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Dissertations / Theses on the topic 'Integrated microsystem'

Author: Grafiati
Published: 4 June 2021
Last updated: 8 February 2022

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1

Kratz, Henrik. "Integrated Communications and Thermal Management Systems for Microsystem-based Spacecraft : A Multifunctional Microsystem Approach." Doctoral thesis, Uppsala : Acta Universitatis Upsaliensis : Universitetsbiblioteket [distributör], 2006. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-6316.

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2

Majerus, Steve J. "Wireless, Implantable Microsystem for Chronic Bladder Pressure Monitoring." Case Western Reserve University School of Graduate Studies / OhioLINK, 2014. http://rave.ohiolink.edu/etdc/view?acc_num=case1397120012.

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3

Roxhed, Niclas. "A Fully Integrated Microneedle-based Transdermal Drug Delivery System." Doctoral thesis, Stockholm : Kungliga Tekniska högskolan, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-4484.

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4

Vitale, Nicholas Heywood. "A Bluetooth Low Energy-Enabled Neural Microsystem for Activity-Dependent Intracortical Microstimulation in Non-Human Primates." Case Western Reserve University School of Graduate Studies / OhioLINK, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=case156534949054962.

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5

Cong, Peng. "WIRELESS BATTERYLESS IN VIVO BLOOD PRESSURE SENSING MICROSYSTEM FOR SMALL LABORATORY ANIMAL REAL-TIME MONITORING." Case Western Reserve University School of Graduate Studies / OhioLINK, 2008. http://rave.ohiolink.edu/etdc/view?acc_num=case1228412139.

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6

Chaimanonart, Nattapon. "Adaptively Radio Frequency Powered Implantable Multi-Channel Bio-Sensing Microsystem for Untethered Laboratory Animal Real-Time Monitoring." Cleveland, Ohio : Case Western Reserve University, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=case1247265060.

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Thesis (Ph.D.)--Case Western Reserve University, 2009<br>Title from PDF (viewed on 19 August 2009) Department of Electrical Engineering and Computer Science Includes abstract Includes bibliographical references Available online via the OhioLINK ETD Center
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7

Narayanan, Arvind. "Development of Low-power Wireless Sensor Nodes based on Assembled Nanowire Devices." Thesis, Virginia Tech, 2000. http://hdl.handle.net/10919/10110.

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Networked wireless sensor systems have the potential to play a major role in critical applications including: environmental monitoring of chemical/biological attacks; condition-based maintenance of vehicles, ships and aircraft; real-time monitoring of civil infrastructure including roads, bridges etc.; security and surveillance for homeland defense systems; and battlefield surveillance and monitoring. Such wireless sensor networks can provide remote monitoring and control of operations of large-scale systems using low-power, low-cost, "throw-away" sensor nodes. This thesis focuses on two aspec
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8

Torres, Erick Omar. "An electrostatic CMOS/BiCMOS Li ion vibration-based harvester-charger IC." Diss., Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/34823.

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The primary objective of this research was to investigate and develop an electrostatic energy-harvesting voltage-constrained CMOS/BiCMOS integrated circuit (IC) that harnesses ambient kinetic energy from vibrations with a vibration-sensitive variable capacitor and channels the extracted energy to charge an energy-storage device (e.g., battery). The proposed harvester charges and holds the voltage across the vibration-sensitive variable capacitor so that vibrations can induce it to generate current into the battery when capacitance decreases (as its plates separate). To that end, the research d
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Chan, Yick Chuen. "Integrated microsystems for micro capillary electrophoresis of DNA /." View Abstract or Full-Text, 2002. http://library.ust.hk/cgi/db/thesis.pl?MECH%202002%20CHAN.

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Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2002.<br>Includes bibliographical references (leaves 78-80). Also available in electronic version. Access restricted to campus users.
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10

Wilson, Denise M. "Analog VLSI architecture for chemical sensing microsystems." Diss., Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/13322.

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11

Chan, Yick Chuen. "DNA electrophoresis in microsystems integrated with sub-micron pillar arrays /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20CHANY.

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12

Liu, Yufei. "Integrated sensors for process monitoring and health monitoring in microsystems." Thesis, Heriot-Watt University, 2011. http://hdl.handle.net/10399/2426.

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This thesis presents the development of integrated sensors for health monitoring in Microsystems, which is an emerging method for early diagnostics of status or “health” of electronic systems and devices under operation based on embedded tests. Thin film meander temperature sensors have been designed with a minimum footprint of 240 m × 250 m. A microsensor array has been used successfully for accurate temperature monitoring of laser assisted polymer bonding for MEMS packaging. Using a frame-shaped beam, the temperature at centre of bottom substrate was obtained to be ~50 ºC lower than that o
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13

Bozorgzadeh, Bardia. "Integrated Microsystems for High-Fidelity Sensing and Manipulation of Brain Neurochemistry." Case Western Reserve University School of Graduate Studies / OhioLINK, 2015. http://rave.ohiolink.edu/etdc/view?acc_num=case1432223568.

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14

Dupé, Valérie. "Conception multidisciplinaire de microsystèmes autonomes." Phd thesis, Bordeaux 1, 2011. http://tel.archives-ouvertes.fr/tel-00858692.

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Toute action naturelle crée de l'énergie perdue qui pourrait être exploitée pour alimenter nos appareils électriques et mobiles. Nos environnements physiques disposent d'un nombre élevé de micro-sources d'énergies ; certes chacune est de faible puissance, mais leur multiplicité pourrait s'avérer significative, notamment dans le cadre du fonctionnement de microsystèmes. C'est le principe précédent qui a conduit nos travaux sur la problématique de la conception de microsystèmes autonomes. Ainsi, pour être innovante, l'ingénierie de microsystèmes doit à la fois s'appuyer sur la culture de l'élect
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15

Schiavone, Giuseppe. "Manufacturing integrated MEMS switching devices using electrodeposited NiFe." Thesis, University of Edinburgh, 2014. http://hdl.handle.net/1842/17955.

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The development of magnetic technologies employing microfabricated magnetic structures for the production of integrated electronic components is a driving topic in the electronic industry. Despite the large amount of work reported in the literature towards the production of magnetic devices that can be integrated into conventional silicon technology, the published research has only achieved moderate success. The research presented in this thesis was conducted with the aim to progress towards the production of a magnetic MEMS relay based on electro-deposited NiFe that combines magnetic and elec
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16

Marefat, Fatemeh. "Toward Cuffless Blood Pressure Monitoring: Integrated Microsystems for Implantable Recording of Photoplethysmogram." Case Western Reserve University School of Graduate Studies / OhioLINK, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=case1595441087168539.

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17

Desai, Salil P. (Salil Pradip) 1978. "Building integrated cell-based microsystems : fabrication methodologies, metrology tools and impact on cellular physiology." Thesis, Massachusetts Institute of Technology, 2009. http://hdl.handle.net/1721.1/53268.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2009.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (p. 116-126).<br>This thesis presents the development of new tools for the realization and characterization of complex, integrated biological microsystems. These tools involve - (1) the implementation and characterization of a new material system for biological microsystems, and its application to the design of a single-bioparticle trap, (2) the creation of a lipid vesicle-based metrology tool for the
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18

Artillan, Philippe. "Design, modelization and realization of integrated inductive components for low power supplies and microsystems." Toulouse, INSA, 2008. http://eprint.insa-toulouse.fr/archive/00000243/.

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Full integration of energy conversion devices for compact power supply circuits is still encountering strong technological locks, especially to integrate passive inductive and capacitive components. The increasing working frequency of those devices, which already reaches 1 Megahertz, would enable the size reduction of passive components and then their integration. Nevertheless, losses, which highly depend on frequency and technology, may complicate or even stop this increase. The objective of this thesis is the systematic study of integrated inductors structures through the developing of preci
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19

Kacker, Karan. "Design and fabrication of free-standing structures as off-chip interconnects for microsystems packaging." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26464.

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Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2009.<br>Committee Chair: Dr. Suresh K. Sitaraman; Committee Member: Dr. F. Levent Degertekin; Committee Member: Dr. Ioannis Papapolymerou; Committee Member: Dr. Madhavan Swaminathan; Committee Member: Dr. Nazanin Bassiri-Gharb. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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20

Lefevre, Brian W. "Integrated Microbattery Charger for Autonomous Systems." BYU ScholarsArchive, 2004. https://scholarsarchive.byu.edu/etd/118.

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This thesis presents a microbattery recharging circuit suitable for autonomous microsystems. The battery charger chosen for this design is a constant current battery charger. Two methods of regulating the constant-current are discussed. A published shunt regulator design is analyzed and is presented with enhancements to the design. A series regulator that controls the current to the battery with a switch is designed and fabricated in a 1.5µm CMOS process. The fabricated prototype occupies less than 2.20x2.20mm and is expected to dissipate less than 25µW of power. A discrete model of the integr
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21

Roham, Masoud. "Wireless Multichannel Microsystems for Time-Share Chemical and Electrical Neural Recording." Cleveland, Ohio : Case Western Reserve University, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=case1258145434.

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Thesis(Ph.D.)--Case Western Reserve University, 2010<br>Title from PDF (viewed on 2009-12-30) Department of Electrical Engineering and Computer Science Includes abstract Includes bibliographical references and appendices Available online via the OhioLINK ETD Center
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22

Chung, Kwanghun. "Automated and integrated microsystems for highthroughput and high-resolution imaging, sorting, and laser ablation of C. elegans." Diss., Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/37163.

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The objective of this research is to develop automated and integrated microsystems for high-resolution imaging and high-throughput phenotyping / laser ablation of C. elegans. These microsystems take advantage of microfluidic technology for precisely handling animals and computer-aid automation for high-throughput processing. We demonstrated automated and high-throughput imaging / sorting and laser ablation of C. elegans. This thesis work is divided into four parts: development of a microsystem for imaging and sorting, development of a microsystem for laser cell ablation, development of a n
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23

Sundaram, Venkatesh. "Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/28141.

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Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2009.<br>Committee Chair: Tummala, Rao; Committee Member: Iyer, Mahadevan; Committee Member: Saxena, Ashok; Committee Member: Swaminathan, Madhavan; Committee Member: Wong, Chingping.
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24

Laotaveerungrueng, Noppasit. "A High-Voltage, High-Current Multi-Channel Arbitrary Waveform Generator ASIC for Neural Interface and MEMS Applications." Case Western Reserve University School of Graduate Studies / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=case1291675462.

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25

Paret, Jean-Marc. "Étude et mise au point de la méthodologie de conception et de fabrication collective de microsystèmes sur silicium." Grenoble INPG, 1997. http://www.theses.fr/1997INPG0015.

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La notion de microsysteme est nee avec la microelectronique, mais n'a jamais connu le meme essor. Les raisons de cette difference de developpement sont nombreuses : multiplicite des domaines a maitriser, complexite des circuits de traitement du signal necessaires, et surtout manque de procedes de fabrication standards. Jusqu'a nos jours, pour presque chaque circuit microsysteme concu puis realise, un procede de fabrication specifique a du etre developpe en laboratoire. En outre, en raison du manque de marche apparent pour ce type de composant, rares sont les applications qui ont pu etre indust
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26

Santos, Filipe Vinci dos. "Techniques de conception pour le durcissement des circuits intégrés face aux rayonnements." Grenoble 1, 1998. http://www.theses.fr/1998GRE10208.

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Les microsystèmes sont le dernier développement de la microélectronique. Leur apparition ouvre des possibilités révolutionnaires dans plusieurs domaines d'application, dont l'exploitation de l'espace. L'utilisation des microsystèmes dans l'espace se heurte au problème de l'exposition à la radiation, notamment pour la partie électronique. Cet obstacle a été surmonte dans le passe par la mise en place de filières de fabrication résistantes (durcies) aux effets de la radiation. Le rétrécissement des budgets militaires a provoqué la disparition de la plupart des technologies de fabrication durcies
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27

Lin, I.-Hsuan, and 林宜璇. "Integrated Resistance Welding for Microsystem Packaging." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/31395202100348652433.

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碩士<br>國立交通大學<br>機械工程系所<br>102<br>This thesis studies the bounding properties of a novel method proposed our research group previously. This new techniques use resistance welding to achieve TLP bounding between two wafers, thus enabling the wafer level packing and testing. Investigation of the bounding properties is proceeded by changing the following parameters including, applying voltage for the resistance welding, hermetic/ vacuum bounding, bounding time, etc. The bonding property is examined by the tests including resistance variation during bonding process, X-ray diffraction (XRD) for the
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28

Lu, Chun-Lin, and 呂俊麟. "Reliability Analysis of 3D Heterogeneous Integrated Microsystem Chip." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/18606420567844841975.

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碩士<br>國立清華大學<br>動力機械工程學系<br>98<br>The reliability analysis of whole structure is an important part in the researching and developing process of 3D heterogeneous integration microsystem chip. And building the reliability of finite element analysis (FEA) simulation for figuring out the relationship between geometric paramaters and reliability; moreover, improving the life of chips are the purpose of this thesis. Generally, the finite element (FE) models are simplified appropriately in simulation process due to the complicated structure of MEMS (Micro Electronic Mechanical Systems) device in the
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29

Mujeeb-U-Rahman, Muhammad. "Integrated Microsystems for Wireless Sensing Applications." Thesis, 2014. https://thesis.library.caltech.edu/8497/1/Muhammad_Mujeeb_U_Rahman_PhD_Thesis_Final.pdf.

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<p>Personal health monitoring is being considered the future of a sustainable health care system. Biosensing platforms are a very important component of this system. Real-time and accurate sensing is essential for the success of personal health care model. Currently, there are many efforts going on to make these sensors practical and more useful for such measurements. Implantable sensors are considered the most widely applicable and most reliable sensors for such accurate health monitoring applications. However, macroscopic (cm scale) size has proved to be a limiting factor for successful use
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30

Chodavarapu, Vamsy. "Integrated CMOS sensor microsystems for biochemical monitoring." 2006. http://proquest.umi.com/pqdweb?did=1184163971&sid=8&Fmt=2&clientId=39334&RQT=309&VName=PQD.

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Thesis (Ph.D.)--State University of New York at Buffalo, 2006.<br>Title from PDF title page (viewed on Feb. 22, 2007) Available through UMI ProQuest Digital Dissertations. Thesis adviser: Cartwright, Alexander N. Includes bibliographical references.
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31

Lien, Jui-Chien, and 練瑞虔. "An Integrated Resistance Welding and TSV Process for Microsystems Packaging." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/86832757864743046678.

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碩士<br>國立交通大學<br>機械工程學系<br>100<br>This paper proposes a novel wafer level packaging for integrated circuits (IC) and microelectromechanical system (MEMS) devices. In this method, two wafers were bounded by resistance welding with simultaneously through-silicon-via (TSV) connection and cavity sealing. In general, bonding techniques require two bonding surfaces to be flat to have intimate contact for bonding. If the surface is rough, it needs to be conditioned. Otherwise, the bonding temperature needs to be high to soften the bonding material, which could damage the device materials such as alumi
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32

Lin, Yu-Rou, and 林毓柔. "On-Interposer Data Communication for 2.5D Heterogeneously Integrated Bio-Sensing Microsystems." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/95703399464979168233.

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碩士<br>國立交通大學<br>電子工程學系 電子研究所<br>102<br>2.5D integration allow to inter-chip communication between multiple chips with intra-chip interconnects. The interposer provides fast and low power chip-to-chip communication. In this thesis, an on-interposer bus (μ-SPI, serial peripheral interface) is presented for providing low power data communication in 2.5D heterogeneous integrations. The protocol of μ-SPI is designed by a hierarchical packetization technique based on the physical layer of SPI. The data width of μ-SPI is from 1-bit to 8-bit. To reduce the overhead of the header, the header of a pa
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33

Gong, Cihun-Siyong, and 龔存雄. "On the Design and Implementation of Efficient Integrated Circuits for Bioimplantable Electronic Microsystems." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/26277042159839834578.

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博士<br>國立中央大學<br>電機工程研究所<br>97<br>Thanks to the rapid advance in the technologies of integrated circuit (IC) during the last ten years, it is possible to realize a complex signal process system with large number of transistors in a single microchip, which creates the possibility of reconstructing lost sophisticated human sensations. Today, implantable chips, such as the cochlear implant, have been able to be used to regain the greater part of the sense of lost hearing. Visual prostheses have been considered potential cure for people who suffer from blindness. Though such prostheses have been ex
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