Books on the topic 'Low-k dielectric materials'

Ree, Moonhor. Low-k nanoporous interdielectrics: Materials, thin film fabrications, structures and properties. Hauppauge, N.Y: Nova Science Publishers, 2010.

Maex, Karen. Materials, technology and reliability for advanced interconnects and low-k dielectrics: Symposium held April 23-27, 2000, San Fransico, California, U.S.A. Warrendale, Pa: Materials Research Society, 2001.

Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics (2000 Phoenix, Ariz.). Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics: Proceedings of the international symposium. Edited by Mathad G. S, Rathore Harzara S, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division, Electrochemical Society Electrodeposition Division, and Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 2001.

International Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics II (2003 Orlando, Fla.). Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II: Proceedings of the international symposium. Edited by Mathad G. S, Bakshi V, Electrochemical Society. Dielectric Science and Technology Division, Electrochemical Society Electronics Division, Electrochemical Society Electrodeposition Division, and Electrochemical Society Meeting. Pennington, N.J: Electrochemical Society, 2003.

Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.). Materials, technology and reliability of low-k dielectrics and copper interconnects: Symposium held April 18-21, 2006, San Francisco, California, U.S.A. Edited by Tsui Ting Y and Materials Research Society Meeting. Warrendale, Pa: Materials Research Society, 2006.

Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.). Materials, technology and reliability of low-k dielectrics and copper interconnects: Symposium held April 18-21, 2006, San Francisco, California, U.S.A. Edited by Tsui Ting Y and Materials Research Society Meeting. Warrendale, Pa: Materials Research Society, 2006.

Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.). Materials, technology and reliability of low-k dielectrics and copper interconnects: Symposium held April 18-21, 2006, San Francisco, California, U.S.A. Edited by Tsui Ting Y and Materials Research Society Meeting. Warrendale, Pa: Materials Research Society, 2006.

J, McKerrow Andrew, Materials Research Society Meeting, and Symposim on Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics (2003 : San Francisco, Calif.), eds. Materials, technology and reliability for advanced interconnects and low-k dielectrics, 2003: Symposium held April 21-25, 2003, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2003.

International Symposium on Thin Film Materials, Processes, and Reliability (2003 Paris, France). Thin film materials, processes, and reliability: Plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. Edited by Mathad G. S, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division, and Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 2003.

Carter, R. J., C. S. Hau-Riege, G. M. Kloster, T. M. Lu, and S. E. Schulz. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004. University of Cambridge ESOL Examinations, 2014.

(Editor), A. J. McKerrow, J. Leu (Editor), and O. Kraft (Editor), eds. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics--2003: Volume 766. Materials Research Society, 2003.

(Editor), G. S. Oehrlein, K. Maex (Editor), Y. C. Joo (Editor), S. Ogawa (Editor), and Jeffrey T. Wetzel (Editor), eds. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Proceedings of Symposium Helt April 23-27, 2000, San Francisco, California U.S.A. Materials Research Society, 2001.

Carter, R. J. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics--2004: Symposium Held April 13-15, 2004, San Francisco, Califor. Materials Research Society, 2004.

1948-, Carter R. J., Materials Research Society Meeting, and Symposim on Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics (2004 : San Francisco, Calif.), eds. Materials, technology, and reliability for advanced interconnects and low-k dielectrics--2004: Symposium held April 13-15, 2004, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2004.

Ogawa, S., K. Maex, G. S. Oehrlein, J. T. Wetzel, and Y. C. Joo. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612. University of Cambridge ESOL Examinations, 2014.

Tsui, Ting Y. Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects: Symposium Held April 18-21, 2006, San Francisco, California, U.S. ... Society Symposium Proceedings (Hardcover)). Materials Research Society, 2006.