Relevant bibliographies by topics / Interfacial fatigue

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Interfacial fatigue'

Author: Grafiati
Published: 4 June 2021
Last updated: 9 February 2022

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Journal articles on the topic "Interfacial fatigue"

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Chen, Yan Hua, Jian Yu Chu, and Qing Jie Zhu. "Effects of Coating on Interfacial Fatigue of Fiber-Reinforced Composites." Advanced Materials Research 97-101 (March 2010): 830–33. http://dx.doi.org/10.4028/www.scientific.net/amr.97-101.830.

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Coating is one of important parts in fiber-reinforced composite. Under cyclic loading, the effect of coating on interfacial fatigue is investigated based on double shear-lag model. Stresses of components are obtained. Relationship for analyzing interfacial debonding is established by the Paris Formula. Interfacial fatigue on fiber/coating and coating/matrix is simulated. It can be seen that interfacial debonding on different interfaces meet energy conservation law in general.
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Dai, Yao, Wei Tan, Chang Qing Sun, and Jia Wen He. "Determination of Growing Direction of Fatigue Crack." Key Engineering Materials 353-358 (September 2007): 1057–59. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.1057.

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The stress field of an interfacial crack in non-homogeneous materials is computed using the semi-analytical method of arbitrary lines (MAL). Then, the eigen-functions of stress, strain and displacement, i.e. the angular distribution functions near a crack tip, are analyzed based on our wedge-shape non-homogeneous model. Finally, the growing direction of the interfacial crack is determined according to the relevant maximum normal stress criterion accurately. Therefore, the effective approach is provided for solving the complicated crack growing directions of an interfacial crack in non-homogeneous materials.
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Zhao, X. J., G. Q. Zhang, J. F. J. M. Caers, and L. J. Ernst. "Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion." Journal of Electronic Packaging 125, no. 4 (December 1, 2003): 582–88. http://dx.doi.org/10.1115/1.1604160.

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In this paper, an “interfacial boundary volume” based damage criterion was proposed in combination with the modified Coffin-Manson model to predict solder fatigue. This criterion assumes that mainly, the behavior of the thin solder layer at chip pad interface contributes to the solder fatigue, not the whole solder joint or the averaged strains from randomly selected elements. The damage parameter was thus calculated by averaging the visco-plastic strain range over the interfacial boundary layer volume in the solder and later related to the corresponding fatigue life of experimental test through least-squares curves fitting to determine the empirical coefficients in the Coffin-Manson equation. As a demonstrator, the solder joint fatigue in wafer level chip scale packaging under thermal shock loading was analyzed. An appropriate constitutive relation from Darveaux was used to model the inelastic deformation of the solder alloy, and the different stress-strain responses resulting from different designs were calculated. The analysis results were used to develop the empirical fatigue model based on the interfacial boundary volume damage criterion and then this fatigue model was used for prediction. The fatigue lives of chip scale packaging with variable solder land size and component size were analyzed using this model. The prediction results match well with those from experimental tests. For this demonstrator, it was also shown that the empirical model based on the interfacial boundary volume criterion was more accurate than the models obtained from other strain averaging methods.
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Ni, Xiang, Chao Chen, and Jianyu Li. "Interfacial fatigue fracture of tissue adhesive hydrogels." Extreme Mechanics Letters 34 (January 2020): 100601. http://dx.doi.org/10.1016/j.eml.2019.100601.

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Yang, Yan, Shao Long Huang, Qing Jun Ding, and Xin Yan Peng. "The Property Research on Interfacial Modificated Semi-Flexible Pavement Material." Applied Mechanics and Materials 71-78 (July 2011): 1090–98. http://dx.doi.org/10.4028/www.scientific.net/amm.71-78.1090.

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Based on shearing test, bending test in low temperature, fatigue test and dynamic modulus test, the text researched the effect on the property of the semi-flexible pavement by a kind of interfacial modifier. The study showed the feasible content of interfacial modifier was 0.4～0.6% . Used 0.4%, the shear strength reached 1.83MPa, flexural strength 6.97MPa, and fatigue-life was over 40000 at 0.2 stress ratio. From interfacial modification, the synthesis property of semi-flexible pavement was especially perfect.
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Chen, Yan Hua, and Qing Jie Zhu. "Numerical Simulation of Interfacial Bonding Degradation of Composites under Two-Stage Loading." Materials Science Forum 575-578 (April 2008): 869–74. http://dx.doi.org/10.4028/www.scientific.net/msf.575-578.869.

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Bonding degradation at interface is one of main damage forms of composites, especially under fatigue loading. Interfacial bonding degradation of FRC under two-stage tension loading is studied, which is base for variable-amplitude cyclic loading existing widely in actual engineering. Based on the shear-lag model and considered the asymmetry of interfacial damage, the mechanical governing equations of fiber and matrix are established and related solutions are obtained firstly. Two kinds of loading models are chosen, one is low-high alternate loading, and the other is low early and high late loading. By the aid of the Paris law and the energy release theory, a relationship between debond rate and cycle number is established. Then the interfacial debonding is simulated under the two-stage tension loading. The rules of the crack growth are analyzed for low-high two-stage loadings. It is found that stress amplitude has great influence on interfacial debonding under two-stage loading. Low stress amplitude in a certain range can postpone interfacial bonding degradation. And interfacial damage extent is greater than that under constant-amplitude fatigue loading. Present study is helpful for analyzing the fatigue damage of engineering materials and structures.
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Zhang, QingKe, HeFei Zou, and Zhe-Feng Zhang. "Improving tensile and fatigue properties of Sn–58Bi/Cu solder joints through alloying substrate." Journal of Materials Research 25, no. 2 (February 2010): 303–14. http://dx.doi.org/10.1557/jmr.2010.0035.

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To eliminate the Bi segregation and interfacial embrittlement of the SnBi/Cu joints, we deliberately added some Ag or Zn elements into the Cu substrate. Then, the reliability of the SnBi/Cu–X (X = Ag or Zn) solder joints was evaluated by investigating their interfacial reactions, tensile property, and fatigue life compared with those of the SnBi/Cu and SnAg/Cu joints. The experimental results demonstrate that even after aging for a long time, the addition of the Ag or Zn elements into the Cu substrate can effectively eliminate the interfacial Bi embrittlement of the SnBi/Cu–X joints under tensile or fatigue loadings. Compared with the conventional SnAg/Cu joints, the SnBi/Cu–X joints exhibit higher adhesive strength and comparable fatigue resistance. Finally, the fatigue and fracture mechanisms of the SnBi/Cu–X solder joints were discussed qualitatively. The current findings may pave the new way for the Sn–Bi solder widely used in the electronic interconnection in the future.
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Valantin, Chloé, Florian Lacroix, Marie-Pierre Deffarges, Julie Morcel, and Nourredine Aït Hocine. "Interfacial damage on fatigue-loaded textile-rubber composites." Journal of Applied Polymer Science 132, no. 4 (August 28, 2014): n/a. http://dx.doi.org/10.1002/app.41346.

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Huang, Jow-Lay, and Jyh-Ming Jih. "Investigation of SiC–AlN: Part III. Static and dynamic fatigue." Journal of Materials Research 10, no. 10 (October 1995): 2488–93. http://dx.doi.org/10.1557/jmr.1995.2488.

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SiC/AlN composites with controlled interfacial solid solution were employed in this present work to investigate the effects of interfacial chemical composition and AlN polytypes on the fatigue properties. The dynamic strength of the SiC/AlN composite was found to decrease initially as the stressing rate decreased. However, the strength increased with a decrease in stress rate at a low stress rate region of below 0.01 MPa/s. Crack arrest could have occurred before exhibiting spontaneous failure at an intermediate stress rate of 0.01 MPa/s. It was found that both the interfacial bonding strength and testing technique had essential effects on the behavior of slow crack growth.
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Chiu, Hsien-Tang, Yung-Lung Liu, Kuo-Chuan Liang, and Peir-An Tsai. "Interfacial properties and fatigue behavior of carbon fiber epoxy laminate composites." Journal of Polymer Engineering 33, no. 2 (April 1, 2013): 173–79. http://dx.doi.org/10.1515/polyeng-2012-0113.

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Abstract The study elucidated the relationship between the stacking sequence and physical properties, by investigating mechanical properties, fatigue life and the morphology, after fatigue fracture of carbon fiber/epoxy composites. The results show that the unidirectional carbon fiber laminate has the maximum tensile stress. Moreover, the laminate with ±45° plies can improve the tensile strain. The fatigue life of all specimens was shorter than 103 cycles under high cyclic stress level, and longer than 106 cycles under low cyclic stress level. Laminates with [908]s stacking sequence had the shortest fatigue life under high and low cyclic stress, while the unidirectional carbon fiber laminate had the highest fatigue life. A number of fatigue damage models, including delaminating, matrix cracking and fiber failure, have been identified by scanning electron microscopy (SEM). The SEM micrographs showed that the morphology on the cross section, after fatigue fracture, was significantly correlated to the stacking sequence.
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Dissertations / Theses on the topic "Interfacial fatigue"

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Ostrowicki, Gregory Thomas. "Magnetically actuated peel test for thin film interfacial fracture and fatigue characterization." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/45870.

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Delamination along thin film interfaces is a prevalent failure mechanism in microelectronic, photonic, MEMS, and other engineering applications. Current interfacial fracture test techniques specific to thin films are limited by either sophisticated mechanical fixturing, physical contact near the crack tip, non-representative test specimens, or complicated stress fields. Moreover, these techniques are generally not suitable for investigating fatigue crack propagation under cyclical loading. A fixtureless and noncontact experimental test technique is thus proposed and implemented to study interfacial fracture for thin film systems. The proposed test incorporates permanent magnets surface mounted onto micro-fabricated released thin film structures. An applied external magnetic field induces noncontact monotonic or fatigue loading to initiate delamination along the interface between the thin film and underlying substrate. Characterization of the film deflection, peel angle, and delamination propagation is accomplished through in situ optical techniques. Analytical and finite-element models are used to extract fracture parameters from the experimental data using thin-film peel mechanics. The developed interfacial fracture test has been demonstrated for Cu thin films on a SiO₂/Si substrate.
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Varadarajan, Bhadri Narayanan. "MICROMECHANICS OF DEBOND GROWTH AND INTERFACIAL WEAR UNDER FATIGUE LOADING IN A TRANSPARENT CERAMIC COMPOSITE." University of Cincinnati / OhioLINK, 2000. http://rave.ohiolink.edu/etdc/view?acc_num=ucin975352464.

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Gaudette, Frederick G. "The influence of alloy composition and interfacial segregants on the fracture and fatigue of metal/ceramic interfaces." Thesis, Massachusetts Institute of Technology, 1999. http://hdl.handle.net/1721.1/9412.

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Kaya, Figen. "Effects of increased interfacial strength on the fatigue crack growth resistance, crack opening displacements and interfacial and fibre strength degradation in a Ti β 21S/SCS 6 composite." Thesis, University of Birmingham, 2003. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.289444.

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Ma, Yu. "Effects of TiB2 nanoparticles on the interfacial precipitation and mechanical properties of Al-Zn-Mg-Cu matrix composites." Thesis, Université Paris-Saclay (ComUE), 2019. http://www.theses.fr/2019SACLS252.

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L’influence des renforts nanoparticules de TiB2 (6 wt.%) sur la précipitation interfaciale de la phase (Zn1.5Cu0.5)Mg, la résistance à la traction et la fissuration sous chargement de fatigue (fatigue crack growth-FCG) des composites à matrice de Al-Zn-Mg-Cu ont été étudiées. Des échantillons de composites ont été obtenus par réaction in-situ pendant le moulage suivi d’un FSP (friction stir processing) et une extrusion à chaud. Seuls les échantillons moulés et extrudés ont été utilisés pour étude de FCG à cause de la limitation de la taille après FSP. Des observations au microscope électronique à balayage (SEM), avec la diffraction des électrons rétrodiffusés (SEM/EBSD) et au microscope électronique en transmission à haute résolution (HRSTEM) ont été réalisées pour caractériser la microstructure.Des échantillons présentent une structure des grains équi-axiaux et des nanoparticules de TiB2 sont distribuées de façon homogène dans la matrice. En état de solution solide, l’interface TiB2/Al est de nature semi-cohérente et très propre. En état de vieillissementou ou sur vieillissement, la précipitation interfacaile hétérogène de la phase (Zn1.5Cu0.5)Mg a été observée. La cinétique de la précipitation interfaciale a été discutée. Les interfaces entre Al/(Zn1.5Cu0.5)Mg/TiB2 sont quasi cohérentes et l’interface TiB2/Al a été renforcée grâce à la réduction de l’énergie de l’interface. Ce mécanisme de précipitation interfaciale peut expliquer l’effet de renforcement de l’interface contribuant simultanement l’augmentation de la résistance et de l’élongation des échatillons de composite.La majorité de nanoparticules TiB2 tentent de s’agglomérer le long des joints de grains dans des échantillons sans FSP. La vitesse de croissance de fissure a été augmentée à l’intérieur des grains avec un facteur d’intensité (ΔK) intermédiaire ou important à cause de l’affinement de grains. Cependant, la vitesse de croissance de fissure a été diminuée aux joints de grains avec (ΔK) faible ou intermédiaire à cause de la présence des clusters de TiB2 tandis que cette vitesse augmente avec (ΔK) important à cause de la coalescence des micropores
The influences of TiB2 reinforcement nanoparticles (6 wt.%) on the interfacial precipitation of (Zn1.5Cu0.5)Mg phase, the associated tensile and fatigue crack growth (FCG) properties of the Al-Zn-Mg-Cu matrix composites have been studied. The composite samples were produced by in-situ reaction during casting followed by friction stir processing (FSP) and hot extrusion, while only casted and extruded samples were used for evaluating FCG due to size limit of the nugget zone after FSP. Scanning electron microscopy (SEM), electron backscatter diffraction (EBSD) and high-resolution scanning transmission electron microscopy (HRSTEM) were employed for the microstructure characterization.The as-processed composite samples contain the fine equiaxed-grain structure, where TiB2 nanoparticles are homogenously distributed. At solid-solution state, the TiB2/Al interfaces are featured by the clean and semi-coherent nature. At the peak-aged and overaged states, the interface precipitate determined as (Zn1.5Cu0.5)Mg phase was formed, and the underlying heterogeneous interfacial precipitation kinetics was discussed. The Al/(Zn1.5Cu0.5)Mg/TiB2 multi-interfaces were revealed to be almost coherent, and the TiB2/Al interfaces were thus strengthened due to the greatly reduced coherency strains. This mechanism was proposed as precipitation assisted interface strengthening, which has contributed to the simultaneously enhanced tensile strength and uniform elongation of the as-processed composite.The majority of TiB2 nanoparticles tend to aggregate along grain boundaries (GBs) in the composite samples without FSP. The FCG rate is increased inside grains at intermediate and high stress intensity factor (ΔK) ranges due to the refined grain size. However, the FCG rate at the GBs is decreased at the low and intermediate ΔK ranges by fatigue crack deflection and trapping due to the presence of TiB2 clusters, while it increases at the high ΔK range due to microvoid coalescence
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Mahalingam, Sakethraman. "Study of Interfacial Crack Propagation in Flip Chip Assemblies with Nano-filled Underfill Materials." Diss., Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/7215.

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No-flow underfill materials that cure during the solder reflow process is a relatively new technology. Although there are several advantages in terms of cost, time and processing ease, there are several reliability challenges associated with no-flow underfills. When micron-sized filler particles are introduced in no-flow underfills to enhance the solder bump reliability, such filler particles could prevent the solder bumps making reliable electrical contacts with the substrate pads during solder reflow, and therefore, the assembly yield would be adversely affected. The use of nano-sized filler particles can potentially improve assembly yield while offering the advantages associated with filled underfill materials. The objective of this thesis is to study the thermo-mechanical reliability of nano-filled epoxy underfills (NFU) through experiments and theoretical modeling. In this work, the thermo-mechanical properties of NFUs with 20-nm filler particles have been measured. An innovative residual stress test method has been developed to measure the interfacial fracture toughness. Using the developed residual stress method and the single-leg bending test, the mode-mixity-dependent fracture toughness for NFU-SiN interface has been determined. In addition to such monotonic interfacial fracture characterization, the interface crack propagation under thermo-mechanical fatigue loading has been experimentally characterized, and a model for fatigue interface crack propagation has been developed. A test vehicle comprising of several flip chips was assembled using the NFU material and the reliability of the flip-chip assemblies was assessed under thermal shock cycles between -40oC and 125oC. The NFU-SiN interfacial delamination propagation and the solder bump reliability were monitored. In parallel, numerical models were developed to study the interfacial delamination propagation in the flip chip assembly using conventional interfacial fracture mechanics as well as cohesive zone modeling. Predictions for interfacial delamination propagation using the two approaches have been compared. Based on the theoretical models and the experimental data, guidelines for design of NFUs against interfacial delamination have been developed.
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Baumert, Eva K. "Influence of the environment on the fatigue properties of alumina ultra-thin coatings and silicon and nickel thin films." Diss., Georgia Institute of Technology, 2013. http://hdl.handle.net/1853/49114.

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This dissertation presents the investigation of three thin film materials used in microelectromechanical systems (MEMS): alumina, silicon, and nickel. For this purpose, novel experimental techniques to test thin films under MEMS-relevant loading conditions were developed in order to study environmental effects and the underlying fatigue mechanisms of amorphous alumina ultra-thin coatings, mono-crystalline brittle silicon thin films, and poly-crystalline ductile nickel thin films. Knowledge of these mechanisms is necessary to improve the reliability of MEMS, especially of those devices operating in harsh environments. MEMS resonators were used to investigate both the fatigue and time-dependent behavior of alumina, silicon, and nickel. While micro-resonators were used in prior studies to research the fatigue properties of mono- and polycrystalline silicon, this work is the first in (1) using them to investigate fatigue properties of ultra-thin coatings and metallic films and in (2) using micro-resonators to investigate the time-dependent fatigue behavior of silicon films. For fatigue testing, the micro-resonators were subjected to fully-reversed loading at resonance (≈40 kHz for alumina-coated silicon, ≈8 kHz for nickel). Experiments were conducted in air at 30 °C, 50% relative humidity (RH) or 80 °C, 90% RH and testing was carried out over a broad range of applied stresses. The resonance frequency evolution proved to be a metric for the accumulated damage, which could be further quantified using finite element analysis. In addition, scanning and transmission electron microscopy were used to examine the extent of fatigue damage. For testing under static loads, the resonators were subjected to external loading using a micromanipulator and probe-tip. Experiments with atomic-layer-deposited alumina investigated the cohesive and interfacial fatigue properties of alumina coatings of four different thicknesses, ranging from nominally 4.2 nm to 50.0 nm on silicon micro-resonators. Fatigue loading led to both cohesive and interfacial damage, while static loading did not result in any damage. Both the cohesive and interfacial fatigue crack growth rates are approximately one order of magnitude higher at 80 °C, 90% RH than at 30 °C, 50% RH and seem to increase with increasing strain energy release rate. A combination of compressive loading and the silicon sidewall's surface roughness is believed to cause the observed fatigue behavior. Experiments with 10-micrometer-thick deep reactive ion etched silicon micro-resonators investigated two aspects: whether surface oxidation is the critical parameter in silicon thin film fatigue and time-dependent failure in silicon as a potential underlying cause of resonator failures in the low cycle fatigue (LCF, <17 cycles, corresponding to ≈5 min) regime. To confirm whether surface oxidation is the critical parameter in silicon thin film fatigue, the influence of oxygen diffusion barrier alumina coatings on the fatigue behavior was investigated. The coatings led to an increase in fatigue life by at least two orders of magnitude compared to uncoated devices in the harsh environment, which not only confirms reaction layer fatigue (RLF) as governing fatigue mechanism in silicon thin films, but also constitutes a practical solution to significantly increase fatigue lifetimes. Previous LCF data were inconsistent with the RLF model, given that thick surface oxidation is unrealistic for tests lasting only few minutes. Accordingly, time-dependent failure in silicon was investigated as underlying cause and the observation of resonator failures under static loading indeed suggest that time-dependent crack growth may be responsible for LCF failures. Experiments with metallic micro-resonators investigated the fatigue crack initiation in 20-micrometer-thick electro-deposited nickel under MEMS-relevant conditions, such as extreme stress gradients resulting in non-propagating cracks, fully-reversed loading (over a large range of stress amplitudes), exposure to mild and harsh environments, and accumulation of billions of cycles. Under these circumstances, extrusions form locally at the notch root (within few million cycles at high stress amplitudes). Very thick local oxides (only at the location of the extrusions) of up to 1100 nm were observed in the harsh environment, with thinner oxides (up to 700 nm) in the mild environment. Micro-cracks form in the oxide but do not propagate given the extreme stress gradients. Finite element analysis confirmed that oxidation and micro-cracking lead to changes in the resonance frequency, which are consistent with the experimental results. Accumulation of cyclic plasticity appears to also lead to a decrease in resonance frequency which scales with applied strain.
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Jain, Jayesh R. "Homogenization Based Damage Models for Monotonic and Cyclic Loading in 3D Composite Materials." The Ohio State University, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=osu1230431496.

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Seghini, Maria Carolina. "Mechanical Analysis and Fibre/Matrix Interface Optimization for Next Generation of Basalt-Plant Fibre Hybrid Composites." Electronic Thesis or Diss., Chasseneuil-du-Poitou, Ecole nationale supérieure de mécanique et d'aérotechnique, 2020. http://www.theses.fr/2020ESMA0003.

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La prise de conscience mondiale des enjeux environnementaux a conduit à l’émergence de composites«verts», dans lesquels les fibres naturelles sont amenées à remplacer les fibres synthétiques. Ces nouveaux matériaux offrent des alternatives écologiques aux composites synthétiques traditionnels mais sont difficilement utilisables pour des applications semi-structurales ou structurales. Une solution possible à ce problème est le développement des composites hybrides, en combinant ensemble fibres naturelles et synthétiques. Dans ce cadre, l'objectif de cette étude était de développer des composites hybrides à base de fibres de basalte et de lin. Les composites hybrides ont été élaborés par moulage par infusion sous vide avec une matrice époxy. À des fins de comparaison,des composites 100% à fibres de lin et100%à fibres de basalte ont également été produits. Une caractérisation mécanique quasi-statique et dynamique amontré que l'hybridation permet d’obtenir un composite avec des propriétés mécaniques intermédiaires comparées à celles des composites à fibres de lin ou de basalte. Cependant, l’analyse approfondie des dommages a montré la nécessité d'optimiser la qualité d'adhésion de l'interface fibre/matrice afin d'accroître les performances mécaniques des composites hybrides obtenus. Pour cette raison, différents traitements de modification de surface ont été développés et étudiés pour les fibres de lin et de basalte. Un traitement physique par plasma (Plasma Enhanced Chemical Vapor Deposition) a été appliqué aux fibres de lin et de basalte. Les fibres de lin ont également été soumises à deux traitements chimiques utilisant des espèces enzymatiques et du CO2supercritique. Les effets des traitements sur la stabilité thermique, la morphologie et les propriétés mécaniques des fibres de lin et de basalte ont été étudiés. L’adhérence fibre/matrice a été analysée en réalisant des tests de fragmentation sur des composites monofilamentaires. La qualité de l'adhésion entre les fibres et les matrices époxy et vinylester a été évaluée en termes de longueur critique de fragment, de longueur de décohésion interfaciale et de résistance au cisaillement interfacial. La micto-tomographie haute résolution a été utilisée pour analyser les mécanismes d'endommagement lors des tests de fragmentation. Pour les deux types de fibres, les meilleurs résultat sont été obtenus grâce au traitement par plasma. Ce traitement a consisté à déposer un revêtement homogène de tétravinylsilane à la surface des fibres de basalte et de lin, ce qui a permis une augmentation significative de l’adhérence fibre/matrice, ouvrant ainsi la voie à la prochaine génération de composites hybrides plus respectueux de l’environnement et utilisables pour des applications semi-structurales
Global awareness of environmental issues has resulted in the emergence of “green” composites, in which natural fibres are used to replace synthetic ones. However, in semi-or structural applications, it can be inconvenient to use composites based on natural fibres. A possible solution to this problem is the development of hybrid composite materials, combining together plies of natural and synthetic fibres. In this framework, the aim of this research project was to develop basalt-flax fibre hybrid composites with a view to obtaining more environmentally friendly composites for semi-structural applications. Hybrid composites were produced through vacuum infusion molding with epoxy matrix.For comparison purposes, 100% flax fibre composites and 100% basalt fibre composites were also manufactured. A quasi-static and dynamic mechanical characterization showed that the hybridization allows the production of a composite with intermediate mechanical performances compared to those possessed by flax and basalt composites. However, the damage analysis has revealed the need to optimize the fibre/matrix interface adhesion quality, in order to increase the mechanical properties of the resulting hybrid composites. For this reason, different surface modification treatments have been specifically designed and investigated for flax and basalt fibres. Flax and basalt fibres were treated by the physical process of Plasma Enhanced Chemical Vapor Deposition. Flax fibres were also subjected to two chemical treatments using enzymatic species and supercritical CO2. The effects of the surface modification treatments on the thermal stability, morphology and mechanical properties of flax and basalt fibres have been investigated. The degree and extent of fibre/matrix adhesion were analyzed by micromechanical fragmentation tests on monofilament composites. The adhesion quality between fibres and both epoxy and vinylester matrices has been assessed in terms of critical fragment length, debonding length and interfacial shear strength. High-resolution μ-CT has been used to support the analysis of the damage mechanisms during fragmentation tests. For both flax and basalt fibres, the best results were obtained after the plasma polymer deposition process. This process was able to produce a homogeneous tetravinylsilane coating on the surface of basalt and flax fibres, which resulted in a significant increase in the fibre/matrix adhesion, thus paving the way for the next generation of more environmentally friendly hybrid composites for semi-structural applications
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Ozelo, Renan Rodrigues de Mello. "Propagação de trincas interfaciais e fadiga em compostos de borracha submetidos a envelhecimento." [s.n.], 2010. http://repositorio.unicamp.br/jspui/handle/REPOSIP/263126.

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Orientador: Paulo Sollero
Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Mecânica
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Resumo: Este trabalho visa o estudo da propagação de trincas interfaciais em materiais liiperelãs-ticos submetidos a envelhecimento. O método dos elementos finitos foi aplicado utilizando o software Abaqus para realizar a análise global do modelo de propagação e determinar as distribuições de tensões e deformações no corpo. Foram desenvolvidas duas técnicas, aplicadas a materiais com comportamento não linear, para a determinação do percurso de propagação. Ambas as técnicas baseiam-se na integral J e no critério da máxima taxa de liberação de energia. Para a análise do tipo de propagação e estimativa da vida em fadiga, uma metodologia foi desenvolvida para obter os parâmetros críticos de fratura e os coeficientes da Lei de Paris. Os parâmetros críticos de fratura são responsáveis por determinar se a trinca propagará de forma estável, instável ou se não haverá propagação, enquanto que os coeficientes da Lei de Paris são utilizados na integração da equação de Paris, de modo a estimar a vida em fadiga do modelo. Para a verificação do modelo de fratura foi utilizada a técnica de correlação de imagem digital. As validações das técnicas para determinar o percurso de propagação foram realizadas a partir de análises comparativas com resultados publicados na literatura e resultados experimentais próprios
Abstract: This work aims the study of interfacial crack propagation in hyperelastic materials with aging. The finite element method was applied using software Abaqus to perform the global analyses of the propagation model and evaluate the stress and strains fields. Two techniques, applied to nonlinear materials, were developed to evaluate the crack propagation path. Both techniques are based on J-integral and maximum energy release rate. To analyze the propagation type and estimation of fatigue life, a methodology was developed to obtain the critical fracture parameters and the Paris coefficients. The critical fracture parameters are responsible to determine the propagation type, while the Paris coefficients are used in the integration of the Paris Law equation, in order to estimate the fatigue life. To verify the fracture model the digital image correlation was used. The validations of the techniques to evaluate the crack propagation path were made from comparative analysis with results published in the literature and own experimental results
Mestrado
Mecanica dos Sólidos e Projeto Mecanico
Mestre em Engenharia Mecânica
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Books on the topic "Interfacial fatigue"

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Fox, Katharine Margaret. Effects of interfacial properties on fatigue crack growth resistance in Ti/SiC metal matrix composites. Birmingham: University of Birmingham, 1994.

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2

Kaya, Figen. Effects of increased interfacial strength on the fatigue crack growth resistance, crack opening displacements and interfacial and fibre strength degradation in a Tiß 21S/SC6 composite. Birmingham: University of Birmingham, 2003.

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Book chapters on the topic "Interfacial fatigue"

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Gao, Cun-Fa, and Yiu-Wing Mai. "Permeable Interfacial Crack in Electrostrictive Materials." In IUTAM Symposium on Multiscale Modelling of Fatigue, Damage and Fracture in Smart Materials, 133–39. Dordrecht: Springer Netherlands, 2010. http://dx.doi.org/10.1007/978-90-481-9887-0_13.

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Shang, Fulin, Yabin Yan, and Takayuki Kitamura. "Interfacial Delamination of PZT Thin Films." In IUTAM Symposium on Multiscale Modelling of Fatigue, Damage and Fracture in Smart Materials, 189–96. Dordrecht: Springer Netherlands, 2010. http://dx.doi.org/10.1007/978-90-481-9887-0_18.

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Lam, P. W. K., and M. R. Piggott. "Influence of Interfacial Adhesion on Fatigue of Comaco Composites." In Time-Dependent Fracture, 159–66. Dordrecht: Springer Netherlands, 1985. http://dx.doi.org/10.1007/978-94-009-5085-6_13.

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Chu, Y. C., A. I. Lavrentyev, and S. I. Rokhlin. "Ultrasonic Characterization of Interfacial Fatigue Damage in Metal Matrix Composites." In Review of Progress in Quantitative Nondestructive Evaluation, 2011–18. Boston, MA: Springer US, 1995. http://dx.doi.org/10.1007/978-1-4615-1987-4_257.

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Yavas, Denizhan, Xu Shang, and Ashraf F. Bastawros. "Contamination-Induced Degradation/Enhancement of Interfacial Toughness and Strength in Polymer-Matrix Composite Interfaces." In Fracture, Fatigue, Failure and Damage Evolution, Volume 7, 73–78. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-62831-8_10.

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Oda, Kazuhiro, Shunya Yasada, and Noriko Tsutsumi. "Singular Stress Field of Interfacial Small Crack in Orthotropic Bonded Plate." In Proceedings of the 7th International Conference on Fracture Fatigue and Wear, 194–201. Singapore: Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-0411-8_19.

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Singh, Indra Vir, and Gagandeep Bhardwaj. "Fatigue Crack Growth Analysis of an Interfacial Crack in Heterogonous Material Using XIGA." In Mathematical Analysis of Continuum Mechanics and Industrial Applications II, 15–26. Singapore: Springer Singapore, 2017. http://dx.doi.org/10.1007/978-981-10-6283-4_2.

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McSwain, R. L., A. R. Markowitz, and K. R. Shull. "Contact Mechanics and Interfacial Fatigue Studies Between Thin Semicrystalline and Glassy Polymer Films." In Adhesion, 365–86. Weinheim, FRG: Wiley-VCH Verlag GmbH & Co. KGaA, 2006. http://dx.doi.org/10.1002/3527607307.ch23.

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NAKAI, Y., and K. OHJI. "FATIGUE AND FRACTURE RESISTANCE OF INTERFACIAL CRACKS IN CLAD STEELS." In Mechanical Behaviour of Materials VI, 451–56. Elsevier, 1992. http://dx.doi.org/10.1016/b978-0-08-037890-9.50469-5.

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Li, K., S. Cao, and X. Wang. "A study of the propagation behavior of CFRP-concrete interfacial cracks under fatigue loading." In Advances in Civil Engineering and Building Materials IV, 165–69. CRC Press, 2015. http://dx.doi.org/10.1201/b18415-38.

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Conference papers on the topic "Interfacial fatigue"

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MAJUMDAR, PRASUN, CAMERON WILKES, PRASHANT KATIYAR, and ALICE ARNOLD. "Effect of Interfacial Defects on Mechanical and Electrical Properties of Composite Materials Fatigue." In American Society for Composites 2017. Lancaster, PA: DEStech Publications, Inc., 2017. http://dx.doi.org/10.12783/asc2017/15258.

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Zheng, Jiantao, Gregory Ostrowicki, and Suresh K. Sitaraman. "Non-contact magnetic actuation test technique to characterize interfacial fatigue fracture of thin films." In 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009). IEEE, 2009. http://dx.doi.org/10.1109/ectc.2009.5074191.

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Goyal, Vinay, and Eric Johnson. "Cohesive-Decohesive Interfacial Constitutive Law for the Analyses of Fatigue Crack Initiation and Growth." In 44th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference. Reston, Virigina: American Institute of Aeronautics and Astronautics, 2003. http://dx.doi.org/10.2514/6.2003-1678.

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Lall, Pradeep, Kalyan Dornala, Jeff Suhling, John Deep, and Ryan Lowe. "Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading." In ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/ipack2019-6572.

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Abstract Electronics components operating under extreme thermo-mechanical stresses are often protected with underfills and potting encapsulation to isolate the severe stresses. By encapsulating the entire PCB, the resin provides complete insulation for the unit thereby combining good electrical properties with excellent mechanical protection. In military and defense applications these components are often subjected to mechanical shock loads of 50,000g and are expected to perform with reliability. Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully-cured material, with no by-products. The cured potting materials are prone to interfacial delamination under dynamic shock loading which in turn potentially cause failures in the package interconnects. The study of interfacial fracture resistance in PCB/epoxy potting systems under dynamic shock loading is important in mitigating the risk of system failure in mission critical applications. In this paper, three types of epoxy potting compounds were used as an encapsulation on PCB samples. The potting compounds were selected based on their ultimate elongation under quasi-static loading. Potting compound, A is a stiffer material with 5% of ultimate elongation before failure. Potting compound, B is a moderately stiff material with 12% ultimate elongation. Finally, potting compound C is a softer material with 90% ultimate elongation before failure. The fracture properties and interfacial crack delamination of the PCB/epoxy interface were determined using three-point bend loading with a pre-crack at the interface. The fatigue crack growth of the interfacial delamination was characterized for the three epoxy systems. A prediction of number of cycles to failure and the performance of different epoxy system resistance under cyclic bending loading was assessed.
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Yang, Donghua, Xiang Zhai, Chunhong Zhang, Guisheng Gan, Teng Ran, Fei Du, and Tao Fan. "Interfacial Reaction and Failure Mechanism of SAC/Co-P Solder Joint under Rapid Thermal Fatigue." In 2020 21st International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2020. http://dx.doi.org/10.1109/icept50128.2020.9202692.

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Kanamori, Kohei, Yusaku Saito, and Akio Yonezu. "Evaluation of Interfacial Fatigue Strength of Hard Coating by Using Repeated Laser Shock Adhesion Test." In ASME 2019 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/imece2019-11145.

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Abstract This study aims to evaluate the adhesion strength and durability of hard coatings in a non-contact manner by using Laser Shock Adhesion Test (LaSAT). Both heat-treated and as-plated (non-heat-treated) Ni-P coatings deposited on carbon steel substrate by electroless plating method were prepared as specimens for this study. LaSAT uses strong elastic waves induced by pulsed laser irradiation in order to apply tensile stress to the coating/substrate interface so that interface delamination occurs. The out-of-plane displacement is also measured simultaneously by using a laser ultrasonic interferometer, and the interface delamination is detected by the change of the out-of-plane displacement waveform. Furthermore, computation of the elastic wave propagation using Finite Difference Time Domain (FDTD) is carried out to estimate the interfacial tensile stress. In addition, the adhesion durability is investigated by repetitive pulsed laser irradiation, and the relationship between the adhesion strength and the number of laser irradiation cycles until delamination was obtained. Finally, we discussed the effects of heat treatment on the adhesion strength and durability. This method of LaSAT is a quick measurement for the adhesion durability, and then it may shed some light on quality control of surface coating.
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Chen, Tung Hung, and T. I. Shih. "Usage of SAM on Fatigue Crack of Solder Joint Induced by Thermal Reliability Test." In ISTFA 2006. ASM International, 2006. http://dx.doi.org/10.31399/asm.cp.istfa2006p0228.

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Abstract Thermal fatigue cracking of lead-free solder joints within flipchip packages was investigated in this study by using scanning acoustic microscope (SAM) and SEM. The distribution of substrate delaminations was mapped with SAM of high depth resolution and observed in cross-section with SEM to find the mechanism of crack growth during thermal reliability tests. The study revealed that the interfacial crack always initiated from the pad edge. This is attributed to the coefficient of thermal expansion (CTE) mismatch between underfill and the PCB substrate. The propagation of fatigue crack within solder joint is closely related to the morphology of interfacial/intergranular intermetallic compound (IMC) formed at the elevated temperature of thermal cycle.
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Allameh, Seyed M., Avery Lenihan, Roger Miller, and Hadi Allameh. "Fatigue Properties of 3D Welded Thin Structures." In ASME 2020 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/imece2020-23135.

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Abstract Additive manufacturing technology has matured enough to produce real industrial components. A newer method of 3D printing is the deposition of molten metal beads using a MIG weld torch. This involves a 3D printer equipped with a MIG torch layering the metals in desired shapes. It allows the fabrication of components made of MIG weld wires, currently available from various elements including Cu, Al, steel and alloys. Some of these structures made by 3D welding will have applications in critical load bearing conditions. The reliability of such components will be vital in applications where human lives are at stake. Tensile tests are conducted to verify the required strength of the fabricated parts which will undergo monotonic loading; however, fatigue tests are required for cases where cyclic loading will take place. Conventional tensile and fatigue testing requires macro-scale samples. With MIG welding, it is possible to make thin-walled structures. Fatigue testing on samples extracted from thin walls is made possible by microtesting. This study is focused on the mechanical properties of 3D welded structures made from MIG welding wires. Our earlier results showed orientation dependence of mechanical properties in 3D welded structures. They also showed the effect of substrates in expression of the orientation dependence. Welding on metal substrate produces weld beads that are harder at the substrate interfacial area. However, for structures welded on ceramics, the opposite is true. They exhibit a softer substrate interfacial area and a relatively harder top. Our newer results show fatigue properties of structures made by 3D welding. Microsamples measuring 0.2 mm × 0.2 mm × 1.0 mm were extracted from metal beads using a CNC mill along with an EDM. The contours of the samples were machined by milling and the back side was cut by electro discharge machining. Specimens were then polished to the desired size and mounted in the grippers of an E1000 Instron load frame. WaveMatrix® application software from Instron was used to control the machine and to obtain testing data. Fatigue tests were performed, and life cycles were determined for various stress levels up to over 5 million cycles. The preliminary results of tensile tests of these samples show strength levels that are comparable to those of parent metal, in the range of 600–950MPa. Results of fatigue tests show high fatigue lives associated with relatively high stresses. The preliminary results will be presented and the implications of the use of 3D welded rebar in 3D printing of reinforced concrete structures will be discussed.
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9

Akutsu, Takahiro, and Qiang Yu. "Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52070.

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This paper presents the influence of the micro structure on the crack propagation in lead free solder joint. The author’s group have studied the Manson-Coffin’s law for lead free solder joint by using the isothermal fatigue test and FEM analytical approaches to establish the practicable evaluation of thermal fatigue life of solder joints, for example, for the Sn-Cu-Ni solder, because this solder is attracted from the aspect of the decrease of solder leach in the flow process and material cost. However, even if the same loading is given to the solder joints of BGA test piece, there was a large dispersion in the fatigue life. Even though the effect of the shape difference has been considered, the range of the dispersion could not been explained sufficiently. In the study, the fatigue crack propagation modes in the solder joints were investigated, and an internal fatigue crack mode and an interfacial fatigue crack mode were confirmed. And the tendency of a shorter on fatigue life in the interfacial fatigue mode was confirmed. To clarify the mechanism of these fatigue crack modes, the crystal grain size in the solder joints was investigated before the fatigue test and also after the test. Furthermore, the verification of the mechanism using FEM models considering the crystal grain size was carried out. First of all, each element in FEM models matching to the average crystal grain size was made. Second, the inelastic strain ranges in each FEM models were studied. As a result, it was shown that the influence of the crude density of the crystal grain to the fatigue crack progress can be evaluated. In addition, the micro structure of the solder joint of large-scale electronic devices is observed, and FEM model was made based on the observation result. As a result, it was shown that the influence of the directionality with the crystal grain to the fatigue crack progress can be evaluated.
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10

Yu, Qiang, Tadahiro Shibutani, Masaki Shiratori, Tomio Matsuzaki, and Tsubasa Matsumoto. "Delamination Evaluation Approach for Bimaterial Structure Considering Interfacial Layer." In ASME 2007 International Mechanical Engineering Congress and Exposition. ASMEDC, 2007. http://dx.doi.org/10.1115/imece2007-41715.

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In recent years, interfacial fracture is one of the most important issues in the assessment of reliability of electronics packaging. In particular, underfill (UF) resin is used to prevent thermal fatigue of solder joints in flip chip packaging. Interfacial fracture between components/substrates and UF resin also affects the reliability of electronic devices. In general, the interfacial strength can be evaluated with the concept of interfacial fracture mechanics. However, as new materials and new processes using in the devices increase, it becomes clear that the fracture concept is difficult to evaluate the interfacial strength quantitatively. Many researches assumed that the interface is bonded perfectly. However, the interface has the micro-scale structure and the bonding may be imperfect. Specially interfaces of the resin have complicated structure. In this study, an alternative approach for evaluating the mechanical fracture of the interfacial structure of resin in electronic components was proposed. The basic mechanical behavior of the new interfacial model with imperfect bonding layer was examined by using finite element analysis. The stress field around the interfacial layer depends not only on the properties of interfacial layer but also on the micro structure of the interfacial layer. In addition, based on the experimental result of the tensile and the shearing test from the reference, the mechanical models of the interfacial structure were constructed. The conditions of delamination were examined by using FEA Furthermore, the new model and approach was confirmed quantitatively. It was found that the basic properties of the interfacial layer can be tuned to the proper values by two different delamination tests, and the new approach could show good agreement with the experimental results from the initial delaminaiton to the instability fracture process qualitatively. The simulation results were in good agreement with the experimental results.
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