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1

Michael, Pecht, and Ganesan Sanka, eds. Lead-free electronics. Hoboken, NJ: Wiley, 2006.

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2

Subramaniam, K. N. Lead-free solders: Materials reliability for electronics. Hoboken, NJ: John Wiley & Sons, 2012.

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3

ASTM Committee D-2 on Petroleum Products and Lubricants, ed. Lead-free solders. West Conshohocken, PA: ASTM International, 2011.

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4

Vardaman, Jan. The lead-free movement: Environmentally friendly electronics manufacturing. Austin, Tex: TechSearch International, 2000.

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5

1963-, Shangguan Dongkai, ed. Lead-free solder interconnect reliability. Materials Park, OH: ASM International, 2005.

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6

Pang, John Hock Lye. Lead free solder: Mechanics and reliability. New York, NY: Springer, 2012.

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7

Joseph, Shany, and Shany Joseph. Electroplating of lead free solder for electronics. Hauppauge, N.Y: Nova Science Publishers, 2010.

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8

Bath, Jasbir, Carol A. Handwerker, and Gregory Arthur Henshall. Lead-free solder process development. Hoboken, N.J: Wiley, 2010.

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9

Lead-free implementation and production: A manufacturing guide. New York: McGraw-Hill, 2005.

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10

Joseph, Shany. Electroplating of lead free solder for electronics. Hauppauge, N.Y: Nova Science Publishers, 2010.

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11

Katsuaki, Suganuma, ed. Lead-free soldering in electronics: Science, technology and environmental impact. New York: Marcel Dekker, 2004.

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12

Global life cycle impact assessments of material shifts: The example of a lead-free electronics industry. London: Springer, 2010.

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13

Plumbridge, W. J. Structural integrity and reliability in electronics: Enhancing performance in a lead-free environment. Dordrecht: Kluwer Academic Publishers, 2003.

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14

Minn.) IPCWorks '99 (1999 Minneapolis. IPCWorks '99: An international summit on lead-free electronics assemblies : proceedings, October 23-28, 1999, Minneapolis, MN. Northbrook, IL: IPC, 1999.

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15

Minn.) IPCWorks '99 (1999 Minneapolis. IPCWorks '99: Minutes : an international summit on lead-free electronics assemblies, October 23-28, 1999, Minneapolis, MN. Northbrook, IL: IPC Association Connecting Electronic Industries, 1999.

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16

Company, PennWell Publishing. SMT: 2006 step-by-step collection. Tulsa, OK: PennWell Corporation, 2008.

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17

Company, PennWell Publishing, ed. SMT: 2006 step-by-step collection. Tulsa, OK: PennWell Corporation, 2008.

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18

H, Lau John, ed. Electronics manufacturing: With lead-free, halogen-free, and conductive-adhesive materials. New York, NY: McGraw-Hill, 2003.

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19

Green electronics design and manufacturing: Implementing lead-free and RoHS-compliant global products. New York: McGraw-Hill, 2008.

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20

Lead-free electronics. Hoboken, NJ: Wiley-Interscience, 2006.

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21

Ganesan, Sanka, and Michael G. Pecht. Lead-Free Electronics. Wiley & Sons, Incorporated, John, 2008.

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22

Bath, Jasbir, Carol A. Handwerker, Edwin Bradley, Ronald W. Gedney, and Richard D. Parker. Lead-Free Electronics. Wiley & Sons, Incorporated, John, 2007.

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23

Lead-free Electronics. New York: John Wiley & Sons, Ltd., 2006.

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24

Ganesan, Sanka. Lead-Free Electronics. Calce Epsc Press, 2003.

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25

Lead-free electronics: INEMI projects lead to successful manufacturing. Hoboken, N. J: Wiley, 2007.

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26

Lead-Free Electronics: INEMI Projects Lead to Successful Manufacturing. Wiley-IEEE Press, 2007.

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27

Pang, John Hock Lye. Lead Free Solder: Mechanics and Reliability. Springer, 2014.

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28

Bath, Jasbir, Carol A. Handwerker, and Gregory Henshall. Lead-Free Solder Process Development. Wiley & Sons, Incorporated, John, 2011.

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29

Bath, Jasbir, Carol A. Handwerker, and Gregory Henshall. Lead-Free Solder Process Development. Wiley & Sons, Incorporated, John, 2011.

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30

Bath, Jasbir, Carol A. Handwerker, and Gregory Henshall. Lead-Free Solder Process Development. Wiley & Sons, Incorporated, John, 2011.

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31

Henshall, Greg, Jasbir Bath, Carol A. Handwerker, and Gregory Henshall. Lead-Free Solder Process Development. Wiley & Sons, Incorporated, John, 2011.

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32

Bath, Jasbir. Lead-Free Soldering. Springer, 2007.

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33

Singh, Bath Jasbir, ed. Lead-free soldering. New York: Springer, 2007.

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34

Bath, Jasbir. Lead-Free Soldering. Springer, 2010.

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35

Bath, Jasbir. Lead-Free Soldering. Springer London, Limited, 2007.

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36

Pang, John Hock Lye. Lead Free Solder: Mechanics and Reliability. Springer, 2011.

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37

Suganuma, Katsuaki. Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact. Taylor & Francis Group, 2003.

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38

Suganuma, Katsuaki. Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact. Taylor & Francis Group, 2003.

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39

Suganuma, Katsuaki. Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact. Taylor & Francis Group, 2003.

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40

Suganuma, Katsuaki. Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact. Taylor & Francis Group, 2003.

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41

Suganuma, Katsuaki. Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact. Taylor & Francis Group, 2003.

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42

Suganuma, Katsuaki. Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact. Taylor & Francis Group, 2003.

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43

Subramanian, K. N. Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics. Springer, 2007.

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44

N, Subramanian K., ed. Lead-free electronic solders: A special issue of Journal of Materials Science: Materials in Electronics. New York: Springer Science+Business, 2007.

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45

J, Puttlitz Karl, and Stalter Kathleen A, eds. Handbook of lead-free solder technology for microelectronic assemblies. New York: Marcel Dekker, 2004.

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46

Puttlitz, Karl J., and Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. Taylor & Francis Group, 2004.

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47

Puttlitz, Karl J., and Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. Taylor & Francis Group, 2004.

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48

Puttlitz, Karl J., and Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. Taylor & Francis Group, 2004.

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49

Puttlitz, Karl J., and Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. Taylor & Francis Group, 2004.

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50

Puttlitz, Karl J., and Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. Taylor & Francis Group, 2004.

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