Relevant bibliographies by topics / Low temperature co-fire ceramic

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Low temperature co-fire ceramic'

Author: Grafiati
Published: 4 June 2021
Last updated: 15 February 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Low temperature co-fire ceramic.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Low temperature co-fire ceramic"

1

Shao, Hui, and Gang Jian. "Microwave Dielectric Properties and its Compatibility with Silver of Glass-Ceramic Based on Co-Fire at Low Temperature." Advanced Materials Research 704 (June 2013): 167–72. http://dx.doi.org/10.4028/www.scientific.net/amr.704.167.

Full text
Abstract:
Low temperature co-fired glass-ceramic-Ag metal electrode systems were investigated in relation to Ag diffusion and micro structural development during firing. Sintering temperature was in a range of 800°C-900°C. At lower temperature of 800°C, Ag ion was diffused through in the LTCC substrates. However, Ag diffusion was not observed at 850°C below. Simultaneously, the densification of the electrode was greatly improved. With increasing sintering temperature, glass-ceramic to the electrode does not occur due to increase of the densification of the sample. The glass-ceramics exhibited good dielectric properties: εr=7.74, tanδ=0.7×10-3 at 850°C for 0.5h.
APA, Harvard, Vancouver, ISO, and other styles
2

Shiao, Fu Thang, Han Chou Ke, and Ying Chieh Lee. "Phase Transformation Behavior of Bi2O3-ZnO-Nb2O5 Ceramics Sintered at Low Temperature." Materials Science Forum 534-536 (January 2007): 1477–80. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.1477.

Full text
Abstract:
To co-fire with commercial LTCC (Low Temperature Co-fired Ceramic) materials at 850oC ~ 880 oC, different contents of B2O3 were added to the Bi2O3-ZnO-Nb2O5 (BZN) ceramics. The dielectric properties of BZN ceramics sintered at low temperatures were studied. According to the test results, the cubic phase of BZN was transformed into orthorhombic in all the test materials. A BiNbO4 phase was formed in test materials with 2 ~ 5 wt% of B2O3 addition. The BiNbO4 phase was inhibited by extra ZnO addition. The phase transformation of cubic BZN was controlled during the synthesis process of cubic and orthorhombic ZnO-Nb2O5 phase with excess ZnO content. The Cubic and orthorhombic phases of BZN could coexist and be sintered densely at 850 oC/2hr.
APA, Harvard, Vancouver, ISO, and other styles
3

Majer, Zdeněk, Kateřina Štegnerová, Pavel Hutař, Martin Pletz, Raul Bermejo, and Luboš Náhlík. "Residual Lifetime Determination of Low Temperature Co-Fired Ceramics." Key Engineering Materials 713 (September 2016): 266–69. http://dx.doi.org/10.4028/www.scientific.net/kem.713.266.

Full text
Abstract:
The effect of subcritical crack growth is nowadays intensively studied mainly in relation to the strength of ceramic materials. The main aim of the contribution is to describe behavior of micro-crack propagating in the Low Temperature Co-fired Ceramics (LTCC) under subcritical crack growth (SCCG) conditions. The micro-crack behavior is significantly influenced by residual stresses developed in the LTCC due to different coefficients of thermal expansion of individual components. Two-dimensional numerical model was developed to simulate micro-crack propagation through the composite. The micro-crack propagation direction was determined using Sih’s criterion based on the strain energy density factor and the micro-crack path was obtained. The residual lifetime of the specific ceramic particulate composite (LTCC) was estimated on the basis of experimental data. The paper contributes to a better understanding of micro-crack propagation in particulate ceramic composites in the field of residual stresses.
APA, Harvard, Vancouver, ISO, and other styles
4

SU, Che-Yi, Cheng-Liang HUANG, and Wen-Hsi LEE. "Phase development and dielectric properties of BaAl2Si2O8-based low temperature co-fire ceramic material." Journal of the Ceramic Society of Japan 116, no. 1357 (2008): 935–40. http://dx.doi.org/10.2109/jcersj2.116.935.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Mercke, William L., Thomas Dziubla, Richard E. Eitel, and Kimberly Anderson. "Biocompatibility Evaluation of Human Umbilical Vein Endothelial Cells Directly onto Low-Temperature Co-fired Ceramic Materials for Microfluidic Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000549–56. http://dx.doi.org/10.4071/cicmt-2012-tha11.

Full text
Abstract:
Expansion of Low-Temperature Co-fired Ceramic materials into microfluidic systems technology has many beneficial applications due to their ability to combine complex three dimensional structures with optical, fluidic, electrical functions. Evaluations of the biocompatibility of these Low-Temperature Co-fired Ceramic materials are vital for expanding into biomedical research. The few biocompatibility studies on Low-Temperature Co-fired Ceramics generally show negative cellular response to thick film pastes used in generating the electronic circuitry patterns. In this study, biocompatibility of Human Umbilical Vein Endothelial Cells was examined on Heraeus's Low-Temperature Co-fired Ceramic tape and two of their conductive pastes. The biocompatibility was assessed by monitoring cellular attachment and viability up to three days. This study examines the idea of leachates being detrimental to cells due to a study that suggests the possibility of harmful leachates. Results indicate difficulty in initial attachment of Human Umbilical Vein Endothelial Cells to sintered Low-Temperature Co-fired Ceramic tapes, but no hindrance of cellular attachment and growth onto the two conductive pastes. Outcomes also demonstrate that possible harmful leachates from Low-Temperature Co-fired Ceramic materials don't thwart cellular attachment and growth for up to three days of cell culturing. These results provide a basis for biological devices using Low-Temperature Co-fired Ceramic materials.
APA, Harvard, Vancouver, ISO, and other styles
6

Wang, Rui, Ji Zhou, Hongjie Zhao, Bo Li, and Longtu Li. "Oxyfluoride glass-silica ceramic composite for low temperature co-fired ceramics." Journal of the European Ceramic Society 28, no. 15 (November 2008): 2877–81. http://dx.doi.org/10.1016/j.jeurceramsoc.2008.05.010.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Luo, Jin, and Richard Eitel. "Biocompatible low temperature co-fired ceramic for biosensors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, CICMT (September 1, 2013): 000183–86. http://dx.doi.org/10.4071/cicmt-wp35.

Full text
Abstract:
Low temperature co-fired ceramic (LTCC) electronic packaging materials are applied for their ease of fabrication, three dimensional features and integration of multifunctional component, such as optical and electrical functions. For these reasons LTCC is attractive for biomedical microfluidics and Lab-on-a-Chip systems. However, commercial LTCC systems, optimized for microelectrics applications, are not designed for biomedical applications, and have unknown cytocompatibility. In the current work, LTCC has been developed starting with materials of known composition and biocompatibility. The developed LTCC, fabricated from a lime silicate glass and pure alumina, exhibits low sintering temperature (<1000°C) and high density. Alumina reacts with the glass and forms anorthite type crystalline phase CaAl2Si2O8 at temperature 900°C. A commercial gold electrode paste has also been co-fired with the LTCC, with no delamination, cracks nor camber observed. In-vitro biocompatibility of LTCC has been evaluated using human umbilical vein endothelial cells (HUVEC). The HUVECs attach and spread on the surface of the LTCC substrates, and also in the leachate obtained by soaking LTCC in cell media for seven days. The cell density and percentage of live cells on LTCC surface are comparative with those of control. Results indicate the developed LTCC materials are biocompatible and suitable for biomedical applications.
APA, Harvard, Vancouver, ISO, and other styles
8

Wu, Ming-Hsun, and Richard Yetter. "A LOW TEMPERATURE CO-FIRED CERAMIC ELECTROLTYIC MICROTHRUSTER." International Journal of Energetic Materials and Chemical Propulsion 8, no. 4 (2009): 357–71. http://dx.doi.org/10.1615/intjenergeticmaterialschemprop.v8.i4.80.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Jurków, Dominik, Thomas Maeder, Arkadiusz Dąbrowski, Marina Santo Zarnik, Darko Belavič, Heike Bartsch, and Jens Müller. "Overview on low temperature co-fired ceramic sensors." Sensors and Actuators A: Physical 233 (September 2015): 125–46. http://dx.doi.org/10.1016/j.sna.2015.05.023.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Radosavljević, Goran, Mariana Mădălina Pochia, Daniela Rosca, Nelu Blaž, and Andrea Marić. "Capacitive Low Temperature Co-Fired Ceramic Fluidic Sensor." Sensor Letters 11, no. 4 (April 1, 2013): 646–49. http://dx.doi.org/10.1166/sl.2013.2933.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Low temperature co-fire ceramic"

1

Adluru, Hari Kishore. "Design and analysis of micro-channel heat-exchanger embedded in Low Temperature Co-fire Ceramic (LTCC)." FIU Digital Commons, 2004. http://digitalcommons.fiu.edu/etd/1160.

Full text
Abstract:
Increased device density, switching speeds of integrated circuits and decrease in package size is placing new demands for high power thermal-management. The convectional method of forced air cooling with passive heat sink can handle heat fluxes up-to 3-5W/cm2; however current microprocessors are operating at levels of 100W/cm2, This demands the usage of novel thermal-management systems. In this work, water-cooling systems with active heat sink are embedded in the substrate. The research involved fabricating LTCC substrates of various configurations - an open-duct substrate, the second with thermal vias and the third with thermal vias and free-standing metal columns and metal foil. Thermal testing was performed experimentally and these results are compared with CFD results. An overall thermal resistance for the base substrate is demonstrated to be 3.4oC/W-cm2. Addition of thermal vias reduces the effective resistance of the system by 7times and further addition of free standing columns reduced it by 20times.
APA, Harvard, Vancouver, ISO, and other styles
2

Smarra, Devin A. "Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics." University of Dayton / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493386231571894.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Sobocinski, M. (Maciej). "Embedding of bulk piezoelectric structures in low temperature co-fired ceramic." Doctoral thesis, Oulun yliopisto, 2014. http://urn.fi/urn:isbn:9789526207049.

Full text
Abstract:
Abstract It has been over a century since the Curie brothers discovered the piezoelectric effect. Since then our knowledge about this phenomena has been constantly growing, accompanied by a vast increase in its applications. Modern piezoelectric devices, especially those meant for use in personal equipment, can often have complicated shapes and electric circuits; therefore, a suitable and cost effective packaging method is needed. The recent introduction of self-constrained Low Temperature Co-fired Ceramic (LTCC) characterized by virtually no planar shrinkage has pushed the limits of this technology a step further. The practical lack of dimension change between “green” state and sintered ceramic has not only improved the design of multilayer smart packages but also allowed the embedding of other bulk materials within the LTCC and their co-firing in one sintering process. This thesis introduces a novel method of seamlessly embedding piezoelectric bulk structures in LTCC by co-firing or bonding with adhesive. Special attention is paid to the multistage lamination and post-firing poling of the piezoelectric ceramics. Examples of several structures from the main areas of piezoelectric applications are presented as proof of successful implementation of the new technique in the existing production environment. The performance of the structures is investigated and compared to structures manufactured using other methods. Integration of bulk piezoelectric structures through co-firing is a new technique with a wide area of applications, suitable for mass production using existing process flow
Tiivistelmä Curien veljekset havaitsivat pietsosähköisen ilmiön jo yli sata vuotta sitten. Ilmiöön liittyvä tutkimustieto ja erityisesti siihen perustuvien sovellusten määrä on nykyisin valtava. Uusissa pietsosähköisissä komponenteissa ja varsinkin niissä, jotka on tarkoitettu henkilökohtaisissa laitteissa käytettäviksi, muodot samoinkuin elektroniikapiirit voivat olla monimutkaisia. Siksi tarvitaan tarkoituksenmukaista ja hinnaltaan edullista laitteen pakkausmenetelmää. Hiljattain kehitetyt itseohjautuvat matalan lämpötilan yhteissintattavat keraamit (LTCC), joiden planaarinen kutistuma on lähes olematon, ovat lisänneet LTCC-teknologian sovellusmahdollisuuksia. Muotoon valmistetun sintraamattoman ja lopullisen sintratun keraamin dimensioiden yhtäsuuruus ei ole ainoastaan parantanut älykkäiden monikerrospakkausten suunnittelua, vaan mahdollistanut myös erilaisten materiaalien ja komponenttien upottamisen LTCC-rakenteisiin ja niiden yhteissintrauksen. Väitöstyössä esitetään uusi menetelmä pietsosähköisten bulkrakenteiden upottamiseksi saumattomasti LTCC-rakenteisiin yhteissintrauksella tai liimaliitoksella. Erityistä huomiota on kiinnitetty monivaiheiseen laminointiin ja sintrauksen jälkeiseen pietsosähköisten keraamien polarisointiin. Työssä on esitetty esimerkkejä useista rakenteista pietsosähköisten sovellusten pääalueilta osoituksena uuden tekniikan onnistuneesta käyttöönottamisesta nykyisessä valmistusympäristössä. Tutkittujen uusien rakenteiden ja muilla menetelmillä valmistettujen rakenteiden ominaisuuksia on verrattu keskenään. Pietsosähköisten bulkrakenteiden integroiminen yhteissintrauksella on uusi tekniikka, joka mahdollistaa lukuisia sovelluksia ja soveltuu massatuotantoon olemassa olevilla prosseintilaitteistoilla
APA, Harvard, Vancouver, ISO, and other styles
4

Barton, Cecil Edward. "Electrical characterization of a multilayer low temperature co-fireable ceramic multichip module." Thesis, This resource online, 1994. http://scholar.lib.vt.edu/theses/available/etd-09052009-040727/.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Jantunen, H. (Heli). "A novel Low Temperature Co-firing Ceramic (LTCC) material for telecommunication devices." Doctoral thesis, University of Oulu, 2001. http://urn.fi/urn:isbn:951426553X.

Full text
Abstract:
Abstract The thesis describes the development of a novel LTCC material system for RF and microwave telecommunication purposes. The work has been divided into three parts. In the first section, the compositional and firing properties of this novel LTCC dielectric have been studied as well as its thermomechanical and dielectric properties. The second section describes the multilayer component preparation procedure for the ceramic material including tape casting and lamination parameters and the selection of the conductor paste. In the last section, the novel LTCC material system has been used to demonstrate its properties in RF multilayer resonators and a bandpass filter. The dielectric material for the novel LTCC system was prepared using magnesium calcium titanate ceramic, the firing temperature of which was decreased to 900°C by the addition of a mixture of zinc oxide, silicon oxide and boron oxide. The powder was made without any prior glass preparation, which is an important process advantage of this composition. The fired microstructure was totally crystalline with high density (3.7 Mg m-3) and low porosity (0.5 %). The mechanical properties were virtually identical to the values of the commercial LTCCs, but the higher thermal expansivity makes it most compatible with alumina substrates. The dielectric values were also good. The permittivity was 8.5 and the dissipation factor (0.9·10-3 at 8 GHz) less than that of the commercial LTCCs. Furthermore, the temperature coefficient of the resonance frequency was demonstrated to be adjustable between the range of +8.8 ... -62 ppm/K with a simple compositional variation of titanium oxide. The slurry for the tape casting was prepared using poly(vinyl butyral) -base organic additives and the 110 μm thick tapes had a smooth surface (RA < 0.5 μm). The multilayer components were prepared using 20 MPa lamination pressure, 90°C temperature and 1 h dwell time. The most suitable conductor paste for this composition was found to be commercial silver paste (duPont 6160), which produced satisfactory inner and outer conductor patterns for multilayer components. Finally, resonators with a resonant frequency range of 1.7 ... 3.7 GHz were prepared together with a bandpass filter suitable for the next generation of telecommunication devices. This demonstration showed the potential of the developed novel LTCC material system at high RF frequencies.
APA, Harvard, Vancouver, ISO, and other styles
6

Yucel, Ayse Tugce. "Modeling And Control Of High Temperature Oven For Low Temperature Co-fired Ceramic (ltcc) Device Manufacturing." Master's thesis, METU, 2012. http://etd.lib.metu.edu.tr/upload/12614918/index.pdf.

Full text
Abstract:
In the electronics the quality, reliability, operational speed, device density and cost of circuits are fundamentally determined by carriers. If it is necessary to use better material than plastic carrier, it has to be made of ceramics or glass-ceramics. This study dealt with the ceramic based carrier production system. The types of the raw ceramics fired at low temperature (below 1000°
C) are called Low Temperature Co-Fired Ceramics (LTCC). In this study, a comprehensive thermal model is described for the high temperature oven which belongs to a Low Temperature Co-fired Ceramic (LTCC) substance production line. The model includes detailed energy balances with conduction, convection and radiation heat transfer mechanisms, view factor derivations for the radiative terms, thermocouple balances, heating filaments and cooling mechanisms for the system. Research was conducted mainly on process development and production conditions along with the system modeling of oven. Temperature control was made in high temperature co-firing oven. Radiation View Factors for substrate and thermocouples are determined. View factors between substrate and top-bottom-sides of the oven are calculated, and then inserted into the energy balances. The same arrangement was made for 3 thermocouples at the bottom of the oven. Combination of both expressions gave the final model. Modeling studies were held with energy balance simulations on MATLAB. Data analysis and DOE study were held with JMP Software.
APA, Harvard, Vancouver, ISO, and other styles
7

Hu, T. (Tao). "BST-based low temperature co-fired ceramic (LTCC) modules for microwave tunable components." Doctoral thesis, University of Oulu, 2004. http://urn.fi/urn:isbn:9514272927.

Full text
Abstract:
Abstract The recent trend in low temperature co-fired ceramic (LTCC) technology is to integrate more elements into multilayer modules. This thesis describes work specifically aimed at developing ferroelectric barium strontium titanate (BST) for integration into such modules. In particular, an objective was the development of a novel, electric field controlled, tunable component to be used at microwave frequencies (2–26 GHz). For the application envisaged, relative permittivity is required to be low (100–1000) and adjustable by a suitable applied electric field, the dissipation factor at room temperature must be low (~0.001) at 2–26 GHz, and most importantly, the sintering temperature must be suited to the LTCC technology (~900 °C) Initial work was focused on sol-gel derived Ba0.7Sr0.3TiO3 powders with boron oxide addition, which were sintered at 900 °C, the dissipation factor was 0.006. The dissipation factor was not low enough for the desired microwave application, and attention turned to powders prepared by the mixed-oxide route. The Ba0.7Sr0.3TiO3 powders, fluxed with the optimum amounts of boron oxide and lithium carbonate, could be sintered at 890 °C to the same density as is achieved with un-fluxed Ba0.7Sr0.3TiO3 sintered at 1360 °C. The dissipation factor for this fluxed powder was acceptably low, although permittivity was too high for the particular objective. Subsequently, research was on BST modified by magnesia, 0.4Ba0.55Sr0.45TiO3-0.6MgO (BSTM). With the optimum fluxing additives, the sintering temperature necessary to achieve a dense BSTM-based ceramic was reduced to 950 °C. The developed microstructure was good, and the relative permittivity and dissipation factor values (221, 0.0012 at 1 kHz) at room temperature indicated good microwave properties. Studies were also undertaken with organic-based tape-casting slurries, laminating procedures and burn-out and sintering schedules. Several kinds of tapes were fabricated and characterized. A test structure for the measurement of dielectric properties at 26 GHz of the optimized BSTM-based ceramic was constructed. The specimen was 50 μm thick layer of BST on an alumina substrate. The relative permittivity and tunability were 130 and >15 % at 4 V μm-1 at room temperature. A tunable phase-shifter was fabricated from the same BSTM-based tape using a novel gravure printing technique, and measurements at 26 GHz showed phase shift from 10 to 35° when the electric field was increased from 1 V μm-1 to 2.5 V μm-1. Some exploratory experiments are described to assess the compatibility of the developed BST-based LTCC with commercial LTCC and some electroceramics.
APA, Harvard, Vancouver, ISO, and other styles
8

Luo, Jin. "The Development and Biocompatibility of Low Temperature Co-Fired Ceramic (LTCC) for Microfluidic and Biosensor Applications." UKnowledge, 2014. http://uknowledge.uky.edu/cme_etds/30.

Full text
Abstract:
Low temperature co-fired ceramic (LTCC) electronic packaging materials are applied for their electrical and mechanical properties, high reliability, chemical stability and ease of fabrication. Three dimensional features can also be prepared allowing integration of microfluidic channels and cavities inside LTCC modules. Mechanical, optical, electrical, microfluidic functions have been realized in single LTCC modules. For these reasons LTCC is attractive for biomedical microfluidics and Lab-on-a-Chip systems. However, commercial LTCC systems, optimized for microelectrics applications, have unknown cytocompatibility, and are not compatible with common surface functionalization chemistries. The first goal of this work is to develop biocompatible LTCC materials for biomedical applications. In the current work, two different biocompatible LTCC substrate materials are conceived, formulated and evaluated. Both materials are based from well-known and widely utilized biocompatible materials. The biocompatibilities of the developed LTCC materials for in-vitro applications are studied by cytotoxicity assays, including culturing endothelial cells (EC) both in LTCC leachate and directly on the LTCC substrates. The results demonstrate the developed LTCC materials are biocompatible for in-vitro biological applications involving EC. The second goal of this work is to develop functional capabilities in LTCC microfluidic systems suitable for in-vitro and biomedical applications. One proposed application is the evaluation of oxygen tension and oxidative stress in perfusion cell culture and bioreactors. A Clark-type oxygen sensor is successfully integrated with LTCC technique in this work. In the current work, a solid state proton conductive electrolyte is used to integrate an oxygen sensor into the LTCC. The measurement of oxygen concentration in Clark-type oxygen sensor is based on the electrochemical reaction between working electrode and counter electrode. Cyclic voltammetry and chronoamperometry are measured to determine the electrochemical properties of oxygen reduction in the LTCC based oxygen sensor. The reduction current showed a linear relationship with oxygen concentration. In addition, LTCC sensor exhibits rapid response and sensitivity in the physiological range 1─9 mg/L. The fabricated devices have the capabilities to regulate oxygen supply and determination of local dissolved oxygen concentration in the proposed applications including perfusion cell culture and biological assays.
APA, Harvard, Vancouver, ISO, and other styles
9

Mercke, William L. "Diagnosis of Systemic Inflammation Using Transendothelial Electrical Resistance and Low-Temperature Co-fired Ceramic Materials." UKnowledge, 2013. http://uknowledge.uky.edu/cme_etds/21.

Full text
Abstract:
Systemic inflammation involves a complex array of cytokines that can result in organ dysfunction. Mortality remains high despite the vast amount of research conducted to find an effective biomarker. The cause of systemic inflammation can be broad and non-specific; therefore, this research investigates using transendothelial electrical resistance (TEER) measurements to better define systemic inflammatory response syndrome (SIRS)/sepsis within a patient. Results show a difference in TEER measurements between healthy individuals and SIRS-rated patients. This research also displays correlations between TEER measurements and biomarkers currently studied with systemic inflammation (tumor necrosis factor-α, C- reactive protein, procalcitonin). Furthermore, this research also presents the groundwork for developing a microfluidic cell-based biosensor using low temperature co-fired ceramic materials. An LTCC TEER-based microfluidic device has the potential to aid in a more effective treatment strategy for patients and potentially save lives.
APA, Harvard, Vancouver, ISO, and other styles
10

Ho, Christopher M. (Christopher Mark). "Manufacturing operation modeling for product redesign : resistance analysis of low-temperature co-fired ceramic circuits." Thesis, Massachusetts Institute of Technology, 1995. http://hdl.handle.net/1721.1/36521.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Books on the topic "Low temperature co-fire ceramic"

1

Herr-Rains, Cheryl. Fire marks: A workbook on low-temperature smoke firing. Vienna, ME: Fire Marks, 1999.

Find full text
APA, Harvard, Vancouver, ISO, and other styles

Book chapters on the topic "Low temperature co-fire ceramic"

1

Geyer, Richard G., Liang Chai, Aziz Shaikh, and Vern Stygar. "Microwave Properties of Low-Temperature Co-Fired Ceramic Systems." In Ceramic Transactions Series, 261–85. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118380802.ch25.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Rabe, Torsten, Markus Eberstein, and Wolfgang A. Schiller. "Low Temperature Co-Fired Ceramics (LTCC) - Design and Characterization of Interfaces." In Ceramic Transactions Series, 173–78. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9781118144145.ch27.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Nair, K. M., M. F. McCombs, K. E. Souders, J. M. Parisi, K. H. Hang, D. M. Nair, and S. C. Beers. "DuPontTM Green TapeTM 9K7 Low Temperature Co-fired Ceramic (LTCC) Low Loss Dielectric System for High Frequency Microwave Applications." In Ceramic Transactions Series, 213–29. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470930915.ch20.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Sawhill, Howard T. "Materials Compatibility and Co-Sintering Aspects in Low Temperature Co-Fired Ceramic Packages." In Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12, 1603–17. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2008. http://dx.doi.org/10.1002/9780470310519.ch5.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Birol, Hansu, Thomas Maeder, Caroline Jacq, Giancarlo Corradini, Marc Boers, Sigfrid Straessler, and Peter Ryser. "Structuration and Fabrication of Sensors Based on LTCC (Low Temperature Co-Fired Ceramic) Technology." In Key Engineering Materials, 1849–52. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-410-3.1849.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Rane, Vivek, Varsha Chaware, Shrikant Kulkarni, Siddharth Duttagupta, and Girish Phatak. "Materials for Embedded Capacitors, Inductors, Nonreciprocal Devices, and Solid Oxide Fuel Cells in Low Temperature Co-fired Ceramic." In Springer Tracts in Mechanical Engineering, 285–301. New Delhi: Springer India, 2014. http://dx.doi.org/10.1007/978-81-322-1913-2_17.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Birol, Hansu, Thomas Maeder, and Peter Ryser. "Modification of Thick-Film Conductors Used in IP Technology for Reduction of Warpage during Co-Firing of LTCC (Low Temperature Co-Fired Ceramic) Modules." In Key Engineering Materials, 746–49. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-410-3.746.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Bansode, Pranoti S., and D. C. Gharpure. "Design and Analysis of Circular Polarize Micro Strip Patch Antenna for X Band in Low Temperature Co-Fired Ceramic Technology (LTCC)." In Computational Mathematics, Nanoelectronics, and Astrophysics, 49–63. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-15-9708-4_4.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Bermejo, Raul, Peter Supancic, Clemens Krautgasser, and Robert Danzer. "Evaluation of Subcritical Crack Growth in Low Temperature Co-Fired Ceramics." In Mechanical Properties and Performance of Engineering Ceramics and Composites VIII, 161–72. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118807514.ch17.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Guo, Yafei, Chuanwen Zhao, Changhai Li, and Shouxiang Lu. "Low-Temperature CO Catalytic Oxidation over KOH-Hopcalite Mixtures and In Situ CO2 Capture from Fire Smoke." In Fire Science and Technology 2015, 725–33. Singapore: Springer Singapore, 2016. http://dx.doi.org/10.1007/978-981-10-0376-9_74.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Low temperature co-fire ceramic"

1

Tsai, Chung-Hao, and Tzong-Lin Wu. "A GHz common-mode filter using negative permittivity metamaterial on low temperature co-fire ceramic (LTCC) substrate." In 2009 IEEE International Symposium on Electromagnetic Compatibility - EMC 2009. IEEE, 2009. http://dx.doi.org/10.1109/isemc.2009.5284670.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Stengel, Bob, and Lei Zhao. "Low Temperature Co-fired Ceramic LTCC Application Testing Alternative." In 57th ARFTG Conference Digest. IEEE, 2001. http://dx.doi.org/10.1109/arftg.2001.327473.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Shawver, S., J. Browning, D. Plumlee, S. M. Loo, C. Lee, J. Taff, M. Yates, J. Woldtvedt, L. Knowles, and D. Reis. "Miniaturized electric propulsion in Low Temperature Co-fired Ceramic." In 2011 IEEE 38th International Conference on Plasma Sciences (ICOPS). IEEE, 2011. http://dx.doi.org/10.1109/plasma.2011.5993296.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Li, Qiang, and Fred C. Lee. "Winding AC resistance of low temperature co-fired ceramic inductor." In 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012. IEEE, 2012. http://dx.doi.org/10.1109/apec.2012.6166064.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Klima, Martin, Jakub Somer, Lucie Blahova, Michal Prochazka, and Ivan Szendiuch. "Usage of low-temperature co-fired ceramic in hermetic packaging." In 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE). IEEE, 2014. http://dx.doi.org/10.1109/isse.2014.6887571.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Khalid, Muhamad Kamil, Noriza Othman, and Mohd Khairul Mohd Salleh. "Low-temperature co-fired ceramic coupled-line bandpass filter design." In 2013 IEEE Symposium on Computers & Informatics (ISCI). IEEE, 2013. http://dx.doi.org/10.1109/isci.2013.6612374.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Devrukhakar, Mayur, Mangesh Dayaphule, Varsha Chaware, Vijaya Giramkar, Shany Joseph, and Girish Phatak. "Non-return microvalve using low temperature co-fired ceramic (LTCC)." In 2015 2nd International Symposium on Physics and Technology of Sensors (ISPTS). IEEE, 2015. http://dx.doi.org/10.1109/ispts.2015.7220131.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Li, Yan-Lin, Xu Zhu, Ji-Chao Liu, Li-Jie Zhou, and Zhi-Hua Wang. "Miniaturization of Low Temperature Co-fired Ceramic Packaging for Microwave Filters." In 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2018. http://dx.doi.org/10.1109/icept.2018.8480833.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Wei, Wei, Peng Wang, Xu-Bo Wei, Jia-Xuan Liao, Sha-Ou Wang, and Bang-Chao Yang. "Compact radar altimeter simulator using low temperature co-fired ceramic technology." In 2011 International Conference on Computational Problem-Solving (ICCP). IEEE, 2011. http://dx.doi.org/10.1109/iccps.2011.6092236.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Sobocinski, Maciej, Mikko Leinonen, Jari Juuti, and Heli Jantunen. "Piezoelectric active mirror suspension embedded into Low Temperature Co-fired Ceramic." In Nanoscale Phenomena in Polar Materials. IEEE, 2011. http://dx.doi.org/10.1109/isaf.2011.6013989.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "Low temperature co-fire ceramic"

1

Uribe, Fernando R., Alice C. Kilgo, John Mark Grazier, Paul Thomas Vianco, Gary L. Zender, Paul Frank Hlava, and Jerome Andrew Rejent. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates. Office of Scientific and Technical Information (OSTI), September 2008. http://dx.doi.org/10.2172/942186.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Uribe, Fernando, Paul Thomas Vianco, and Gary L. Zender. Pull strength evaluation of Sn-Pb solder joints made to Au-Pt-Pd and Au thick film structures on low-temperature co-fired ceramic -final report for the MC4652 crypto-coded switch (W80). Office of Scientific and Technical Information (OSTI), June 2006. http://dx.doi.org/10.2172/887252.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Moll, Amy J., Judi Steciak, and Donald G. Plumlee. Micro-Propulsion Devices in Low Temperature Co-Fired Ceramics. Fort Belvoir, VA: Defense Technical Information Center, February 2009. http://dx.doi.org/10.21236/ada495405.

Full text
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Low temperature co-fire ceramic' for particular source types:
Journal articles Dissertations / Theses
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography