Journal articles: 'Intermetalicum'

1

Chen, Jiang, Guang Ze Dai, Jun Wen Zhao, Xing Min Huang, and Jing Han. "Optimization of Process Parameters of Hot-Dip Aluminized Coating." Advanced Materials Research 391-392 (December 2011): 46–50. http://dx.doi.org/10.4028/www.scientific.net/amr.391-392.46.

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The hot-dip aluminized process parameters with respect to the thickness and microstructure of intermetalic layer were investigated using a uniform design of experiments. The measured thickness of intermetalic layer was regressed as first- to third-order polynomial equations of four related parameters, i.e. hot-dip temperature, hot-dip time, diffusion treatment temperature and diffusion treatment time. It was found that the third-order regressed equation was acceptable and appropriate to identify the influences of the investigated parameters on the thickness of intermetalic layer. Comprehensive analysis of the results based on the regressed equation and microstructure could supply believable and optimized process parameters.

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Hariyanto, Agus Hadi, Triyono Triyono, and Agus Supriyanto. "PENGARUH TEMPERATUR TERHADAP SIFAT FISIK MEKANIK PADA SAMBUNGAN DIFUSI LOGAM TAK SEJENIS ANTARA SS400 DENGAN Al6061." ROTASI 17, no. 2 (April 1, 2015): 57. http://dx.doi.org/10.14710/rotasi.17.2.57-66.

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Diffusion welding on the disimilar metal between steel SS400 and aluminum Al6061 by using induction furnace, the temperature variation and filler variation. Temperature variations that are used 850⁰C, 875⁰C and 900⁰C. Filler that is used Fe and Cu powders, in variations filler Fe / Cu: 70/30%, 75/25%, 80/20%, on 30 minutes holding time. The results shows there is the presence of intermetallic layers in the temperaturs. Results of Scanning Electron Microscop (SEM), good diffusion process occurs on temperatures 850⁰C and filler variations Fe: 75%, Cu: 25%. It occurs interface bonding steel and aluminum on diffusion area. Interface bonding steel and aluminum will produces intermetalic layer Fe2Al3. The results of good hardness distribution occurs on 900⁰C filler variations Fe: 75%, Cu: 25%. It occurs intermetalic layer formation on diffusion area. Intermetalic layer formation is influenced by heat treatment and diffusion of Fe atoms and Cu atoms. The higher the heat treatment, the harder the Cu atoms. So it will affect the hardness intermetalic layer. By the higher heat treatment, the microstructure of the coating intermetalic will be so close. The more tightly layered arrangement intermatalic blistering effect on shear test. The results of tensile shear testing, high voltage value occurs on 900⁰C filler variations Fe: 75%, Cu: 25%. It is influenced by a continuous heating process, thus causing the Cu atoms will be hard. With high heat, Fe atoms will diffuse to the base metal aluminum and copper atoms will diffuse to the base metal and Al6061 SS400. So that the Fe and Cu atoms will bond with the base metal that affects the mechanical properties.

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Nozaki, Yoshihiko. "Injection Molding of Intermetalic Compounds Powder." Bulletin of the Japan Institute of Metals 31, no. 8 (1992): 720–24. http://dx.doi.org/10.2320/materia1962.31.720.

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4

Oki, A., H. Hori, M. Furusawa, M. Kurisu, S. Yamada, Y. Andoh, S. Mitsudo, and M. Motokawa. "Magnetoresistance and magnetization in intermetalic compound RNiSn." Czechoslovak Journal of Physics 46, S4 (April 1996): 2019–20. http://dx.doi.org/10.1007/bf02571001.

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5

Palanichamy, P., M. Sivabharathy, K. Jeyadheepan, P. Kalyanasundaram, K. Ramachandran, and C. Sanjeeviraja. "Ultrasonic, Metallographic and Photo Acoustic Studies on Zircaloy-2." Materials Science Forum 699 (September 2011): 123–30. http://dx.doi.org/10.4028/www.scientific.net/msf.699.123.

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The nuclear material, Zircaloy-2 is studied here by photoacoustics and the results are correlated with ultrasonic measurements and metallographic microstructures. Precipitation of hard intermetalics and formation of α-martensite, due to thermal aging are also explained through photoacoustic studies.

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Chen, Y. A., Cosme Roberto Moreira Silva, and D. Michael Rowe. "Synthesis of PbTe Intermetalic Compound by Mechanical Alloying." Materials Science Forum 660-661 (October 2010): 347–52. http://dx.doi.org/10.4028/www.scientific.net/msf.660-661.347.

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The formation of PbTe intermetallic compound by mechanical alloying (MA) has been investigated. The elemental starting materials were 99.5% pure lead and tellurium, with a sieve size of 80 and 200 mesh, respectively. A SPEX 8000 shaker milling was used to perform the MA, using WC balls as milling media in a cylindrical hardened tool steel vial. X-ray diffraction analysis was performed with a profile-fitting program, to evaluate time evolution of the alloy formation. An exotermical reaction occurs on PbTe formation, with entalphy H= - 16.3 Kcal/mol. The *T value is confirmed by the heat exchange equation *Q = |*Hf | =* i (mici ) *T, where the summation comprises the mass and specific heat of vial, balls and powder material. For the standard milling conditions employed, the PbTe formation occurs at aproximately 90 seconds of milling, when using charge ratios between 3:1 and 7.5:1. However, for lower charge ratios (8:1 to 10:1), isolated reactions at the mixture occurs, but the amount of material is not enough to raise the temperature of adjacent regions, and the propagation of the reaction is avoided. There is therefore a minimum amount of powder (“critical mass”), and below this value the reaction will not be self-sustained.

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Ben-Hamu, Guy, D. Eliezer, and Kwang Seon Shin. "Studies on the Influence of Chloride Ion Concentration on the Corrosion Behavior of ZSMX Magnesium Alloy." Advanced Materials Research 95 (January 2010): 47–50. http://dx.doi.org/10.4028/www.scientific.net/amr.95.47.

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The paper presented reveals the influence of chloride ion concentration on the corrosion and electrochemical behavior of new ZSMX wrought magnesium alloy in NaCl solution. The experimental techniques used include potentiodynamic polarization tests. The corrosion rate usually increased with the increase in chloride ion concentration. This result can be explained by the distribution of intermetalics.

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Pankratov, N. Yu, V. I. Mitsiuk, V. M. Ryzhkovskii, and S. A. Nikitin. "Direct measurement of the magnetocaloric effect in MnZnSb intermetalic compound." Journal of Magnetism and Magnetic Materials 470 (January 2019): 46–49. http://dx.doi.org/10.1016/j.jmmm.2018.06.035.

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OGINUMA, Hideki, Katsuyoshi KONDOH, Eiji YUASA, and Tatsuhiko AIZAWA. "605 Reaction behavior in formation of Mg_2Sn intermetalic from powder." Proceedings of the Materials and processing conference 2001.9 (2001): 235–36. http://dx.doi.org/10.1299/jsmemp.2001.9.235.

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10

Chlubny, Leszek, Jerzy Lis, and Mirosław M. Bućko. "SHS Synthesis of the Materials in the Ti-Al-C-N System Using Intermetallics." Advances in Science and Technology 45 (October 2006): 1047–51. http://dx.doi.org/10.4028/www.scientific.net/ast.45.1047.

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Materials in the Ti-Al-C-N system due to their specific heterodesmic structure show pseudo-plastic properties. Direct synthesis of these compounds from respective elements requires high-temperature and long-lasting reaction. Presented work shows attempts to prepare some ternary compounds using self-propagating high-temperature synthesis (SHS). Intermetalic precursors, TiAl and Ti3Al, were used to synthesize fine and sinterable powders of 211 and 312 complex structure materials.

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11

Kovalenko, Vadym, Denis Kondratyev, Valerii Kotok, Olga Chernova, Ihor Kovalenko, Sergey Zhykovin, Viktor Ved, and Volodymyr Verbitskiy. "DETERMINATION OF FORMATION REGIMES FOR BILAYER COBALT DYSPROSIUM INTERMETALIC SURFACE ALLOY." EUREKA: Physics and Engineering 6 (November 30, 2019): 3–8. http://dx.doi.org/10.21303/2461-4262.2019.001011.

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High tech industrial fields on modern development stage are in need of construction materials with an optimal ratio of volume and surface properties, along with low cost of material itself. As evidenced by studies, in order to give a set complex of properties to a workpiece that operates under specific conditions, it is often sufficient to only modify its surface area. Over the course of studies, by means of gravimetric, influence of technological parameters (temperature and time samples are kept in the melt) on specific mass change of cobalt samples, that act as substrate, during electroless diffusive saturation with dysprosium in eutectic melt of lithium and potassium chlorides have been studied. A mathematical dependency was established for specific mass change of cobalt samples on time spent in melt for temperature range of 873–973 K. Composition of intermetallic coats obtained on surface of cobalt samples was studied means of EDX and SEM analyses. It was discovered, that for chosen temperature range, diffusion layers formed on surface of cobalt samples consists of two structural zones that correspond to Co-Dy and Cp2Dy phases.

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12

Князев, Ю. В., and Ю. И. Кузьмин. "Оптические свойства соединений YFe-=SUB=-2-=/SUB=- и TbFe-=SUB=-2-=/SUB=-." Физика твердого тела 62, no. 7 (2020): 1004. http://dx.doi.org/10.21883/ftt.2020.07.49463.033.

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Ellipsometric investigation of the optical properties of YFe2 and TbFe2 intermetalic compounds have been carried out in wavelength range of 0.22 –15 μm. A number of electronic and spectral characteristic was determined. Nature of interband light absorption in these materials is discussed on base of comparative analyses of experimental and theoretical optical conductivity spectra. Experimental optical conductivities of the compounds are shown to conform qualitatively to spectra calculated from densities of electronic states in the region of quantum electron transitions.

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13

Borisov, Yu S., A. L. Borisova, N. V. Vihilyanska, I. A. Demyanov, and O. M. Burlachenko. "Electric arc spraying of intermetalic Fe–Al coatings using different solid and powder wires." Paton Welding Journal 2021, no. 3 (March 28, 2021): 16–21. http://dx.doi.org/10.37434/tpwj2021.03.03.

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14

Małecka, J. "Oxidation Activation Energy of Titanium Alloy Based on TiAl(γ) Intermetalic Phase." Advances in Materials Science 18, no. 2 (June 1, 2018): 5–14. http://dx.doi.org/10.1515/adms-2017-0027.

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AbstractThe present paper deals with the analysis of the course of oxidation of the cyclic Ti-46Al-7Nb-0.7Cr-0.1Si-0.2Ni alloy in a hot air atmosphere in the temperature range of 875-975°C. The constant rates of the oxidation were determined (separately for the first and second stages of oxidation) and the energy of oxidation activation of the tested alloy was established. It was discovered that the oxidation process of the Ti-46Al-7Nb-0,7Cr-0.1Si-0.2Ni alloy develops according to the parabolic correlation, and it is only possible to determine the apparent energy of oxidation activation.

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15

Öner, Y., and S. Avci. "Electronic and Magnetic Properties of Pt Based Intermetalic LaPtAs and LaPt2As Compounds." Journal of Electronic Materials 48, no. 4 (January 18, 2019): 2200–2208. http://dx.doi.org/10.1007/s11664-019-06934-z.

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16

Miura, Yuki, Yasuyuki Kaneno, Takayuki Takasugi, and Atsushi Kakituji. "Characterization of Ni3(Si,Ti) intermetalic alloys synthesized by powder metallurgical method." MRS Proceedings 1516 (2013): 121–26. http://dx.doi.org/10.1557/opl.2013.109.

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ABSTRACTA Ni3(Si,Ti) intermetalic alloy was synthesized by the powder metallurgy method using elemental powders. The raw powder mixtures with various compositions were sintered by a spark plasma sintering apparatus and then homogenized at high temperatures. Microstructure, hardness, tensile properties and density of the sintered alloys were investigated as functions of the chemical composition and sintering temperature. It was found that a highly-densified Ni3(Si,Ti) sintered alloy was obtained by choosing proper chemical composition and sintering temperature. Also, the Ni3(Si,Ti) sintered alloy with an L12 single-phase microstructure exhibited high hardness and tensile strength.

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17

Nourbakhsh, Z., and A. Pourghazi. "First principles calculation of electric and magnetic properties of UIn3 intermetalic compound." physica status solidi (c) 3, no. 9 (September 2006): 3292–96. http://dx.doi.org/10.1002/pssc.200567120.

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18

Besterci, M., J. Ivan, P. Kulu, D. Arensburger, and O. Velgosova. "Model of fracture micro mechanism of Cu-Cr-Zr system by in-situ tensile test in SEM." Journal of Mining and Metallurgy, Section B: Metallurgy 39, no. 3-4 (2003): 499–507. http://dx.doi.org/10.2298/jmmb0304499b.

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In the present work fracture mechanism of the Cu-Cr-Zr system was studied by "in-situ tensile test in SEM". It has been shown, that during tensile strain over the critical deformation the first cracks appeared due to the decohesion of matrix - large Cr particles interphase or by Cr particles failure. The further stress increase causes the cracks formation on matrix small Cr particles interfaces and in the clusters of Cu5Zr intermetalics. The trajectory affinal fracture was formed preferably by coalescence of cracks oriented about 67? to the loading direction. The model, presenting fracture mechanism in the investigated system was suggested.

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19

Ballas, M., H. Song, and O. J. Ilegbusi. "Effect of thermal conductivity on reaction front propagation during combustion synthesis of intermetalics." Journal of Materials Science 41, no. 13 (July 2006): 4169–77. http://dx.doi.org/10.1007/s10853-006-6751-0.

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20

Rocha Cabrera, R., C. V. Landauro, and J. Quispe Marcatoma. "Estudio estructural y microestructural de la aleación AlxFe1−x (x=0.25; 0.5 y 0.75) obtenida por molienda mecánica." Revista de Investigación de Física 22, no. 2 (May 3, 2021): 1–8. http://dx.doi.org/10.15381/rif.v22i2.20288.

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Las aleaciones de Fe-Al en las composiciones Al25Fe75, Al50Fe50 y Al75Fe25 fueron sintetizado por la técnica del horno de arco y luego tratando térmicamente ha 6000C. El difractograma de rayos X (DRX) y la espectroscopia Mössbauer (EM) muestran la formación de la solución sólida Fe(Al) rica y pobre en átomos de aluminio. A 10 horas de molienda mecánica se observa la formación de la maghemita γ − Fe2O3(Al) para las composiciones Al25Fe75 y Al50Fe50 con átomos de aluminio ocupando algunos sitios de hierro. En el caso de la composición Al75Fe25 se observa el intermetalico Al13Fe4, permaneciendo estructuralmente invariante durante el proceso de nanoestructuración.

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21

Sun, Xian Ming, Jian Li, Gui Rong Yang, Wen Ming Song, and Ying Ma. "The Microstructure of Ni/ZrO₂ Infiltrated Composite Layer." Advanced Materials Research 314-316 (August 2011): 236–39. http://dx.doi.org/10.4028/www.scientific.net/amr.314-316.236.

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The Ni/ZrO2 composite powder was used as raw materials to fabricate the surface infiltrated composite layer on cast steel substrate through vacuum infiltrated casting technology. The microstructure indicated that the infiltrated composite layer included surface composite layer, Ni-based alloying layer and diffusion transition layer. The thickness of diffusion transition layer deceased with the increasing thickness of preform. The surface infiltrated composite layer was composed of ZrO2 ceramic particles, Cr2B and NiB intermetalic compounds as well as Ni-based solid solution. The Ni-based solid solution and Fe-based solid solution was the main composition for diffusion transition layer. The change of micro-hardness of surface infiltrated composite layer presents gradient from surface of infiltrated layer to substrate.

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22

Srigiofun, Pajaree, Panyawat Wangyao, Gobboon Lothongkum, and Ekasit Nisaratanaporn. "Effect of Al and Ti Additions in Cast Nickel Base Alloy, Grade Hastelloy X by Arc Melting Process on Microstructures and Oxidation Behavior at 900°C and 1000°C." Applied Mechanics and Materials 548-549 (April 2014): 274–79. http://dx.doi.org/10.4028/www.scientific.net/amm.548-549.274.

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The nickel base alloy, grade Hastelloy X was modified by Aluminum and Titanium additions by means of vacuum arc melting process in order to improve microstructural characteristics and oxidation resistance. The arc melted Hastelloy X was added Aluminum and Titanium each for 2%, 4% and 6% by weight. Then all specimens were performed with heat treatment, which consists of solutioning treatment at 1125°C for 24 hours and precipitation aging at temperatures of 760°C, 800°C and 845°C for 24 hours. Both aluminum and titanium additions resulted in network intermetalic phase formation, namely, σ-phase, throughout the matrix. Furthermore, the addition of both elements provided the better oxidation resistance for the alloys.

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23

Borisov, Yu S., A. L. Borisova, N. V. Vihilianska, I. A. Demianov, and O. M. Burlachenko. "Electric arc spraying of intermetalic Fe–Al coatings using different solid and powder wires." Avtomatičeskaâ svarka (Kiev) 2021, no. 3 (March 28, 2021): 17–22. http://dx.doi.org/10.37434/as2021.03.03.

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24

Cermak, Jiri, and Lubomir Kral. "Interrelation between Hydrogen Desorption Kinetics and Structure of (Mg₂Ni)H_x and Hydrogenated Eutectic(Mg/Mg₂Ni)H_y." Defect and Diffusion Forum 289-292 (April 2009): 167–74. http://dx.doi.org/10.4028/www.scientific.net/ddf.289-292.167.

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Mg-rich alloys of the binary system Mg-Ni are prospective hydrogen-storage materials. In the present study, desorption characteristics of hydrided Mg2Ni intermetalic and hydrided Mg/Mg2Ni eutectic mixture were investigated. Structure of experimental materials during the hydrogenation was observed by SEM. Three modifications of (Mg2Ni)Hx (x ~ 4) were prepared differing in the ratio of two low-temperature phases f = LT2/LT1: with (i) f >1, (ii) f ~ 1 and with (iii) f <1. Evolution of the ratio f during hydrogen desorption was checked by XRD. It was found that the micro-twinned phase LT2 is not desirable in hydrogen-storage materials containing Mg2Ni intermetallic. Diffusion coefficient of hydrogen in LT2 is about 20 times lower than in LT1.

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Shimizu, Toru. "Preparation of TiAl Intermetallic Alloy Precursor Using Slow Reaction Synthesis Process." Materials Science Forum 941 (December 2018): 1312–17. http://dx.doi.org/10.4028/www.scientific.net/msf.941.1312.

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Already, there are several processes to produce intermetalic alloy parts from powder , ex. metal injection molding (MIM) or additive manufacturing (AM). For these processes, pre-alloyed powder made by gas atomized powder is used because of their quality. As other way, intermetallic alloy can be produced combustion reaction process. On this process, ingredient metal powders are mixed and reacted by combustion. However, powders are fused by reaction heat, and they are difficult to keep the powder condition. There for, we are developed the process to produce intermetallic alloy precursor by slow combustion reaction. On this process, temperature of mixed powders increases slower than 0.2K/sec. while the combustion reaction, and powders are reacted without fusing. Using this process, TiAl presursor is synthesized. Relation of reacting condition and quality of the precursor is evaluated, and researched the practical usage of this precurser.

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26

Levitskiy, V., I. Levitskiy, L. Pavlova, V. Solodilova, and N. Zavadich. "Genetic Nature of Mineralization on Native and Intermetalic Compounds in the Bobruisk Ring Structure (Republic of Belarus)." Доклады Академии наук 481, no. 2 (2018): 174–78. http://dx.doi.org/10.31857/s086956520001198-0.

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Çaligülü, Uğur, Halil Dikbaş, and Adil Küçükarslan. "INVESTIGATION OF SURFACE COATING Ni3Al INTERMETALIC COMPOUND ON THE AISI 1030 STEEL BY USING GTA WELDING METHOD." e-Journal of New World Sciences Academy 1, no. 1 (September 10, 2016): 159–69. http://dx.doi.org/10.12739/nwsa.2016.2a1pb.

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28

Matlak, M., and J. Zieliński. "Multiband s-f Model for Pseudobinary Intermetalic Gd(Al1-xMex)2Alloys. II. Me=Pb, Bi, Si, Sb." Acta Physica Polonica A 79, no. 5 (May 1991): 717–19. http://dx.doi.org/10.12693/aphyspola.79.717.

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29

Szymański, W. "Properties of „In Situ” 7475 Alloy Matrix Composites Reinforced Al3Ti Intermetalic Compound Extruded in Semi-Solid State." Archives of Metallurgy and Materials 61, no. 1 (March 1, 2016): 433–38. http://dx.doi.org/10.1515/amm-2016-0078.

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Studies were conducted to improve the mechanical properties of composites based on 7475 aluminium alloy reinforced with Al3Ti particles fabricated by the “in situ” process. The first step involved “dissolving” of titanium in the liquid aluminium alloy and fabricating in this way composite materials with different content of the reinforcing phase (15-45wt%). A relationship between the composite hardness and content of the reinforcing phase was confirmed. The second step involved the improvement of cohesion between the reinforcing particles and composite matrix. By extrusion of samples in semi-solid state, an average increase in hardness by 15-20% relative to the unextruded composite was obtained. In the third step, the fabricated composite was subjected to a heat treatment corresponding to the state T6 in 7475 alloy, which raised the hardness by about 30%. Structure examinations carried out by means of optical microscopy and scanning electron microscopies as well as the results of hardness measurements were described. They enabled estimating the effect of the content of produced Al3Ti particles, and of the extrusion process in semi-solid state and heat treatment parameters on the composite properties. In compression test, the yield strength and compressive strength of the heat-treated composites were determined.

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Mola, R. "Fabrication and Microstructure of Layers Containing Intermetallic Phases on Magnesium." Archives of Foundry Engineering 13, no. 1 (March 1, 2013): 99–102. http://dx.doi.org/10.2478/afe-2013-0019.

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Abstract Al- and Al/Zn-enriched layers containing intermetallic phases were deposited on the Mg substrate by heating the Mg specimens in contact with the powdered materials in a vacuum furnace. The Al-enriched surface layers were produced using Al powder, whereas the Al/Znenriched layers were obtained from an 80 wt.% Al + 20 wt.% Zn powder mixture. The microstructure and composition of the layers were analyzed by optical microscopy, scanning electron microscopy and X-ray diffraction. The results showed that the Al-enriched layer comprised an Mg17Al12 intermetallic phase and a solid solution of Al in Mg. The layer obtained from the Al+Zn powder mixture was composed of Mg-Al-Zn intermetalic phases and a solid solution of Al and Zn in Mg. Adding 20% of Zn into the Al powder resulted in the formation of a considerably thicker layer. Moreover, the hardness of the surface layers was much higher than that of the Mg substrate.

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Kosone, Takashi, Itaru Tomori, Daisuke Akahoshi, Toshiaki Saito, and Takafumi Kitazawa. "New Iron(II) Spin Crossover Complexes with Unique Supramolecular Networks Assembled by Hydrogen Bonding and Intermetallic Bonding." Crystals 8, no. 11 (November 5, 2018): 415. http://dx.doi.org/10.3390/cryst8110415.

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Two spin crossover (SCO) coordination polymers assembled by combining FeII octahedral ion, 4-cyanopyridine (4-CNpy) and [Au(CN)2]− liner unit are described. These compounds, Fe(4-CNpy)2[Au(CN)2]2·1/2(4-CNpy) (1a) and {Fe(4-CNpy)2[Au(CN)2]2}-{Fe(H2O)2[Au(CN)2]2} (1b), present quite different supramolecular networks that show different magnetic behaviors. Compound 1a crystallizes in the centrosymmetric space group Pbcn. The asymmetric unit contains two 4-CNpy, one type of Fe2+, and two types of crystallographically distinct [Au(CN)2]− units which form Hofmann-like two dimensional layer structures with guest spaces. The layers are combined with another layer by strong gold-gold intermetalic interactions. Compound 1b crystallizes in the centrosymmetric space group Pnma. The bent bismonodentate [AuI(CN)2] units and FeII ions form a complicated interpenetrated three dimensional structure. In addition, 1b exhibits ferromagnetic interaction.

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Kim, Seung Mo, Eun Sook Shon, Yoon Hyun Ka, Yong Joon Kim, Jin Young Kim, and Jae Dong Kim. "Reliability Characterization of Organic Solderability Preservatives (OSP) of IC Packages by Drop and Cyclic Bend Test." Key Engineering Materials 297-300 (November 2005): 893–98. http://dx.doi.org/10.4028/www.scientific.net/kem.297-300.893.

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Cyclic bend test and drop test were carried out as a second level reliability test method in order to characterize the joint performance between electronic components and board. Two types of package substrates were used for the test. The one was NiAu plated, and the other one was organic solderability preservatives (OSP) finished. Drop test was done in accordance with JEDEC standard test method [1]. Drop impact and duration time was 1,500G and 0.5ms, respectively. Cyclic bend test was performed with Amkor internal specification because there is no international standard for the test. The Amkor internal specification was edited based on the IPC/JEDEC specification [2]. Board deflection and cyclic frequency was 3mm and 1Hz, respectively. NiAu substrate showed better mean life performance about by 30% in cyclic bend test. OSP substrate showed the same or better failure rate performance in drop test. Typical solder joint failures and intermetalic crack were found by failure analysis.

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Allen, Charles W., and Robert C. Birtcher. "Electron and ion irradiation-induced dissolution of mechanical twins in the intermetalic U3Si: An in situ HVEM study." Proceedings, annual meeting, Electron Microscopy Society of America 47 (August 6, 1989): 652–53. http://dx.doi.org/10.1017/s0424820100155232.

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The uranium silicides, including U3Si, are under study as candidate low enrichment nuclear fuels. Ion beam simulations of the in-reactor behavior of such materials are performed because a similar damage structure can be produced in hours by energetic heavy ions which requires years in actual reactor tests. This contribution treats one aspect of the microstructural behavior of U3Si under high energy electron irradiation and low dose energetic heavy ion irradiation and is based on in situ experiments, performed at the HVEM-Tandem User Facility at Argonne National Laboratory. This Facility interfaces a 2 MV Tandem ion accelerator and a 0.6 MV ion implanter to a 1.2 MeV AEI high voltage electron microscope, which allows a wide variety of in situ ion beam experiments to be performed with simultaneous irradiation and electron microscopy or diffraction.At elevated temperatures, U3Si exhibits the ordered AuCu3 structure. On cooling below 1058 K, the intermetallic transforms, evidently martensitically, to a body-centered tetragonal structure (alternatively, the structure may be described as face-centered tetragonal, which would be fcc except for a 1 pet tetragonal distortion). Mechanical twinning accompanies the transformation; however, diferences between electron diffraction patterns from twinned and non-twinned martensite plates could not be distinguished.

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Smolik, J., A. Mazurkiewicz, J. Kacprzyńska-Gołacka, M. Rydzewski, M. Szota, and J. Mizera. "Composite Layers “MgAl Intermetalic Layer / PVD Coating” Obtained On The AZ91D Magnesium Alloy By Different Hybrid Surface Treatment Methods." Archives of Metallurgy and Materials 60, no. 2 (June 1, 2015): 1031–35. http://dx.doi.org/10.1515/amm-2015-0255.

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Abstract Magnesium alloys have very interesting physical properties which make them ‘materials of the future’ for tools and machine components in many industry areas. However, very low corrosion and tribological resistance of magnesium alloys hampers the implementation of this material in the industry. One of the methods to improve the properties of magnesium alloys is the application of the solutions of surface engineering like hybrid technologies. In this paper, the authors compare the tribological and corrosion properties of two types of “MgAlitermetalic / PVD coating” composite layers obtained by two different hybrid surface treatment technologies. In the first configuration, the “MgAlitermetalic / PVD coating” composite layer was obtained by multisource hybrid surface treatment technology combining magnetron sputtering (MS), arc evaporation (AE) and vacuum heating methods. The second type of a composite layer was prepared using a hybrid technology combined with a diffusion treatment process in Al-powder and the electron beam evaporation (EB) method. The authors conclude, that even though the application of „MgAlitermetalic / PVD coating” composite layers can be an effective solution to increase the abrasive wear resistance of magnesium alloys, it is not a good solution to increase its corrosion resistance.

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Menon, Sandeep, Adam Pearl, Michael Osterman, and Michael Pecht. "Effect of ENEPIG Surface Finish on the Vibration Reliability of Solder Interconnects." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000115–19. http://dx.doi.org/10.4071/isom-2013-ta44.

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Surface finishes are used to preserve and promote solderability of exposed copper metallization on printed wiring boards. While in the best of worlds, the solder used in assembly should dictate the solder interconnect reliability, surface finishes are known to have an effect. The effect of surface finishes on solder interconnect reliability can be particularly strong under high strain rate loading conditions. In this study, durability of solder interconnects formed between BGAs and electroless nickel, electroless palladium, immersion gold (ENEPIG) finished pads assembled using SnPb and SAC305 solders under harmonic vibration loading is examined. ENEPIG test specimens with two thicknesses of palladium were evaluated. Isothermal preconditioning levels at 100°C for 24 hrs and 500 hrs were included to evaluate the impact of intermetalic evolution on the durability of the soldered interconnects. For comparison, tests specimens created with immersion silver (ImAg) finished printed wiring boards were also included. The failure data obtained found the durability of interconnects formed with ENEPIG finish was comparable or better durability than the durability of interconnects formed with ImAg finish irrespective of the solder. The tests indicate that the use of a thicker palladium layer reduced the degradation in durability which occurred from isothermal aging.

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Zhou, Li, Chuck Mooney, and Phillip E. Russell. "Atomic force microscopy using beam fabricated tips: resolution issues." Proceedings, annual meeting, Electron Microscopy Society of America 50, no. 2 (August 1992): 1128–29. http://dx.doi.org/10.1017/s0424820100130274.

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A question often arises concerning the resolving power of the AFM compared with that of the scanning electron microscopy (SEM). One of the advantages of AFM is that it gives accurate three dimensional topographic information that the SEM can not provide. Figure 1(a) shows an SEM micrograph of a two level metal integrated circuit with intermetalic dielectric (unpassivated) that has a complicated three dimensional structure. Quantitive feature height information can not be obtained from this picture. But, as shown in Figure 1(b) die AFM perspective image clearly gives us the details of three dimensional information. In Figure 1(c), a line scan taken from the image yields the height of the pattern quantitively. However, the image we obtain with an AFM is often complicated by the nature of the sample and the structure of the tip. If the dimension of the tip is larger than the topography of the sample, the image will reflect the shape of die tip, which is one of die problems associated with pyramidal shapes of commercial AFM tips (5.0 Х 5.0 μm square base and 55° slope of sidewalls).

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Chang, Jinghuan, Rui Cao, and Yingjie Yan. "The Joining Behavior of Titanium and Q235 Steel Joined by Cold Metal Transfer Joining Technology." Materials 12, no. 15 (July 29, 2019): 2413. http://dx.doi.org/10.3390/ma12152413.

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Cold metal transfer process is applied to join titanium and Q235 steel with copper filler metal. Scanning electron microscope (SEM), energy dispersive spectrometer (EDS) analysis, micro-hardness tests, and tensile strength test were performed to investigate the joining mechanism and strength of joints. The results show that the stacking order of two base metals affected the joining modes and strength. For top Q235 steel to bottom Ti-TA2 lapped joint, there was no distinct interface reaction layer between the steel base metal and the weld metal; dispersed TiFe2 intermetalics (IMCs) IMCs between the steel base metal and the Ti base metal greatly improved the strength of joint; the tensile force of the joint could reach up to 93% that of steel-steel joint using the same welding parameters. Additionally, the joints were fractured in dimple mode at the steel base metal. For top Ti-TA2 to bottom Q235 steel lapped joint, the increasing volume fraction of Ti-Cu IMCs at the Ti-Cu weld metal interface contributed to the strength of joint degradation. The joints under tensile loading are initiated at the Ti-Cu weld metal interface between the weld metal and Ti base metal, then propagated to weld metal, finally fractured with brittle mode.

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Lang, Fengqun, Hiroshi Yamaguchi, and Hiroshi Sato. "Package Reliability of the SiC Power Modules in Harsh Environments." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000139–44. http://dx.doi.org/10.4071/hiten-paper2-flang.

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To evaluate the package reliability of the SiC power modules in harsh environments, the SiC Schottky Barrier Diodes (SBDs) were die bonded to the Si3N4/Cu/Ni(P) substrate with Au-Ge eutectic solder using a vacuum reflow furnace. The Si3N4/Cu/Ni(P) substrates are active metalized copper (AMC). The bonded samples were isothermally aged at 330°C and tested under thermal cycling conditions in the temperature range of −40–300°C in air. During the isothermal aging, cracks of the Ni(P) layer developed, resulting in oxidation of the Cu power path. Decrease in the die bond strength and increase in the electrical resistivity were observed due to the Cu power path oxidation and the growth of the Ni-Ge intermetalic compound (IMC) in the joint. Under the thermal cycling conditions, the metallization of the substrate suffers from serious surface roughness, which greatly degrades the die-attach reliability. The Al electrode was found to seriously exfoliate from the SiC-SBDs due to the thermal stress. After 521 cycles, almost all the Al electrode exfoliated form the anode. Benefit from the excellent mechanical properties of Si3N4, no detachment of the Cu layer was observed from the Si3N4 substrate after 1079 cycles, while the Cu layer detached from the AlN substrate only after 12 cycles.

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Karolus, Małgorzata, Bożena Bierska-Piech, Joanna Panek, and Eugeniusz Łągiewka. "The Study of Zink-Nickel Composite Coatings after Annealing." Solid State Phenomena 163 (June 2010): 84–87. http://dx.doi.org/10.4028/www.scientific.net/ssp.163.84.

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The Zinc composite coatings containing Ni powder were obtained by the electrodeposition and electroless methods. Electrodeposited Zn+Ni coatings were plated with the current density jk = 150 mA/cm2 from the zinc chloride bath containing the suspension of nickel powder. Electroless (Zn-Ni)+Ni coatings were obtained by chemical reduction of Ni2+ and Zn2+ ions from the sulphate bath containing sodium hypophosphite as a reducing agent and mechanically dispersed Ni powder suspension. The thickness of (Zn-Ni)+Ni layer was ~8 m. In order to enhance the Zn content the obtained coatings were covered with the electrolytic Zn layers of different thickness (5 m, 8 m and 14 m) – (Zn-Ni)+Ni/Zn. The thermal treatment of the obtained composites was carried out at a temperature of 320oC, during 2h in argon atmosphere. The electrodeposited coatings show the presence of Zn, Ni(Zn) and ZnO phases. The electroless coatings show the presence of Zn, Ni(Zn) and ZnO phases. The additional electrodeposition of Zn leads to the creation of dilayer coatings (Zn-Ni)+Ni/Zn. The annealing of such obtained coatings leads to the creation of Ni2Zn11 intermetalic phase. The average Ni(Zn) and Ni crystallite size before annealing is in a range of 200 Å and after annealing the size is increasing to values of 600-800 Å.

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Wąsik, Mateusz, and Joanna Karwan-Baczewska. "Copper Metal Matrix Composites Reinforced by Titanium Nitride Particles." Key Engineering Materials 682 (February 2016): 270–75. http://dx.doi.org/10.4028/www.scientific.net/kem.682.270.

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Copper based Metal Matrix Composites are promising materials for electrical and electrotechnical applications such as electronic packaging and contacts, resistance welding electrodes, heat exchangers etc. Introducing the ceramics particles into the copper matrix allows to achieve a higher mechanical properties comparing to pure copper. The literature shows the variety of reinforcement materials are used. The most commonly strengthening phase include: oxides Al2O3,Y2O3, SiO2, carbides SiC, WC, TiC, ZrC, borides TiB2, ZrB2 and others such us volcanic tuff, carbon or intermetalic phases Al-Fe. [1-7]. It is obvious that reinforcement material without TiN leads to decrease the electrical conductivity of copper. Preliminary investigations concerning nanoscale Cu-based composites with TiN particles were presented in papers [10, 11]. Powder metallurgy (PM) process leads to obtain uniform distribution of strengthening phase in matrix. In order to achieve uniform distribution the process parameters such as mixing and selection the sizes of particles must be appropriate selected. The another factor of decreasing the mechanical and electrical properties by using PM route is porosity. Conventional PM process includes pressing and sintering does not always allow to achieve the high density what is one of the main criterion for high electrical conductivity material. The hard ceramic particles in metal matrix which are not deformable make difficult the densification process. In some cases the use of more advanced methods of production is desirable. The use of titanium nitride particles is justified by their high electrical conductivity in compare to the other reinforcement materials.

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Evecen, Meryem, and Yasemin öztekin Çiftci. "First-Principles Study on the Structural, Elastic, Electronic and Vibrational Properties of Scandium Based Intermetalic Compounds (ScX, X = Co, Rh and Ir) Under Pressure." Journal of Nanoelectronics and Optoelectronics 12, no. 2 (February 1, 2017): 100–108. http://dx.doi.org/10.1166/jno.2017.1977.

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Urban, Miroslav, and Vladimír Kellö. "Relativistic and Electron Correlation Effects as a Tool for Explaining Some Trends in Molecular Properties and Interactions." Computing Letters 1, no. 1 (March 6, 2006): 259–65. http://dx.doi.org/10.1163/157404006779194079.

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In this paper we discuss relatively routine Douglas–Kroll–Hess spin–free relativistic calculations as a tool for understanding some trends of molecular properties within the series of related molecules. Electron correlation effects are considered by the Coupled Cluster method with iterative treatment of the single and double excitation operators and perturbative treatment of triples, CCSD(T). For our analysis we use accumulated data on relativistic effects on ionization potentials, electron affinities and polarizabilities of the coinage elements, Cu, Ag, and Au and related series like Ia and IIa group elements. Next we analyze electric properties of diatomic molecules as CuF, AgF, and AuF, and compare electric properties and bonding energies of these molecules with intermetalics CuAl, AgAl, AuAl. Electric dipole moments and dipole polarizabilities of the series of oxides including a heavy atom, GeO, SnO, and PbO in their 1∑ ground states are also analyzed. Particular attention is paid to the dissociation energy of PbO and its electron affinity. The bonding character of the MeL series of complexes (Me=Cu, Ag, Au; L=H2O, NH3, and H2S) is explained by stressing the importance of the charge transfer from the lone pair of the ligand to the metal element. Relativistic effects which affect the Me electron affinity and polarizability facilitate understanding the trends of Me interactions with different ligands. We also mention using of the optimized virtual orbital space (OVOS) as an instrument which allows to circumvent problems with proper contraction needed for a specific approximate relativistic Hamiltonian. OVOS allows to reduce the computer time of correlated relativistic calculation by an order of magnitude.

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Panaccione, Paul, Tao Wang, Guo-Quan Lu, Xu Chen, and Susan Luo. "Improved Heat Dissipation and Optical Performance of High-power LED Packaging with Sintered Nanosilver Die-attach Material." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 001585–605. http://dx.doi.org/10.4071/2010dpc-wa44.

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Heat removal in packaged high-power light-emitting diode (LED) chips is critical to device performance and reliability. Thermal performance of LEDs is important in that lowered junction temperatures extend the LED's lifetime at a given photometric flux (brightness). Optionally, lower thermal resistance can enable increased brightness operation without exceeding the maximum allowable Tj for a given lifetime. A significant portion of the junction-to-case thermal resistance comes from the joint between chip and substrate, or the die-attach layer. In this study, we evaluated three different types of leading die-attach materials; silver epoxy, lead-free solder, and an emerging nanosilver paste. Each of the three was processed via their respective physical and chemical mechanisms: epoxy curing by cross-linking of polymer molecules; intermetalic soldering by reflow and solidification; and nanosilver sintering by solid-state atomic diffusion. High-power LED chips with a chip area of 3.9 mm2 were attached by the three types of materials onto metalized aluminum nitride substrates, wire-bonded, and then tested in an electro-optical setup. The junction-to-heatsink thermal resistance of each LED assembly was determined by the wavelength shift methodology, described in detail in this paper. We found that the average thermal resistance in the chips attached by the nanosilver paste was the lowest, and it is the highest from the chips attached by the silver epoxy: the difference between the two was about 0.7°C/W, while the difference between the sintered and soldered was about 0.3°C/W. The lower thermal resistance in the sintered joints is expected to significantly improve the photometric flux from the device. Simple calculations, excluding high current efficiency droop, predict that the brightness improvement could be as high as 50% for the 3.9 mm2 chip. The samples will be functionally tested at high current, in both steady-state and pulsed operation, to determine brightness improvements, including the impact of droop. Nanosilver die-attach on a range of chip sizes up to 12 mm2 are also considered and discussed.

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Panaccione, Paul, Tao Wang, Xu Chen, Susan Luo, and Guo-Quan Lu. "Improved Heat Dissipation and Optical Performance of High-Power LED Packaging with Sintered Nanosilver Die-Attach Material." Journal of Microelectronics and Electronic Packaging 7, no. 3 (July 1, 2010): 164–68. http://dx.doi.org/10.4071/imaps.264.

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Heat removal in packaged high-power light-emitting diode (LED) chips is critical to device performance and reliability. Thermal performance of LEDs is important in that lowered junction temperatures extend the LED's lifetime at a given pho-tometric flux (brightness). Optionally, lower thermal resistance can enable increased brightness operation without exceeding the maximum allowable Tj for a given lifetime. A significant portion of the junction-to-case thermal resistance comes from the joint between chip and substrate, or the die-attach layer. In this study, we evaluated three different types of leading die-attach materials; silver epoxy, lead-free solder, and an emerging nanosilver paste. Each of the three was processed via their respective physical and chemical mechanisms: epoxy curing by cross-linking of polymer molecules; intermetalic soldering by reflow and solidification; and nanosilver sintering by solid-state atomic diffusion. High-power LED chips with a range of chip areas from 3.9 mm2 to 9.0 mm2 were attached by the three types of materials onto metalized aluminum nitride substrates, wire-bonded, and then tested in an electro-optical setup. The junction-to-heatsink thermal resistance of each LED assembly was determined by the wavelength shift methodology. We found that the average thermal resistance in the chips attached by the nanosilver paste was the lowest, and it was highest from the chips attached by the silver epoxy. For the 3.9 mm2 die, the difference was about 0.6°C/W, while the difference between the sintered and soldered was about 0.3°C/W. The lower thermal resistance in the sintered joints is expected to significantly improve the photometric flux from the device. Simple calculations, excluding high current efficiency droop, predict that the brightness improvement could be as high as 50% for the 3.9 mm2 chip. The samples will be functionally tested at high current, in both steady-state and pulsed operation, to determine brightness improvements, including the impact of droop. Nanosilver die-attach on a range of chip sizes up to 12 mm2 are also considered and discussed.

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"5466311 Method of manufacturing a Ni-Al intermetalic compound matrix composite." Composites Part A: Applied Science and Manufacturing 27, no. 8 (January 1996): 670. http://dx.doi.org/10.1016/1359-835x(96)88535-6.

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Seletskaia, Tatiana, Leonid Muratov, and Bernard R. Cooper. "Calculation of thermal expansion of iron-aluminides with transition metal additives." MRS Proceedings 753 (2002). http://dx.doi.org/10.1557/proc-753-bb5.16.

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ABSTRACTThe addition of transition metal elements can significantly modify physical properties of intermetalic compounds. We studied the influence of Molybdenum and Vanadium additives on thermal expansion coefficient (CTE) of Fe3Al and FeAl over the wide range of temperatures. The site preference of both transition metals was determined by full-potential LMTO method within the grandcanonical formalism. At low temperatures CTEs were found directly from the FP-LMTO calculations by incorporating them into the Debye model of a solid. The obtained thermal expansion for pure Fe3Al and FeAl is within 10% of its experimentally measured values. At high temperatures we performed Molecular Dynamics (MD) simulations based on our many-body atomistic potentials. The parameters were fitted to reproduce the total energy of a crystal under various types of deformations obtained by FP-LMTO method and were tested with respect to different structures and vacancy formation energies. Our calculations show that addition of V decreases the CTEs of both iron-aluminides, while the addition of Mo makes Fe3Al DO3 structure unstable.

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Ishii, Hiroaki, Seiji Miura, and Tetsuo Mohri. "Effect of Additives on the Phase Equilibria Related to the E21-Fe3AlC Intermetalic Compound with Carbon Atom at the Interstitial Site." MRS Proceedings 753 (2002). http://dx.doi.org/10.1557/proc-753-bb5.29.

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ABSTRACTThe structure of E21 is a derivative of L12 structure with an interstitial carbon in the body center or the octahedral interstitial site. In the Fe-Al-C ternary system E21-Fe3AlC intermetallic is known to precipitate in γ-austenite alloys. For the high temperature application, the stability of microstructure is a key issue and the control of the lattice misfit is essential. By adding some elements to Fe-Al-C alloys, the lattice constant can be controlled, and enhancement of the stability of γ-austenite + E21-Fe3AlC two phase structure is expected. In this study, phase stability and lattice parameter of E21 phase in the (Fe-Mn)-(Al-M)-C system (M=Si, Ge) are investigated. In both systems, no significant changes in microstructures were observed within the composition range of concern. The lattice constant of E21-Fe3AlC phase, however, does not show decrease with the addition of Si or Ge. This result is different from what was expected. By WDS analysis, it was revealed that Si tends to distribute mainly in γ phase, and Ge concentrates in E21-Fe3AlC phase. It was found that the lattice constants of E21 phases are very close to those of L12 structure estimated from the atomic radii of constituent elements which are evaluated from those in binary alloys and compounds. The distribution behavior of Si and Ge can be related to tolerance factor which strongly affects the stability of phases.

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Saputro, Gilang Sigit, Triyono ., and Nurul Muhayat. "Welding Current and Shielding Gas Flow Rate Effect to The Intermetalic Layer Formation of Tungsten Inert Gas (Tig) on Dissimilar Metals Weld Joints Between Galvanized Steel and Aluminium Aa 5052 By Using Al-Si 4043 Filler." Mekanika: Majalah Ilmiah Mekanika 16, no. 1 (March 4, 2017). http://dx.doi.org/10.20961/mekanika.v16i1.35052.

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Tungsten Inert Gas welding of galvanized steel-aluminium useful for weight reduction, improve perform and reduce cost production. The effect of welding parameters, welding current and shielding gas flow rate on the intermetallic formation and hardness of dissimilar metals weld joint between galvanized steel and aluminium by using AA 5052 filler was determined. In this research, welding speed was consistent kept. The welding parameters were obtained by using welding currents of 70, 80 and 90 A, shielding gas flow rate of 10, 12 and 14 litre/min. The intermetallic layer thickness increased by welding currents of 70 A to 80 A, but then it dropped on 90 A. The higher of a shielding gas flow rate, the lower the thickness of the intermetallic layer. The higher of a welding current, the lower the hardness of weld. The higher of a shielding gas flow rate, the greater the hardness of weld. As a result,the maximum hardness by current variation of 70 A and a shielding gas flow rate of 14 Litre/min was 100.9 HVN.

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Journal articles on the topic 'Intermetalicum'

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