To see the other types of publications on this topic, follow the link: Melting of oxygen-free copper.

Journal articles on the topic 'Melting of oxygen-free copper'

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 50 journal articles for your research on the topic 'Melting of oxygen-free copper.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

S. Kazem, Murtadha, and Isam M. Abdulbaqi. "DESIGN OF INDUCTION COIL FOR OXYGEN FREE COPPER PRODUCTION." Journal of Engineering and Sustainable Development 25, no. 4 (2021): 51–57. http://dx.doi.org/10.31272/jeasd.25.4.5.

Full text
Abstract:
This paper deals with the design of an induction coil (IC) intended to be used for an oxygen free copper production. This coil differs in design because it should be placed in a vacuum or in a chamber filled with noble gas, such as Argon. The designed coil must be suitable for melting the copper in this environment. The coil design means, using the simulation of the melting process to determine the best, coil geometry, type of crucible, the required current, frequency, the consumed power, and time required for this process. These results will be used to determine the parameters of the inductio
APA, Harvard, Vancouver, ISO, and other styles
2

Guo, Ming En, Yun Xu Shi, and Yu Chen Guo. "Research on Oxygen Content and Crack Control of Oxygen-Free Copper Billet in Horizontal Continuous Casting Process." Advanced Materials Research 569 (September 2012): 264–67. http://dx.doi.org/10.4028/www.scientific.net/amr.569.264.

Full text
Abstract:
In this paper, research on reducing oxygen content and crack in oxygen-free copper strip during horizontal continuous casting process has been taken. First, reform the original copper alloy smelting-holding-casting three stages process. Through developing melting and holding integrative furnace, combine melting process and holding process for one, reforming smelting holding-casting two stages process. Second, pick up and realize on-off valve technics on controlling flow or stop of undercurrents copper liquid. Third, analyze the cracks in oxygen-free copper billet with flakinessratio 6500/20mm.
APA, Harvard, Vancouver, ISO, and other styles
3

Lee, Jung Il, Joo Ho Lee, Seung Hwan Park, et al. "Design of Manufacturing Process of Oxygen-Free High Conductivity Copper Using Mahalanobis-Distance Outlier Detection Method." Materials Science Forum 544-545 (May 2007): 965–68. http://dx.doi.org/10.4028/www.scientific.net/msf.544-545.965.

Full text
Abstract:
The proper control of total impurities and oxygen contents of oxygen-free high conductivity (OFHC) copper prepared by vacuum high-frequency melting technique was studied using Mahalanobis-Distance (MD) outlier detection method as functions of raw material purities, vacuum pressure, melting temperature and holding time. The properties of vacuum-melted OFHC copper was examined by thermo-gravimetric analysis, differential scanning calorimetry, hardness test, macro and optical microstructure analyses and ultimate tensile test. In multivariate systems, the existence of outlier makes it difficult to
APA, Harvard, Vancouver, ISO, and other styles
4

Lei, H. "Melting of free copper clusters." Journal of Physics: Condensed Matter 13, no. 13 (2001): 3023–30. http://dx.doi.org/10.1088/0953-8984/13/13/315.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Stefanova, V., K. Vutova, and V. Vassileva. "Thermodynamic analysis of the processes during electron beam melting and refining of copper." Journal of Physics: Conference Series 2240, no. 1 (2022): 012034. http://dx.doi.org/10.1088/1742-6596/2240/1/012034.

Full text
Abstract:
Abstract In the paper, results are presented and discussed obtained by thermodynamic analysis of the refining processes of copper aimed at removing metal impurities and oxygen via electron beam melting (EBM) in vacuum. Thermodynamic evaluations of the possible chemical interactions between the base metal (Cu) and the metal impurities present in Cu that can proceed during the refining of copper are made based on the calculated values of the Gibbs free energy and equilibrium constants taking into account the physical state of copper and of the metal impurities during EBM.
APA, Harvard, Vancouver, ISO, and other styles
6

Guo, Junli, Jin Zou, Huihui Yu, Kai Hu, and Qiang Hu. "Effect of FetO on viscosity and structure of Na2O3-B2O3-CaO-SiO2-Al2O3 slag." Metallurgical Research & Technology 121, no. 6 (2024): 622. http://dx.doi.org/10.1051/metal/2024095.

Full text
Abstract:
The effects of FetO on the characteristic melting temperature, viscosity, and structure of Na2O3-B2O3-CaO-SiO2-Al2O3 slag were investigated. Understanding the viscous behavior and structure of borate slag containing FetO can guide the design of mold powders for copper alloy casting. The melting temperature (Th) suddenly increased and exceeded 800 °C when the FetO content increased from 15 to 23 wt%. The viscosity changed significantly with increasing FetO content when the temperature was below 1050 °C. The slag structure exhibited a boron–iron anomaly. The viscosity of the Na2O3-B2O3-CaO-SiO2-
APA, Harvard, Vancouver, ISO, and other styles
7

李, 永弟. "Research on High Purity Oxygen Free Copper by Vacuum Melting and Downward Continuous Casting Process." Material Sciences 14, no. 09 (2024): 1328–34. http://dx.doi.org/10.12677/ms.2024.149147.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

De Lucia, M. "Oxygen Enrichment in Combustion Processes: Comparative Experimental Results From Several Application Fields." Journal of Energy Resources Technology 113, no. 2 (1991): 122–26. http://dx.doi.org/10.1115/1.2905785.

Full text
Abstract:
The effects of using oxygen to partially or wholly replace fuel air in small-size melting furnaces were studied over a range of application fields. Following definition of the useful parameters, testing was conducted on furnaces for melting glass, ferrous metals (pigiron), nonferrous metals (copper alloys), and ceramic materials. In all cases, oxygen-enrichment was found to provide significant energy savings, as well as notable advantages in terms of both plant output and energy consumption.
APA, Harvard, Vancouver, ISO, and other styles
9

Tsao, Lung-Chuan, Cheng-Kai Li, Yu-Kai Sun, Shih-Ying Chang, and Tung-Han Chuang. "Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper." Advances in Materials Science and Engineering 2021 (November 15, 2021): 1–7. http://dx.doi.org/10.1155/2021/8069719.

Full text
Abstract:
Due to the combined advantages of low cost, good soldering properties, and appropriate melting temperature range, novel Sn8Zn3Bi1Mg active solder was developed for direct soldering of transparent conductive oxide (TCO) ceramic targets with oxygen-free copper at 200°C in air. The TCO specimens have aluminum-doped zinc oxide (AZO) and zinc oxide (ZnO) ceramics. The direct soldering process was performed without the need for flux or pre-metallization of the two transparent conductive oxides. The microstructure, phase constitution, melting characteristics, and soldering properties of the Sn8Zn3Bi1
APA, Harvard, Vancouver, ISO, and other styles
10

Ledford, Christopher, Christopher Rock, Paul Carriere, Pedro Frigola, Diana Gamzina, and Timothy Horn. "Characteristics and Processing of Hydrogen-Treated Copper Powders for EB-PBF Additive Manufacturing." Applied Sciences 9, no. 19 (2019): 3993. http://dx.doi.org/10.3390/app9193993.

Full text
Abstract:
The fabrication of high purity copper using additive manufacturing has proven difficult because of oxidation of the powder feedstock. Here, we present work on the hydrogen heat treatment of copper powders for electron beam powder bed fusion (EB-PBF), in order to enable the fabrication of high purity copper components for applications such as accelerator components and vacuum electronic devices. Copper powder with varying initial oxygen contents were hydrogen heat-treated and characterized for their chemistry, morphology, and microstructure. Higher initial oxygen content powders were found to n
APA, Harvard, Vancouver, ISO, and other styles
11

Li, Jianxing, Daniel Lau, Pingliang Tu, Andrew Delano, and Brian Knight. "High Melting Temperature Lead Free Solder for Die Attach Application." International Symposium on Microelectronics 2011, no. 1 (2011): 000322–26. http://dx.doi.org/10.4071/isom-2011-tp4-paper1.

Full text
Abstract:
Two lead free solders were developed for die attach application. The bismuth based solder has a melt temperature of 271C and thermal conductivity of 18W/mK. The zinc based solder has a melt temperature of 337C and thermal conductivity of 85W/mK. Both solders have acceptable wetting on bare copper and nickel plated copper substrate, could be processed using modified high lead solder process condition and survived 260C board level reflow simulation. This paper discusses the solder material properties, and presents the die attach process and reliability test results in a manufacturing environment
APA, Harvard, Vancouver, ISO, and other styles
12

Vasilyeva, Natalia, and Ivan Pavlyuk. "Analysis of Operational Control Data and Development of a Predictive Model of the Content of the Target Component in Melting Products." Eng 5, no. 3 (2024): 1752–67. http://dx.doi.org/10.3390/eng5030092.

Full text
Abstract:
The relevance of this research is due to the need to stabilize the composition of the melting products of copper–nickel sulfide raw materials. Statistical methods of analyzing the historical data of the real technological object and the correlation analysis of process parameters are described. Factors that exert the greatest influence on the main output parameter (the fraction of copper in a matte) and ensure the physical–chemical transformations are revealed: total charge rate, overall blast volume, oxygen content in the blast (degree of oxygen enrichment in the blowing), temperature of exhau
APA, Harvard, Vancouver, ISO, and other styles
13

Maryam, javaid Kainat Javeed. "Mechanochemically Synthesized Copper (II) and Silver (I) Complexes with Cefuroxime: A Promising Strategy to Combat Cephalosporin-Resistant Bacteria." International Journal in Pharmaceutical Sciences 1, no. 11 (2023): 127–34. https://doi.org/10.5281/zenodo.10077979.

Full text
Abstract:
Pharmaceutical drug development frequently involves the use of complexation to modify the pharmacological, toxicological, and physico-chemical properties of drugs. In our investigation, we employed solvent-free (mechanochemical) synthesis techniques to create copper (II) and silver (I) complexes with cefuroxime. Various physico-chemical analyses, including infrared spectroscopy, UV/Visible spectroscopy, elemental analysis, melting point determination, solubility tests, and conductivity measurements, were utilized to characterize these complexes. Our findings led to the proposed chemical formul
APA, Harvard, Vancouver, ISO, and other styles
14

Song, Shu Xiang, Zhang Jian Zhou, Juan Du, and Chang Chun Ge. "Study on Interfacial Characterization and Mechanical Properties of Plasma-Sprayed Tungsten Coatings." Materials Science Forum 546-549 (May 2007): 1809–12. http://dx.doi.org/10.4028/www.scientific.net/msf.546-549.1809.

Full text
Abstract:
Tungsten has the highest melting point among all metal, which makes it withstand thermal shock and erosion in high temperature environments. In this study, Tungsten coatings were sprayed onto the oxygen-free copper substrates by plasma spraying using inert gases protection. XRD, SEM and EDS were used to identify the phases, morphologies and compositions of the coatings. Vickers micro-hardness and bonding strength of the tungsten coatings were also measured. The results revealed that the hardness distribution of the tungsten coatings was different along the thickness direction. The tungsten coa
APA, Harvard, Vancouver, ISO, and other styles
15

Olagboye, S.A, and S.E Ige. "Synthesis, Characterization and Antimicrobial Properties of Mixed Ligand of Sulphamethoxazole and Trimethoprim and Their Manganese (II) and Copper (II) Complexes." International Journal of Innovative Science and Research Technology 7, no. 2 (2022): 716–21. https://doi.org/10.5281/zenodo.6351083.

Full text
Abstract:
Sulphamethoxazole and trimethoprim mixed ligand and their Mn(II) and Cu(II) metal complexes have been synthesized and characterized. The characterization of metal complexes is based on the results of the solubility, colour, melting points and spectroscopic studies. The UVVisible spectra revealed characteristic wavelength maxima at 600 nm, 700 nm, 750 nm and 800 nm assigned to the d-d electronic transition of the metal complexes. The FTIR results confirmed that the manganese and copper ions coordinated through the nitrogen atom and oxygen atom (S=O) of sulphamethoxazole and through the nitrogen
APA, Harvard, Vancouver, ISO, and other styles
16

NING, HONGLONG, USHENG MA, FUXIANG HUANG, YONGGANG WANG, JIMAN ZHU, and ZHITING GENG. "INVESTIGATION OF THE INTERFACE OF THE DCB SUBSTRATE." Surface Review and Letters 10, no. 01 (2003): 95–99. http://dx.doi.org/10.1142/s0218625x03004640.

Full text
Abstract:
DCB means direct copper bonding and denotes a process in which copper and a ceramic material are directly bonded. Between the temperature of the metal's melting point and the eutectic temperature of the metal-oxygen, DCB depends on the eutectic compound to join the copper and the ceramic. We do some research to investigate the interface between the copper foils and Al2O3 ceramics; it is the key factor in influencing the performance of the DCB substrate. We also discuss how to get good microstructure of the DCB interface.
APA, Harvard, Vancouver, ISO, and other styles
17

Ramazonova, Dilbar, Zokirjon Turayev, Bakhodir Mamurov, et al. "Investigation of the process of extraction of copper from dust of electric filters of oxygen-flare smelting furnace with sulfuric, thermal, and extractive phosphoric acid." IOP Conference Series: Earth and Environmental Science 1281, no. 1 (2023): 012003. http://dx.doi.org/10.1088/1755-1315/1281/1/012003.

Full text
Abstract:
Abstract The results of studies on the extraction of copper from the dust of electrostatic precipitators of oxygen-torch melting with solutions of sulfuric, thermal, extraction phosphoric depending on S:L, concentration and duration of the leaching process are presented. It has been established that the maximum degree of copper extraction is observed when using extractive phosphoric acid, which reaches more than 86%. The optimal parameters for the extraction of copper in extraction phosphoric acid are S:L = 1:10, temperature 90°C and mixing time 25-30 minutes.
APA, Harvard, Vancouver, ISO, and other styles
18

Yao, Wei Zhi, Shu Xiang Song, Zhang Jian Zhou, Wei Wei Cong, and Chang Chun Ge. "Fabrication and Evaluation of Plasma-Sprayed Molybdenum for Plasma Facing Materials." Materials Science Forum 561-565 (October 2007): 1777–80. http://dx.doi.org/10.4028/www.scientific.net/msf.561-565.1777.

Full text
Abstract:
Molybdenum has many prominent properties, such as high melting point, good thermal properties, and low erosion rate and so on, which make it promising candidate materials for plasma facing materials in the next fusion reactor. In this paper, Molybdenum coatings were deposited onto the oxygen-free copper substrates by atmospheric plasma spraying. The spraying parameters had been carefully selected. Different interlayers were induced between the substrate and the coating. SEM and XRD were used to investigate the photographs and compositions of these coatings. The micro-hardness and bonding stren
APA, Harvard, Vancouver, ISO, and other styles
19

Hablovska, N., T. Pavlenko, A. Kloc-Ptaszna, et al. "Synthesis of components for composite material of electrical contacts with unique properties for high-current electrical apparatus with arc-free switching." Physics and Chemistry of Solid State 25, no. 4 (2024): 816–24. https://doi.org/10.15330/pcss.25.4.816-824.

Full text
Abstract:
Experimental research has determined the optimal composition of components for a composite material used in electrical contacts with unique properties designed for high-current electrical apparatus that perform switching without arc formation. This article presents the results of a study on the porosity of copper obtained by the powder metallurgy method. To analyze the porosity of copper, methods for studying porous structures on both the surface and within the sample were examined. The metallographic method and the method of computed tomography were selected as the most suitable and informati
APA, Harvard, Vancouver, ISO, and other styles
20

Araki, Noritoshi, Yasutomo Ichiyama, Ryo Oishi, Teruo Haibara, and Takashi Yamada. "Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-Coated Copper Bonding Wires." Journal of Microelectronics and Electronic Packaging 12, no. 2 (2015): 98–103. http://dx.doi.org/10.4071/imaps.460.

Full text
Abstract:
The free air ball (FAB) formation processes of fine diameter Cu wires were observed, and the effects of process parameters were studied on the basis of high-speed camera observation. It was revealed that the FAB formation process is characterized by preheating before melting, melting that accompanies ball rising, and solidification periods. The relationships between the electronic flame-off (EFO) condition and the FAB formation were summarized for both bare Cu and palladium-coated Cu (PCC) wires. Further study was performed on the changes in FAB shape with different EFO conditions, wire types,
APA, Harvard, Vancouver, ISO, and other styles
21

Araki, Noritoshi, Yasutomo Ichiyama, Ryo Oishi, Teruo Haibara, and Takashi Yamada. "Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-coated Copper Bonding Wires." International Symposium on Microelectronics 2014, no. 1 (2014): 000272–77. http://dx.doi.org/10.4071/isom-tp41.

Full text
Abstract:
The Free Air Ball (FAB) formation processes of fine diameter Cu wires were observed, and the effects of process parameters were studied on the basis of high-speed camera observation. It was revealed that the FAB formation process is characterized by preheating before melting, melting that accompanies ball rising, and solidification periods. The relationships between the electronic flame-off (EFO) condition and the FAB formation were summarized for both bare Cu and palladium-coated Cu wires. Further study was performed on the changes in FAB shape with different EFO conditions, wire types, and F
APA, Harvard, Vancouver, ISO, and other styles
22

Huang, Weijun, Yajing Liu, and Tao Jiang. "Reduction of Copper Smelting Slag by Carbon for Smelting Cu-Fe Alloy." Alloys 3, no. 3 (2024): 164–77. http://dx.doi.org/10.3390/alloys3030010.

Full text
Abstract:
An innovative technology for the direct reduction of copper slag was studied while smelting Cu-Fe alloy by carbon to recover the main valuable elements from the copper smelting slag. The melting temperature of samples first decreased, followed by an increase in Fe3O4 content in slag. The melting temperature reached the minimum temperature of 1157 °C once the Fe3O4 content was about 8 wt%. The recovery rate of copper and iron first increased gradually, followed by a rapid increase in the modifier (CaO). Subsequently, the rise in the recovery rate slowed down. The reduction rate of copper and ir
APA, Harvard, Vancouver, ISO, and other styles
23

Jadhav, Dadbakhsh, Vleugels, et al. "Influence of Carbon Nanoparticle Addition (and Impurities) on Selective Laser Melting of Pure Copper." Materials 12, no. 15 (2019): 2469. http://dx.doi.org/10.3390/ma12152469.

Full text
Abstract:
The addition of 0.1 wt % carbon nanoparticles significantly improved the optical absorption and flowability of gas-atomized copper powder. This facilitated selective laser melting (SLM) by reducing the required laser energy density to obtain 98% dense parts. Moreover, the carbon addition led to an in situ de-oxidation of the copper parts during the SLM process. The properties of the as-built copper parts were limited to a tensile strength of 125 MPa, a ductility of 3%, and an electrical conductivity of 22.7 × 106 S/m, despite the advantageous effect of carbon on the powder characteristics and
APA, Harvard, Vancouver, ISO, and other styles
24

Kang, Jeong-Won, and Ho-Jung Hwang. "Molecular Dynamics Simulations on Melting Properties of Free Icosahedral Copper Clusters." Transactions on Electrical and Electronic Materials 4, no. 1 (2003): 1–6. http://dx.doi.org/10.4313/teem.2003.4.1.001.

Full text
APA, Harvard, Vancouver, ISO, and other styles
25

Yastrebinsky, R. N., V. I. Pavlenko, A. I. Gorodov, A. A. Karnauhov, N. I. Cherkashina, and A. V. Yastrebinskay. "Effect of electrochemical modification of titanium hydride fraction on oxygen content in surface and deep layers." Materials Research Express 9, no. 1 (2022): 016401. http://dx.doi.org/10.1088/2053-1591/ac45bd.

Full text
Abstract:
Abstract The paper presents a study of the microstructure and oxygen concentration in the surface and deep layers of fractions of unmodified titanium hydride and titanium hydride modified by electrodeposited layers of Ti and Cu at temperatures of 300 °C–900 °C. The composition of the oxide layer and the concentration of titanium and oxygen atoms are estimated. It is shown that an increase in the thickness and compaction of the oxide layer with increasing temperature prevents the penetration of oxygen into the deep layers of the unmodified fraction of titanium hydride. Modification of titanium
APA, Harvard, Vancouver, ISO, and other styles
26

Liu, Xuan, and Ping Feng. "Picosecond Pulsed Laser Induced Melting of Monocrystalline Copper: A Hybrid Simulation." Advanced Materials Research 97-101 (March 2010): 3807–10. http://dx.doi.org/10.4028/www.scientific.net/amr.97-101.3807.

Full text
Abstract:
A hybrid method combing molecular dynamics and two-step radiation heating model is used to study the kinetics and microscopic mechanisms of picosecond laser melting of monocrystalline copper in stress confinement regime. The nonequilibrium processes of laser melting are simulated by classical MD method, and laser excitation as well as subsequent relaxation of the conduction band electrons are described continually by two-step radiation heating model. The mechanism responsible for melting of copper under picosecond laser pulse irradiation can be attributed to homogeneous nucleation of the liqui
APA, Harvard, Vancouver, ISO, and other styles
27

Alekseev, A. V., T. N. Pahomkina, and Yu V. Lapshina. "DETERMINATION OF SULFUR, CARBON, NITROGEN AND OXYGEN IN COPPER BASED ALLOYS." Proceedings of VIAM, no. 11 (2021): 112–19. http://dx.doi.org/10.18577/2307-6046-2021-0-11-112-119.

Full text
Abstract:
The determination of gas-forming impurities in samples of low-alloyed copper alloys of the Cu–Cr and Cu–Cr–Zr systems is carried out. The content of sulfur and carbon was determined by the method of combustion in an induction furnace of a gas analyzer with subsequent detection in the infrared cell of the spectrometer, and to determine oxygen and nitrogen, the method of reducing melting in a flow of an inert carrier gas was used, followed by the detection of oxygen in the infrared cell and nitrogen in the conductometric cell of the gas analyzer.
APA, Harvard, Vancouver, ISO, and other styles
28

Camurri, Carlos, Claudia Carrasco, Antonio Pagliero, and Rodrigo Leite. "Influence of the Impurities on Cathodic Copper on the Ductility of Copper Wires." Materials Science Forum 706-709 (January 2012): 899–906. http://dx.doi.org/10.4028/www.scientific.net/msf.706-709.899.

Full text
Abstract:
The main characteristic of cathodic copper is the concentration of impurities because it depends on mechanical characteristics, i.e. ductility, of the derived copper wires. The standard mechanical tests that evaluate their ductility, are quick elongation and spiral elongation tests. The results of these essais shown that there is not a clear correlation among the impurities content in cathodes and wire ductility. Also, the two mechanical tests actually used are not able to discriminate differences on the copper ductility associated to variations in impurities concentration, at ppm level. In th
APA, Harvard, Vancouver, ISO, and other styles
29

Shrestha, Sabita, and Sudha Maharjan. "Synthesis and Characterization of Copper Complex of Salicylaldehyde Benzoyl Hydrazone." Journal of Nepal Chemical Society 29 (December 3, 2013): 11–17. http://dx.doi.org/10.3126/jncs.v29i0.9231.

Full text
Abstract:
Copper complex of type [Cu(SBH)2] was synthesized and characterized by different analytical procedure and spectral studies. The complex was insoluble in common organic solvents and it has melting point in between 254-258°C. Infrared spectrum showed the bonding through enolic oxygen and azomethine nitrogen. The electronic spectral studies showed that the Cu(II) is in tetrahedral coordination environment. DOI: http://dx.doi.org/10.3126/jncs.v29i0.9231Journal of Nepal Chemical SocietyVol. 29, 2012Page: 11-17Uploaded date : 12/3/2013
APA, Harvard, Vancouver, ISO, and other styles
30

Prasad, V. V. Satya, V. Ramakrishna Rao, U. Prakash, P. Krishna Rao, and K. M. Gupt. "Electro Slag Crucible Melting for Recycling of Low Oxygen High Conductivity Copper Scrap." ISIJ International 36, no. 9 (1996): 1113–18. http://dx.doi.org/10.2355/isijinternational.36.1113.

Full text
APA, Harvard, Vancouver, ISO, and other styles
31

Majidian, Hudsa, Leila Nikzad, Sheida Hamzavi Taleghani, Mohammad Farvizi, Mansour Razavi, and Arash Faraji. "Alternative Industrial Chrome-Free Alumina-Based Bricks for Copper Alloy Melting Furnaces." Materials Performance and Characterization 12, no. 1 (2023): 20230045. http://dx.doi.org/10.1520/mpc20230045.

Full text
APA, Harvard, Vancouver, ISO, and other styles
32

Artis, Rylan, Clifford W. Padgett, Kennedy Musso, Nathaniel Shank, Allison Marks та Brandon Quillian. "A (2-(Pyrrolidin-1-yl)ethan-1-olate)(1-oxo-3-phenyl-1,4-dihydronaphthalen-2-olate) μ-Oxo-Bridged Dicopper(II) Dimeric Complex". Molbank 2024, № 3 (2024): M1846. http://dx.doi.org/10.3390/m1846.

Full text
Abstract:
The reaction of 2-(1H-pyrrol-1-yl)ethanol with 3-hydroxyflavone in the presence of copper(II) bromide yielded a dimeric copper(II) complex, [μ-O-(κ2-O,O-flav)(κ2-N,O-2PEO)Cu]2 (1) (flav = 3-hydroxyflavonolate; 2PEO = 2-(1H-pyrrol-1-yl)ethanolate) with both the flav and 2PEO ligands bound to the copper(II) atom in a κ2-bonding mode. The dimer is held electrostatically by bridging oxygen atoms between two copper atoms. Complex 1 was characterized by single-crystal X-ray diffraction, infrared, and UV-Vis spectroscopy, elemental analysis, and melting point determination. The complex crystallizes i
APA, Harvard, Vancouver, ISO, and other styles
33

Yao, Wei Zhi, Shu Xiang Song, Zhang Jian Zhou, Wei Wei Cong, Y. Ma, and C. C. Ge. "Study on the Plasma-Sprayed Molybdenum as Plasma Facing Materials in Fusion Reactor." Key Engineering Materials 373-374 (March 2008): 81–84. http://dx.doi.org/10.4028/www.scientific.net/kem.373-374.81.

Full text
Abstract:
Molybdenum has many prominent properties, such as high melting point, good thermal properties, low erosion rate and so on, which make it promising candidate materials for plasma facing materials in the next fusion reactor. In the present work, molybdenum coatings were deposited onto the oxygen-free copper substrates by atmospheric plasma spraying. Different interlayers were introduced between the coatings and substrates. SEM, EDS and XRD were used to investigate the photographs and compositions of these coatings. The bonding strength of the coatings was tested to investigate the effect of inte
APA, Harvard, Vancouver, ISO, and other styles
34

Kalyniuk, M. M., Ya P. Gritskiv, and L. M. Kahitanchuk. "Eloboration of Methods for Determination on Content of the Oxygen, Nitrogen, Hydrogen Admixtures in Titanium Aluminides." Metrology and instruments, no. 2 (May 21, 2020): 61–67. http://dx.doi.org/10.33955/2307-2180(2)2020.61-67.

Full text
Abstract:
Titanium intermetalides (TiAl and Ti3 Al) and alloys on theirs bases applies in air — and spacetechnology and automobile industry.
 Physical and mechanical properties there alloys is better, then at classical Ti — or Ni — alloys, that are utilized in aeroplanes and rocets.
 Alloys, based on TiAl and Ti3Al, are made with utilization vacuum — arc, plasma — arc, induction- garnisage, magnetoperating electroslag melting, electron — beam melting with intermediate capacity, electroslag melting in inert atmosphere under «active» fluxes with metallic calcium, induction melting in muchsection
APA, Harvard, Vancouver, ISO, and other styles
35

Zhao, Luo, Daofei Zhu, Dafang Liu, Huitao Wang, Zhangming Xiong, and Lei Jiang. "Prediction and Optimization of Matte Grade in ISA Furnace Based on GA-BP Neural Network." Applied Sciences 13, no. 7 (2023): 4246. http://dx.doi.org/10.3390/app13074246.

Full text
Abstract:
The control of matte grade determines the production cost of the copper smelting process. In this paper, an optimal matte-grade control model is established to derive the optimal matte grade with the objective of minimizing the cost in the whole process of copper smelting. This paper also uses the prediction capability of the BP (Backpropagation) neural network to establish a BP neural network prediction model for the matte grade, considering various factors affecting matte grade (including the input copper concentrate amount and its composition content, air drumming amount, oxygen drumming am
APA, Harvard, Vancouver, ISO, and other styles
36

Mookam, Niwat, Prajak Jattakul, and Kannachai Kanlayasiri. "Effects of Ni Content on Melting Behaviors and Wettability of SnBiAgNi Lead-Free Solder." Materials Science Forum 1074 (November 8, 2022): 119–23. http://dx.doi.org/10.4028/p-zcw87p.

Full text
Abstract:
This research aimed to study the effects of Ni content on melting behaviors and wettability of SnBiAgNi lead-free solder. Sn-58Bi-0.05Ag was used as the base solder, and Ni was then put in by 0.05, 0.10, 0.50 or 1.00 wt%. Solidus and liquidus temperatures of the solder alloys were examined to study melting behaviors. The Ni content changed the solidus and liquidus temperatures, and Sn-58Bi-0.05Ag-0.10Ni possessed the lowest solidus and liquidus temperatures. Sn-58Bi-0.05Ag-0.10Ni also provided the narrowest pasty range. Wettability of the solders on the copper substrate was expressed in terms
APA, Harvard, Vancouver, ISO, and other styles
37

Nassau, K., A. E. Miller, E. M. Gyorgy, and T. Siegrist. "Rapidly quenched Bi-containing high Tc superconducting oxide compositions." Journal of Materials Research 4, no. 6 (1989): 1330–38. http://dx.doi.org/10.1557/jmr.1989.1330.

Full text
Abstract:
Twin roller quenching from the melt at cooling rates of ∼107 K s−1 was used on several Bi-containing high Tc compositions. Pure glass was obtained in most compositions and the route of crystallization was studied by differential thermal and thermogravimetric analysis, x-ray diffraction, and magnetic measurements. Heating of the glasses produced poorly crystallized short-range-order-only as determined by x-ray diffraction, despite passing through several exotherms, some of which were very strong. This anomalous behavior deserves further investigation. On heating to higher temperatures the expec
APA, Harvard, Vancouver, ISO, and other styles
38

Guschlbauer, Ralf, Alex K. Burkhardt, Zongwen Fu, and Carolin Körner. "Effect of the oxygen content of pure copper powder on selective electron beam melting." Materials Science and Engineering: A 779 (March 2020): 139106. http://dx.doi.org/10.1016/j.msea.2020.139106.

Full text
APA, Harvard, Vancouver, ISO, and other styles
39

Ilyushenko, V. M., T. B. Maidanchuk, A. N. Bondarenko, E. P. Lukianchenko, T. E. Udartseva, and D. I. Andreichuk. "Restoration Of End Part Of Copper Gas-oxygen Chambers Of Arc Steel-melting Furnaces." Sovremennaâ èlektrometallurgiâ 2019, no. 4 (2019): 38–43. http://dx.doi.org/10.15407/sem2019.04.06.

Full text
APA, Harvard, Vancouver, ISO, and other styles
40

Evidente, Ralph Carlo T., Marc Jazer F. Esguerra, Danielle Jaye S. Agron, Louise Grace S. Avena, and Michelle C. Almendrala. "Thermodynamic Metallurgical Analyses of a Sustainable Copper Production in Philippines." IOP Conference Series: Earth and Environmental Science 1395, no. 1 (2024): 012022. http://dx.doi.org/10.1088/1755-1315/1395/1/012022.

Full text
Abstract:
Abstract This paper provides the thermodynamic metallurgical analyses for the copper production of the Philippine Associated Smelting and Refining (PASAR). Unlike the traditional processes, PASAR limits the amount of waste vaporization through utilizing sustainable mining. This involves the waste from manufacturing the by-products were further treated to reduce the impact of the plant operation to the environment. Additionally, the paper discusses in detail the processes used in the manufacture of the PASAR refinery’s main product – copper cathodes. The pyrometallurgical treatment of the conce
APA, Harvard, Vancouver, ISO, and other styles
41

Netskina, Olga V., Svetlana A. Mukha, Kirill A. Dmitruk, et al. "Solvent-Free Method for Nanoparticles Synthesis by Solid-State Combustion Using Tetra(Imidazole)Copper(II) Nitrate." Inorganics 10, no. 2 (2022): 15. http://dx.doi.org/10.3390/inorganics10020015.

Full text
Abstract:
The development of solvent-free techniques for nanoparticles synthesis is one of the challenges of Green chemistry. In this work, the principled opportunity to obtain copper-containing nanosized particles without use of any solvents was shown. The copper complexes were prepared as precursors by the melting-assisted solvent-free synthesis. The formation of tetra(imidazole)copper(II) nitrate complex was confirmed by XRD, elemental analysis, FTIR spectroscopy, and thermal analysis. It was noted that their thermal decomposition occurs in two stages: (I) the low-temperature step may be related to r
APA, Harvard, Vancouver, ISO, and other styles
42

Vintaikin, B. Е., A. E. Smirnov, S. Yu Shevchenko, A. A. Drenin, and V. I. Sheykina. "Phase Composition and Structure of the BrX Chromium Bronze Powder." Herald of the Bauman Moscow State Technical University. Series Natural Sciences, no. 1 (106) (February 2023): 82–94. http://dx.doi.org/10.18698/1812-3368-2023-1-82-94.

Full text
Abstract:
Methods of the X-ray phase analysis, as well as optical and scanning electron microscopy supplemented by construction of the distribution maps for such chemical elements as oxygen and copper demonstrated presence in the structure of the PR-BrX brand powder made of bronze with the FСС lattice of oxygen-containing phases, i.e., copper oxides (CuO, Cu2O) located along the grain boundaries and on the powder particle surface. Using these methods demonstrated that annealing in the ammonia at a temperature of 450 °C promoted reduction of the oxide phases to the single-phase structure of the initial s
APA, Harvard, Vancouver, ISO, and other styles
43

Wang, Dawei, Jinyao Tang, and Yuxia Song. "Effective Removal of Arsenic from Copper Matte by Sodium Carbonate." Metals 14, no. 9 (2024): 1078. http://dx.doi.org/10.3390/met14091078.

Full text
Abstract:
Residual arsenic in copper matte is a source of arsenic contamination in subsequent processes in the smelting section of copper pyrometallurgy. In order to solve the impact of arsenic in copper matte on the subsequent process of smelting, this study removes arsenic from copper matte by adding an arsenic removal agent to the molten copper matte. The results show that the most difficult arsenic phase in copper matte is the residual arsenic in copper-arsenic alloys, based on which sodium carbonate was selected as the arsenic removal agent. The arsenic content in the copper matte was reduced by 98
APA, Harvard, Vancouver, ISO, and other styles
44

Vutova, Katia, Vladislava Stefanova, Vania Vassileva, and Milen Kadiyski. "Behaviour of Impurities during Electron Beam Melting of Copper Technogenic Material." Materials 15, no. 3 (2022): 936. http://dx.doi.org/10.3390/ma15030936.

Full text
Abstract:
The current study presents the electron beam melting (EBM) efficiency of copper technogenic material with high impurity content (Se, Te, Pb, Bi, Sn, As, Sb, Zn, Ni, Ag, etc.) by means of thermodynamic analysis and experimental tests. On the basis of the calculated values of Gibbs free energy and the physical state of the impurity (liquid and gaseous), a thermodynamic assessment of the possible chemical interactions occurring in the Cu-Cu2O-Mex system in vacuum in the temperature range 1460–1800 K was made. The impact of the kinetic parameters (temperature and refining time) on the behaviour an
APA, Harvard, Vancouver, ISO, and other styles
45

KANIGEL, AMIT, JOAN ADLER, and EMIL POLTURAK. "INFLUENCE OF POINT DEFECTS ON THE SHEAR ELASTIC COEFFICIENTS AND ON THE MELTING TEMPERATURE OF COPPER." International Journal of Modern Physics C 12, no. 05 (2001): 727–37. http://dx.doi.org/10.1142/s0129183101001900.

Full text
Abstract:
We present molecular dynamics simulations of the influence of point defects on the shear elastic properties of copper. We find that vacancies do not influence these properties at all, while the introduction of interstitials causes a large reduction of the elastic coefficients. The simulations establish a phase diagram of the melting temperature as a function of the density of interstitials. A crystal having no free surface undergoes bulk mechanical melting as a result of the vanishing of C′ ≡ (C11 - C12)/2 once the specific volume reaches a critical value, equal to the experimental volume of l
APA, Harvard, Vancouver, ISO, and other styles
46

Wong, Wei Yee, Rabiatul Adawiyah Shamsudin, Muhammad Firdaus Mohd Nazeri, and Mohamad Najmi Masri. "The Preliminary Study of the Addition Zinc in Tin-Copper Lead Free Solder." Materials Science Forum 1010 (September 2020): 104–8. http://dx.doi.org/10.4028/www.scientific.net/msf.1010.104.

Full text
Abstract:
Sn-0.7Cu lead free solder has become an alternative material to replace Sn-Pb solder. However, it has the weakness of high melting point and poor corrosion behavior. Through the study, Sn-0.7-xZn microstructure and phase changes were studied through scanning electron microscope (SEM) and X-ray diffraction (XRD). SEM result shows microstructure Cu6Sn5 is precipitated with rod like shape while CuZn is shown in bump oval shape whereas compounds that presented are Cu6Sn5 and Cu5Zn8 as shown in the XRD analysis result.
APA, Harvard, Vancouver, ISO, and other styles
47

Liu, J., and J. M. Cowley. "SREM imaging of copper (110) vicinal surfaces." Proceedings, annual meeting, Electron Microscopy Society of America 47 (August 6, 1989): 542–43. http://dx.doi.org/10.1017/s0424820100154688.

Full text
Abstract:
Scanning reflection electron imaging technique is sensitive to surface perturbations at nano-meter scale. Single atom high steps and defects on crystal surfaces can be observed with high contrast. Microanalysis of surface areas can be performed to study surface reaction problems. One advantage of SREM over conventional REM imaging is that by changing the objective lens current synchronously with the frame speed one can manage to keep more of the scanned areas in focus. This dynamic focusing is important for observing less flat surfaces such as the vicinal surface areas. We take this advantage
APA, Harvard, Vancouver, ISO, and other styles
48

Koshel, Oleksandr. "EXAMINATION OF COUNTERFEIT CONDUCTORS WITH SIGNS OF A SHORT CIRCUIT." Criminalistics and Forensics, no. 67 (August 9, 2022): 410–16. http://dx.doi.org/10.33994/kndise.2022.67.41.

Full text
Abstract:
The article reviews an expert study of conductors with melting due to a short circuit from the places of fires. Given the urgency of the problem of low-quality conductors on sale, the issue of studying such objects is considered. The use of counterfeit cable and wire products leads to fires, resulting in both material losses and deaths, while the number of fires caused by low-quality products is increasing. For the most used copper wires, the electrical properties are determined by the presence of impurities, some of which have a significant effect on electrical resistance. The technical stand
APA, Harvard, Vancouver, ISO, and other styles
49

Aamir, Muhammad, Riaz Muhammad, Majid Tolouei-Rad, Khaled Giasin, and Vadim V. Silberschmidt. "A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics." Soldering & Surface Mount Technology 32, no. 2 (2019): 115–26. http://dx.doi.org/10.1108/ssmt-11-2018-0046.

Full text
Abstract:
Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstruc
APA, Harvard, Vancouver, ISO, and other styles
50

Haruna, A., Rumah, M.M., Sani, U., and Ibrahim, A.K. "Synthesis, Characterization and corrosion Inhibition Studies on Mn (II) and Co (II) Complexes Derived from 1-{(Z)-[(2-hydroxyphenyl) imino]methyl}naphthalen-2-ol in 1M HCl Solution." International Journal of Biological, Physical and Chemical Studies 3, no. 1 (2021): 09–18. http://dx.doi.org/10.32996/ijbpcs.2021.3.1.2.

Full text
Abstract:
Schiff base derived from the reaction of 2-amino phenol and 2-hydroxy-1-naphthaldehyde and its Co (II), and Mn (II) complexes have been synthesized and characterized by solubility test, melting point/ decomposition temperatures, molar conductance, IR and magnetic susceptibility. The number of ligands coordinated to the metal ion was determined using Job’s method of continuous variation. Their molar conductance values indicate that all the complexes are non-electrolytes. Magnetic moment values of the complexes showed that both Mn (II) and Co (II) are paramagnetic. The spectroscopic data of meta
APA, Harvard, Vancouver, ISO, and other styles
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!