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Relevant bibliographies by topics / Low temperature sintering

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Academic literature on the topic 'Low temperature sintering'

Author: Grafiati

Published: 4 June 2021

Last updated: 27 April 2022

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Journal articles on the topic "Low temperature sintering"

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Bernard, Janez, Andreja Benčan, Tadej Rojac, Janez Holc, Barbara Malič, and Marija Kosec. "Low-Temperature Sintering of K0.5Na0.5NbO3Ceramics." Journal of the American Ceramic Society 91, no. 7 (July 2008): 2409–11. http://dx.doi.org/10.1111/j.1551-2916.2008.02447.x.

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Medesi, A., T. Greiner, M. Benkler, C. Megnin, and T. Hanemann. "Low Temperature Sintering of PZT." Journal of Physics: Conference Series 557 (November 27, 2014): 012132. http://dx.doi.org/10.1088/1742-6596/557/1/012132.

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Balakrishna, P., B. P. Varma, T. S. Krishnan, T. R. R. Mohan, and P. Ramakrishnan. "Low-temperature sintering of thoria." Journal of Materials Science Letters 7, no. 6 (June 1988): 657–60. http://dx.doi.org/10.1007/bf01730326.

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Zajc, I., and M. Drofenik. "Semiconducting BaTiO3 ceramic prepared by low temperature liquid phase sintering." Journal of Materials Research 13, no. 3 (March 1998): 660–64. http://dx.doi.org/10.1557/jmr.1998.0082.

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Donor-doped BaTiO3 ceramics were prepared by adding PbO B2O3 SiO2 as a sintering aid. Semiconducting BaTiO3 was obtained at a sintering temperature of 1100 °C. The sintered samples exhibit the Positive Temperature Coefficient of Resistivity (PTCR) effect, which depends on the amount of liquid phase, the concentration of the donor-dopant, and the sintering temperature. The cold resistivity of the samples decreases when the sintering temperature increases. The increase of the grain boundary resistivity and hence of the cold resistivity at lower sintering temperatures was explained by applying the diffusion grain boundary layer model.

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Watari, Koji, Hae J. Hwang, Motohiro Toriyama, and Shuzo Kanzaki. "Effective Sintering Aids for Low-temperature Sintering of AlN Ceramics." Journal of Materials Research 14, no. 4 (April 1999): 1409–17. http://dx.doi.org/10.1557/jmr.1999.0191.

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A disappearing sintering aid was used to promote densification during the initial and middle stages of sintering and to be removed in gaseous form from the specimens during the final stage of sintering. From thermodynamic consideration such as assessment of Gibbs free energy change of formation of Al2O3 compounds including metal-oxide and evaluation of the vapor pressure of metal-oxide, Li2O is expected to become a disappearing sintering aid for AlN sintering. Doping with Li2O resulted in densification of AlN ceramics with Y2O3 and CaO additives by sintering at a firing temperature of 1600 °C. The amount of Li2O in the specimens decreased by volatilization at temperatures higher than 1300 °C, and its amount was at a level of several ppm after firing at 1600 °C for 6 h. Low-temperature densification of AlN specimens by addition of Li2O also caused the improvement of thermal conductivity and mechanical strength of sintered specimens. Present results indicate that a Li2O addition is effective for AlN sintering. Furthermore, LiYO2 was also used as a new sintering aid instead of Li2O and Y2O3, and the results of thermal conductivity and mechanical strength are shown.

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Tomizawa, Jun, Tomoyuki Hasegawa, Yoshikazu Akiyama, and Takashi Hayashi. "Low-Temperature Sintering of PZT with a Sintering Aid." Key Engineering Materials 228-229 (September 2002): 207–10. http://dx.doi.org/10.4028/www.scientific.net/kem.228-229.207.

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Ramesh, T., S. R. Murthy, and R. S. Shinde. "Low Temperature Sintering of YIG Using Microwave Sintering Method." Integrated Ferroelectrics 118, no. 1 (November 12, 2010): 67–75. http://dx.doi.org/10.1080/10584587.2010.503786.

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Quercioli, Regis, Jerome Bernard, Jean-Marie Haussonne, Jean-Michel Reboul, and David Houivet. "Low sintering temperature of ZnNb2O6 for silver co-sintering." Ceramics International 40, no. 1 (January 2014): 1771–79. http://dx.doi.org/10.1016/j.ceramint.2013.07.077.

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Torii, Hideo, Satoru Yuhaku, and Hideyuki Okinaka. "Low-temperature sintering of zirconia ceramics." Journal of the Japan Society of Powder and Powder Metallurgy 33, no. 2 (1986): 98–102. http://dx.doi.org/10.2497/jjspm.33.98.

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YEH, TSUNG-SHOU, and MICHAEL D. SACKS. "Low-Temperature Sintering of Aluminum Oxide." Journal of the American Ceramic Society 71, no. 10 (October 1988): 841–44. http://dx.doi.org/10.1111/j.1151-2916.1988.tb07533.x.

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Dissertations / Theses on the topic "Low temperature sintering"

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Matović, Branko. "Low temperature sintering additives for silicon nitride." [S.l. : s.n.], 2003. http://www.bsz-bw.de/cgi-bin/xvms.cgi?SWB10806387.

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Wu, Wenzhong. "Low Temperature Sintering Semiconductive Barium Strontium Titanate." FIU Digital Commons, 2007. http://digitalcommons.fiu.edu/etd/76.

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Low temperature sintering has become a very important research area in ceramics processing and sintering as a promising process to obtain grain size below 100nm. For electronic ceramics, low temperature sintering is particularly difficult, because not only the required microstructure but also the desired electronic properties should be obtained. In this dissertation, the effect of liquid sintering aids and particle size (micrometer and nanometer) on sintering temperature and Positive Temperature Coefficient Resistivity (PTCR) property are investigated for Ba1-xSrxTiO3 (BST) doped with 0.2-0.3mol% Sb3+ (x = 0.1,0.2,0.3,0.4 and 0.5). Different sintering aids with low melting point are used as sintering aids to decrease the sintering temperature for micrometer size BST particles. Micrometer size and nanometer size Ba1-xSrxTiO3 (BST) particles are used to demonstrate the particle size effect on the sintering temperature for semiconducting BST. To reduce the sintering temperature, three processes are developed, i.e. 1 using sol-gel nanometer size Sb3+ doped powders with a sintering aid; 2 using micrometer size powders plus a sintering aid; and 3 using nanometer size Sb3+ doped powders with sintering aids. Grain size effect on PTCR characteristics is investigated through comparison between micrometer size powder sintered pellets and nanometer size powder sintered pellets. The former has lower resistivity at temperatures below the Curie temperature (Tc) and high resistivity at temperatures above the Curie temperature (Tc) along with higher ñmax/ñmin ratio (ñmax is the highest resistivity at temperatures above Tc, ñmin is the lowest resistivity at temperatures below Tc), whereas the latter has both higher ñmax and ñmin. Also, ñmax/ñmin is smaller than that of pellets with larger grain size. The reason is that the solid with small grain size has more grain boundaries than the solid with large grain size. The contribution z at room temperature and high temperature and a lower ñmax/ñmin ratio value.

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Lewis, Gene Stacey. "Low temperature sintering of solid oxide fuel cell electrolytes." Thesis, Imperial College London, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.402178.

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Kim, Hyungchan. "Low temperature sintering of nanosized ceramic powder YSZ-bismuth oxide system /." Connect to this title online, 2004. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1092765117.

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Thesis (Ph. D.)--Ohio State University, 2004.
Title from first page of PDF file. Document formatted into pages; contains xxvi, 249 p.; also includes graphics (some col.). Includes bibliographical references (p. 241-249).

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Toledo, Dos Santos Daniel. "High temperature sintering: investigation of the dimensional precision and mechanical properties of low alloyed steels." Doctoral thesis, Università degli studi di Trento, 2021. http://hdl.handle.net/11572/310431.

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The automobile industry has set the demand regarding Powder Metallurgy (PM) parts for decades, since this near-net shape technology is a cost-effective manufacturing process allying good mechanical properties with dimensional and geometrical precision. Aiming at the future of the electric automobiles high production and demand, many changes are on the way to guarantee the competitiveness of PM against other manufacturing process. The high costs of alloying elements such as Ni and Cu, the changes in health and safety regulations as well as light weighting of components are the topics of major importance in the field of PM and focus of main R&D around the globe. The use of high temperature sintering and different alloying elements are possible solutions to overcome properties obtained by using Ni as an alloying element sintered at conventional temperatures. Materials with Cr, Mo and Si were investigated using high temperature sintering (1180°C and 1250°) in comparison to traditionally high Ni materials sintered at conventional temperature (1120°C). The dimensional stability, geometrical precision, density, and microstructure of ring-shaped specimens were studied by using a coordinate measuring machine (CMM) and the effect of HTS on the mechanical properties were estimated through the fraction of the load bearing section. The effect of HTS on the dimensional precision and geometrical stability was later investigated in real parts manufactured by industrial partners through an EPMA Club Project. The 4%Ni material sintered at 1120°C was also compared to Ni-less/Ni-free materials sintered at 1250°C using tensile testing, impact testing, and hardness. The use of HTS to improve the mechanical properties without impairing the dimensional and geometrical stability was confirmed in parts with both low and high complexity designs. This project sets the blueprint for future material developments using HTS as manufacturing process.

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Bai, Guofeng. "Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection." Diss., Virginia Tech, 2005. http://hdl.handle.net/10919/29409.

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This research has developed a lead-free semiconductor device interconnect technology by studying the processing-microstructure-property relationships of low-temperature sintering of nanoscale silver pastes. The nanoscale silver pastes have been formulated by adding organic components (dispersant, binder and thinner) into nano-silver particles. The selected organic components have the nano-particle polymeric stabilization, paste processing quality adjustment, and non-densifying diffusion retarding functions and thus help the pastes sinter to ~80% bulk density at temperatures no more than 300Â°C. It has been found that the low-temperature sintered silver has better electrical, thermal and overall thermomechanical properties compared with the existing semiconductor device interconnecting materials such as solder alloys and conductive epoxies. After solving the organic burnout problems associated with the covered sintering, a lead-free semiconductor device interconnect technology has been designed to be compatible with the existing surface-mounting techniques with potentially low-cost. It has been found that the low-temperature sintered silver joints have high electrical, thermal, and mechanical performance. The reliability of the silver joints has also been studied by the 50-250Â°C thermal cycling experiment. Finally, the bonging strength drop of the silver joints has been suggested to be ductile fracture in the silver joints as micro-voids nucleated at microscale grain boundaries during the temperature cycling. The low-temperature silver sintering technology has enabled some benchmark packaging concepts and substantial advantages in future applications.
Ph. D.

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Woodruff, Mark A. "Agglomeration of Bed Particles in Low-Temperature Black Liquor Gasification." Diss., CLICK HERE for online access, 2006. http://contentdm.lib.byu.edu/ETD/image/etd1567.pdf.

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Boonyongmaneerat, Yuttanant. "Sintering and joining of low temperature co-fired tungsten and aluminum oxide." Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/36204.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2006.
Includes bibliographical references (p. 181-189).
Conventional methods used to fabricate co-fired tungsten/alumina composites usually rely on high temperature processing (>1500C). As it would be beneficial or even necessary for some applications to produce such composites at relatively low firing temperatures, low-temperature processing techniques and the attendant knowledge of processing-property relationships need to be developed. In this thesis, a set of experiments and simulations are performed to obtain a better understanding of sintering and joining of the tungsten/alumina system processed at temperatures near or below 12000C. The technique of activated sintering for tungsten is investigated, whereby a minimal content of additives enables low firing temperatures through a change in the sintering mechanism for tungsten. Tungsten compacts produced by this method are found to sinter only to the "initial stage" and are characterized by high residual porosity level. Hardness and fracture toughness of such partially-sintered materials are examined experimentally and analytically, and dependence of mechanical properties on the relative particle neck size is observed. Various studies are carried out to examine both fundamental and practical aspects of joining co-fired tungsten/alumina.
(cont.) First, contributions to adhesion of co-sintered bilayers are studied where the properties of the tungsten layer are controlled using the process of activated sintering. Using a bending delamination test, improvements in sintered density of tungsten are found to increase the adhesive strength of the system only up to a point, beyond which shrinkage mismatch compromises the intrinsic toughness of the interface. A study of low-temperature co-fired tungsten/alumina is then focused on composite shells for an investment casting application. The influences of various processing parameters in a slurry-based route on the sintering and adhesion properties of tungsten/alumina are investigated. Binder content, stucco sand application, and powder characteristics are among the parameters found to critically control the quality of tungsten/alumina shells produced. Finally, the feasibility of several joining strategies, which involve the use of chemical additives, is examined on co-fired tungsten/alumina compacts processed at low temperatures. Some bonding techniques are verified to help improve the bonding of the co-sintered composites.
by Yuttanant Boonyongmaneerat.
Ph.D.

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Chen, M. Y. (Mei-Yu). "Ultra-low sintering temperature glass ceramic compositions based on bismuth-zinc borosilicate glass." Doctoral thesis, Oulun yliopisto, 2017. http://urn.fi/urn:isbn:9789526215600.

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Abstract In the first part of the thesis, novel glass-ceramic compositions based on Al2O3 and BaTiO3 and bismuth-zinc borosilicate (BBSZ) glass, sintered at ultra-low temperatures, were researched. With adequate glass concentration, dense microstructures and useful dielectric properties were achieved. The composite of BaTiO3 with 70 wt % BBSZ sintered at 450 °C exhibited the highest relative permittivity, εr, of 132 and 207 at 100 kHz and 100 MHz, respectively. Thus, the dielectric properties of the composites were dominated by the characteristics of glass, BaTiO3, and Bi24Si2O40 phase, especially the contribution of Bi24Si2O40 for the samples with 70-90 wt % glass. Actually, the existence of the secondary phase Bi24Si2O40 may not hinder but enhance the dielectric properties. The Al2O3-BBSZ composition samples showed a similar situation, not only for densification but also for their microstructures and phases (Al2O3, BBSZ, Bi24Si2O40), explaining the achieved dielectric properties. The second part of the thesis mainly discusses the composite of BaTiO3 with 50 wt % BBSZ with different thermal treatments. After sintering at 720 °C, dense microstructures and the existence of Bi4BaTi4O15, BaTiO3, Bi24Si2O40 phases were observed. The results also showed that the size of glass powder particles did not influence the dielectric properties (εr = 263-267, tan δ = 0.013 at 100 kHz) of sintered samples, but the addition of LiF degraded the dielectric properties due to the features and amount of Bi4BaTi4O15. These results demonstrate the feasibility of the BBSZ based composites for higher sintering temperature technologies as well. At the end, a novel binder system, which enables low sintering temperatures close to 300 °C, was developed. A dielectric multilayer module containing BaTiO3-BBSZ and Al2O3-BBSZ composites with silver electrodes was co-fired at 450 °C without observable cracks and diffusions. These results indicate that these glass-ceramic composites provide a new horizon to fabricate environmentally friendly ULTCC materials, as well as multilayers for multimaterial 3D electronics packages and high frequency devices
Tiivistelmä Väitöstyön ensimmäisessä osassa tutkittiin ja kehitettiin uudentyyppisiä, ultramatalissa sintrauslämpötiloissa (ULTCC) valmistettuja lasi-keraami komposiitteja käyttäen vismuttisinkkiborosilikaatti -pohjaista lasia (BBSZ). Täyteaineina olivat alumiinioksidi (Al2O3) ja bariumtitanaatti (BaTiO3). Materiaaleille saatiin riittävän suuren lasipitoisuuden avulla tiheät mikrorakenteet ja sovelluskelpoiset dielektriset ominaisuudet. BaTiO3:n komposiitti, joka sisälsi 70 p-% BBSZ lasia, saavutti 450 °C lämpötilassa sintrattuna korkeimman suhteellisen permittiivisyyden: εr=132 (@100 kHz) ja εr=207 (@100 MHz). Komposiittien dielektrisiä ominaisuuksia määrittivät tällöin lasi-, BaTiO3- ja Bi24Si2O40- faasien ominaisuudet ja erityisesti Bi24Si2O40 -faasi näytteissä, joissa on 70-90 p-% lasia. Sekundäärinen faasi Bi24Si2O40 ei välttämättä heikentänyt, vaan jopa paransi dielektrisiä ominaisuuksia. Vastaavilla Al2O3-BBSZ –komposiiteilla saavutettiin samanlaisia tuloksia tihentymisen, mikrorakenteiden ja faasien (Al2O3, BBSZ, Bi24Si2O40) suhteen. Lisäksi tässä tapauksessa saavutetut dielektriset ominaisuudet voidaan selittää näiden kolmen faasin yhdistelmän olemassaololla. Väitöstyön toinen osa käsitteli pääasiassa eritavoin lämpökäsiteltyjä BaTiO3:n komposiitteja, joissa on 50 p-% BBSZ-lasia. Näillä saavutettiin tiheä mikrorakenne sintrattaessa 720 °C lämpötilassa ja havaitiin Bi4BaTi4O15-, Bi24Si2O40-faasien muodostuminen BaTiO3 lähtöfaasin rinnalle. Tulokset osoittivat myös, että lasijauheen partikkelikoko ei vaikuttanut sintrattujen näytteiden dielektrisiin ominaisuuksiin (εr = 263-267, tan δ = 0.013 (@100 kHz)). LiF -lisäys sen sijaan heikensi dielektrisiä ominaisuuksia ja vähensi Bi4BaTi4O15 faasin muodostumista. Tämä aiheutui Bi4BaTi4O15-faasin ominaisuuksista ja oli riippuvainen kyseisen faasin määrästä. Nämä tulokset osoittivat BBSZ -pohjaisten komposiittien käytettävyyden myös korkeampien sintrauslämpötilojen teknologioihin. Viimeisenä kehitettiin uudentyyppinen sideainesysteemi, joka mahdollistaa ultramatalien keraamien yhteissintraamisen jopa noin 300 °C lämpötilassa. Hyödyntäen kehitettyä sideainesysteemiä monikerrosrakenne, jossa käytettiin dielektrisiä BaTiO3-BBSZ- ja Al2O3-BBSZ-komposiitteja ja hopeaelektrodeja, yhteissintrattiin 450 °C lämpötilassa. Valmistetuissa rakenteissa ei havaittu murtumia eikä diffuusioita. Tulokset osoittavat, että kehitetyt lasi-keraami komposiitit mahdollistavat ympäristöystävällisten ULTCC -materiaalien valmistuksen. Lisäksi osoitettiin kehitettyjen materiaalien soveltuvuus monikerroksisten rakenteiden käyttöön monimateriaali-3D-elektroniikan pakkauksissa ja suurtaajuuskomponteissa

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Patha, Venu Gopal. "Characterization of TiO₂ Photoelectrodes Fabricated via a Low Temperature Sintering Process." Youngstown State University / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=ysu1310266733.

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Book chapters on the topic "Low temperature sintering"

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Hirota, Ken, Mitsuo Satomi, and Koichi Kugimiya. "Low-Temperature Sintering of Mn-Zn Ferrites." In Sintering ’87, 1203–8. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1373-8_202.

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Li, Gui Zhilun, Longtu Gao Suhua, and Zhang Xiaowen. "Low Temperature Sintering of Lead-Based Piezoelectric Ceramics with Transient Liquid Phase." In Sintering ’87, 920–25. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1373-8_155.

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Maisnam, Mamata. "Low Temperature Sintering of Lithium Based Ferrites." In Materials Horizons: From Nature to Nanomaterials, 265–83. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-8307-0_13.

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Kimura, Nobuo, Shinji Abe, Junichi Morishita, and Hiromichi Okamura. "Low-Temperature Sintering of Y-TZP and Y-TZP-AL2O3 Composites with Transition Metal Oxide Additives." In Sintering ’87, 1142–48. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1373-8_192.

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Rehspringer, Jean-Luc, Sami Dick, and Marc Daire. "Chemical Preparation of Alumina-Zirconia Powders for Low Temperature Sintering and Particulate Composites." In Science of Sintering, 127–34. Boston, MA: Springer US, 1989. http://dx.doi.org/10.1007/978-1-4899-0933-6_9.

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Zago, Marco, Ilaria Cristofolini, and Sasan Amirabdollahian. "Designing Powder Metallurgy Process - The Influence of High Sintering Temperature on Dimensional and Geometrical Precision." In Lecture Notes in Mechanical Engineering, 3–8. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-70566-4_2.

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AbstractThe precision of parts produced by Powder Metallurgy (PM) strongly depends on the careful design of PM process parameters. Among them, high sintering temperature is generally considered as detrimental for dimensional and geometrical precision, and therefore neglected in industrial production. Nevertheless, high sintering temperature would strongly improve mechanical characteristics of PM parts, so that the real influence of high sintering temperature on dimensional and geometrical precision is of great interest for PM companies. This study investigates the influence of sintering temperature (up to 1350 °C) on dimensional and geometrical precision of real parts. Dimensional changes on sintering and the effect of sintering temperature have been evaluated. Geometrical characteristics have been measured both in the green and in the sintered state, and the real influence of sintering temperature has been highlighted. As a conclusion, it has been demonstrated that the larger shrinkage due to the high sintering temperature is not detrimental with respect to the dimensional precision, being it reliably predictable. Moreover, the influence on geometrical characteristics is unexpectedly low. The encouraging results of this study convinced the main PM companies in Europe to further investigate the influence of high sintering temperature, as partners in a Club Project within the European Powder Metallurgy Association (EPMA).

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Park, Hwi-Yeol, and Sahn Nahm. "Low Temperature Sintering of the Alkali-Niobate Ceramics." In Lead-Free Piezoelectrics, 121–37. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-9598-8_4.

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Zhang, Yuanbo, Wei Luo, Zhixiong You, Zijian Su, Guanghui Li, and Tao Jiang. "Optimizing the Sintering Process of Low-Grade Ferromanganese Ores." In 4th International Symposium on High-Temperature Metallurgical Processing, 527–34. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118663448.ch64.

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Bian, Pei, and Dong Ying Ju. "A New Low-Temperature Sintering Method for NiCuZn Ferrite." In Key Engineering Materials, 695–98. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-410-3.695.

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Chaim, Rachman, Zhijian Shen, and Mats Nygren. "Transparent Nanocrystalline MgO by Low Temperature Spark Plasma Sintering." In Ceramic Transactions Series, 21–30. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118407158.ch3.

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Conference papers on the topic "Low temperature sintering"

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Carter, Michael, Jacob Colvin, and James Sears. "Sintering nano-particles on low temperature materials." In ICALEO® 2006: 25th International Congress on Laser Materials Processing and Laser Microfabrication. Laser Institute of America, 2006. http://dx.doi.org/10.2351/1.5060872.

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Yesner, G., M. Kuciej, and A. Safari. "Low temperature sintering of Bi0.5Na0.5TiO3 based ceramics." In 2015 Joint IEEE International Symposium on the Applications of Ferroelectric (ISAF), International Symposium on Integrated Functionalities (ISIF), and Piezoelectric Force Microscopy Workshop (PFM). IEEE, 2015. http://dx.doi.org/10.1109/isaf.2015.7172658.

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Bronchy, Maxime, Jean-Charles Souriau, Jean-Marc Heintz, Celine Feautrier, David Henry, Etienne Duguet, Laurent Mendizabal, Gilles Simon, and Mona Treguer-Delapierre. "Low-temperature silver sintering by colloidal approach." In 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE, 2020. http://dx.doi.org/10.1109/estc48849.2020.9229830.

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Muralithran, G., and S. Ramesh. "LOW TEMPERATURE SINTERING OF MnO2-DOPED HYDROXYAPATITE." In Processing and Fabrication of Advanced Materials VIII. WORLD SCIENTIFIC, 2001. http://dx.doi.org/10.1142/9789812811431_0042.

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Lu, Guo-Quan, Yunhui Mei, Meiyu Wang, and Xin Li. "Low-temperature Silver Sintering for Bonding 3D Power Modules." In 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2019. http://dx.doi.org/10.23919/ltb-3d.2019.8735123.

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Kawase, Kinya, Koichiro Morimoto, Tohru Kohno, and Hiroki Yanagawa. "High Temperature Sintering of Low Alloy Steel Powders." In International Congress & Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1996. http://dx.doi.org/10.4271/960381.

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Wang, Lingen. "Low temperature hermertic packaging with Ag sintering process." In 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2015. http://dx.doi.org/10.1109/icept.2015.7236821.

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Deng, Dunying, Yunxia Jin, Yuanrong Chen, Tianke Qi, and Fei Xiao. "Preparation of copper nanoparticles with low sintering temperature." In 2012 14th International Conference on Electronic Materials and Packaging (EMAP). IEEE, 2012. http://dx.doi.org/10.1109/emap.2012.6507927.

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Yang, Hui, and Zhengbang Zhan. "Progress on low temperature sintering of nano-silver." In 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). IEEE, 2021. http://dx.doi.org/10.1109/eptc53413.2021.9663963.

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Li, Rui, and Yuemin Zhou. "High Temperature Creep Properties of UO2 Fuel Pellets Manufactured by Low Temperature Sintering Technology." In 2013 21st International Conference on Nuclear Engineering. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/icone21-15038.

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Abstract:

In this paper, the low temperature sintering technology to UO2 pellets has been introduced, and we have studied the high temperature creep properties of the pellets which manufactured by low temperature sintering. The sintering temperatures are 1073K, 1273K, 1473K and 1673K, sintering time are 1 hour, 2 hours and 3 hours respectively. We obtained the highest sintering density of pellets at 1673K with 3 hours, which is 10.41g/cm3 (94.98% theoretical density). The grain size of pellets which prepared by low temperature sintering technology and traditional technology are 9.0μm and 23.8μm respectively. So the high temperature creep properties of the two kinds of pellet must be studied. They were performed at 20–50 MPa, 1673K and 1773K respectively, under a nitrogen atmosphere to shorten the experimental time. According to the results, the creep rates of sintered UO2 with the grain sizes of 9.0μm and 23.8μm under the load of 10MPa are almost the same. The creep process is controlled by both Nabarro-Herring creep and Hamper-Dorn creep for uranium dioxide with grain size of 9.0μm; while Hamper-Dorn creep is the dominant mechanism for uranium dioxide with grain size of 23.8μm.

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Reports on the topic "Low temperature sintering"

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Christopher J. Zygarlicke, Donald P. McCollor, and John P. Kay. LOW-TEMPERATURE ASH SINTERING AND STRENGTH DEVELOPMENT. Office of Scientific and Technical Information (OSTI), October 1999. http://dx.doi.org/10.2172/824981.

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Nicholas, Jason Dale. Low Temperature Constrained Sintering of Cerium Gadolinium OxideFilms for Solid Oxide Fuel Cell Applications. Office of Scientific and Technical Information (OSTI), January 2007. http://dx.doi.org/10.2172/926303.

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3

Nenoff, Tina Maria, Patrick Vane Brady, Curtis D. Mowry, and Terry J. Garino. AgI-MOR Loading Effect on the Durability of the Sandia Low Temperature Sintering GCM Waste Form. Office of Scientific and Technical Information (OSTI), September 2014. http://dx.doi.org/10.2172/1171567.

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