Academic literature on the topic 'Integrated Passive Devices IPD'
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Journal articles on the topic "Integrated Passive Devices IPD"
Liu, Kai, YongTaek Lee, HyunTai Kim, Gwang Kim, and Billy Ahn. "RF System in Packages (SiP) using Integrated Passive Devices." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (January 1, 2011): 001977–95. http://dx.doi.org/10.4071/2011dpc-wp43.
Full textPrashant, Meenakshi, Seung Wook Yoon, GeunSik Kim, Kai Liu, and Flynn Carson. "Advanced SiP Packaging Technologies of IPD for Mobile Applications." Journal of Microelectronics and Electronic Packaging 7, no. 4 (October 1, 2010): 223–27. http://dx.doi.org/10.4071/imaps.267.
Full textLee, Ki-Hun, Eun-Seong Kim, Jun-Ge Liang, and Nam-Young Kim. "Design and Realization of a Compact High-Frequency Band-Pass Filter with Low Insertion Loss Based on a Combination of a Circular-Shaped Spiral Inductor, Spiral Capacitor and Interdigital Capacitor." Electronics 7, no. 9 (September 12, 2018): 195. http://dx.doi.org/10.3390/electronics7090195.
Full textLiu, Kai, YongTaek Lee, HyunTai Kim, Gwang Kim, Guruprasad Badakere, Yaojian Lin, and Billy Ahn. "Passive Device Integration from Silicon Technology." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 001967–89. http://dx.doi.org/10.4071/2010dpc-wp36.
Full textBunel, C., J.-R. Tenailleau, F. Voiron, S. Borel, and A. Lefevre. "Integrated Passive Devices and TSV, a disruptive technology for miniaturization." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000794–98. http://dx.doi.org/10.4071/isom-2013-thp12.
Full textPark, Yun-Mook, Jun-Kyu Lee, Byung-Jin Park, Byeung-Gee Kim, Jung-Won Lee, and In-Soo Kang. "Development on Silicon module with Cu-filled TSV and Integrated Passive Devices." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000385–91. http://dx.doi.org/10.4071/isom-2010-wa1-paper6.
Full textLiu, Kai, YongTaek Lee, HyunTai Kim, and MaPhooPwint Hlaing. "Mobile Device Passive Integration from Wafer Process." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000878–86. http://dx.doi.org/10.4071/isom-2011-tha1-paper1.
Full textZhu, Bao-Hua, Nam-Young Kim, Zhi-Ji Wang, and Eun-Seong Kim. "On-Chip Miniaturized Bandpass Filter Using GaAs-Based Integrated Passive Device Technology For L-Band Application." Materials 12, no. 18 (September 19, 2019): 3045. http://dx.doi.org/10.3390/ma12183045.
Full textLau, J. H., C. J. Zhan, P. J. Tzeng, C. K. Lee, M. J. Dai, H. C. Chien, Y. L. Chao, et al. "Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300 mm Multi-Project Wafer (MPW)." Journal of Microelectronics and Electronic Packaging 8, no. 4 (October 1, 2011): 171–78. http://dx.doi.org/10.4071/imaps.306.
Full textLau, J. H., C.-J. Zhan, P.-J. Tzeng, C.-K. Lee, M.-J. Dai, H.-C. Chien, Y.-L. Chao, et al. "Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW)." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000446–54. http://dx.doi.org/10.4071/isom-2011-wa1-paper1.
Full textDissertations / Theses on the topic "Integrated Passive Devices IPD"
Li, Heli. "RF LOW PASS FILTER DESIGN AND FABRICATION USING INTEGRATED PASSIVE DEVICE TECHNOLOGY." Master's thesis, University of Central Florida, 2006. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/4340.
Full textM.S.E.E.
School of Electrical Engineering and Computer Science
Engineering and Computer Science
Electrical Engineering
Cayron, Audrey. "Intégration de dispositifs passifs 3D compacts et performants.Application à la réalisation d’une matrice de Butler 4×4 en bande Ka." Thesis, Toulouse, INSA, 2020. http://www.theses.fr/2020ISAT0006.
Full textThe complexity of embedded RF systems in consumer wireless applications is increasing, and requires to improve the integration of RF and microwave passive circuits. New solutions that offer more compactness and performance have to be developed, while maintaining a low manufacturing cost. Among Integrated Passive Devices (IPD) technologies, a 3-D technology has been developed at the LAAS CNRS and by 3DiS Technologies for several years. Results demonstrate that the manufactured solenoids exhibit high compactness and high-performance. This PhD thesis aims to develop the integration process of capacitors in order to evolve the technology towards the fabrication of complex passive RF functions.The manuscript is divided into three chapters. The first chapter reviews the technological processes that enable the manufacture of RF systems and highlights the challenges for integrating high-performance passive components. It also presents the advantages of a low-cost 3-D integration solution such as the one proposed. In the second chapter, we present the development of Metal Insulator Metal (MIM) capacitors. The characterization result show that capacitors present performances equivalent to those identified in the literature with high quality factors. We then manufacture two transformers matched to 50 ohms using capacitors. The technological process is described. The manufactured and measured circuits show that transmission losses are close to those obtained at the maximum available gain of the transformers. These results confirm the good performance of the developed capacitors since they introduce minimal losses for the manufactured circuits. No technological problems are encountered during the manufacturing of the two transformers, which validates the complete technological process for the integration of capacitors and solenoid.Based on these results, we present in the last chapter the development of a 4×4 Butler matrix dedicated to 5G beamforming applications. In a large bandwidth ranging from 24 GHz to 29 GHz, insertion losses for the four outputs of the matrix are under 3.5 dB and the phase difference between the outputs are reached with a deviation of less than 16°. The measured results are at the state of the art and overcome those of the existing IPD solutions, in particular for the occupied aera that does not exceed 0.84 mm2. These performances allow us to conclude on the potential of 3-D IPD technology to achieve an excellent compromise between integration density and performance
Li, Liangyu. "Experimental Investigation of Integrated Tunable Passive Microwave Devices." University of Dayton / OhioLINK, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1607337154651345.
Full textPark, Jae Yeong. "Packaging-compatible micromachined magnetic devices : integrated passive components and modules." Diss., Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/16385.
Full textLo, Chi Chuen. "Integrated silicon optical bench with passive alignment features for three-dimensional optical interconnect /." View abstract or full-text, 2004. http://library.ust.hk/cgi/db/thesis.pl?MECH%202004%20LO.
Full textIncludes bibliographical references (leaves 118-122). Also available in electronic version. Access restricted to campus users.
Syahriar, Ary. "Passive integrated optical devices formed by electron beam irradiation of silica-on-silicon layers." Thesis, Imperial College London, 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.481291.
Full textLahti, M. (Markku). "Gravure offset printing for fabrication of electronic devices and integrated components in LTCC modules." Doctoral thesis, University of Oulu, 2008. http://urn.fi/urn:isbn:9789514288944.
Full textBorden, Bradley W. Wang Shuping. "A study of the laser direct writing for all polymer single mode passive optical channel waveguide devices." [Denton, Tex.] : University of North Texas, 2008. http://digital.library.unt.edu/permalink/meta-dc-9805.
Full textZanzi, Andrea. "Passive and active silicon photonics devices at TLC telecommunication wavelengths for on-chip optical interconnects." Doctoral thesis, Universitat Politècnica de València, 2020. http://hdl.handle.net/10251/149377.
Full text[ES] Las tecnologías ópticas son el eje vertebrador de los sistemas de comunicación mod- ernos que proporcionan acceso de alta velocidad a la Internet, interconexiones efi- cientes entre centros de datos y dentro de ellos. Además, se están expandiendo hacia campos de investigación crecientes y nuevos mercados como son las aplicaciones de comunicaciones por satélite, los LIDAR (Laser Imaging Detection and Ranging), la computación neuromórfica y los circuitos fotónicos programables, por nombrar algunos. La fotónica de silicio está considerada y aceptada ampliamente como una de las tecnologías clave para que dichas aplicaciones puedan desarrollarse. Como resultado, hay una fuerte necesidad de estructuras fotónicas básicas integradas que sean innovadoras, que soporten altas velocidades de transmisión y que sean más eficientes en términos de consumo de potencia, a fin de aumentar la capacidad de los circuitos integrados fotónicos de silicio. El trabajo desarrollado y presentado en esta tesis se centra en el diseño y la car- acterización de dispositivos avanzados pasivos y activos, para circuitos fotónicos integrados. La tesis consta de tres capítulos principales, así como de sendas sec- ciones de motivación y conclusiones que exponen los fundamentos y los logros de este trabajo. El capítulo uno describe el diseño y la caracterización de un modulador electro-óptico Mach-Zehnder incorporado en una unión pn vertical altamente eficien- ciente que explota el efecto de dispersión de plasma en banda O. El capítulo dos está dedicado al diseño y caracterización de una nueva geometría de dispositivo de interferencia multimodo asimétrico y su aplicación en un modulador Mach-Zehnder. El capítulo tres está dedicado al diseño y caracterización de innovadores cristales fotónicos unidimensionales para aplicaciones de modulación con luz lenta. Se pre- senta un amplio análisis de los principales retos derivados del uso de la misma.
[CA] Les tecnologies òptiques són l'eix vertebrador d'aquells sistemes de comunicació moderns que proporcionen accés d'alta velocitat a la Internet, així com intercon- nexions eficients inter i entre centres de dades. A més a més, s'estan expandint cap a camps d'investigació creixents i nous mercats com són les aplicacions de co- municacions per satèl·lit, els LIDAR (Laser Imaging Detection and Ranging), la computació neuromòrfica i els circuits fotònics programables, entre d'altres. La fotònica de silici és considerada i acceptada àmpliament com una de les tecnologies clau i necessàries perquè aquestes aplicacions puguen desenvolupar-se. Per aquest motiu, es fa necessària l'existència d'estructures fotòniques bàsiques integrades que siguen innovadores, que suporten altes velocitats de transmissió i que siguen més eficients en termes de consum de potència, a fi d'augmentar la capacitat dels cir- cuits integrats fotònics de silici. El treball desenvolupat i presentat en aquesta tesi se centra en el disseny i la caracterització de dispositius avançats passius i actius, per a circuits fotònics integrats. La tesi consta de tres capítols principals, així com d'una secció de motivació i una altra de conclusions que exposen els fonaments i els assoliments d'aquest treball. El capítol u descriu el disseny i la caracterització d'un modulador electro-òptic Mach-Zehnder incorporat en una unió pn vertical d'alta efi- ciència que explota l'efecte de dispersió de plasma en la banda O. El capítol dos està dedicat al disseny i caracterització d'una nova geometria de dispositiu d'interferència multimode asimètric així com a la seua aplicació en un modulador Mach-Zehnder. El capítol tres està dedicat al disseny i caracterització d'innovadors cristalls fotònics unidimensionals per a aplicacions de modulació amb llum lenta. S'inclou també una anàlisi detallada dels principals reptes derivats de l'ús d'aquest tipus de llum.
I want to thank you the Generelitat Valenciana and the European Project L3MATRIX for the funding, without them my doctorate would not taken place.
Zanzi, A. (2020). Passive and active silicon photonics devices at TLC telecommunication wavelengths for on-chip optical interconnects [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/149377
TESIS
Borden, Bradley W. "A Study of Laser Direct Writing for All Polymer Single Mode Passive Optical Channel Waveguide Devices." Thesis, University of North Texas, 2008. https://digital.library.unt.edu/ark:/67531/metadc9805/.
Full textBooks on the topic "Integrated Passive Devices IPD"
A, Haus Hermann, ed. Passive components for dense optical integration. Boston: Kluwer Academic Publishers, 2002.
Find full textNejhad, M. N. Ghasemi. Active and passive smart structures and integrated systems 2010: 8-11 March 2010, San Diego, California, United States. Edited by SPIE (Society). Bellingham, Wash: SPIE, 2010.
Find full textAhmadian, Mehdi. Active and passive smart structures and integrated systems 2009: 9-12 March 2009, San Diego, California, United States. Edited by Ghasemi Nejhad, M. N. (Mehrdad N.), SPIE (Society), Intelligent Materials Forum (Mitō Kagaku Gijutsu Kyōkai), American Society of Mechanical Engineers, Jet Propulsion Laboratory (U.S.), and National Science Foundation (U.S.). Bellingham, Wash: SPIE, 2009.
Find full textNejhad, M. N. Ghasemi. Active and passive smart structures and integrated systems 2011: 7-10 March 2011, San Diego, California, United States. Edited by SPIE (Society). Bellingham, Wash: SPIE, 2011.
Find full textNejhad, M. N. Ghasemi. Active and passive smart structures and integrated systems 2010: 8-11 March 2010, San Diego, California, United States. Bellingham, Wash: SPIE, 2010.
Find full textGhasemi Nejhad, M. N. (Mehrdad N.), SPIE (Society), Intelligent Materials Forum (Mitō Kagaku Gijutsu Kyōkai), American Society of Mechanical Engineers, Jet Propulsion Laboratory (U.S.), and National Science Foundation (U.S.), eds. Active and passive smart structures and integrated systems 2009: 9-12 March 2009, San Diego, California, United States. Bellingham, Wash: SPIE, 2009.
Find full textIntegrated Photonics Research Topical Meeting. (1991 Monterey, Calif.). Integrated photonics research: Summaries of papers presented at the Integrated Photonics Research Topical Meeting, April 9-11, 1991, Monterey, California ; including Workshop on Active and Passive Fiber Components. Washington, D.C: Optical Society of America, 1991.
Find full textNino, Juan C., Fred Roozeboom, Susan Trolier-McKinstry, Paul Muralt, and David LaVan. Heterogeneous Integration of Materials for Passive Components and Smart Systems: Volume 969. University of Cambridge ESOL Examinations, 2014.
Find full textHeterogeneous Integration of Materials for Passive Components and Smart Systems: Symposium Held November 27-29, 2006, Boston, Massachusetts, U.S.A. (Materials Research Society Symposium Proceedings). Materials Research Society, 2007.
Find full textBook chapters on the topic "Integrated Passive Devices IPD"
Tabib-Azar, M. "Passive Optical Devices." In Integrated Optics, Microstructures, and Sensors, 71–97. Boston, MA: Springer US, 1995. http://dx.doi.org/10.1007/978-1-4615-2273-7_3.
Full textKévorkian, Antoine. "Passive and Active Glass Integrated Optics Devices." In Springer Series in Photonics, 197–261. Berlin, Heidelberg: Springer Berlin Heidelberg, 2001. http://dx.doi.org/10.1007/978-3-642-56466-6_6.
Full textNiknejad, Ali M., Sohrab Emami, Chinh Doan, Babak Heydari, and Mounir Bohsali. "Design and Modeling of Active and Passive Devices." In Series on Integrated Circuits and Systems, 59–108. Boston, MA: Springer US, 2008. http://dx.doi.org/10.1007/978-0-387-76561-7_3.
Full textNassiopoulou, Androula G., Panagiotis Sarafis, Jean-Pierre Raskin, Henza Issa, and Phillippe Ferrari. "Substrate Technologies for Silicon-Integrated RF and mm-Wave Passive Devices." In Beyond-CMOS Nanodevices 1, 373–417. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2014. http://dx.doi.org/10.1002/9781118984772.ch13.
Full textBarklage, Alexander, and Rolf Radespiel. "Interaction of Wake and Propulsive Jet Flow of a Generic Space Launcher." In Notes on Numerical Fluid Mechanics and Multidisciplinary Design, 129–43. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-53847-7_8.
Full textMaloratsky, Leo G. "Diode Control Devices." In Passive RF & Microwave Integrated Circuits, 237–65. Elsevier, 2004. http://dx.doi.org/10.1016/b978-075067699-1/50011-0.
Full textAl-Azzawi, Abdul. "Manufacturing of Passive Fiber Optic Devices." In Advanced Manufacturing for Optical Fibers and Integrated Photonic Devices, 107–13. CRC Press, 2017. http://dx.doi.org/10.1201/b18749-7.
Full textWang, Shyh. "Chapter 1 Principles and Characteristics of Integratable Active and Passive Optical Devices." In Lightwave Communications Technology - Integrated Optoelectronics, 1–202. Elsevier, 1985. http://dx.doi.org/10.1016/s0080-8784(08)62965-8.
Full textYeh, Chai. "Introduction to Optical Fiber Sensors, Passive Applications, and Integrated Devices." In Handbook of Fiber Optics, 277. Elsevier, 1990. http://dx.doi.org/10.1016/b978-0-12-770455-5.50018-3.
Full textBenech, Philippe, Jean-Marc Duchamp, Philippe Ferrari, Darine Kaddour, Emmanuel Pistono, Tan Phu, Pascal Xavier, and Christophe Hoarauand Jean-Daniel Arnoul. "Integrated Silicon Microwave and Millimeterwave Passive Components and Functions." In Microwave and Millimeter Wave Technologies from Photonic Bandgap Devices to Antenna and Applications. InTech, 2010. http://dx.doi.org/10.5772/9050.
Full textConference papers on the topic "Integrated Passive Devices IPD"
Chang, Y. C., P. Y. Wang, S. H. Hsu, Y. T. Chang, C. K. Chen, and D. C. Chang. "Impact and Improvement of Resistor Process Variation on RF Passive Circuit Design in Integrated Passive Devices (IPD) Technology." In 2015 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2015. http://dx.doi.org/10.7567/ssdm.2015.ps-2-14.
Full textKim, Hyun-Tai, Kai Liu, Robert C. Frye, Yong-Taek Lee, Gwang Kim, and Billy Ahn. "Design of compact power divider using integrated passive device (IPD) technology." In 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009). IEEE, 2009. http://dx.doi.org/10.1109/ectc.2009.5074278.
Full textPo-Hao Chang, Kevin Chiang, Jeng-Yuan Lai, and Yu-Po Wang. "Advanced integrated passive device (IPD) low pass filter designs on WLCSP." In 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2009. http://dx.doi.org/10.1109/impact.2009.5382162.
Full textNeyer, A. "LOW- COST PASSIVE POLYMER DEVICES." In Integrated Photonics Research. Washington, D.C.: OSA, 1994. http://dx.doi.org/10.1364/ipr.1994.fg1.
Full textYin-Cheng Chang, Ping-Yi Wang, Shawn S. H. Hsu, Ta-Yeh Lin, Chao-Ping Hsieh, and Da-Chiang Chang. "A V-band CPW bandpass filter with controllable transmission zeros in integrated passive devices (IPD) technology." In 2016 IEEE/MTT-S International Microwave Symposium (IMS). IEEE, 2016. http://dx.doi.org/10.1109/mwsym.2016.7540147.
Full textPrashant, Meenakshi, Kai Liu, and Seung Wook Yoon. "Integrated passive devices (IPD) integration with eWLB (embedded wafer level BGA) for high performance RF applications." In 2010 12th Electronics Packaging Technology Conference - (EPTC 2010). IEEE, 2010. http://dx.doi.org/10.1109/eptc.2010.5702724.
Full textWeinert, C. M., and H. Heidrich. "Vectorial Simulation of Passive Mode Converter Devices on InP." In Integrated Photonics Research. Washington, D.C.: OSA, 1992. http://dx.doi.org/10.1364/ipr.1992.md7.
Full textKim, Jaeyoun, Kim A. Winick, and Catalin Florea. "Passive and active glass waveguide devices utilizing silicon overlay grating." In Integrated Photonics Research. Washington, D.C.: OSA, 2002. http://dx.doi.org/10.1364/ipr.2002.ithi1.
Full textLee, Yong-Taek, Kai Liu, Robert Frye, Hyun-Tai Kim, Gwang Kim, and Billy Ahn. "Ultra-wide-band (UWB) band-pass-filter using integrated passive device (IPD) technology for wireless applications." In 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009). IEEE, 2009. http://dx.doi.org/10.1109/ectc.2009.5074295.
Full textWu, Sung-Mao, Wang-Yu Lin, Kao-Yi Wang, Chien-Hsiang Huang, and Wen-Kuan Yeh. "The high balance symmetric balun for WLAN and WiMAX application using the Integrated Passive Device (IPD) technology." In High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270803.
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