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Relevant bibliographies by topics / Interface Electronic Circuits

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Academic literature on the topic 'Interface Electronic Circuits'

Author: Grafiati

Published: 4 June 2021

Last updated: 6 September 2023

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Journal articles on the topic "Interface Electronic Circuits"

1

Manukyan, Vahram K. "Software applications in modeling of physical processes in radio engineering and electronics in the context of distance learning." Physics of Wave Processes and Radio Systems 24, no. 1 (May 6, 2021): 89–97. http://dx.doi.org/10.18469/1810-3189.2021.24.1.89-97.

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This article examines the existing software applications for electronic circuit prototyping that can help evaluate the operation of the entire circuit based on specified parameters and find the best options. Using the TAC application and the Arduino library components, projects and instructions for creating and testing electronic circuits were developed. The resulting application was tested for capabilities and efficiency. The interface design and settings were also assessed to determine whether they simulate real conditions. The functionality of TAC application made it possible to generate alternate circuits. The results of software testing showed that using the application speeds up the learning process significantly when compared to traditional methods and helps eliminate problems that may emerge when designing and assembling circuits. The application may be useful in designing complex electronic circuits and developing teaching aids for students in technical fields.

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Yun, Eun Jeong, Jong Tae Park, and Chong Gun Yu. "An maximum power point tracking interface circuit for low-voltage DC-type energy harvesting sources." Bulletin of Electrical Engineering and Informatics 11, no. 6 (December 1, 2022): 3108–18. http://dx.doi.org/10.11591/eei.v11i6.4124.

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This paper presents a maximum power point tracking (MPPT) interface circuit for low-voltage DC-type energy harvesting sources such as light and thermal energy. Most energy harvesting systems used in miniature-sized sensor systems require start-up circuits because the output voltages of small-sized energy transducers are very low and not enough to directly power electronic systems. The proposed interface circuit is driven directly by the low output voltages of small size energy transducers, eliminating the need for complex start-up circuitry. A simple MPPT controller with the fractional open-circuit voltage (FOCV) method is designed and fabricated in a 65-nm complementary metal oxide semiconductor (CMOS) process. Measurement results show that the designed circuit can track the MPP voltage even in the presence of the open-circuit voltage fluctuations and can operate properly at operating voltages as low as 0.3 V. The interface circuit achieves a peak power efficiency of 97.1% and an MPPT accuracy of over 98.3%.

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Liew Hui Fang, Rosemizi Abd Rahim, Muhammad Izuan Fahmi, Junita Mohd Nordin, and Aini Syuhada Md Zain. "Review of Active Circuit and Passive Circuit Techniques to Improve the Performance of Highly Efficient Energy Harvesting Systems." Journal of Advanced Research in Applied Sciences and Engineering Technology 31, no. 1 (June 13, 2023): 271–90. http://dx.doi.org/10.37934/araset.31.1.271290.

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In piezoelectric energy harvesting systems, energy harvesting circuits are the interface between piezoelectric devices and electrical loads. The conventional view of this interface is based on the concept of impedance matching. In fact, in the power supply circuit can also apply as an electrical boundary conditions, such as voltage and charge, to piezoelectric devices for each energy conversion cycle. The major drawback of piezoelectric power harvesting have low-power relationships in systems within (in the range of μW to mW), then system also have significantly reduced any potential losses in circuits that make up the EH system, whereas other condition into careful selection of circuits and components can enhanced the energy harvesting performance and electricity consumption. In the study of energy harvesting systems, it is an energy harvesting system approach that using active and passive electronic circuit to control voltage and or charge on piezoelectric devices as proposed and review to mechanical inputs for optimized energy conversion. Several factors in the practical limitation of active and passive energy consumption, due to device limitations and the power efficiency of electronic circuits, will be introduced and have played an important role into to enhance optimum and increase efficiency of energy harvesting system.

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Goeritno, Arief, and Ika Setyawibawa. "An Electronic Device Reviewed by Diagnosing on the Modules Embodiment." International Journal of Electronics and Communications Systems 1, no. 2 (December 28, 2021): 41–55. http://dx.doi.org/10.24042/ijecs.v1i2.10383.

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An electronic device with various purposes needs in-depth study from the very beginning of the idea, before getting the final product. It relates to an essential role in providing user's infrastructure and service. The research objectives are to obtain the electronic circuits, modules, and devices by integrating the wiring. The research methods are conducted in the form of designing, manufacturing, assembling, and diagnosing. Designing stage is to obtain several electronic circuits as a liaison and the manufacturing stage to obtain the printed circuit board. The assembling stage is to obtain the gateway boards which controlled by the Arduino modules and diagnosing stage to obtain the interface device for communicating (IDC) is formed by integrating the wiring. Integrating several electronic circuits, modules, and devices have resulted in an IDC. Operating the IDC uses two different systems, i.e. from the telephony system to the radio-frequency system or vice versa with a half-duplex mechanism.

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Žemva, Andrej, Andrej Trost, and Baldomir Zajc. "Educational Programmable System for Prototyping Digital Circuits." International Journal of Electrical Engineering & Education 35, no. 3 (July 1998): 236–44. http://dx.doi.org/10.1177/002072099803500306.

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In this paper, we present an educational programmable system for prototyping digital circuits. The system is composed of the PC and the prototyping board composed of 3 FPGAs. PC is used for designing a digital circuit, programming the FPGAs, automatic generation of the interface logic and hardware verification of the designed circuit.

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Boni, Andrea, Michele Caselli, Alessandro Magnanini, and Matteo Tonelli. "CMOS Interface Circuits for High-Voltage Automotive Signals." Electronics 11, no. 6 (March 21, 2022): 971. http://dx.doi.org/10.3390/electronics11060971.

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The acquisition of high-voltage signals from sensors and actuators in an internal-combustion engine is often required for diagnostic purposes or in the case of conversion to alternative fuels, such as hydrogen, natural gas, or biogas. The integration of electronic interfaces and acquisition circuits in a single device provides benefits in terms of component-count reduction and performance. Nonetheless, the high voltage level of the involved signals makes on-chip design challenging. Additionally, the circuits should be compatible with the CMOS technology, with limited use of high-voltage options and a minimum number of off-chip components. This paper describes the design and the implementation in 350 nm CMOS technology of electronic interfaces and acquisition circuits for typical high-voltage signals of automotive context. In particular, a novel co-design of dedicated voltage clamps with electro-static discharge (ESD) protections is described. The proposed circuits require only a single off-chip resistor, and they are suitable for the acquisition of signals with peak voltages up to 400 V. The measured performance of the silicon prototypes, in the [−40 °C, +125 °C] temperature range, make the proposed electronic interfaces suitable for the automotive domain.

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Polachan, Kurian, Baibhab Chatterjee, Scott Weigand, and Shreyas Sen. "Human Body–Electrode Interfaces for Wide-Frequency Sensing and Communication: A Review." Nanomaterials 11, no. 8 (August 23, 2021): 2152. http://dx.doi.org/10.3390/nano11082152.

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Several on-body sensing and communication applications use electrodes in contact with the human body. Body–electrode interfaces in these cases act as a transducer, converting ionic current in the body to electronic current in the sensing and communication circuits and vice versa. An ideal body–electrode interface should have the characteristics of an electrical short, i.e., the transfer of ionic currents and electronic currents across the interface should happen without any hindrance. However, practical body–electrode interfaces often have definite impedances and potentials that hinder the free flow of currents, affecting the application’s performance. Minimizing the impact of body–electrode interfaces on the application’s performance requires one to understand the physics of such interfaces, how it distorts the signals passing through it, and how the interface-induced signal degradations affect the applications. Our work deals with reviewing these elements in the context of biopotential sensing and human body communication.

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Stornelli, Vincenzo, Leonardo Pantoli, Gianluca Barile, Alfiero Leoni, and Emanuele D’Amico. "Silicon Photomultiplier Sensor Interface Based on a Discrete Second Generation Voltage Conveyor." Sensors 20, no. 7 (April 5, 2020): 2042. http://dx.doi.org/10.3390/s20072042.

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This work presents the design of a discrete second-generation voltage conveyor (VCII) and its capability to be used as electronic interface for silicon photomultipliers. The design addressed here exploits directly at the transistor level, with commercial components, the proposed interface; the obtained performance is valuable considering both the discrete elements and the application. The architecture adopted here realizes a transimpedance amplifier that is also able to drive very high input impedance, as usually requested by photons detection. Schematic and circuital design of the discrete second-generation voltage conveyor is presented and discussed. The complete circuit interface requires a bias current of 20 mA with a dual 5V supply voltage; it has a useful bandwidth of about 106 MHz, and considering also the reduced dimensions, it is a good candidate to be used in portable applications without the need of high-cost dedicated integrated circuits.

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Xu, Yunsong, Shen Yin, Jinyong Yu, and Hamid Reza Karimi. "Design of a TFT-LCD Based Digital Automobile Instrument." Mathematical Problems in Engineering 2014 (2014): 1–8. http://dx.doi.org/10.1155/2014/549790.

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The traditional mechanical instrument lacks the ability to satisfy the market with characters of favorable compatibility, easy upgrading, and fashion. Thus the design of a TFT-LCD (thin film transistor-liquid crystal display) based automobile instrument is carried out. With a 7-inch TFT-LCD and the 32-bit microcontroller MB91F599, the instrument could process various information generated by other electronic control units (ECUs) of a vehicle and display valuable driving parameters on the 7-inch TFT-LCD. The function of aided parking is also provided by the instrument. Basic principles to be obeyed in circuits designing under on-board environment are first pointed out. Then the paper analyzes the signals processed in the automobile instrument and gives an introduction to the sampling circuits and interfaces related to these signals. Following this is the functional categorizing of the circuit modules, such as video buffer circuit, CAN bus interface circuit, and TFT-LCD drive circuit. Additionally, the external EEPROM stores information of the vehicle for history data query, and the external FLASH enables the display of high quality figures. On the whole, the accomplished automobile instrument meets the requirements of automobile instrument markets with its characters of low cost, favorable compatibility, friendly interfaces, and easy upgrading.

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Hasegawa, Daiki, Yuto Takeshita, Feng Li, Kyosuke Sano, Masamitsu Tanaka, Taro Yamashita, and Akira Fujimaki. "Demonstration of Interface Circuits Between Half- and Single- Flux- Quantum Circuits." IEEE Transactions on Applied Superconductivity 31, no. 5 (August 2021): 1–4. http://dx.doi.org/10.1109/tasc.2021.3072846.

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Dissertations / Theses on the topic "Interface Electronic Circuits"

1

So, Biu 1959. "THE METHODOLOGY AND IMPLEMENTATION OF RELAXATION METHOD TO INVESTIGATE ELECTRO-THERMAL INTERACTIONS IN SOLID-STATE INTEGRATED CIRCUITS." Thesis, The University of Arizona, 1987. http://hdl.handle.net/10150/276384.

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Honghao, Tang. "A Study on Interface Circuits for Piezoelectric Energy Harvesting." Thesis, Linköpings universitet, Elektroniska Kretsar och System, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-144497.

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A piezoelectric energy harvesting (PEH) system can harvest electrical energy from ambient vibration energy. In a PEH system, the interface rectifier circuit is critical because it converts AC from the output of piezoelectric harvester to DC that can power the load. Hence, improving the efficiency of the interface circuit can directly increase the efficiency of the entire PEH system; consequently, more power can be harvested. Commonly used interface circuits in PEH systems, such as full-bridge and voltage- doubler rectifiers,lead to relatively simple circuit implementations but they show serious limitations in energy-harvesting efficiency. Several innovative solutions have been reported to improve the efficiency of the interface rectifiers, such as ‘switch-only’ and ‘bias-flip’ techniques [7]. Such solutions utilize additional switches or switched inductors to speed up and even quickly reverse (flip) the voltage on the rectifier input to the desired voltage-level and condition for energy transfer, ultimately improving the overall efficiency of the energy harvesting. However, such techniques rely on accurate timing and synchronization of the pulsed switches every time the current produced by the piezoelectric harvester changes polarity. This thesis studies and investigates the impact of the non-ideal switching effects on the energy efficiency of the switch-only and bias-flip interface rectifiers in a PEH system, by theoretical derivation and experimental simulation.

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Rahim, Md Sayed Kaysar Jaeger Richard C. Suhling J. C. "Die stress characterization and interface delamination study in flip chip on laminate assemblies." Auburn, Ala., 2005. http://repo.lib.auburn.edu/2005%20Summer/doctoral/RAHIM_MD_37.pdf.

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DOMIENIKAN, CLAUDIO. "interface eletronica para aquisicao de 12 espectros de coincidencias gama-gama atrasadas." reponame:Repositório Institucional do IPEN, 2001. http://repositorio.ipen.br:8080/xmlui/handle/123456789/10889.

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Dissertacao (Mestrado)
IPEN/D
Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP

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Yamamoto, Silas Demmy. "Integração de sistema transceptor de 60 GHz para aplicações sem fio de interface multimídia de alta definição." [s.n.], 2011. http://repositorio.unicamp.br/jspui/handle/REPOSIP/259229.

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Orientador: Jacobus Willibrordus Swart
Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de Computação
Made available in DSpace on 2018-08-18T12:44:03Z (GMT). No. of bitstreams: 1 Yamamoto_SilasDemmy_M.pdf: 5306597 bytes, checksum: 9dd3930c43415f31bf913b4d374c25eb (MD5) Previous issue date: 2011
Resumo: O trabalho intitulado Integração de Sistema Transceptor de 60 GHz para Aplicações Sem Fio de Interface Multimídia de Alta Definição (Wireless HDMI) foi realizado na empresa STMicroelectronics (França), no departamento de P&D de Tecnologia / CAD Central e Soluções, como requisito para a obtenção do título de mestre. O objetivo deste trabalho foi de pesquisar e propor uma integração de sistema do tipo Sistema no Empacotamento (SiP ou System in Package) a nível industrial, com o desenvolvimento de um Módulo de Múltiplos Chips (MCM ou Multi-Chip Module) de camadas cerâmicas com tecnologia Cerâmica Cossinterizada sob Alta Temperatura (HTCC), integrando componentes de diferentes tecnologias - um circuito integrado CMOS 65 nm, um circuito integrado monolítico de micro-ondas (MMIC) de Arseneto de Gálio (GaAs) comercial e antenas IPD (Dispositivo de Integração Passiva) de vidro. Além disso foram desenvolvidas técnicas de projeto de integração na tecnologia HTCC, atendendo-se às regras para fabricação e montagem industrial. Utilizaram-se no projeto ferramentas software de projeto de simulação elétrica e eletromagnética, resultando no módulo com área de 13 x 8 mm2 e 1,12 mm de espessura incluindo os componentes. Nas linhas de transmissão do sinal a 60 GHz e de banda base foram medidas perdas de inserção de 1,0 dB/mm e 0,6 dB respectivamente. A antena integrada no módulo apresentou um ganho mínimo de 6 dBi (de 53,5 a 59,5 GHz), com perda de retorno maior que 10 dB (de 51 a 63 GHz) e um pequeno deslocamento em relação à banda especificada. Os resultados de medição de algumas amostras demonstraram que a tecnologia HTCC, para integração do sistema, é viável tanto em termos de desempenho, quanto nos aspectos industrial e comercial, mesmo antes da análise da montagem e desempenho do MMIC HPA e do sistema
Abstract: This Master's degree work, entitled System-in-Package (SiP) Integration of 60 GHz Transceiver for Wireless High Definition Multimedia Interface Application, was executed at STMicroelectronics Company (France), Minatec site in the department of Research and Technological Development/Central CAD and Solutions Department, under the guidance of PhD. Andreia Cathelin. The objective was to research and propose a SiP integration for industrial production. The Multi-Chip Module with ceramic materials (MCM-C) of High Temperature Cofired Ceramic technology (HTCC) was developed. Components and devices of different technologies - an RF 65 nm CMOS Integrated Circuit (IC), a commercial Gallium Arsenide (GaAs) monolithic microwave IC (MMIC), and IPD (Integrated Passive Device) antennas with glass substrate - were integrated into the same module. Further design techniques were developed complying with techniques for industrial assembly and the design rules of Kyocera, the company which provides HTCC technology and module manufacturing. The complete system integration was designed with electronic design automation (EDA) software tools with electrical and electromagnetic simulation resulting in a 13 x 8 mm2 area and 1.12 mm thickness module including its components. The 60 GHz and the base band transmission lines presented an insertion loss of 1.0 dB/mm and 0.6 dB respectively. The IPD antenna integrated in the module presented a 6 dBi minimum gain (53.5 to 59.5 GHz band) with return loss above 10 dB (51 to 63 GHz band) and a small shift of the frequency band. The measurement results of some assembled samples showed that HTCC technology is viable in terms of performance and industrial production for the 60 GHz application, even before the analysis of MMIC HPA and the system evaluation
Mestrado
Eletrônica, Microeletrônica e Optoeletrônica
Mestre em Engenharia Elétrica

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Masoud, Khalid Hasan. "Circuits and controls for grid-connected inverters." Thesis, Queensland University of Technology, 2002.

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7

Forbes, Mark Graham. "Electronic design issues in high-bandwidth parallel optical interfaces to VLSI circuits." Thesis, Heriot-Watt University, 1999. http://hdl.handle.net/10399/598.

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8

Silay, Kanber Mithat. "High Performance Cmos Capacitive Interface Circuits For Mems Gyroscopes." Master's thesis, METU, 2006. http://etd.lib.metu.edu.tr/upload/2/12607518/index.pdf.

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This thesis reports the development and analysis of high performance CMOS readout electronics for increasing the performance of MEMS gyroscopes developed at Middle East Technical University (METU). These readout electronics are based on unity gain buffers implemented with source followers. High impedance node biasing problem present in capacitive interfaces is solved with the implementation of a transistor operating in the subthreshold region. A generalized fully differential gyroscope model with force feedback electrodes has been developed in order to simulate the capacitive interfaces with the model of the gyroscope. This model is simplified for the single ended gyroscopes fabricated at METU, and simulations of resonance characteristics are done. Three gyroscope interfaces are designed by considering the problems faced in previous interface architectures. The first design is implemented using a single ended source follower biased with a subthreshold transistor. From the simulations, it is observed that biasing impedances up to several gigaohms can be achieved. The second design is the fully differential version of the first design with the addition of a self biasing scheme. In another interface, the second design is modified with an instrumentation amplifier which is used for fully differential to single ended conversion. All of these interfaces are fabricated in a standard 0.6 µ
m CMOS process. Fabricated interfaces are characterized by measuring their ac responses, noise response and transient characteristics for a sinusoidal input. It is observed that, biasing impedances up to 60 gigaohms can be obtained with subthreshold transistors. Self biasing architecture eliminates the need for biasing the source of the subthreshold transistor to set the output dc point to 0 V. Single ended SOG gyroscopes are characterized with the single ended capacitive interfaces, and a 45 dB gain improvement is observed with the addition of capacitive interface to the drive mode. Minimum resolvable capacitance change and displacement that can be measured are found to be 58.31 zF and 38.87 Fermi, respectively. The scale factor of the gyroscope is found to be 1.97 mV/(°
/sec) with a nonlinearity of only 0.001% in ±
100 °
/sec measurement range. The bias instability and angle random walk of the gyroscope are determined using Allan variance method as 2.158 °
/&
#8730
hr and 124.7 °
/hr, respectively.

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Finn, Steven Ernest. "Interface circuit designs for extreme environments using SiGe BiCMOS technology." Thesis, Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22679.

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SiGe BiCMOS technology has many advantageous properties that, when leveraged, enable circuit design for extreme environments. This work will focus on designs targeted for space system avioinics platforms under the NASA ETDP program. The program specifications include operation under temperatures ranging from -180 C to +125 C and with radiation tolerance up to total ionizing dose of 100 krad with built-in single-event latch-up tolerance. To the author's knowledge, this work presents the first design and measurement of a wide temperature range enabled, radiation tolerant as built, RS-485 wireline transceiver in SiGe BiCMOS technology. This work also includes design and testing of a charge amplification channel front-end intended to act as the interface between a piezoelectric sensor and an ADC. An additional feature is the design and testing of a 50 Ohm output buffer utilized for testing of components in a lab setting.

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Smith, O'neil Lohanica. "Design and use of surface modifiers as tools for understanding and controlling interfaces in organic electronics." Diss., Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/51838.

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This thesis focuses on the use of surface modifiers as tools for probing and/or controlling interfaces. Surface modification of transparent conducting oxides (TCOs) with organic and organometallic modifiers can be used as a tool for mediating interfacial energetics as well as probing the kinetics of charge-transfer at the metal oxide/organic interface. The synthetic tunability of these modifiers allows us to design molecules based on various parameters, which include the nature of the binding, spacer, and terminal groups. Based on this framework, several modifiers were synthesized and used to investigate surface energy tuning as well as charge injection kinetics as a function of molecular structure. More specifically, we use XPS/UPS to examine the evolution of the chemical structure and frontier orbital levels of the TCO/organic interface as a function of the chosen surface modifier. In addition, we investigate the impact that various molecular binding groups have on mediating the kinetics of charge-transfer. In the last section of this body of work we examine the development of dielectric nanocomposite films for capacitor applications. More specifically, we examine the use of phosphonic acid modifiers to functionalize barium titanate nanoparticles in order to provide miscibility with a suitable polymer host. The effect of various modifiers on the dielectric properties not nanocomposite thin films was examined.

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Books on the topic "Interface Electronic Circuits"

1

Electronic circuit guidebook. Indianapolis, IN: Prompt Publications, 1997.

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1950-, Watkinson John, ed. Digital interface handbook. Boston: Elsevier Focal Press, 2003.

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Rumsey, Francis. Digital interface handbook. 3rd ed. Oxford: Focal Press, 2004.

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1966-, Baumann Konrad, and Thomas Bruce 1954-, eds. User interface design of electronic appliances. London: Taylor & Francis, 2001.

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Gorby, Andrew. Development of a schematic capture graphical user interface for SPICE. Dublin: University College Dublin, 1995.

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1950-, Watkinson John, ed. The digital interface handbook. 2nd ed. Oxford: Focal Press, 1995.

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Roermund, Arthur van. Analog Circuit Design:: Sensor and Actuator Interface Electronics, Integrated High-Voltage Electronics and Power Management, Low-Power and High-Resolution ADC's. U.S.: Springer, 2005.

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1938-, Huijsing Johan H., Steyaert Michiel 1959-, and Roermund, Arthur H. M. van., eds. Analog circuit design: Sensor and actuator interface electronics, integrated high-voltage electronics and power management, low-power and high-resolution ADC's. Boston: Kluwer Academic, 2004.

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Bushby, Richard J. Liquid Crystalline Semiconductors: Materials, properties and applications. Dordrecht: Springer Netherlands, 2013.

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1962-, Cortadella J., ed. Logic synthesis for asynchronous controllers and interfaces. Berlin: Springer, 2002.

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Book chapters on the topic "Interface Electronic Circuits"

1

Fraden, Jacob. "Interface Electronic Circuits." In Handbook of Modern Sensors, 191–270. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-19303-8_6.

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Fraden, Jacob. "Interface Electronic Circuits." In Handbook of Modern Sensors, 173–246. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-6466-3_5.

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Barnes, John R. "Designing Interface Circuits." In Robust Electronic Design Reference Book, 556–70. New York, NY: Springer US, 2004. http://dx.doi.org/10.1007/1-4020-7830-7_23.

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Grecki, M., G. Jabłoński, and A. Napieralski. "MOPS — parallel environment for simulation of electronic circuits using physical models of semiconductor devices." In Recent Advances in Parallel Virtual Machine and Message Passing Interface, 478–85. Berlin, Heidelberg: Springer Berlin Heidelberg, 1997. http://dx.doi.org/10.1007/3-540-63697-8_120.

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Fiorillo, A. S., S. A. Pullano, R. Tiriolo, and J. D. Vinko. "Iono-Electronic Interface Based on Innovative Low Temperature Zeolite Coated NMOS (Circuits) for Bio-nanosensor Manufacture." In Nanomaterials for Security, 201–14. Dordrecht: Springer Netherlands, 2016. http://dx.doi.org/10.1007/978-94-017-7593-9_16.

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Iyer, Shivkumar V. "User Interface." In Simulating Nonlinear Circuits with Python Power Electronics, 35–61. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-73984-7_3.

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Williams, Ian, Lieuwe Leene, and Timothy G. Constandinou. "Next Generation Neural Interface Electronics." In Circuit Design Considerations for Implantable Devices, 141–78. New York: River Publishers, 2022. http://dx.doi.org/10.1201/9781003337522-7.

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Iyer, Shivkumar V. "Interface for User Control Functions." In Simulating Nonlinear Circuits with Python Power Electronics, 63–84. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-73984-7_4.

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Lopez, Carolina Mora, and Xiaohua Huang. "Circuits and Architectures for Neural Recording Interfaces." In Biomedical Electronics, Noise Shaping ADCs, and Frequency References, 45–57. Cham: Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-28912-5_3.

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Lienig, Jens, and Juergen Scheible. "Bridges to Technology: Interfaces, Design Rules, and Libraries." In Fundamentals of Layout Design for Electronic Circuits, 83–126. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-39284-0_3.

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Conference papers on the topic "Interface Electronic Circuits"

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Franzon, Paul D. "Molecular electronic circuits." In 2007 2nd International Workshop on Advances in Sensors and Interface. IEEE, 2007. http://dx.doi.org/10.1109/iwasi.2007.4420001.

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Dallago, E., D. Miatton, G. Venchi, V. Bottarel, G. Frattini, G. Ricotti, and M. Schipani. "Electronic interface for Piezoelectric Energy Scavenging System." In ESSCIRC 2008 - 34th European Solid-State Circuits Conference. IEEE, 2008. http://dx.doi.org/10.1109/esscirc.2008.4681877.

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Naus, Sebastien, Ioulia Tzouvadaki, Pierre-Emmanuel Gaillardon, Armando Biscontini, Giovanni De Micheli, and Sandro Carrara. "An efficient electronic measurement interface for memristive biosensors." In 2017 IEEE International Symposium on Circuits and Systems (ISCAS). IEEE, 2017. http://dx.doi.org/10.1109/iscas.2017.8050685.

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Biccario, G. E., M. De Vittorio, and S. D'Amico. "A 2.4μW input power electronic interface circuit for piezoelectric MEMS harvesters." In ESSCIRC 2017 - 43rd IEEE European Solid-State Circuits Conference. IEEE, 2017. http://dx.doi.org/10.1109/esscirc.2017.8094541.

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Tao, Xiao Ming, and David Dagan Feng. "A wearable, wireless electronic interface for textile sensors lin shu." In 2010 IEEE International Symposium on Circuits and Systems - ISCAS 2010. IEEE, 2010. http://dx.doi.org/10.1109/iscas.2010.5537973.

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Schmitz, Joseph A., Jonathan M. Sherman, Sam Hansen, Samuel J. Murray, Sina Balkir, and Michael W. Hoffman. "A Low-Power, Single-Chip Electronic Skin Interface for Prosthetic Applications." In 2019 IEEE International Symposium on Circuits and Systems (ISCAS). IEEE, 2019. http://dx.doi.org/10.1109/iscas.2019.8702424.

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Robert, Charlotte, Sylvie Pommier, Stephane Lefebvre, Marion Ortali, and Michel Massiot. "Mechanical Behavior and Damage of Tridimensional Multilayered Ceramics-Tungsten Power Electronic Substrates." In ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/esda2012-82305.

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Abstract:

Since few years a 3D electric lines is developed. But new applications will be to expose this circuit to high variation of temperature and use them for electronic power. Circuits lines are made of tungsten and insulation in alumina. These materials have different behavior. That difference implies mechanics stress and stress singularities. Some stress concentration can fracture materials or interface between them. Alumina is a brittle material. We need to know his fracture behavior. A statistic model is already used: Weibull model. The idea is to break about hundred samples and to related the probabilities to break of alumina used in the circuit versus stress.

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Osenbach, John, B. Q. Wang, Sue Emerich, John DeLucca, and Dongmei Meng. "Corrosion of the Cu/Al interface in Cu-Wire-bonded integrated circuits." In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575782.

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Elmala, M. A., A. Omar, A. Metawea, A. Ismail, A. S. Elmallah, A. I. Saeed, A. Elsayed, et al. "Electronic interface system with 7.5/12.5V actuation for MEMS accelerometer." In 2017 Intl Conf on Advanced Control Circuits Systems (ACCS) Systems & 2017 Intl Conf on New Paradigms in Electronics & Information Technology (PEIT). IEEE, 2017. http://dx.doi.org/10.1109/accs-peit.2017.8302992.

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Gurrum, Siva, Shivesh Suman, Yogendra Joshi, and Andrei Fedorov. "Thermal Issues in Next Generation Integrated Circuits." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35309.

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Effective cooling of electronic chips is crucial for reliability and performance of electronic devices. Steadily increasing power dissipation in both devices and interconnects motivate the investigation of chip-centric thermal management as opposed to traditional package-centric solutions. In this work, we explore the fundamental limits for heat removal from a model chip for various configurations. Temperature rise when the chip is embedded in an infinite solid is computed for different thermal conductivities of the medium to pin down the best that can be achieved with conduction based thermal management. Next, a chip attached to a spreader plate with convection boundary condition on top was considered. A brief review of interface thermal resistances and partitioning of overall thermal resistance is presented for current generation microprocessors. Based upon the analysis it is concluded that far-term cooling solutions might necessitate integration with chip/interconnect-stack to meet the challenges. In addition, this would require concurrent thermal and electrical design/fabrication of future high-performance microprocessors.

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