Relevant bibliographies by topics / Micro Electromechanical Systems (MEMS) accelerometers

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Micro Electromechanical Systems (MEMS) accelerometers'

Author: Grafiati
Published: 4 June 2021
Last updated: 11 February 2022

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Journal articles on the topic "Micro Electromechanical Systems (MEMS) accelerometers"

1

Polla, D. L., and L. F. Francis. "Ferroelectric Thin Films in Micro-electromechanical Systems Applications." MRS Bulletin 21, no. 7 (July 1996): 59–65. http://dx.doi.org/10.1557/s0883769400035934.

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Ferroelectric ceramic thin films fit naturally into the burgeoning field of microelectromechanical systems (MEMS). Microelectromechanical systems combine traditional Si integrated-circuit (IC) electronics with micromechanical sensing and actuating components. The term MEMS has become synonymous with many types of microfabricated devices such as accelerometers, infrared detectors, flow meters, pumps, motors, and mechanical components. These devices have lateral dimensions in the range of 10 μm–10 mm. The ultimate goal of MEMS is a self-contained system of interrelated sensing and actuating devices together with signal processing and control electronics on a common substrate, most often Si. Since fabrication involves methods common to the IC industry, MEMS can be mass-produced. Commercial applications for MEMS already span biomedical (e.g., blood-pressure sensors), manufacturing (e.g., microflow controllers), information processing (e.g., displays), and automotive (e.g., accelerometers) industries. More applications are projected in consumer electronics, manufacturing control, communications, and aerospace. Materials for MEMS include traditional microelectronic materials (e.g., Si, SiO2, Si3N4, polyimide, Pt, Al) as well as nontraditional ones (e.g., ferroelectric ceramics, shapememory alloys, chemical-sensing materials). The superior piezoelectric and pyroelectric properties of ferroelectric ceramics make them ideal materials for microactuators and microsensors.
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Yin, Chong, Xiang Ming Zheng, and Peng Wang. "The Angle Measurement of Folding Wing Craft Based on MEMS." Applied Mechanics and Materials 303-306 (February 2013): 411–15. http://dx.doi.org/10.4028/www.scientific.net/amm.303-306.411.

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The unmanned folding wing aircraft has the advantage on expanding the flight envelope. The angle measurement algorithm of folding wing craft which based on MEMS (micro-electromechanical systems) accelerometers was studied. Collected the acceleration values from the accelerometers, and built the motion parameter model .Used the analyze data and the redundant acceleration; multiple sensors were used to do the error correction. With the experiment of folding wing, the validity and accuracy of the algorithm was verified.
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Chiu, Liu, and Hong. "A Robust Fully-Integrated Digital-Output Inductive CMOS-MEMS Accelerometer with Improved Inductor Quality Factor." Micromachines 10, no. 11 (November 18, 2019): 792. http://dx.doi.org/10.3390/mi10110792.

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This paper presents the design, fabrication, and characterization of an inductive complementary metal oxide semiconductor micro-electromechanical systems (CMOS-MEMS) accelerometer with on-chip digital output based on LC oscillators. While most MEMS accelerometers employ capacitive detection schemes, the proposed inductive detection scheme is less susceptible to the stress-induced structural curling and deformation that are commonly seen in CMOS-MEMS devices. Oscillator-based frequency readout does not need analog to digital conversion and thus can simplify the overall system design. In this paper, a high-Q CMOS inductor was connected in series with the low-Q MEMS sensing inductor to improve its quality factor. Measurement results showed the proposed device had an offset frequency of 85.5 MHz, sensitivity of 41.6 kHz/g, noise floor of 8.2 mg/Hz, bias instability of 0.94 kHz (11 ppm) at an average time of 2.16 s, and nonlinearity of 1.5% full-scale.
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Chen, Dongliang, Liang Yin, Qiang Fu, Wenbo Zhang, Yihang Wang, Guorui Zhang, Yufeng Zhang, and Xiaowei Liu. "A Straightforward Approach for Synthesizing Electromechanical Sigma-Delta MEMS Accelerometers." Sensors 20, no. 1 (December 22, 2019): 91. http://dx.doi.org/10.3390/s20010091.

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The EM- Σ Δ (electromechanical sigma-delta) approach is a concise and efficient way to realize the digital interface for micro-electromechanical systems (MEMS) accelerometers. However, including a fixed MEMS element makes the synthesizing of the EM- Σ Δ loop an intricate problem. The loop parameters of EM- Σ Δ can not be directly mapped from existing electrical Σ Δ modulator, and the synthesizing problem relies an experience-dependent trail-and-error procedure. In this paper, we provide a new point of view to consider the EM- Σ Δ loop. The EM- Σ Δ loop is analyzed in detail from aspects of the signal loop, displacement modulation path and digital quantization loop. By taking a separate consideration of the signal loop and quantization noise loop, the design strategy is made clear and straightforward. On this basis, a discrete-time PID (proportional integral differential) loop compensator is introduced which enhances the in-band loop gain and suppresses the displacement modulation path, and hence, achieves better performance in system linearity and stability. A fifth-order EM- Σ Δ accelerometer system was designed and fabricated using 0.35 μ m CMOS-BCD technology. Based on proposed architecture and synthesizing procedure, the design effort was saved, and the in-band performance, linearity and stability were improved. A noise floor of 1 μ g / Hz , with a bandwidth 1 kHz and a dynamic range of 140 dB was achieved.
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Miller, Brandon J., and Fadi A. Fathallah. "Body-fixed Orientation Sensors for Trunk Motion Sensing." Proceedings of the Human Factors and Ergonomics Society Annual Meeting 51, no. 15 (October 2007): 933–37. http://dx.doi.org/10.1177/154193120705101514.

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Awkward trunk postures and dynamic trunk movements are associated with increased risk of low back disorders (LBDs). Recent advancements in computing and micro-electromechanical systems (MEMS) technology have resulted in high precision, compact, and relatively inexpensive commercial orientation sensors that address the workplace usage limitations of the most common kinematics measurement methods (video analysis, magnetic field sensors, and electrogoniometers). The purpose of this study is to review the available body-fixed orientation sensing technology for its use in ergonomics research and practice. A laboratory study of a custom MEMS accelerometer-based inclinometer highlights issues of axial orientation, vibration, and non-gravitational acceleration that affect orientation results from basic inclinometers. Techniques are presented for correcting for such issues in advanced sensors using computational methods and combinations of MEMS accelerometers, gyroscopes, and/or magnetometers. Body-fixed orientation sensors provide enhanced opportunities to identify and reduce harmful work postures that may reduce the prevalence and severity of work-related musculoskeletal disorders (WMSDs).
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Chen, Yin Jun, Qing Hua Chen, Yan Mei Li, and Wen Gang Wu. "Coupled-Field Finite Element Analysis of MEMS Compound Electrostatic Actuator by Using the ANSYS Software." Applied Mechanics and Materials 214 (November 2012): 929–34. http://dx.doi.org/10.4028/www.scientific.net/amm.214.929.

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MEMS (Microelectromechanical Systems) electrostatic actuators have been successfully applied in a number of areas, including accelerometers, gyroscopes, pressure sensors, and optical devices. In this paper, the actuator optimization of a silicon bulk-micro machined MEMS compound electrostatic actuator of an optical device is discussed. The actuator uses folded-beam structure to enhance the electromechanical performance. The movable block is connected to the compound electrostatic actuator through unequal-height folded-beam springs. The lower-height springs connect the block with parallel plates, and can convert the descending motion of the plates into out-of-plane tilting motion of the block efficiently Additionally, the block is capable of in-plane motion by applying the driving force of the comb-drive actuator through structural connection. ANSYS FEM simulation is used to extract the device electromechanical performance and resonant frequency of the device. By gradually varying the design parameters in ANSYS simulation, the relationship between the actuator electromechanical performance and various design parameters is derived. The curves of actuator electromechanical performance versus beam length and beam height are derived and they are in good agreement with theoretical prediction. From the analysis it is concluded that the actuator behavior strongly depends upon various actuator parameters. By adjusting design parameters, desired electromechanical performance can be obtained. Based on the simulation results, a set of optimized design parameters for the compound electrostatic actuator is decided. The above-proposed MEMS compound electrostatic actuator may be used for many applications, such as optical device and micro-operating.
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Hong, Lei, Ming Jian Li, and Ning Han. "MEMS/GPS Integrated Navigation System Based on EKF." Applied Mechanics and Materials 482 (December 2013): 367–74. http://dx.doi.org/10.4028/www.scientific.net/amm.482.367.

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MEMS (Micro-electromechanical Systems) sensors have many advantages including fast response, low cost, small size and low power consumption. However, MEMS sensors suffer low accuracy and poor stability due to the limitations of the manufacturing process. the MEMS/GPS integrated navigation system based on EKF make up for these shortcomings. The system using a low-cost MEMS sensor system consists of tri-axis gyroscopes and accelerometers which also incorporates a tri-axis magnetometer, and it can provide a complete measurement of orientation relative to the direction of gravity and the earths magnetic field.Extended kalman filter is used to fuse informations from MEMS and GPSof UAV. Mathematical models of GPS and MEMS sensor system are constructed based on matlab/simulink. The experimental results indicate that the average attitude angle error obtained is less than 0.15° in simulation experiments while position error is less than 7m and the velocity error is less than 0.4m.
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Rafiee, Peyman, Golta Khatibi, and Francesco Solazzi. "Optically-detected nonlinear oscillations of single crystal silicon MEMS accelerometers." Microelectronics International 33, no. 2 (May 3, 2016): 107–15. http://dx.doi.org/10.1108/mi-04-2015-0042.

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Purpose The purpose of this study is to address the nonlinear oscillations of single-crystal silicon micro-electromechanical systems (MEMS) accelerometers subjected to mechanical excitation. Methodology/approach The nonlinear behavior was detected and analyzed by using experimental, analytical and numerical approaches. Piezoelectric shaker as a source of mechanical excitation and differential laser Doppler vibrometer in combination with a micro system analyzer were used in the experimental effort. Two types of devices considered included nonencapsulated samples and samples encapsulated in nitrogen gas compressed between two glasses. Numerical and analytical investigations were conducted to analyze the nonlinear response. A novel method has been suggested to calculate the nonlinear parameters. The obtained experimental, numerical and analytical results are in good agreement. Findings It has been found that the nonlinearity leads to a shift in frequencies and generates higher harmonics, but, most importantly, reveals new phenomena, such as the jump and instability of the vibration amplitudes and phases. Originality/value It has been shown that under the constant excitation force, the MEMS device can work in both linear and nonlinear regions. The role of the beat phenomenon has been also addressed and discussed. It has been found that the attributes of the nonlinear response are strongly dependent on the level and duration of the excitation. It is concluded that the nonlinear response of the systems is strongly dependent on the level of the excitation energy. It has been also concluded that larger quality factors are able to enhance dramatically the nonlinear effects and vice versa.
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Malik, M. Rizwan, Tie Lin Shi, Zi Rong Tang, and M. Haseeb. "A Boost-Up Method of MEMS-Bulk-Micromachining towards C-MEMS Fabrication for Sensing and Manipulating Bioparticles." Defect and Diffusion Forum 316-317 (May 2011): 59–67. http://dx.doi.org/10.4028/www.scientific.net/ddf.316-317.59.

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Much of the recent ongoing advanced research into the quest for improved etching techniques has brought forth a broad concept for the fabrication of micro/nano-electromechanical systems (MEMS/NEMS) having high accuracy, precision, efficiency, compatibility and through-put of metallic- as well as carbon-composition structural phases. This in turn leads towards a thorough understanding of the sensing, trapping, separating, controlling, positioning, directing, concentrating and manipulating of micro-nano-sized particles - predominantly biological particles - in the emerging MEMS/NEMS technological field. This paper focuses its attention on the easiest means of wet-etching {100}-type silicon wafer surfaces by guiding the choice of [<100> or <010>] orientation (at 45° to the normal orientation). This anisotropic etching is performed in KOH solution. Here, consideration is not concerned to a large extent with process parameters as in anodic oxidation, an intensely doped boron etching stops and silicon wafer surface back-etching. The main concern of the present practical application route involves a passivating material (silicon dioxide, SiO2) and two masking stages (for a two-step etching process). As a example of this method, silicon cantilever beams having vertical edges are produced. It is concluded that the method presented will be helpful in the comprehensive study of resonators, pressure/temperature sensors, three-dimensional carbon micro-electrodes, actuators and accelerometers for bioparticle applications.
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Li, Qin, and Tao Wang. "Low-Frequency Wireless Accelerometer to Bridge Health Monitoring." Applied Mechanics and Materials 241-244 (December 2012): 858–62. http://dx.doi.org/10.4028/www.scientific.net/amm.241-244.858.

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According to the requirements and characteristics of the long-span bridge vibration monitoring, this paper presents one kind of low-frequency wireless accelerometer monitoring system based on PIC and MEMS (Micro-electromechanical Systems) acceleration sensor. The system was composed of sensor module, data acquisition and processing module, micro-processing module, wireless transmitting and receiving module, and a computer system. Model 1221 was the sensor chip, the measure data processed by MCU, and transmitted by wireless transmitting module based on Zigbee networks. As the date was received by the wireless receiving module, re process the sensing data by computer, to get the vibration parameter and assess the vibration. The system was validated with standard vibrator.
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Dissertations / Theses on the topic "Micro Electromechanical Systems (MEMS) accelerometers"

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Esu, Ozak O. "Vibration-based condition monitoring of wind turbine blades." Thesis, Loughborough University, 2016. https://dspace.lboro.ac.uk/2134/21679.

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Significant advances in wind turbine technology have increased the need for maintenance through condition monitoring. Indeed condition monitoring techniques exist and are deployed on wind turbines across Europe and America but are limited in scope. The sensors and monitoring devices used can be very expensive to deploy, further increasing costs within the wind industry. The work outlined in this thesis primarily investigates potential low-cost alternatives in the laboratory environment using vibration-based and modal testing techniques that could be used to monitor the condition of wind turbine blades. The main contributions of this thesis are: (1) the review of vibration-based condition monitoring for changing natural frequency identification; (2) the application of low-cost piezoelectric sounders with proof mass for sensing and measuring vibrations which provide information on structural health; (3) the application of low-cost miniature Micro-Electro-Mechanical Systems (MEMS) accelerometers for detecting and measuring defects in micro wind turbine blades in laboratory experiments; (4) development of an in-service calibration technique for arbitrarily positioned MEMS accelerometers on a medium-sized wind turbine blade. This allowed for easier aligning of coordinate systems and setting the accelerometer calibration values using samples taken over a period of time; (5) laboratory validation of low-cost modal analysis techniques on a medium-sized wind turbine blade; (6) mimicked ice-loading and laboratory measurement of vibration characteristics using MEMS accelerometers on a real wind turbine blade and (7) conceptualisation and systems design of a novel embedded monitoring system that can be installed at manufacture, is self-powered, has signal processing capability and can operate remotely. By applying the conclusions of this work, which demonstrates that low-cost consumer electronics specifically MEMS accelerometers can measure the vibration characteristics of wind turbine blades, the implementation and deployment of these devices can contribute towards reducing the rising costs of condition monitoring within the wind industry.
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Wong, Christine Y. 1975. "Strategic outsourcing of micro-electromechanical systems (MEMS)." Thesis, Massachusetts Institute of Technology, 2002. http://hdl.handle.net/1721.1/43726.

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Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Civil and Environmental Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2002.
"June 2002."
Includes bibliographical references (leaves 60-61).
ABB Automation is starting to experiment with Micro-electrical Mechanical Systems (MEMS) as an enabling technology for their products. If ABB's implementation of MEMS is found successful, it will be able to create breakthrough products and services that will revolutionize the market in ABB's industrial sensors, instrumentation and analytical areas. The thesis begins with a description of ABB as a company and then provides a brief overview on MEMS and the challenges ABB faces as it tries to commercialize MEMS enabled products. A literature review is also included to explain how companies can better profit from technological innovations such as MEMS. An analysis of ABB's decision to outsource MEMS is described with multiple frameworks including a vertical integration versus outsourcing model as well as a traditional make or buy decision assessment from a financial perspective. The decision to outsource is valid given the stage of the technological life cycle and the company's resolution to use MEMS in selected products. Since the strategic fit argument is still questionable through much of ABB, outsourcing is a legitimate choice for MEMS. Outsourcing allows a greater amount of flexibility and the least amount of capital investment. Although ABB has decided to outsource its MEMS capabilities, it has to realize that there is a possibility of vertical market failure with MEMS. There are very few suppliers in the market today with potentially fewer in the future as mergers and acquisitions begin to take place once a dominant design is established. This vertical market failure encourages vertical integration and not outsourcing.
Christine Y. Wong.
S.M.
M.B.A.
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Yazicioglu, Refet Firat. "Surface Micromachined Capacitive Accelerometers Using Mems Technology." Master's thesis, METU, 2003. http://etd.lib.metu.edu.tr/upload/1093475/index.pdf.

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Micromachined accelerometers have found large attention in recent years due to their low-cost and small size. There are extensive studies with different approaches to implement accelerometers with increased performance for a number of military and industrial applications, such as guidance control of missiles, active suspension control in automobiles, and various consumer electronics devices. This thesis reports the development of various capacitive micromachined accelerometers and various integrated CMOS readout circuits that can be hybrid-connected to accelerometers to implement low-cost accelerometer systems. Various micromachined accelerometer prototypes are designed and optimized with the finite element (FEM) simulation program, COVENTORWARE, considering a simple 3-mask surface micromachining process, where electroplated nickel is used as the structural layer. There are 8 different accelerometer prototypes with a total of 65 different structures that are fabricated and tested. These accelerometer structures occupy areas ranging from 0.2 mm2 to 0.9 mm2 and provide sensitivities in the range of 1-69 fF/g. Various capacitive readout circuits for micromachined accelerometers are designed and fabricated using the AMS 0.8 µ
m n-well CMOS process, including a single-ended and a fully-differential switched-capacitor readout circuits that can operate in both open-loop and close-loop. Using the same process, a buffer circuit with 2.26fF input capacitance is also implemented to be used with micromachined gyroscopes. A single-ended readout circuit is hybrid connected to a fabricated accelerometer to implement an open-loop accelerometer system, which occupies an area less than 1 cm2 and weighs less than 5 gr. The system operation is verified with various tests, which show that the system has a voltage sensitivity of 15.7 mV/g, a nonlinearity of 0.29 %, a noise floor of 487 Hz µ
g , and a bias instability of 13.9 mg, while dissipating less than 20 mW power from a 5 V supply. The system presented in this research is the first accelerometer system developed in Turkey, and this research is a part of the study to implement a national inertial measurement unit composed of low-cost micromachined accelerometers and gyroscopes.
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Seth, Danny 1978. "A remotely automated microscope for characterizing micro electromechanical systems (MEMS)." Thesis, Massachusetts Institute of Technology, 2001. http://hdl.handle.net/1721.1/86762.

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Erismis, Mehmet Akif. "Mems Accelerometers And Gyroscopes For Inertial Measurement Units." Master's thesis, METU, 2004. http://etd.lib.metu.edu.tr/upload/12605331/index.pdf.

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This thesis reports the development of micromachined accelerometers and gyroscopes that can be used for micromachined inertial measurement units (IMUs). Micromachined IMUs started to appear in the market in the past decade as low cost, moderate performance alternative in many inertial applications including military, industrial, medical, and consumer applications. In the framework of this thesis, a number of accelerometers and gyroscopes have been developed in three different fabrication processes, and the operation of these fabricated devices is verified with extensive tests. In addition, the fabricated accelerometers were combined with external readout electronics to obtain hybrid accelerometer systems, which were tested in industrial test facilities. The accelerometers and gyroscopes are designed and optimized using the MATLAB analytical simulator and COVENTORWARE finite element simulation tool. First set of devices is fabricated using a commercial foundry process called SOIMUMPs, while the second set of devices is fabricated using the electroplating processes developed at METU-MET facilities. The third set of devices is designed for a new advanced process based on DRIE, which is under development. Mechanical and electrical test results of the fabricated accelerometers and gyroscopes are in close agreement with the designed values. The testing of the SOI and nickel accelerometers is also performed in industrial test environments. In order to perform these tests, accelerometers are hybrid connected to commercially available capacitive readout circuits. These accelerometer systems require only two DC supply voltages for operation and provide an analog output voltage related to the input acceleration. The industrial tests show that the SOI accelerometer system yields a 799 µ
g/&
#8730
Hz average noise floor, a 1.8 mg/&
#8730
Hz peak noise floor, a 22.2 mV/g sensitivity, and a 0.1 % nonlinearity, while the nickel accelerometer system yields a 228 µ
g/&
#8730
Hz average noise floor, a 375 µ
g/&
#8730
Hz peak noise floor, a 1.02 V/g sensitivity, and a 0.23 % nonlinearity. Long-term drift components of the accelerometers are determined to be smaller than 20 mg. These systems are the highest performance micromachined accelerometer systems developed in Turkey, and they can be used in implementation of a national inertial measurement unit.
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Jafaridinani, Kian. "Parameter estimation methods based on binary observations - Application to Micro-Electromechanical Systems (MEMS)." Phd thesis, Supélec, 2012. http://tel.archives-ouvertes.fr/tel-00756675.

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While the characteristic dimensions of electronic systems scale down to micro- or nano-world, their performance is greatly influenced. Micro-fabrication process or variations of the operating situation such as temperature, humidity or pressure are usual cause of dispersion. Therefore, it seems essential to co-integrate self-testing or self-adjustment routines for these microdevices. For this feature, most existing system parameter estimation methods are based on the implementation of high-resolution digital measurements of the system's output. Thus, long design time and large silicon areas are needed, which increases the cost of the micro-fabricated devices. The parameter estimation problems based on binary outputs can be introduced as alternative self-test identification methods, requiring only a 1-bit Analog-to-Digital Converter (ADC) and a 1-bit Digital-to-Analog Converter (DAC).In this thesis, we propose a novel recursive identification method to the problem of system parameter estimation from binary observations. An online identification algorithm with low-storage requirements and small computational complexity is derived. We prove the asymptotic convergence of this method under some assumptions. We show by Monte Carlo simulations that these assumptions do not necessarily have to be met in practice in order to obtain an appropriate performance of the method. Furthermore, we present the first experimental application of this method dedicated to the self-test of integrated micro-electro-mechanical systems (MEMS). The proposed online Built-In Self-Test method is very amenable to integration for the self-testing of systems relying on resistive sensors and actuators, because it requires low memory storage, only a 1-bit ADC and a 1-bit DAC which can be easily implemented in a small silicon area with minimal energy consumption.
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Spinello, Davide. "Instabilities in Multiphysics Problems: Micro- and Nano-electromechanical Systems, and Heat-Conducting Thermoelastoviscoplastic Solids." Diss., Virginia Tech, 2006. http://hdl.handle.net/10919/28829.

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We investigate (i) pull-in instabilities in a microelectromechanical (MEM) beam due to the Coulomb force and in MEM membranes due to the Coulomb and the Casimir forces, and (ii) thermomechanical instability in a heat-conducting thermoelastoviscoplastic solid due to thermal softening overcoming hardening caused by strain- and strain-rate effects. Each of these nonlinear multiphysics problems is analyzed by the meshless local Petrov-Galerkin (MLPG) method. The moving least squares (MLS) approximation is used to generate basis functions for the trial solution, and the basis for test functions is taken to be either the weight functions used in the MLS approximation, or the same as for the trial solution. In this case the method becomes Bubnov-Galerkin. Essential (displacement, temperature, electric potential) boundary conditions are enforced by the method of Lagrange multipliers. For the electromechanical problem, the pull-in voltage and the corresponding deflection are extracted by combining the MLPG method with either the displacement iteration pull-in extraction algorithm or the pseudoarclength continuation method. For the thermomechanical problem, the localization of deformation into narrow regions of intense plastic deformation is delineated. For every problem studied, computed results are found to compare well with those obtained either analytically or by the finite element (FE) method. For the same accuracy, the MLPG method generally requires fewer nodes but more CPU time than the FE method; thus additional computational cost is compensated somewhat by the increased efficiency of the MLPG method.
Ph. D.
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Khosrowabadi, Allen, Richard Gurr, and Amy Fleishans. "SUBMINIATURE GPS INERTIAL TIME SPACE POSITION INFORMATION." International Foundation for Telemetering, 2000. http://hdl.handle.net/10150/608299.

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International Telemetering Conference Proceedings / October 23-26, 2000 / Town & Country Hotel and Conference Center, San Diego, California
In the past few years, GPS has proven itself as an effective source of time space position information (TSPI) data for air vehicles. Currently, GPS truth systems are used to track aircraft ranging from low dynamic vehicles to high dynamic fighters. However, low-cost GPS TSPI instrumentation is not currently available for stores and weapons delivered by air vehicles. To date, data is collected by tracking dropped items using radar or optical means. This process is costly and time consuming. The purpose of this project is to leverage the recent advances in micro-electromechanical systems (MEMS) technology to develop a subminiature, inexpensive, low power, disposable telemetrytransmitting package. The purpose of this transmitting package is to up-link the GPS positional data from the weapon or store to the host aircraft. This data is then retransmitted by the host aircraft to a ground station and/or recorded on board for post processing. The transmission of the data to the host aircraft can provide near real- time position data for the released object. The transmitting package must have a unique identification method for application in tracking multiple objects. Since most of the systems used in weapons testing will be destroyed, it is extremely important to keep the development and maintenance cost low. In addition, the package must be non-intrusive to avoid any significant modification to the weapon and to facilitate quick instrumentation of the weapon for test and evaluation.
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Voyantzis, Mitchell D. "CloudMEMS Platform for Design and Simulation of MEMS: Physics Modules & End-to-End Testing." University of Toledo / OhioLINK, 2018. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1533226484963866.

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ISLAM, MOHAMMAD SAIFUL. "Reconfigurable RF and Wireless Architectures Using Ultra-Stable Micro- and Nano-Electromechanical Oscillators: Emerging Devices, Circuits, and Systems." Case Western Reserve University School of Graduate Studies / OhioLINK, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=case1582167898995604.

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Books on the topic "Micro Electromechanical Systems (MEMS) accelerometers"

1

ASME International Mechanical Engineering Congress and Exposition (2001 New York, N.Y.). Micro-electro-mechanical systems: MEMS -- 2001 : presented at the 2000 [i.e. 2001] ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, New York. New York, N.Y: American Society of Mechanical Engineers, 2001.

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Boundary Layer Control Using Micro-Electromechanical systems (MEMS). Storming Media, 2002.

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Dechev, Nikolai. Microassembly of 3D microstructures and micro-electromechanical systems (MEMS). 2004.

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(Editor), Osamu Tabata, Toshiyuki Tsuchiya (Editor), Oliver Brand (Series Editor), Gary K. Fedder (Series Editor), Christofer Hierold (Series Editor), and Jan G. Korvink (Series Editor), eds. Reliability of MEMS (Advanced Micro and Nanosystems). Wiley-VCH, 2008.

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Brand, Oliver, Jan G. Korvink, Henry Baltes, Gary K. Fedder, and Christofer Hierold. Enabling Technology for MEMS and Nanodevices: Advanced Micro and Nanosystems. Wiley & Sons, Limited, John, 2008.

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Korvink, J. G., Oliver Brand, Henry Baltes, Gary K. Fedder, and C. Hierold. Enabling Technology for MEMS and Nanodevices: Advanced Micro and Nanosystems. Wiley-VCH Verlag GmbH, 2013.

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George, Thomas. Micro (Mems) And Nanotechnologies for Space Applications. Society of Photo Optical, 2006.

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Thomas, George, Cheng Z. -Y, and Society of Photo-optical Instrumentation Engineers., eds. Micro (MEMS) and nanotechnologies for space applications: 19-20 April, 2006, Kissimmee, Florida, USA. Bellingham, Wash: SPIE, 2006.

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T, Avedisian C., American Society of Mechanical Engineers. Dynamic Systems and Control Division., and International Mechanical Engineering Congress and Exposition (1996 : Atlanta, Ga.), eds. Microelectromechanical systems (MEMS): Microscale thermal phenomena in electronic systems, applications of miocrofabrication to fluid mechanics, mechanics in micro-electro-mechanical systems (MEMS), micromechanical systems : presented at the 1996 International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia. New York, N.Y: American Society of Mechanical Engineers, 1996.

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P, Lee Abraham, American Society of Mechanical Engineers. MEMS Subdivision., and International Mechanical Engineering Congress and Exposition (2001 : New York, N.Y.), eds. Micro-electro-mechanical systems (MEMS)--2001: Presented at the 2001 ASME International Mechanical Engineering Congress and Exposition : November 11-16, 2001, New York, New York. New York, N.Y: American Society of Mechanical Engineers, 2001.

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Book chapters on the topic "Micro Electromechanical Systems (MEMS) accelerometers"

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Colinge, Cynthia A. "Wafer Bonding for Micro-ElectroMechanical Systems (MEMS)." In Perspectives, Science and Technologies for Novel Silicon on Insulator Devices, 269–80. Dordrecht: Springer Netherlands, 2000. http://dx.doi.org/10.1007/978-94-011-4261-8_26.

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Kurina, G. A., J. M. Balthazar, and A. M. Tusset. "Using Different Approximations of Averaging Method in Theory of Micro Electromechanical Systems (MEMS)." In Mechanisms and Machine Science, 333–42. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-60694-7_21.

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Lyshevski, Sergey Edward. "Control of MEMS and NEMS." In Nano- and Micro-Electromechanical Systems, 539–644. CRC Press, 2018. http://dx.doi.org/10.1201/9781315219288-9.

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Lyshevski, Sergey Edward. "Fundamentals of Microfabrication and MEMS Fabrication Technologies." In Nano- and Micro-Electromechanical Systems, 97–134. CRC Press, 2018. http://dx.doi.org/10.1201/9781315219288-4.

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Lyshevski, Sergey Edward. "Devising and Synthesis of NEMS and MEMS." In Nano- and Micro-Electromechanical Systems, 135–90. CRC Press, 2018. http://dx.doi.org/10.1201/9781315219288-5.

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Lyshevski, Sergey Edward. "Examples in Synthesis, Analysis, Design, and Fabrication of MEMS." In Nano- and Micro-Electromechanical Systems, 645–704. CRC Press, 2018. http://dx.doi.org/10.1201/9781315219288-10.

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Lyshevski, Sergey Edward. "Modeling of Micro- and Nanoscale Electromechanical Systems, Devices, and Structures." In Mems and Nems, 137–312. CRC Press, 2018. http://dx.doi.org/10.1201/9781315220246-5.

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Tuna, Gurkan, and Vehbi Cagri Gungor. "Micro-Electromechanical Systems for Underwater Environments." In Handbook of Research on Recent Developments in Intelligent Communication Application, 529–56. IGI Global, 2017. http://dx.doi.org/10.4018/978-1-5225-1785-6.ch020.

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Abstract:
Underwater networking technologies have brought us unforeseen ways to explore the unexplored aquatic environment and this way provided us with a large number of different kinds of applications for environmental, scientific, commercial, and military purposes. Although precise and continuous aquatic environment monitoring capability is highly important for various underwater applications, due to the unique characteristics of underwater networks such as low communication bandwidth, high error rate, node mobility, large propagation delay, and harsh underwater environmental conditions, existing solutions cannot be applied directly to underwater networks. Therefore, new solutions considering the unique features of underwater environment are highly demanded. In this chapter, the authors mainly focus on the use of wireless micro-electromechanical systems for underwater networks and present its advantages. In addition, the authors investigate the challenges and open research issues of wireless MEMS to provide an insight into future research opportunities.
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Stanimirovi, Ivanka, and Zdravko Stanimirovi. "Optical MEMS for Telecommunications: Some Reliability Issues." In Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies. InTech, 2013. http://dx.doi.org/10.5772/55128.

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Mori, K. "Silicon-on-insulator (SOI) technology for micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS) sensors." In Silicon-On-Insulator (SOI) Technology, 435–53. Elsevier, 2014. http://dx.doi.org/10.1533/9780857099259.2.435.

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Conference papers on the topic "Micro Electromechanical Systems (MEMS) accelerometers"

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Deimerly, Yannick, Patrice Rey, Philippe Robert, Tarik Bourouina, and Guillaume Jourdan. "Electromechanical damping in MEMS accelerometers: A way towards single chip gyrometer accelerometer co-integration." In 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS). IEEE, 2014. http://dx.doi.org/10.1109/memsys.2014.6765743.

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Valoff, S., and W. J. Kaiser. "Presettable micromachined MEMS accelerometers." In Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291). IEEE, 1999. http://dx.doi.org/10.1109/memsys.1999.746755.

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Farrar, D. "Controlling Micro ElectroMechanical Systems (MEMS) in Space." In SPACE TECHNOLOGY AND APPLICATIONS INT.FORUM-STAIF 2003: Conf.on Thermophysics in Microgravity; Commercial/Civil Next Generation Space Transportation; Human Space Exploration; Symps.on Space Nuclear Power and Propulsion (20th); Space Colonization (1st). AIP, 2003. http://dx.doi.org/10.1063/1.1541293.

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Zunino III, James L., and Donald Skelton. "Department of Defense need for a micro-electromechanical systems (MEMS) reliability assessment program." In MOEMS-MEMS Micro & Nanofabrication, edited by Danelle M. Tanner and Rajeshuni Ramesham. SPIE, 2005. http://dx.doi.org/10.1117/12.602257.

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Kamada, Yudai, Naoki Mori, Hideto Kazama, Akira Matsumoto, Tomonori Sekiguchi, Atsushi Isobe, Takashi Oshima, et al. "A low-cost, 30 NG/VHZ noise floor MEMS accelerometers for large sensor network." In 2018 IEEE Micro Electro Mechanical Systems (MEMS). IEEE, 2018. http://dx.doi.org/10.1109/memsys.2018.8346711.

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Miani, Theo, Thierry Verdot, Audrey Berthelot, Federico Maspero, Alexandra Koumela, Philippe Robert, Giacomo Langfelder, Julien Arcamone, and Marc Sansa. "Resonant Accelerometers Based on Nanomechanical Piezoresistive Transduction." In 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS). IEEE, 2021. http://dx.doi.org/10.1109/mems51782.2021.9375287.

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Schoen, F., M. Nawaz, T. Bever, R. Gruenberger, W. Raberg, W. Weber, B. Winkler, and R. Weigel. "Temperature Compensation in Silicon-Based Micro-Electromechanical Resonators." In 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems (MEMS). IEEE, 2009. http://dx.doi.org/10.1109/memsys.2009.4805525.

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Hajjam, Arash, Amir Rahafrooz, and Siavash Pourkamali. "Temperature compensated single-device electromechanical oscillators." In 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS). IEEE, 2011. http://dx.doi.org/10.1109/memsys.2011.5734546.

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Chen, Fang, Wei Zhou, Hongshuo Zou, Michael Kraft, and Xinxin Li. "Self-clocked dual-resonator micromachined Lorentz force magnetometer based on electromechanical sigma-delta modulation." In 2018 IEEE Micro Electro Mechanical Systems (MEMS). IEEE, 2018. http://dx.doi.org/10.1109/memsys.2018.8346712.

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Khlifi, Awatef, Brahim Mezghani, Shardul Pandit, Aftab Ahmed, Rajul Patkar, Pradeep Dixit, and Maryam Shojaei Baghini. "Eigenfrequency Investigation of SU-8 Single Axis MEMS Piezoresistive Accelerometers." In 2020 IEEE International Conference on Design & Test of Integrated Micro & Nano-Systems (DTS). IEEE, 2020. http://dx.doi.org/10.1109/dts48731.2020.9196180.

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Reports on the topic "Micro Electromechanical Systems (MEMS) accelerometers"

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Hudson, Tracy D., and Michael S. Kranz. Operation of Silicon-on-Insulator (SOI) Micro-ElectroMechanical Systems (MEMS) Gyroscopic Sensor as a Two-Axis Accelerometer. Fort Belvoir, VA: Defense Technical Information Center, April 2012. http://dx.doi.org/10.21236/ada559286.

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Feddema, J. T., R. Simon, M. Polosky, and T. Christenson. Ultra-Precise Assembly of Micro-Electromechanical Systems (MEMS) Components. Office of Scientific and Technical Information (OSTI), April 1999. http://dx.doi.org/10.2172/5833.

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Giedd, Ryan, Matt Curry, Paul Durham, and Norm Dobson. Biosensors Made From Carbon and Polymer Composite Micro-Electromechanical Systems (MEMS). Fort Belvoir, VA: Defense Technical Information Center, August 2004. http://dx.doi.org/10.21236/ada426181.

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Giedd, Ryan, Matt Curry, Paul Durham, and Norm Dobson. Biosensors Made from Carbon and Polymer Composite Micro-Electromechanical Systems (MEMS). Fort Belvoir, VA: Defense Technical Information Center, December 2003. http://dx.doi.org/10.21236/ada419760.

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