Academic literature on the topic 'Iron Soldier'

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Journal articles on the topic "Iron Soldier"

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Johnson, Anthony E. "Iron Supplementation and the Female Soldier." Military Medicine 171, no. 4 (April 2006): 298–300. http://dx.doi.org/10.7205/milmed.171.4.298.

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Leasher, Evelyn, and Coralou Peel Lassen. "Dear Sarah: Letters Home from a Soldier of the Iron Brigade." Michigan Historical Review 26, no. 2 (2000): 172. http://dx.doi.org/10.2307/20173873.

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Nishikawa, Hiroshi, Tadashi Takemoto, Takashi Uetani, and Norihisa Sekimori. "Effect of Grain Size on Reaction between Pb-Free Solder and Plated Iron." Materials Science Forum 502 (December 2005): 405–10. http://dx.doi.org/10.4028/www.scientific.net/msf.502.405.

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Recently the soldering iron tip has been severely damaged by molten Pb-free solders during operation due to the high reaction rate of metals in molten lead-free solder. The tip is usually protected by plated iron to prevent the direct contact of copper with molten solders. However, the plated iron tip is heavily dissolved into molten Pb-free solders and the life time of the iron tip is reduced. In this study the simple reaction test between Sn-3.0Ag-0.5Cu (mass%) solder and plated iron was carried out to estimate the dissolution of plated iron in molten Pb-free solder and the effect of the grain size of plated surface on the reaction between Pb-free solder and plated iron. An iron-plated copper was used as the test piece. The Pb-free solder was placed on the test piece and it was put into an oven held at 673, 703 and 733K for 3.6, 10.8 and 32.4ks. After heating, the dissolution thickness of plated iron was measured and the intermetallic compound between Pb-free solder and plated iron was analyzed by XRD. As a result, it has been made clear that the dissolution thickness of plated iron decreases with the decrease of the grain size and then the dissolution of plated iron in molten Pb-free solder is attributable to the grain size of plated iron.
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Silva, Luis F. P., Geoff W. Brown, and Peter J. James. "Nutritional Value of Black Soldier Fly Grown on Abattoir Waste." Proceedings 36, no. 1 (April 10, 2020): 216. http://dx.doi.org/10.3390/proceedings2019036216.

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Meat processing plants generate a range of solid and liquid wastes, including manure, paunch solids, and biological solids from wastewater treatment. There is growing interest in alternative technologies for treating abattoir waste, including using insects to transform waste into high-value products. Black Soldier Fly (BSF) larvae may be a competitive source of digestible amino acids and, depending on the protein digestibility, can be used as a replacement for fish meal, soybean meal or cottonseed meal in livestock and aquaculture rations. The objective of this study was to evaluate the effect of using different substrates and substrate mixes from abattoir waste streams on the nutritional quality of BSF harvested at two growth stages (larvae and prepupae). Protein digestibility was evaluated using an adapted pepsin digestion. Averaged across all substrates, there was no difference between growth stages in total protein content (43.7%). However, protein digestibility was higher for larvae (86.5%) than for prepupae (65.1%). The substrate used greatly influenced the nutritional composition of BSF. Prepupae protein content varied from 42 to 48% and protein digestibility varied from 42 to 80%, according to the substrate. Variation in larvae across substrates was greater than prepupae for protein content (34% to 53%) but much lower for digestibility (80% to 91%). Both substrate and growth stage altered the mineral composition of BSF prepupae and larvae. Iron levels varied from 79 (paunch) to 453 mg/kg DM (substrate containing blood), illustrating the plasticity of BSF. In conclusion, BSF can be used to transform abattoir waste into high-value products.
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Szema, Anthony M., Millicent P. Schmidt, Antonio Lanzirotti, Andrea D. Harrington, Sergey Lyubsky, Richard J. Reeder, and Martin A. A. Schoonen. "Titanium and Iron in Lung of a Soldier With Nonspecific Interstitial Pneumonitis and Bronchiolitis After Returning From Iraq." Journal of Occupational and Environmental Medicine 54, no. 1 (January 2012): 1–2. http://dx.doi.org/10.1097/jom.0b013e31824327ca.

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Gawlik-Dziki, Urszula, Piotr Sugier, Dariusz Dziki, Danuta Sugier, and Łukasz Pecio. "Water Soldier Stratiotes aloides L.—Forgotten Famine Plant With Unique Composition and Antioxidant Properties." Molecules 25, no. 21 (October 31, 2020): 5065. http://dx.doi.org/10.3390/molecules25215065.

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Stratiotes aloides L. is common water plant in central Poland. Due to its expansive character, S. aloides L. can strongly affect the functioning of aquatic ecosystems. S. aloides L. was an important famine plant in central Poland. This plant was commonly collected and cooked until the turn of the 20th century. It has also been used to heal wounds, especially when these are made by an iron implement. The objective of the present work was to study the phenolic profile in the leaves and roots of S. aloides as well as their antioxidant potential and ability to inhibit lipoxygenase (LOX) in the light of their potential bioaccessibility. The dominant compound in its leaves was luteolin-7-O-hexoside-glucuronide (5.84 mg/g DW), whereas the dominant root component was chrysoeriol-7-O-hexoside-glucuronide (0.83 mg/g DW). Infusions from leaves, roots, and their 1:1 (v/v) mixture contained potentially bioaccessible antiradical compounds. S. aloides is a good source of water-extractable reductive compounds. Especially valuable are the leaves of this plant. The roots of S. aloides contained very active hydrophilic compounds able to chelate metal ions. However, their potential bioaccessibility was relatively low. The hydrophilic compounds from the leaves were the most effective XO inhibitors (EC50 = 9.91 mg DW/mL). The water-extractable compounds derived from the leaves and roots acted as uncompetitive LOX inhibitors.
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Sekunowo, Olatunde, Stephen Durowaye, and Gbenga Fashakin. "Electrical and Thermal Characterisation of Millscale Modified Sn-Cu Lead-Free Solders." Journal of the Institute of Engineering 15, no. 1 (January 31, 2019): 37–46. http://dx.doi.org/10.3126/jie.v15i1.27702.

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Lead-free solders are gaining much attention as a result of legislation against the inclusion of lead and other hazardous materials in solders used in joining electronic components. This study investigated the effect of iron millscale (IMS) modified tin-copper (Sn-Cu) alloy on the electrical resistivity, electrical, and thermal conductivities of the solder samples under increasing applied current. The input materials consist of tin, zinc and iron millscale while the copper was varied from 0.2 – 1.0 wt. %. Fabrication of the alloy employed metal casting technique followed by relevant test samples preparation for characterisation in terms of microstructure, electrical, and thermal conductivities. Results show that the sample with 1 wt. % Cu addition exhibited the highest electrical and thermal conductivity values of 9967.9 S/m and 11.24 x 10-5 W/mK respectively at applied current value of 600 A with the lowest resistivity of 1 x 10-4 (Ωm). The solder alloy microstructure confirmed the presence of Cu6Sn5-FeO intermetallic phase dispersed in Sn matrix forming a continuous network. Contribution to the overall desirable performance of the solder alloy may have stemmed from the strong and coherent inter-crystal cohesion between the Cu6Sn3 and FeO phases which resulted in improved electrical and thermal conductivities of the as cast solder. The grade of solder alloy fabricated is adjudged suitable for assembling electronic components in industrial plant control panels.
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Nyakeri, E. M., H. J. Ogola, M. A. Ayieko, and F. A. Amimo. "An open system for farming black soldier fly larvae as a source of proteins for smallscale poultry and fish production." Journal of Insects as Food and Feed 3, no. 1 (March 25, 2017): 51–56. http://dx.doi.org/10.3920/jiff2016.0030.

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The utilisation of insect as ingredients for animal feeds has gained considerable interest recently. For example, the potential of black soldier fly (Hermetia illucens; BSF) larvae as a cheap alternative protein source for animal feeds seems to show promising perspectives, especially for poultry and aquaculture feeds. In the present study, we sought to establish the wild availability of BSF in Bondo area of Western Kenya, and to develop appropriate methods for larvae farming for utilisation in smallholder farming systems using organic waste substrates. Using an open system involving a larvae feeding structure, study results showed that BSF is native to the study area with higher production observed on substrates of plant origin compared to those of animal origin. Proximate, mineral and vitamin analysis showed that wild BSF larvae contained: 40% crude protein, 33% crude fat, 15% ash, 12% crude fibre, 0.56% manganese, 3.07% sodium, 0.57% iron, 2.27% potassium, 0.24 mg/100 g thiamin, 2.2 mg/100 g riboflavin and 1.3 mg/100 g vitamin E. This nutritional profile of the wild BSF larvae indicates its potential to serve as a cheap and sustainable substitute protein source. We therefore recommend small-scale poultry and fish farmers to adopt the identified methods for its cultivation as a way of lowering production costs and also contributing to environmental hygiene and sanitation.
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Gariglio, Marta, Sihem Dabbou, Manuela Crispo, Ilaria Biasato, Francesco Gai, Laura Gasco, Francesco Piacente, et al. "Effects of the Dietary Inclusion of Partially Defatted Black Soldier Fly (Hermetia illucens) Meal on the Blood Chemistry and Tissue (Spleen, Liver, Thymus, and Bursa of Fabricius) Histology of Muscovy Ducks (Cairina moschata domestica)." Animals 9, no. 6 (May 31, 2019): 307. http://dx.doi.org/10.3390/ani9060307.

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The present study has evaluated the effects of dietary partially-defatted black soldier fly (BSF; Hermetia illucens L.) larva meal on the blood parameters, antioxidant status, and histological features of the organs of broiler ducks. A total of 192 female 3-days of age Muscovy ducklings (Cairina moschata domestica) were divided into four dietary treatments (0%, 3%, 6%, and 9% BSF meal inclusion; 6 pens/treatment, 8 birds/pen). A total of 12 ducks/treatment (2 birds/pen) were slaughtered at 51 days of age and blood samples were collected to evaluate the haematological traits, serum protein, lipid and minerals, liver and renal function serum enzymes, plasma oxidative enzymes, and metabolites. Liver, spleen, thymus, and bursa of Fabricius samples were submitted to histopathological investigations. Between the serum and plasma traits, triglycerides, cholesterol, creatinine, alkaline phosphatase, magnesium, malondialdehyde, and nitrotyrosine showed a linear decrease for increasing amounts of dietary BSF meal (p <0.01); in contrast, the serum iron concentration showed a linear increase (p <0.01). Moreover, the histopathological findings were not significantly affected by the dietary BSF larva meal inclusion. The results showed that the inclusion of up to 9% BSF larva meal represents a promising feed ingredient for Muscovy duck nutrition, and improved blood traits were observed.
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Takemoto, Tadashi. "High Dissolution Rate of Solid Materials in Molten Lead-Free Solders." Materials Science Forum 580-582 (June 2008): 205–8. http://dx.doi.org/10.4028/www.scientific.net/msf.580-582.205.

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Sn-based lead-free solders have some characteristics that are different from the conventionally used Sn-Pb eutectic. One is the high dissolution rate of metals and alloys into molten lead-free solder. Several problems due to this high dissolution rate were reviewed. The prominent materials that suffered from this high dissolution rate are copper and iron based. High dissolution rate of Cu resulted in thick Cu-Sn intermetallic compound formation during soldering and Cu enrichment in wave soldering bath. The iron-based materials used for soldering equipments are damaged by erosion. Suppression of the dissolution rate is important to secure quality of micro-soldered joints, to prevent contamination of solder bath and to prolong the life of soldering equipments. The method of suppressing dissolution in practical soldering operation and some examples of erosion damage are introduced.
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Dissertations / Theses on the topic "Iron Soldier"

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Macháň, Ladislav. "Detekce přítomnosti olova v pájkách používaných v elektrotechnice." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2008. http://www.nusl.cz/ntk/nusl-217697.

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This work deals with issues of lead detection in solder irons used in electrotechnics. The general aim is to study principles of quantitative heavy metal detection by the electrochemical methods, optimal method selection and construction of detecting instrument.
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Bartoš, Miroslav. "Pistolová páječka s napájením z baterií Li-Ion." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2018. http://www.nusl.cz/ntk/nusl-377105.

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This master‘s thesis deals with the design of battery powered soldering iron. The soldering iron will be placed in the plastic box from a conventional transformer soldering iron. First, we need to find the parameters of the original transformer soldering iron. Then design a synchronous step-down converter, driver of converter, BMS circuits, and component placement in a plastic box. The battery-powered soldering iron was successfully revived and tested, the final parameters of the converter are: voltage 0.4 V at 80 A current. The total power on the soldering wire is 32 W. Technically, this is a very interesting alternative to the classic version of the soldering iron, which can be used for assembly or repairs in poorly accessible locations.
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Ali, Rami. "Beyond the dichotomies of a coercion and voluntary recruitment, Afghan unaccompanied minors unveil their recruitment process in Iran." Thesis, Stockholms universitet, Avdelningen för mellanösternstudier, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:su:diva-167730.

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By shedding light on accounts from unaccompanied Afghan asylum-seeking minors in Sweden who were child soldiers in Syria, this thesis explores and examines their narratives and their involvement in the civil war in Syria. The research aims to create a deeper understanding of how these children themselves made sense of their participation in the war by answering the following questions: How were the children approached by the recruiters? What kind of reasons for joining the war are put forward by the recruiters and what strategies do the children encounter: a) economic; b) identity formation; c) social deprivation; d) feeling of vulnerability; e) militarization; f) mental development; g) ideology/ religious-sectarian; or all together? How do the children perceive these encounters and make sense of their recruitment to the Shiite Fatemiyoun Brigade? To which extent has the ideology of Shi’ism played an important role for them in joining the Syrian War? This is a qualitative study based on in-depth interviews which combines procedures from two approaches and techniques: an ethnographic approach and a narrative approach that explores the interviewees’ experiences in a period of time and also generates detailed insights. Despite the fact that none of the respondents testified for being recruited at gunpoint or having been ill-treated, the respondents emphasized that they were forced to join due to the bad circumstances they were living in. In addition, many similarities with other cases regarding child soldiering in several countries have been explored in this thesis, for instance factors related to the socio- economic context and the experiences that are related to the children’s development processes. Differences can be located in various details regarding ideologies and indoctrination since the respondents did not share the politico-religious purposes of the recruiters.
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Rami, Ali. "Beyond the dichotomies of a coercion and voluntary recruitment Afghan unaccompanied minors unveil their recruitment process in Iran." Thesis, Stockholms universitet, Avdelningen för mellanösternstudier, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:su:diva-167729.

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Boroumand, Armin. "L'exploitation des enfants par le travail en droit international, européen et iranien : étude normative comparée." Thesis, Strasbourg, 2013. http://www.theses.fr/2013STRAA001.

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D’après la Convention n° 182 de l’OIT, toutes les formes d’esclavage ou pratiques analogues, telles que la servitude pour dettes et le servage, la traite, le travail forcé, ainsi que le recrutement obligatoire des enfants dans les conflits armés figurent parmi les pires formes de travail des enfants. Ledit instrument regroupe l’ensemble de ces notions dans une seule et même catégorie pouvant donner lieu à une possible ambiguïté. Le but de ce travail est de faire toute la lumière sur les nuances qui distinguent chacune de ces notions en droit international, européen (en particulier, le droit du Conseil de l’Europe) et iranien. Cette thèse se compose de deux parties. La première partie traite de l’évolution du cadre juridique international, européen et iranien dans la lutte contre le travail des enfants dans son ensemble. La deuxième partie, quant à elle, se penche sur les formes particulièrement graves de travail des enfants, d’ordre économique, qui nécessitent de ce fait un régime juridique spécifique
Child Labour and Child Exploitation in International, European and Iranian law (a Comparative Legal Study): According to the ILO’s Convention No. 182, all forms of slavery or similar practices, such as debt bondage and serfdom, trafficking, forced labour and compulsory recruitment of children for use in armed conflicts appear among the worst forms of child labour. The aforementioned Convention classifies all these concepts into a singlecategory which may give rise to a possible ambiguity. The aim of this thesis is to shed light on the nuances of each of these notions in international, European (in particular, Council of Europe) and Iranian law. This thesis consists of two parts. The first part deals with theevolution of the international, European and Iranian Legal framework in the fight against child labour in general. The second part particularly focuses on grave forms of child labour of economic nature which require a specific legal regime
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Magill, Ronald Jay [Verfasser]. "Inward, Christian soldiers : romantic irony and civic trust in the American mind / vorgelegt von Ronald Jay Magill, Jr." 2006. http://d-nb.info/98169568X/34.

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Szefer, Henry. "The Technology of Copper Alloys, Particularly Leaded Bronze, in Greece, its Colonies, and in Etruria during the Iron Age." Thèse, 2012. http://hdl.handle.net/1866/8414.

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L’objet de la présente étude est le développement, l’application et la diffusion de la technologie associée à divers types d’alliages de cuivre, en particulier l’alliage du plomb-bronze, en Grèce ancienne, dans ses colonies, ainsi qu’en Étrurie. Le plomb-bronze est un mélange de diverses proportions d’étain, de cuivre et de plomb. Le consensus général chez les archéométallurgistes est que le plomb-bronze n’était pas communément utilisé en Grèce avant la période hellénistique; par conséquent, cet alliage a reçu très peu d’attention dans les documents d’archéologie. Cependant, les analyses métallographiques ont prouvé que les objets composés de plomb ajouté au bronze ont connu une distribution étendue. Ces analyses ont aussi permis de différencier la composition des alliages utilisés dans la fabrication de divers types de bronzes, une preuve tangible que les métallurgistes faisaient la distinction entre les propriétés du bronze d’étain et celles du plomb-bronze. La connaissance de leurs différentes caractéristiques de travail permettait aux travailleurs du bronze de choisir, dans bien des cas, l’alliage approprié pour une utilisation particulière. L’influence des pratiques métallurgiques du Proche-Orient a produit des variations tant dans les formes artistiques que dans les compositions des alliages de bronze grecs durant les périodes géométrique tardive et orientalisante. L’utilisation du plomb-bronze dans des types particuliers d’objets coulés montre une tendance à la hausse à partir de la période orientalisante, culminant dans la période hellénistique tardive, lorsque le bronze à teneur élevée en plomb est devenu un alliage commun. La présente étude analyse les données métallographiques de la catégorie des objets coulés en bronze et en plomb-bronze. Elle démontre que, bien que l’utilisation du plomb-bronze n’était pas aussi commune que celle du bronze d’étain, il s’agissait néanmoins d’un mélange important d’anciennes pratiques métallurgiques. Les ères couvertes sont comprises entre les périodes géométrique et hellénistique.
The subject of this study is the development, application and diffusion of the technology of various types of copper alloys, particularly that of leaded bronze, in ancient Greece, its colonies, and in Etruria. Leaded bronze is a mixture of tin, copper and lead in various proportions. The general consensus among archaeometallurgists is that leaded bronze was not commonly used in Greece until the Hellenistic period, and thus this alloy has not received very much attention in archaeological literature. However, metallographic analyses demonstrate that objects composed of leaded bronze had a wide distribution. The analyses also show differentiation in the composition of alloys that were used in the manufacture of various types of bronzes, a tangible indication that metalworkers distinguished between the properties of both tin bronze and leaded bronze. The knowledge of their different working characteristics is what enabled a bronzeworker to choose, in many cases, the appropriate alloy for a specific application. The influence of Near Eastern metallurgical practices produced variations in both the artistic forms as well as alloy compositions of Greek bronzes during the Late Geometric and Orientalizing periods. The use of leaded bronze for particular types of cast objects shows an increasing tendency from the Orientalizing period onwards, culminating in the late Hellenistic period when high-lead bronze became a common alloy. This study analyzes the metallographic data of specific categories of bronze and leaded bronze cast objects, and it will demonstrate that although the use of leaded bronze was not as prevalent as that of tin bronze, it was nevertheless a significant adjunct of ancient metallurgical practices. The periods surveyed range from the Geometric to the Hellenistic periods.
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Books on the topic "Iron Soldier"

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Pardington, John Henry. Dear Sarah: Letters home from a soldier of the Iron Brigade. Bloomington: Indiana University Press, 1999.

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Iron soldiers. New York: Pocket Books, 1994.

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Meštrović, Stjepan Gabriel. The "good soldier" on trial: A sociological study of misconduct by the U.S. military pertaining to Operation Iron Triangle, Iraq. New York: Algora Pub., 2009.

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Meštrović, Stjepan Gabriel. The "good soldier" on trial: A sociological study of misconduct by the U.S. military pertaining to Operation Iron Triangle, Iraq. New York: Algora Pub., 2009.

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Gabriel, Meštrović Stjepan, ed. The "good soldier" on trial: A sociological study of misconduct by the U.S. military pertaining to Operation Iron Triangle, Iraq. New York: Algora Pub., 2009.

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Meštrović, Stjepan Gabriel. The enemy within: The conduct of the US military in convicting the good soldier. New York: Algora Pub., 2009.

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Age of iron. New York, NY: Orbit, 2014.

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Clara, Winston, and Winston Richard, eds. The cross of iron. Costa Mesa, Calif: Noontide Press, 1988.

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Cronin, Stephanie. Soldiers, Shahs and Subalterns in Iran. London: Palgrave Macmillan UK, 2010. http://dx.doi.org/10.1057/9780230309036.

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Heart of iron. Lodi, Calif: Pacifica Pub., 1987.

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Book chapters on the topic "Iron Soldier"

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Cronin, Stephanie. "Introduction: Contesting Power in the New Iran." In Soldiers, Shahs and Subalterns in Iran, 3–43. London: Palgrave Macmillan UK, 2010. http://dx.doi.org/10.1057/9780230309036_1.

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Cronin, Stephanie. "The Provincial Cities in Revolt (i): Colonel Pasyan and the Mashhad Rebellion, April–October 1921." In Soldiers, Shahs and Subalterns in Iran, 44–100. London: Palgrave Macmillan UK, 2010. http://dx.doi.org/10.1057/9780230309036_2.

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Cronin, Stephanie. "The Provincial Cities in Revolt (ii): Major Abulqasim Lahuti and the Tabriz Insurrection of 1922." In Soldiers, Shahs and Subalterns in Iran, 101–27. London: Palgrave Macmillan UK, 2010. http://dx.doi.org/10.1057/9780230309036_3.

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Cronin, Stephanie. "Popular Protest, Disorder and Riot in Iran: The Tehran Crowd and the Rise of Riza Khan, 1921–1925." In Soldiers, Shahs and Subalterns in Iran, 128–57. London: Palgrave Macmillan UK, 2010. http://dx.doi.org/10.1057/9780230309036_4.

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Cronin, Stephanie. "Reform from Above and Resistance from Below, 1927–1929." In Soldiers, Shahs and Subalterns in Iran, 161–200. London: Palgrave Macmillan UK, 2010. http://dx.doi.org/10.1057/9780230309036_5.

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Cronin, Stephanie. "Popular Politics, the New State and the Birth of the Iranian Working Class: The 1929 Abadan Oil Refinery Strike." In Soldiers, Shahs and Subalterns in Iran, 201–37. London: Palgrave Macmillan UK, 2010. http://dx.doi.org/10.1057/9780230309036_6.

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Cronin, Stephanie. "The Politics of Radicalism within the Iranian Army: The Jahansuz Group of 1939." In Soldiers, Shahs and Subalterns in Iran, 238–60. London: Palgrave Macmillan UK, 2010. http://dx.doi.org/10.1057/9780230309036_7.

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Cronin, Stephanie. "Conclusion." In Soldiers, Shahs and Subalterns in Iran, 261–68. London: Palgrave Macmillan UK, 2010. http://dx.doi.org/10.1057/9780230309036_8.

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Nishikawa, Hiroshi, Tadashi Takemoto, Takashi Uetani, and Norihisa Sekimori. "Effect of Grain Size on Reaction between Pb-Free Solder and Plated Iron." In Materials Science Forum, 405–10. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-980-6.405.

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Dumas, Alexandre. "24 Three Guests Astonished to Find Themselves at Supper Together." In The Man in the Iron Mask. Oxford University Press, 2008. http://dx.doi.org/10.1093/owc/9780199537259.003.0025.

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The carriage arrived at the outside gate of the Bastille. A soldier on guard stopped it, but d’Artagnan had only to utter a single word to procure admittance, and the carriage passed on without further difficulty. Whilst they were proceeding along the covered way...
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Conference papers on the topic "Iron Soldier"

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Yoshihara, Sachio. "Newly Developed Real Time Monitoring System for Ionic Migration by Means of Quartz Crystal Microbalance (QCM) and Electrochemical Impedance Spectroscopy (EIS)." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35081.

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Micro-fabricated or Nano-fabricated Printed Circuit Boards (PCB) using environmental friendly materials and processes will be desirable candidates for future electronic packaging technologies. To investigate the ionic migration for thus developed PCB, quite new measurement method has been developed by the authors, which enables real time monitoring of the growth process of ionic migration using QCM (Quartz Crystal Microbalance) and Electrochemical Impedance Spectroscopy (EIS). First part of this research has focused on the QCM method and EIS to study the process of ion migration (hereinafter we call it simply “migration”) in various types of lead-free solder plating and the effects of the reflow (Heat treatments) processing and flux residue of soldering processes. In addition, we investigated the anodic dissolution characteristics of the elements in each type of solder alloy by measuring the current-potential curves in 0.1 kmol m−3 KNO3 solution. When using Sn-3.5 mass%Ag solder plating, reflow processing segregate the stable compound Ag3Sn layer and Sn layer. The Sn layer selectively promotes the anodic dissolution reaction, increasing the occurrence of migration. When using Sn-9 mass%Zn solder plating, the Sn effectively prevents the excessive dissolution reaction of Zn. However, since reflow processing causes each element to separate out, reflow processing lessens the effectiveness of Sn, thus promoting the occurrence of migration. The flux processing of lead-free solders suppresses anodic dissolution and effectively prevents the occurrence of migration. However, with Sn-9 mass%Zn, the lowered adhesion between the flux film and the electrodes is a factor in speeding the growth of migration. The ionic migration of lead free solder in severe NOx circumstance will be commented. Next, electric reliability of the newly developed copper printed boards by NEDO project (L/S = 4/6, 8/12, 12/16 μ□) using polyimide as the substrate have been evaluated under 85 °C, 85%RH. The generation of the migration was tested by conventional time dependence of current under bias of 5.0 V. The progress of the migration could be investigated by EIS (Cole-Cole plots of the impedance). The degradation of the diameter of the impedance loop suggested the intimation of migrations. Finally, in order to establish the micro-fabricated printed circuit boards, “semi-additive” process will be one of the candidates. The process involves the copper etching processes by use of FeCl3 or CuCl2 aqueous solution. But even after the cleansing of such etched substrate, some residue of the iron or copper contaminants will affect the electric reliability of the boards. Such effects have been evaluated by the QCM method. The obtained results suggested that scarce residue of iron contaminants will diminish the reliability rather than residue of copper contaminants.
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2

Lu, Minhua, Paul Lauro, and Charles Goldsmith. "Study of Interfacial Reaction and Electromigration Reliability of Pb-Free Solders With Nickel Iron Barrier Layer." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52052.

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A study of NiFe alloy as under bump metallurgy (UBM) for Pb-free interconnect has been performed. Intermetallic growth rate of NiFe and SnAg solder is about 10x slower than that of Ni and SnAg solder. The thin and uniform intermetallic compound FeSn2 showed excellent thermal and electromigration stability. By slowing down or stopping the UBM dissolution, NiFe effectively eliminated the early EM fails that are common with Ni UBM. NiFe is an interesting candidate for the chip and substrate surface metallurgy of Pb-free interconnects for high power applications.
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3

Imanishi, Ken, Hajime Nomura, Mitsuo Ebisawa, Katsuyuki Tsuji, and Shinichi Enoki. "Melting/Solidification Analysis of the Pb Free-Solder in Sleeve Soldering." In ASME 2015 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/imece2015-51253.

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Automatic soldering technic called Sleeve soldering has been developed recently. In the technic, a ceramic tube has been used instead of a soldering iron. It is called Sleeve. Fixed amount of solder is loaded into this Sleeve. The melted solder is poured from tip of the Sleeve to glue electronic parts into electronic boards. At present Sleeve soldering has been produced and introduced. However condition of soldering failure and concept of process design are not clear due to a few data of melting behavior and solidification. In this research we intended to express these standards by comparing numerical analysis and experiment. Moreover we explain about the establishment of numerical analysis method in this paper. Result in the behavior using the solder model has been similar to actual phenomenon in this simulation. Besides, we have confirmed that the fillet and back fillet was arisen on both sides of the electronic board.
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4

Bunis, Carl B. "High Temperature Solder (Au/Sn) Failures from Nickel Plating Impurities." In ISTFA 2000. ASM International, 2000. http://dx.doi.org/10.31399/asm.cp.istfa2000p0373.

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Abstract High temperature gold/tin eutectic (80 Au/ 20 Sn) solder is used in manufacturing for multiple reasons. These motives may include the ability to post solder a part/device without reflow, high temperature field applications, and allow soldering to thick Au layers without the possibility of precipitating AuSn4 brittle intermetallics. In the following military case, Au/Sn eutectic was employed because of high temperature service and the guarantee of no occurrence of gold embrittlement when soldering to the thick Au outer plating. The Au was plated over an electroplated nickel (Ni) layer on a Kovar (iron/nickel/cobalt) housing. The soldering resulted in an extremely poor bond strength of a duroid circuit to the Kovar housing. The results showed contamination in the supplier’s electroplated Ni bath caused the plating to have poor bond strength. The failure occurred within the Ni plating layer.
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5

Manjunath, Deepak, Satyanarayan Iyer, Shawn Eckel, Purushothaman Damodaran, and Krishnaswami Srihari. "A Repeatable and Reliable Rework Process for Lead-Free Fine Pitch BGA’s." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-83026.

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Fine pitch leadless components, such as Ball Grid Arrays (BGAs) and Chip-Scale Packages (CSPs), are increasingly used in modern day circuitry to aid miniaturization. Assembling these surface mount components using lead-free solder pastes has been a subject of interest for the past several years. Reworking a BGA is complicated as the solder joints are hidden underneath the component. The process window available for the rework process is very narrow and there are number of other critical factors, which complicate and affect the repeatability of the rework process. Consequently, the primary objective of this research endeavor is to develop a reliable and a repeatable process to rework lead-free fine pitch BGAs. The process steps to rework a BGA are component removal, site redressing, solder paste/flux deposition, component replacement and reflow. This experimental study evaluates a number of alternatives for several rework process steps during the course of developing a reliable and repeatable rework process. Two alternatives for site redressing namely, (i) copper wick with soldering iron, and (ii) vacuum de-soldering methods are evaluated. Similarly the application of solder paste versus gel flux is compared. A localized reflow method for replacing the component at the SRT machine is developed and it is compared with forced convection in reflow oven. The pros and cons of using the two reflow methods and the effect of multiple reflows on solder joint reliability is discussed in the paper. A reliability study was conducted on the samples and the results are presented to compare the various alternatives.
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6

Ali, Bakhtiar, Mohd Faizul Mohd Sabri, and Iswadi Jauhari. "Microstructural behavior of iron and bismuth added Sn-1Ag-Cu solder under elevated temperature aging." In THE 2ND INTERNATIONAL CONFERENCE ON FUNCTIONAL MATERIALS AND METALLURGY (ICoFM 2016). Author(s), 2016. http://dx.doi.org/10.1063/1.4958754.

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