Academic literature on the topic 'Kontaktování'

V práci sme výskum zamerali na primárne predložky od, do a z v slovenčine a ich ekvi-valenty v srbčine. Spomínané predložky patria do skupiny primárnych predložiek a v oboch skúmaných jazykoch sa viažu s genitívom. Predložky od a do sú v oboch jazykoch formálne a zvukovo úplne zhodné. Slovenská predložka do je kontaktová a vyjadruje uskutočňovanie kontaktu deja s vnútrom objektu. Srbská predložka do je pozičná. Spoločný význam v oboch jazykoch je význam časovej, miestnej a číselnej hranice. Predložkou do sa v oboch jazykoch vyjadruje časová, miestna a číselná hranica, smerovanie dovnútra, spôsob, miera, účel, cieľ, prostriedok. Predložka od v oboch jazykoch patrí k pozičným predložkám, vyjadruje rušenie pozície deja vzhľadom na blízkosť objektu. Vyjadruje priestorové alebo časové vychodisko, príčinu, dôvod, pôvod, spôsob, zreteľ, účel, cieľ. Predložka z sa zaraďujeme ku kontaktovým predložkám, lebo vyjadruje rušenie kontaktu deja s vnútrom alebo s povrchom objektu. Pred-ložka z v spojení s menom v genitíve vyjadruje miestne vzťahy, čas, pôvod, materiál, príčinu, dôvod, spôsob, mieru, prostriedok, zreteľ. V práci sme uviedli aj javy interferencie, keď pod vplyvom srbčiny sa používajú v spisovnej slovenčine nenáležité predložkové konštrukcie.

The thesis summarizes the basic knowledge of Wirebonding. It also closely studying the various influences on the final shape, strength and reliability of the bonds. In the experimental part are found the optimal settings of various wire bonders. For wire bonder TPT HB-10 are found the optimal settings for different types of surfaces, which were contacted.

This work deals with a theoretical analysis of contacting semiconductor chips using wire-bonding method. There are mentioned basic types of chips packages and their contacts. In the thesis is also described software Ansys. The number of the mechanical stress and deformation simulation within micro-wire during thermocompress process were made.

This work deals with silicon chip interconnection with a view to high current up to 10A. A wire bonding method is used for interconnection. The first part of investigation is focused on the modeling and simulation by the help of program ANSYS. Thermo mechanical stressing and current density is important parts of this research. Stress and current density distribution are results of the first part. The experimental part describes transition resistance, electro migration and thermal process in the connection of wire and chip pad. A controlled current source (0 – 10A) is used for measurement. The current source makes it possible to 4-point method measurement with sampling rate 1,5MHz.

The doctoral thesis is aimed at research of application possibilities of low-temperature co-fired ceramics, especially its non-conventional usage. It deals with particular topics ensue from electronic chips package design. The thesis also touches optoelectronic sensor application of this ceramics.

The diploma thesis An analysis of the history of French borrowings' pronunciation from Middle to Modern English on the basis of corpus data attempts to account for the influence of Old French borrowings and their pronunciation on the Middle English phonological system with respect to Modern English. The theoretical part of the thesis explains extralinguistic and intralinguistic aspects of language contact and the related lexical and phonological borrowing, which is followed by an overview of the history of the English and French phonological systems and complemented by the corresponding scribal practices. The research is carried out on a list of French loans extracted from and further studied in Oxford English Dictionary. Selected samples are looked up in a Middle English corpus and their probable pronunciation is inferred on the basis of their orthography. The analysis is concerned with five French phonemes absent in the medieval English.