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Dissertations / Theses on the topic 'Interfacial reaction'

Author: Grafiati

Published: 4 June 2021

Last updated: 25 July 2025

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1

Matthews, Sinéad Marie. "A microfluidic investigation of interfacial reaction kinetics." Thesis, University of Cambridge, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.613334.

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2

Unwin, Patrick Robert. "Hydrodynamic electrodes and the study of interfacial reaction mechanisms." Thesis, University of Oxford, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.236340.

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3

Ling, Juliette Roseanne. "Enhancement of the interfacial transfer of iodine by chemical reaction." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp01/MQ29382.pdf.

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4

Xu, Lei. "Controlling interfacial reaction in aluminium to steel dissimilar metal welding." Thesis, University of Manchester, 2016. https://www.research.manchester.ac.uk/portal/en/theses/controlling-interfacial-reaction-in-aluminium-to-steel-dissimilar-metal-welding(721d3009-de49-434c-bd81-b01ff5973706).html.

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Two different aluminium alloys, AA6111 (Al-Mg-Si) and AA7055 (Al-Mg-Zn), were chosen as the aluminium alloys to be welded with DC04, and two welding methods (USW and FSSW) were selected to prepare the welds. Selected pre-welded joints were then annealed at T=400 - 570oC for different times. Kinetics growth data was collected from the microstructure results, and the growth behaviour of the IMC layer was found to fit the parabolic growth law. A grain growth model was built to predict the grain size as a function of annealing time. A double-IMC phase diffusion model was applied, together with gra

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5

Rhamdhani, Muhammad Akbar Brooks Geoffrey. "Reaction kinetics and dynamic interfacial phenomena in liquid metal-slag systems." *McMaster only, 2005.

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6

Baig, Fakhir U. "Effects of interfacial reaction on oil displacement in a Hele-Shaw cell." Thesis, University of Ottawa (Canada), 1993. http://hdl.handle.net/10393/7666.

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An experimental study was conducted to examine the behaviour of reactive and non-reactive systems by displacement experiments of light paraffin oil/decane mixtures by water in a range of mobility ratios. Displacement experiments were performed in a Hele-Shaw cell, simulated a quarter of a reversed five-spot pattern. Displacement patterns produced by reactive and non-reactive systems were compared. It showed that the displacement patterns in the case of the reactive system were completely different from the non-reactive system. The recovery in the reactive system was always higher than in the n

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7

Yu, Kyle Kai-Hung. "Interfacial Electrochemistry of Copper and Spectro-Electrochemical Characterization of Oxygen Reduction Reaction." Thesis, University of North Texas, 2011. https://digital.library.unt.edu/ark:/67531/metadc103416/.

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The first part of this dissertation highlights the contents of the electrochemical characterization of Cu and its electroplating on Ru-based substrates. The growth of Ru native oxide does diminish the efficiency of Cu plating on Ru surface. However, the electrochemical formed irreversible Ru hydrate dioxide (RuOxHy) shows better coverage of Cu UPD. The conductive Ru oxides are directly plateable liner materials as potential diffusion barriers for the IC fabrication. The part II of this dissertation demonstrates the development of a new rapid corrosion screening methodology for effective charac

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8

Kohler, Sven Philipp. "Dynamics of the gas-liquid interfacial reaction of O(³P) atoms with squalane." Thesis, Heriot-Watt University, 2006. http://hdl.handle.net/10399/153.

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9

Wang, Yin. "A metallurgical approach for controlling interfacial reaction in aluminium to magnesium dissimilar metal welding." Thesis, University of Manchester, 2016. https://www.research.manchester.ac.uk/portal/en/theses/a-metallurgical-approach-for-controlling-interfacial-reaction-in-aluminium-to-magnesium-dissimilar-metal-welding(baf9186c-449e-44f3-9a1e-20dfde48b966).html.

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Dissimilar welding of Al to Mg alloys could potentially find significant application in the automobile industry, if the massive production of brittle intermetallic compounds (IMCs) at the joint interface can be prevented. In order to better understand Al-Mg IMC reactions, a comprehensive investigation of the interfacial region in AA6111 - AZ31 diffusion couples was carried out in this research. Three Al-Mg binary IMCs, namely the -Al12Mg17, -AlMg and -Al3Mg2 phases, were observed to form in the Al - Mg diffusion couple. In both the Al3Mg2 and Al12Mg17 layers, residual stresses were dete

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10

De, Oliveira Cruz Mendes Tatsis Maria Alcina. "Marangoni instabilities under microgravity and in liquid-liquid systems with an interfacial chemical reaction." Thesis, Imperial College London, 1990. http://hdl.handle.net/10044/1/46279.

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11

Lyu, Ying, Mark L. Brusseau, Ouni Asma El, Juliana B. Araujo, and Xiaosi Su. "The Gas-Absorption/Chemical-Reaction Method for Measuring Air-Water Interfacial Area in Natural Porous Media." AMER GEOPHYSICAL UNION, 2017. http://hdl.handle.net/10150/626480.

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The gas-absorption/chemical-reaction (GACR) method used in chemical engineering to quantify gas-liquid interfacial area in reactor systems is adapted for the first time to measure the effective air-water interfacial area of natural porous media. Experiments were conducted with the GACR method, and two standard methods (X-ray microtomographic imaging and interfacial partitioning tracer tests) for comparison, using model glass beads and a natural sand. The results of a series of experiments conducted under identical conditions demonstrated that the GACR method exhibited excellent repeatability f

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12

Davis, Gwen Marie. "Interfacial Reaction of an Olefin-Terminated Self-Assembled Monolayer Exposed to Nitrogen Dioxide: An Investigation Into the Reaction Rate and Mechanism." Thesis, Virginia Tech, 2003. http://hdl.handle.net/10919/34927.

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Reactions of strongly oxidizing pollutants with unsaturated hydrocarbon surfaces are important to many areas of scientific interest. For example, reactions of unsaturated hydrocarbons on the surface of tropospheric aerosols could have a great effect on the oxidizing capacity of the troposphere while the reaction products could be involved in the formation of clouds and smog. These reactions are also important in understanding the toxic effect inhalation of these pollutants have on the pulmonary surfactant of the lung, the only amicable air-water interface of the body. The fatty acids of thi

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13

Dulnee, Siriwan. "Sorption and Interfacial Reaction of SnII onto Magnetite (FeIIFeIII2O4), Goethite (α-FeIIIOOH), and Mackinawite (FeIIS)". Doctoral thesis, Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2015. http://nbn-resolving.de/urn:nbn:de:bsz:14-qucosa-175316.

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The long-lived fission product 126Sn (105 years) (Weast (1972)) is of substantial interest in the context of nuclear waste disposal in deep underground repositories. However, the prevalent redox state, the aqueous speciation as well as the reactions at the mineral-water interface under the expected anoxic conditions are a matter of debate. Therefore, in this PhD thesis I present work on the reactions of SnII with three Fe-bearing minerals as a function of pH, time, and SnII loading under anoxic condition with O2 level < 2 ppmv. The first mineral, goethite, contains only trivalent Fe (FeIIIOOH)

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14

Tsubouchi, Shigetaka. "Study on Interfacial Reaction between Graphite Negative Electrode and Electrolyte Solution in Lithium-Ion Battery." Kyoto University, 2018. http://hdl.handle.net/2433/232047.

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15

McCarthy, Fiona Materials Science &amp Engineering Faculty of Science UNSW. "Interfacial phenomena and dissolution of carbon from chars into liquid iron during pulverised coal injection in a blast furnace." Awarded by:University of New South Wales. School of Materials Science and Engineering, 2005. http://handle.unsw.edu.au/1959.4/20797.

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As carbon dissolution rates have been determined for a few chars only, a systematic and comprehensive study was undertaken in this project on the dissolution behaviour of carbon from non-graphitic materials into liquid iron. In addition to measuring the kinetics of carbon dissolution from a number of coal chars into liquid iron as a function of parent coal and coal ash composition, the influence of chemical reactions between solute/solid carbon and ash oxides was also investigated. These studies were supplemented with investigations on one metallurgical coke for the sake of comparison. The wet

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16

Zhu, Wenbo. "Soldering interconnects through self-propagating reaction process." Thesis, Loughborough University, 2016. https://dspace.lboro.ac.uk/2134/23259.

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This thesis presents a research into the solder interconnects made through the reactive bonding process based on the self-propagating reaction. A numerical study of soldering conditions in the heat affected zone (HAZ) during bonding was initially carried out in order to understand the self-propagating reactive bonding and the related influencing factors. This was subsequently followed by an extensive experimental work to evaluate the feasibility and reliability of the reactive bonding process to enable the optimisation of processing parameters, which had provided a detailed understanding in te

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17

Perrodin, Marion. "Modélisation et simulation numérique du couplage entre hydrodynamique et réactions chimiques dans du verre fondu peuplé en microbulles." Thesis, Toulouse, INPT, 2011. http://www.theses.fr/2011INPT0108/document.

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Lors de la fusion du verre, de nombreuses petites bulles de gaz sont produites. L’affinage du verre a pour objectif de faire disparaitre ces bulles par l’ajout d’espèces réactives contribuant à la résorption des bulles ou à une augmentation de leur taille. La modélisation de l’hydrodynamique et des transferts nécessite l’étude des couplages entre convection, diffusion et réaction. Une approche locale à l’échelle de la bulle (simulation directe du transfert réactif et de l’écoulement) est utilisée pour déterminer le transfert interfacial. Des mesures de la propagation de fronts d’oxydation dans

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18

Payyapilly, Jairaj Joseph. "Formation And Growth Mechanisms of a High Temperature Interfacial Layer Between Al and TiO2." Diss., Virginia Tech, 2008. http://hdl.handle.net/10919/29733.

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The product of interaction between Al and TiO2 at elevated temperature has a wide range of applications in refractory, structural and electronics industries (refractory tiles, tank armor, fuel cells, and microelectronic devices). This research attempts to understand the extent of interaction between Al and TiO2 when the reactant surfaces are in contact at elevated temperature and normal atmospheric pressure. The interfacial region between the reactant compounds is examined using analytical techniques; and the formation of TiAl as the interfacial compound is described. The thermodynamics of the

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19

Chen, Yi-Ling, and 陳俋菱. "Interfacial Reaction of Ag/In." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/50691047714701086600.

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20

Chang, Jer-Min, and 張哲銘. "Interfacial reaction between NiCu alloyand Sn3Ag solder." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/31941990208634325126.

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碩士<br>國立中央大學<br>化學工程與材料工程研究所<br>93<br>ABSTRACT Diffusion barrier plays an important role in soldering, it can prevent fast reaction between tin and copper. Beside nickel and platinum, nickel-copper alloy is a possible diffusion barrier in the future. In the past, our labortoary investigated liquid/solid reaction between SnAgCu solder and nickel, it found that little copper added in solder can reduce consumption of nickel. Additionally, intermetallic compound at interface can also changed with copper added in solder. In the experiment, we electroplated nickel-copper alloy on copper and inv

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21

Yang, Ching-feng, and 楊青峰. "Surface Finish and Interfacial Reaction in Flexible Electronics." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/93582417365170636672.

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博士<br>國立清華大學<br>化學工程學系<br>98<br>Flexible electronics have recently attracted very intensive studies because they are thinner, lighter, and more flexible. Similar to other electronic products, flexible electronics products comprise numerous devices and modules. The interconnection technologies of these devices and modules to the flexible substrates are crucial for manufacturing. Two metallic interconnection technologies, Au-Sn bonding and soldering, are frequently used in flexible electronic packaging. Thus, interfacial reactions in the two interconnections with different surface finishes a

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22

Chi, Shang-Wei, and 紀尚緯. "Interfacial Reaction in Electroplated Cu/Ni/Sn System." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/87495446472521833248.

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碩士<br>國立中興大學<br>化學工程學系所<br>105<br>In this study, the electroplating copper substrate and tin, electroplating copper substrate electroplating nickel and tin two kinds of reaction comparison, and in the copper electroplating solution by adding the additive SPS for further comparison. The experimental results show that Cu / Sn mainly produces IMC as Cu6Sn5 in the reflow soldering reaction, and Ni(Ni, Cu)3Sn4 is formed after electroplating the Ni layer. No holes are present in the interface. The presence of SPS does not affect the results. In the heat treatment at 150°C, Cu / Sn forms Cu3Sn in add

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23

Wang, Yu-Ju, and 王郁茹. "The Interfacial Reaction between Silver Electrode and Glass Ceramics." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/09893492969128357985.

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碩士<br>國立臺灣大學<br>材料科學與工程學研究所<br>93<br>In this research, the reaction layers produced from silver electrode cofired with La-Si-B-O-mullite (LSBM) or Mg-Si-B-Al (MSBA) glass ceramic composites in different sintering conditions were analyzed, and the controlled mechanism was investigated. The grown phases were characterized by X-ray diffractometry (XRD), and the microstructures were studied by scanning and transmission electronic microscopy (SEM and TEM). In order to study the phenomenon of Ag diffusion into the LSB glass in air, the D-LSBM/Ag laminated samples was sintered at 760oC-840oC and

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24

KE, SUN-JIAN, and 柯孫堅. "Investigation of interfacial reaction between metal silicides and GaAs." Thesis, 1989. http://ndltd.ncl.edu.tw/handle/16799636275077704271.

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25

Li, Cheng-Chieh, and 李澄傑. "Volume Shrinkage Induced by Interfacial Reaction In Micro Joints." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/82765863623943124198.

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博士<br>國立臺灣大學<br>材料科學與工程學研究所<br>102<br>Imminent ending of Moore’s law is the most critical issue threatening the continuing development of semiconductor industry. The strategy of consensus in order to go beyond Moore’s law is through the Three-Dimensional Integrated Circuit (3D IC) architecture. Among many 3D IC integration schemes under development today, solder micro-bumping is a very promising one. Due to the extremely small size of solder joints in 3D IC packages, interfacial reaction features are quite different to that in the conventional solder joints. The space confinement behavior must

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26

Ye, Shan, and 葉珊. "Interfacial Reaction Between Solder Tin and Bismuth Telluride Substrate." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/49389177542530061773.

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碩士<br>國立中興大學<br>化學工程學系所<br>102<br>Because of no moving parts, small size and noiseless operation, thermoelectric (TE) materials have drawn much attention and be wildly used recently, among which, bismuth Telluride is best known for its great thermoelectric ability of converting heat to electricity at room temperature. Lots of researches are emphasizing on improving the conversion efficiency of TE materials, i.e. figure-of-merit, but only few are on the solder joints reliability of the thermoelectric device. Actually, “reliability” is the key point to prolong the lifetime of a thermoelectric de

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27

Huang, Kuan-Yu, and 黃冠育. "Interfacial Reaction of Different Solders in Solar Cell Interconnect." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/19790384386205962684.

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28

Chen, Chun-Wei, and 陳駿維. "Interfacial reaction between Sn(Cu) solder and NiCo alloy UBM." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/49636679478494714528.

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碩士<br>國立中央大學<br>化學工程與材料工程研究所<br>97<br>In the work, we study soldering reaction between Ni-Co alloy layer and Sn(Cu) Pb-free solders. Different Co concentrations in Ni-Co alloy layer were electroplated on Cu foils. Then, Sn(Cu) solders were reflowed on the Ni-Co alloy layers at 250 ℃ to investigate the growth situation and morphology of IMCs and to discuss the effect of Co concentration and Cu concentration on the reaction between Sn(Cu) and Ni-Co layer. Experimental results show that when the composition of NiCo alloy are Ni, Ni-20at%Co, Ni-63at%Co and Co, the corresponding IMCs formed at

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29

Yeh, Yu-ting, and 葉昱廷. "Current density effect on the interfacial reaction between Sn5Ag/Cu." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/51684119480342750917.

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碩士<br>國立中央大學<br>化學工程與材料工程研究所<br>96<br>Under 130℃ heat treatment, we concern about the interfacial reaction between Sn5Ag solder and investigate the Cu consumption behavior and the formation of intermetallic compound. We obtain that , the diffusion coefficient under 130℃ is about D=1.48×10-13 (cm2/s). Further, we investigate the interfacial reaction between Sn solder and Cu and also Sn5Ag solder and Cu under different current densities. And explain the Cu consumption behavior and the formation of intermetallic compound by flux. Cu consumption at cathode side is due to Cu atom transported to ano

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30

Yang, Ji-Jyun, and 楊吉駿. "The Interfacial Reaction Investigation Between Sn-3.5Ag and Ni Substrate." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/45369287072958447229.

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碩士<br>義守大學<br>材料科學與工程學系碩士班<br>98<br>In order to understand the mechanism of intermetallic compounds (IMCs) formation and growth between Sn3.5Ag solder and Fe-Co-Ni substrate and their effects with reliability, this study would experience multiple reflows and high temperature storage, to observe the growth of IMCs and the mechanism of voids growth, and further explorer the relationship among them. After Sn-3.5Ag solder and Fe-Co-Ni substrate bonding reaction, the Ni3Sn4 IMCs formed at the interface, and the Ni3Sn4 IMCs with a little Co elements of Ni solubility；and the solder in Co、Ni element d

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31

Li, Kuan-Yang, and 李冠洋. "A Study of the Interfacial reaction between Ni and Sn." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/18409103019290778774.

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碩士<br>國立中山大學<br>材料與光電科學學系研究所<br>100<br>The orientation relationship and interfaces of Ni3Sn4 and Ni3Sn2 with the Ni (001) and (111) surfaces have been studied with transmission electron microscopy. Ni was evaporated onto the NaCl (001) and (111) surfaces to form epitaxial Ni thin films and Sn was evaporated onto the Ni film and heat treated to form Ni3Sn4 and Ni3Sn2. No orientation relationship between Ni3Sn4 and Ni was found. Two types of orientation relationships between η-Ni3Sn2 and Ni were found: (1) (0002) η-Ni3Sn2//(220)Ni and (01 0) η-Ni3Sn2//(2 0)Ni on the (2 0) η-Ni3Sn2/(001)Ni interf

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32

Fang, Yuang-shing, and 方爰心. "A Study of the Interfacial reaction between Pt and Sn." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/77067005506445670841.

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碩士<br>國立中山大學<br>材料與光電科學學系研究所<br>100<br>The orientation relationship and interfaces of PtSn4 and PtSn with the Pt (001) and (111) surfaces have been studied with transmission electron microscopy. Pt was evaporated onto the NaCl (001) and (111) surfaces to form epitaxial Pt thin films and Sn was evaporated onto the Pt films at different temperature to form PtSn4 and PtSn. Pt was evaporated onto the NaCl (001) and (111) surfaces at 350 ℃ to form epitaxial Pt thin films of [001] and [111] zone axes, respectively. Some grains are in random orientation and other as ring pattern. The grain size was a

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33

Lo, Li-Chen, and 羅立晨. "Interfacial Reaction between Diffusion Barrier and Thermoelectric Materials under Current." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/56115317675735653569.

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碩士<br>國立中央大學<br>化學工程與材料工程研究所<br>100<br>This research investigated the interfacial reaction between the diffusion barrier, Ni, and the thermoelectric materials. Ni is a good barrier between Pb-free solder and n-type bismuth telluride (Bi2Te2.7Se0.3) thermoelectric material to prevent the rapid formation of brittle SnTe intermetallic compound (IMC). We use sandwich structure Sn/Ni-P/n-Bi2Te3/Ni-P/Sn to simulate the interfacial reaction under current. The depletion of diffusion barrier and the formation of intermetallic compound (IMC) will be concerned. Different current densities were applied to

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34

Tsai, Jung-Ting, and 蔡榮庭. "Interfacial reaction and electrical performances between silver paste and silicon substrate." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/b2j5hk.

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碩士<br>國立臺灣科技大學<br>機械工程系<br>100<br>Since the silver paste plays a major role in the mass production of silicon solar cells, this research has studied its physical characteristics. This research has succeeded in optimizing the silver paste in 80 wt%~85 wt% and controlling its particle size in 1~1.5 μm spherical powder. As the firing temperature is increased, the growth trend of silver grain is improved. The result has showed that the lowest sheet resistance is 4 mΩ/sq during the 860°C sintering process. The SEM observation has showed that the formation of silver oxide is formed during the meltin

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Wei-ShiuanWu and 吳維軒. "Investigation of interfacial reaction and microstructure of high temperature solder joint." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/7cx8w6.

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碩士<br>國立成功大學<br>機械工程學系<br>103<br>This research is to discuss the 95Pb-5Sn microstructure and solid/solid interfacial microstructure variation of 95Pb-5Sn solder combining with Ni/Cu UBM. Diffusion barrier Ni layer was coating on copper rods by electroless plating. Using the solders to join two rods whose diameter is 1.5mm. Those solder joints are stored isothermally at 200℃for up to 400 h and evaluate different thickness (2μm、1μm、0.5μm) of diffusion barrier prevent reaction between tin and copper ability and the tensile strength of solder joint. Experimental results show that the β-Sn precipi

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36

Chiang, Yu-Yen, and 江昱彥. "The Interfacial Reaction of SnAgIn Pb-Free Solder on Cu Substrates." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/53580872795950616260.

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碩士<br>國立中央大學<br>材料科學與工程研究所<br>99<br>This thesis investigated the interfacial reaction between Sn-Ag-In lead-free solder and Cu substrates. Two composition of solder, 94Sn-3Ag-3In and 80Sn-3Ag-17In, were employed. the addition of indium decreases the melting point of 94Sn-3Ag-3In and 80Sn-3Ag-17In to 214.7 and 193.3℃, respectivily. When increaseing the amount of indium, the pasty range increases. due to partial melting of solder. The amount of Sn affects the undercooling despite the amount of external additives. The interfacial intermetallic compound are Cu6(Sn,In)5 in Sn-Ag-In system solder an

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37

Chen, Jun-Yuan, and 陳俊元. "The Research of Lead-Free Solder Interfacial Reaction in UCSP Package." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/66308816564115066870.

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碩士<br>義守大學<br>材料科學與工程學系<br>92<br>In this research, the basic properties、microstructures and the aging effects of Sn-0.7Cu、Sn-2.6Ag-0.6Cu、Sn-4.0Ag-0.5Cu lead-free solder balls and conventional Sn-Pb solder ball are investigated. In addition, commercial Ultra CSP 98L device with above mentimed solder balls and Sn-Pb、Sn-3.0Ag-0.5Cu、Sn-7Zn-Al（30-40ppm）paste are placed on OSP and NiAu PCB. After reflow, samples are gone through TCT and HTS reliability tests. DSC、SEM/EDX、EPMA/WDX are then utilized to study the mechanism of the IMC formation on the interface of the solder joints and the relations

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38

Chen, Wan-Ching, and 陳琬菁. "Interfacial reaction of the Ni/Sn-xZn/Cu sandwich structure couples." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/43631592900081581432.

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碩士<br>國立臺灣科技大學<br>材料科學與工程系<br>101<br>In this study, the Sn-Zn alloys were used as the solders because of its low cost and the melting point is closer to the conventional Sn-Pb solder. However, BGA and FC technology are two of the mainstreams applied to the electronic packaging widely, and the Ni/solder/Cu structure is the most common one. Therefore, this study demonstrates interfacial reaction of the Ni/Sn-xZn/Cu sandwich structure couples, the purpose is to investigate whether the Zn content of the Sn-Zn alloy, inter-diffusion between Cu and Ni atoms and the thickness of the solders will effe

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39

Liu, Pei-Chi, and 劉培基. "The interfacial reaction between Sn-Zn series solders and Ag substrate." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/82957039372385593735.

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碩士<br>國立成功大學<br>材料科學及工程學系碩博士班<br>92<br>The drawbacks of Sn-Zn based solders could be improved by alloying modification. This study investigated the effect of various alloying elements, Al, Ag and Ga, on the wetting behavior between the Sn-Zn based solders and Cu/Ag substrates. On the other hand, the interfacial reaction between the Sn-Zn based solders and Ag substrate were rarely studied before. The solid-liquid and solid-solid reactions of Sn-Zn based solders were also investigated, and the intermetallic compounds (IMCs) formed at interface were identified and the growth behaviors were discus

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Farner, Budarz Jeffrey Michael. "Lights, Camera, Reaction! The Influence of Interfacial Chemistry on Nanoparticle Photoreactivity." Diss., 2016. http://hdl.handle.net/10161/13369.

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<p>The ability of photocatalytic nanoparticles (NPs) to produce reactive oxygen species (ROS) has inspired research into several new applications and technologies, including water purification, contaminant remediation, and self-cleaning surface coatings. As a result, NPs continue to be incorporated into a wide variety of increasingly complex products. With the increased use of NPs and nano-enabled products and their subsequent disposal, NPs will make their way into the environment. Currently, many unanswered questions remain concerning how changes to the NP surface chemistry that occur in natu

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Chang, Chih-Chiang, and 張智強. "Dissolution and Interfacial Reaction between Cu and Sn-Ag-Cu Solders." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/28516702026379155360.

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碩士<br>國立中央大學<br>化學工程與材料工程研究所<br>95<br>In electronic packing, the dissolution of thin film under-bump metallizations (UBMs) and surface finishes in molten lead-free solders is one of the most important processing concerns. Due to a higher melting temperatures and richer Sn content, molten lead-free solder such as SnAgCu tend to dissolve the UBMs and surface finishes at faster rates than the eutectic SnPb. The SnAgCu solder are a series of lead-free solders with broad compositions. The OSP/Cu surface finish is the most common and important for solder pad and bumps in industry now. One of the imp

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Huo, Cheng-Bang, and 霍正邦. "Investigation of Interfacial Reaction Between Various Optical glasses and Mold Materials." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/25299830787160714410.

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碩士<br>淡江大學<br>機械與機電工程學系碩士班<br>95<br>Glass molding process is considered to have great potential of mass producing various spherical/aspherical glass lenses to a higher achievable accuracy and at a lower cost. However, glass molding has its own problems to deal with such as glass stuck on the mold surfaces and chemical interaction between glass and mold materials. During the molding process mold surfaces have to experience cyclic mechanical and thermal loading. This research aimed to investigate the interaction between various optical glass and mold materials at elevated temperature with/withou

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Wu, Jia-rong, and 吳佳融. "Effect of applied stress on copper/tin thin film interfacial reaction." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/01014820293746296698.

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碩士<br>中興大學<br>化學工程學系所<br>95<br>With the electronic products becoming small, thin and light, the flip-chip technology is the trend of the package because of its small package size and excellent performance. The interfacial reaction between solder bump and under bump metallization is one of the important subjects in the flip chip reliability concerns. But at the process of microelectronic packaging, the electronic products that could be affected by the environment of the packaging and the property of products’s material could be strain. In this study, effect of applied stresses on the copper/tin

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Su, Tien-min, and 蘇天民. "Core-Shell Nanoparticles Prepared by Interfacial Redox Reaction in SDS Microemulsion." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/19157701671279478257.

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Chen, Zhao-Ming, and 陳昭銘. "The study of interfacial reaction between SnBi solder and Au substrate." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/mbjuaq.

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碩士<br>國立臺北科技大學<br>化學工程研究所<br>96<br>The interfacial reaction between Sn-Bi solder and Au substrate grows Sn-Au intermetallic compound (IMC) mainly. The constituent of IMC depends on the composition (wt%) of Bi in the solder. When the weight percent of Bi is more than eutectic composition (57wt%), AuSn and AuSn2 would be found at interface. When the composition of Bi is 50wt%, a Sn-Au-Bi ternary metastable compound was formed and after longtime aging or the reaction temperature was increased, the ternary compound will become AuSn4. That means AuSn、AuSn2 and AuSn4, three different Sn-Au IMC will

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Tsai, Yu-Cheng, and 蔡育成. "A study of the interfacial reaction in a Ta2N/Si(100) system." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/52641978658800739493.

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碩士<br>國立臺灣科技大學<br>機械工程系<br>92<br>We studied the thin film structure and interfacial reaction of tantalum nitride deposited on a Si(100) wafer with a diameter of 12 inches. The tantalum nitride film was obtained by a sputtering method. The thickness of the film was about 30 nm. After the tantalum nitride film was formed, annealing processes were carried out in a tube furnace with a vacuum level of 5 × 10-5 torr. The samples were annealed at temperatures ranging from 500, 600, 800, 900, and 1000oC for one hour in the vacuum furnace and cooled by furnace cooling. We studied the propert

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Hsu, Andrew Chia-Ming, and 許家銘. "A generalized phenomenological model for the effect of electromigration on interfacial reaction." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/16171356103196698710.

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Chung, Chee-Key, and 鄭子企. "Analysis of interfacial reaction during the formation of Pb-free solder joint." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/72797021008479385612.

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博士<br>國立臺灣大學<br>材料科學與工程學研究所<br>101<br>This research analyzed the interface of solder joint during the soldering process. It separated into four parts. Part I focused on early melting of the solder joint. The dominant mechanism for the growth of Cu6Sn5 and Cu3Sn at the early stage was investigated using Sn4.0Ag0.5Cu solder reflowed on Cu. A thin layer of Cu3Sn (80~90 nm) was observed between Cu6Sn5 and Cu even though the temperature was as low as 217.4 °C. High-resolution transmission electron microscopy (TEM) identified Cu-enriched regions at phase boundaries between Cu6Sn5 and Cu3Sn. Such reg

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Huang, Wei Chia, and 黃偉嘉. "Effect of Magnesium on Interfacial Reaction and Microstructures of Lead-Free Solders." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/54941699909492275806.

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碩士<br>國立雲林科技大學<br>機械工程系碩士班<br>99<br>Adding magnesium alloy in Sn-3Ag-0.5Cu lead-free solders alloy can effectively improve the wettability of the solders. It can directly wet many materials which are difficult to be wetted, such as ceramics, glass, aluminum or magnesium alloys. Magnesium reacts with tin in solders to form Mg2Sn and (Ag,Mg)3Sn intermetallic compounds. The intermetallic compounds cause tin whisker abnormal growth. As inner stress is increased, the amount of tin wisker will be increased. The amount and length of tin whisker will increase with the increase of aging temperature and

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chen, Chien-hao, and 陳建豪. "Interfacial reaction between the As-Si-Te chalcogenide glasses and optical substrates." Thesis, 1999. http://ndltd.ncl.edu.tw/handle/09279420059411089703.

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