Academic literature on the topic 'Intellisuite'

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Journal articles on the topic "Intellisuite"

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Jian, Qi Xia, Jun Wang, Kai Yuan, Zi Qiu Peng, and Ya Dong Jiang. "Simulation of Micro-Bolometer Using Double Sacrificial Layers Structure." Applied Mechanics and Materials 120 (October 2011): 504–9. http://dx.doi.org/10.4028/www.scientific.net/amm.120.504.

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Micro-bolometer using double sacrificial layers with smaller pixel size and higher resolution has been a new trend for microbolometers. Optical design and simulation of microbolometer with double sacrificial layers were analyzed in this article. Also, the manufacture, test and optimization of doule layer structure were discussed. The micro-bolometer cell structure models were constructed and simulated with Intellisuite software. The devices with and without umbrella structure were compared in this paper. The models of different structure and manufacture conditions were simulated with Intellisu
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Dr., Shanmugavalli. M., G. Vignesh., R. Harish., Nesan. G. Nicolas, and Kumar. J. Parithi. "Design and Simulation of Piezoresistive Pressure Sensor using Intellisuite." International Journal of Multidisciplinary Research Transactions 5, no. 5 (2023): 27–37. https://doi.org/10.5281/zenodo.7868910.

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The Piezoresistive Pressure Sensor given in this study describes the best methods for enhancing the sensor's performance. To get findings that are roughly equivalent to theoretical values, finite element analysis is used as part of the design process. The size, shape, and position of the piezo resistors are taken into account during the simulation. The piezo resistors, which are coupled in the shape of a Wheatstone bridge, convert the applied pressure into electricity. By choosing the appropriate membrane geometry and piezo resistor placement, the sensitivity of the sensor can be increased
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Srikanth, S. Sri Surya, B. Rajesh Kumar, V. Suresh, V. Jyothi, I. Sreenivasa Rao, and G. Aswani Kumar. "Design of MEMS Cantilever Sensors for Identification of VOCs Using IntelliSuite." Materials Today: Proceedings 22 (2020): 3162–70. http://dx.doi.org/10.1016/j.matpr.2020.03.453.

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Dou, Yan Wei, Cheng Jun Qiu, Bo Zang, Jing Xuan Wang, and Xiao Dong Zhang. "Design and Simulation of Thermopile Sensor Technology Based on Porous Silicon." Applied Mechanics and Materials 741 (March 2015): 289–93. http://dx.doi.org/10.4028/www.scientific.net/amm.741.289.

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Thermopile sensor using porous silicon (PS) as thermal isolation layer was designed. Thermal stability and mechanical property of sensor were simulated by IntelliSuite CAD software. Analysis results showed stress and temperature distribution of PS layer. Ansys simulation indicated that thermocouple’s thermoelectromotive force was decided by its material composition. If thermocouple was composed of polycrystalline silicon/aluminum, its thermoelectromotive force would reach 256.8 μV/K.
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Sindhanaiselvi, D., R. Ananda Natarajan, and T. Shanmuganantham. "Performance Analysis of Sculptured Diaphragm for Low Pressure MEMS Sensors." Applied Mechanics and Materials 592-594 (July 2014): 2193–98. http://dx.doi.org/10.4028/www.scientific.net/amm.592-594.2193.

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Sculptured or Bossed diaphragm is a specialized geometry with rigid center or boss. This paper presents the outcome of design approaches of sculptured diaphragm structure for low pressure applications. The simulation results are obtained using Intellisuite MEMS CAD design tool. The results indicate that sculptured diaphragm are designed with minimum thickness, compensating the large (a/h) ratio with local stiffening by means of rigid center and better linearity. Further, the maximum stress regions are analyzed for fixing the position of the piezoresistor. Finally, the sensitivity is improved b
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Gomathi, K., A. Senthil Kumar, and M. Raghunath. "Design and Analysis of Micro Accelerometer for Tool Condition Monitoring." Applied Mechanics and Materials 787 (August 2015): 932–36. http://dx.doi.org/10.4028/www.scientific.net/amm.787.932.

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Tool condition monitoring plays a huge role in the CNC machines in which it is used to avoid the breakage of the tools.In this paper area changed capacitive micro accelerometer is designed to measure the vibration exposure of the tool on various applications in the CNC machines. The design process and simulation of the Micro accelerometer are done using INTELLISUITE 8.6. The rectangular folded beamis designed to reduce the residual stress and to obtain a better sensitivity. Static and dynamic analysis shows that sensitivity of the designed capacitive accelerometer is good enough to detect the
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Yu, Lei, Jun Wang, Kai Yuan, and Chong Wang. "Three Dimension Thermal and Mechanical Simulation of Microbolometer to Detect Terahertz Wave." Advanced Materials Research 605-607 (December 2012): 2039–44. http://dx.doi.org/10.4028/www.scientific.net/amr.605-607.2039.

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The teraherz (THz) wave in the far-infrared wave band has been showing its value in many areas in life. The detection of THz wave with microbolometer was simulated in this paper. The thermal and mechanical simulation were carried out by Intellisuite, a professional simulation software of MEMS. The influence of micro-bridge structure on the device performance was studied and simulation results showed that the bridge leg shape and width affected mainly on the thermal and mechanical properties of device. A compromise design between the thermal and mechanical properties was obtained in order to ma
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Ayatollahi, Fatimah Lina, and Burhanuddin Yeop Majlis. "Materials Design and Analysis of Low-Power MEMS Microspeaker Using Magnetic Actuation Technology." Advanced Materials Research 74 (June 2009): 243–46. http://dx.doi.org/10.4028/www.scientific.net/amr.74.243.

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This paper presents material properties of a micromachined mesoscopic acoustic speaker for hearing aid applications. The microspeaker has a single turn copper coil on a polyimide membrane, and an NdFeB permanent magnet beneath the membrane. The fields due to the permanent magnet were computed using FEMM. Then, forces based on the fields and on the coil driving current were computed. Finally, IntelliSuite was employed to simulate membrane displacements and stresses. The device, with a polyimide membrane diameter of 2.5 mm and thickness of 2 µm, consumes 3.4 mW to generate a sound pressure level
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Biswas, Bikram, Sutanni Bhowmick, Anup Dey, Subhashis Roy, and Subir Kumar Sarkar. "Capacitive Multilayered Bio-Sensor Based on Dielectric Modulation Towards Sensing of Biomolecules." Sensor Letters 17, no. 9 (2019): 701–3. http://dx.doi.org/10.1166/sl.2019.4129.

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In this paper, we propose a multilayered capacitive biosensor and evaluate the feasibility of using capacitance as a metric for sensing target biomolecules. The structure has been modeled using the IntelliSuite software. Consideration of distinct values of dielectric constants for different biomolecules makes it a suitable parameter for capacitive biosensor applications. The structure consists of nanogap cavities that act as the sensing sites. The concept of dielectric modulation has been employed for detecting the change in capacitance due to change in the dielectric constant of the cavity. W
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Khan, Fahimullah, Yong Zhu, Jun Wei Lu, and Dzung Dao. "Design Optimization of MEMS Based LLC Tunable Resonant Converter for Power Supplies on Chip." Advanced Materials Research 705 (June 2013): 258–63. http://dx.doi.org/10.4028/www.scientific.net/amr.705.258.

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In this paper, a novel MEMS based LLC converter is proposed for on chip power supplies. The design is optimized based on commercially available Metal MUMPs process for fabrication. The resonant frequency is optimized at 20MHz and MEMS based variable capacitor is fabricated on the chip to tune the peak resonance frequency of circuit which varies due to the load variations. The Design is simulated in FEM based numerical software COMSOL and Intellisuite. According to analysis the magnetizing inductance of 42nH and leakage inductance of 40nH has been achieved from 16 mm2 rectangular coil transform
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Conference papers on the topic "Intellisuite"

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Xu, Fan, Shan-Liang Zhang, Lei Zhou, and Bo Xu. "IntelliSuite® EMagAnalysis: an S-parameter Extraction Tool for Real Deformed Structures." In 2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems. IEEE, 2007. http://dx.doi.org/10.1109/nems.2007.352031.

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Deepika, Manju Mittal, and Anurekha Sharma. "Virtual prototyping of a MEMS capacitive pressure sensor for TPMS using Intellisuite®." In 2012 1st International Symposium on Physics and Technology of Sensors (ISPTS). IEEE, 2012. http://dx.doi.org/10.1109/ispts.2012.6260867.

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Finch, Nora. "Design to Succeed: Integrated MEMS Development." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39260.

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Designers of Micro-Electro-Mechanical Systems (MEMS) face many challenges by being forced to meet product specifications within the limitations of processing and thin-film material parameters. To create a successful MEMS product, there must be collaboration between experts in the target industry and MEMS experts in processing, materials, and other relevant technologies. The use of an integrated CAD for MEMS™ tool by all parties involved can greatly reduce the number of design and fabrication iterations required to successfully commercialize the product. Leveraging Corning IntelliSense’s over t
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Rao, Qing, Jun Yao, Li Zhang, Dajia Wang, and Mohua Yang. "Design and Analysis of a Novel MEMS Variable Capacitor for RF Applications." In 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. ASMEDC, 2008. http://dx.doi.org/10.1115/micronano2008-70263.

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A novel electrostatic RF MEMS variable capacitor consisting of a suspended top plate and two fixed bottom electrodes is presented. The fixed bottom electrodes are constructed by an inner fixed plate and an outer fixed plate. The inner fixed bottom plate is designed to provide electrostatic actuation for capacitance tuning and the outer one is coupled with the top plate to form a variable capacitor. The mechanical suspension of the top plate is served by four L-shaped cantilever beams, the spring constant of which has been analyzed. The characteristics of the proposed device have been analyzed
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Zhang, Li, Jun Yao, Dajia Wa, Qing Rao, Hongsheng Zhong, and Jurgen Schmoll. "High Isolation X-Band RF MEMS Shunt Switches on Groove Etched Substrates." In 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. ASMEDC, 2008. http://dx.doi.org/10.1115/micronano2008-70107.

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Developments in RF MEMS switches have demonstrated great potential at low-loss microwave application. MEMS shunt switches have a few advantages compared to the FET or p-i-n diode counterparts due to their characteristics of low intermodulation distortion or harmonics, low DC power consumption, low insertion losses and high isolation [1][2]. RF MEMS shunt capacitive switches has shown excellent performance from Ka-band to W-band, however, they fail to perform the same in X-band for the low isolation in this frequency range. Various approaches have been introduced to address this shortcoming, su
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