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1

Pang, John Hock Lye. Lead Free Solder. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-0463-7.

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2

Bath, Jasbir, Carol A. Handwerker, and Gregory Arthur Henshall. Lead-free solder process development. Hoboken, N.J: Wiley, 2010.

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3

Henshall, Gregory, Jasbir Bath, and Carol A. Handwerker, eds. Lead-Free Solder Process Development. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470901199.

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4

1963-, Shangguan Dongkai, ed. Lead-free solder interconnect reliability. Materials Park, OH: ASM International, 2005.

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5

ASTM Committee D-2 on Petroleum Products and Lubricants, ed. Lead-free solders. West Conshohocken, PA: ASTM International, 2011.

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6

Pang, John Hock Lye. Lead free solder: Mechanics and reliability. New York, NY: Springer, 2012.

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7

Joseph, Shany, and Shany Joseph. Electroplating of lead free solder for electronics. Hauppauge, N.Y: Nova Science Publishers, 2010.

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8

Joseph, Shany. Electroplating of lead free solder for electronics. Hauppauge, N.Y: Nova Science Publishers, 2010.

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9

Salleh, Mohd Arif Anuar Mohd, Mohd Sharizal Abdul Aziz, Azman Jalar, and Mohd Izrul Izwan Ramli, eds. Recent Progress in Lead-Free Solder Technology. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-030-93441-5.

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10

Lee, Tae-Kyu, Thomas R. Bieler, Choong-Un Kim, and Hongtao Ma. Fundamentals of Lead-Free Solder Interconnect Technology. Boston, MA: Springer US, 2015. http://dx.doi.org/10.1007/978-1-4614-9266-5.

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11

Lau, John H., and Ning-Cheng Lee. Assembly and Reliability of Lead-Free Solder Joints. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-3920-6.

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12

Subramaniam, K. N. Lead-free solders: Materials reliability for electronics. Hoboken, NJ: John Wiley & Sons, 2012.

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13

Environment friendly electronics: Lead-free technology. Isle of Man: Electrochemical Publications, 2001.

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14

Grossmann, Günter, and Christian Zardini. The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects. London: Springer Verlag, 2011.

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15

Katsuaki, Suganuma, ed. Lead-free soldering in electronics: Science, technology and environmental impact. New York: Marcel Dekker, 2004.

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16

Grossmann, Günter, and Christian Zardini, eds. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects. London: Springer London, 2011. http://dx.doi.org/10.1007/978-0-85729-236-0.

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17

1946-, Matela Raymond J., and Westwater A. (Angus), eds. Structural integrity and reliability in electronics: Enhancing performance in a lead-free environment. Dordrecht: Kluwer Academic Publishers, 2003.

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18

Plumbridge, W. J. Structural integrity and reliability in electronics: Enhancing performance in a lead-free environment. Dordrecht: Kluwer Academic Publishers, 2003.

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19

Global life cycle impact assessments of material shifts: The example of a lead-free electronics industry. London: Springer, 2010.

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20

Prabhu, K. Narayan, ed. Lead-free Solders. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959: ASTM International, 2011. http://dx.doi.org/10.1520/stp1530-eb.

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21

Subramanian, K. N. Lead-Free Electronic Solders. Boston, MA: Springer US, 2007. http://dx.doi.org/10.1007/978-0-387-48433-4.

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22

Engelmaier, Werner, ed. A Guide to Lead-free Solders. London: Springer London, 2007. http://dx.doi.org/10.1007/978-1-84628-310-9.

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23

Subramanian, K. N., ed. Lead-Free Solders: Materials Reliability for Electronics. Chichester, UK: John Wiley & Sons, Ltd, 2012. http://dx.doi.org/10.1002/9781119966203.

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24

Bath, Jasbir, Carol A. Handwerker, and Gregory Henshall. Lead-Free Solder Process Development. Wiley & Sons, Incorporated, John, 2011.

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25

Shangguan, Dongkai. Lead-Free Solder Interconnect Reliability. A S M International, 2005.

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26

Bath, Jasbir, Carol A. Handwerker, and Gregory Henshall. Lead-Free Solder Process Development. Wiley & Sons, Incorporated, John, 2011.

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27

Bath, Jasbir, Carol A. Handwerker, and Gregory Henshall. Lead-Free Solder Process Development. Wiley & Sons, Incorporated, John, 2011.

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28

Henshall, Greg, Jasbir Bath, Carol A. Handwerker, and Gregory Henshall. Lead-Free Solder Process Development. Wiley & Sons, Incorporated, John, 2011.

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29

Pang, John Hock Lye. Lead Free Solder: Mechanics and Reliability. Springer, 2011.

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30

Pang, John Hock Lye. Lead Free Solder: Mechanics and Reliability. Springer, 2014.

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31

Bath, Jasbir, Carol A. Handwerker, Edwin Bradley, Ronald W. Gedney, and Richard D. Parker. Lead-Free Electronics. Wiley & Sons, Incorporated, John, 2007.

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32

Bath, Jasbir, Carol A. Handwerker, Edwin Bradley, Ronald W. Gedney, and Richard D. Parker. Lead-Free Electronics: INEMI Projects Lead to Successful Manufacturing. Wiley & Sons, Incorporated, John, 2007.

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33

Bath, Jasbir. Lead-Free Soldering. Springer, 2007.

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34

Lee, Ning-Cheng, and John H. Lau. Assembly and Reliability of Lead-Free Solder Joints. Springer Singapore Pte. Limited, 2021.

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35

Lee, Ning-Cheng, and John H. Lau. Assembly and Reliability of Lead-Free Solder Joints. Springer, 2020.

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36

Lead-free electronics: INEMI projects lead to successful manufacturing. Hoboken, N. J: Wiley, 2007.

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37

Singh, Bath Jasbir, ed. Lead-free soldering. New York: Springer, 2007.

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38

Bath, Jasbir. Lead-Free Soldering. Springer, 2010.

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39

Bath, Jasbir. Lead-Free Soldering. Springer London, Limited, 2007.

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40

J, Puttlitz Karl, and Stalter Kathleen A, eds. Handbook of lead-free solder technology for microelectronic assemblies. New York: Marcel Dekker, 2004.

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41

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. New York: Marcel Dekker, Inc., 2004.

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42

Puttlitz, Karl J., and Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. Taylor & Francis Group, 2004.

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43

Puttlitz, Karl J., and Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. Taylor & Francis Group, 2004.

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44

Puttlitz, Karl J., and Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. Taylor & Francis Group, 2004.

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45

Puttlitz, Karl J., and Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. CRC Press, 2004. http://dx.doi.org/10.1201/9780203021484.

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46

Puttlitz, Karl J., and Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. Taylor & Francis Group, 2004.

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47

Puttlitz, Karl J., and Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. Taylor & Francis Group, 2004.

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48

Lead-Free Electronics: INEMI Projects Lead to Successful Manufacturing. Wiley-IEEE Press, 2007.

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49

W, Evans John, Werner Engelmaier, and Dong-il Kwon. Guide to Lead-Free Solders: Physical Metallurgy and Reliability. Springer, 2010.

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50

W, Evans John, Werner Engelmaier, and Dong-il Kwon. Guide to Lead-Free Solders: Physical Metallurgy and Reliability. Springer London, Limited, 2007.

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