Academic literature on the topic 'Layer on Substrate'

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Journal articles on the topic "Layer on Substrate"

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Šimelevičius, Dainius, and Romas Baronas. "Amperometrinių biojutiklių su sinerginių substratų stiprinimu kompiuterinis modeliavimas." Informacijos mokslai 56 (January 1, 2011): 174–81. http://dx.doi.org/10.15388/im.2011.0.3139.

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Šiame straipsnyje yra tiriamas amperometrinis biojutiklis, kuriame biojutiklio atsakas yra stiprinamas chemiškai – sinerginiais substratais. Tokiuose biojutikliuose, be substrato, kurio koncentracija matuojama, naudojamas ir pagalbinis substratas, reikalingas substratų sinergetikai. Biojutiklis yra modeliuojamas naudojant nestacionarias netiesines reakcijos-difuzijos lygtis. Modeliuojami keturi biojutiklio sluoksniai: fermento sluoksnis, kuriame vyksta visos biocheminės reakcijos ir difuzija, dializėsmembrana ir difuzijos sluoksnis, kuriuose vyksta tik difuzija ir reakcijos, kuriose nedalyvauj
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Mróz, K. P., and K. Doliński. "Brittle Layer Cracking on Bonded Loaded Substrate." International Journal of Materials, Mechanics and Manufacturing 4, no. 3 (2015): 191–94. http://dx.doi.org/10.7763/ijmmm.2016.v4.254.

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Usikov, Alexander, Sergey Kurin, Iosif Barash, et al. "HVPE GaN Growth on 4H SiC and Die Dicing." Materials Science Forum 858 (May 2016): 1198–201. http://dx.doi.org/10.4028/www.scientific.net/msf.858.1198.

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Hydride Vapor Phase Epitaxy (HVPE) was used to grow 1-4 μm thick undoped GaN layers on 4H-SiC and sapphire substrates. To adjust mechanical strain and crack formation in the GaN/SiC samples, the AlGaN-based buffer layer was grown at low temperature (920-980°C) and the GaN layer was grown at a higher temperature (1000-1040°C). Laser scribing through the GaN layer or the SiC substrate was applied to fabricate dies from the GaN/SiC and GaN/sapphire samples. The laser irradiation passing through the GaN layer to the sapphire substrate or through the SiC substrate to the GaN layer, along two orthog
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Wells, Brendan C., Wei Lin, and HyunJin Park. "Effect of Substrate Layer Variation on Package Warpage." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (2013): 001086–105. http://dx.doi.org/10.4071/2013dpc-wa21.

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As requirements for thinner packages continue to be driven by increased device functionality, warpage has become more and more of a concern in package design and processing. Designers are limited by available materials whose properties are not always capable of achieving low warpage targets. Outside of materials development, techniques in the fabrication processing of organic substrates have served as an important secondary approach to reducing package-level warpage. This is becoming more and more important as the substrate thickness is reduced. For a thin substrate, each layer has a marked im
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Yu, Ho-Chieh (Jay), and Jason Huang. "Investigation of the Direct Plating Copper (DPC) on Al2O3, BeO or AlN Ceramic Substrates for High Power Density Applications." International Symposium on Microelectronics 2016, no. 1 (2016): 000079–86. http://dx.doi.org/10.4071/isom-2016-tp43.

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Abstract In the high power module applications, the power increasing and the size shrinking becomes one of the major topics for the power module design. Due to both the power increasing and the size decreasing, the power density of the device will be much increased. Therefore, not only the thermal conductivity and stability of the substrate material but the long-term material reliability of the substrate have to be seriously considered. For these reasons, the ceramic PCB becomes one of the best solutions. The ceramic substrates now used are normally based on Ag-printed or direct bonding copper
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Zhang, Qiuhong, Betty T. Quinton, Bang-Hung Tsao, et al. "Growth and Characterization of Uniform Carbon Nanotube Arrays on Active Substrates." MRS Proceedings 1752 (2015): 3–14. http://dx.doi.org/10.1557/opl.2015.291.

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ABSTRACTCarbon nanotubes (CNTs) have unique thermal/electrical/mechanical properties and high aspect ratios. Growth of CNTs directly onto reactive material substrates (such as metals and carbon based foam structures, etc.) to create a micro-carbon composite layer on the surface has many advantages: possible elimination of processing steps and resistive junctions, provision of a thermally conductive transition layer between materials of varying thermal expansion coefficients, etc. Compared to growing CNTs on conventional inert substrates such as SiO2, direct growth of CNTs onto reactive substra
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Xu, Mingsan, Jibin Jiang, Bingbing Li, Weilong Cong, and Dongdong Zhang. "Experimental characterizations of laser cladding of iron- and nickel-based alloy powders on carbon steel 1045 for remanufacturing." Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications 232, no. 12 (2016): 1023–35. http://dx.doi.org/10.1177/1464420716660126.

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The purpose of this investigation is to test the laser cladding of different alloy powders onto 1045 medium-carbon steel substrates for parts remanufacturing. The types of alloy powder, laser output powers, and scanning speeds are selected as influencing factors to conduct laser cladding experiments with orthogonal design on the carbon steel 1045 substrate. Bonding shear strength and microhardness of the cladding layer and the substrate are tested and analyzed. The high resolution scanning electron microscopy and energy dispersive X-ray spectroscopy are also used to analyze cladding layers, mi
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Appelt, Bernd K. "Ultra-Slim Packages." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (2012): 001477–506. http://dx.doi.org/10.4071/2012dpc-wa21.

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What does thin or ultra-slim packaging mean? That of course depends on the particular cross-section of the substrate e.g. single layer vs. double layer vs. coreless or embedded component substrate, etc. The thinnest prepreg based substrate and concomitant package is a single layer substrate termed a-S3 ™ and can be as thin as 90 μ and 400 μ, respectively, with the appropriate mold cap. The manufacturing concept for a-S3 has inspired a new manufacturing concept for thin prepreg based coreless substrates with any number of layers. Layers two through five have been demonstrated successfully. The
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Kim, Jae Young, Heejin Lim, Sun Young Lee, et al. "Gold-Nanoparticle Layer Substrate Assisted Transmission-Mode Laser Desorption for Atmospheric Pressure Mass Spectrometry Imaging." Science of Advanced Materials 12, no. 10 (2020): 1517–23. http://dx.doi.org/10.1166/sam.2020.3792.

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We demonstrate continuous-wave laser-based ambient mass spectrometry imaging with the use of a gold-nanoparticle layer substrate. When a fresh tissue slice is placed on a gold-nanoparticle layer substrate and irradiated with a 532-nm continuous-wave laser, the transmission-mode laser configuration provides precise desorption performance to facilitate mass spectrometry imaging. The subsequent ionization process with nonthermal atmospheric pressure plasma jets generates sufficient amounts of molecular ions. By using this method, micrometer-spatial-resolution mass spectrometry imaging of humid ti
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Yan, Zeng, Xiao Yang Huang, Wei Dong Zhou, and Sheng Kai Yu. "Numerical Study on Heat Transfer and Lubricant Depletion in a Heat Assisted Magnetic Recording System with Multilayer Disk Structure." Advanced Materials Research 452-453 (January 2012): 1384–88. http://dx.doi.org/10.4028/www.scientific.net/amr.452-453.1384.

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Heat transfer and lubricant depletion in a HAMR system with multilayer disk substrate are numerically simulated in this study. Cases under two types of multilayer disk substrates with different materials on the top layer as well as different laser powers are examined. The results show the significant effects of the material property and the laser power. Compared with pure glass disk substrate, larger thermal conductivity of top-layer material in the multilayer disk substrate causes faster heat conduction and thus substantial reductions in the temperature increase and lubricant depletion on the
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Dissertations / Theses on the topic "Layer on Substrate"

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amini, manesh navid. "HEAT TRANSFER IN MULTI-LAYER ENERGETIC NANOFILM ON COMPOSITES SUBSTRATE." Master's thesis, University of Central Florida, 2007. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/3191.

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The main purpose of this work is the physical understanding and the numerical description of the reaction of the dense metastable intermolecular composition (MIC). Energy density of MIC is much higher than conventional energetic material; therefore, MIC finds more applications in the propellant and explosive system. The physical model includes the speed of propagation and rate of reaction, and the relationship between the layer thickness, heat rate, and length of the flame based on physical model. In Part I of this thesis, a one-dimensional model based on Weihs was developed for 20 pairs of a
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Amini, Manesh Navid. "Heat transfer in multi-layer energetic nanofilm on composites substrate." Doctoral diss., University of Central Florida, 2010. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/4587.

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Numerical model was also used to estimate three major variables for a range of 30-60 m/s. In fact, the maximum combustion flame temperature that corresponds to flame speed along with the length of the flame, density of the product behind the flame, and maximum penetration depth in steady reaction, were calculated. These studies will aid in the design of nEM multilayer thin film. As further numerical and experimental results are obtained for different nEM thicknesses, a unified model involving various parameters can be developed.; The main purpose of this work is to find a physical and numerica
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Poehler, Scott A. "Transport Phenomena of CVD Few-Layer MoS2 As-grown on an Al2O3 Substrate." The Ohio State University, 2015. http://rave.ohiolink.edu/etdc/view?acc_num=osu1440181154.

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Ainsworth, Joseph. "A numerical model of the propagation characteristics of multi-layer ridged substrate integrated waveguide." Thesis, University of Manchester, 2012. https://www.research.manchester.ac.uk/portal/en/theses/a-numerical-model-of-the-propagation-characteristics-of-multilayer-ridged-substrate-integrated-waveguide(23c69a19-694c-41c6-8870-5c09e5734362).html.

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A transmission line format is presented which takes the form of a Multilayer Ridged Substrate Integrated Waveguide, for which signal energy is transmitted within standard PCB substrates, within a wave-guiding structure formed from conducting tracks in the horizontal plane and arrays of through-plated vias in the vertical plane. The Substrate Integrated Waveguide (SIW) is a recent development into which research is so far concentrated on single-layer rectangular variants which, like traditional rectangular waveguide, are amenable to analytic computation of the cutoff eigenvalues. Recent publica
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Jeedigunta, Sathyaharish. "Development of cadmium selenide as an absorber layer for tandem solar cells." [Tampa, Fla.] : University of South Florida, 2004. http://purl.fcla.edu/fcla/etd/SFE0000279.

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Balkan, Haluk. "Thin layer with circular debonding over a substrate under either axisymmetric compression or thermal loading." Diss., The University of Arizona, 1996. http://hdl.handle.net/10150/187500.

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The objective of this dissertation is to present analytical solutions to the problem of a circular debonded thin film on a substrate subjected to either axisymmetric compressive stress or uniform thermal loading. In the case of the axisymmetric compressive stress, the solution method utilizes the three-dimensional equations of elastic stability while allowing the debonded region to be slightly open. The in-plane axisymmetric compressive stress is present only in the thin film. In the case of thermal loading, both the film and the substrate are subjected to the same uniform temperature variatio
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Chaitoglou, Stefanos. "Growth Study and Characterization of Single Layer Graphene Structures Deposited on Copper Substrate by Chemical Vapor Deposition." Doctoral thesis, Universitat de Barcelona, 2016. http://hdl.handle.net/10803/400402.

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Graphene was first isolated from graphite using the method called the tape by scientists at the University of Manchester (Andre Geim, Konstantin Novoselov); such work was later awarded the Nobel Prize in Physics (2010) highlighting its innovative contribution. Still, the method of the tape or mechanical exfoliation can not provide larger domains graphene some hundred micrometers. different technologies that could promote the synthesis of continuous layers of graphene large area in order to boost the potential for large-scale applications were needed. Synthesis chemical vapor deposition (CVD) o
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Manoi, Athikom. "Study of thermal properties of GaN-based HEMTs : the effects of thermal crosstalk, nucleation layer, and substrate." Thesis, University of Bristol, 2011. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.541641.

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Choudhury, Sakeb Hasan [Verfasser], and Robert [Akademischer Betreuer] Schlögl. "Atomic layer deposition of Manganese oxide on Carbon substrate for electrocatalytic water splitting / Sakeb Hasan Choudhury ; Betreuer: Robert Schlögl." Duisburg, 2020. http://d-nb.info/1217595023/34.

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Melo, Tede Fernandes. "Obtaining an photovoltaic solar cell based in CdS and TiO2 photosensitized with dye in glass substrate with conductive layer." Universidade Federal do CearÃ, 2014. http://www.teses.ufc.br/tde_busca/arquivo.php?codArquivo=12131.

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CoordenaÃÃo de AperfeÃoamento de Pessoal de NÃvel Superior<br>This research describes the process of obtaining a photovoltaic cell, since getting electrical conductor glasses used for the flow of electrons coming from the photovoltaic effect until the deposition of thin films of semiconductor titanium dioxide (TiO2) and cadmium sulfide (CdS) at each of these glasses. The use of natural or synthetic dyes deposited on titanium dioxide layer has the objective to increase the absorption spectrum of the TiO2, since sunlight emits most of its energy in the frequency range of visible light. After joi
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Books on the topic "Layer on Substrate"

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Sloof, Willem Gerrit. Internal stresses and microstructure of layer/substrate assemblies: Analysis of TiC and TiN coatings chemically vapour deposited on various substrates. Delft University Press, 1996.

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Ogbuji, L. U. J. T. Process-induced carbon and sub-layer in SiC/BN/SiC composites: Characterization and consequences. National Aeronautics and Space Administration, Glenn Research Center, 2001.

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Cho, Hyo Suk. Plasma nitrocarburising of ferrous substrates and property measurements of the compound layer. University of Birmingham, 1998.

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Hahn, H. J. Method for the production of strongly adhesive metal films on titanium and titanium alloys with a metallization process [microform]. National Aeronautics and Space Administration, 1986.

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Hahn, H. J. Method for the production of strongly adhesive metal films on titanium and titanium alloys with a metallization process [microform]. National Aeronautics and Space Administration, 1986.

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Woodcock, Thomas George. The crystallographic texture and morphology of nickel oxide layers grown on textured nickel and nickel alloy substrates. University of Birmingham, 2003.

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Keski-Rahkonen, Olavi. Effect of the substrate on the results of the fire tests of thin layers of floor, wall, and ceiling coverings. Technical Research Centre of Finland, 1992.

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Jamarani, F. Deposition of single-layer and graded aluminum nitride coatings on vanadium substrates using ion-beam assisted reactive evaporation (ITER task no. ETA-EC-BRL26). Canadian Fusion Fuels Technology Project, 1994.

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He, Junfeng. Angle-Resolved Photoemission Spectroscopy on High-Temperature Superconductors: Studies of Bi2212 and Single-Layer FeSe Film Grown on SrTiO3 Substrate. Springer, 2016.

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He, Junfeng. Angle-Resolved Photoemission Spectroscopy on High-Temperature Superconductors: Studies of Bi2212 and Single-Layer FeSe Film Grown on SrTiO3 Substrate. Springer, 2018.

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Book chapters on the topic "Layer on Substrate"

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Ochiai, Shojiro, T. Tomida, Toyomitsu Nakamura, et al. "Fracture Behavior of Brittle Coating Layer on Metal Substrate." In Materials Science Forum. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-960-1.929.

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Nowacki, Jerzy Paweł. "2D Electro-Elastic Fields in a Piezoelectric Layer-Substrate Structure." In Static and Dynamic Coupled Fields in Bodies with Piezoeffects or Polarization Gradient. Springer Berlin Heidelberg, 2006. http://dx.doi.org/10.1007/978-3-540-31670-1_10.

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Ivanov, S. T., and N. I. Nikolaev. "Magnetoplasmons Guided by a Cyrotropic Plasma Layer on a Metal Substrate." In Advanced Technologies Based on Wave and Beam Generated Plasmas. Springer Netherlands, 1999. http://dx.doi.org/10.1007/978-94-017-0633-9_59.

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Hwang, Jae Sun, Sang Bae Lee, Keun Taek Oh, Kyoung Nam Kim, and Kwang Mahn Kim. "Titanium Oxide Layer with Micro and Nano Tubes on Titanium Substrate." In Bioceramics 18. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-992-x.379.

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Chen, Haifeng, and Duan Xie. "Optical Characteristics of Antireflection of SiN Layer on the Si Substrate." In Advances in Intelligent Systems and Computing. Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-38789-5_48.

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Back, In Jae, Su Cheol Gong, Hun Seoung Lim, et al. "Field Effect Transistor with ZnS Active Layer on ITO/Glass Substrate." In Materials Science Forum. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-431-6.753.

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Kakimoto, Kazuomi, Yuich Ishida, and Yuh Shiohara. "Preparation of Intermediate Buffer Layer Between YBCO Film and YSZ Substrate." In Advances in Superconductivity IX. Springer Japan, 1997. http://dx.doi.org/10.1007/978-4-431-68473-2_38.

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Hoppenbrouwers, Marc B., Gerrit Oosterhuis, Guido Knippels, and Fred Roozeboom. "Laser-Assisted Wafer Processing: New Perspectives in Through-Substrate Via Drilling and Redistribution Layer Deposition." In Handbook of 3D Integration. Wiley-VCH Verlag GmbH & Co. KGaA, 2014. http://dx.doi.org/10.1002/9783527670109.ch08.

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Lee, Sang Soon. "Determination of Singular Residual Stresses in Epoxy Layer Deposited on Concrete Substrate." In Key Engineering Materials. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-978-4.1277.

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Chrisochoides, Nikos, Kevin Barker, Démian Nave, and Chris Hawblitzel. "The Mobile Object Layer: A Run-Time Substrate for Mobile Adaptive Computations." In Computing in Object-Oriented Parallel Environments. Springer Berlin Heidelberg, 1998. http://dx.doi.org/10.1007/3-540-49372-7_7.

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Conference papers on the topic "Layer on Substrate"

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Zhang, Martin Y., Qiong Nian, and Gary J. Cheng. "Deposition of Al-Doped Zinc Oxide by Direct Pulsed Laser Recrystallization at Room Temperature on Various Substrates for Solar Cell Applications." In ASME 2012 International Manufacturing Science and Engineering Conference collocated with the 40th North American Manufacturing Research Conference and in participation with the International Conference on Tribology Materials and Processing. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/msec2012-7381.

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In this study, a method combining room temperature pulsed laser deposition (PLD) and direct pulsed laser recrystallization (DPLR) are introduced to deposit superior transparent conductive oxide (TCO) layer on low melting point flexible substrates. As an indispensable component of thin film solar cell, TCO layer with a higher quality will improve the overall performance of solar cells. Alumina-doped zinc oxide (AZO), as one of the most promising TCO candidates, has now been widely used in solar cells. However, to achieve optimal electrical and optical properties of AZO on low melting point flex
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Jiang, Jibin, Guofu Lian, Mingsan Xu, Chunyu Li, Bingsan Chen, and Bingbing Li. "Influence of Preheating Temperature on Mechanical Properties of Laser Cladding Layer." In ASME 2016 11th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/msec2016-8718.

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Physical and chemical changes always occur in the process of laser cladding, and the cladding quality is directly affected by processing parameters. This paper mainly focused on effects of temperature field of preheating substrate on the cladding quality. Laser cladding process has the following experimental parameters: laser power, powder feeding rate and rotational speed. Three types of cladding powders were used: Ni60A, Cr12MoV and WC-Co. Experiments were conducted by using different substrate preheating temperatures and cladding materials, which affect the quality of cladding layers. Compa
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Kaijun Song, Yong Fan, Guiqin Yue, and Bo Zhang. "Novel substrate integrated waveguide layer-to-layer transitions." In 2008 Asia Pacific Microwave Conference. IEEE, 2008. http://dx.doi.org/10.1109/apmc.2008.4958215.

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Takenaka, Shoichi, Shoji Ito, Ryoichi Kishihara, Masahiro Okamoto, and Osamu Nakao. "Polyimide Multi-Layer Substrate for High-Density Semiconductor Package." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73065.

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We have developed a polyimide multi-layer substrate for semiconductor package. Interstitial via holes filled with conductive paste make the electrical connection in any layers in the multi-layer substrate to realize high-density wiring. The substrate shows reliable resistance to moisture and heat. Use of polyimide film make the substrate considerable thin compared to the conventional method using glass-epoxy. The present multi-layer substrate can be applied to a promising interposer for high-density semiconductor such as multi-chip module and stacked chip.
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Kongsuwan, Panjawat, Grant B. Brandal, and Y. Lawrence Yao. "Laser Induced Porosity and Crystallinity Modification of a Bioactive Glass Coating on Titanium Substrates." In ASME 2015 International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/msec2015-9272.

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Functionally graded bioactive glass coatings on bioinert metallic substrates were produced by using continuous-wave (CW) laser irradiation. The aim is to achieve strong adhesion on the substrates and high bioactivity on the top surface of a coating material for load-bearing implants in biomedical applications. The morphology and microstructure of the bioactive glass from the laser coating process were investigated as functions of processing parameters. Laser sintering mechanisms were discussed with respect to the resulting morphology and microstructure. It has been shown that double layer lase
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Chenni, Bouzid, Andre Moreau, and J. Pouliquen. "NDE of zinc layer on steel substrate using laser-ultrasonic SAW." In NDE For Health Monitoring and Diagnostics, edited by Norbert Meyendorf, George Y. Baaklini, and Bernd Michel. SPIE, 2002. http://dx.doi.org/10.1117/12.469621.

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Mori, Hiroyuki, Sayuri Kohara, Keishi Okamoto, Hirokazu Noma, and Kazushige Toriyama. "Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48741.

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Coefficient of thermal expansion (CTE) characteristic of organic materials for substrates in flip chip package application demanded by semiconductor package requirements is becoming lower than ever. In general, height restrictions are imposed on package-on-package (PoP) devices in mobile applications. One should hence establish a tight budget on the height variation in manufacturing of the devices. Given such background, a lowering of the CTE characteristic of package substrates is an attractive solution for reducing package deformation upon manufacturing, since it contributes to minimize CTE
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Mariyama, Shota, Kunio Sakakibara, and Nobuyoshi Kikuma. "Design of Hollow Waveguide to Substrate Integrated Waveguide Transition in Multi-layer Substrate." In 2019 International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM). IEEE, 2019. http://dx.doi.org/10.1109/iwem.2019.8887913.

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Pech, J., B. Hannoyer, A. Denoirjean, and P. Fauchais. "Influence of Substrate Preheating Monitoring on Alumina Splat Formation in DC Plasma Process." In ITSC 2000, edited by Christopher C. Berndt. ASM International, 2000. http://dx.doi.org/10.31399/asm.cp.itsc2000p0759.

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Abstract This paper is devoted to the study of alumina splats formation and the adhesion/cohesion of alumina coatings on oxidized 1040 steel substrates. When preheating with the plasma torch, a duplex oxide layer is formed with an upper hematite and an under magnetite. Measurements have been performed on oxide layers with 470 nm average thickness corresponding to preheating times of about 10 min. In these conditions, the relative thickness of each sub-layer can be controlled by monitoring the heating rate and the preheating temperature. When the hematite upper layer is thick, it is mostly brok
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Wei, Z., C. Dames, and Y. Chen. "Substrate Effects on the Thermal Conductivity of Single Layer Supported Graphene." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-63304.

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A non-equilibrium molecular dynamics model is developed to calculate the thermal conductivity of single layer graphene supported on silicon dioxide. We use the Tersoff potential to describe the carbon-carbon interactions within graphene, and a Lennard-Jones (LJ) potential to describe the interactions between graphene and silicon dioxide. To overcome possible artifacts of thermal expansion, the model avoids using any periodic or fixed boundary conditions for the graphene flake. For both smooth and rough substrates, the simulations show that increasing the LJ coupling strength between graphene a
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Reports on the topic "Layer on Substrate"

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Carvalho, Marco. XLAYER: A Cross-Layer Communications Substrate for Tactical Environments. Defense Technical Information Center, 2010. http://dx.doi.org/10.21236/ada524233.

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Lioubtchenko, M., A. Suvkhanov, N. Parikh, J. Hunn, and D. Bray. Formation of a buried soft layer in SiC for compliant substrate by ion implantation. Office of Scientific and Technical Information (OSTI), 1997. http://dx.doi.org/10.2172/459397.

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Prasad, Kuldeep R., and Dale P. Bentz. Thermal performance of fire resistive materials II. A multi-layer one-dimensional heat transfer model for fire resistive materials protecting a substrate. National Institute of Standards and Technology, 2008. http://dx.doi.org/10.6028/nist.ir.7482.

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Kinlein, Scott, Anindya Ghoshal, James Ayers, and Daniel Cole. Lipid Layer-based Corrosion Monitoring on Metal Substrates. Defense Technical Information Center, 2013. http://dx.doi.org/10.21236/ada579985.

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Rogers, John. Inorganic Substrates and Encapsulation Layers for Transient Electronics. Defense Technical Information Center, 2014. http://dx.doi.org/10.21236/ada607424.

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Melde, Kathleen L. Exploring New RF Circuit Structures with Embedded Patterned Substrate Layers. Defense Technical Information Center, 2013. http://dx.doi.org/10.21236/ada616694.

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George, Steven M. Atomic Layer Deposition of Metal Oxides on sp2-Graphitic Carbon Substrates. Defense Technical Information Center, 2014. http://dx.doi.org/10.21236/ada608981.

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Koleske, Daniel David, Stephen Roger Lee, Thomas Kerr Lemp, Michael Elliott Coltrin, Karen Charlene Cross, and Gerald Thaler. Nanostructural engineering of nitride nucleation layers for GaN substrate dislocation reduction. Office of Scientific and Technical Information (OSTI), 2009. http://dx.doi.org/10.2172/985493.

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Dickens, Brian. Photoacoustic infrared spectroscopy of thin polyimide layers on glass substrates. National Institute of Standards and Technology, 1997. http://dx.doi.org/10.6028/nist.ir.6097.

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Chang, T., and M. A. Havstad. Design of a substrate heater for calcium hydroxyapatite coating by pulsed laser ablation. Office of Scientific and Technical Information (OSTI), 1995. http://dx.doi.org/10.2172/113932.

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