Academic literature on the topic 'International technology roadmap for semiconductors (ITRS)'
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Journal articles on the topic "International technology roadmap for semiconductors (ITRS)"
Radamson, Henry H., Huilong Zhu, Zhenhua Wu, et al. "State of the Art and Future Perspectives in Advanced CMOS Technology." Nanomaterials 10, no. 8 (2020): 1555. http://dx.doi.org/10.3390/nano10081555.
Full textZEITZOFF, PETER M., JAMES A. HUTCHBY, and HOWARD R. HUFF. "MOSFET AND FRONT-END PROCESS INTEGRATION: SCALING TRENDS, CHALLENGES, AND POTENTIAL SOLUTIONS THROUGH THE END OF THE ROADMAP." International Journal of High Speed Electronics and Systems 12, no. 02 (2002): 267–93. http://dx.doi.org/10.1142/s0129156402001241.
Full textRadamson, Henry H., Xiaobin He, Qingzhu Zhang, et al. "Miniaturization of CMOS." Micromachines 10, no. 5 (2019): 293. http://dx.doi.org/10.3390/mi10050293.
Full textF. Roslan, Ameer, F. Salehuddin, A. S. M.Zain, et al. "3D Double Gate FinFET Construction of 30 nm Technology Node Impact Towards Short Channel Effect." Indonesian Journal of Electrical Engineering and Computer Science 12, no. 3 (2018): 1358. http://dx.doi.org/10.11591/ijeecs.v12.i3.pp1358-1365.
Full textKraus, W., and D. Schmitt-Landsiedel. "Influence of gate tunneling currents on switched capacitor integrators." Advances in Radio Science 7 (May 19, 2009): 225–29. http://dx.doi.org/10.5194/ars-7-225-2009.
Full textXu, K., S. Pichler, Kurt Wostyn, et al. "Removal of Nano-Particles by Aerosol Spray: Effect of Droplet Size and Velocity on Cleaning Performance." Solid State Phenomena 145-146 (January 2009): 31–34. http://dx.doi.org/10.4028/www.scientific.net/ssp.145-146.31.
Full textHeyns, M., and W. Tsai. "Ultimate Scaling of CMOS Logic Devices with Ge and III–V Materials." MRS Bulletin 34, no. 7 (2009): 485–92. http://dx.doi.org/10.1557/mrs2009.136.
Full textWilson, Peter R., Braham Ferreira, Jing Zhang, and Christina DiMarino. "IEEE ITRW: International Technology Roadmap for Wide-Bandgap Power Semiconductors: An Overview." IEEE Power Electronics Magazine 5, no. 2 (2018): 22–25. http://dx.doi.org/10.1109/mpel.2018.2821938.
Full textKang, Yuhao, Walter Den, Hsunling Bai, and Fu-Hsiang Ko. "Surface Deposition of Diethyl Phthalate on SiO2 and Si3N4 Wafers in Simulated Cleanroom Environment." Journal of the IEST 48, no. 1 (2005): 21–32. http://dx.doi.org/10.17764/jiet.48.1.f2l1547q134n506t.
Full textLeela Rani, V., and M. Madhavi Latha. "Particle Swarm Optimization Algorithm for Leakage Power Reduction in VLSI Circuits." International Journal of Electronics and Telecommunications 62, no. 2 (2016): 179–86. http://dx.doi.org/10.1515/eletel-2016-0025.
Full textDissertations / Theses on the topic "International technology roadmap for semiconductors (ITRS)"
Rosenbaum, Tommy. "Performance prediction of a future silicon-germanium heterojunction bipolar transistor technology using a heterogeneous set of simulation tools and approaches." Thesis, Bordeaux, 2017. http://www.theses.fr/2017BORD0550/document.
Full textBook chapters on the topic "International technology roadmap for semiconductors (ITRS)"
Hoefflinger, Bernd. "ITRS: The International Technology Roadmap for Semiconductors." In The Frontiers Collection. Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-23096-7_7.
Full textHoefflinger, Bernd. "ITRS 2028—International Roadmap of Semiconductors." In The Frontiers Collection. Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-22093-2_7.
Full textVargas-Bernal, Rafael, Gabriel Herrera-Pérez, and Margarita Tecpoyotl-Torres. "The Impact of Carbon Nanotubes and Graphene on Electronics Industry." In Encyclopedia of Information Science and Technology, Fourth Edition. IGI Global, 2018. http://dx.doi.org/10.4018/978-1-5225-2255-3.ch253.
Full textVargas-Bernal, Rafael, Gabriel Herrera-Pérez, and Margarita Tecpoyotl-Torres. "The Impact of Carbon Nanotubes and Graphene on Electronics Industry." In Advances in Marketing, Customer Relationship Management, and E-Services. IGI Global, 2019. http://dx.doi.org/10.4018/978-1-5225-7766-9.ch030.
Full textSimpson, Michael L., and Gary S. Sayler. "The Device Science of Whole Cells as Components in Microscale and Nanoscale Systems." In Cellular Computing. Oxford University Press, 2004. http://dx.doi.org/10.1093/oso/9780195155396.003.0009.
Full textPraveenkumar, Padmapriya, Santhiya Devi R., Amirtharajan Rengarajan, and John Bosco Balaguru Rayappan. "LFSR-Keyed MUX for Random Number Generation in Nano Communication Using QCA." In Quantum Cryptography and the Future of Cyber Security. IGI Global, 2020. http://dx.doi.org/10.4018/978-1-7998-2253-0.ch004.
Full textConference papers on the topic "International technology roadmap for semiconductors (ITRS)"
Jeong, Kwangok, and Andrew B. Kahng. "A power-constrained MPU roadmap for the International Technology Roadmap for Semiconductors (ITRS)." In 2009 International SoC Design Conference (ISOCC). IEEE, 2009. http://dx.doi.org/10.1109/socdc.2009.5423856.
Full textQu, Yan, Ekachai Puttitwong, John R. Howell, Ofodike A. Ezekoye, and Kenneth S. Ball. "Drawdown-Effect of Lightpipes in Silicon Wafer Surface Temperature Measurements." In ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. ASMEDC, 2005. http://dx.doi.org/10.1115/ht2005-72203.
Full textCarballo, Juan-Antonio, Wei-Ting Jonas Chan, Paolo A. Gargini, Andrew B. Kahng, and Siddhartha Nath. "ITRS 2.0: Toward a re-framing of the Semiconductor Technology Roadmap." In 2014 32nd IEEE International Conference on Computer Design (ICCD). IEEE, 2014. http://dx.doi.org/10.1109/iccd.2014.6974673.
Full textTricard, Marc, Paul R. Dumas, Don Golini, and James T. Mooney. "Prime Silicon and Silicon-on-Insulator (SOI) Wafer Polishing With Magnetorheological Finishing (MRF)." In ASME 2003 International Mechanical Engineering Congress and Exposition. ASMEDC, 2003. http://dx.doi.org/10.1115/imece2003-42149.
Full textKane, Terence, Michael P. Tenney, and John Bruley. "Characterization of Sub 130 Nanometer Gate Length SOI MOSFET Devices Exhibiting Short Channel Effects." In ISTFA 2003. ASM International, 2003. http://dx.doi.org/10.31399/asm.cp.istfa2003p0478.
Full textKacker, Karan, George Lo, and Suresh K. Sitaraman. "Wafer-Level, Compliant, Off-Chip Interconnects for Next-Generation Low-K Dielectric/Cu IC’s." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-16014.
Full textGee, Stephen, Nikhil Kelkar, Joanne Huang, and King-Ning Tu. "Lead-Free and PbSn Bump Electromigration Testing." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73417.
Full textSuman, Shivesh K., Andrei G. Fedorov, and Yogendra K. Joshi. "Thermodynamic Design of Compact Thermal Compressor for Sorption Assisted Cryogenic Cooling of Electronics." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73452.
Full textMa, Lunyu, Qi Zhu, and Suresh K. Sitaraman. "Mechanical and Electrical Study of Linear Spring and J-Spring." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39683.
Full textKlein, Kevin M., and Suresh K. Sitaraman. "Compliant Stress-Engineered Interconnects for Next-Generation Packaging." In ASME 2004 International Mechanical Engineering Congress and Exposition. ASMEDC, 2004. http://dx.doi.org/10.1115/imece2004-61990.
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