Relevant bibliographies by topics / Lead-free solder

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Lead-free solder'

Author: Grafiati
Published: 4 June 2021
Last updated: 29 January 2023

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Lead-free solder.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Lead-free solder"

1

Pan, Jianbiao, Jyhwen Wang, and David M. Shaddock. "Lead-free Solder Joint Reliability – State of the Art and Perspectives." Journal of Microelectronics and Electronic Packaging 2, no. 1 (January 1, 2005): 72–83. http://dx.doi.org/10.4071/1551-4897-2.1.72.

Full text
Abstract:
There is an increasing demand for replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concerns. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI and many others to avoid a commercial disadvantage. The solder joints reliability not only depends on the solder joint alloys, but also on the component and PCB metallizations. Reflow profile also has significant impact on lead-free solder joint performance because it influences wetting and microstructure of the solder joint. A majority of researchers use temperature cycling for accelerated reliability testing since the solder joint failure mainly comes from thermal stress due to CTE mismatch. A solder joint failure could be caused by crack initiation and growth or by macroscopic solder facture. There are conflicting views of the reliability comparison between lead-free solders and tin-lead solders. This paper first reviews lead-free solder alloys, lead-free component lead finishes, and lead-free PCB surface finishes. The issue of tin whiskers is also discussed. Next, lead-free solder joint testing methods are presented; finite element modeling of lead-free solder joint reliability is reviewed; and experimental data comparing lead-free and tin-lead solder joint reliability are summarized. Finally the paper gives perspectives of transitions to totally lead-free manufacturing.
APA, Harvard, Vancouver, ISO, and other styles
2

Abu Bakar, Maria, Azman Jalar, Norliza Ismail, Ahmad Ghadafi Ismail, and Najib Saedi Ibrahim. "Solderability of Coloured Lead Free Solder Composite." Solid State Phenomena 307 (July 2020): 15–19. http://dx.doi.org/10.4028/www.scientific.net/ssp.307.15.

Full text
Abstract:
Coloured solders offer wide range of possible application on top of conventional usage related to solder and soldering. Coloured solder can be produced by adding colour pigment into solder formulation to form coloured solder composite. The performance of coloured solder joint typically determined by good solderability, which influenced by wetting properties. The objectives of this paper is to investigate the solderability of coloured lead free solder composite with different formulation type of colour pigment and variation of colour pigment composition. Green and “glow in the dark pigment” with composition of 5% and 10% respectively were added into the lead free solder paste. Each coloured solder paste was stencil printed on the PCB and then reflowed using reflow soldering process. The wettability of the solder composite was measured and observed using Infinite Focus Measurements (IFM). The results demonstrated that coloured lead free solder composite have a good wettability. This finding also indicates that use of green pigment into the solder composite has shown greater wettability as compared to glow in the dark pigment. Higher percentage of added colour pigment of 10% has significantly reduced the wettability of solder composite. Wettability of coloured solder composite with small amount of added pigment is in the acceptable range of contact angle, showing good solderability of joining.
APA, Harvard, Vancouver, ISO, and other styles
3

Maulidiah, Hana Mutialif, Budiana Budiana, Widya Rika Puspita, Adlian Jefiza, and Mustanir Mustanir. "Study of Lead-Free Solder Joint Reliability." JURNAL INTEGRASI 14, no. 1 (April 13, 2022): 30–34. http://dx.doi.org/10.30871/ji.v14i1.3910.

Full text
Abstract:
Solders are essential for the construction of many engineering materials. The use of soldering in electronic packaging has become increasingly critical in today's world. In the electronic manufacturing industry, alternative soldering materials based on tin metal have developed gradually over the last two decades. Manufacturing companies are primarily concerned about removing lead from electronic manufacturing and waste recycling by switching to the lead-free solder. Environmental and human health are adversely affected by exposure to high lead levels in consumer products. The manufacturing industry has switched to lead-free soldering to support their social responsibility initiatives. The three categories of lead-free solder are classified according to temperature range: high-temperature solder, medium-temperature solder, and low-temperature solder. This research is conducted based on the approach of study literature, which is obtained from some papers that generally explain lead-free solder. To provide additional knowledge which is expected to add new insights about the importance of lead-free usage and its behavior.
APA, Harvard, Vancouver, ISO, and other styles
4

Mohd Salleh, M. A. A., Flora Somidin, N. Z. Noriman, Khairel Rafezi Ahmad, Ramani Mayappan, and Noor Farhani Mohd Alui. "Thermal Properties of Sn-0.7Cu/re-Al Composite Lead-Free Solder." Advanced Materials Research 795 (September 2013): 451–54. http://dx.doi.org/10.4028/www.scientific.net/amr.795.451.

Full text
Abstract:
Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminum (0, 3.0, 3.5 and 4.0 wt.% re-Al) particulates produced from aluminum beverage cans were successfully fabricated via powder metallurgy techniques in this study. This paper focuses on the thermal properties focusing on the melting temperature of the new developed Sn-0.7Cu/re-Al lead-free composite solder. The melting temperature (Tm) of the new solders was determined using differential scanning calorimetry (DSC). The melting temperature of the composite solders has showed comparable results with the monolithic solders of Sn-0.7Cu lead-free solder.
APA, Harvard, Vancouver, ISO, and other styles
5

Li, Jianxing, Daniel Lau, Pingliang Tu, Andrew Delano, and Brian Knight. "High Melting Temperature Lead Free Solder for Die Attach Application." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000322–26. http://dx.doi.org/10.4071/isom-2011-tp4-paper1.

Full text
Abstract:
Two lead free solders were developed for die attach application. The bismuth based solder has a melt temperature of 271C and thermal conductivity of 18W/mK. The zinc based solder has a melt temperature of 337C and thermal conductivity of 85W/mK. Both solders have acceptable wetting on bare copper and nickel plated copper substrate, could be processed using modified high lead solder process condition and survived 260C board level reflow simulation. This paper discusses the solder material properties, and presents the die attach process and reliability test results in a manufacturing environment.
APA, Harvard, Vancouver, ISO, and other styles
6

Musa, Sayyidah Amnah, Mohd Arif Anuar Mohd Salleh, and Saud Norainiza. "Zn-Sn Based High Temperature Solder - A Short Review." Advanced Materials Research 795 (September 2013): 518–21. http://dx.doi.org/10.4028/www.scientific.net/amr.795.518.

Full text
Abstract:
The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high temperature solders. The lead and lead-based compound are highly toxic which is dangerous to human health and environment. The highly suitable lead-free solder candidates for replacing high Pb high temperature solder are Au-Sn, Al-Zn, Zn-Sn, Sn-Sb, and Bi-Ag solders. However, Zn-Sn based solder has highly recommended as the best candidates in replacing high lead high temperature solder. This paper provides a short review of recent research on Zn-Sn based lead free high temperature solders with different additional alloying elements. The new novel alloy of Zn-Sn based for high temperature solder applications will be proposed in this paper.
APA, Harvard, Vancouver, ISO, and other styles
7

Lau, John H. "Reliability of Lead-Free Solder Joints." Journal of Electronic Packaging 128, no. 3 (July 26, 2006): 297–301. http://dx.doi.org/10.1115/1.2229234.

Full text
Abstract:
Reliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the lead-free solder joint reliability. Solder is the electrical and mechanical “glue” of electronics assemblies. Will lead-free solders provide the characteristics necessary to allow the world to depend on it in the future? This paper cannot answer this question; however, it will help all participants in the soldering world better understand what needs to be done in order to answer this question and plan for the future.
APA, Harvard, Vancouver, ISO, and other styles
8

Mohd Salleh, M. A. A., Stuart McDonald, and Kazuhiro Nogita. "Non-Metal Reinforced Lead-Free Composite Solder Fabrication Methods and its Reinforcing Effects to the Suppression of Intermetallic Formation: Short Review." Applied Mechanics and Materials 421 (September 2013): 260–66. http://dx.doi.org/10.4028/www.scientific.net/amm.421.260.

Full text
Abstract:
To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders.This paper reviews the fabrication processes of the lead-free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that byadditions of non-metal reinforcement from micron up to nanoparticle size had suppressed the intermetallic compound formations of lead-free composite solders.
APA, Harvard, Vancouver, ISO, and other styles
9

Jiang, Tong, Fubin Song, Chaoran Yang, and S. W. Ricky Lee. "Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000314–18. http://dx.doi.org/10.4071/isom-2010-tp4-paper5.

Full text
Abstract:
The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.
APA, Harvard, Vancouver, ISO, and other styles
10

Asano, Yasuhiro. "Lead-Free Solder Paste and VOC-Free Solder Paste." Journal of SHM 13, no. 4 (1997): 17–21. http://dx.doi.org/10.5104/jiep1993.13.4_17.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Lead-free solder"

1

Weller, Sean David Tomey. "Lead-free solder technology." Thesis, University of Birmingham, 2010. http://etheses.bham.ac.uk//id/eprint/5575/.

Full text
Abstract:
Aerospace applications typically require electronic products with not only higher levels of reliability than the consumer electronics industry but also longer service lives within demanding working environments. The transition will inevitably mean changes to design and manufacturing procedures, which is likely to incur a significant cost to the business. For example, the best candidate Pb-free solder alloys have been shown to require higher soldering temperatures and have higher surface tensions. Moreover, a reduction in product safety and reliability is not acceptable to the industry. This present work is divided into three sections. Firstly, the effect of increased component soldering temperatures on the integrity of the epoxy laminate material used for manufacture of printed circuit boards (PCB) has been assessed. Secondly, the required changes in soldering process parameters have been investigated for a range of solders and PCB finishes, largely due to the different wetting characteristics brought about by the increased surface tension of the Pb-free solders. Thirdly, the reliability of SnAgCu solder is assessed in comparison to the currently utilised SnPbAg solder alloy. This has been achieved firstly by accelerated thermal cycling, as the dominant mode of failure in a solder joint is typically thermo-mechanical fatigue and as such is already well researched. In addition, the mechanical fatigue properties have been assessed using a novel accelerated vibration test method and then finally, the two individual accelerated environmental tests of thermal cycling and vibration have been combined in a novel way to assess whether the combination is especially dangerous for SnAgCu solder reliability. A secondary objective of the combined environment test was to see if the well established thermal cycling test method for demonstration of product reliability can be further accelerated while still producing solder joint failure representative of those in-service. The present work shows that SnAgCu solder has inferior thermo-mechanical and mechanical fatigue life to SnPbAg solder. A combined environment test has been developed which effectively combines the single environments of thermal and vibration. The combination of thermal cycling with superimposed vibration is especially dangerous for SnAgCu solder, where an 89% reduction in the characteristic life is observed when compared to the equivalent thermal cycling characteristic life. It is suspected that a large reduction in life will be observed in SnPbAg solder, but not as pronounced as SnAgCu due to SnPbAg solders ability to better withstand plastic deformation that is induced by thermal cycling.
APA, Harvard, Vancouver, ISO, and other styles
2

Iyer, Ganesh R. "Role of intermetallics for both tin-lead and lead free solder structures and its solder pad combination." Diss., Online access via UMI:, 2005.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
3

Mitchell, Charles Clayton. "PBGA reliability of lead free solder balls assembled with tin lead solder paste for harsh environment electronics." Auburn, Ala., 2006. http://repo.lib.auburn.edu/2006%20Summer/Theses/MITCHELL_CHARLES_16.pdf.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Reid, Pamela Patrice. "Variable Frequency Microwave Reflow of Lead-Free Solder Paste." Thesis, Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/5011.

Full text
Abstract:
As the world moves towards eliminating lead from consumer products, the microelectronics industry has put effort into developing lead-free solder paste. The major drawback of lead-free solder is the problems caused by its high reflow temperature. Variable frequency microwave (VFM) processing has been shown to allow some materials to be processed at lower temperatures. Issues addressed in this study include using VFM to reduce the solder reflow temperature, comparing the heating rate of different size solder particles, and comparing the reliability of VFM reflowed solder versus conventionally reflowed solder. Results comparing the effect of particle size on the heating rate of solder showed that the differences were negligible. This is due in part to the particle sizes overlapping. Many lead-free solder pastes reflow around 250℃. Results indicate that when using the VFM, lead-free solder paste will reflow at 220℃. The reliability of solder that was reflowed using the VFM at the reduced temperature was found to be comparable to solder reflowed in a conventional manner. Based on these findings, VFM processing can eliminate the major obstacles to making lead-free solder paste a more attractive option for use in the microelectronics industry.
APA, Harvard, Vancouver, ISO, and other styles
5

Lewin, Susanne. "Mechanical Reliability of Aged Lead-­Free Solders." Thesis, KTH, Materialvetenskap, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-98372.

Full text
Abstract:
The usage of lead-­free solder joints in electronic packaging is of greatest concern to the electronic industry due to the health and environmental hazards arising with the use of lead. As a consequence, lead is legally prohibited in the European Union and the industry is aiming to produce lead-free products.            The reliability of solder joints is an important issue as the failure could destroy the whole function of a product. SnAgCu is a commonly used alloy for lead-­free solders. Compared to solders containing lead, tin-­rich solders react more rapidly with the copper substrate. The reaction results in formation of brittle intermetallic compounds and in poor mechanical reliability. The formation can be slowed down by the addition of nickel in the under bump metallization.     In this project the objective was to evaluate the mechanical reliability of solder joints in high temperature applications. An alloy of nickel and phosphorus was plated on copper plates by electroless plating. The plates were joined together using SnAgCu solder. The samples were then thermally aged at 180°C for different durations (100, 200, 300, 400 and 500 hours). Tensile tests were performed on the samples. The result from the tensile test showed a decrease in mechanical strength with increasing aging duration. The fracture path shifted from being in the bulk solder to being at the interfaced.
APA, Harvard, Vancouver, ISO, and other styles
6

Anson, Scott J. "Analysis of lead free tin-silver-copper and tin-lead solder wetting reactions." Diss., Online access via UMI:, 2007.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
7

Stinson-Bagby, Kelly Lucile. "Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints." Thesis, Virginia Tech, 2002. http://hdl.handle.net/10919/34573.

Full text
Abstract:
Currently, there are two major driving forces for considering alternative materials to lead- based products, specifically interconnections, in electronics applications, including the impending legislation or regulations which may tax, restrict, or eliminate the use of lead and the trend toward advanced interconnection technology, which may challenge the limits of present soldering technology. The reliability of solder joints is a concern because fracture failures in solder joints accounts for 70% of failures in electronic components. Lead-free solders are being investigated as replacements for lead solders currently used in electronics. Thermo-mechanical properties describe the stresses accumulated due to thermal fatigue as a result of CTE mismatch within the system. By understanding the failure mechanisms related to lead-free solders, the application of lead- free solders could be more strategically designed for specific applications. The objective of this thesis is to observe microstructural change in large-area solder joints caused by thermal cycling and relate these changes to reliability issues in large-area lead and lead-free solder constructed semiconductor power devices. This study focused on the microstructural changes within the solder alloy of a large-area solder joint under thermal cycling conditions. Two major primary observations were made from this research, they are: 1) due to a combination of testing conditions and material properties, the lead-free solders, Sn/3.5Ag and Sn/Ag/0.7Cu, sustained the most severe damage as compared to Sn/37Pb, and 2) due to elevated stresses at the solder/substrate interface in a simulated power semiconductor device sample damage was found to be most severe.
Master of Science
APA, Harvard, Vancouver, ISO, and other styles
8

Marquez, de Tino Ursula. "Reduction of nitrogen consumption of lead-free reflow processes and prediction models for behaviors of lead-free assemblies." Diss., Online access via UMI:, 2009.

Find full text
Abstract:
Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009.
Includes bibliographical references.
APA, Harvard, Vancouver, ISO, and other styles
9

Bhave, Aniket. "A leaded and lead-free solder paste evaluation screening procedure." Diss., Online access via UMI:, 2005. http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&res_dat=xri:pqdiss&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&rft_dat=xri:pqdiss:1425610.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Woo, Belemy Hok Chung. "Solderability & microstructure of lead-free solder in leadframe packaging." access abstract and table of contents access full-text, 2005. http://libweb.cityu.edu.hk/cgi-bin/ezdb/dissert.pl?msc-ap-b21175214a.pdf.

Full text
Abstract:
Thesis (M.Sc.)--City University of Hong Kong, 2005.
At head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.
APA, Harvard, Vancouver, ISO, and other styles
More sources

Books on the topic "Lead-free solder"

1

Pang, John Hock Lye. Lead Free Solder. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-0463-7.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Bath, Jasbir, Carol A. Handwerker, and Gregory Arthur Henshall. Lead-free solder process development. Hoboken, N.J: Wiley, 2010.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
3

Henshall, Gregory, Jasbir Bath, and Carol A. Handwerker, eds. Lead-Free Solder Process Development. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470901199.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

1963-, Shangguan Dongkai, ed. Lead-free solder interconnect reliability. Materials Park, OH: ASM International, 2005.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
5

ASTM Committee D-2 on Petroleum Products and Lubricants, ed. Lead-free solders. West Conshohocken, PA: ASTM International, 2011.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
6

Pang, John Hock Lye. Lead free solder: Mechanics and reliability. New York, NY: Springer, 2012.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
7

Joseph, Shany, and Shany Joseph. Electroplating of lead free solder for electronics. Hauppauge, N.Y: Nova Science Publishers, 2010.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
8

Joseph, Shany. Electroplating of lead free solder for electronics. Hauppauge, N.Y: Nova Science Publishers, 2010.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
9

Salleh, Mohd Arif Anuar Mohd, Mohd Sharizal Abdul Aziz, Azman Jalar, and Mohd Izrul Izwan Ramli, eds. Recent Progress in Lead-Free Solder Technology. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-030-93441-5.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Lee, Tae-Kyu, Thomas R. Bieler, Choong-Un Kim, and Hongtao Ma. Fundamentals of Lead-Free Solder Interconnect Technology. Boston, MA: Springer US, 2015. http://dx.doi.org/10.1007/978-1-4614-9266-5.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Book chapters on the topic "Lead-free solder"

1

Pang, John Hock Lye. "Theory on Mechanics of Solder Materials." In Lead Free Solder, 7–22. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-0463-7_2.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Clech, Jean-Paul. "Lead-Free Solder Joint Reliability." In Lead-Free Soldering, 145–72. Boston, MA: Springer US, 2007. http://dx.doi.org/10.1007/978-0-387-68422-2_6.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Pang, John Hock Lye. "Introduction." In Lead Free Solder, 1–5. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-0463-7_1.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Pang, John Hock Lye. "Mechanical Properties and Constitutive Models." In Lead Free Solder, 23–48. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-0463-7_3.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Pang, John Hock Lye. "Fatigue Life Prediction Models." In Lead Free Solder, 49–63. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-0463-7_4.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Pang, John Hock Lye. "Finite Element Analysis and Design-for-Reliability." In Lead Free Solder, 65–88. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-0463-7_5.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Pang, John Hock Lye. "Thermo-Mechanical Reliability Test and Analysis." In Lead Free Solder, 89–122. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-0463-7_6.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Pang, John Hock Lye. "Dynamic Mechanical Reliability Test and Analysis." In Lead Free Solder, 123–53. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-0463-7_7.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Pang, John Hock Lye. "Thermal Cycling Aging Effects on Board-Level Drop Test Result." In Lead Free Solder, 155–70. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-0463-7_8.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Pang, J. H. L. "Erratum to: Theory on Mechanics of Solder Materials." In Lead Free Solder, E1. New York, NY: Springer New York, 2018. http://dx.doi.org/10.1007/978-1-4614-0463-7_9.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Lead-free solder"

1

Pei, M., and J. Qu. "Constitutive Modeling of Lead-Free Solders." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73411.

Full text
Abstract:
Solders are used extensively as electrical interconnects in microelectronics packaging. Because of environmental concerns, lead-based solders are being replaced by Sn/Ag and Sn/Ag/Cu based solder materials. Since the thermomechanical reliability of modern electronic devices depends on, to a large extent, the fatigue and creep behavior of the solder joints, it is imperative to understand the deformation behavior of these new lead-free solders. This study conducted extensive thermomechanical testing on several commercial lead-free solder alloys. Anand viscoplastic model was used to describe the behavior of these materials with new curve fitting techniques. A modified Anand models was proposed that can yield a more accurate description of lead-free solders.
APA, Harvard, Vancouver, ISO, and other styles
2

Szendiuch, Ivan, Cyril Vasko, and Pavel Cejtchaml. "Lead-free Solder Quality Investigation." In 2006 29th International Spring Seminar on Electronics Technology. IEEE, 2006. http://dx.doi.org/10.1109/isse.2006.365389.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Castello, Todd, Dan Rooney, and Dongkai Shangguan. "Failure Analysis Techniques for Lead-Free Solder Joints." In ISTFA 2005. ASM International, 2005. http://dx.doi.org/10.31399/asm.cp.istfa2005p0295.

Full text
Abstract:
Abstract Printed circuit board assembly with lead free solder is now a reality for most global electronics manufacturers. Extensive research and development has been conducted to bring lead free assembly processes to a demonstrated proficiency. Failure analysis has been an integral part of this effort and will continue to be needed to solve problems in volume production. Many failure analysis techniques can be directly applied to study lead free solder interconnects, while others may require some modification in order to provide adequate analysis results. In this paper, several of the most commonly applied techniques for solder joint failure analysis will be reviewed, including visual inspection, x-ray radiography, mechanical strength testing, dye & pry, metallography, and microscopy/photomicrography, comparing their application to lead bearing and lead free solder interconnects. Common failure modes and mechanisms will be described with examples specific to lead free solders, following PCB assembly as well as after accelerated reliability tests.
APA, Harvard, Vancouver, ISO, and other styles
4

Leng, Eu Poh, Min Ding, Ibrahim Ahmad, Hoh Huey Jiun, and Kamarudin Hazlinda. "Lead-free Flux Effect in Lead-free Solder Joint Improvement." In 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEEE, 2006. http://dx.doi.org/10.1109/iemt.2006.4456509.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Sabri, Mohd Faizul Mohd, Dhafer Abdul-Ameer Shnawah, Irfan Anjum Badruddin, and Suhana Binti Mohd Said. "A compliant lead-free solder alloy." In 2012 10th IEEE International Conference on Semiconductor Electronics (ICSE). IEEE, 2012. http://dx.doi.org/10.1109/smelec.2012.6417184.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Whitten, Gordon. "Lead Free Solder for Vehicle Electronics." In International Truck & Bus Meeting & Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1997. http://dx.doi.org/10.4271/973210.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Whitten, Gordon. "Lead Free Solder for Automotive Electronics." In International Congress & Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1998. http://dx.doi.org/10.4271/980098.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Doe, Simon, and Alan Mundy. "Laser soldering using lead free solder." In PICALO 2004: 1st Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication. Laser Institute of America, 2004. http://dx.doi.org/10.2351/1.5056102.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Nurmi, Sami T., Janne J. Sundelin, Eero O. Ristolainen, and Toivo K. Lepisto¨. "The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35150.

Full text
Abstract:
As environmental issues are raising more interest and are becoming crucial factors in all parts of the world, more and more environmental-friendly electronics products are emerging. Usually this means the introduction of products with lead-free solders. However, the reliability of lead-free solders is still a serious concern despite the vast research done in this field. This paper will describe the interconnect reliability of three kinds of solder joints respectively prepared with lead-free solder paste and lead-free PBGA components, lead-free solder paste and tin-lead-silver PBGA components, and tin-lead solder paste and tin-lead-silver PBGA components. Lead-free and tin-lead solders were composed of eutectic tin-silver-copper and tin-lead, respectively. In addition, the study also presents the effect of multiple reflow times. The study focuses on the microstructures of different assemblies. The particular interest is on the assemblies soldered with lead-free solder paste and tin-lead-silver PBGA components, since the SnPbAg solder on the bumps of the PBGA components were exposed to the reflow profile meant for the lead-free SnAgCu solder. Thus, these SnPbAg solder bumps were in the molten state almost twice as long as the rest of the solders. This had a notable effect on the reliability of these solder joints as we will be showing later in this paper. The test boards were temperature-cycled for 2500 cycles between −40 and +125°C (a 30-minute cycle). PBGA solder joint failures were monitored with a real time monitoring system. Optical and scanning electron microscopy was used to inspect the broken solder joints and their microstructure. The results of tests indicate that the number of reflow times can significantly affect the lifetime of PBGA solder joints. The most notable changes can be seen in the solder joints made with tin-lead-silver PBGA components and tin-silver-copper solder paste soldered with a lead-free reflow profile. The general trend was that the reliability of the solder joints increased in proportion to the number of reflow times. Mainly two factors are believed to have the major effect on the reliability of PBGA solder joints, voids, and microstructural changes in solder.
APA, Harvard, Vancouver, ISO, and other styles
10

Kam, Pascal, Aaron Coppage, Calvin Kam, Sharin Shafian, Bong Steven Chun, and Jinny Rhee. "Lead-Free, Fluxless Solder Joints to Synthetic Diamond." In ASME 2008 International Mechanical Engineering Congress and Exposition. ASMEDC, 2008. http://dx.doi.org/10.1115/imece2008-67068.

Full text
Abstract:
With the recent trends towards smaller heat sources and higher heat fluxes, conduction spreading resistance can become a bottleneck to efficient heat dissipation from temperature-sensitive components such as advanced microelectronics and high power light-emitting diodes (LEDs). However, the use of a high thermal conductivity heat spreader such as a synthetic chemically vapor deposited (CVD) diamond results in an additional interface between two materials. The near elimination of thermal interface resistance at material boundaries is critical for this application to be viable from a thermal standpoint. A lead-free, fluxless soldering process for joining metal substrates to a CVD diamond heat spreader was sought in this study to achieve the low thermal interface resistance and Restruction of Hazardous Substances Directive (RoHS) compliancy desired for this application. A typical titanium-platinum-gold metallization was applied to the surfaces of the diamond to enable it to bond with metal solders. Both indium solder and a popular tin-silver-copper solder (SAC305) were examined in this work. The indium was cold-welded to the substrates under pressure. The SAC305 solder was reflowed in a nitrogen furnace with variable pressure at the joint. The resulting solder thicknesses and joint quality were assessed using a scanning electron microscope (SEM). Lastly, a prototype of high-heat flux source with a CVD diamond spreader and forced convection with air was built to illustrate the thermal advantages of properly incorporating a diamond spreader with a fluxless solder bond.
APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "Lead-free solder"

1

Becka, G. Lead-Free Solder Alloy. Office of Scientific and Technical Information (OSTI), August 1999. http://dx.doi.org/10.2172/9607.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Anderson, Iver. Liquid-Phase Diffusion Bonding and the Development of a Cu-Ni/Sn Composite Solder Paste for High Temperature Lead-Free Electrical Connections. Office of Scientific and Technical Information (OSTI), September 2018. http://dx.doi.org/10.2172/1468948.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Choquette, Stephanie Michele. Liquid-phase diffusion bonding and the development of a Cu-Ni/Sn composite solder paste for high temperature lead-free electrical connections. Office of Scientific and Technical Information (OSTI), September 2018. http://dx.doi.org/10.2172/1593363.

Full text
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Lead-free solder' for particular source types:
Journal articles Dissertations / Theses Books
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography