Academic literature on the topic 'Interfacial conduction mechanism'
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Journal articles on the topic "Interfacial conduction mechanism"
Martinez-Gonzalez, J. A., H. Cavaye, J. D. McGettrick, P. Meredith, K. A. Motovilov, and A. B. Mostert. "Interfacial water morphology in hydrated melanin." Soft Matter 17, no. 34 (2021): 7940–52. http://dx.doi.org/10.1039/d1sm00777g.
Full textRaze, Rizwan, Xiao Di Wang, Ying Ma, Yi Zhong Huang, and Bin Zhu. "Enhancement of Conductivity in Ceria-Carbonate Nanocomposites for LTSOFCs." Journal of Nano Research 6 (June 2009): 197–203. http://dx.doi.org/10.4028/www.scientific.net/jnanor.6.197.
Full textCho, Sanghoon, Jungmo Jung, Saeyoung Kim та James Jungho Pak. "Conduction mechanism and synaptic behaviour of interfacial switching AlOσ-based RRAM". Semiconductor Science and Technology 35, № 8 (2020): 085006. http://dx.doi.org/10.1088/1361-6641/ab8d0e.
Full textWu, Nan, Po-Hsiu Chien, Yutao Li, et al. "Fast Li+ Conduction Mechanism and Interfacial Chemistry of a NASICON/Polymer Composite Electrolyte." Journal of the American Chemical Society 142, no. 5 (2020): 2497–505. http://dx.doi.org/10.1021/jacs.9b12233.
Full textHorsfall, Alton B., Ming Hung Weng, Rajat Mahapatra, and Nicolas G. Wright. "Trap Assisted Gas Sensing Mechanism in MISiC Capacitors." Materials Science Forum 556-557 (September 2007): 621–26. http://dx.doi.org/10.4028/www.scientific.net/msf.556-557.621.
Full textRuan, Kunpeng, Yongqiang Guo, Chuyao Lu, et al. "Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management." Research 2021 (February 23, 2021): 1–13. http://dx.doi.org/10.34133/2021/8438614.
Full textHamri, D., A. Teffahi, A. Djeghlouf, D. Chalabi, and A. Saidane. "On electrical and interfacial properties of iron and platinum Schottky barrier diodes on (111) n-type Si0.65Ge0.35." International Journal of Modern Physics B 32, no. 09 (2018): 1850097. http://dx.doi.org/10.1142/s0217979218500972.
Full textWang, Lina, and Benbing Shi. "Hydroxide Conduction Enhancement of Chitosan Membranes by Functionalized MXene." Materials 11, no. 11 (2018): 2335. http://dx.doi.org/10.3390/ma11112335.
Full textHussain, A., P. Akhter, and A. S. Bhatti. "Charge Transport Mechanism and the Effects of Device Temperature on Electrical Parameters of Au/ZnPc/N-Si Structures." Key Engineering Materials 442 (June 2010): 372–80. http://dx.doi.org/10.4028/www.scientific.net/kem.442.372.
Full textHuo, Y., and B. Q. Li. "Surface Deformation and Convection in Electrostatically-Positioned Droplets of Immiscible Liquids Under Microgravity." Journal of Heat Transfer 128, no. 6 (2005): 520–29. http://dx.doi.org/10.1115/1.2188460.
Full textDissertations / Theses on the topic "Interfacial conduction mechanism"
Bertram, Brian D. "Effects of interfaces and preferred orientation on the electrical response of composites of alumina and silicon carbide whiskers." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/42895.
Full textBook chapters on the topic "Interfacial conduction mechanism"
Talapatra, Animesh, and Debasis Datta. "Molecular Dynamics Simulation-Based Study on Enhancing Thermal Properties of Graphene-Reinforced Thermoplastic Polyurethane Nanocomposite for Heat Exchanger Materials." In Inverse Heat Conduction and Heat Exchangers. IntechOpen, 2020. http://dx.doi.org/10.5772/intechopen.86527.
Full textSchmickler, Wolfgang. "The metal-solution interface." In Interfacial Electrochemistry. Oxford University Press, 1996. http://dx.doi.org/10.1093/oso/9780195089325.003.0008.
Full textConference papers on the topic "Interfacial conduction mechanism"
de Lemos, Marcelo J. S., and Ana C. Pivem. "Simulation of a Moving Porous Bed Reactor With a Two-Energy Equation Model." In 2010 14th International Heat Transfer Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/ihtc14-22133.
Full textLongson, Timothy J., James Maddocks, and Ali Kashani. "Morphological Impact on Thermal Interface Resistance of Self Catalyzing Fecralloy MWNT TIMs." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48735.
Full textZhang, Martin Y., and Gary J. Cheng. "Nanoscale Size Dependence on Metallic Nanoparticles: Case Study of Titanium Nanoparticles on Pulsed Laser Sintering of Hydroxyapatite/Titanium Nanoparticles." In ASME 2011 International Manufacturing Science and Engineering Conference. ASMEDC, 2011. http://dx.doi.org/10.1115/msec2011-50296.
Full textPrasher, Ravi. "Brownian-Motion-Based Convective-Conductive Model for the Thermal Conductivity of Nanofluids." In ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. ASMEDC, 2005. http://dx.doi.org/10.1115/ht2005-72048.
Full textZhang, X., and Z. Y. Guo. "Micro/Nanoscale Heat Transfer: Interfacial Effects Dominate the Heat Transfer." In ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/mnhmt2012-75355.
Full textChaurasia, Adarsh K., Gary D. Seidel, and Xiang Ren. "Computational Micromechanics Model to Study the Effective Macroscale Piezoresistivity of Carbon Nanotube-Polymer Nanocomposites for Strain and Damage Sensing." In ASME 2013 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/smasis2013-3223.
Full textBigham, Sajjad, and Saeed Moghaddam. "Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48581.
Full textSinha, K., D. Farley, T. Kahnert, et al. "Cold Welding Phenomenon in Adhesively Bonded Flip-Chip Interconnects." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-12650.
Full textAkle, Barbar J., and Donald J. Leo. "A Design Model for Bending and Extensional Ionic Polymer Transducers." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-15953.
Full textYee, Shannon K., Nelson Coates, Jeffrey J. Urban, Arun Majumdar, and Rachel A. Segalman. "A High-Performance Solution-Processable Hybrid Thermoelectric Material." In ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/mnhmt2012-75002.
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