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Journal articles on the topic 'Integrated power electronic module (IPEM)'

Author: Grafiati
Published: 4 June 2021
Last updated: 14 February 2022

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1

Herna´ndez-Mora, M., J. E. Gonza´lez, M. Ve´lez-Reyes, J. M. Ortiz-Rodrı´guez, Y. Pang, and E. Scott. "Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)." Journal of Electronic Packaging 126, no. 4 (2004): 477–90. http://dx.doi.org/10.1115/1.1827264.

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Background: This paper presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of an integrated power electronics module (IPEM). This model is based on the expanded lumped thermal capacitance method (LTCM), in which the number of variables involved in the analysis of heat transfer is reduced only to time. Method of Approach: By applying the LTCM, a simple, nonspatial, but highly nonlinear model is obtained for the case of the IPEM Generation II. Steady and transient results of the model are validated against results from a three-dimensional, transient thermal analysis software tool, FLOTHERM™ 3.1. The electrothermal coupling was obtained by implementing the reduced-order thermal model into the SABER™ circuit simulator. Two experimental setups, for low- and high-speed thermal responses, were developed and used to calibrate the reduced model with actual data. Results: The comparison of the LTCM model implemented in a Generation II IPEM with FLOTHERM 3.1 results compared very favorably in terms of accuracy and efficiency, reducing the computational time significantly. Additional validations of the reduced thermal model were made using experiment data for the low-speed thermal response at different constant powers, and good agreement was demonstrated in all cases. A comparison between SABER™ simulations, which incorporated the proposed LTCM, and the fast thermal experimental response results is also presented to validate the dynamic electrothermal model response, and excellent agreement was found for this case. Conclusions: The good agreement found for all three cases presented, the three-dimensional, transient numerical formulation, and the low- and high-speed experimental data indicates that reduced electrothermal models are an excellent alterative for design methodologies of new generations of IPEMs.
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2

Zeng, Xiang-jun, Xu Yang, and Zhao-an Wang Xi'an. "Analysis of Capacitive and Inductive Coupling inside Hybrid Integrated Power Electronic Module." Journal of Microelectronics and Electronic Packaging 1, no. 3 (2004): 169–75. http://dx.doi.org/10.4071/1551-4897-1.3.169.

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Electromagnetic compatibility has to be given enough attention in the design of hybrid Integrated Power Electronic Module (IPEM) due to the sharply decreased distances between power devices and the control/driving circuits as compared to such distances for conventional power electronic equipment built with discrete devices. The high dν/dt, di/dt and high frequency parasitic ringing emanating from the switching circuit can cause serious EMI within the control/driving circuit due to cross-coupling. This paper analyzes the capacitive and inductive cross-coupling problems inside an IPEM. Finite Element Method (FEM) is used to extract the mutual capacitances between the metal bars in the model. Then the influence of dν/dt can be estimated. The high frequency circulating current in the bridge circuits is also investigated since it causes magnetic interference due to mutual inductance coupling. The mutual inductance is calculated with the simplified Partial Element Equivalent Circuit (PEEC) approach and image method. The experiment validates the effectiveness of this evaluation. In the end, the electromagnetic shielding is discussed.
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3

Xiaoling, Yu, Xiong Wei, Zhou Wei, and Feng Quanke. "Study of Thermal Effect of Power Circuit on Driver & Protection PCB in Hybrid IPEM." Journal of Microelectronics and Electronic Packaging 1, no. 2 (2004): 95–101. http://dx.doi.org/10.4071/1551-4897-1.2.95.

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In a hybrid integrated power electronic module (IPEM) for medium power converter, when packaged with power circuit closely, the driver & protection circuit is affected seriously by heat generated from power chips in the power circuit. Thermal simulation results of the module show that the thermal resistance between the power chip and the bottom surface of substrate is 0.24 °C/W. Experimental results reveal that the highest temperature on the driver & protection printed circuit board (PCB) is over 70 °C when the power chip temperature reaches 93 °C. Therefore, an air gap is sandwiched between the power circuit and the driver & protection PCB to insulate the heat transferred from the former to the latter. Measuring results show that the air gap weakens the thermal effect of power circuit on the driver & protection PCB, and the highest temperature on the PCB decreases while the thickness of air gap increases. If the thickness of air gap increases to certain value, the highest temperature on the driver & protection PCB can be controlled below 70 °C when the power chip temperature reaches 125 °C.
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4

Chen, R., F. Canales, B. Yang, and J. D. vanWyk. "Volumetric Optimal Design of Passive Integrated Power Electronics Module (IPEM) for Distributed Power System (DPS) Front-End DC/DC Converter." IEEE Transactions on Industry Applications 41, no. 1 (2005): 9–17. http://dx.doi.org/10.1109/tia.2004.841026.

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5

Pang, Ying Feng, Elaine P. Scott, Jonah Zhou Chen, and Karen A. Thole. "Thermal Design and Optimization Methodology for Integrated Power Electronics Modules." Journal of Electronic Packaging 127, no. 1 (2005): 59–66. http://dx.doi.org/10.1115/1.1849233.

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A methodology was developed and implemented to optimize the design layout for i_ntegrated p_ower e_lectronics m_odules (IPEMs) by considering both the electrical and thermal performances. This paper is primarily focused on the thermal aspects, which were analyzed using three-dimensional (3D) computational software tools. Implementation of the design methodology resulted in a 70 percent reduction in the common mode current, a 4 percent reduction in the size of the geometric footprint, and a 7°C reduction in the maximum temperature rise for the case studied, thus, providing an increase in the IPEM’s overall performance.
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6

Qiaoliang, Chen, Zeng Xiangjun, Yang Xu, and Wang Zhaoan. "Research on Power Electronic Integrated Module for SMPs." Journal of Microelectronics and Electronic Packaging 1, no. 4 (2004): 225–30. http://dx.doi.org/10.4071/1551-4897-1.4.225.

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A novel structure for a power module used in switching mode power supplies (SMPs) is presented in this paper. The power module employs the three-dimensional terrace structure resulting in lowered parasitic parameters and a higher power density. Based on this structure, the characteristics of the power module, such as parasitic parameters and thermal management performance are evaluated through simulation analysis and experimental research. The measured results for a 1kw prototype demonstrate that the power module based on an aluminum substrate has higher power density, smaller volume and better thermal performance when compared to a module using a conventional structure.
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7

Zhang, Wenli, Fengchang Yang, Rui Qiao, and Dushan Boroyevich. "Integrated Microchannel Cooling for Power Electronic Modules." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (2016): 000122–29. http://dx.doi.org/10.4071/2016cicmt-wa25.

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Abstract The power electronic module plays a key role in the power system by providing the needed physical support, electrical contact and insulation, and thermal pathway for power devices. Using wide bandgap power semiconductors in the power modules enables high-frequency and low-loss switching at relatively high temperatures for efficient power conversion. These advantages could lead to an increase in power-density for the power module as well as a reduction of cost, weight, and volume at the system level. However, the highly integrated power module requires advanced thermal management solutions for effective heat removal from the active chips to achieve high reliability. The evaluation of thermal performance for the power module is critical for its packaging design, because most of the heat generated by the semiconductors is dissipated through the module package. It is even more critical for the gallium nitride (GaN)-based power modules due to the lower thermal conductivity of the GaN material compared with that of silicon and silicon carbide. This paper provides a brief introduction of power modules in conventional packaging design and a review of several new packaging structures with advanced thermal management solutions. The direct-bonded-copper (DBC) substrate with integrated microchannel cooling designed for a new packaging structure is proposed for highly integrated power modules. In this design, the cooling microchannels are embedded inside the aluminum nitride (AlN) layer of the DBC substrate. In finite element analysis (FEA) simulation model of the new package, six high-voltage GaN transistors are arranged on the top surface of the DBC substrate to realize a three-phase inverter circuit. Three straight embedded microchannels with a cross-sectional area of 0.3 mm × 5 mm are located underneath the GaN devices. The average maximum temperature of the GaN devices in the new package is around 72 °C (50 W power loss applied on each die), which is about 16 °C lower than that in the traditional power module package. A thermal transfer coefficient of 2000 W/m2 K, which is equivalent to the liquid cooling condition, is applied on the bottom surface of the baseplate in the traditional package. Enhanced heat dissipation capability is demonstrated using this integrated microchannel cooling method. Further study will focus on the fabrication of a prototype and experimental testing.
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8

Kwon, J. M., K. H. Nam, and B. H. Kwon. "High-efficiency module-integrated photovoltaic power conditioning system." IET Power Electronics 2, no. 4 (2009): 410–20. http://dx.doi.org/10.1049/iet-pel.2008.0023.

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9

Hu, Yamu, Mohamad Sawan, and Mourad N. El-Gamal. "An Integrated Power Recovery Module Dedicated to Implantable Electronic Devices." Analog Integrated Circuits and Signal Processing 43, no. 2 (2005): 171–81. http://dx.doi.org/10.1007/s10470-005-6790-5.

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10

Barlow, Matthew, Shamim Ahmed, A. Matt Francis, and H. Alan Mantooth. "An Integrated SiC CMOS Gate Driver for Power Module Integration." IEEE Transactions on Power Electronics 34, no. 11 (2019): 11191–98. http://dx.doi.org/10.1109/tpel.2019.2900324.

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11

Pang, Y., E. Scott, J. D. van Wyk, and Z. Liang. "Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module." Journal of Electronic Packaging 129, no. 1 (2006): 1–8. http://dx.doi.org/10.1115/1.2429703.

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The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding of the thermal behavior of these components can help in deciding an effective thermal management scheme. Recognizing the inherent need for the thermal design of the active integrated power electronics modules, this paper assesses various possibilities of integrated thermal management for integrated power electronics modules. These integrated thermal management strategies include employing high thermal conductivity materials as well as structural modifications to the current module structure while not adding complexity to the fabrication process to reduce the cost.
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12

Son, Yo-Chan, Ki Young Jang, and Bum-Seok Suh. "Integrated MOSFET Inverter Module for Low-Power Drive System." IEEE Transactions on Industry Applications 44, no. 3 (2008): 878–86. http://dx.doi.org/10.1109/tia.2008.921447.

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13

Liang, Z., B. Lu, J. D. vanWyk, and F. C. Lee. "Integrated CoolMOS FET/SiC-Diode Module for High Performance Power Switching." IEEE Transactions on Power Electronics 20, no. 3 (2005): 679–86. http://dx.doi.org/10.1109/tpel.2005.846547.

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14

Han, Xueyan, Zeping Zhao, Shuangxing Dai, Yuehui Wang, Jianguo Liu, and Junming An. "Hybrid-integrated photodetector array receiving module with power pre-equalization." Optics Communications 501 (December 2021): 127375. http://dx.doi.org/10.1016/j.optcom.2021.127375.

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15

Kim, Dae Jun, Kyung Sik Yoon, and Chul Soon Park. "A Ka-band LTCC integrated 22-dBm MMIC power-amplifier module." Microwave and Optical Technology Letters 38, no. 6 (2003): 455–57. http://dx.doi.org/10.1002/mop.11088.

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16

Wenduo Liu, J. D. van Wyk, and Bing Lu. "In-Circuit Loss Measurement of a High-Frequency Integrated Power Electronics Module." IEEE Transactions on Instrumentation and Measurement 57, no. 7 (2008): 1394–402. http://dx.doi.org/10.1109/tim.2007.915152.

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17

Qiaoliang Chen, Yunqing Pei, Xu Yang, and Zhaoan Wang. "Analysis and Suppression of Inductive Interference in an Active Integrated Power Electronics Module." IEEE Transactions on Components and Packaging Technologies 32, no. 4 (2009): 724–33. http://dx.doi.org/10.1109/tcapt.2009.2029085.

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18

Jørgensen, Asger Bjørn, Thore Stig Aunsborg, Szymon Bęczkowski, Christian Uhrenfeldt, and Stig Munk‐Nielsen. "High‐frequency resonant operation of an integrated medium‐voltage SiC MOSFET power module." IET Power Electronics 13, no. 3 (2020): 475–82. http://dx.doi.org/10.1049/iet-pel.2019.0413.

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19

Jorgensen, Asger Bjorn, Szymon Beczkowski, Christian Uhrenfeldt, Niels Hogholt Petersen, Soren Jorgensen, and Stig Munk-Nielsen. "A Fast-Switching Integrated Full-Bridge Power Module Based on GaN eHEMT Devices." IEEE Transactions on Power Electronics 34, no. 3 (2019): 2494–504. http://dx.doi.org/10.1109/tpel.2018.2845538.

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20

Yu, Byunggyu, and Seok-Cheol Ko. "Power dissipation analysis of PV module under partial shading." International Journal of Electrical and Computer Engineering (IJECE) 11, no. 2 (2021): 1029. http://dx.doi.org/10.11591/ijece.v11i2.pp1029-1035.

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Photovoltaic (PV) generation has been growing dramatically over the last years and it ranges from small, rooftop-mounted or building integrated systems, to large utility scale power stations. Especially for rooftop-mounted PV system, PV modules are serially connected to match with PV inverter input voltage specification. For serially connected PV system, shading is a problem since the shaded PV module reduces the output whole string of PV modules. The excess power from the unshaded PV module is dissipated in the shaded PV module. In this paper, power dissipation of PV module under partial shading is analyzed with circuit analysis for series connected PV modules. The specific current and voltage operating point of the shaded PV module are analyzed under shading. PSIM simulation tool is used to verify the power dissipation analysis. When there is no bypass diode and three solar modules are connected in series, upto 39.1% of the total maximum PV power is dissipated in the shaded PV module. On the other hand, when the bypass is attached, 0.3% of the total maximum power is generated as a loss in the shaded PV module. The proposed analysis technique of shaded PV module could be used in PV system performance analysis, especially for maximum power point tracking (MPPT) performance.
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21

Yuan, Tao, Yuanjin Zheng, Le-Wei Li, and Mook-Seng Leong. "A fully integrated ultra-low power CMOS transmitter module for UWB systems." Microwave and Optical Technology Letters 51, no. 10 (2009): 2318–23. http://dx.doi.org/10.1002/mop.24632.

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22

Yin, Shizhuo, Purwadi Purwosumarto, Weihong Su, Claire Luo, and Yunlong Sheng. "An athermal, hitless, tunable add-drop module with inherently integrated power controller." Microwave and Optical Technology Letters 36, no. 4 (2003): 297–300. http://dx.doi.org/10.1002/mop.10747.

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23

Zhang, Maosheng, Yu Bai, Shu Yang, and Kuang Sheng. "Investigation on Thermal Resistance and Capacitance Characteristics of a Highly Integrated Power Control Unit Module." Electronics 10, no. 8 (2021): 958. http://dx.doi.org/10.3390/electronics10080958.

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With the increasing integration density of power control unit (PCU) modules, more functional power converter units are integrated into a single module for applications in electric vehicles or hybrid electric vehicles (EVs/HEVs). Different types of power dies with different footprints are usually placed closely together. Due to the constraints from the placement of power dies and liquid cooling schemes, heat-flow paths from the junction to coolant are possibly inconsistent for power dies, resulting in different thermal resistance and capacitance (RC) characteristics of power dies. This presents a critical challenge for optimal liquid cooling at a low cost. In this paper, a highly integrated PCU module is developed for application in EVs/HEVs. The underlying mechanism of the inconsistent RC characteristics of power dies for the developed PCU module is revealed by experiments and simulations. It is found that the matching placement design of power dies with a heat sink structure and liquid cooler, as well as a liquid cooling scheme, can alleviate the inconsistent RC characteristics of power dies in highly integrated PCU modules. The findings in this paper provide valuable guidance for the design of highly integrated PCU modules.
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24

Poymalin, V. E., A. V. Buyankin, A. A. Nelin, L. E. Ragulina, and M. V. Ryzhakov. "Shielding Device for Microwave Electronic Components of a Multilayer Board for the AFAR Transceiver Module for Space Purposes." Rocket-space device engineering and information systems 8, no. 2 (2021): 82–87. http://dx.doi.org/10.30894/issn2409-0239.2021.8.2.82.87.

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A method of shielding the elements of a microwave module based on the principles of forming a Faraday cage, with different power and different frequency paths of the AFAR receiving-transmitting module, excluding their mutual electromagnetic influence, is presented. A description of the structure of a multilayer board and various structural elements is given, allowing to limit (screen) the signal in a small volume, commensurate with the size of a monolithic integrated circuit or a set of monolithic integrated circuits, isolating parasitic electromagnetic interference. Polyimide is considered as a dielectric material of a multilayer microwave board for use in space technology devices, as well as promising design solutions for reducing the mass and dimensions of the module.
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25

Chang, Hung-Chun, and Chang-Ming Liaw. "An Integrated Driving/Charging Switched Reluctance Motor Drive Using Three-Phase Power Module." IEEE Transactions on Industrial Electronics 58, no. 5 (2011): 1763–75. http://dx.doi.org/10.1109/tie.2010.2051938.

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26

Ahn, Seong‐Hyeop, and Wang‐Sang Lee. "A compact module‐integrated wireless power transfer system with a square metal plate." Microwave and Optical Technology Letters 61, no. 5 (2019): 1235–39. http://dx.doi.org/10.1002/mop.31747.

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27

Denk, Marco, and Mark-M. Bakran. "Online Junction Temperature Cycle Recording of an IGBT Power Module in a Hybrid Car." Advances in Power Electronics 2015 (March 2, 2015): 1–14. http://dx.doi.org/10.1155/2015/652389.

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The accuracy of the lifetime calculation approach of IGBT power modules used in hybrid-electric powertrains suffers greatly from the inaccurate knowledge of application typical load-profiles. To verify the theoretical load-profiles with data from the field this paper presents a concept to record all junction temperature cycles of an IGBT power module during its operation in a test vehicle. For this purpose the IGBT junction temperature is measured with a modified gate driver that determines the temperature sensitive IGBT internal gate resistor by superimposing the negative gate voltage with a high-frequency identification signal. An integrated control unit manages the TJ measurement during the regular switching operation, the exchange of data with the system controller, and the automatic calibration of the sensor system. To calculate and store temperature cycles on a microcontroller an online Rainflow counting algorithm was developed. The special feature of this algorithm is a very accurate extraction of lifetime relevant information with a significantly reduced calculation and storage effort. Until now the recording concept could be realized and tested within a laboratory voltage source inverter. Currently the IGBT driver with integrated junction temperature measurement and the online cycle recording algorithm is integrated in the voltage source inverter of first test vehicles. Such research will provide representative load-profiles to verify and optimize the theoretical load-profiles used in today’s lifetime calculation.
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28

Abdrazakov, Evgeniy, and Victor Andreev. "Power supply of a modular mobile robot in combination with a communication channel over power supply lines." Robotics and Technical Cybernetics 9, no. 1 (2021): 72–80. http://dx.doi.org/10.31776/rtcj.9108.

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The article is devoted to the development of a full-featured power supply module with an integrated communication channel over the power supply lines. The module is intended to perform the energy function of a mobile robot (MR), namely, to provide power to all electronic and mechatronic units of mobile robots with modular architecture. In contrast to the power supply unit for robots with mono-block architecture, in this case, the module power supply node must be made in the form of a full-featured module, i.e. meet a number of special requirements: 1 - structurally it must be made as a separate module, easily included in the design of the modular robot and possess the ability to quickly build up its power; 2 - the control system must monitor the state of the battery and power consumption of each of the MR’s modules, to manage the process of switching them off / on; 3 - to have an information communication channel with all MR’s modules for dynamic control of the power supply to each of the modules, including the supervisor module for subsequent transfer power status parameters to the operator of the MR by the radio channel. As a part of the solution of the problem the concept of sub-module principle of organizing the structure of the power supply module of modular mobile robot was developed, battery power submodule and submodule decoder based on PLC modem using DC-PLC technology (Direct Current Power Line Communication), which provides the formation of an intermodular information communication channel over the power supply lines, were designed and manufactured.
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29

Pavithra, C., R. Geethamani, G. Radhakrishnan, Kishore S. Kumar, and C. Manoj. "A Novel Grid Integrated Perturb and Observe Maximum Power Point Tracking Controlled Photovoltaic Power Plant for Power Enhancement." Journal of Computational and Theoretical Nanoscience 16, no. 2 (2019): 410–16. http://dx.doi.org/10.1166/jctn.2019.7741.

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Solar Photovoltaic power generation shows considerable growth in the past decades. In the grid integrated PV system require MPPT controller to improve the efficiency of the power harvested from the plant due to nonlinearity nature of PV module. Among many MPPT Technique P&O has adaptive tracking, reduced oscillation around MPP. In this paper the Perturbation and Observation based MPPT algorithm with adaptive duty ratio generation is used. In this Paper in addition to PV power generation it is used for the power correction of the utility grid by injecting the power to balance the system during unbalanced load condition. Simulation of the proposed concept is run in the MATLAB 2018/Simulink environment.
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30

Liang, Xi, Tao Jiang, Guoxu Liu, et al. "Triboelectric Nanogenerator Networks Integrated with Power Management Module for Water Wave Energy Harvesting." Advanced Functional Materials 29, no. 41 (2019): 1807241. http://dx.doi.org/10.1002/adfm.201807241.

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31

Edwin, Fonkwe Fongang, Weidong Xiao, and Vinod Khadkikar. "Dynamic Modeling and Control of Interleaved Flyback Module-Integrated Converter for PV Power Applications." IEEE Transactions on Industrial Electronics 61, no. 3 (2014): 1377–88. http://dx.doi.org/10.1109/tie.2013.2258309.

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32

Zhang, Xiuyan, Ouwen Shi, Jian Xu, and Shantanu Dutt. "A Power-Driven Stochastic-Deterministic Hierarchical High-Level Synthesis Framework for Module Selection, Scheduling and Binding." Journal of Low Power Electronics 15, no. 4 (2019): 388–409. http://dx.doi.org/10.1166/jolpe.2019.1584.

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We present a power-driven hierarchical framework for module/functional-unit selection, scheduling, and binding in high level synthesis. A significant aspect of algorithm design for large and complex problems is arriving at tradeoffs between quality of solution and timing complexity. Towards this end, we integrate an improved version of the very runtime-efficient list scheduling algorithm called modified list scheduling (MLS) with a power-driven simulated annealing (SA) algorithm for module selection. Our hierarchical framework efficiently explores the problem solution space by an extensive exploration of the power-driven module-selection solution space via SA, and for each module selection solution, uses MLS to obtain a scheduling and (integrated) binding (S&B) solution in which the binding is either a regular one (minimizing number of FUs and thus FU leakage power) or power-driven with mux/demux power considerations. This framework avoids the very runtime intensive exploration of both module selection and S&B within a conventional SA algorithm, but retains the basic prowess of SA by exploring only the important aspect of power-driven module-selection in a stochastic manner. The proposed hierarchical framework provides an average of 9.5% FU leakage power improvement over state of the art (approximate) algorithms that optimize only FU leakage power, and has a smaller runtime by factors of 2.5–3x. Further, compared to a sophisticated flat simulated annealing framework and an optimal 0/1-ILP formulation for total (dynamic and leakage) FU and architecture power optimization under latency constraints, PSA-MLS provides an improvement of 5.3–5.8% with a runtime advantage of 2x, and has an average optimality gap of only 4.7–4.8% with a significant runtime advantage of a factor of more than 1900, respectively.
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33

Schuh, Patrick, Hardy Sledzik, Rolf Reber, et al. "X-band T/R-module front-end based on GaN MMICs." International Journal of Microwave and Wireless Technologies 1, no. 4 (2009): 387–94. http://dx.doi.org/10.1017/s1759078709990389.

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Amplifiers for the next generation of T/R modules in future active array antennas are realized as monolithically integrated circuits (MMIC) on the basis of novel AlGaN/GaN (is a chemical material description) high electron mobility transistor (HEMT) structures. Both low-noise and power amplifiers are designed for X-band frequencies. The MMICs are designed, simulated, and fabricated using a novel via-hole microstrip technology. Output power levels of 6.8 W (38 dBm) for the driver amplifier (DA) and 20 W (43 dBm) for the high-power amplifier (HPA) are measured. The measured noise figure of the low-noise amplifier (LNA) is in the range of 1.5 dB. A T/R-module front-end with mounted GaN MMICs is designed based on a multi-layer low-temperature cofired ceramic technology (LTCC).
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34

Jasińska, Laura, Krzysztof Szostak, Mateusz Czok, Karol Malecha, and Piotr Słobodzian. "A Stripline-Based Integrated Microfluidic-Microwave Module." Energies 14, no. 9 (2021): 2439. http://dx.doi.org/10.3390/en14092439.

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The paper presents the preliminary results on the development of an integrated stripline-based microwave-microfluidic module. The measurements were performed in a frequency range from 300 MHz up to 12 GHz, with the microchannel filled with three different test fluids—deionized water, the ethanol-water solution and pure ethanol. Due to the higher-than-expected losses in transmittance, the selected module was examined with use of the cross-sections taken along its length. The possible causes were highlighted and described. Likewise, the proposed areas of further investigations have been clearly described.
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35

Vine, Guillaume, Paul-Etienne Vidal, and Jean-Marc Dienot. "Characterization Method of Radiated Magnetic Field Based on Integrated Antenna Measurement Applied to Power Module Technologies." IEEE Transactions on Power Electronics 35, no. 2 (2020): 1440–49. http://dx.doi.org/10.1109/tpel.2019.2916261.

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36

Wang, Zhiqiang, Xiaojie Shi, Leon M. Tolbert, et al. "A high temperature silicon carbide mosfet power module with integrated silicon-on-insulator-based gate drive." IEEE Transactions on Power Electronics 30, no. 3 (2015): 1432–45. http://dx.doi.org/10.1109/tpel.2014.2321174.

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37

Anderson, T. J., F. Ren, L. Covert, J. Lin, and S. J. Pearton. "Thermal simulations of three-dimensional integrated multichip module with GaN power amplifier and Si modulator." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 24, no. 1 (2006): 284. http://dx.doi.org/10.1116/1.2163888.

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38

Sahan, Benjamin, Antonio Notholt Vergara, Norbert Henze, Alfred Engler, and Peter Zacharias. "A Single-Stage PV Module Integrated Converter Based on a Low-Power Current-Source Inverter." IEEE Transactions on Industrial Electronics 55, no. 7 (2008): 2602–9. http://dx.doi.org/10.1109/tie.2008.924160.

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39

Zhu, Xiwen, Qiang Fu, Ruimo Yang, and Yufeng Zhang. "A High Power-Conversion-Efficiency Voltage Boost Converter with MPPT for Wireless Sensor Nodes." Sensors 21, no. 16 (2021): 5447. http://dx.doi.org/10.3390/s21165447.

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A high power-conversion-efficiency voltage boost converter with MPPT for wireless sensor nodes (WSNs) is proposed in this paper. Since tiny wireless sensor nodes are all over complex environments, an efficient power management system (PMS) must be equipped to achieve long-term self-power supply and maintain regular operation. It is common to use Photovoltaic cells (PV) to harvest sunlight in the environment. However, most existing interface boost integrated circuits for the PV cell have low efficiency. This paper presents a voltage boost converter (VBC) with high power conversion efficiency (PCE) for WSNs. The integrated circuit (IC) designed in this paper includes a novel four-phase high-efficiency charge pump module, an ultra-low-power perturbation observation (P&O) MPPT control circuit module, a feedback control module, a nano-ampere current reference, etc. Manufactured in a standard 0.35 um complementary metal-oxide-semiconductor (CMOS) technology, the chip area is 3.15 mm × 2.43 mm. Test results demonstrate that when the output voltage of the PV cell is more than 0.5 V, VBC can improve the voltage to 3Vin, and the calculated voltage conversion efficiency can reach 99.4%. P&O MPPT algorithm makes output power improving 8.53%. Furthermore, when the output load current is 297uA, the output PCE achieves 85.1%.
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40

Pogra, Vivek, Santosh Kumar Vishvakarma, and Balwinder Raj. "Design and Performance Analysis of Application Specific Integrated Circuit for Internet of Things Application." Sensor Letters 18, no. 1 (2020): 31–38. http://dx.doi.org/10.1166/sl.2020.4176.

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This paper proposes a novel design of application specific integrated circuit (ASIC) which is capable of connecting sensor network and other electronic systems to the Internet. The transfer of data between different networks and internet of things (IoT) platform is controlled by IoT platform with the help of instruction sent to ASIC. ASIC will act as serial peripheral interface (SPI) master to all connected networks and data will be transferred serially between them. The different ASIC modules are SPI module, control module, memory module and data/instruction decoder with additional modules built-in self-test (BIST) and direct memory access (DMA). The proposed ASIC will consume less power as compared to conventional microcontroller/microprocessor due to the fact that it is designed for IoT applications. It is described in VHDL at RTL level and simulation is done on the Vivado 2016.2.
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41

Cao, Yongqi, Weihe Shen, Fangzhi Li, et al. "All-in-One High-Power-Density Vibrational Energy Harvester with Impact-Induced Frequency Broadening Mechanisms." Micromachines 12, no. 9 (2021): 1083. http://dx.doi.org/10.3390/mi12091083.

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This paper proposes an electrostatic-piezoelectric-electromagnetic hybrid vibrational power generator with different frequency broadening schemes. Both the nonlinear frequency broadening mechanisms and the synergized effect of the electrostatic-piezoelectric-electromagnetic hybrid structures are investigated. The structure and performance of the composite generator are optimized to improve the response bandwidth and performance. We propose that the electrostatic power generation module and the electromagnetic power generation module be introduced into the cantilever beam to make the multifunctional cantilever beam, realizing small integrated output loss, high output voltage, and high current characteristics. When the external load of the electrostatic power generation module is 10 kΩ, its peak power can reach 3.6 mW; when the external load of the piezoelectric power generation module is 2 kΩ, its peak power is 2.2 mW; and when the external load of the electromagnetic power generation module is 170 Ω, its peak power is 0.735 mW. This means that under the same space utilization, the performance is improved by 90%. Moreover, an energy management circuit (ECM) at the rear end of the device is added, through the energy conditioning circuit, the device can directly export a 3.3 V DC voltage to supply power to most of the sensing equipment. In this paper, the hybrid generator’s structure and performance are optimized, and the response bandwidth and performance are improved. In general, the primary advantages of the device in this paper are its larger bandwidth and enhanced performance.
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42

Mertol, A. "Optimization of Extruded Type External Heat Sink for Multichip Module." Journal of Electronic Packaging 115, no. 4 (1993): 440–44. http://dx.doi.org/10.1115/1.2909354.

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A three-dimensional finite element model of a multichip module (MCM) has been developed by using ANSYS™ finite element simulation code. The model has been used for thermal characterization of the module. In addition, optimum dimensions of an external heat sink, which maintains the specified device’s junction temperature within desired operating temperature limits, are determined as functions of air flow rate and power density of surrounding semiconductor devices. Parametric studies have been performed to study the effects of heat sink height, width and length on junction-to-ambient thermal resistance of a high power application specific integrated circuit (ASIC) device found in the MCM assembly. A set of curves are generated to select either heat sink dimensions or air speed for a given design requirements. Influence of the power output of surrounding devices on the thermal performance of the high power ASIC device is also assessed. The predicted results indicate that the ASIC device’s junction temperature as well as junction-to-ambient resistance increase as the power of the surrounding packages increases. This effect diminishes if a sufficiently large heat sink is used to cool the package.
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43

Jiang, Shu, Jinping Xu, Jiangling Dou, and Wenbo Wang. "100 GHz FMCW Radar Module Based on Broadband Schottky-diode Transceiver." Frequenz 72, no. 5-6 (2018): 267–76. http://dx.doi.org/10.1515/freq-2017-0030.

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AbstractWe report on a W-band frequency-modulated continuous-wave (FMCW) radar module with fractional bandwidth over 10 %. To improve flatness over large operation bandwidth, the radar module is developed with focus on the 90–101 GHz modular transceiver, for which accurate modeling of Schottky diode in combination with an integrated design method are proposed in this work. Moreover, the nonlinearity compensation approach is introduced to further optimize the range resolution. To verify the design method and RF performance of the radar module, both measurements of critical components and ISAR imaging experiments are performed. The results demonstrate that high resolution in range and azimuth dimensions can be achieved based on the radar module, of which the receiving gain flatness and transmitting power flatness are better than ±1.3 dB and ±0.7 dB over 90~101 GHz, respectively.
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44

Othman, Muhammad Murtadha, Muhamad Amirul Naim Mohd Jamaluddin, Faisal Fauzi, Ismail Musirin, and Mohammad Lutfi Othman. "Improved reliability assessment of backup battery storage integrated with power supply system in a building." International Journal of Power Electronics and Drive Systems (IJPEDS) 10, no. 3 (2019): 1538. http://dx.doi.org/10.11591/ijpeds.v10.i3.pp1538-1546.

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This paper presents the improved analysis of reliability for battery storage used in power system. The reliability assessment of this paper includes the evaluation of reliability of the system components, battery module and power electronic components. Battery storage is considered as one of energy storage and energy source that commonly used in power system. The evaluation of the reliability of power systems utilising with the storage batteries is performed by using the Markov chain process. The computation of the reliability is conducted by referring to the generated reliability block begins from power supply system. Every part of the system is evaluated regarding two specific states that are in normal or failure mode. By using the Markov method, the system unavailability and failure frequency can be computed.<span style="font-size: 9pt; font-family: 'Times New Roman', serif;" lang="EN-GB">This paper presents the improved analysis of reliability for battery storage used in power system. The reliability assessment of this paper includes the evaluation of reliability of the system components, battery module and power electronic components. Battery storage is considered as one of energy storage and energy source that commonly used in power system. The evaluation of the reliability of power systems utilising with the storage batteries is performed by using the Markov chain process. The computation of the reliability is conducted by referring to the generated reliability block begins from power supply system. Every part of the system is evaluated regarding two specific states that are in normal or failure mode. By using the Markov method, the system unavailability and failure frequency can be computed.</span>
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45

Pogra, Vivek, Amandeep Singh, Santosh Kumar Vishvakarma, and Balwinder Raj. "Design and Performance Analysis of Application Specific Integrated Circuit for Internet of Things Applications." Sensor Letters 18, no. 9 (2020): 700–705. http://dx.doi.org/10.1166/sl.2020.4239.

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This paper proposes a novel design of application specific integrated circuit (ASIC) which is capable of connecting sensor network and other electronic systems to the internet. The transfer of data between different networks and electronic systems is controlled by internet of things (IoT) platform with the help of instruction sent to ASIC. ASIC will act as serial peripheral interface (SPI) master to all connected networks and data will be transferred serially between them. The different ASIC modules are SPI module, control module, memory module and data/instruction decoder with additional modules built-in self-test (BIST) and direct memory access (DMA). The proposed ASIC will consume less power as compared to conventional microcontroller/microprocessor due to SPI feature along with DMA on ASIC for IoT applications. It is described in very high speed integrated circuit hardware description language (VHDL) at register transfer level (RTL) and simulation is done on the Vivado 2016.2.
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46

Wentzel, Andreas, Oliver Hilt, Joachim Würfl, and Wolfgang Heinrich. "A highly efficient GHz switching GaN-based synchronous buck converter module." International Journal of Microwave and Wireless Technologies 12, no. 10 (2020): 945–53. http://dx.doi.org/10.1017/s1759078720000380.

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AbstractThe paper presents a highly efficient GaN-based synchronous buck converter suitable for switching in the lower GHz range. The module includes a very compact 2-stage GaN half-bridge converter MMIC (monolithic microwave integrated circuit) for low parasitic inductances between switches and drivers and a hybrid output network with core-less inductors to avoid ferrite losses. At 1 GHz switching frequency the buck converter achieves with pulse-width modulated (PWM) input signals power loop conversion efficiencies up to 78% for 40 V operation and output voltages up to 33 V. For 100 MHz the power loop efficiencies peak at 87.5% for 14.5 W conversion to 25 V. By changing the output network to a 2nd order low-pass with 700 MHz cut-off frequency the module has been characterized for the use as a supply modulator in very broadband envelope tracking systems with modulation bandwidths of up to 500 MHz. For 1 GHz switching frequency the power-added efficiency peaks at 74% for a 90% duty-cycle PWM input signal. The novelty of this work is that for the first time a buck converter design proves highest flexibility supporting different applications from very compact DC converters to microwave power amplifier efficiency enhancement techniques as well as efficient high frequency switching up to 1 GHz.
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47

Ke, Haotao, Adam Morgan, Ronald Aman, and Douglas C. Hopkins. "Investigation of Rapid-Prototyping Methods for 3D Printed Power Electronic Module Development." International Symposium on Microelectronics 2014, no. 1 (2014): 000887–92. http://dx.doi.org/10.4071/isom-thp52.

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The recent research in wide-bandgap (WBG) power electronic semiconductors has produced a wide variety of device and combinational topologies, such as HFETS, MOSHFETS, and the Cascode Pair. Each variation needs to be tested with certain package criteria (e.g. high voltage SiC devices up to 15kV, high current GaN devices up to 300A, or unprecedented high frequencies). Having a common package is costly and cannot provide an investigation of optimized performance. Hence, use of a rapid prototyping method to print power electronic packages and modules is needed. Also, the continual move to higher frequencies will require greater integration of packaging into the end application, as is presently done with point-of-load converters. The future modules will take on more functional integration, including more mechanical features, which further supports use of printed fabrication technologies. It is not reasonable to assume that a complete module can be directly printed, though most would be; some assembly is required. This paper discusses partitioning of a module process, and identifying key elements that can be combined for optimum power package production. To select the best process, or combination, for rapid-prototype printing of power modules current, Additive Manufacturing (AM) methods are evaluated, such as Stereolithography (SLA), Selective Laser sintering (SLS), and Fused Deposition Manufacturing (FDM). Several modules were fabricated to demonstrate mechanical resolutions in the packaging. A thermoplastic printer, specifically the MakerBot, which is a high end consumer 3D printer, produces packages with 100 micron resolution. The Acrylonitrile butadiene styrene (ABS) build object can have surface texture enhancement with post chemical treatment, such as an acetone vapor bath. Today, this is finding a home and proving useful in low volume rapid prototyping in small electronics companies. The ABS plastics are typically rated for <105°C applications. Another printed module to be reported uses a high-end commercial machine with <20 microns in resolution (Stratasys Objet) using standard UV curable polymers. This provides a slightly higher temperature range with greater mechanical integrity. Materials for >250°C that use both UV and thermal sintering are available, but not evaluated in this paper. Functional integration can include electrical, mechanical, and thermal appendages and sub-systems. Electrical sub-systems, such as gate drivers and sensors, can impact process partitioning, by requiring “low power” circuit fabrication processes integrated with those for high power. This paper demonstrates a printed polymer substrate process for functional integration of a signal-circuit. Since nearly all AM processes were developed initially for mechanical systems, many processed materials have not been electrically characterized, though the basic material compositions may have suitable electrical characteristics. This paper categorizes several materials for their potential suitability for power packaging. The evaluation is based on the electrical, mechanical, and thermal parameters, along with precision, surface texture (affecting electric field contours) and process times. Cost and performance will be of main concern.
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48

Liang, Jian-Yi, Yung-Lung Lee, Shih-Wei Mao, and Ming-Da Tsai. "Design of an Integrated Heat Dissipation Mechanism for a Quad Transmit Receive Module of Array Radar." Applied Sciences 11, no. 15 (2021): 7054. http://dx.doi.org/10.3390/app11157054.

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A radar system requires a number of high-power components operating in a narrow and convection-free environment. This study aims to develop an integrated heat dissipation system that is suitable for the high-power electronic equipment of radar systems. The proposed heat dissipation mechanism integrates a fluid circulation-type cold plate with a quad transmit receive module. The finite element method in the COMSOL fluid–solid coupling heat transfer analysis software was used to analyze the heat dissipation performance of the cold plate in the proposed mechanism. The Taguchi method was adopted to optimize the cold plate design. The simulation and experimental results show that the proposed mechanism can control the temperature equalization and temperature of the system within the specified requirements. The practicality of the proposed mechanism was verified. The findings can serve as a reference for the design of high-power electronic equipment in a heat dissipation system.
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49

Kim, Jun Chul, Dongsu Kim, Hyun Min Cho, Jong Chul Park, and Nam Kee Kang. "An LTCC Based Filter and Front End Module using Heterogeneous Dielectrics." Journal of Microelectronics and Electronic Packaging 3, no. 3 (2006): 129–35. http://dx.doi.org/10.4071/1551-4897-3.3.129.

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This paper presents a multi-layered bandpass filter (BPF) and a power amplifier module (PAM) integrated with a SAW duplexer based on heterogeneous ceramic substrates. The heterogeneous substrates are composed of two different ceramic layers with εr = 7.4 and 17.5 in order to take advantage of their own properties. In the PAM substrate, a DC blocking capacitor and a shunt capacitor for an output matching network of a power amplifier are embedded with a material of εr = 17.5 to reduce occupied areas of the capacitors. On the other hand, a quarter-wave-length stripline and RF chokes are realized with a material of εr = 7.4 to reduce signal delay time. In the multi-layered BPF, a coupled stripline and a high shunt capacitor are embedded with materials of εr = 7.4 and 17.5, respectively, resulting in improved spurious characteristics.
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50

Li, Zhiqiang, Houjun Sun, Hongjiang Wu, and Shuai Zhang. "An Ultra-Wideband Compact TR Module Based on 3-D Packaging." Electronics 10, no. 12 (2021): 1435. http://dx.doi.org/10.3390/electronics10121435.

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This study presents a novel four-channel tile-type T/R module which achieves excellent performances in ultra-wideband (2–12 GHz) and integrates all circuits in a super-light (25 g) and compact (27.8 × 27.8 × 12 mm3) mechanical structure in active phased array systems. The key advancement of this T/R module was to choose a Ball Grid Array (BGA) as the vertical interconnection and bracing between High-Temperature Co-fired Ceramic (HTCC) substrates in order to achieve a high-integration 3-D structure. Exploiting the HTCC multilayer layout, this paper presents the design and development of an ultra-wideband, compact and light, high-output power, four-channel, dual-polarization Transmit/Receive (T/R) Module. In this module, microwave circuits and power control circuits are highly integrated into electrically isolated HTCC layers or substrates, resulting in low coupling and crosstalk between signals. Furthermore, multichip assembly technology, multifunctional MMICs, and other high-integration technologies were adopted for this module. Each channel could provide more than 2 W transmit output power, more than 15 dB receive gain, and less than 5 dB receive noise figure. Every module contains four channels. The power supply and phase/amplitude conditioning of each channel can be controlled individually and showed good consistency of the amplitude and phase of all channels. The connectors of manifold port and polarization ports are all SSMP, which can achieve further integration. This module has also an automatic negative power protection function. The module has stabilized performance and mass production prospects.
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