Dissertations / Theses on the topic 'Junctional resistance'
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Opp, Daniel. "Transendothelial Migration of Metastatic Cancer Under the Influence of Cigarette Smoke Condensate." Scholar Commons, 2007. http://scholarcommons.usf.edu/etd/3808.
Full textWu, Hawellek ZhenMing. "Formation mechanism and resistance fluctuations of atomic sized junctions /." [S.l.] : [s.n.], 2009. http://edoc.unibas.ch/diss/DissB_8758.
Full textGokce, Aisha. "Low frequency current and resistance fluctuations in magnetic tunnel junctions." Access to citation, abstract and download form provided by ProQuest Information and Learning Company; downloadable PDF file, 203 p, 2009. http://proquest.umi.com/pqdweb?did=1896928791&sid=9&Fmt=2&clientId=8331&RQT=309&VName=PQD.
Full textJiang, Xiuguang. "Experimental study of discrete resistance fluctuations in normal metal tunnel junctions /." The Ohio State University, 1991. http://rave.ohiolink.edu/etdc/view?acc_num=osu1487758680161861.
Full textYoung, Elisa, and elisayoung@iprimus com au. "Endothelial dysfunction in insulin resistance: The role of EDHF and gap junction communication." RMIT University. Medical Sciences, 2007. http://adt.lib.rmit.edu.au/adt/public/adt-VIT20080110.162249.
Full textSalvage, Samantha. "Modulation of gap junctions and the intracellular resistance pathway in guinea-pig myocardium." Thesis, University of Surrey, 2013. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.604348.
Full textBuono, Benedetto. "Simulation and Characterization of Silicon Carbide Power Bipolar Junction Transistors." Doctoral thesis, KTH, Integrerade komponenter och kretsar, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-95320.
Full textQC 20120522
Lee, Hyung-Seok. "Fabrication and Characterization of Silicon Carbide Power Bipolar Junction Transistors." Doctoral thesis, Stockholm : Kungliga Tekniska högskolan, 2008. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-4623.
Full textGiovannini, Federica. "Voltage-dependent calcium channel subtypes at the mouse neuromuscular junction : evidence for the role of a resistant component." Thesis, University of Oxford, 2001. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.365445.
Full textEl, khatib Mariam. "Implication des porines dans la genèse et le développement des biofilms de Providencia stuartii." Thesis, Université Grenoble Alpes (ComUE), 2017. http://www.theses.fr/2017GREAV012/document.
Full textBiofilms, bacterial multicellular communities, are ubiquitous. Despite their importance to the ecosystem, they pose a threat to both industry and human health. The virulence of biofilms is mainly due to their high resistance to antibiotics, which makes their eradication virtually impossible. Thus, biofilms are involved in most chronic bacterial infections, causing each year more than 4,000 deaths in France. P. stuartii is a bacterium known for its ability to form biofilms in the human urinary tract. It is responsible for 10% of chronic nosocomial urinary infections and is described as the most resistant of its kind. Despite these facts, studies on this bacterium are rare, hampering the understanding of the mechanism of development and resistance of its biofilms and thus complicating the advancement of new therapies to fight, prevent or eradicate these infections. P. stuartii expresses at its outer membrane two porins, Omp-Pst1 and Omp-Pst2, which constitute 70% of the membrane protein content. These porins are the main conduit allowing the bacterium to communicate and exchange with its surrounding environment. Thus, porins are vital for the bacteria.To date, three publications are available that deal with these two porins, but none have explored their influence on the formation of bacterial biofilms. The work carried out during my thesis thus aimed to reduce the lack of knowledge about P. stuartii's biofilm and to unveil the role of porins in the establishment and resistance of these biofilms. For this, we have divided our work into four parts aiming at (1) understanding of P. stuartii's biofilms formation and their response to the stresses of the surrounding environment; (2) describing the effect of suppression or overexpression of porins; (3) studying the behavior of isolated porins on a molecular and atomic scale; and (4) developing tools for studying porins on a molecular scale within a biofilm of P. stuartii
Asada, Satoshi. "Improvement of ON-Characteristics in SiC Bipolar Junction Transistors by Structure Designing Based on Analyses of Material Properties and Carrier Recombination." Kyoto University, 2019. http://hdl.handle.net/2433/242510.
Full textMilatz, Susanne. "Funktionelle Charakterisierung des Tight Junction-Proteins Claudin-3 in Epithel- und Endothelzellen." Doctoral thesis, Humboldt-Universität zu Berlin, Mathematisch-Naturwissenschaftliche Fakultät I, 2011. http://dx.doi.org/10.18452/16293.
Full textThe tight junction (TJ) regulates the paracellular transport of ions, water and solutes in epithelia and endothelia and is of particular importance for a correct function of organs and tissues. Although claudin-3 is one of the first identified and ubiquitously expressed TJ components, its specific function was unsolved as yet. For functional characterization, human claudin-3 was stably overexpressed in the leaky epithelial cell line MDCK II. Overexpression of claudin-3 led to a marked alteration of TJ meshwork pattern, a strong increase in transepithelial resistance and a decrease in permeability for ions and paracellular tracers (332 or 4000 Da). Paracellular water transport was not affected. It was proved that claudin-3 acts as a „tightening“ TJ component. The endothelial cell culture model HUVEC was used for analysis of expression and regulation of claudin-3 and several other TJ proteins under different conditions of wall shear stress and oxygen saturation. Treatment with lacking wall shear stress led to an upregulation of the “tightening” TJ proteins occludin, claudin-3, claudin-5, and claudin-11, but not claudin-23. Upregulation of all proteins was due to increased mRNA levels. Apparently, different signaling pathways were involved in regulation of particular TJ components. Combined treatment with lacking shear stress and hypoxia resulted in drastically increased claudin-3 expression. Upregulation of tightening TJ components under lacking shear stress and hypoxic conditions as occuring in different physiological or pathological situations would limit the passage of solutes from the blood into the surrounding tissue.
Chung, Charlotte Yuk-Yan. "Tight Junctions - The Link Between HIV-Associated Intestinal Barrier Dysfunction and Loss of Immune Homeostasis." Case Western Reserve University School of Graduate Studies / OhioLINK, 2015. http://rave.ohiolink.edu/etdc/view?acc_num=case1417822947.
Full textTyagi, Pawan. "FABRICATION AND CHARACTERIZATION OF MOLECULAR SPINTRONICS DEVICES." UKnowledge, 2008. http://uknowledge.uky.edu/gradschool_diss/614.
Full textPiehl, Christian. "Untersuchungen zu parazellulären Barriereeigenschaften von Claudinen." Doctoral thesis, Humboldt-Universität zu Berlin, Mathematisch-Naturwissenschaftliche Fakultät I, 2009. http://dx.doi.org/10.18452/15922.
Full textEpithelial and endothelial cells form the external lining of outer and inner body surfaces and blood vessels of multicellular organisms. Thus, they create separate compartments each exhibiting an environment optimally adjusted to their respective function. To build up such compartments epithelial and endothelial cells have to restrict the paracellular diffusion of substances. The paracellular cleft is sealed by tight junctions (TJ). In electron microscopical images TJs appear as a network of intermembranous strands in the apical region of the lateral cell membrane of epithelial and endothelial cells. Claudins (Cld) form the structural backbone of TJs. The present study provided evidence for the first time that single amino acids of the second extracellular loop (ECL) of a claudin are essential for the paracellular tightness of epithelial cells. The effect of single amino acid substitutions of the second ECL of Cld5 were studied in cells expressing various other endogenous claudins except Cld5. Point mutants of Cld5 were stably expressed in MDCK-II cells. While the expression of Cld5wt caused increased paracellular tightness, this effect was completely abolished by the Cld5 point mutants. Furthermore, the mutants even decreased the paracellular permeation of certain substances compared with the vector control. Further findings of the present study demonstrated that a peptide corresponding to the C-terminal half of the first ECL of Cld1 is capable of opening the TJ in a reversible manner. Using an N-terminal fragment of clostridium perfringens enterotoxin (CPE194-319) a reduction of the paracellular tightness of epithelial cells was demonstrated. Taken together, the findings of the present study contribute to a better understanding of the sealing of the paracellular cleft by claudins. Furthermore, Cld153-81 und CPE194-319 open new perspectives for a targeted therapeutic opening of the TJs suited for enhancing the transport of active substances into diseased tissue.
Aygun, Seymen Murat. "Gas Sensors Based on Ceramic p-n Heterocontacts." Ames, Iowa : Oak Ridge, Tenn. : Ames Laboratory ; distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2004. http://www.osti.gov/servlets/purl/837264-2ckydm/webviewable/.
Full textPublished through the Information Bridge: DOE Scientific and Technical Information. "IS-T 2498" Seymen Murat Aygun. US Department of Energy 12/19/2004. Report is also available in paper and microfiche from NTIS.
Oruganti, Prasad. "Drug Transport in Cell Preparations with Diffusional Dosing and Temporal Ratiometry." Case Western Reserve University School of Graduate Studies / OhioLINK, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=case1269536608.
Full textAlcami, Ayerbe José. "Interactions synaptiques entre les interneurones de la couche moléculaire du cervelet." Thesis, Paris 5, 2013. http://www.theses.fr/2013PA05T021.
Full textMolecular layer interneurons of the cerebellum (MLIs: basket cells and stellate cells) are connected by frequent and strong electrical synapses in young rats and mice around the end of the second postnatal week. Capacitive currents of MLIs show a slow component that reflects the charge of electrically-coupled MLIs. The analysis of capacitive currents makes it possible to quantify the number of directly connected cells and the equivalent number of coupled cells (Alcami and Marty, submitted). They were used to show a difference in coupling between basket and stellate cells and propose a model of the basket cell coupled network. Electrical coupling strength can be modulated by intrinsic currents, like the h current in the hyperpolarizing range. Electrical synapses modify the propagation and the patterns of activity in the MLI network, when the network is excited.The study of connectivity of MLIs by chemical GABAergic synapses led us to reevaluate the sources of error of cell-attached recordings (Alcami et al., 2012). Cell-attached measurements can modify cellular electrical activity of MLIs, by introducing a conductif coupling between the recording pipette and the cell interior, resulting from a combination of passive and active coupling
Stein, Félix. "SPICE Modeling of TeraHertz Heterojunction bipolar transistors." Thesis, Bordeaux, 2014. http://www.theses.fr/2014BORD0281/document.
Full textThe aim of BiCMOS technology is to combine two different process technologies intoa single chip, reducing the number of external components and optimizing power consumptionfor RF, analog and digital parts in one single package. Given the respectivestrengths of HBT and CMOS devices, especially high speed applications benefit fromadvanced BiCMOS processes, that integrate two different technologies.For analog mixed-signal RF and microwave circuitry, the push towards lower powerand higher speed imposes requirements and presents challenges not faced by digitalcircuit designs. Accurate compact device models, predicting device behaviour undera variety of bias as well as ambient temperatures, are crucial for the development oflarge scale circuits and create advanced designs with first-pass success.As technology advances, these models have to cover an increasing number of physicaleffects and model equations have to be continuously re-evaluated and adapted. Likewiseprocess scaling has to be verified and reflected by scaling laws, which are closelyrelated to device physics.This thesis examines the suitability of the model formulation for applicability to production-ready SiGe HBT processes. A derivation of the most recent model formulationimplemented in HICUM version L2.3x, is followed by simulation studies, whichconfirm their agreement with electrical characteristics of high-speed devices. Thefundamental geometry scaling laws, as implemented in the custom-developed modellibrary, are described in detail with a strong link to the specific device architecture.In order to correctly determine the respective model parameters, newly developed andexisting extraction routines have been exercised with recent HBT technology generationsand benchmarked by means of numerical device simulation, where applicable.Especially the extraction of extrinsic elements such as series resistances and parasiticcapacitances were improved along with the substrate network.The extraction steps and methods required to obtain a fully scalable model library wereexercised and presented using measured data from a recent industry-leading 55nmSiGe BiCMOS process, reaching switching speeds in excess of 300GHz. Finally theextracted model card was verified for the respective technology
Najjari, Hamza. "Power Amplifier Design Based on Electro-Thermal Considerations." Thesis, Bordeaux, 2019. http://www.theses.fr/2019BORD0422.
Full textThe aim of this work is to design a power amplifier based on electrothermal considerations. It describes the Dynamic Error Vector Magnitude challenge and long packet issue when designing a power amplifier with hetero-junction bipolar transistors. Based on the circuit electrothermal behavior, an optimization method of both the static and dynamic linearity is proposed. A complete RF front-end (PA + coupler + switch + LNA) is designed for the latest WLAN standard: the Wi-Fi 6. The dynamic temperature distribution in the circuit is analyzed. It’s impact on the performances is quantified. Finally, a programmable temperature dependent bias is designed to compensate for performance degradation. The measurements show a significant linearity improvement with this compensation, allowing the PA to maintain the DEVM lower than -47dB at 14.5 dBm output power, over a large ambient temperature range from -40°C to 85°C
Sahoo, Amit Kumar. "Electro-thermal Characterizations, Compact Modeling and TCAD based Device Simulations of advanced SiGe : C BiCMOS HBTs and of nanometric CMOS FET." Thesis, Bordeaux 1, 2012. http://www.theses.fr/2012BOR14557/document.
Full textAn extensive evaluation of different techniques for transient and dynamic electro-thermal behavior of microwave SiGe:C BiCMOS hetero-junction bipolar transistors (HBT) and nano-scale metal-oxide-semiconductor field-effect transistors (MOSFETs) have been presented. In particular, new and simple approach to accurately characterize the transient self-heating effect, based on pulse measurements, is demonstrated. The methodology is verified by static measurements at different ambient temperatures, s-parameter measurements at low frequency region and transient thermal simulations. Three dimensional thermal TCAD simulations are performed on different geometries of the submicron SiGe:C BiCMOS HBTs with fT and fmax of 230 GHz and 290 GHz, respectively. A comprehensive evaluation of device self-heating in time and frequency domain has been investigated. A generalized expression for the frequency-domain thermal impedance has been formulated and that is used to extract device thermal impedance below thermal cut-off frequency. The thermal parameters are extracted through transistor compact model simulations connecting electro-thermal network at temperature node. Theoretical works for thermal impedance modeling using different networks, developed until date, have been verified with our experimental results. We report for the first time the experimental verification of the distributed electrothermal model for thermal impedance using a nodal and recursive network. It has been shown that, the conventional single pole thermal network is not sufficient to accurately model the transient thermal spreading behavior and therefore a recursive network needs to be used. Recursive network is verified with device simulations as well as measurements and found to be in excellent agreement. Therefore, finally a scalable electro-thermal model using this recursive network is developed. The scalability has been verified through numerical simulations as well as by low frequency measurements and excellent conformity has been found in for various device geometries
Weisz, Mario. "Electrothermal device-to-circuit interactions for half THz SiGe∶C HBT technologies." Thesis, Bordeaux 1, 2013. http://www.theses.fr/2013BOR14909/document.
Full textThe power generate by modern silicon germanium (SiGe) heterojunction bipolar transistors (HBTs) can produce large thermal gradients across the silicon substrate. The device opering temperature modifies model parameters and can significantly affect circuit operation. This work characterizes and models self-heating and thermal coupling in SiGe HBTs. The self-heating effect is evaluated with low frequency and pulsed measurements. A novel pulse measurement system is presented that allows isothermal DC and RF measurements with 100ns pulses. Electrothermal intra- and inter-device feedback is extensively studied and the impact on the performance of two analog circuits is evaluated. Novel test structures are designed and fabricated to measure thermal coupling between single transistors (inter-device) as well as between the emitter stripes of a multi-finger transistor (intra-device). Thermal coupling factors are extracted from measurements and from 3D thermal simulations. Thermally coupled simulations of a ring oscillator (RO) with 218 transistors and of a 60GHz power amplifier (PA) are carried out. Current mode logic (CML) ROs are designed and measured. Layout optimizations lead to record gate delay of 1.65ps. The thermal performance of a 60GHz power amplifier is compared when realized with a multi-transistor array (MTA) and with a multi-finger trasistor (MFT). Finally, perspectives of this work within a CAD based circuit design environment are discussed
D'Esposito, Rosario. "Electro-thermal characterization, TCAD simulations and compact modeling of advanced SiGe HBTs at device and circuit level." Thesis, Bordeaux, 2016. http://www.theses.fr/2016BORD0147/document.
Full textThis work is focused on the characterization of electro-thermal effects in advanced SiGe hetero-junction bipolar transistors (HBTs); two state of the art BiCMOS processes have been analyzed: the B11HFC from Infineon Technologies (130nm) and the B55 from STMicroelectronics (55nm).Special test structures have been designed, in order to evaluate the overall electro-thermal impact of the back end of line (BEOL) in single finger and multi-finger components. A complete DC and RF electrical characterization at small and large signal, as well as the extraction of the device static and dynamic thermal parameters are performed on the proposed test structures, showing a sensible improvement of the DC and RF figures of merit when metal dummies are added upon the transistor. The thermal impact of the BEOL has been modeled and experimentally verified in the time and frequency domain and by means of 3D TCAD simulations, in which the effect of the doping profile on the thermal conductivity is analyzed and taken into account.Innovative multi-finger transistor topologies are designed, which allow an improvement of the SOA specifications, thanks to a careful design of the drawn emitter area and of the deep trench isolation (DTI) enclosed area.A compact thermal model is proposed for taking into account the mutual thermal coupling between the emitter stripes of multi-finger HBTs in dynamic operation and is validated upon dedicated pulsed measurements and TCAD simulations.Specially designed circuit blocks have been realized and measured, in order to verify the accuracy of device compact models in electrical circuit simulators; moreover the impact on the circuit performances of mutual thermal coupling among neighboring transistors and the presence of BEOL metal dummies is evaluated and modeled
Chen, Kuan-chieh, and 程冠傑. "The investigation of AC LED junction temperature and thermal resistance measurement." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/46967063270239645476.
Full text國立中央大學
能源工程研究所
97
The AC LED, which can be operated under alternating current without converter, is fabricated by several microchips in series and parallel. The conventional DC LED junction temperature and thermal resistance measurement system cannot be applied to AC LED, because of the different operation mode. In this study, the author built a system which can measure the highest junction temperature of AC LED. Besides, we also proposed a method for determining the average junction temperature and thermal resistance of AC LED. Furthermore, the junction temperature oscillation of AC LED can also be found using this method, and we found that the AC LED junction temperature oscillation of this experiment is about 7 ℃ under alternating current VRMS 23V with frequency of 60 HZ at room temperature 30℃.
Tan, Qiao-Meng, and 陳俏蒙. "Resistance Switching in ZnO-Based Memristors with a p-n Junction." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/d3gz7g.
Full text國立東華大學
物理學系
105
Resistance switching in ZnO-based memristive devices with a p-n junction has been investigated. Sputtering was performed to prepare devices with layered structures as Ti/ZnO/p+-Si. Programming strategies were developed in terms of using different operation modes, including voltage sweep mode, current sweep mode, and single-pulse mode. The single-pulse mode was found to suppress the multiplicity of the readout resistance levels as compared with the voltage/voltage sweep modes. Furthermore, current compliance was found to significantly affect the device stability during repeated switching operations. Conduction processes leading to the resistive switching were examined for the low-resistance and high-resistance states, conforming the mechanisms dominated by space charge limited current (SCLC) and Poole-Frenkel (PL) trap-associated processes respectively. Instability and device failures were attributed to structural imperfections resulting from preparations.
Chou, Hung-Ju, and 周鴻儒. "A Study on N+-P Ge Shallow Junction and Contact Resistance." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/17604965803753477808.
Full text國立交通大學
電子工程學系 電子研究所
104
Scaling down geometry to enhance transistor’s performance will encounter difficulty due to physical limitation. Therefore, high mobility materials and novel device structures become the emerging research topic. Germanium (Ge) has higher electron and hole bulk mobility than Silicon (Si) so that it is considered as the material for the next generation. However, because there are a lot of interface states distributing near the valence band of germanium, Fermi level would be pinned near valence band. It causes a high Schottky barrier height value nearly about a bandgap of germanium and a large contact resistance for a metal/n-Ge Schottky contact. Moreover, due to the high diffusivity of n-type dopants in Ge, it is hard to form a shallow junction to suppress short channel effect. In this thesis, we fabricate conventional Al-contacted N+-P junction at first. Low ion implantation energy or dose cause a very shallow junction but the leakage current increases. The junction characteristics is not good. Then, the Al-contact is replaced by NiGe-contact and dopant segregation is used to improve junction characteristics. There are two types of dopant segregation process. One is implantation before germanidation (IBG), the other one is implantation after germanidation (IAG). For the IBG process, due to high diffusivity of Ni in Ge, it would make nickel diffuse to the depletion region and cause a high leakage current if junction depth is too shallow. The NiGe-contacted junction can tolerate at 450℃ for 30 sec or 500℃ for 10sec at most as the junction depth becomes shallower than 100 nm (82.06nm). If increasing the temperature or extending the annealing time, the junction would exhibit voltage dependence generation leakage current due to Ni diffusion. Finally, we use the IBG+IAG process to enhance the doping concentration at the NiGe/Ge interface and lower the specific contact resistance to 3×10^(-6)Ω-cm^2 for the mean value. The specific contact resistance of the pure IBG process is 2×10^(-5) Ω-cm^2 for the mean value. Besides, the additional IAG process would not induce more leakage current. The leakage current for the IBG+IAG process keeps as low as that of the IBG junction. This thesis also demonstrates the effect of high dose implantation of Aluminum (Al), Selenium (Se), and Stannum (Sn) on the Schottky barrier height. It is predicted by first-principles calculations that the Se atom can lower the Schottky barrier height of NiGe/Ge the most, the Al atom is hardly to modify the SBH, and the Sn atom can raise the SBH. For the implementation of the Schottky junctions, the Se ion implantation can lower the SBH about 0.15 eV. In brief, this thesis focus on the IBG+IAG process to form a low leakage current and low contact resistance junction. Compared with other studies about contact resistance issue, our process is easier and our test structure of the contact resistance is more accurate. Employing Se ion implantation is expected to further reduce the contact resistance.
Chiu, Chun Wei, and 邱俊維. "Junction Temperature and Thermal Resistance study in Light Emitting Diode Lamps." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/18694100740061163360.
Full text長庚大學
光電工程研究所
98
This study used a generally and accurately method that was called diode forward-voltage method to measure junction temperature, and to obtain the entire thermal resistance. Then, a part of temperature from the radiator module was measured by the J-type thermocouples, and to obtain a part of thermal resistance. According to this measurement, a part of efficiency from the radiator could be analyzed. Compared the junction temperature from chip and lamp of AlGaInP LED under different operating conditions, and discuss the reason why worse radiator of AlGaInP LED lamp; Besides, measuring the power chip LED lamp whose type was Cree XLamp XR-E, and installed the power chip LED lamp on different radiators to compared the junction temperature. In the same manner, discussing the reason that efficiency of radiator from the power chip LED lamp on different radiators by parts of thermal resistance.
Chen, Wei. "The dynamics of sustained reentry in a loop model with discrete gap junction resistance." Thèse, 2007. http://hdl.handle.net/1866/8085.
Full textChen, C. H., and 陳健煌. "A Study of Sheet Resistance Uniformity in Ion-Implanted 12 inch Si Shallow Junction." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/01779653890634569628.
Full text國立中興大學
材料科學與工程學系所
100
With the progress of semiconductor fabrication processes, the device size is getting smaller and circuit layout becomes more complicated. Nevertheless, the current channel of MOSFET is shortened with the shrinking of device size, which will lead to the problem of so-called short channel effect (SCE). In order to suppress the SCE, the ultra-shallow junction (USJ) structure of semiconductor device is introduced and the low energy ion implantation is an important factor in this technique. In this study, the ion implanter was applied to fabricate USJ using Boron ion in n-type (100) Si substrate. The implantation doseage and annealing temperature are 6×1015 ions/cm2 and 950 C, respectively. The drift, process chamber decel and double decel modes of ion implanter controlled conditions were optimized for USJ fabrication. The different decel ratios (1.5 %, 2 % and 3 %) and implant energies (2.5 keV, 3 keV and 3.5 keV) were used to investigate the implant concentration, thermal wave and sheet resistance. The uniformity of sheet resistance is 0.87 % with the decel ration of 1.57 %. The thermal wave unit is 1350 TWU with 3.5 keV implant energy. Finally, the measurement of secondary ion mass spectroscopy was adopted to confirm the implant depth.
Shih, Che-Ju, and 施哲儒. "A Study on the Nickel Germanide Contacted N+-P Germanium Shallow Junction and Contact Resistance." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/75953686017457551375.
Full text國立交通大學
電子工程學系 電子研究所
102
In the past several decades, the research on Si-based devices progresses very fast. Furthermore, the Si-based MOSFETs have been successfully scaled down to 20 nm regime. However, scaling down the devices becomes more and more difficult and reaches the physics limits soon. Therefore, developing another ways to promote the device performance is necessary. Using new semiconducting materials is a way to improve performance. Because germanium has higher mobility and process compatibility for MOSFET fabrication process, germanium is considered to replace Si as the channel material in the future. Nevertheless, the n-type dopant diffusion in germanium is fast so that it is not easy to form shallow n+/p junction, and the high Schottky barrier height at the metal/n-Ge interface causes a high contact resistance due to the Fermi level pinning near the Ge valance band at the interface between metal and germanium. Therefore, the thesis would focus on the forming of shallow n+/p-Ge junction and low resistance metal/n-Ge contact. Because NiGe has the lowest resistivity and low temperature formation, NiGe is selected as the contact metal. The implantation before germanide (IBG) process means ion implantation is performed before germanide formation, and the implantation after germanide (IAG) process means ion implantation is performed after germanide formation. For the IBG junctions fabricated on heavily-doped substrate, very poor junction characteristic is observed by high dose phosphorous ion implantation due to the fast diffusion of Ni by virtue of defects which are generated by ion implantation. Fluorine ion implantation before NiGe formation could effectively suppress Ni diffusion and reduce the leakage current. Moreover, better junction characteristic can be obtained by low dose ion implantation due to the less defects resulting in less Ni diffusion. However, fluorine implantation before NiGe formation would enhance the Ni diffusion to degrade junction characteristic because the fluorine ion implantation induces extra defects. Next, on the lightly-doped substrate, good junction characteristic is more easily to be obtained than on heavily-doped substrate because the deeper junction depth on lightly-doped substrate so that the Ni diffusion would not destroy the junctions. In particular, after NiGe formation, the forward current obviously increases owing to the dopant segregation at the NiGe/Ge interface. Furthermore, either phosphorous or arsenic n+/p junction would have the dopant segregation effect. The arsenic n+/p junctions have relatively low activation concentration inferred by the I-V characteristic. Finally, because the IAG junctions have poor junction characteristic due to the segregated n+ layer is too thin to maintain good n-p junction and the Ni fast diffusion induces large leakage current, the IBG+IAG process is proposed. The IBG+IAG junction could achieve shallow junction depth and raise the forward current at the same time. Furthermore, the measured contact resistance of the IBG junction is about 2x10-5 -cm2 and the lowest contact resistance of IBG+IAG junction is 2x10-6 -cm2.Therefore, this thesis has formed a junction with shallower junction depth, lower leakage current, and lower contact resistance in comparison with previous studies. This achievement is expected to improve the performance of Ge nMOSFETs.
Liao, Hsiu-Hsien, and 廖修賢. "Studies of N+-P Junctions on Ultrathin GeSn/Ge Structure and Self-Aligned Contact Resistance Test Structure." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/2urh6a.
Full text國立交通大學
電子研究所
107
In this thesis, we thoroughly studied N+-P junctions on ultrathin GeSn/Ge structure and successfully developed a novel contact resistance test structure, aimed for source/drain application in modern Si/Ge-based FETs. First, well-behaved N+-P junctions possessing high forward bias current density of 250 A/cm2 at −1 V and high On/Off ratio over 3×104 were realized on ultrathin GeSn/Ge Structure using P ion implantation and low-temperature thermal annealing. Also, various electrical characteristic analyses were carried out to investigate the leakage characteristic of these junctions. Moreover, by performing thermal annealing at different temperatures, we gain an overall insight into the effect of activation temperatures on junction leakage. It is found that the leakage current remains low when samples were annealed at a temperature range of 400oC to 500oC. But, the leakage current of junctions increases drastically when annealing temperatures exceed 550oC. A model is then proposed on the basis of the results of advanced electrical and material characterization to explain ascending junction leakage: A large numbers of defects induced by high-dose ion implantation intermix with Sn atoms escaping from original lattice site. As a result of enhanced Sn diffusion via vacancy-mediated mechanism, Sn atoms come closer to the metallurgical junction of N+-P diode after a high-temperature annealing. These Sn atoms then serve as effective generation-recombination centers in the space-charge region of junction devices. Besides, the effects of activation temperatures and contact interfaces on contact resistance and sheet resistance of Ni/GeSn is preliminarily explored. We observed that all the samples exhibit similar contact characteristics. On the other hand, a novel test structure called self-aligned TLM (SATLM) was designed and fabricated. By realizing self-aligned contact window definition, the robustness of TLM structure towards lateral current spreading effect and nanoscale contact patterning issues can be greatly improved. Using proposed test structure, we demonstrate significant ρ_c extraction of 4.7×10−8 Ω-cm2 for Ti/Si:P contact. In addition, the influence of post-metal annealing temperatures and contact width on extraction results was discussed. Finally, the extraction results of SATLM were verified and compared with that of CBKR structure fabricated under the identical fabrication processes. The proposed structure is thus confirmed to be less vulnerable to the parasitic elements which limit the measurement accuracy.
Liu, Chihi, and 劉知易. "A Study Of Low Resistance Ultra Shallow Junction And Applied To MOSFETs By Low Temperature Microwave Annealing." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/93432138027102352473.
Full text義守大學
電子工程學系
100
When the depth of the channel length is scaled down, will lead to cut-in current add at junction depletion region. As a result, the gate threshold voltage is reduced. The best approach to avoid this phenomenon is ultra-shallow junction. Therefore, ultra-shallow junction becomes an important process. We try to use the National Nano Device Laboratories (NDL) microwave annealing system (Microwave anneal) and with conventional rapid thermal annealing (RTA) for comparison. First, activation by ion implantation and compare MWA and RTA doping material spread. Found by the MWA activation can reduce the dopant diffusion. Second, form different thickness nickel-germanium by the different parameters of MWA and RTA, and the film structure were analyzed. Found that in the same process temperature, MWA can get batter film quality. Finally, reduce the dielectric thickness and use different parameters of MWA and RTA annealing, compared to the RTA, the stronger effect of the MWA patches dielectric layer defects. By MWA replaced RTA produced the CMOS and I-V measurement system for measuring and analyzing. We have successfully produced CMOS transistor gold of the whole microwave process.
Wei, Houng-Chi, and 魏鴻基. "Study of Negative Differential Resistance Characteristics and Application of Delta-Doped Emitter Structure in GaAs-Based Bipolar Junction Transistor." Thesis, 1994. http://ndltd.ncl.edu.tw/handle/50422876995945014468.
Full text國立成功大學
電機工程研究所
82
First, voltage-controllable negative differential resistance characteristics in a N-alGaAs/p-GaAs/n-GaAs transistor structure which the third terminal is placed in the collector are investi- gated. At the applied voltage smaller than the gate voltage, the base-emitter unction is modulated by the gate voltage to con- duct a peak current. When the large applied voltage is applied to the device, the gate voltage is suppressed due to the exist- ence of the gate resistive so that the device is looked like a base-open situation. Therefore, a low valley current is then obtained which in turns achieve a high peak-to-valley current ratio larger than 26000. Next, a new kind of GaAs homojunction bipolar transistor with a delta- doped emitter structure is proposed. The delta-doped emitter structure inducing a triangular barrier is employed to block the minority carriers injection from the base into the emitter. Like a heterojunction transistor, the heavily doped base and lightly doped emitter can be realized. Due to the base- emitter homojunction, the offset voltage is low. The experimental results of these two kinds of the devices in the thesis are in agreement with the theoretical results.
Chen, Bo-Ruei, and 陳柏睿. "The Response Test and Thermal Resistance Analysis of the Junction Temperature for the LED under Different Thermal Interfacial Material." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/77860411862644448863.
Full textAdams, Emily. "Physiology and morphology of epithelia in the freshwater demosponge, Spongilla lacustris." Master's thesis, 2010. http://hdl.handle.net/10048/1411.
Full textPhysiology, Cell and Development Biology
Ngendahayo, Mukiza Clément. "L’entérotoxine STb d’Escherichia coli affecte les jonctions serrées des cellules intestinales épithéliales." Thèse, 2012. http://hdl.handle.net/1866/8937.
Full textEscherichia coli heat-stable toxin (STb) causes diarrhea in Man and animals. STb binds to sulfatide, its receptor, followed by its internalization. Inside the cytoplasm, through a cascade of events, STb triggers the opening of ion channels allowing ion secretion and water loss leading to diarrhea. Tight junctions (TJs) are well known for controlling paracellular traffic of ions and water by forming a physical intercellular barrier in epithelial cells. Some bacterial toxinz are known to affect adversibly TJs. To date, the impact of STb on TJs has not been investigated. The present study aimed to explore the effect of STb on TJs and the barrier function in intestinal epithelial cells. Human colon intestinal epithelial cells (T84) were treated for 24h with either purified STb toxin or an E. coli strains expressing STb. TransEpithelial Resistance (TER), paracellular flux marker and confocal microscopy were used to analyze the effect of STb toxin on TJs. An E. coli strains expressing STb as well as purified STb caused a significant reduction of TER (p<0.0001) parallely to an increase in paracellular permeability to BSA-FITC (p<0.0001) compared to untreated cells or a commensal non toxinogenic E.coli strain. The increased paracellular permeability induced by STb was associated with a marked general dissolution and condensation of central F-actin stress fibers. F-actin disorganisation was accompanied by redistribution and fragmentation of occludin, claudin-1 and ZO-1 (Zonula Occludens-1) proteins. These changes were also observed following intoxication of T84 cells with an 8 amino acids peptide found in the STb sequence corresponding to a consensus sequence of Vibrio cholerae Zot toxin, shown to be involved in TJs disassembly. This effect was not observed with the scramble peptide and D30V mutant. Our findings suggest that STb induces epithelial barrier dysfunction by changes in tight junction proteins that could contribute to the observed diarrhea. These results provide new insight into the diarrhea pathogenesis caused by STb.
Schuhmann, Henning. "Hochauflösende mikroskopische und spektroskopische Untersuchungen zur strukturellen Ordnung an MgO-CoFeB-Grenzflächen." Doctoral thesis, 2014. http://hdl.handle.net/11858/00-1735-0000-0023-9929-2.
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