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Dissertations / Theses on the topic 'Lead-free electronics manufacturing processes'

Author: Grafiati

Published: 4 June 2021

Last updated: 29 January 2023

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1

Ma, Hongtao Johnson R. Wayne Suhling J. C. "Characterization of lead-free solders for electronic packaging." Auburn, Ala., 2007. http://repo.lib.auburn.edu/2006%20Fall/Dissertations/MA_HONGTAO_31.pdf.

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2

Woo, Belemy Hok Chung. "Solderability & microstructure of lead-free solder in leadframe packaging." access abstract and table of contents access full-text, 2005. http://libweb.cityu.edu.hk/cgi-bin/ezdb/dissert.pl?msc-ap-b21175214a.pdf.

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Thesis (M.Sc.)--City University of Hong Kong, 2005.
At head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.

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3

Anson, Scott J. "Analysis of lead free tin-silver-copper and tin-lead solder wetting reactions." Diss., Online access via UMI:, 2007.

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4

Marquez, de Tino Ursula. "Reduction of nitrogen consumption of lead-free reflow processes and prediction models for behaviors of lead-free assemblies." Diss., Online access via UMI:, 2009.

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Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009.
Includes bibliographical references.

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5

Iyengar, Deepti Raju Lall Pradeep. "Initialization and progression of damage in lead free electronics under drop impact." Auburn, Ala, 2008. http://repo.lib.auburn.edu/EtdRoot/2008/FALL/Mechanical_Engineering/Thesis/Iyengar_Deepti_35.pdf.

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6

Li, Jing. "Evaluation and improvement of the robustness of a PCB pad in a lead-free environment." Diss., Online access via UMI:, 2007.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007.
Includes bibliographical references.

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7

Liu, Yueli Johnson R. Wayne. "Lead-free assembly and reliability of chip scale packages and 01005 components." Auburn, Ala., 2006. http://hdl.handle.net/10415/1311.

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8

Wang, Qing Johnson R. Wayne Gale W. F. "Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applications." Auburn, Ala., 2005. http://repo.lib.auburn.edu/2005%20Summer/doctoral/WANG_QING_29.pdf.

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9

Kirkpatrick, Timothy. "The kinetics of tin solidification in lead-free solder joints." Diss., Online access via UMI:, 2006.

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10

Hinshaw, Robert Bruce Lall Pradeep. "Reliability of lead-free and advanced interconnects in fine pitch and high I/O electronics subjected to harsh thermo-mechanical environments." Auburn, Ala, 2009. http://hdl.handle.net/10415/1907.

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11

Shantaram, Sandeep Lall Pradeep. "Explicit finite element modeling in conjunction with digital image correlation based life prediction of lead-free electronics under shock-impact." Auburn, Ala, 2009. http://hdl.handle.net/10415/1894.

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12

Vishwanathan, Krishnan. "Process development and microstructural analysis of capacitor filter assemblies using lead free solder preforms." Diss., Online access via UMI:, 2007.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007.
Includes bibliographical references.

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13

Dhakal, Ramji. "Failure mechanism of lead-free Sn-Ag-Cu solder BGA interconnects." Diss., Online access via UMI:, 2005.

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14

Venkatadri, Vikram. "Quantitative assessment of long term aging effects on the mechanical properties of lead free solder joints." Diss., Online access via UMI:, 2009.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009.
Includes bibliographical references.

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15

Ramkumar, S. Manian. "Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead-free surface mount electronics assembly." Diss., Online access via UMI:, 2008.

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16

Subbarayan, Guhan. "A systematic approach for selection of best PB-free printed circuit board (PCB) surface finish." Diss., Online access via UMI:, 2007.

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17

Bhalerao, Vikram. "Process development and reliability study for 01005 components in a lead-free assembly environment." Diss., Online access via UMI:, 2008.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008.
Includes bibliographical references.

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18

Jiang, Hongjin. "Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22636.

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Thesis (Ph. D.)--Chemistry and Biochemistry, Georgia Institute of Technology, 2008.
Committee Chair: Dr. C. P. Wong; Committee Member: Dr. Boris Mizaikoff; Committee Member: Dr. Rigoberto Hernandez; Committee Member: Dr. Z. John Zhang; Committee Member: Dr. Z.L. Wang.

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19

Mirza, Fahad. "Investigation of the impact response of Pb-free electronic assemblies and comparison of drop with cyclic 4-point bend test." Diss., Online access via UMI:, 2007.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2007.
Includes bibliographical references.

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20

Pei, Min. "Effects of Lanthanum doping on the microstructure and mechanical behavior of a SnAg alloy." Diss., Available online, Georgia Institute of Technology, 2007, 2007. http://etd.gatech.edu/theses/available/etd-03272007-120709/.

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Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2007.
Neu, Richard W., Committee Member ; Sanders, Thomas H. Jr., Committee Member ; Wong, C.P., Committee Member ; McDowell, David L., Committee Member ; Qu, Jianmin, Committee Chair.

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21

Tang, Zhenming. "Interfacial reliability of Pb-free flip-chip BGA package." Diss., Online access via UMI:, 2008.

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Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008.
Includes bibliographical references.

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22

Raut, Rahul. "Thermal management of heat sensitive components in Pb-free assembly." Diss., Online access via UMI:, 2005.

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23

Li, Yuquan Johnson Robert Wayne. "Flip chip and heat spreader attachment development." Auburn, Ala, 2009. http://hdl.handle.net/10415/1624.

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24

Shah, Vatsal. "Pb-free process development and microstructural analysis of capacitor filter assemblies using solder preforms." Diss., Online access via UMI:, 2005.

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25

Bukhari, Sarfaraz. "Evaluation of the effects of processing conditions on shear strength in Pb-free surface mount assembly." Diss., Online access via UMI:, 2004. http://wwwlib.umi.com/dissertations/fullcit/1422361.

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26

Tumne, Pushkraj Satish. "Investigation of bulk solder and intermetallic failures in PB free BGA by joint level testing." Diss., Online access via UMI:, 2009.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department or Systems Science and Industrial Engineering, 2009.
Includes bibliographical references.

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27

Srinivasan, Guruprasad. "Evaluation of secondary wire bond integrity on silver plated and nickel/palladium based lead frame plating finishes." Diss., Online access via UMI:, 2008.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008.
Includes bibliographical references.

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28

Li, Yi. "High performance electrically conductive adhesives (ecas) for leadfree interconnects." Diss., Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/26518.

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Electrically conductive adhesives (ECAs) are one of the lead-free interconnect materials with the advantages of environmental friendliness, mild processing conditions, fewer processing steps, low stress on the substrates, and fine pitch interconnect capability. However, some challenging issues still exist for the currently available ECAs, including lower electrical conductivity, conductivity fatigue in reliability tests, limited current-carrying capability, poor impact strength, etc. The interfacial properties is one of the major considerations when resolving these challenges and developing high performance conductive adhesives. Surface functionalization and interface modification are the major approaches used in this thesis. Fundamental understanding and analysis of the interaction between various types of interface modifiers and ECA materials and substrates are the key for the development of high performance ECA for lead-free interconnects. The results of this thesis provide the guideline for the enhancement of interfacial properties of metal-metal and metal-polymer interactions. Systematic investigation of various types of ECAs contributes to a better understanding of materials requirements for different applications, such as surface mount technology (SMT), flip chip applications, flat panel display modules with high resolution, etc. Improvement of the electrical, thermal and reliability of different ECAs make them a potentially ideal candidate for high power and fine pitch microelectronics packaging option.

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29

Sadiq, Muhammad. "Design and fabrication of lanthanum-doped Sn-Ag-Cu lead-free solder for next generation microelectronics applications in severe environment." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/44762.

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Sn-Pb solder has long been used in the Electronics industry. But, due to its toxic nature and environmental effects, certain restrictions are made on its use and therefore many researchers are looking to replace it. Sn-3.0Ag-0.5Cu (SAC) solders are suggested as lead-free replacements but their coarse microstructure and formation of hard and brittle Inter-Metallic Compounds (IMCs) like Ag₃Sn and Cu₆Sn₅ have limited their use in high temperature applications. In this research work, RE elements, mostly lanthanum (La), are used as potential additives to SAC alloys. They reduce the surface free energy, refine the grain size and improve the mechanical and wetting properties of SAC alloys. An extensive experimental work has been performed on the microstructure evolution, bulk mechanical properties, individual phase (matrix and IMCs) mechanical properties, creep behavior and wettability performance of the SAC and SAC-La alloys, with different (La) doping. SEM and EDS have been used to follow the continuous growth of the IMCs at 150°C and 200°C and thus provide a quantitative measure in terms of their size, spacing and volume fraction. Grain size is measured at regular intervals starting from 10 hours up to 200 hours of thermal aging using Optical Microscope with cross polarized light. Bulk mechanical properties are evaluated using tensile tests at low strain rates. Individual phase mechanical properties like Young's modulus, hardness, strain rate sensitivity index and bulge effects are characterized with nanoindentation from 100 µN up to 5000 µN loadings at different temperatures of 25°C, 45°C, 65°C and 85°C. Creep experiments are performed at elevated temperatures with good fitting of Dorn creep and back-stress creep models. Activation energy measurements are made at 40°C, 80°C and 120°C. Wettability testing on copper substrates is used for surface tension, wetting force and contact angle measurements of SAC and SAC-La doped alloys at 250°C and 260°C.

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30

Majeed, Sulman. "Rework & reliability of area array components." Diss., Online access via UMI:, 2009.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engfineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009.
Includes bibliographical references.

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31

TAUFER, MICHEL. "Polymerisation et caracterisations de materiaux de coeur pour fibres optiques transparentes et scintillantes." Toulouse 3, 1989. http://www.theses.fr/1989TOU30031.

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Preparation et caracterisation de polymeres entrant dans la fabrication de fibres optiques; ameliorations du procede de fabrication de la fibre pour pallier les fluctuations de diametre. Presentation des phenomenes de luminescence et des theories existantes dans le domaine de la scintillation; justifications du choix de polystyrene ou de polymethylstyrene pour les fibres scintillantes; probleme des fibres scintillantes de faible diametre; presentation d'une methode de preparation de materiau de coeur et mesures de transparence

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32

Patterson, Eric Andrew. "Development, characterization, and piezoelectric fatigue behavior of lead-free perovskite piezoelectric ceramics." Thesis, 2012. http://hdl.handle.net/1957/34828.

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Much recent research has focused on the development lead-free perovskite piezoelectrics as environmentally compatible alternatives to lead zirconate titanate (PZT). Two main categories of lead free perovskite piezoelectric ceramic systems were investigated as potential replacements to lead zirconate titanate (PZT) for actuator devices. First, solid solutions based on Li, Ta, and Sb modified (K��.��Na��.��)NbO�� (KNN) lead-free perovskite systems were created using standard solid state methods. Secondly, Bi-based materials a variety of compositions were explored for (1-x)(Bi��.��Na��.��)TiO��-xBi(Zn��.��Ti��.��)O�� (BNT-BZT) and Bi(Zn��.��Ti��.��)O��(Bi��.��K��.��)TiO��(Bi��.��Na��.��)TiO�� (BZT-BKT-BNT). It was shown that when BNT-BKT is combined with increasing concentrations of Bi(Zn[subscript 1/2]Ti[subscript 1/2])O�� (BZT), a transition from normal ferroelectric behavior to a material with large electric field induced strains was observed. The higher BZT containing compositions are characterized by large hysteretic strains (> 0.3%) with no negative strains that might indicate domain switching. This work summarizes and analyzes the fatigue behavior of the new generation of Pb-free piezoelectric materials. In piezoelectric materials, fatigue is observed as a degradation in the electromechanical properties under the application of a bipolar or unipolar cyclic electrical load. In Pb-based materials such as lead zirconate titanate (PZT), fatigue has been studied in great depth for both bulk and thin film applications. In PZT, fatigue can result from microcracking or electrode effects (especially in thin films). Ultimately, however, it is electronic and ionic point defects that are the most influential mechanism. Therefore, this work also analyzes the fatigue characteristics of bulk polycrystalline ceramics of the modified-KNN and BNT-BKT-BZT compositions developed. The defect chemistry that underpins the fatigue behavior will be examined and the results will be compared to the existing body of work on PZT. It will be demonstrated that while some Pb-free materials show severe property degradation under cyclic loading, other materials such as BNT-BKT-BZT essentially exhibit fatigue-free piezoelectric properties with chemical doping or other modifications. Based on these results, these new Pb-free materials have great potential for use in piezoelectric applications requiring a large number of drive cycles such as MEMS devices or high frequency actuators.
Graduation date: 2013

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