Relevant bibliographies by topics / Interface circuits

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Interface circuits'

Author: Grafiati
Published: 4 June 2021
Last updated: 28 July 2024

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Journal articles on the topic "Interface circuits"

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Zhao, Xue Mei. "Realization of Serial Port Expansion Circuit." Applied Mechanics and Materials 271-272 (December 2012): 1597–601. http://dx.doi.org/10.4028/www.scientific.net/amm.271-272.1597.

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This article describes the design of a interface chip with serial port expansion circuit of computer in industrial applications. It is used to connect with 422 and RS232 interfaces. Circuits involved several major chip such as the interface of 422 and RS232 and UART(Universal Asynchronous Receiver Transmitter)16C550 Inside the computer. Paper describes the composition of the hardware circuit, theory and implementation and initialization programming of URAT interface chip. We use interface chip with the FIFO to the circuit, It improves the efficiency of the application software, And it solves the problem of insufficient of computer serial port.
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Zhang, Bin, Hongsheng Liu, Shengxi Zhou, and Jun Gao. "A review of nonlinear piezoelectric energy harvesting interface circuits in discrete components." Applied Mathematics and Mechanics 43, no. 7 (July 2022): 1001–26. http://dx.doi.org/10.1007/s10483-022-2863-6.

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AbstractPiezoelectric energy harvesting is considered as an ideal power resource for low-power consumption gadgets in vibrational environments. The energy extraction efficiency depends highly on the interface circuit, and should be highly improved to meet the power requirements. The nonlinear interface circuits in discrete components have been extensively explored and developed with the advantages of easy implementation, stable operation, high efficiency, and low cost. This paper reviews the state-of-the-art progress of nonlinear piezoelectric energy harvesting interface circuits in discrete components. First, the working principles and the advantages/disadvantages of four classical interface circuits are described. Then, the improved circuits based on the four typical circuits and other types of circuits are introduced in detail, and the advantages/disadvantages, output power, efficiency, energy consumption, and practicability of these circuits are analyzed. Finally, the future development trends of nonlinear piezoelectric energy harvesting circuits, e.g., self-powered extraction, low-power consumption, and broadband characteristic, are predicted.
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Pawase, Ramesh, and N. P. Futane. "MEMS Seismic Sensor with FPAA Based Interface Circuit for Frequency-Drift Compensation using ANN." International Journal of Reconfigurable and Embedded Systems (IJRES) 6, no. 2 (May 28, 2018): 120. http://dx.doi.org/10.11591/ijres.v6.i2.pp120-126.

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<p>Electrochemical MEMS seismic sensor is limited by its non-ideality of frequency dependent characteristics hence interface circuits for compensation is necessary. The conventional compensation circuits are limited by high power consumption, bulky external hardware circuitry. In these methods digital circuits are also limited by inherent analog to digital conversion and vice versa which consumes significant power, acquires more size and limits speed. A Field programmable analog array (FPAA) overcomes these limitations and gives fast, simple and user friendly development platform with less development speed comparable to ASIC. Recently FPAA becoming popular for rapid prototyping. The proposed system presents FPAA (Anadigm AN231E04) based hardware implementation of ANN model. Using this FPAA based compensation circuit, the error in frequency drift have been minimized in the range of 3.68% to about 0.64% as compared to ANN simulated results in the range of 23.07% to 0.99 %. This single neuron consumes of power of 206.62 mW. and has minimum block wise resource utilization. The proposed hardware uses all analog blocks which remove the requirement of ADC and DAC reducing significant power and size of interface circuit. This work gives the SMART MEMS seismic sensor with reliable output and ANN based intelligent interface circuit implemented in FPAA hardware.<strong></strong></p>
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Liang, Junrui. "Synchronized bias-flip interface circuits for piezoelectric energy harvesting enhancement: A general model and prospects." Journal of Intelligent Material Systems and Structures 28, no. 3 (July 28, 2016): 339–56. http://dx.doi.org/10.1177/1045389x16642535.

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Piezoelectric energy harvesting (PEH) systems, as a kind of electromechanically coupled system, are composed of two essential parts: the piezoelectric structure and the power conditioning interface circuit. Previous studies have shown that the energy harvesting capability of a piezoelectric generator can be greatly enhanced by up to several hundred percent by using synchronized switch harvesting on inductor (SSHI) interface circuits, the most extensively investigated family of synchronized bias-flip interface circuits. After SSHI, some other bias-flip circuit topologies, which utilize active approaches for PEH enhancement, have been proposed sporadically. Yet, how active is active enough for harvesting as much energy as possible was not clear. This paper answers this question through the generalization and derivation of existing bias-flip solutions. The study starts by analyzing the energy flow in existing featured interface circuits, including the standard energy harvesting (bridge rectifier) circuit, parallel-SSHI, series-SSHI, pre-biasing/energy injection/energy investment scheme, etc. A synchronized multiple bias-flip (SMBF) model, which generalizes the bias-flip control and summarizes the energy details in these circuits, is then proposed. Based on the topological and mathematical abstraction, the optimal bias-flip (OBF) strategy towards maximum harvesting capability is derived. A case study on the series synchronized double bias-flip (S-S2BF) circuit shows that the potential of the PEH interface circuits can be fully released by using the OBF strategy. The proposed SMBF model and OBF strategy set the theoretical foundation and provide a new insight for future circuit innovations towards more powerful PEH systems.
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Kumagai, Masaaki, and Takashi Emura. "Development of a Universal Interface Board and its Application to Robot Controllers and Signal Processors." Journal of Robotics and Mechatronics 16, no. 2 (April 20, 2004): 200–207. http://dx.doi.org/10.20965/jrm.2004.p0200.

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Multipurpose digital interface boards for the PCI bus were designed for robot controllers. They used a programmable logic device reconfigured for internal circuits. The user plugs the board in, then downloads circuit data to obtain various interfaces. Optional modules such as analog front ends and support software also were developed. The board enables rapid prototyping and flexible use of high-speed digital circuits. Three applications of the board — robot interfaces of DC servomotors for a walking robot, high-speed digital signal processing for a motion capture system, and pipelined image processing units — showed the effectiveness of the board.
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Tselegkaridis, Sokratis, Theodosios Sapounidis, and Dimitrios Papakostas. "Learning Circuits and Coding with Arduino Board in Higher Education Using Tangible and Graphical User Interfaces." Information 15, no. 5 (April 24, 2024): 245. http://dx.doi.org/10.3390/info15050245.

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The integration of the Arduino board into educational settings has penetrated across various educational levels. The teaching of this subject can be accomplished by (a) using real components in breadboards, (b) prefabricated modular boards that snap together, and (c) utilizing computer simulations. Yet, it is unknown which interface offers a more effective learning experience. Therefore, this experimental study aims to compare the effectiveness of these interfaces in a series of three laboratory exercises involving 110 university students, who were divided into three groups: (a) the first group used a tangible user interface, implementing circuits on breadboards, (b) the second group also used a tangible interface but with modular boards, and (c) the third group used a graphical user interface to simulate circuits using Tinkercad. For each laboratory exercise, students completed both pretests and posttests. Also, they provided feedback through five Likert-type attitude questions regarding their experiences. In terms of data analysis, t-tests, ANOVA, and ANCOVA, along with bootstrapping, and principal component analysis were employed. The results suggest that among the participants, those who used a graphical user interface stated that their understanding of the interconnection of components in microcontroller circuits was enhanced, while students with previous experience in microcontroller labs found the circuit creation process easier than students without experience.
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Liu, Haili, Rui Hua, Yang Lu, Ya Wang, Emre Salman, and Junrui Liang. "Boosting the efficiency of a footstep piezoelectric-stack energy harvester using the synchronized switch technology." Journal of Intelligent Material Systems and Structures 30, no. 6 (February 8, 2019): 813–22. http://dx.doi.org/10.1177/1045389x19828512.

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In this article, the self-supported power conditioning circuits are studied for a footstep energy harvester, which consists of a monolithic multilayer piezoelectric stack with a force amplification frame to extract electricity from human walking locomotion. Based on the synchronized switch harvesting on inductance (SSHI) technology, the power conditioning circuits are designed to optimize the power flow from the piezoelectric stack to the energy storage device under real-time human walking excitation instead of a simple sine waveform input, as reported in most literatures. The unique properties of human walking locomotion and multilayer piezoelectric stack both impose complications for circuit design. Three common interface circuits, for example, standard energy harvesting circuit, series-SSHI, and parallel-SSHI, are compared in terms of their output power to find the best candidate for the real-time-footstep energy harvester. Experimental results show that the use of parallel-SSHI circuit interface produces 74% more power than the standard energy harvesting counterpart, while the use of series-SSHI circuit demonstrates a similar performance in comparison to the standard energy harvesting interface. The reasons for such a huge efficiency improvement using the parallel-SSHI interface are detailed in this article.
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Ning, Yongkai, Jiangfei Guo, Yangchen Jia, Duosheng Li, and Guiliang Guo. "A Fast Interface Circuit for the Measurement of 10 Ω to 1 GΩ Resistance." Electronics 12, no. 18 (September 8, 2023): 3796. http://dx.doi.org/10.3390/electronics12183796.

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In this work, an interface circuit applied to resistive gas or chemical sensors is proposed. The interface circuit includes a detection front-end, a single-end to differential circuit, a successive approximation analog-to-digital converter (SAR ADC), and some reference auxiliary circuits. In detection front-end circuits, mirrored currents in a current mirror usually differ by several orders of magnitude. In order to ensure that the current mirror can be copied accurately, this work uses a negative feedback structure consisting of an operational amplifier and an NMOS tube to ensure that the VDS of the current mirroring tube remains consistent. Simulation results show that the replication error of the current mirror is 0.015%. The proposed interface circuit has a detection range of 10 Ω to 1 GΩ with a relative error of 0.55%. The current multiplication or divided technique allows the interface circuit to have a high sampling frequency of up to 10 kHz. The proposed circuit is based on a 180 nm CMOS process with a chip area of 0.308 mm2 (723 μm ∗ 426 μm). The power consumption of the whole interface circuit is 3.66 mW when the power supply voltage is 1.8 V.
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Yun, Eun Jeong, Jong Tae Park, and Chong Gun Yu. "An maximum power point tracking interface circuit for low-voltage DC-type energy harvesting sources." Bulletin of Electrical Engineering and Informatics 11, no. 6 (December 1, 2022): 3108–18. http://dx.doi.org/10.11591/eei.v11i6.4124.

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This paper presents a maximum power point tracking (MPPT) interface circuit for low-voltage DC-type energy harvesting sources such as light and thermal energy. Most energy harvesting systems used in miniature-sized sensor systems require start-up circuits because the output voltages of small-sized energy transducers are very low and not enough to directly power electronic systems. The proposed interface circuit is driven directly by the low output voltages of small size energy transducers, eliminating the need for complex start-up circuitry. A simple MPPT controller with the fractional open-circuit voltage (FOCV) method is designed and fabricated in a 65-nm complementary metal oxide semiconductor (CMOS) process. Measurement results show that the designed circuit can track the MPP voltage even in the presence of the open-circuit voltage fluctuations and can operate properly at operating voltages as low as 0.3 V. The interface circuit achieves a peak power efficiency of 97.1% and an MPPT accuracy of over 98.3%.
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Tang, Wei Feng, An Ping Qiu, Guo Ming Xia, and Yan Su. "Noise Analysis of Silicon Microgyroscope's Transimpedance Amplifier Interface Circuit." Key Engineering Materials 645-646 (May 2015): 624–29. http://dx.doi.org/10.4028/www.scientific.net/kem.645-646.624.

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The output-current of silicon microgyroscope is at the level of 10-7A. So the requirements for circuits’ SNR are very high. This paper proposes a method to improve transimpedance amplifier interface circuit’s SNR. First of all, the operating principles of silicon microgyroscope and transimpedance amplifier interface circuit are introduced. Secondly, resistor thermal noise, amplifier’s current and voltage noise are analyzed. Then noise density in a certain frequency range is calculated based on Matlab. Besides, a method to improve SNR is proposed, namely, increasing the value of DC offset resistance. Finally, simulation based on Cadence is operated to verify the method. Simulation results fit well with the theoretical analysis. That means the method to improve the SNR is feasible.
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Dissertations / Theses on the topic "Interface circuits"

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MOHAMED, MOHAMED ELSAID ELKHAYAT MOATAZBELLAH. "Interface Circuits for Sensors and Actuators." Doctoral thesis, Università degli studi di Pavia, 2018. http://hdl.handle.net/11571/1214860.

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The research activity described in this Thesis is the result of three different projects, all dealing with interface circuits for sensors and actuators. 1) Capacitive Humidity sensor with temperature controller and heater integrated in CMOS technology The first project deals with the design of the integrated interface circuit for accurately controlling the temperature of a CMOS capacitive humidity sensor, with the final goal of allowing self-dignostics and self-calibration of the sensor. The humidity sensor used is equipped with an integrated resistor and a temperature sensor which allow changing and measuring the actual sensor temperature. This activity concentrated initially on the characterization of the humidity sensor provided by Texas Instruments, with the goal of determining the features and the behavior of the device and identifying the specifications of the integrated interface circuit. A measurement setup based on LabView has been developed to allow controlling the temperature of the sensor with an accuracy of 0.005˚C and measuring both the relative humidity and the temperature. Based on the sensor measurement results we developed a model of the humidity sensor with built-in heater and thermometer in the Cadence framework, to allow the simulation of the complete system. In this sensor model, all the dynamic effects of the heater and relative humidity variation have been considered, to guarantee proper design of the temperature controller integrated circuit. The temperature controller is designed in CMOS technology; it allows a precise adjustment of the temperature with an accuracy better than 0.1˚C. The circuit is based on an analog control loop with PWM modulator. The circuit has been fabricated using a 0.35µm CMOS technology. 2) Scaltech28 (test structures in CMOS 28nm) The second project deals with the design of test structures in CMOS 28nm technology, to evaluate it potential for the implementation of sensor interface circuits in future high-energy physics experiments. This work has been carried out in the frame of project, SCALTECH28, which continues the tradition of other similar studies carried out in previous technology generations for achieving optimal results in IC design for various detectors. This investigation within the selected 28nm technology had to address basic analysis on the single MOS devices (n-MOS and p-MOS), on passive elements like resistors and capacitors, and finally on basic circuits and system building blocks, among the most critical in the sensor interface circuits for different physics experiments. The main purpose of the work is to investigate the performance of the 28nm technology in terms of signal processing quality, power consumption, and radiation hardness with respect to previous technological generations. An additional target is to experimentally evaluate radiation damage effects on single devices and on full circuits to develop rad-models for simulations. A test chip including elementary device arrays and dedicated read-out circuits has been developed and fully characterized. In particular, a capacitance to frequency converter has been integrated to measure the matching between different capacitors of a programmable array.
Experimental measurements showed that the worst-case measurement for the capacitor pair matching is around 0.98% error at 500fF. This value is compliant to the feasibility of A/D converters for sensor readout with resolution better than 10 bits. It is clear from the results that matching performance is comparable to previous technologies, making the 28nm technology eligible for analog signal processing in front-end circuits for physical experiments and related data converters. Samples have been sent to irradiation facility to be exposed to different radiation doses in order to be re-measured and compared in terms of matching and absolute capacitance values with respect to the measurements done before. Based on the results obtained on the basic devices in 28nm technology, we designed a 14-bit 1MS/s extended range incremental A/D converter composed by the cascade of two resettable second-order sigma-delta modulators. The system is designed for reading out detector arrays in particle physics experiments. The two stages, ideally targeting 9 and 6 bits, respectively, are both based on a cascade of integrators with feed-forward (CIFF) architecture to maximize linearity. If necessary, they can work in pipeline to minimize conversion time. When the conversion of each sample by the two stages is completed, a digital recombination filter produces the overall ADC output word with the required resolution (ENOB) of at least 13 bits and a throughput of 1MS/s at the very low over sampling ratio (OSR) of 16. Each stage, implemented with the switched capacitor technique, consists of two integrators followed by a multi-bit quantizer and a capacitive DAC for the feedback. At the start of each conversion cycle, both analog integrators and the digital filter memory elements are reset. The ADC has been sent for fabrication in 28nm technology. Driving circuit for the piezoelectric actuators in ultrasonic washing machines The third project deals with the design of the driving circuit for the piezoelectric actuators in ultrasonic washing machines. The object of this project concerns the study and design of a driving and control system for an ultrasonic cleaning machine, or more commonly called ultrasonic washing machine. These devices are used in several industrial applications. Ultrasonic washing machines consist of a tank filled with a detergent solvent, an electronic interface circuit and one or more piezoelectric transducers, which are mechanically connected to the tank and electrically to the driving circuit. The driving system is connected from the AC mains and consists of three cascaded stages: a rectifier followed by a boost converter, to regulate the power factor and produce an intermediate DC voltage; a buck converter, to adjust the amplitude of the supply voltage for the piezoelectric transducers; an inverter, to drive the actuators with a square wave at their resonance frequency between 30kHz and 40kHz. A flyback converter has also been designed for generating the auxiliary power supply voltage for all the integrated components in the system. A control system based on an Arduino microcontroller has been developed to adjust the frequency of the square wave to the resonance frequency of the transducer, control the output voltage of the buck converter and read data from a current sensor. The system is designed and implemented on a PCB board of 10cm×15cm. The system has been tested on machined with two different tank sizes.
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Peter, Kenneth W. "Integrated interface circuits for switched capacitor sensors." Thesis, University of Edinburgh, 1991. http://hdl.handle.net/1842/15637.

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This thesis reports an investigation into integrated interface circuits for switched capacitor sensors for application in industrial process control instrumentation networks. Three circuits are presented: an absolute capacitance to voltage converter; a capacitance ratio to frequency ratio converter; and a capacitance ratio to voltage ratio converter. Of the circuits, the first two are subject to most thorough investigation with the capacitance ratio to frequency ratio converter being of particular interest. This circuit is based upon a switched capacitor, frequency controlled, negative feedback loop which permits implementation with modest quality analogue components, such as are provided with a standardcell ASIC CMOS process. Initial investigations, accomplished with discrete component implementations of the interface circuits, reveal a significant departure in behaviour from that predicted by firstorder analysis. Switch induced chargefeedthrough is shown to be responsible for the deviation. In addition, parasitic induced jitter and frequency locking are identified as a second source of error. The three interface circuits are implemented as an integrated circuit using the European Silicon Structures (ES2) ASIC CMOS process, with a modification to permit the inclusion of fullcustom designed, chargefeedthrough compensated switches. This implementation exhibits greatly reduced chargefeedthrough, and circuit behaviour is in accordance with a modification to the firstorder analysis that includes the effects of chargefeedthrough. Importantly, no frequency locking and much reduced jitter is observed. Significantly, linear performance is obtained for the capacitance ratio to frequency ratio converter over a 20 to 1 capacitance range, with operation demonstrable down to 5pF sensor capacitance.
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Mason, J. S. B. "Analog Design within High Speed Serial Interface Circuits." Thesis, Oxford Brookes University, 2008. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.493433.

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The serial interface is a pervasive component within many electronic products and will be familiar to users of personal computers and modern electronic devices. Over the last twenty years, the serial interface or link has developed from a specialist electronic subsystem for computer and telecommunication systems to an essential building block for modern electronic products ranging from disk storage devices to home entertainment consoles. The high speed serial interface (HSS!) offers fast data transfer at relatively low cost and is now an semiconductor vendors supplying chips to original equipment manufacturers.
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Nerkar, Rajesh. "Self-Timed DRAM Data Interface." PDXScholar, 2013. https://pdxscholar.library.pdx.edu/open_access_etds/1443.

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A DRAM communicates with a processing unit via two interfaces: a data interface and a command interface. In today's DRAMs, also known as synchronous DRAMs (SDRAMs), both interfaces use a clock to communicate with the processing unit. The clock times the communication between the processing unit and the SDRAM on both the data interface and the command interface. We propose a self-timed DRAM. The self-timed DRAM introduces more flexibility into the DRAM interface by eliminating the clock. The command interface and the data interface each communicate with the processing unit using a handshake protocol rather than a clock. This thesis presents the data interface between the self-timed DRAM and the processing unit. The proposed data interface is self-timed. The self-timed data interface allows the DRAM to deliver data to or accept data from the processing unit as the processing unit demands rather than on a schedule set from the command interface. The self-timed data interface is designed using GasP circuits and micropipeline circuits. The design is simulated in 180nm CMOs process technology using hspice. This thesis presents the effects of width mismatch on the self-timed data interface. The micropipeline is slightly faster than the GasP. Also, the thesis compares the self-timed DRAM data interface with synchronous DRAM for the data burst rate.
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Mohammed, A. A. "IGIMCD : An interactive graphical interface for microwave circuit design." Thesis, University of Kent, 1987. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.375622.

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Silay, Kanber Mithat. "High Performance Cmos Capacitive Interface Circuits For Mems Gyroscopes." Master's thesis, METU, 2006. http://etd.lib.metu.edu.tr/upload/2/12607518/index.pdf.

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This thesis reports the development and analysis of high performance CMOS readout electronics for increasing the performance of MEMS gyroscopes developed at Middle East Technical University (METU). These readout electronics are based on unity gain buffers implemented with source followers. High impedance node biasing problem present in capacitive interfaces is solved with the implementation of a transistor operating in the subthreshold region. A generalized fully differential gyroscope model with force feedback electrodes has been developed in order to simulate the capacitive interfaces with the model of the gyroscope. This model is simplified for the single ended gyroscopes fabricated at METU, and simulations of resonance characteristics are done. Three gyroscope interfaces are designed by considering the problems faced in previous interface architectures. The first design is implemented using a single ended source follower biased with a subthreshold transistor. From the simulations, it is observed that biasing impedances up to several gigaohms can be achieved. The second design is the fully differential version of the first design with the addition of a self biasing scheme. In another interface, the second design is modified with an instrumentation amplifier which is used for fully differential to single ended conversion. All of these interfaces are fabricated in a standard 0.6 µ
m CMOS process. Fabricated interfaces are characterized by measuring their ac responses, noise response and transient characteristics for a sinusoidal input. It is observed that, biasing impedances up to 60 gigaohms can be obtained with subthreshold transistors. Self biasing architecture eliminates the need for biasing the source of the subthreshold transistor to set the output dc point to 0 V. Single ended SOG gyroscopes are characterized with the single ended capacitive interfaces, and a 45 dB gain improvement is observed with the addition of capacitive interface to the drive mode. Minimum resolvable capacitance change and displacement that can be measured are found to be 58.31 zF and 38.87 Fermi, respectively. The scale factor of the gyroscope is found to be 1.97 mV/(°
/sec) with a nonlinearity of only 0.001% in ±
100 °
/sec measurement range. The bias instability and angle random walk of the gyroscope are determined using Allan variance method as 2.158 °
/&
#8730
hr and 124.7 °
/hr, respectively.
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Honghao, Tang. "A Study on Interface Circuits for Piezoelectric Energy Harvesting." Thesis, Linköpings universitet, Elektroniska Kretsar och System, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-144497.

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A piezoelectric energy harvesting (PEH) system can harvest electrical energy from ambient vibration energy. In a PEH system, the interface rectifier circuit is critical because it converts AC from the output of piezoelectric harvester to DC that can power the load. Hence, improving the efficiency of the interface circuit can directly increase the efficiency of the entire PEH system; consequently, more power can be harvested. Commonly used interface circuits in PEH systems, such as full-bridge and voltage- doubler rectifiers,lead to relatively simple circuit implementations but they show serious limitations in energy-harvesting efficiency. Several innovative solutions have been reported to improve the efficiency of the interface rectifiers, such as ‘switch-only’ and ‘bias-flip’ techniques [7]. Such solutions utilize additional switches or switched inductors to speed up and even quickly reverse (flip) the voltage on the rectifier input to the desired voltage-level and condition for energy transfer, ultimately improving the overall efficiency of the energy harvesting. However, such techniques rely on accurate timing and synchronization of the pulsed switches every time the current produced by the piezoelectric harvester changes polarity. This thesis studies and investigates the impact of the non-ideal switching effects on the energy efficiency of the switch-only and bias-flip interface rectifiers in a PEH system, by theoretical derivation and experimental simulation.
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MOISELLO, ELISABETTA. "Integrated Interface Circuits for MEMS Contact-less Temperature Sensors." Doctoral thesis, Università degli studi di Pavia, 2020. http://hdl.handle.net/11571/1370177.

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Thermal sensors, exploiting the relation between the thermal radiation emitted by an object and its temperature, as expressed by the Stefan-Boltzmann law, allow realizing contact-less temperature measurements, required in a wide range of applications, ranging from fever measurements to presence detection for security and climate control systems. With the advent of smart homes and Internet of Things (IoT) and the wide spreading of mobile and wearable devices, the need for low-cost low-power thermal sensors has arisen, therefore moving the focus of the research away from standard bolometers and pyroelectric detectors and towards uncooled infrared (IR) sensors solutions that can be easily integrated. Bolometers and pyroelectric detectors, which are the main types of thermal sensors found nowadays on the market, in fact, do not comply with the low-cost and easy integration specifications. Integration of thermal sensors is possible through Micro-Electro Mechanical Systems (MEMS) technology, which allows combining on the same substrate or chip both electrical and mechanical structures with dimensions in the micro-meter range, thus providing structures with high thermal isolation and low thermal mass. The micromachining processes that are required to thermally isolate the sensing element from the substrate are versatile and include anisotropic wet etching, dry and wet etching, electrochemical etch stop, or the use of silicon-on-insulator (SOI). In this scenario, STMicroelectronics has fabricated two different novel thermal sensors, which fulfill the low-cost low-power specifications for smart homes, IoT and mobile and wearable devices, while also being compatible with CMOS processes and thus easily integrated: a polysilicon thermopile and a micromachined CMOS transistor, from now on referred to as TMOS. During my Ph.D. activity I was involved in a cooperation between the STMicroelectronics Analog MEMS and Sensors R&D group and the University of Pavia, that led to the design of two readout circuits specifically tailored on the sensors characteristics, one for the thermopile sensor and one for the TMOS (developed by the Technion-Israel Institute of Technology), which were integrated in two test-chip prototypes and thoroughly characterized through measurements as stand-alone devices and as a system with the sensor they were designed for.
Thermal sensors, exploiting the relation between the thermal radiation emitted by an object and its temperature, as expressed by the Stefan-Boltzmann law, allow realizing contact-less temperature measurements, required in a wide range of applications, ranging from fever measurements to presence detection for security and climate control systems. With the advent of smart homes and Internet of Things (IoT) and the wide spreading of mobile and wearable devices, the need for low-cost low-power thermal sensors has arisen, therefore moving the focus of the research away from standard bolometers and pyroelectric detectors and towards uncooled infrared (IR) sensors solutions that can be easily integrated. Bolometers and pyroelectric detectors, which are the main types of thermal sensors found nowadays on the market, in fact, do not comply with the low-cost and easy integration specifications. Integration of thermal sensors is possible through Micro-Electro Mechanical Systems (MEMS) technology, which allows combining on the same substrate or chip both electrical and mechanical structures with dimensions in the micro-meter range, thus providing structures with high thermal isolation and low thermal mass. The micromachining processes that are required to thermally isolate the sensing element from the substrate are versatile and include anisotropic wet etching, dry and wet etching, electrochemical etch stop, or the use of silicon-on-insulator (SOI). In this scenario, STMicroelectronics has fabricated two different novel thermal sensors, which fulfill the low-cost low-power specifications for smart homes, IoT and mobile and wearable devices, while also being compatible with CMOS processes and thus easily integrated: a polysilicon thermopile and a micromachined CMOS transistor, from now on referred to as TMOS. During my Ph.D. activity I was involved in a cooperation between the STMicroelectronics Analog MEMS and Sensors R&D group and the University of Pavia, that led to the design of two readout circuits specifically tailored on the sensors characteristics, one for the thermopile sensor and one for the TMOS (developed by the Technion-Israel Institute of Technology), which were integrated in two test-chip prototypes and thoroughly characterized through measurements as stand-alone devices and as a system with the sensor they were designed for.
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Johnson, James Robert. "Interface design for an audio based information retrieval system." Master's thesis, This resource online, 1992. http://scholar.lib.vt.edu/theses/available/etd-05042010-020011/.

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Chan, Cheung. "Out of plane screening and dipolar interaction in heterostructures /." View abstract or full-text, 2009. http://library.ust.hk/cgi/db/thesis.pl?PHYS%202009%20CHAN.

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Books on the topic "Interface circuits"

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Instruments, Texas. Interface circuits data book. [Dallas, Tex.]: Texas Instruments, 1990.

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C, Sansen Willy M., Huijsing Johan H. 1938-, and Plassche, Rudy J. van de., eds. Analog circuit design: Mixed A/D circuit design, sensor interface circuits and communication circuits. Boston: Kluwer Academic, 1994.

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Pippenger, Dale E. Linear and interface circuits applications. 2nd ed. New York: McGraw-Hill, 1988.

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Pippenger, D. E. Linear and interface circuits: Applications. 2nd ed. New York: Texas Instruments, 1991.

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Motorola. Linear and interface integrated circuits. (s.l.): Motorola, 1990.

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Pippenger, Dale E. Linear and interface circuits applications. 2nd ed. New York: McGraw-Hill, 1988.

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Loveday, George. Practical interface circuits for microprocessors. Englewood Cliffs, N.J: Prentice-Hall, 1985.

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Pippenger, Dale E. Linear and interface circuits applications. New York: McGraw-Hill, 1986.

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Motorola. Linear and interface integrated circuits. (s.l.): Motorola, 1988.

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J, Tobaben E., and Texas Instruments, eds. Linear and interface circuits applications. 2nd ed. New York: McGraw-Hill, 1988.

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Book chapters on the topic "Interface circuits"

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Nicoud, J. D. "Memory circuits." In Microprocessor Interface Design, 105–16. Dordrecht: Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-011-2320-4_4.

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Nicoud, J. D. "Testing circuits." In Microprocessor Interface Design, 161–78. Dordrecht: Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-011-2320-4_7.

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Fraden, Jacob. "Interface Electronic Circuits." In Handbook of Modern Sensors, 191–270. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-19303-8_6.

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Fraden, Jacob. "Interface Electronic Circuits." In Handbook of Modern Sensors, 173–246. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-6466-3_5.

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Barnes, John R. "Designing Interface Circuits." In Robust Electronic Design Reference Book, 556–70. New York, NY: Springer US, 2004. http://dx.doi.org/10.1007/1-4020-7830-7_23.

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Zjajo, Amir. "Neural Signal Conditioning Circuits." In Brain-Machine Interface, 17–31. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-31541-6_2.

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Zjajo, Amir. "Neural Signal Quantization Circuits." In Brain-Machine Interface, 33–76. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-31541-6_3.

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Zjajo, Amir. "Neural Signal Classification Circuits." In Brain-Machine Interface, 77–93. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-31541-6_4.

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Nixon, Mark S. "Interface and Hybrid Circuits." In Introductory Digital Design, 244–59. London: Macmillan Education UK, 1995. http://dx.doi.org/10.1007/978-1-349-13508-0_8.

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van Helleputte, Nick. "Biomedical Sensor Interface Circuits." In Selected Topics in Biomedical Circuits and Systems, 45–80. New York: River Publishers, 2022. http://dx.doi.org/10.1201/9781003339427-3.

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Conference papers on the topic "Interface circuits"

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Wu, P. H., and Y. C. Shu. "Wideband Energy Harvesting by Multiple Piezoelectric Oscillators With an SECE Interface." In ASME 2015 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/smasis2015-8862.

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This paper presents the development of wideband energy harvesting by the parallel connection of multiple piezoelectric oscillators attached to a synchronized electric charge extraction (SECE) interface circuit. It is shown that the electric response is determined by the matrix formulation of generalized Ohm’s law. The impedance matrix is explicitly expressed in terms of the equivalent load impedance and system parameters. In addition, the load impedance is found to be independent of external load, so is harvested power. The framework is subsequently validated numerically by SPICE circuit simulations. Finally, the performance evaluation is carried out with comparisons to other interface circuits, including the standard and synchronized switch harvesting on inductor (SSHI) interfaces. The result demonstrates that the bandwidth of an SECE array system is improved and its harvested power is not less than that based on the use of other interface circuits.
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Jianping Hu, Ling Wang, and Huiying Dong. "Interface circuits between adiabatic and standard CMOS circuits." In 2007 Joint 50th IEEE International Midwest Symposium on Circuits and Systems (MWSCAS) and the IEEE Northeast Workshop on Circuits and Systems (NEWCAS 2007). IEEE, 2007. http://dx.doi.org/10.1109/mwscas.2007.4488646.

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MALCOVATI, PIERO. "INTERFACE CIRCUITS FOR INTEGRATED MICROSENSORS." In Proceedings of the 7th Italian Conference. WORLD SCIENTIFIC, 2002. http://dx.doi.org/10.1142/9789812776457_0002.

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Zhang, Hui, and Jan Rabaey. "Low-swing interconnect interface circuits." In the 1998 international symposium. New York, New York, USA: ACM Press, 1998. http://dx.doi.org/10.1145/280756.280876.

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Cojocariu, Bogdan, Anthony Hill, Alejandra Escudero, Han Xiao, and Xu Wang. "Piezoelectric Vibration Energy Harvester: Design and Prototype." In ASME 2012 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/imece2012-85785.

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This paper proposes a new approach for vibration energy harvesting analysis. The research investigates and compares efficiencies of a vibration energy harvesting system with two different electric storage interface circuits. One of the interface circuits is the standard interface circuit comprised of four rectifier diodes connected in a classical single phase bridge. The other interface circuit is a newly proposed interface circuit integrated with a voltage multiplier, an impedance converter and an off shelf booster. To validate the effectiveness of the newly proposed interface circuit, a vibration energy harvesting beam system has been developed in connection with this proposed circuit. The harvested efficiency and harvested power output of the system with the two different electric storage interface circuits have been measured and compared.
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Yeong, Koh Chin, Ma Fan Yung, Koh Tee Peng, and Tan Hee Yeng. "1.2Gbps LVDS interface." In 2007 International Symposium on Integrated Circuits. IEEE, 2007. http://dx.doi.org/10.1109/isicir.2007.4441878.

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Schmidtbauer, Matthew, Samuel Johnson, Jeffrey Jalkio, and AnnMarie Thomas. "Squishy circuits as a tangible interface." In the 2012 ACM annual conference extended abstracts. New York, New York, USA: ACM Press, 2012. http://dx.doi.org/10.1145/2212776.2223761.

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Sansen, Willy. "SC1: Biomedical and sensor interface circuits." In 2014 IEEE International Solid- State Circuits Conference (ISSCC). IEEE, 2014. http://dx.doi.org/10.1109/isscc.2014.6757580.

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Franzon, Paul D. "Molecular electronic circuits." In 2007 2nd International Workshop on Advances in Sensors and Interface. IEEE, 2007. http://dx.doi.org/10.1109/iwasi.2007.4420001.

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Strogonov, A. V., and V. V. Maltsev. "DEVELOPMENT OF A GRAPHICAL EDITOR OF ELECTRICAL CIRCUITS FOR DIRECT CURRENT ANALYSIS BY THE NEWTON-RAPHSON METHOD." In Actual problems of physical and functional electronics. Ulyanovsk State Technical University, 2023. http://dx.doi.org/10.61527/appfe-2023.106-109.

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Currently, the issue of automation of the analysis of electrical circuits is acute. The article offers a graphical interface for the construction and calculation of electrical circuits using the Newton–Raphson method. The program is implemented in the Microsoft Visual Studio environment in the C# programming language and contains an intuitive interface for circuit design and implementation of an algorithm for solving a system of nonlinear equations by the Newton–Raphson method with high speed. The application of this program is possible for the analysis of a DC circuit for two or more circuits in a circuit containing diodes, without capacitances and inductances. A comparison of the results obtained during testing of the program with the results of known calculations showed their good agreement.
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Reports on the topic "Interface circuits"

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Sainudeen, Zuhail, and Navid Yazdi. Analog CMOS Interface Circuits for UMSI Chip of Environmental Monitoring Microsystem. Fort Belvoir, VA: Defense Technical Information Center, July 2001. http://dx.doi.org/10.21236/ada402437.

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Saripalli, Ganesh. CMOS Interface Circuits for Spin Tunneling Junction Based Magnetic Random Access Memories. Office of Scientific and Technical Information (OSTI), January 2002. http://dx.doi.org/10.2172/806590.

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Lim, Chee. High-performance Input/Output Circuit for CMOS Integrated Circuit Interface. Portland State University Library, January 2000. http://dx.doi.org/10.15760/etd.7186.

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Steinberger, R., and O. Nicklass. Definitions of Managed Objects for Circuit to Interface Translation. RFC Editor, January 2002. http://dx.doi.org/10.17487/rfc3201.

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Eads, Rand E., and Mark R. Boolootian. Controlling suspended samplers by programmable calculator and interface circuitry. Berkeley, CA: U.S. Department of Agriculture, Forest Service, Pacific Southwest Forest and Range Experiment Station, 1985. http://dx.doi.org/10.2737/psw-rn-376.

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Nudo, Randolph. A Brain-Machine-Brain Interface for Rewiring of Cortical Circuitry after Traumatic Brain Injury. Fort Belvoir, VA: Defense Technical Information Center, September 2011. http://dx.doi.org/10.21236/ada561375.

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Nudo, Randolph J. A Brain-Machine-Brain Interface for Rewiring of Cortical Circuitry after Traumatic Brain Injury. Fort Belvoir, VA: Defense Technical Information Center, September 2012. http://dx.doi.org/10.21236/ada570590.

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Mohseni, Pedram. A Brain-Machine-Brain Interface for Rewiring of Cortical Circuitry after Traumatic Brain Injury. Fort Belvoir, VA: Defense Technical Information Center, September 2013. http://dx.doi.org/10.21236/ada598378.

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Nudo, Randolph J. A Brain-Machine-Brain Interface for Rewiring of Cortical Circuitry after Traumatic Brain Injury. Fort Belvoir, VA: Defense Technical Information Center, September 2013. http://dx.doi.org/10.21236/ada598379.

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Bruce and Fiore. L51629 Users Manual-Field Validation of the Low-Frequency Eddy Current Instrument-Software Listings. Chantilly, Virginia: Pipeline Research Council International, Inc. (PRCI), October 1990. http://dx.doi.org/10.55274/r0010602.

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When an eddy current probe is placed near a conductive material, the alternating magnetic field from the probe causes electrical currents to flow in the material. These currents have associated with them their own magnetic field, which opposes the original magnetic field from the coil. The result is that the impedance of the probe is greatly reduced by the presence of the conducting material. If the conductor is also magnetic, as is normal steel, the situation is similar though slightly more complicated. Here, the impedance of the probe may be either increased or decreased depending on the permeability of the material and the frequency of the alternating field. Anything that affects the flow of current in the conductive material will also affect the impedance of the eddy current probe. For example, the electrical currents cannot flow through a crack but must flow around it. The alteration in the currents also changes the magnetic field produced by the currents and, consequently, the impedance of the probe. Normally, the impedance change caused by a defect is much smaller than that caused by the presence of the material in the first place, and measuring this small change requires a bridge circuit much like the balanced bridge used with strain gauges. The balanced bridge allows one to amplify the small changes in impedance caused by defects in the presence of the much larger change caused by the presence of the conductive and magnetic pipeline steel. The LFEC instrument is constructed using an� IBM-AT compatible portable computer. Inside the PAC-386 are two plug-in circuit cards that turn the PAC-386 into an eddy current instrument. The first, also commercially available, is a Spectrum DSP56000 digital signal processing card, while the second is a specially-built interface card for the eddy current probe. The PAC-386 is a standard MS-DOS machine and will operate most MS-DOS software. In the discussion below, it is assumed that the user is familiar with the MSDOS operating system.
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