Dissertations / Theses on the topic 'Micro Electromechanical Systems (MEMS) accelerometers'

Significant advances in wind turbine technology have increased the need for maintenance through condition monitoring. Indeed condition monitoring techniques exist and are deployed on wind turbines across Europe and America but are limited in scope. The sensors and monitoring devices used can be very expensive to deploy, further increasing costs within the wind industry. The work outlined in this thesis primarily investigates potential low-cost alternatives in the laboratory environment using vibration-based and modal testing techniques that could be used to monitor the condition of wind turbine blades. The main contributions of this thesis are: (1) the review of vibration-based condition monitoring for changing natural frequency identification; (2) the application of low-cost piezoelectric sounders with proof mass for sensing and measuring vibrations which provide information on structural health; (3) the application of low-cost miniature Micro-Electro-Mechanical Systems (MEMS) accelerometers for detecting and measuring defects in micro wind turbine blades in laboratory experiments; (4) development of an in-service calibration technique for arbitrarily positioned MEMS accelerometers on a medium-sized wind turbine blade. This allowed for easier aligning of coordinate systems and setting the accelerometer calibration values using samples taken over a period of time; (5) laboratory validation of low-cost modal analysis techniques on a medium-sized wind turbine blade; (6) mimicked ice-loading and laboratory measurement of vibration characteristics using MEMS accelerometers on a real wind turbine blade and (7) conceptualisation and systems design of a novel embedded monitoring system that can be installed at manufacture, is self-powered, has signal processing capability and can operate remotely. By applying the conclusions of this work, which demonstrates that low-cost consumer electronics specifically MEMS accelerometers can measure the vibration characteristics of wind turbine blades, the implementation and deployment of these devices can contribute towards reducing the rising costs of condition monitoring within the wind industry.

Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Civil and Environmental Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2002.
"June 2002."
Includes bibliographical references (leaves 60-61).
ABB Automation is starting to experiment with Micro-electrical Mechanical Systems (MEMS) as an enabling technology for their products. If ABB's implementation of MEMS is found successful, it will be able to create breakthrough products and services that will revolutionize the market in ABB's industrial sensors, instrumentation and analytical areas. The thesis begins with a description of ABB as a company and then provides a brief overview on MEMS and the challenges ABB faces as it tries to commercialize MEMS enabled products. A literature review is also included to explain how companies can better profit from technological innovations such as MEMS. An analysis of ABB's decision to outsource MEMS is described with multiple frameworks including a vertical integration versus outsourcing model as well as a traditional make or buy decision assessment from a financial perspective. The decision to outsource is valid given the stage of the technological life cycle and the company's resolution to use MEMS in selected products. Since the strategic fit argument is still questionable through much of ABB, outsourcing is a legitimate choice for MEMS. Outsourcing allows a greater amount of flexibility and the least amount of capital investment. Although ABB has decided to outsource its MEMS capabilities, it has to realize that there is a possibility of vertical market failure with MEMS. There are very few suppliers in the market today with potentially fewer in the future as mergers and acquisitions begin to take place once a dominant design is established. This vertical market failure encourages vertical integration and not outsourcing.
Christine Y. Wong.
S.M.
M.B.A.

Micromachined accelerometers have found large attention in recent years due to their low-cost and small size. There are extensive studies with different approaches to implement accelerometers with increased performance for a number of military and industrial applications, such as guidance control of missiles, active suspension control in automobiles, and various consumer electronics devices. This thesis reports the development of various capacitive micromachined accelerometers and various integrated CMOS readout circuits that can be hybrid-connected to accelerometers to implement low-cost accelerometer systems. Various micromachined accelerometer prototypes are designed and optimized with the finite element (FEM) simulation program, COVENTORWARE, considering a simple 3-mask surface micromachining process, where electroplated nickel is used as the structural layer. There are 8 different accelerometer prototypes with a total of 65 different structures that are fabricated and tested. These accelerometer structures occupy areas ranging from 0.2 mm2 to 0.9 mm2 and provide sensitivities in the range of 1-69 fF/g. Various capacitive readout circuits for micromachined accelerometers are designed and fabricated using the AMS 0.8 µ
m n-well CMOS process, including a single-ended and a fully-differential switched-capacitor readout circuits that can operate in both open-loop and close-loop. Using the same process, a buffer circuit with 2.26fF input capacitance is also implemented to be used with micromachined gyroscopes. A single-ended readout circuit is hybrid connected to a fabricated accelerometer to implement an open-loop accelerometer system, which occupies an area less than 1 cm2 and weighs less than 5 gr. The system operation is verified with various tests, which show that the system has a voltage sensitivity of 15.7 mV/g, a nonlinearity of 0.29 %, a noise floor of 487 Hz µ
g , and a bias instability of 13.9 mg, while dissipating less than 20 mW power from a 5 V supply. The system presented in this research is the first accelerometer system developed in Turkey, and this research is a part of the study to implement a national inertial measurement unit composed of low-cost micromachined accelerometers and gyroscopes.

This thesis reports the development of micromachined accelerometers and gyroscopes that can be used for micromachined inertial measurement units (IMUs). Micromachined IMUs started to appear in the market in the past decade as low cost, moderate performance alternative in many inertial applications including military, industrial, medical, and consumer applications. In the framework of this thesis, a number of accelerometers and gyroscopes have been developed in three different fabrication processes, and the operation of these fabricated devices is verified with extensive tests. In addition, the fabricated accelerometers were combined with external readout electronics to obtain hybrid accelerometer systems, which were tested in industrial test facilities. The accelerometers and gyroscopes are designed and optimized using the MATLAB analytical simulator and COVENTORWARE finite element simulation tool. First set of devices is fabricated using a commercial foundry process called SOIMUMPs, while the second set of devices is fabricated using the electroplating processes developed at METU-MET facilities. The third set of devices is designed for a new advanced process based on DRIE, which is under development. Mechanical and electrical test results of the fabricated accelerometers and gyroscopes are in close agreement with the designed values. The testing of the SOI and nickel accelerometers is also performed in industrial test environments. In order to perform these tests, accelerometers are hybrid connected to commercially available capacitive readout circuits. These accelerometer systems require only two DC supply voltages for operation and provide an analog output voltage related to the input acceleration. The industrial tests show that the SOI accelerometer system yields a 799 µ
g/&
#8730
Hz average noise floor, a 1.8 mg/&
#8730
Hz peak noise floor, a 22.2 mV/g sensitivity, and a 0.1 % nonlinearity, while the nickel accelerometer system yields a 228 µ
g/&
#8730
Hz average noise floor, a 375 µ
g/&
#8730
Hz peak noise floor, a 1.02 V/g sensitivity, and a 0.23 % nonlinearity. Long-term drift components of the accelerometers are determined to be smaller than 20 mg. These systems are the highest performance micromachined accelerometer systems developed in Turkey, and they can be used in implementation of a national inertial measurement unit.

While the characteristic dimensions of electronic systems scale down to micro- or nano-world, their performance is greatly influenced. Micro-fabrication process or variations of the operating situation such as temperature, humidity or pressure are usual cause of dispersion. Therefore, it seems essential to co-integrate self-testing or self-adjustment routines for these microdevices. For this feature, most existing system parameter estimation methods are based on the implementation of high-resolution digital measurements of the system's output. Thus, long design time and large silicon areas are needed, which increases the cost of the micro-fabricated devices. The parameter estimation problems based on binary outputs can be introduced as alternative self-test identification methods, requiring only a 1-bit Analog-to-Digital Converter (ADC) and a 1-bit Digital-to-Analog Converter (DAC).In this thesis, we propose a novel recursive identification method to the problem of system parameter estimation from binary observations. An online identification algorithm with low-storage requirements and small computational complexity is derived. We prove the asymptotic convergence of this method under some assumptions. We show by Monte Carlo simulations that these assumptions do not necessarily have to be met in practice in order to obtain an appropriate performance of the method. Furthermore, we present the first experimental application of this method dedicated to the self-test of integrated micro-electro-mechanical systems (MEMS). The proposed online Built-In Self-Test method is very amenable to integration for the self-testing of systems relying on resistive sensors and actuators, because it requires low memory storage, only a 1-bit ADC and a 1-bit DAC which can be easily implemented in a small silicon area with minimal energy consumption.

We investigate (i) pull-in instabilities in a microelectromechanical (MEM) beam due to the Coulomb force and in MEM membranes due to the Coulomb and the Casimir forces, and (ii) thermomechanical instability in a heat-conducting thermoelastoviscoplastic solid due to thermal softening overcoming hardening caused by strain- and strain-rate effects. Each of these nonlinear multiphysics problems is analyzed by the meshless local Petrov-Galerkin (MLPG) method. The moving least squares (MLS) approximation is used to generate basis functions for the trial solution, and the basis for test functions is taken to be either the weight functions used in the MLS approximation, or the same as for the trial solution. In this case the method becomes Bubnov-Galerkin. Essential (displacement, temperature, electric potential) boundary conditions are enforced by the method of Lagrange multipliers. For the electromechanical problem, the pull-in voltage and the corresponding deflection are extracted by combining the MLPG method with either the displacement iteration pull-in extraction algorithm or the pseudoarclength continuation method. For the thermomechanical problem, the localization of deformation into narrow regions of intense plastic deformation is delineated. For every problem studied, computed results are found to compare well with those obtained either analytically or by the finite element (FE) method. For the same accuracy, the MLPG method generally requires fewer nodes but more CPU time than the FE method; thus additional computational cost is compensated somewhat by the increased efficiency of the MLPG method.
Ph. D.

International Telemetering Conference Proceedings / October 23-26, 2000 / Town & Country Hotel and Conference Center, San Diego, California
In the past few years, GPS has proven itself as an effective source of time space position information (TSPI) data for air vehicles. Currently, GPS truth systems are used to track aircraft ranging from low dynamic vehicles to high dynamic fighters. However, low-cost GPS TSPI instrumentation is not currently available for stores and weapons delivered by air vehicles. To date, data is collected by tracking dropped items using radar or optical means. This process is costly and time consuming. The purpose of this project is to leverage the recent advances in micro-electromechanical systems (MEMS) technology to develop a subminiature, inexpensive, low power, disposable telemetrytransmitting package. The purpose of this transmitting package is to up-link the GPS positional data from the weapon or store to the host aircraft. This data is then retransmitted by the host aircraft to a ground station and/or recorded on board for post processing. The transmission of the data to the host aircraft can provide near real- time position data for the released object. The transmitting package must have a unique identification method for application in tracking multiple objects. Since most of the systems used in weapons testing will be destroyed, it is extremely important to keep the development and maintenance cost low. In addition, the package must be non-intrusive to avoid any significant modification to the weapon and to facilitate quick instrumentation of the weapon for test and evaluation.

Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. 3D integration of NEMS and ICs also contributes to more compact device footprints, improves device performance, and lowers the power consumption. Therefore, 3D integration of NEMS and ICs has been proposed as a promising solution to the end of Moore’s law, i.e. the slowing advancement of complementary metal-oxide-semiconductor (CMOS) technology.In this Ph.D. thesis, I propose a comprehensive fabrication methodology for heterogeneous 3D integration of NEM devices directly on top of CMOS circuits. In heterogeneous integration, the NEMS and CMOS components are fully or partially fabricated on separate substrates and subsequently merged into one. This enables process flexibility for the NEMS components while maintaining full compatibility with standard CMOS fabrication. The first part of this thesis presents an adhesive wafer bonding method using ultra-thin intermediate bonding layers which is utilized for merging the NEMS components with the CMOS substrate. In the second part, a novel NEM switch concept is introduced and the performance of CMOS-integrated NEM switch circuits for logic and computation applications is discussed. The third part examines two different packaging approaches for integrated MEMS and NEMS devices with either hermetic vacuum cavities or low-cost glass lids for optical applications. Finally, a novel fabrication approach for through silicon vias (TSVs) by magnetic assembly is presented, which is used to establish an electrical connection from the packaged devices to the outside world.
Tredimensionell (3D) integration av mikro- och nano-elektromekaniska system (MEMS/NEMS) med integrerade kretsar (ICs) är en ny teknik som erbjuder stora fördelar jämfört med konventionell mikroelektronik. MEMS och NEMS används oftast som sensorer och aktuatorer då de möjliggör många funktioner som inte kan uppnås med vanliga ICs.3D-integration av NEMS och ICs bidrar även till mindre dimensioner, ökade prestanda och mindre energiförbrukning av elektriska komponenter. Den nuvarande tekniken för complementary metal-oxide-semicondictor (CMOS) närmar sig de fundamentala gränserna vilket drastiskt begränsar utvecklingsmöjligheten för mikroelektronik och medför slutet på Moores lag. Därför har 3D-integration identifierats som en lovande teknik för att kunna driva vidare utvecklingen för framtidens elektriska komponenter.I denna avhandling framläggs en omfattande fabrikationsmetodik för heterogen 3D-integration av NEMS ovanpå CMOS-kretsar. Heterogen integration betyder att både NEMS- och CMOS-komponenter byggs på separata substrat för att sedan förenas på ett enda substrat. Denna teknik tillåter full processfrihet för tillverkning av NEMS-komponenter och garanterar kompatibilitet med standardiserade CMOS-fabrikationsprocesser.I den första delen av avhandlingen beskrivs en metod för att sammanfoga två halvledarskivor med en extremt tunn adhesiv polymer. Denna metod demonstreras för 3D-integration av NEMS- och CMOS-komponenter. Den andra delen introducerar ett nytt koncept för NEM-switchar och dess användning i NEM-switch-baserade mikrodatorchip. Den tredje delen presenterar två olika inkapslingsmetoder för MEMS och NEMS. Den ena metoden fokuserar på hermetisk vakuuminkapsling medan den andra metoden beskriver en lågkostnadsstrategi för inkapsling av optiska komponenter. Slutligen i den fjärde delen presenteras en ny fabrikationsteknik för så kallade ”through silicon vias” (TSVs) baserad på magnetisk självmontering av nickeltråd på mikrometerskala.

20170519

This dissertation presents the design and development of a mixed-signal low noise second-order integrated circuit (IC) for the open-loop and closed-loop operation of integrated capacitive micro- and nano-gravity accelerometers. The micromechanical accelerometers are fabricated in thick (less than 100 m) silicon-on-insulator (SOI) substrates. The IC provides the 1-bit digital output stream and has the versatility of interfacing sensors with different sensitivities while maintaining minimum power consumption (less than 5 mW) and maximum dynamic range (90 dB). A fully-differential sampled-data scheme is deployed with the ability of low-frequency noise reduction through the use of correlated double sampling (CDS) scheme. In this work, the measured resolution of the closed-loop CMOS-SOI accelerometer system, in the presence of high background accelerations, is in the micro-g (g: gravity) range. In this design, a second-order SC modulator is cascaded with the accelerometer and the front-end amplifier. The accelerometer operates in air and is designed for non-peaking response with a BW-3dB of 500 Hz. A 22 dB improvement in noise and hence dynamic range is achieved with a sampling clock of 40 kHz corresponding to a low oversampling ratio (OSR) of 40. The interface IC consumed a current of 1.5 mA from a supply of 3 V.

The production of magnetic materials is of great interest for use in the micro-fabrication industry. In particular, Permalloy (Ni80Fe20) is used in the production of micro-electromechanical systems (MEMS) due to its favourable magnetic properties (high relative permeability, low coercivity and high magnetic saturation). This leads to applications in devices such as inductors, transformers and micro-actuators. The electrodeposition of NiFe is also of fundamental electrochemical interest, as there is anomalous thermodynamic behaviour, with the less noble (iron) metal depositing preferentially to the more noble (nickel) metal. To enable consistent alloy deposition nickel and nickel-iron baths are currently almost exclusively based on boric acid. Boric acid has an important role in the deposition of NiFe films but its role(s) in the electro-deposition mechanism is (are) not wholly understood. Recently (2011) boric acid has been identified as a “substance of very high concern” based on the criteria established by EU chemical regulation, REACH. In anticipation of increased regulation an alternative was sought to provide a benign alternative to boric acid in the NiFe plating bath suitable for use in micro-fabrication. Initial work was performed to benchmark the performance of existing boric acid based electro-deposition baths. Cyclic voltammetry was performed, which demonstrated the deposition of nickel and nickel-iron from boric acid baths. Coulombic efficiencies up to 93 % were measured for the deposition of nickel using the electrochemical quartz crystal microbalance (EQCM) on platinum electrodes. For nickel-iron deposition control of the film composition was demonstrated on copper electrodes through varying the iron (II) concentration, current density and temperature. A citrate bath for the deposition of nickel-iron was then developed and characterised. Cyclic voltammetry was performed in these citrate baths demonstrating the deposition of nickel and nickel-iron. Optimal conditions for depositing Ni80Fe20 were demonstrated to be an elevated temperature (60 °C) with a current density of 20 mA cm-2 and a pH of 3. Using the EQCM the efficiency for nickel deposition was measured to be > 80 %. The effects of sodium saccharin and sodium dodecyl sulfate as additives were investigated; these were shown to influence morphology but not the coulombic efficiency. Decreasing the pH was shown to lower the efficiency of nickel deposition from the citrate bath. Comparisons of key properties were made between NiFe films deposited from a boric acid bath and the citrate bath developed in this work. Test structures were used to compare the strain in the films; no significant difference was found. For 2.2 μm thick Ni80Fe20 films the sheet resistance was measured using Greek cross structures as 0.078 ± 0.004 Ω/square for films deposited from the boric acid bath and 0.090 ± 0.006 Ω/square from the citrate bath. The magnetic saturation, Ms, was measured as 895 ± 66 emu cm-3 for deposits from the boric acid bath and 923 ± 111 emu cm-3 from the citrate bath. These again show no significant difference in these values within experimental error. Coercivities for these films were measured to be between 20 and 120 A m-1. In combination, this work demonstrates the development and characterisation of a new citrate based electrodeposition bath for nickel and nickel-iron. Similar chemical, electrical, mechanical and magnetic properties were found from films deposited from both baths, thus demonstrating the suitability of the citrate bath for the deposition of nickel-iron films in microfabrication.

Thin film material properties and measurement characterisation techniques are crucial for the development of micro-electromechanical systems (MEMS) devices. Furthermore, as the technology scales down from microtechnology towards nanotechnology, nanoscale materials such as carbon nanotubes (CNTs) are required in electronic devices to overcome the limitations encountered by conventional materials at the nanoscale. The integration of CNTs into micro-electronics and material applications is expected to provide a wide range of new applications. The work presented in this thesis has contributed to the development of thin film material characterisation through research on the thermal conductivity measurement and the control of the residual stress of thin film materials used commonly in MEMS devices. In addition, the use of CNTs in micro-electronics and as filler reinforcement in composite materials applications have been investigated, leading to low resistivity CNTs interconnects and CNTs-Polyimide (PI) composites based resistive humidity sensors. In the first part of this thesis, the thermal conductivity of conductive thin films as well as the control of the residual stress arising from fabrication process in PI micro-cantilevers have been studied. A MEMS device has been developed for the thermal conductivity characterisation of conductive thin films showing good agreement with thermal conductivity of bulk material. Low energy Ar+ ion bombardment in a plasma has been used to control the residual stress present in PI cantilevers. Appropriate ion energy and exposure time have led to stress relaxation of the beams resulting in a straight PI cantilever beam. In the second part of this thesis, low resistivity CNTs interconnects have been developed using both dielectrophoresis (DEP) and Focused Ion Beam (FIB) techniques. An investigation of the effects of CNT concentration, applied voltage and frequency on the CNTs alignment between Al and Ti electrodes has resulted in the lowering of the CNTs’ resistance. The deposition of Pt contact using FIB at the CNTs-metal electrodes interface has been found to decrease the high contact resistances of the devices by four and two orders of magnitude for Al and Ti electrodes respectively. The last part of this thesis focuses on the preparation of CNTs-PI composite materials, its characterisation and its application as resistive humidity sensor. The integration of CNTs inside the PI matrix has resulted in enhancing significantly the electrical and mechanical properties of the composites. In particular, a DEP technique employed to induce CNTs alignment inside the PI matrix during curing has been attributed to play an important role in improving the composite properties and lowering the percolation threshold. In addition, the fabrication and testing of CNTs-PI resistive humidity sensors have been carried out. The sensing performance of the devices have shown to be dependent highly on the CNT concentration. Finally, the alignment of CNTs by DEP has improved the sensing properties of CNTs-PI humidity sensors and confirmed that the change of resistance in response to humidity is governed by the change of the CNTs’ resistances due to charge transfer from the water molecules to the CNTs.

abstract: ABSTRACT This work seeks to develop a practical solution for short range ultrasonic communications and produce an integrated array of acoustic transmitters on a flexible substrate. This is done using flexible thin film transistor (TFT) and micro electromechanical systems (MEMS). The goal is to develop a flexible system capable of communicating in the ultrasonic frequency range at a distance of 10 - 100 meters. This requires a great deal of innovation on the part of the FDC team developing the TFT driving circuitry and the MEMS team adapting the technology for fabrication on a flexible substrate. The technologies required for this research are independently developed. The TFT development is driven primarily by research into flexible displays. The MEMS development is driving by research in biosensors and micro actuators. This project involves the integration of TFT flexible circuit capabilities with MEMS micro actuators in the novel area of flexible acoustic transmitter arrays. This thesis focuses on the design, testing and analysis of the circuit components required for this project.
Dissertation/Thesis
M.S. Electrical Engineering 2012

With the advent of micro and nano electromechanical systems (MEMS/NEMS), there has been rapid development in the design and fabrication of sensitive resonant sensors. Sensitivity of such devices depends on the resonant frequency and the quality factor (Q). The Q of these devices are dependent on process induced prestress in the structural geometry, interaction with the external environment, and the encapsulation method. For high frequency sensors operating in air and under encapsulation condition, the Q is dominated by structural and fluid-structure interaction losses. In this thesis, we set out to study the dominant energy dissipative mechanisms that are constituent of the experimentally observed loss (Q-factor) in two specific test geometries—uncapped and capped circular MEMS drumhead resonators. Considering the importance of various factors, we consider four important problems pertaining to the uncapped as well as capped resonators. In the first problem, the most important factors perhaps are the acoustic radiation losses emanating from the annular plate, and the effect of added mass effect on the natural frequencies of the annular plate. The second problem is to investigate the dominant contribution of squeeze film losses and acoustic radiation losses with respect to various natural frequencies of the annular plate. The third problem is to consider the effect of prestress on the natural frequencies of the annular plate and its associated fluid-structure interaction losses (quality factors due to squeeze film damping and acoustic radiation losses). The fourth problem is to study the dominant fluid-structure interaction losses and structural losses that are constituent of experimentally measured Q-factors of the encapsulated annular plate (conceptual representation of MEMS device under packaged conditions). In the first problem, we study the mode dependent acoustic radiation losses in an uncapped drumhead microresonator which is represented by a annular circular plate fixed at its outer edge, suspended over a fixed substrate. There are two main effects which are associated with such systems due to the fluid-structure interaction. First is the “added mass effect,” which reduces the effective resonance frequency of the structure. The second is the acoustic radiation loss from the top side of the resonator, that affects the quality factor of the vibrating structure. In deriving the analytical solution, we first obtain the exact mode shapes of the structure ignoring any effect of the surrounding fluid (air) on the mode shape. Subsequently, we use these mode shapes to study the effect of the surrounding fluid on the associated natural frequencies and the Q-factor. The effect of “added mass” on the frequencies of the structure is found to be negligible. However, the acoustic radiation losses found to be significant. Additionally, we found that the variation in Qac over the first few modes (< 40 MHz) is marked with a local maximum and a minimum. Beyond this range, Qac increases monotonically over the higher frequency modes. It is also found that such kind of variation can be described using different acoustics parameters. Finally, comparing the acoustics radiation loss based quality factor with the experimental results for the uncapped drumhead resonator, the acoustic damping dominates only at higher modes. Therefore, our second problem forms the basis of finding other fluid-related damping. In the second problem, we explore the fluid losses due to squeeze film damping in the uncapped drumhead micro resonator. In this case, the squeeze film loss is due to the flow of the fluid film between the bottom surface of the annular plate and the fixed substrate. Based on the literature survey, it is found that the squeeze film damping reduces with increase in the air-gap thickness and the operating frequencies respectively. However, the squeeze film effect can not be ignored at lower frequencies. In order to investigate the contribution of squeeze film damping in uncapped resonator, we determine squeeze-film damping based quality factor Qsq corresponding to different modes of the resonators using FEM based software, ANSYS. On comparing Qsq with the experiments, we found that Qsq matches well with the experiments corresponding to the lower modes. Therefore, it is found that Qsq dominates at low frequencies (< 20 MHz) and Qac plays significant role at high frequencies (> 40 MHz). Both types of damping should be considered while modeling the fluid damping in uncapped resonator. In the next study, we discuss the effects of prestress on the resonant frequencies and quality factor. In the third study, we discuss the applicability of thin-plate theory with prestress and membrane theory in computing the frequencies and quality factor due to acoustic and squeeze film losses in the uncapped drumhead resonator. In the first two studies, although the quality factor due to acoustic losses and the squeeze film captures the correct trend of the experimental results, there is a mismatch between the experimental and theoretical frequencies computed with added mass effect. In order to improve the computation of frequencies corresponding to measured modes, we first used membrane theory to predict the frequencies, and finally we quantify that there exists discrepancy between computed and the corresponding experimental frequencies with error of about 8–55%. Since, both the membrane as well as thin plate theory without prestress do not correctly model the frequencies, we used the thin plate theory with prestress. For a prestress level of 96 MPa, we found the match between the computed frequencies and the corresponding quality factors with the measured values. However, we also found that there exists strong dependence of prestress on the acoustic radiation loss, with decrease in the acoustic loss based quality factors with increase in the prestress level. In the subsequent problem, we focus on the computation of losses in capped drumhead resonator which leads to a design possibility of improving the quality factor by containing the acoustic radiation losses. In the fourth problem, we study the structural and fluid-structure interaction losses which are dominant constituent of net Q-factor observed in experiments due to encapsulation of uncapped drumhead resonator. Essentially, the geometry of the capped resonator constitutes upper and lower cavities subjected to fluid-structure interaction losses on both sides of the annular plate. The dominant fluid-structure interaction loss is found to be due to squeezing action acting simultaneously in the upper and lower cavities. However, as we go to the higher modes, squeeze film damping become very small and the damping due to structure related losses such as clamping and thermoelastic losses becomes significant. We found the thermoelastic damping to be the dominant source of structural damping at higher resonant modes, whereas, the clamping losses are found to be relatively smaller. Finally, on comparing the net quality factor with the experimental results, we observed that the squeeze film losses are dominant at lower frequencies, and thermoelastic losses dominate at the higher frequencies. However, there remains some discrepancy between theoretical and experimental Q-factors particularly over higher frequency range. Such discrepancy may be due to some unaccounted factors which may be explored to improve the modeling of damping in capped resonators. The emphasis of this work has been towards developing a comprehensive understanding of different dominant dissipative mechanisms, classified into the fluid-structure interaction and the structural losses, that are constituent of the Q-factor at various resonant modes of uncapped and capped drumhead resonators.

MEMS Sensors are widely used for sensing inertial displacements. The displacements arising out of acceleration /Coriolis effect are typically in the range of 1 nm-1 m. This work investigates the realization of high resolution MEMS inertial sensors using novel displacement sensing mechanisms. Capacitance sensing ASIC is developed as part of conventional electronics interface with MEMS sensor under the conventional CMOS-MEMS integration strategy. The capacitance sense ASIC based on Continuous Time Voltage scheme with coherent and non-coherent demodulation is prototyped on AMS 0.35 m technology. The ASIC was tested to sense C = 3.125 fF over a base of 2 pF using on-chip built-in test capacitors. Dynamic performance of this ASIC was validated by interfacing with a DaCM MEMS accelerometer. 200milli-g of acceleration (equivalent to a C = 2.8 fF) over an input frequency of 20Hz is measurable using the developed ASIC. The observed sensitivity is 90mV/g. The ASIC has several programmable features such as variation in trim capacitance (3.125 fF-12.5 pF), bandwidth selection (500 Hz-20 kHz) and variable gain options (2-100). Capacitance detection, a dominant sensing principle in MEMs sensors, experiences inherent limitation due to the role of parasitics when the displacements of interest are below 5 nm range. The capacitive equivalence ( C) for the range of displacements of the order of 5 nm and below would vary in the range atto-to-zepto farad. Hence there is a need to explore alternative sensing schemes which preferably yield higher sensitivity (than those offered by the conventional integration schemes) and are based on the principle of built-in transduction to help overcome the influence of parasitics on sensitivity. In this regard, 3 non-conventional architectures are explored which fall under the direct integration classification namely: (a) Sub-threshold based sensing (b) Fringe field based sensing and (c) Tunneling current based sensing. a) In Sub-threshold based sensing, FET with a suspended gate is used for displacement sensing. The FET is biased in the sub-threshold region of operation. The exponential modulation of drain current for a change in displacement of 1 nm is evaluated using TCAD, and the in uence of initial air-gap variation on the sensitivity factor ( ID=ID) is brought out. For 1% change in air gap displacement (i.e., TGap/TGap, the gap variation resulting due to the inertial force / mass loading) nearly 1050% change in drain current( ID=ID) is observed (considering initial air gaps of the order 100 nm). This validates the high sensitivity offered by the device in this regime of operation. A comparison of sensitivity estimate using the capacitive equivalence model and TCAD simulated model for different initial air-gaps in a FD-SOI FET is brought out. The influence of FDSOI FET device parameters on sensitivity, namely the variation of TSi, TBox, NA and TGap are explored. CMOS compatibility and fabrication feasibility of this architecture was looked into by resorting to the post processing approach used for validating the sub-threshold bias concept. The IMD layers of the Bulk FETs fabricated through AMS 0.35 technology were etched using BHF and IPA mixture to result in a free standing metal (Al) layers acting as the suspended gate. The performance estimate is carried out considering specific Equivalent Gap Thickness (EGT) of 573 nm and 235 nm, to help overcome the role of coupled electrostatics in influencing the sensitivity metric. The sensitivity observed by biasing this post processed bulk FET in sub-threshold is 114% ( ID=ID change) for a 59% ( d/d change). The equivalent C in this case is 370 aF. b) In Fringe eld based sensing approach, a JunctionLess FET (JLFET) is used as a depletion mode device and an out-of-plane gate displacement would help modulate the device pinch-o voltage due to fringe field coupling. The resulting change in the gate fringe field due to this displacement modulates the drain current of the JunctionLess FET. The displacement induced fringe field change (relative to the FET channel) brings about a distinct shift in the ID-VG characteristics of the JLFET. For displacement d = 2 nm, the JLFET with a channel doping of ND = 8X1018cm 3 and a bias point of VG = -47.7 V, 98% enhancement in sensitivity is observed in 3D TCAD simulations. The equivalent C in this case is 29 zF. The role of ground-planes in the device operation is explored. c) In the tunneling current based sensing approach, the beams fabricated using the SOI-MUMPS process are FIB milled so as to create very ne air gaps of the order of nearly 85 nm. Under high electric fields of the order > 8 MV/cm, the lateral displacement based tunneling sensor offers enhanced change in sensitivity for an induced external force at a fixed DC bias. When integrated as an array with varying electrode overlap, this technique can track displacements over a wide range. With the initial beam overlap as 1.2 m, for a lateral displacement of 1.2 m, a 100% change in sensitivity ( ID=ID) is observed. The effect of fringe field can be completely neglected here unlike its capacitive beam equivalent.

Different methods for the determination of cantilever properties in non-contact atomic force microscopy (NC-AFM) are under investigation. A key aspect is the determination of the cantilever stiffness being essential for a quantitative NC-AFM data analysis including the extraction of the tip-surface interaction force and potential. Furthermore, a systematic analysis of the displacement noise in the cantilever oscillation detection is performed with a special focus on the thermally excited cantilever oscillation. The propagation from displacement noise to frequency shift noise is studied under consideration of the frequency response of the PLL demodulator. The effective Q-factor of cantilevers depends on the internal damping of the cantilever as well as external influences like the ambient pressure and the quality of the cantilever fixation. While the Q-factor has a strong dependence on the ambient pressure between vacuum and ambient pressure yielding a decrease by several orders of magnitude, the pressure dependence of the resonance frequency is smaller than 1% for the same pressure range. On the other hand, the resonance frequency highly depends on the mass of the tip at the end of the cantilever making its reliable prediction from known cantilever dimensions difficult. The cantilever stiffness is determined with a high-precision static measurement method and compared to dimensional and dynamic methods. Dimensional methods suffer from the uncertainty of the measured cantilever dimensions and require a precise knowledge its material properties. A dynamic method utilising the measurement of the thermally excited cantilever displacement noise to obtain cantilever properties allows to characterise unknown cantilevers but requires an elaborative measurement equipment for spectral displacement noise analysis. Having the noise propagation in the NC-AFM system fully characterised, a proposed method allows for spring constant determination from the frequency shift noise at the output of the PLL demodulator with equipment already being available in most NC-AFM setups.