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Dissertations / Theses on the topic 'MEMS Pressure Sensors'

Author: Grafiati

Published: 4 June 2021

Last updated: 6 September 2023

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1

Anderås, Emil. "Advanced MEMS Pressure Sensors Operating in Fluids." Doctoral thesis, Uppsala universitet, Fasta tillståndets elektronik, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-173182.

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Today’s MEMS technology allows manufacturing of miniaturized, low power sensors that sometimes exceeds the performance of conventional sensors. The pressure sensor market today is dominated by MEMS pressure sensors. In this thesis two different pressure sensor techniques are studied. The first concerns ways to improve the sensitivity in the most commonly occurring pressure sensor, namely such based on the piezoresistive technique. Since the giant piezoresistive effect was observed in silicon nanowires, it was assumed that a similar effect could be expected in nano-thin silicon films. However,

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2

Wang, Jun. "Packing design of MEMS pressure, temperature and other sensors." Mémoire, École de technologie supérieure, 2008. http://espace.etsmtl.ca/623/1/WANG_Jun.pdf.

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Dans certaines recherches précédentes, la fabrication des capteurs de pression se basait sur les puces MEMS à base de SiC (Silicon Carbide). Cependant, des chercheurs de l'Université Concordia ont démontré récemment que SiCN (Silicon Carbide Nitride) avait un avantage plus important par rapport au Si (Silicon) ou SiC à haute température. Il serait donc un matériel potentiel dans un environnement hostile. Dans ce mémoire, un bref historique sur les capteurs MEMS à haute température sera introduit. Certaines questions dont le choix du matériel, la fabrication, l'empaquetage, et l'applicati

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3

Abeysinghe, Don Chandana. "Novel MEMS Pressure and Temperature Sensors Fabricated on Optical Fibers." University of Cincinnati / OhioLINK, 2001. http://rave.ohiolink.edu/etdc/view?acc_num=ucin997987327.

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4

Jin, Sheng. "Silicon carbide pressure sensors for high temperature applications." Case Western Reserve University School of Graduate Studies / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=case1296096110.

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5

Olszacki, Michal. "Modelling and optimization of piezoresistive pressure sensors." Toulouse, INSA, 2009. http://eprint.insa-toulouse.fr/archive/00000297/.

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Depuis 1954, où l’effet piézorésistif a été découvert dans Silicium, la démarche pour mesurer la pression a changé et de nouveaux dispositifs avec des performances remarquables sont apparus sur le marché. Grâce au développement des microtechnologies, une nouvelle famille de capteurs de pression piézorésistifs miniatures s’est ainsi progressivement imposée pour de nombreuses applications. Même si le principe de fonctionnement des capteurs de pression piézorésistif en silicium reste le même depuis de nombreuses années, l’optimisation des capteurs pour une application donnée reste toujours une ét

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6

Chen, Li. "SILICON CARBIDE PRESSURE SENSORS AND INFRA-RED EMITTERS." Case Western Reserve University School of Graduate Studies / OhioLINK, 2008. http://rave.ohiolink.edu/etdc/view?acc_num=case1195161915.

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7

Rashidi, Mohammadi Abdolreza. "MEMS pressure, temperature and conductivity sensors for high temperature and harsh environments." Thesis, University of British Columbia, 2011. http://hdl.handle.net/2429/33783.

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Kraft pulp digesters have been used to convert wood chips into pulp for manufacturing a wide variety of paper products. Inside a kraft digester, chemical reactions remove lignin from their wood matrix in a caustic environment (pH~13.5, 170°C, 2MPa). Data on actual internal operating conditions in a kraft digester is needed to optimize kraft digester operation and obtain maximum production quality. Currently, this information is limited to selected static locations on the periphery of the digester. The objective of this thesis is to develop miniature temperature, pressure, and liquid conductivi

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8

Johari, Houri. "Development of MEMS Sensors for Measurements of Pressure, Relative Humidity, and Temperature." Digital WPI, 2003. https://digitalcommons.wpi.edu/etd-theses/815.

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Continued demands for better control of the operating conditions of structures and processes have led to the need for better means of measuring temperature (T), pressure (P), and relative humidity (RH). One way to satisfy this need is to use MEMS technology to develop a sensor that will contain, in a single package, capabilities to simultaneously measure T, P, and RH of its environment. Because of the advantages of MEMS technology, which include small size, low power, very high precision, and low cost, it was selected for use in this thesis. Although MEMS sensors that individually measure T

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9

Fonseca, Michael Agapito. "Polymer/Ceramic Wireless MEMS Pressure Sensors for Harsh Environments: High Temperature and Biomedical Applications." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/19789.

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Thesis (Ph.D)--Electrical and Computer Engineering, Georgia Institute of Technology, 2008.<br>Committee Chair: Dr. Mark G. Allen; Committee Co-Chair: Dr. Oliver Brand; Committee Member: Dr. Andrew Peterson; Committee Member: Dr. Elliot Chaikof; Committee Member: Dr. Gregory Durgin; Committee Member: Dr. Robert Butera.

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10

Massarotti, Giorgio, Cristian Ferrari, Esteban Codina Macia, and Massimiliano Ruggeri. "Mems sensors in hydraulics, an opportunity to create smart components." Technische Universität Dresden, 2020. https://tud.qucosa.de/id/qucosa%3A71238.

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Modern electronic technologies allow for the design and production of Micro Electro-Mechanical Systems, also called MEMS. These microchips are widely used as sensors in many fields of application, also in embedded systems in heavy-duty and agricultural vehicles and in automotive applications. In addition to the classic uses of these sensors, new architectures and sensor topologies exploit electromechanical principles of great interest for the field of hydraulic applications. This paper presents some examples of the application of a new MEMS architecture based on self-oscillating microresonator

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11

Samoei, Victor K. "Fabrication and Characterization of Thin film Pressure Sensors using Novel Materials." University of Toledo / OhioLINK, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1596762165322848.

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12

Li, Weizhuo. "Wavelength Multiplexing of MEMS Pressure and Temperature Sensors Using Fiber Bragg Gratings and Arrayed Waveguide Gratings." University of Cincinnati / OhioLINK, 2005. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1123972586.

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13

Walk, Christian [Verfasser], and Holger [Akademischer Betreuer] Vogt. "Development of a MEMS Technology for the Monolithic Post-CMOS Integration of Capacitive Pressure Sensors / Christian Walk ; Betreuer: Holger Vogt." Duisburg, 2019. http://d-nb.info/1191691349/34.

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14

Krondorfer, Rudolf H. "On Packaging of MEMS. Simulation of Transfer Moulding and Packaging Stress and their Effect on a Family of piezo-resistive Pressure Sensors." Doctoral thesis, Norwegian University of Science and Technology, Department of Engineering Design and Materials, 2004. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-177.

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<p>Micro Electro Mechanical Systems (MEMS) produced to date include IR detectors, accelerometers, pressure sensors, micro lenses, actuators, chemical sensors, gear drives, RF devices, optical processor chips, micro robots and devices for biomedical analysis. The track for tomorrow has already been set and products like 3D TV, physician on a chip, lab on a chip, micro aircraft and food safety sensors will be developed when the technology matures and the market is ready.</p><p>Todays MEMS fabrication is typically based around a silicon substrate and borrow batch fabrication processes from the IC

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15

Luo, Mengdi. "Materials and microfabrication approaches for completely biodegradable wireless micromachined sensors." Diss., Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/53093.

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Implantable sensors have been extensively investigated to facilitate diagnosis or to provide a means to generated closed loop control of therapy by yielding in vivo measurements of physical and chemical signals. Biodegradable sensors which degrade gradually after they are no longer functionally needed exhibit great potential in acute or shorter-term medical diagnostic and sensing applications due to the advantages of (a) exclusion of the need to a secondary surgery for sensor removal, and (b) reduction of the risk of long-term infection. The objective of this research is to design and characte

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16

Ibrahim, Amr. "Remotely interrogated MEMS pressure sensor." Thesis, University of Glasgow, 2012. http://theses.gla.ac.uk/4149/.

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This thesis considers the design and implementation of passive wireless microwave readable pressure sensors on a single chip. Two novel-all passive devices are considered for wireless pressure operation. The first device consists of a tuned circuit operating at 10 GHz fabricated on SiO2 membrane, supported on a silicon wafer. A pressure difference across the membrane causes it to deflect so that a passive resonant circuit detunes. The circuit is remotely interrogated to read off the sensor data. The chip area is 20 mm2 and the membrane area is 2mm2 with thickness of 4 µm. Two on chip passive r

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17

Tan, T. H. "Silicon piezoresistors for MEMS pressure sensor applications." Thesis, Queen's University Belfast, 2014. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.677842.

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Silicon based micromachining technology enables the realization of high performance micro electromechanical systems (MEMS) including a range of physical and environmental sensors. Pressure sensors are used for a wide range of monitoring and control applications, e.g. environmental, industrial, aircraft, automotive. Monitoring of vehicle tyre pressures offers benefits such as improved safety, fuel economy, and tyre life. Micromachined pressure sensors are used at present, but require further research to improve their performance in terms of size, power consumption and manufacturing cost. This t

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18

Rathore, Pradeep Kumar. "Cmos compatible mems structures for pressure sensing applications." Thesis, IIT Delhi, 2015. http://localhost:8080/iit/handle/2074/6894.

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19

Chen, Xiaopei. "Fiber Optic Pressure Sensor Fabrication Using MEMS Technology." Thesis, Virginia Tech, 2003. http://hdl.handle.net/10919/32744.

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A technology for fabricating fiber optic pressure sensors is described. This technology is based on intermediate-layer bonding of a fused silica ferrule to a patterned, micro-machined fused silica diaphragm, providing low temperature fabrication of optical pressure sensor heads that can operate at high temperature. Fused silica ferrules and fused silica diaphragms are chosen to reduce the temperature dependence. The fused silica diaphragms have been micro-machined using wet chemical etching in order to form extrinsic Fabry-Perot (FP) interferometric cavities. Sol-gel is used as an inter

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20

De, Clerck Albrey Paul. "Modeling the Thermal Performance of an Intelligent MEMS Pressure Sensor with Self-Calibration Capabilities." Thesis, Virginia Tech, 2020. http://hdl.handle.net/10919/100688.

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Recent industry trends toward more complex and interconnected systems have increased the demand for more reliable pressure sensors. One of the best methods to ensure reliability is by regularly calibrating the sensor, checking its functionality and accuracy. By integrating a micro-actuator with a pressure sensor, the sensor can self-calibrate, eliminating the complexities and costs associated with traditional sensor calibration methods. The present work is focused on furthering understanding and improving the thermal performance of a thermopneumatic actuated self-calibrating pressure sensor.

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21

Ozgeneci, Ercin Mehmet. "Mems Sensor Based Underwater Ahrs(attitude And Heading Reference System) Aided By Compass And Pressure Sensor." Master's thesis, METU, 2012. http://etd.lib.metu.edu.tr/upload/12614619/index.pdf.

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Attitude and Heading angles are crucial parameters for navigation. Conventional navigation methods mostly uses IMU and GPS devices to calculate these angles. MEMS technology offers small sized, low cost IMU sensors with moderate performance. However, GPS cannot be used in underwater. Therefore, different aiding sensors are used in underwater vehicles in order to increase the accuracy. As the accuracy of devices increases, the cost of these devices also increases. In this thesis, rather than using GPS and high quality IMU sensors, low cost MEMS IMU sensor is used together with a magnetometer an

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22

Kinnell, Peter Ken. "The development of selective strain coupling structures for a novel MEMS resonant pressure sensor." Thesis, University of Birmingham, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.422766.

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This thesis proposes a novel form of MEMS (micro electro mechanical system) resonant pressure sensor. The sensor incorporates a MEMS silicon resonator that is coupled to a macro scale metallic diaphragm. The combination of a large metallic diaphragm with a micro engineered MEMS resonator required an innovative selective strain coupling structure to be designed. Without the proposed coupling structure, unwanted packaging or thermally induced strain would severely degrade sensor performance, resulting in resonator misalignment, or unwanted strain loading. The feasibility of the proposed device i

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23

Black, Richard Allyn. "A flush mounted microelectromechanical system (MEMS) pressure and flow sensor based air data system /." Thesis, Connect to this title online; UW restricted, 1999. http://hdl.handle.net/1773/10012.

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24

SARAN, ANISH. "MEMS BASED FABRY PEROT PRESSURE SENSOR AND NON-ADHESIVE INTEGRATION ON OPTICAL FIBER BY ANODIC BONDING." University of Cincinnati / OhioLINK, 2004. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1084719088.

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25

Aravamudhan, Shyam. "Development of micro/nanosensor elements and packaging techniques for oceanography." [Tampa, Fla.] : University of South Florida, 2007. http://purl.fcla.edu/usf/dc/et/SFE0002219.

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26

Wu, Zhizhen. "Flexible Microsensors based on polysilicon thin film for Monitoring Traumatic Brain Injury (TBI)." University of Cincinnati / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1512045589967871.

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27

Hou, Stephen Ming-Chang 1981. "Design and fabrication of a MEMS-array pressure sensor system for passive underwater navigation inspired by the lateral line." Thesis, Massachusetts Institute of Technology, 2012. http://hdl.handle.net/1721.1/75454.

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Thesis (Elec. E.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2012.<br>This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.<br>Cataloged from student-submitted PDF version of thesis.<br>Includes bibliographical references (p. 233-241).<br>An object within a fluid flow generates local pressure variations that are unique and characteristic to the object's shape and size. For example, a three-dimensional object or a wall-like obstacle obstructs flow and c

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28

Pekárek, Jan. "Výzkum a vývoj moderních emisních senzorů typu MEMS." Doctoral thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2014. http://www.nusl.cz/ntk/nusl-233623.

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The dissertation thesis is focused on research and development of modern emission MEMS sensors. The emission sensor based on the field emission from nanostructured materials represents innovative approach to pressure sensing. The nanostructures serve as electron emitter in an electric field between the cathode and anode in the pressure sensor. This electric field is constant and the change in ambient pressure causes the change of distance between electrodes, thereby the electric field is increasing. This intensity is proportional to the emission from the cathode made of nanostructured material

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29

Pekárek, Jan. "Katodové nanostruktury v MEMS aplikacích." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2008. http://www.nusl.cz/ntk/nusl-217244.

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The main goal of this work is to introduce new carbon structures - carbon nanotubes. The main objective of this work is to take advantage of the unique characteristic of carbon nanotubes to emit electrons at very low supply voltage.

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30

Jeedigunta, Sathyaharish. "Growth and characterization of nanocrystalline diamond films for microelectronics and microelectromechanical systems." [Tampa, Fla] : University of South Florida, 2008. http://purl.fcla.edu/usf/dc/et/SFE0002532.

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31

Khaji, Zahra. "Extending Microsystems to Very High Temperatures and Chemically Harsh Environments." Doctoral thesis, Uppsala universitet, Mikrosystemteknik, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-302658.

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Aiming at applications in space exploration as well as for monitoring natural hazards, this thesis focuses on understanding and overcoming the challenges of extending the applicability of microsystems to temperatures above 600°C as well as chemically harsh environments. Alumina and zirconia high-temperature co-fired ceramics (HTCC) with platinum as the conductor material, have in this thesis, been used to manufacture a wide range of high-temperature tolerant miniaturized sensors and actuators, including pressure and flow sensors, valves, a combustor, and liquid monopropellant microthrusters. I

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32

Chan, Wei Huang, and 黃春偉. "MEMS－Based Pressure Sensors." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/48032316203546398843.

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碩士<br>大葉大學<br>機械與自動化工程學系<br>97<br>This study presents a novel fabrication process for a micro pressure sensor. The presented micro sensor not only has a smaller volume than a traditional sensor, but also can make more accurate measurement and higher sensitivity due to the miniaturized dimension. In this study, MEMS techniques are used to deposit a silicon nitride layer on a silicon wafer to create a piezoresistive structure. A platinum layer is deposited on the silicon nitride layer to form resistors and the structure is then etched to form a member. And the backside of chip is bonded with a m

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33

Ke, Cheng-Han, and 柯呈翰. "Development of CMOS MEMS Capacitive Pressure Sensors." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/n97fg7.

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34

gao, Jia-yan, and 高嘉言. "CMOS-MEMS Capacitive sensors for intra-cranial pressure." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/rnre49.

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碩士<br>國立臺北科技大學<br>機電整合研究所<br>101<br>This paper presents the design, fabrication and characterization of a capacitive pressure sensor using a commercial 0.18 μm and 0.35 um CMOS (complementary metal–oxide–semiconductor) process and postprocess.The metal layers of the CMOS process are used as the sensing electrodes and sacri?cial layers, the cavity spacing of commercial 0.35μm is 0.64um and the 0.18μm is 0.53μm.TSMC 0.35 is single capacitance senser, TSMC 0.18 is differential capacitance senser. Finally the two different fabrication senser,the etching holes in the pressure sensor are sealed wi

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35

Chen, Lung-tai, and 陳榮泰. "A Novel Packaging for MEMS-Based Pressure Sensors." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/2mm386.

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36

Kuntzman, Michael Louis. "Micromachined in-plane acoustic pressure gradient sensors." Thesis, 2014. http://hdl.handle.net/2152/31015.

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This work presents the fabrication, modeling, and characterization of two first-generation acoustic in-plane pressure gradient sensors. The first is a micromachined piezoelectric microphone. The microphone structure consists of a semi-rigid beam structure that rotates about torsional pivots in response to in-plane pressure gradients across the length of the beam. The rotation of the beam structure is transduced by piezoelectric cantilevers, which deflect when the beam structure rotates. Sensors with both 10 and 20-μm-thick beam structures are presented. An analytical model and multi-mode, mult

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37

Singh, Jaspreet. "Design, Development and Performance Analysis of Micromachined Sensors for Pressure and Flow Measurement." Thesis, 2014. http://etd.iisc.ac.in/handle/2005/3132.

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Now-a-days sensors are not limited only to industry or research laboratories but have come to common man’s usage. From kids toys to house hold equipment like washing machine, microwave oven as well as in automobiles, a wide variety of sensors and actuators can be easily seen. The aim of the present thesis work is to discuss the design, development, fabrication and testing of miniaturized piezoresistive, absolute type, low pressure sensor and flow sensor. Detailed performance study of these sensors in different ambient conditions (including harsh environment such as radiation, temperature etc.

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38

Singh, Jaspreet. "Design, Development and Performance Analysis of Micromachined Sensors for Pressure and Flow Measurement." Thesis, 2014. http://hdl.handle.net/2005/3132.

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Now-a-days sensors are not limited only to industry or research laboratories but have come to common man’s usage. From kids toys to house hold equipment like washing machine, microwave oven as well as in automobiles, a wide variety of sensors and actuators can be easily seen. The aim of the present thesis work is to discuss the design, development, fabrication and testing of miniaturized piezoresistive, absolute type, low pressure sensor and flow sensor. Detailed performance study of these sensors in different ambient conditions (including harsh environment such as radiation, temperature etc.

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39

Ram, S. N. "Measurement Of Static Pressure Over Bodies In Hypersonic Shock Tunnel Using MEMS-Based Pressure Sensor Array." Thesis, 2010. https://etd.iisc.ac.in/handle/2005/2265.

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Hypersonic flow is both fascinating and intriguing mainly because of presence of strong entropy and viscous interactions in the flow field. Notwithstanding the tremendous advancements in numerical modeling in the last decade separated hypersonic flow still remains an area where considerable differences are observed between experiments and numerical results. Lack of reliable data base of surface static pressures with good spatial resolution in hypersonic separated flow field is one of the main motivations for the present study. The experiments in hypersonic shock tunnels has an advantage com

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40

Ram, S. N. "Measurement Of Static Pressure Over Bodies In Hypersonic Shock Tunnel Using MEMS-Based Pressure Sensor Array." Thesis, 2010. http://hdl.handle.net/2005/2265.

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Hypersonic flow is both fascinating and intriguing mainly because of presence of strong entropy and viscous interactions in the flow field. Notwithstanding the tremendous advancements in numerical modeling in the last decade separated hypersonic flow still remains an area where considerable differences are observed between experiments and numerical results. Lack of reliable data base of surface static pressures with good spatial resolution in hypersonic separated flow field is one of the main motivations for the present study. The experiments in hypersonic shock tunnels has an advantage comp

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41

Yang, Po-Chiang, and 楊伯強. "A New Packaging Method for Pressure Sensors by PDMS MEMS Technology." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/51879061144254739722.

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碩士<br>淡江大學<br>機械與機電工程學系碩士班<br>93<br>This paper describes a novel wafer-level packaging method at room temperature for piezoresistive pressure sensors. We use polydimethylsiloxane (PDMS) to seal the wafer backside with V-grooves for pressure sensors. PDMS has several advantages in packaging herein. First, it can be bonded with many kinds of the materials (e.g., single-crystal silicon, silicon dioxide, silicon nitride, glass and another PDMS) after the hydrophilic surface treatment at room temperature. Second, it is much cheaper compared to other silicon-based materials (e.g., PDMS costs only US

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42

Chen, Pe-Ue, and 陳丕宇. "A study of applying MEMS Pressure sensors in wind tunnel experiment." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/2wr8vz.

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碩士<br>國立成功大學<br>航空太空工程學系碩博士班<br>90<br>Subject：A Study of Applying MEMS Pressure Sensors in Wind Tunnel Experiment Student：P. U. Chen Advisor：J. J. Miau, G. B. Lee The purpose of this study is to develop a high-sensitivity, array-type micro piezoresistive pressure sensors based on MEMS (Micro-electro-mechanical-system) technologies. The pressure sensor will be superior to its large-scale counterparts in the aspects of spatial resolution and sensitivity. The developed pressure sensors will be employed to investigate the characteristics of flow in the stagnation region at the leading edge of a

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43

Pattnaik, Prasant Kumar. "Analysis And Design Of Micro-Opto-Electro-Mechanical Systems (MOEMS) Based Pressure And Vibration Sensors." Thesis, 2005. https://etd.iisc.ac.in/handle/2005/1414.

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44

Pattnaik, Prasant Kumar. "Analysis And Design Of Micro-Opto-Electro-Mechanical Systems (MOEMS) Based Pressure And Vibration Sensors." Thesis, 2005. http://etd.iisc.ernet.in/handle/2005/1414.

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45

Chung-Hsien, Yang, and 楊忠憲. "The Study and Fabrication of Advanced Piezoresistive Pressure and Shear-Stress Sensors by Micro-Electro-Mechanical System(MEMS) Technologies." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/51715769660576297106.

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碩士<br>國立成功大學<br>電機工程學系<br>88<br>Based on computer finite element analysis ANSYS5.3 and micro-electro-mechanical system(MEMS) technologies, monolithic silicon micro pressure and shear-stress sensors have been designed and fabricated. The sensors employ one or two four-terminal shear-stress sensitive piezoresistive transverse voltage strain gauge in place of the conventional Wheatstone bridge construction. In the developed pressure sensor, a square diaphragm with 3000X3000X100 um3 is formed by bulk micromachining of an n-type <100> monolithic silicon in KOH solution. The gauge, which

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46

Lin, Jeng-Hsien, and 林政賢. "DESIGN AND IMPLEMENTATION OF MEMS PRESSURE SENSOR." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/76444592717348118353.

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碩士<br>雲林科技大學<br>電子與資訊工程研究所<br>96<br>This paper starts with basic theorem of parallel plate capacitor and classical theorem of plate and tries to calculate several kinds of capacitive structure with the combination of pre-readout sensing circuit and signal processing system circuit on a single chip, the aim is the design and fabrication of fully integrated capacitive micro-pressure sensor that can be detected pressure for airtight structure of industrial and biomedical application, and the geometry structure of capacitive pressure sensor is circle and rectangle. Each the pressure sensor has cap

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47

Hsin, Chin-Te, and 辛親德. "Design of CMOS MEMS Pressure Sensor and Readout Circuits." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/m552qw.

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碩士<br>淡江大學<br>電機工程學系碩士班<br>107<br>A CMOS MEMS pressure sensor for blood pulse and pressure measurement applications is proposed. A capacitive pressure sensor implemented in UMC 0.18 μm CMOS MEMS process is adopted to sense blood pulses and pressure. A readout circuit is designed and integrated with the MEMS sensor. The MEMS sensor has a simulated sensitivity of 6.53 fF/kPa with a sensing range of 4-40 kPa (30-300 mmHg). The overall system has a measured conversion gain of 4.72 mV/kPa. The power dissipation of the whole circuit is only 6.46 μW. Finally, a SAR-ADC is designed to convert the

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Jan, Hsin-Ru, and 詹欣儒. "Using CMOS-MEMS Process Production of Blood Pressure Sensor and Intracranial Pressure monitoring." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/45bbcg.

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碩士<br>國立臺北科技大學<br>機電整合研究所<br>99<br>The fabrication of a Blood Pressure Sensor and Intracranial Pressure monitoring using the TSMC 0.35 um complementary metal oxide semiconductor process and a post-process have been investigated. The metal layers of the CMOS process are used as the sensing electrodes and sacriﬁcial layers, with the cavity spacing about 0.64um. Finally the etching holes in the pressure sensor are sealed with SU8 or sputter deposition Al. This sensor is composed of eight sensing cells containing four variable capacitors and four reference capacitors. The variable and reference ca

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Hsu, Feng-jui, and 許峰瑞. "Thermal-Hygro-Vapor Pressure-Mechanical Analysis and Reliability on MEMS-Based Pressure Sensor." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/39877383247868045200.

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碩士<br>義守大學<br>機械與自動化工程學系碩士班<br>98<br>Over the past decade, the micro-electro-mechanical systems (MEMS) sensor industry has made continuous improvements for size-reduction, reliability and low cost. In this research, thermo-hygro-vapor pressure-mechanical analysis and reliability design on pre-mold plastic packaging MEMS-based pressure sensor has been fully investigated. Two major analyses are accomplished in this research. In the first, moisture properties and hygroscopic swelling material properties are carefully measured and determined based on Fick’s diffusion equation. Moisture coefficient

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Haghighat, Sohrab Jay. "Design and Analysis of a MEMS Fabry-Perot Pressure Sensor." Thesis, 2007. http://hdl.handle.net/10012/3377.

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Accurate dynamic pressure measurements in the jet engine compressors are the key point in the detection of instabilities that are often precursors to surge or rotating stall. Localized pressure measurements are also very helpful in vehicles aerodynamics performance optimization. A new MEMS pressure sensor capable of measuring pressures between 14.7 psi to 100 psi is presented in this work. The sensor is based on the effect of the viscous damping force on the frequency response of a micro cantilever beam. The frequency response of a micro cantilever beam is affected by two types of damping, squ

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