Relevant bibliographies by topics / Lead-free electronics manufacturing processes

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Lead-free electronics manufacturing processes'

Author: Grafiati
Published: 4 June 2021
Last updated: 29 January 2023

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Journal articles on the topic "Lead-free electronics manufacturing processes"

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Syed-Khaja, Aarief, Christopher Kaestle, and Joerg Franke. "Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit Carriers." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000517–22. http://dx.doi.org/10.4071/isom-2016-poster1.

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Abstract Additive manufacturing (AM) has the potential to lead significant changes in the present state-of-the-art production processes. This provides tool-free and direct manufacturing of complex geometries simultaneously integrating various functions into components. Though AM techniques are widely used in various sectors, the application into electronics production has been not yet explored. In electronics production, substrate development has high relevance due to their multi-functionality in giving the mechanical support and electrically connecting electronic components. This contribution introduces an innovative approach in the development of high-temperature substrates through additive layered manufacturing. The technique used in the investigations was selective laser melting (SLM) of copper based powder materials mainly bronze alloy and pure copper, for the generation of conductive patterns on ceramic surfaces. The process parameters for the SLM technique and the influential factors in the generation of conductive structures are discussed in detail.
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Gyenes, A., M. Benke, N. Teglas, E. Nagy, and Z. Gacsi. "Investigation of Multicomponent Lead-Free Solders." Archives of Metallurgy and Materials 62, no. 2 (June 1, 2017): 1071–74. http://dx.doi.org/10.1515/amm-2017-0156.

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Abstract According to the directives (RoHS and WEEE) adopted by the European Union, lead has been banned from the manufacturing processes because of its health and environmental hazards. Therefore, the development of lead-free solders is one of the most important research areas of the electronic industry. This paper investigates multicomponent Sn-Ag-Cu based lead-free solders with different compositions. The properties of the six-component Innolot (SAC+BiSbNi) and two low-Ag containing alloys were compared with the widespread used SAC307 solder. Microstructure investigations and X-ray diffraction measurements were performed to analyze and identify the formed phases, furthermore, tensile tests and microhardness measurements were executed to determine the mechanical properties of the examined solders.
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Tulkoff, Cheryl, and Greg Caswell. "Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000341–44. http://dx.doi.org/10.4071/isom-2011-tp4-paper4.

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Leadless, near chip scale packages (LNCSP) like the quad flat pack no lead (QFN) are the fastest growing package types in the electronics industry today. Early LNCSPs were fairly straightforward components with small overall dimensions, a single outer row of leads and small lead counts. However, there is currently a proliferation of advanced LNCSP package styles that have started to approach BGA packages in terms of both size and number of connections. Some of the newer packages have 3 or more rows, pitches as fine as .35mm, lead counts exceeding 200, and dimensions exceeding 12 mm × 12 mm. While the advantages of these packages are well documented, concerns arise with both reliability and manufacturability in Pb-free environments. So, acceptance of these packages in long-life, severe-environment, high-reliability applications is somewhat limited. One of the most common drivers for reliability failures is the inappropriate adoption of new technologies like LNCSP. Since robust manufacturing and qualifications standards always lag behind implementation, users must carefully select and validate these components for suitability in their use environments and customer applications. Soldering, flexure, and cleanliness issues have driven many failures seen in production and in the field. All of these areas must be addressed early in the selection and validation processes. In this paper, we will review and discuss LNCSP related reliability concerns and challenges, and propose Physics-of- Failure (PoF) based approaches to allow the successful introduction and failure analysis of LNCSP components in electronics products.
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Datta, Madhav. "Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview." Journal of Micromanufacturing 3, no. 1 (December 17, 2019): 69–83. http://dx.doi.org/10.1177/2516598419880124.

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Electronic packaging is the methodology for connecting and interfacing the chip technology with a system and the physical world. The objective of packaging is to ensure that the devices and interconnections are packaged efficiently and reliably. Chip–package interconnection technologies currently used in the semiconductor industry include wire bonding, tape automated bonding and flip-chip solder bump connection. Among these interconnection techniques, the flip-chip bumping technology is commonly used in advanced electronic packages since this interconnection is an area array configuration so that the entire surface of the chip can be covered with bumps for the highest possible input/output (I/O) counts. The present article reviews the manufacturing processes for the fabrication of flip-chip bumps for chip–package interconnection. Various solder bumping technologies used in high-volume production include evaporation, solder paste screening and electroplating. Evaporation process produces highly reliable bumps, but it is extremely expensive and is limited to lead or lead-rich solders. Solder paste screening is cost-effective, but issues related to excessive void formation limits the process to low-end products. On the other hand, electrochemical fabrication of flip-chip bumps is an extremely selective and efficient process, which is extendible to finer pitch, larger wafers and a variety of solder compositions, including lead-free alloys. Electrochemically fabricated copper pillar bumps offer fine pitch capabilities with excellent electromigration performance. Due to these virtues, the copper pillar bumping technology is emerging as a lead-free bumping technology option for high-performance electronic packaging.
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Shaddock, David, Cathleen Hoel, Nancy Stoffel, Mark Poliks, and Mohammed Alhendi. "Additively Manufactured Extreme Temperature Electronics Packaging." International Symposium on Microelectronics 2021, no. 1 (October 1, 2021): 000189–94. http://dx.doi.org/10.4071/1085-8024-2021.1.000189.

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Abstract There is growing interest in extreme temperature electronics to support the mission needs to sense, actuate, and communicate at temperatures beyond the normal range of operations in commercial and military applications. Reliable packaging in the temperature range of more than 300°C has been demonstrated using ceramic multi-chip modules using conventional hybrid circuit technology. This approach typically requires high NRE costs and lead time. Additive manufacturing processes of metals, ceramics, conductors, and dielectrics provides a digital transformation of hybrid circuit manufacturing technology that reduces time and cost for packaging with the added benefits of novel 3D structures and embedded features. This report presents the results of testing to characterize important electrical and mechanical properties of additively manufactured packaging materials (substrates, conductor, dielectrics) and die interconnect methods needed for 300 to 750 °C electronic packaging designs.
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Hart, Dan, John Ganjei, and Nilesh Kapadia. "Enabling MSL-1 Capability for QFN and Other Design Leadframe Packages." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000137–42. http://dx.doi.org/10.4071/isom-2010-ta4-paper6.

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As the conversion of the electronics industry to lead free soldering materials continues some unexpected negative side effects of higher lead free reflow temperatures have occurred. Defects such as delamination or “popcorning” in surface mount components have increased significantly since lead free soldering has become mainstream. Popcorning is a defect that manifests itself as a fracture between the epoxy based encapsulant and the metal, usually copper alloy, leadframe components used to form a surface mount component. This fracture occurs when moisture in the package volatilizes during reflow processes and forces its way through the encapsulation material and leadframe interface. Peak reflow temperatures for leaded solder typically run around 215° – 225° C but due to the higher melting point of lead free solders, they require peak reflow temperatures of 240° to 260° C range. This 30° increase in reflow temperatures can have a significant effect on the electronic devices and any resident moisture in the component The keys to popcorning, or delamination, defect reduction is twofold. The first objective is to enhance the bond between the encapsulant and the copper leadframe materials to form a stronger bond that can resist the vapor pressures induced during reflow. The other objective is to provide a superior bond between the leadframe and encapsulant thus minimizing moisture ingress. New chemical treatment processes have been developed that pre-treat the copper surfaces of the leadframe and significantly enhance the bond between the encapsulant material and the metal leadframe. The chemical treatment process results in micro-roughening of the copper surfaces and at the same time depositing a thermally robust film that enhances the chemical bond between the epoxy encapsulant material and the copper. This paper examines the possible issues and the real life successes when comparing standard component manufacturing methods to those that incorporate the aforementioned chemical adhesion promotion process. Components are assembled using both processes and final performance is tested using MLS-1 conditioning protocols, acoustic microscopy analysis (SAM), and final yield improvement.
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Gharaibeh, Ali, Ilona Felhősi, Zsófia Keresztes, Gábor Harsányi, Balázs Illés, and Bálint Medgyes. "Electrochemical Corrosion of SAC Alloys: A Review." Metals 10, no. 10 (September 23, 2020): 1276. http://dx.doi.org/10.3390/met10101276.

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Tin–silver–copper (SAC) solder alloys are the most promising candidates to replace Sn–Pb solder alloys. However, their application is still facing several challenges; one example is the electrochemical corrosion behaviour, which imposes a risk to electronics reliability. Numerous investigations have been carried out to evaluate the corrosion performance of SAC lead-free alloys, regarding the effect of the corrosive environment, the different manufacturing technologies, the effect of fluxes, the metallic contents within the SAC alloys themselves, and the different alloying elements. In these studies, widely used electrochemical techniques are applied as accelerated corrosion tests, such as linear sweep voltammetry and electrochemical impedance spectroscopy. However, there is lack of studies that try to summarise the various corrosion results in terms of lead-free solder alloys including low-Ag and composite solders. This study aims to review these studies by showing the most important highlights regarding the corrosion processes and the possible future developments.
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Wickham, Martin, Kate Clayton, Ana Robador, Chris Hunt, Robin Pittson, Laura Statton, Tina Brown, Fiona Lambert, and Tracy Wotherspoon. "Development of a High Temperature Interconnect Solution as an Alternative to High Lead or Gold Content Solders." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, HiTEC (January 1, 2016): 000196–206. http://dx.doi.org/10.4071/2016-hitec-196.

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AbstractA collaborative research programme between project partners Microsemi, the National Physical Laboratory (NPL) and Gwent Electronic Materials (GEM), has successfully developed innovative materials specifically designed to offer an alternative for high Pb or Au content materials to increase the operating temperature of electronic assemblies. Currently, for electronic assemblies to operate at high temperature, they must use a high lead solder or a very expensive gold based solder to withstand these temperatures. The ELCOSINT project has developed an inexpensive lead-free alternative for joining high temperature electronics suitable for operating at temperatures above 250°C utilising standard surface mount assembly processes. This paper summarises the work undertaken by the authors to develop and better understand this new family of electrical interconnection materials. The project brought together a materials supplier (GEM – Gwent Electronic Materials), an end-user (MSL - Microsemi) and an technology research organisation (NPL – National Physical Laboratory) to jointly develop, test and implement in production, the solution based on silver-loaded silicone materials. This paper focuses on the testing and materials evaluation undertaken at NPL to determine the long term performance of these alternative materials including high temperature ageing up to 300°C, thermal cycling and damp heat testing. Details of the shear strength and electrical performance of interconnects between the substrates and components during the test regimes are given. The manufacturing process is outlined including details of the test vehicles utilised. The processing temperature for the conductive adhesive is 250°C which offers additional advantages in potential improvements in component and substrate reliability compared to soldered solutions which would typically be processed at temperatures above 300°C.
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Mitovski, Aleksandra, Dragana Zivkovic, Ljubisa Balanovic, Nada Strbac, and Zivan Zivkovic. "Life cycle assessment (LCA) of lead-free solders from the environmental protection aspect." Chemical Industry 63, no. 3 (2009): 163–69. http://dx.doi.org/10.2298/hemind0903163m.

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Life-cycle assessment (LCA) presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA) and life-cycle impact assessment (LCIA), are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu), BSA (Bi-Sb-Ag) and SABC (Sn-Ag-Bi-Cu) respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including the potentials for dissolution and recycling processes.
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Lau, Chun Sean, C. Y. Khor, D. Soares, J. C. Teixeira, and M. Z. Abdullah. "Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review." Soldering & Surface Mount Technology 28, no. 2 (April 4, 2016): 41–62. http://dx.doi.org/10.1108/ssmt-10-2015-0032.

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Purpose The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed. Design/methodology/approach Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process. Findings With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed. Practical implications This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process. Originality/value The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.
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Dissertations / Theses on the topic "Lead-free electronics manufacturing processes"

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Ma, Hongtao Johnson R. Wayne Suhling J. C. "Characterization of lead-free solders for electronic packaging." Auburn, Ala., 2007. http://repo.lib.auburn.edu/2006%20Fall/Dissertations/MA_HONGTAO_31.pdf.

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Woo, Belemy Hok Chung. "Solderability & microstructure of lead-free solder in leadframe packaging." access abstract and table of contents access full-text, 2005. http://libweb.cityu.edu.hk/cgi-bin/ezdb/dissert.pl?msc-ap-b21175214a.pdf.

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Thesis (M.Sc.)--City University of Hong Kong, 2005.
At head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.
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Anson, Scott J. "Analysis of lead free tin-silver-copper and tin-lead solder wetting reactions." Diss., Online access via UMI:, 2007.

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Marquez, de Tino Ursula. "Reduction of nitrogen consumption of lead-free reflow processes and prediction models for behaviors of lead-free assemblies." Diss., Online access via UMI:, 2009.

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Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009.
Includes bibliographical references.
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Iyengar, Deepti Raju Lall Pradeep. "Initialization and progression of damage in lead free electronics under drop impact." Auburn, Ala, 2008. http://repo.lib.auburn.edu/EtdRoot/2008/FALL/Mechanical_Engineering/Thesis/Iyengar_Deepti_35.pdf.

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Li, Jing. "Evaluation and improvement of the robustness of a PCB pad in a lead-free environment." Diss., Online access via UMI:, 2007.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007.
Includes bibliographical references.
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Liu, Yueli Johnson R. Wayne. "Lead-free assembly and reliability of chip scale packages and 01005 components." Auburn, Ala., 2006. http://hdl.handle.net/10415/1311.

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Wang, Qing Johnson R. Wayne Gale W. F. "Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applications." Auburn, Ala., 2005. http://repo.lib.auburn.edu/2005%20Summer/doctoral/WANG_QING_29.pdf.

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Kirkpatrick, Timothy. "The kinetics of tin solidification in lead-free solder joints." Diss., Online access via UMI:, 2006.

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Hinshaw, Robert Bruce Lall Pradeep. "Reliability of lead-free and advanced interconnects in fine pitch and high I/O electronics subjected to harsh thermo-mechanical environments." Auburn, Ala, 2009. http://hdl.handle.net/10415/1907.

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Books on the topic "Lead-free electronics manufacturing processes"

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Michael, Pecht, and Ganesan Sanka, eds. Lead-free electronics. Hoboken, NJ: Wiley, 2006.

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Subramaniam, K. N. Lead-free solders: Materials reliability for electronics. Hoboken, NJ: John Wiley & Sons, 2012.

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ASTM Committee D-2 on Petroleum Products and Lubricants, ed. Lead-free solders. West Conshohocken, PA: ASTM International, 2011.

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Vardaman, Jan. The lead-free movement: Environmentally friendly electronics manufacturing. Austin, Tex: TechSearch International, 2000.

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1963-, Shangguan Dongkai, ed. Lead-free solder interconnect reliability. Materials Park, OH: ASM International, 2005.

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Pang, John Hock Lye. Lead free solder: Mechanics and reliability. New York, NY: Springer, 2012.

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Joseph, Shany, and Shany Joseph. Electroplating of lead free solder for electronics. Hauppauge, N.Y: Nova Science Publishers, 2010.

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Bath, Jasbir, Carol A. Handwerker, and Gregory Arthur Henshall. Lead-free solder process development. Hoboken, N.J: Wiley, 2010.

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Lead-free implementation and production: A manufacturing guide. New York: McGraw-Hill, 2005.

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Joseph, Shany. Electroplating of lead free solder for electronics. Hauppauge, N.Y: Nova Science Publishers, 2010.

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Book chapters on the topic "Lead-free electronics manufacturing processes"

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Rao, Srinivas, Jasbir Bath, and Harjinder Ladhar. "Lead-free Manufacturing." In Lead-free Electronics, 101–38. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/047000780x.ch4.

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"Lead-Free Electronic Reliability: Higher Temperature." In Green Electronics Manufacturing, 133–56. CRC Press, 2012. http://dx.doi.org/10.1201/b12518-10.

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"Fatigue Characterization of Lead- Free Solders." In Green Electronics Manufacturing. CRC Press, 2012. http://dx.doi.org/10.1201/b12518-4.

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"Fatigue Characterization of Lead-Free Solders." In Green Electronics Manufacturing, 61–82. CRC Press, 2012. http://dx.doi.org/10.1201/b12518-7.

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"Flip-Chip Assembly for Lead-Free Electronics." In Green Electronics Manufacturing, 251–72. CRC Press, 2012. http://dx.doi.org/10.1201/b12518-15.

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"Let’s Package a Lead-Free Electronic Design." In Green Electronics Manufacturing, 323–49. CRC Press, 2012. http://dx.doi.org/10.1201/b12518-18.

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"Lead-Free Electronic Reliability: Finite Element Modeling." In Green Electronics Manufacturing, 83–106. CRC Press, 2012. http://dx.doi.org/10.1201/b12518-8.

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"Lead-Free Electronic Reliability: Fatigue Life Model." In Green Electronics Manufacturing, 107–32. CRC Press, 2012. http://dx.doi.org/10.1201/b12518-9.

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"Flip-Chip Bonding Technique for Lead-Free Electronics." In Green Electronics Manufacturing, 273–98. CRC Press, 2012. http://dx.doi.org/10.1201/b12518-16.

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"Fatigue Design of Lead-Free Electronics and Weibull Distribution." In Green Electronics Manufacturing, 157–90. CRC Press, 2012. http://dx.doi.org/10.1201/b12518-11.

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Conference papers on the topic "Lead-free electronics manufacturing processes"

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Nagarkar, Kaustubh, Tan Zhang, David Esler, David Simon, Paul Gillespie, Sandeep Tonapi, Prameela Susarla, and Ryan Mills. "Development of No Flow Underfills for Lead-Free Flip Chip Applications." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-13420.

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Flip chip packaging is one of the fastest growing segments in electronics packaging technology. The semiconductor packaging industry is continuing to migrate towards Pb-free electronics assembly. Therefore, the development of compatible materials for Pb-free flip chip packaging is critical to this transition [1]. Flip chip devices are commonly underfilled to compensate for the mismatch in the Coefficient of Thermal Expansion (CTE) between the die and the chip carrier. The No Flow Underfill (NFU) process is a type that can increase the throughput of the flip chip assembly process and reduce manufacturing costs. Significant research has been performed to develop NFUs for eutectic applications. However, further research is required for the development of NFUs that are compatible with the Pb-free solders and the high temperature reflow process associated with these solders. In this paper, the challenges associated with the development of 'filled' underfill formulations for assembly with the 95.5Sn/3.8Ag/0.7Cu bumped flip chip devices are discussed. The effects of process variables that affect voiding in the underfill layer have been presented. The impact on voiding due to stencil printing of the underfill has been discussed. The impact on assembly reliability due to the underfill material properties has also been reported.
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Bruno, Felix, Purushothaman Damodaran, Krishnaswami Srihari, and Guhan Subbarayan. "An Experimental Study on Voids in Mixed Alloy Assemblies." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-13556.

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The electronics manufacturing industry is gradually migrating towards to a lead-free environment. During this transition, there will be a period where lead-free materials will need to coexist with those containing lead on the same assembly. The use of tin-lead solder with lead-free parts and lead-free solder with components containing lead can hardly be avoided. If it can be shown that lead-free Ball Grid Arrays (BGAs) can be successfully assembled with tin-lead solder while concurrently obtaining more than adequate solder joint reliability, then the Original Equipment Manufacturers (OEMs) will accept lead-free components regardless of the attachment process or material used. Consequently, the Electronics Manufacturing Service (EMS) providers need not carry both the leaded and the unleaded version of a component. Solder voids are the holes and recesses that occur in the joints. Some say the presence of voids is expected to affect the mechanical properties of a joint and reduce strength, ductility, creep, and fatigue life. Some believe that it may slow down crack propagation by forcing a re-initiation of the crack. Consequently, it has the ability to stop a crack. The primary objective of this research effort is to develop a robust process for mixed alloy assemblies such that the occurrence of voids is minimized. Since there is no recipe currently available for mixed alloy assemblies, this research will study and 'optimize' each assembly process step. The difference between the melting points of lead-free (217°C) and tin-lead (183°C) solder alloys is the most important constraint in a mixed alloy assembly. The effect of voids on solder joint reliability in tin-lead assembly is well documented. However, its effect on lead-free and mixed alloy assemblies has not received due attention. The secondary objective of this endeavor is to determine the percentage of voids observed in mixed alloy assemblies and compare the results to both tin-lead and lead-free assemblies. The effect of surface finish, solder volume, reflow profile parameters, and component pitch on the formation of voids is studied across different assemblies. A designed experiments approach is followed to develop a robust process window for mixed alloy assemblies. Reliability studies are also conducted to understand the effect of voids on solder joint failures when subjected to accelerated testing conditions.
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Yao, Y. Lawrence, Richard N. Smith, Ralph L. Resnick, K. P. Rajurkar, John H. Givens, Warren E. Maher, and Bin Wei. "Emerging Technologies and Research Issues in Nontraditional Manufacturing." In ASME 2001 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2001. http://dx.doi.org/10.1115/imece2001/med-23352.

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Abstract There are significant transport issues that arise in the development, assembly, qualification, and manufacturing of organic packages. These issues include diverse areas like chemical processing of printed wiring boards (PWBs) during etching, plating and rinsing, lamination of cores, drilling of plated through holes, profiling (the separation of individual chip carriers or PWBs from a large panel) and adhesive curing, all of which occur during the manufacturing of the PWBs and chip carriers. During assembly and rework, transport issues arise in solder reflow during module attach and re-work, adhesive cure during heat-sink attach, and under-fill and curing processes in flip chip packages. Similar, but more complex, processes are encountered in wafer level packaging. During reliability stress testing, concerns arise about establishment of appropriate stress and acceleration factors that relate the accelerated tests to actual field conditions. During shipping and handling, similar concerns arise in simulating potential temperature excursions that may occur. In addition to these thermal and transport issues, manufacturing processes may induce interfacial de-lamination due to surface conditions resulting from process history, residual stresses in the package that impact the thermal performance of the package and manufacturing tolerances that inherently affect the thermal performance. Additionally, ever reducing time-to-market demands novel methods of package manufacture and reliability qualification. Experimentally validated modeling and simulation must play an important role towards this goal. The methodologies and tools must continuously be upgraded to achieve true concurrent engineering. In spite of the wide spread use of numerical simulation, there is much that remains to be done to make simulation truly useful to the practicing engineer in the electronics cooling and packaging area. Among the important shortcomings are: (i) restriction to disciplinary boundaries — electronics cooling and packaging is inherently interdisciplinary, but nearly all simulation tools are discipline-specific; (ii) an emphasis on analysis rather than on synthesis — there are few tools to translate insights from detailed component-level simulations into a broader systemic view; and (iii) long lead times and, consequently, an inability to impact the short time-scale design processes inherent to the electronics manufacturing/ packaging area. The purpose of this panel session is to initiate discussion and idea exchange related to some of these topics. The tone of the panel is set by presentations by panelists addressing the technology aspects of packaging, processes and materials covering three broad issues: substrates, assembly and system-level packaging. The emerging technology challenges in each of these areas will be addressed with attendant examples mainly from computer, automotive electronics. Technology roadmaps will be discussed with special reference to the needs of the automotive electronics of the future. These needs will be translated into the required technology solutions in the substrate, assembly, and packaging arenas. The presentations will also identify future areas of research in modeling and simulation that address the technology broadly related to the technology needs identified above. Such modeling and simulation topics are multi-disciplinary in nature enveloping design, materials selection, and manufacturability. While these topics are of great interest to industry from a concurrent engineering point of view, they also present a great challenge to the academic community to integrate multi-disciplinary nature of this problem and develop truly predictive methods and tools for pervasive use in the industry. The panelists are a combination of industrial and academic researchers as can be seen from their attached biographies below and they will share their vision for long term resolution of this vision.
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4

Chung, Chunhui, Glenn Melendez, and Imin Kao. "Experimental Study of Lapping Using Mixed Abrasive Grits." In ASME 2009 International Manufacturing Science and Engineering Conference. ASMEDC, 2009. http://dx.doi.org/10.1115/msec2009-84210.

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Wafers made of materials such as silicon, III-V and II-VI compounds, and optoelectronic materials, require high-degree of surface quality in order to increase the yield in micro-electronics fabrication to produce IC chips and devices. Measures of properties of surface quality of wafers include: nanotopography, surface morphology, global planarization, total thickness variation (TTV) and warp. Due to the reduction of feature size in micro-electronics fabrication, the requirements of such properties become more and more stringent. To meet such requirements, the wafer manufacturing processes of brittle semiconductor materials, such as slicing, lapping, grinding, and polishing have been continually improved. In this paper, the lapping process of wafer surface treatment is studied with experimental results of surface roughness and material removal rate. In order to improve the performance of lapping process, effects of mixed abrasive grits in the slurry of the free abrasive machining (FAM) processes are studied using a single-sided wafer-lapping machine. Under the same slurry density, experiments employing different mixing ratios of large and small abrasive grits, and various normal loadings on the wafer surface applied through a jig are conducted for parameter study. With various mixing ratios and loadings, observations and measurements such as the total amount of material removed, material removal rate, surface roughness, and relative angular velocity are presented and discussed in this paper. The experiments show that the half-half mixing ratio of abrasives removes more material than other mixing ratios under the same conditions, but with a higher surface roughness. The results of this study can provide a good reference to the FAM processes that practitioners use today by exploiting different mixing ratios and loadings of abrasive slurry in the manufacturing processes.
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Hadidi, Haitham, Brady Mailand, Tayler Sundermann, Ethan Johnson, Rakeshkumar Karunakaran, Mehrdad Negahban, Laurent Delbreilh, and Michael Sealy. "Dynamic Mechanical Analysis of ABS From Hybrid Additive Manufacturing by Fused Filament Fabrication and Shot Peening." In ASME 2020 15th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/msec2020-8253.

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Abstract The mechanical properties of 3D printed polymers parts are process parameter dependent. Defects such as inadvertent voids between deposited rasters and layers lead to weakness in produced parts, which results in inferior mechanical properties as compared to injection molding. An alternative method to change energy absorption and stiffness of a polymer is hybrid additive manufacturing (AM). Hybrid-AM is the use of additive manufacturing with one or more secondary processes that are fully coupled and synergistically affect part quality, functionality, and/or process performance. In this study, fused filament fabrication (FFF) was coupled with layer-by-layer shot peening to study the dynamic mechanical properties of ABS 430 polymer using dynamic mechanical analysis (DMA). FFF is a heated extrusion process. Shot peening is a mechanical surface treatment that impinges a target with a stochastically dispersed, high velocity stream of beads. Compressive residual stress was imparted to preferential layer intervals during printing to modify the elasticity (stiffness), viscosity, toughness, and glass transition temperature. Viscoelastic and dynamic mechanical properties are important to the performance of polymers in automotive, aerospace, electronics, and medical components. Coupling printing and peening increased the storage and loss moduli as well as the tangent delta. DMA results suggest that preferential layer sequences exist that possess higher elasticity and better absorb energy upon sinusoidal dynamic loading.
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6

Leng, Eu Poh, Min Ding, Ibrahim Ahmad, Hoh Huey Jiun, and Kamarudin Hazlinda. "Lead-free Flux Effect in Lead-free Solder Joint Improvement." In 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEEE, 2006. http://dx.doi.org/10.1109/iemt.2006.4456509.

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7

Siu-Lung Ng, A. Vaidya, V. Venkataraman, B. Murcko, K. Srihari, and R. Rai. "Environmental Conservation Through Lead-Free Electronics Manufacturing." In Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. IEEE, 2006. http://dx.doi.org/10.1109/isee.2006.1650059.

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8

Kannabiran, Anand, Sreekanth Varma Penmatsa, S. Manian Ramkumar, and Reza Ghaffarian. "Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33963.

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The primary objective of this experimental research is to understand the common issues faced in a manufacturing environment that assembles products containing a variety of fine-pitch devices. The testing phase of the research, relates to characterizing the thermo-mechanical integrity of surface mount mixed (Sn-Pb & lead-free) assembly solder joints. The investigation involves both forward and backward compatibility in electronics assemblies on Pb-free PWB surface finishes. A full factorial design is used in the investigation, with 3 factors — solder paste, component finish and PWB surface finish. Eutectic Sn-Pb paste (63–37% wt) and SAC305 (Sn 3.0%Ag0.5%Cu) paste are used as Pb-containing and Pb-free levels respectively. For component finish metallization, Sn-Pb termination finish/bump composition is used for Pb-containing level while Sn termination/SAC 405 bump composition represents the Pb-free level. Immersion Silver (ImAg) and Electroless Nickel Immersion Gold (ENIG) surface finish on printed wiring board (PWB) is used for testing and analysis. The testing was aimed at providing results for a wide variety of fine-pitch components commonly used in surface mount solder assemblies. Hence, a PWB containing flip chip (0.4mm pitch), Ultra chip scale package (UCSP), micro-lead frame (MLF) or quad flat pack no-lead (QFN), thin small outline package (TSOP −0.5 mm pitch) and plastic ball grid array (PBGA −1156 I/O and 256 I/O −1 mm pitch) devices was designed and used for testing. The test vehicle also includes resistors (0201, 0402 & 0603). The stencil thickness and openings were selected to accommodate both the large PBGA (1156 I/O) and finer pitch components. The reflow profile was designed taking into account the component maximum temperature exposure limitations, due to non-uniformity in heating, determined from thermocouples during initial assembly. Lessons learned from the design, reflow process optimization and manufacturing are presented in this paper. The solder joints were subjected to isothermal aging followed by mechanical shock test, attempting to establish a relationship between the intermetallic growth at the solder/PWB interface and the mechanical integrity of the solder joint. The compounding of test, unlike singular test methods, provides a more realistic estimate of the reliability and life of the joint in the field. The assemblies were cross-sectioned after the tests and the microstructure of the solder joints will be analyzed to study the intermetallic growth upon isothermal aging.
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9

Chen, Jeff. "Peek for Lead-Free Soldering Processes and Electronics Applications." In Circuits Technology Conference (IMPACT). IEEE, 2008. http://dx.doi.org/10.1109/impact.2008.4783825.

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10

Sammakia, Bahgat, Koneru Ramakrishna, Frank Andros, Jayathi Y. Murthy, Vijay Sarihan, D. H. R. Sarma, and Sanjeev Sathe. "Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages." In ASME 2001 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2001. http://dx.doi.org/10.1115/imece2001/med-23350.

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Abstract:
Abstract There are significant transport issues that arise in the development, assembly, qualification, and manufacturing of organic packages. These issues include diverse areas like chemical processing of printed wiring boards (PWBs) during etching, plating and rinsing, lamination of cores, drilling of plated through holes, profiling (the separation of individual chip carriers or PWBs from a large panel) and adhesive curing, all of which occur during the manufacturing of the PWBs and chip carriers. During assembly and rework, transport issues arise in solder reflow during module attach and re-work, adhesive cure during heat-sink attach, and under-fill and curing processes in flip chip packages. Similar, but more complex, processes are encountered in wafer level packaging. During reliability stress testing, concerns arise about establishment of appropriate stress and acceleration factors that relate the accelerated tests to actual field conditions. During shipping and handling, similar concerns arise in simulating potential temperature excursions that may occur. In addition to these thermal and transport issues, manufacturing processes may induce interfacial de-lamination due to surface conditions resulting from process history, residual stresses in the package that impact the thermal performance of the package and manufacturing tolerances that inherently affect the thermal performance. Additionally, ever reducing time-to-market demands novel methods of package manufacture and reliability qualification. Experimentally validated modeling and simulation must play an important role towards this goal. The methodologies and tools must continuously be upgraded to achieve true concurrent engineering. In spite of the wide spread use of numerical simulation, there is much that remains to be done to make simulation truly useful to the practicing engineer in the electronics cooling and packaging area. Among the important shortcomings are: (i) restriction to disciplinary boundaries — electronics cooling and packaging is inherently interdisciplinary, but nearly all simulation tools are discipline-specific; (ii) an emphasis on analysis rather than on synthesis — there are few tools to translate insights from detailed component-level simulations into a broader systemic view; and (iii) long lead times and, consequently, an inability to impact the short time-scale design processes inherent to the electronics manufacturing/ packaging area. The purpose of this panel session is to initiate discussion and idea exchange related to some of these topics. The tone of the panel is set by presentations by panelists addressing the technology aspects of packaging, processes and materials covering three broad issues: substrates, assembly and system-level packaging. The emerging technology challenges in each of these areas will be addressed with attendant examples mainly from computer, automotive electronics. Technology roadmaps will be discussed with special reference to the needs of the automotive electronics of the future. These needs will be translated into the required technology solutions in the substrate, assembly, and packaging arenas. The presentations will also identify future areas of research in modeling and simulation that address the technology broadly related to the technology needs identified above. Such modeling and simulation topics are multi-disciplinary in nature enveloping design, materials selection, and manufacturability. While these topics are of great interest to industry from a concurrent engineering point of view, they also present a great challenge to the academic community to integrate multi-disciplinary nature of this problem and develop truly predictive methods and tools for pervasive use in the industry. The panelists are a combination of industrial and academic researchers as can be seen from their attached biographies below and they will share their vision for long term resolution of this vision.
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