Journal articles on the topic 'Melting of oxygen-free copper'
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S. Kazem, Murtadha, and Isam M. Abdulbaqi. "DESIGN OF INDUCTION COIL FOR OXYGEN FREE COPPER PRODUCTION." Journal of Engineering and Sustainable Development 25, no. 4 (2021): 51–57. http://dx.doi.org/10.31272/jeasd.25.4.5.
Full textGuo, Ming En, Yun Xu Shi, and Yu Chen Guo. "Research on Oxygen Content and Crack Control of Oxygen-Free Copper Billet in Horizontal Continuous Casting Process." Advanced Materials Research 569 (September 2012): 264–67. http://dx.doi.org/10.4028/www.scientific.net/amr.569.264.
Full textLee, Jung Il, Joo Ho Lee, Seung Hwan Park, et al. "Design of Manufacturing Process of Oxygen-Free High Conductivity Copper Using Mahalanobis-Distance Outlier Detection Method." Materials Science Forum 544-545 (May 2007): 965–68. http://dx.doi.org/10.4028/www.scientific.net/msf.544-545.965.
Full textLei, H. "Melting of free copper clusters." Journal of Physics: Condensed Matter 13, no. 13 (2001): 3023–30. http://dx.doi.org/10.1088/0953-8984/13/13/315.
Full textStefanova, V., K. Vutova, and V. Vassileva. "Thermodynamic analysis of the processes during electron beam melting and refining of copper." Journal of Physics: Conference Series 2240, no. 1 (2022): 012034. http://dx.doi.org/10.1088/1742-6596/2240/1/012034.
Full textGuo, Junli, Jin Zou, Huihui Yu, Kai Hu, and Qiang Hu. "Effect of FetO on viscosity and structure of Na2O3-B2O3-CaO-SiO2-Al2O3 slag." Metallurgical Research & Technology 121, no. 6 (2024): 622. http://dx.doi.org/10.1051/metal/2024095.
Full text李, 永弟. "Research on High Purity Oxygen Free Copper by Vacuum Melting and Downward Continuous Casting Process." Material Sciences 14, no. 09 (2024): 1328–34. http://dx.doi.org/10.12677/ms.2024.149147.
Full textDe Lucia, M. "Oxygen Enrichment in Combustion Processes: Comparative Experimental Results From Several Application Fields." Journal of Energy Resources Technology 113, no. 2 (1991): 122–26. http://dx.doi.org/10.1115/1.2905785.
Full textTsao, Lung-Chuan, Cheng-Kai Li, Yu-Kai Sun, Shih-Ying Chang, and Tung-Han Chuang. "Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper." Advances in Materials Science and Engineering 2021 (November 15, 2021): 1–7. http://dx.doi.org/10.1155/2021/8069719.
Full textLedford, Christopher, Christopher Rock, Paul Carriere, Pedro Frigola, Diana Gamzina, and Timothy Horn. "Characteristics and Processing of Hydrogen-Treated Copper Powders for EB-PBF Additive Manufacturing." Applied Sciences 9, no. 19 (2019): 3993. http://dx.doi.org/10.3390/app9193993.
Full textLi, Jianxing, Daniel Lau, Pingliang Tu, Andrew Delano, and Brian Knight. "High Melting Temperature Lead Free Solder for Die Attach Application." International Symposium on Microelectronics 2011, no. 1 (2011): 000322–26. http://dx.doi.org/10.4071/isom-2011-tp4-paper1.
Full textVasilyeva, Natalia, and Ivan Pavlyuk. "Analysis of Operational Control Data and Development of a Predictive Model of the Content of the Target Component in Melting Products." Eng 5, no. 3 (2024): 1752–67. http://dx.doi.org/10.3390/eng5030092.
Full textMaryam, javaid Kainat Javeed. "Mechanochemically Synthesized Copper (II) and Silver (I) Complexes with Cefuroxime: A Promising Strategy to Combat Cephalosporin-Resistant Bacteria." International Journal in Pharmaceutical Sciences 1, no. 11 (2023): 127–34. https://doi.org/10.5281/zenodo.10077979.
Full textSong, Shu Xiang, Zhang Jian Zhou, Juan Du, and Chang Chun Ge. "Study on Interfacial Characterization and Mechanical Properties of Plasma-Sprayed Tungsten Coatings." Materials Science Forum 546-549 (May 2007): 1809–12. http://dx.doi.org/10.4028/www.scientific.net/msf.546-549.1809.
Full textOlagboye, S.A, and S.E Ige. "Synthesis, Characterization and Antimicrobial Properties of Mixed Ligand of Sulphamethoxazole and Trimethoprim and Their Manganese (II) and Copper (II) Complexes." International Journal of Innovative Science and Research Technology 7, no. 2 (2022): 716–21. https://doi.org/10.5281/zenodo.6351083.
Full textNING, HONGLONG, USHENG MA, FUXIANG HUANG, YONGGANG WANG, JIMAN ZHU, and ZHITING GENG. "INVESTIGATION OF THE INTERFACE OF THE DCB SUBSTRATE." Surface Review and Letters 10, no. 01 (2003): 95–99. http://dx.doi.org/10.1142/s0218625x03004640.
Full textRamazonova, Dilbar, Zokirjon Turayev, Bakhodir Mamurov, et al. "Investigation of the process of extraction of copper from dust of electric filters of oxygen-flare smelting furnace with sulfuric, thermal, and extractive phosphoric acid." IOP Conference Series: Earth and Environmental Science 1281, no. 1 (2023): 012003. http://dx.doi.org/10.1088/1755-1315/1281/1/012003.
Full textYao, Wei Zhi, Shu Xiang Song, Zhang Jian Zhou, Wei Wei Cong, and Chang Chun Ge. "Fabrication and Evaluation of Plasma-Sprayed Molybdenum for Plasma Facing Materials." Materials Science Forum 561-565 (October 2007): 1777–80. http://dx.doi.org/10.4028/www.scientific.net/msf.561-565.1777.
Full textHablovska, N., T. Pavlenko, A. Kloc-Ptaszna, et al. "Synthesis of components for composite material of electrical contacts with unique properties for high-current electrical apparatus with arc-free switching." Physics and Chemistry of Solid State 25, no. 4 (2024): 816–24. https://doi.org/10.15330/pcss.25.4.816-824.
Full textAraki, Noritoshi, Yasutomo Ichiyama, Ryo Oishi, Teruo Haibara, and Takashi Yamada. "Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-Coated Copper Bonding Wires." Journal of Microelectronics and Electronic Packaging 12, no. 2 (2015): 98–103. http://dx.doi.org/10.4071/imaps.460.
Full textAraki, Noritoshi, Yasutomo Ichiyama, Ryo Oishi, Teruo Haibara, and Takashi Yamada. "Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-coated Copper Bonding Wires." International Symposium on Microelectronics 2014, no. 1 (2014): 000272–77. http://dx.doi.org/10.4071/isom-tp41.
Full textHuang, Weijun, Yajing Liu, and Tao Jiang. "Reduction of Copper Smelting Slag by Carbon for Smelting Cu-Fe Alloy." Alloys 3, no. 3 (2024): 164–77. http://dx.doi.org/10.3390/alloys3030010.
Full textJadhav, Dadbakhsh, Vleugels, et al. "Influence of Carbon Nanoparticle Addition (and Impurities) on Selective Laser Melting of Pure Copper." Materials 12, no. 15 (2019): 2469. http://dx.doi.org/10.3390/ma12152469.
Full textKang, Jeong-Won, and Ho-Jung Hwang. "Molecular Dynamics Simulations on Melting Properties of Free Icosahedral Copper Clusters." Transactions on Electrical and Electronic Materials 4, no. 1 (2003): 1–6. http://dx.doi.org/10.4313/teem.2003.4.1.001.
Full textYastrebinsky, R. N., V. I. Pavlenko, A. I. Gorodov, A. A. Karnauhov, N. I. Cherkashina, and A. V. Yastrebinskay. "Effect of electrochemical modification of titanium hydride fraction on oxygen content in surface and deep layers." Materials Research Express 9, no. 1 (2022): 016401. http://dx.doi.org/10.1088/2053-1591/ac45bd.
Full textLiu, Xuan, and Ping Feng. "Picosecond Pulsed Laser Induced Melting of Monocrystalline Copper: A Hybrid Simulation." Advanced Materials Research 97-101 (March 2010): 3807–10. http://dx.doi.org/10.4028/www.scientific.net/amr.97-101.3807.
Full textAlekseev, A. V., T. N. Pahomkina, and Yu V. Lapshina. "DETERMINATION OF SULFUR, CARBON, NITROGEN AND OXYGEN IN COPPER BASED ALLOYS." Proceedings of VIAM, no. 11 (2021): 112–19. http://dx.doi.org/10.18577/2307-6046-2021-0-11-112-119.
Full textCamurri, Carlos, Claudia Carrasco, Antonio Pagliero, and Rodrigo Leite. "Influence of the Impurities on Cathodic Copper on the Ductility of Copper Wires." Materials Science Forum 706-709 (January 2012): 899–906. http://dx.doi.org/10.4028/www.scientific.net/msf.706-709.899.
Full textShrestha, Sabita, and Sudha Maharjan. "Synthesis and Characterization of Copper Complex of Salicylaldehyde Benzoyl Hydrazone." Journal of Nepal Chemical Society 29 (December 3, 2013): 11–17. http://dx.doi.org/10.3126/jncs.v29i0.9231.
Full textPrasad, V. V. Satya, V. Ramakrishna Rao, U. Prakash, P. Krishna Rao, and K. M. Gupt. "Electro Slag Crucible Melting for Recycling of Low Oxygen High Conductivity Copper Scrap." ISIJ International 36, no. 9 (1996): 1113–18. http://dx.doi.org/10.2355/isijinternational.36.1113.
Full textMajidian, Hudsa, Leila Nikzad, Sheida Hamzavi Taleghani, Mohammad Farvizi, Mansour Razavi, and Arash Faraji. "Alternative Industrial Chrome-Free Alumina-Based Bricks for Copper Alloy Melting Furnaces." Materials Performance and Characterization 12, no. 1 (2023): 20230045. http://dx.doi.org/10.1520/mpc20230045.
Full textArtis, Rylan, Clifford W. Padgett, Kennedy Musso, Nathaniel Shank, Allison Marks та Brandon Quillian. "A (2-(Pyrrolidin-1-yl)ethan-1-olate)(1-oxo-3-phenyl-1,4-dihydronaphthalen-2-olate) μ-Oxo-Bridged Dicopper(II) Dimeric Complex". Molbank 2024, № 3 (2024): M1846. http://dx.doi.org/10.3390/m1846.
Full textYao, Wei Zhi, Shu Xiang Song, Zhang Jian Zhou, Wei Wei Cong, Y. Ma, and C. C. Ge. "Study on the Plasma-Sprayed Molybdenum as Plasma Facing Materials in Fusion Reactor." Key Engineering Materials 373-374 (March 2008): 81–84. http://dx.doi.org/10.4028/www.scientific.net/kem.373-374.81.
Full textKalyniuk, M. M., Ya P. Gritskiv, and L. M. Kahitanchuk. "Eloboration of Methods for Determination on Content of the Oxygen, Nitrogen, Hydrogen Admixtures in Titanium Aluminides." Metrology and instruments, no. 2 (May 21, 2020): 61–67. http://dx.doi.org/10.33955/2307-2180(2)2020.61-67.
Full textZhao, Luo, Daofei Zhu, Dafang Liu, Huitao Wang, Zhangming Xiong, and Lei Jiang. "Prediction and Optimization of Matte Grade in ISA Furnace Based on GA-BP Neural Network." Applied Sciences 13, no. 7 (2023): 4246. http://dx.doi.org/10.3390/app13074246.
Full textMookam, Niwat, Prajak Jattakul, and Kannachai Kanlayasiri. "Effects of Ni Content on Melting Behaviors and Wettability of SnBiAgNi Lead-Free Solder." Materials Science Forum 1074 (November 8, 2022): 119–23. http://dx.doi.org/10.4028/p-zcw87p.
Full textNassau, K., A. E. Miller, E. M. Gyorgy, and T. Siegrist. "Rapidly quenched Bi-containing high Tc superconducting oxide compositions." Journal of Materials Research 4, no. 6 (1989): 1330–38. http://dx.doi.org/10.1557/jmr.1989.1330.
Full textGuschlbauer, Ralf, Alex K. Burkhardt, Zongwen Fu, and Carolin Körner. "Effect of the oxygen content of pure copper powder on selective electron beam melting." Materials Science and Engineering: A 779 (March 2020): 139106. http://dx.doi.org/10.1016/j.msea.2020.139106.
Full textIlyushenko, V. M., T. B. Maidanchuk, A. N. Bondarenko, E. P. Lukianchenko, T. E. Udartseva, and D. I. Andreichuk. "Restoration Of End Part Of Copper Gas-oxygen Chambers Of Arc Steel-melting Furnaces." Sovremennaâ èlektrometallurgiâ 2019, no. 4 (2019): 38–43. http://dx.doi.org/10.15407/sem2019.04.06.
Full textEvidente, Ralph Carlo T., Marc Jazer F. Esguerra, Danielle Jaye S. Agron, Louise Grace S. Avena, and Michelle C. Almendrala. "Thermodynamic Metallurgical Analyses of a Sustainable Copper Production in Philippines." IOP Conference Series: Earth and Environmental Science 1395, no. 1 (2024): 012022. http://dx.doi.org/10.1088/1755-1315/1395/1/012022.
Full textNetskina, Olga V., Svetlana A. Mukha, Kirill A. Dmitruk, et al. "Solvent-Free Method for Nanoparticles Synthesis by Solid-State Combustion Using Tetra(Imidazole)Copper(II) Nitrate." Inorganics 10, no. 2 (2022): 15. http://dx.doi.org/10.3390/inorganics10020015.
Full textVintaikin, B. Е., A. E. Smirnov, S. Yu Shevchenko, A. A. Drenin, and V. I. Sheykina. "Phase Composition and Structure of the BrX Chromium Bronze Powder." Herald of the Bauman Moscow State Technical University. Series Natural Sciences, no. 1 (106) (February 2023): 82–94. http://dx.doi.org/10.18698/1812-3368-2023-1-82-94.
Full textWang, Dawei, Jinyao Tang, and Yuxia Song. "Effective Removal of Arsenic from Copper Matte by Sodium Carbonate." Metals 14, no. 9 (2024): 1078. http://dx.doi.org/10.3390/met14091078.
Full textVutova, Katia, Vladislava Stefanova, Vania Vassileva, and Milen Kadiyski. "Behaviour of Impurities during Electron Beam Melting of Copper Technogenic Material." Materials 15, no. 3 (2022): 936. http://dx.doi.org/10.3390/ma15030936.
Full textKANIGEL, AMIT, JOAN ADLER, and EMIL POLTURAK. "INFLUENCE OF POINT DEFECTS ON THE SHEAR ELASTIC COEFFICIENTS AND ON THE MELTING TEMPERATURE OF COPPER." International Journal of Modern Physics C 12, no. 05 (2001): 727–37. http://dx.doi.org/10.1142/s0129183101001900.
Full textWong, Wei Yee, Rabiatul Adawiyah Shamsudin, Muhammad Firdaus Mohd Nazeri, and Mohamad Najmi Masri. "The Preliminary Study of the Addition Zinc in Tin-Copper Lead Free Solder." Materials Science Forum 1010 (September 2020): 104–8. http://dx.doi.org/10.4028/www.scientific.net/msf.1010.104.
Full textLiu, J., and J. M. Cowley. "SREM imaging of copper (110) vicinal surfaces." Proceedings, annual meeting, Electron Microscopy Society of America 47 (August 6, 1989): 542–43. http://dx.doi.org/10.1017/s0424820100154688.
Full textKoshel, Oleksandr. "EXAMINATION OF COUNTERFEIT CONDUCTORS WITH SIGNS OF A SHORT CIRCUIT." Criminalistics and Forensics, no. 67 (August 9, 2022): 410–16. http://dx.doi.org/10.33994/kndise.2022.67.41.
Full textAamir, Muhammad, Riaz Muhammad, Majid Tolouei-Rad, Khaled Giasin, and Vadim V. Silberschmidt. "A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics." Soldering & Surface Mount Technology 32, no. 2 (2019): 115–26. http://dx.doi.org/10.1108/ssmt-11-2018-0046.
Full textHaruna, A., Rumah, M.M., Sani, U., and Ibrahim, A.K. "Synthesis, Characterization and corrosion Inhibition Studies on Mn (II) and Co (II) Complexes Derived from 1-{(Z)-[(2-hydroxyphenyl) imino]methyl}naphthalen-2-ol in 1M HCl Solution." International Journal of Biological, Physical and Chemical Studies 3, no. 1 (2021): 09–18. http://dx.doi.org/10.32996/ijbpcs.2021.3.1.2.
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