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Journal articles on the topic 'Micro-embossing'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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1

Wu, Cheng Hsien, Chen Hao Hung, and Ya Zhen Hu. "Parametric Study of Hot Embossing on Micro-Holes." Advanced Materials Research 74 (June 2009): 251–54. http://dx.doi.org/10.4028/www.scientific.net/amr.74.251.

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This report describes the application of hot embossing to produce parts with microstructure. An embossing machine, designed for microfabrication, was used to emboss PMMA and PC substrates. An insert with micro-holes of various diameters was applied in the hot embossing experiments. Effects of process parameters, such as embossing temperature, embossing force, embossing period and demolding temperature, on replicated heights were studied. Results show that replicated heights on smaller holes are smaller. Embossing temperature is the most important factor. Demolding temperature hardly affects the replication ability. Replicated heights increase with embossing period. The height can reach a very high value with a large enough embossing period.

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2

Du, L. Q., C. Liu, H. J. Liu, J. Qin, N. Li, and Rui Yang. "Design and Fabrication of Micro Hot Embossing Mold for Microfluidic Chip Used in Flow Cytometry." Key Engineering Materials 339 (May 2007): 246–51. http://dx.doi.org/10.4028/www.scientific.net/kem.339.246.

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Micro hot embossing mold of microfluidic chip used in flow cytometry is designed and microfabricated. After some kinds of microfabrication processes are tried, this paper presents a novel microfabrication technology of micro hot embossing metal mold. Micro metal mold is fabricated by low-cost UV-LIGA surface micro fabrication process using negative thick photoresist, SU-8. Different from other micro hot embossing molds, the micro mold with vertical sidewalls is fabricated by micro nickel electroforming directly on Nickel base. Based on the micro Nickel mold and automation fabrication system, high precision and mass-producing microfluidic chips have been fabricated and they have been used in flow cytometry

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3

Su, Qian, Jie Xu, Lei Shi, De Bin Shan, and Bin Guo. "Micro-Embossing Process in Ultrafine-Grained Pure Aluminum Processed by Equal-Channel Angular Pressing with Elevated Temperature." Key Engineering Materials 821 (September 2019): 244–49. http://dx.doi.org/10.4028/www.scientific.net/kem.821.244.

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Micro-embossing tests were performed on ultrafine-grained pure Al processed by equal-channel angular pressing (ECAP) with 100 μm width of female die at different deformation temperature ranging from 298 K to 523 K under a force of 5 kN. The filling height, surface topography and microstructure of the cross section were measured by confocal scanning laser microscopy (CSLM), scanning electron microscopy (SEM) and electron backscattered diffraction (EBSD), respectively. The effects of deformation temperature on formability of ultrafine-grained (UFG) pure Al during micro-embossing were analyzed. The results show that increase in deformation temperature can improve the formability of UFG pure Al on micro-embossing. Micro hot embossing of UFG pure aluminum is characterized by the rib sidewall, surface quality, and fully transferred patterns, which shows ultrafine-grained pure Al has potential application in micro-forming.

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4

Zhang, Xiang, Jiang Ma, Ran Bai, Qian Li, Bing Li Sun, and Chang Yu Shen. "Polymer Micro Hot Embossing with Bulk Metallic Glass Mold Insert." Advanced Materials Research 510 (April 2012): 639–44. http://dx.doi.org/10.4028/www.scientific.net/amr.510.639.

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Polymer microstructures are used more and more in many fields. Hot embossing is one of molding processing to achieve micro polymer components. In this paper, bulk metallic glass was selected as mold material to fabricate mold insert of micro hot embossing. Traditional UV-lithography and ICP-etching were used to achieve micro features on silicon wafer. And then, micro features were transferred from silicon wafer to bulk metallic glass mold insert above its glass transition temperature. Finally, applied bulk metallic glass mold insert to replicate polymer microstructure with hot embossing. Three commonly used thermoplastic polymers: high-density polyethylene (HDPE), polypropylene (PP) and polycarbonate (PC) were selected in this study. Experiments show that microstructures can have a good replication from bulk metallic glass mold insert to the thermoplastic polymer using hot embossing.

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5

Weng. "Development of Belt-Type Microstructure Array Flexible Mold and Asymmetric Hot Roller Embossing Process Technology." Coatings 9, no. 4 (April 22, 2019): 274. http://dx.doi.org/10.3390/coatings9040274.

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This study proposed the belt-type microstructure array flexible mold designed hot roller embossing process technology. An extrusion molding system was integrated with belt-type hot roller embossing process technology and, deriving the asymmetric principle as the basis of prediction, designed a belt-type microstructure array hot roller embossing process system. This study first focused on the design and manufacturing of a belt-type hot roller embossing process system (roll to belt-type). It then carried out system integration and testing, along with the film extrusion system, to fabrication microstructure array production. Hot embossing was used to replicate the array of the plastic micro lens as the microstructure mold. The original master mold was fabricated with micro electromechanical technology and the PC micro lens array as the microstructure (inner layer) film using the gas-assisted hot embossing technology. A microstructure composite belt and magnetic belt were produced on the hot roller embossing by an innovated coated casting technique. The forming accuracy of the belt-type microstructure array flexible mold hot roller embossing process and the prediction precision of numerically simulated forming were discussed. The proposed process technology is expected to effectively reduce the process cycle time with the advantages of being a fast and continuous process.

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6

Aizawa, Tatsuhiko, Kenji Wasa, Abdelrahman Farghali, and Hiroshi Tamagaki. "Plasma Printing of Micro-Punch Assembly for Micro-Embossing of Aluminum Sheets." Materials Science Forum 920 (April 2018): 161–66. http://dx.doi.org/10.4028/www.scientific.net/msf.920.161.

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This paper concerned with micro-embossing of micro-cavities and micro-grooves into aluminum sheets by CNC-stamping with use of the arrayed DLC multi-punches. Both SKD11 and AISI420 steel die substrates were prepared and DLC-coated with the thickness of 10 to 15 μm. This DLC coating worked as a punch material. The two dimensional micro-patterns were printed onto this DLC film by maskless lithography. The unprinted DLC films were removed by the plasma oxidation to leave the three dimensional DLC-punch array on the steel substrate. This micro-pillared and micro-grooved DLC-punches were placed into the cassette die set for micro-embossing process by using the table-top CNC stamper. The micro-circular patterns transformed to the micro-pillars in the DLC punch by the plasma oxidation. Through the CNC-micro-embossing, this micro-texture further transferred to micro-cavities in the aluminum sheet. The dimensional accuracy of embossed micro-textures by stamping was measured by SEM and three dimensional profilometer with comparison to the tailored micro-pattern and the DLC-punch array configuration.

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7

Li, Kangsen, Gang Xu, Xinfang Huang, Zhiwen Xie, and Feng Gong. "Manufacturing of Micro-Lens Array Using Contactless Micro-Embossing with an EDM-Mold." Applied Sciences 9, no. 1 (December 26, 2018): 85. http://dx.doi.org/10.3390/app9010085.

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Micro embossing is an effective way to fabricate a polymethyl methacrylate (PMMA) specimen into micro-scale array structures with low cost and large volume production. A new method was proposed to fabricate a micro-lens array using a micro-electrical discharge machining (micro-EDM) mold. The micro-lens array with different shapes was established by controlling the processing parameters, including embossing temperature, embossing force, and holding time. In order to obtain the friction coefficient between the PMMA and the mold, ring compression tests were conducted on the Shenzhen University’s precision glass molding machine (SZU’s PGMM30). It was found that the friction coefficient between the PMMA specimen and the mold had an interesting change process with increasing of temperature, which affected the final shape and stress distribution of the compressed PMMA parts. The results of micro-optical imaging of micro-lens array indicated that the radius of curvature and local length could be controlled by adjusting the processing parameters. This method provides a basis for the fabrication and application of micro-lens arrays with low-cost, high efficiency, and mass production.

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8

Tang, C. W., Y. C. Chang, T. T. Wu, J. C. Huang, and C. T. Pan. "Micro-Forming of Au₄₉Ag_5.5Pd_2.3Cu_26.9Si_16.3 Metallic Glasses in Supercooled Region." Advanced Materials Research 47-50 (June 2008): 266–69. http://dx.doi.org/10.4028/www.scientific.net/amr.47-50.266.

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This study presents the hot embossing micro-forming of the V-groove and micro-lens array on the Au-based bulk metallic glasses (BMGs). The thermal and thermomechanical properties were firstly investigated by using thermomechanical analysis (TMA). Based on the results, the temperature of the hot embossing experiment was set at 177oC. The formability of the Au-based BMGs were evaluated under different embossing pressures and time durations, and the results showed the increasing trend of the forming quality with increasing forming pressure and time. The Au-based BMGs are considered to be promising for micro-electro-mechanical system applications.

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9

Shen, Yung Kang, Yi Lin, Dong Yea Sheu, Ming Der Ger, Yi Han Hu, Rong Hong Hong, and Shung Mang Wang. "Study on Micro Fabrication of Mold Insert for Microlens Arrays by Micro Dispensing." Key Engineering Materials 364-366 (December 2007): 48–52. http://dx.doi.org/10.4028/www.scientific.net/kem.364-366.48.

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This work used micro dispensing technology to fabricate the master of microlens array, then uses electroforming technology to replication the Ni mold insert of microlens array and finally used micro hot embossing to replicate the plastic microlens array. This work used the Si10 resin by AutoStrade Company for dispensing material. The resin material was exposed to 80W halogen light. The resin will be hardened and become convex by surface tension effect on exposition. It can be used as the master of microlens array. This work sputtered a silver layer of 150 nm thick on the master for conducting electricity layer. The electroforming technology replicateed on the Ni mold insert from the master of microlens array. Finally, the micro hot embossing technology was used to replicate the molded microlens array. The molding experiment used PMMA and PC optical film. The experiment studied the influence of processing parameters of hot embossing by processing temperature, embossing pressure, embossing time and de-molding temperature. This work used the Taguchi’s Method to search the best processing parameter for molded microlens array. This work used the microscope, surface profiler and SEM to measure the surface profile of master, mold insert and molded microlens array. This work also used AFM to measure the surface roughness of master, mold insert and molded microlens array. In addition, this work measured the optical strength and the focal length to discuss optical characteristics of molded microlens array.

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10

Lee, Hye Jin, Nak Kyu Lee, and Hyoung Wook Lee. "A Study on the Micro Property Testing of Micro Embossing Patterned Metallic Thin Foil." Key Engineering Materials 345-346 (August 2007): 335–38. http://dx.doi.org/10.4028/www.scientific.net/kem.345-346.335.

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In this paper, Experimental results on the measurement of mechanical properties of fine patterns in the MEMS structure are described. The mechanical properties of embossing patterns on metallic thin foil is measured using the nano indentation system, that is developed by Korea Institute of Industrial Technology(KITECH). These micro embossing patterns are fabricated using CIP(Cold Isostatic Press) process on micro metallic thin foils(Al-1100) that are made by rolling process. These embossing patterned metallic thin foils(Al-1100) are used in the reflecting plate of BLU(Back Light Unit) and electrical/mechanical MEMS components. If these mechanical properties of fine patterns are utilized in a design procedure, the optimal design can be achieved in aspects of reliability as well as economy.

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11

Su, B., D. Zhang, and T. W. Button. "Embossing of ceramic micro-pillar arrays." Journal of the European Ceramic Society 32, no. 12 (September 2012): 3345–49. http://dx.doi.org/10.1016/j.jeurceramsoc.2012.04.009.

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12

Fu, G., S. B. Tor, N. H. Loh, and D. E. Hardt. "Micro-hot-embossing of 316L stainless steel micro-structures." Applied Physics A 97, no. 4 (August 1, 2009): 925–31. http://dx.doi.org/10.1007/s00339-009-5363-3.

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13

YOUN, Sung-Won, Masaharu TAKAHASHI, Kouhei HASEGAWA, and Ryutaro MAEDA. "Micro Embossing of Borosilicate Glass Using Quartz Mold Prepared by Hot Embossing." Journal of the Japan Society for Technology of Plasticity 50, no. 586 (2009): 1019–23. http://dx.doi.org/10.9773/sosei.50.1019.

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14

Liang, Yong, Chong Liu, Huan Li Sun, Jing Min Li, Jun Shan Liu, and Xian Ni Gao. "Experimental Study on Hot Embossing of Micro/Nano Grating." Advanced Materials Research 60-61 (January 2009): 450–55. http://dx.doi.org/10.4028/www.scientific.net/amr.60-61.450.

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During hot embossing process of polymer MEMS devices, the parameters such as temperature, pressure and time are important for the duplication precision of patterns. In this work, a novel method of hot embossing lithography for replication of multiple nano bar structure mould was conducted. The effects of hot embossing temperature and pressure on fabrication precision were studied. Linewidth of the pattern on the mould is from 71nm to 980nm. The replicas of nano bar structure were fabricated on the PMMA (polymer methyl methacrylate) layer with silicon substrate. The effects of hot embossing and demoulding temperature on replicating quality were also discussed. Experimental results indicate that higher demoulding temperature help to lessen PMMA leftover and improve the duplication quality. The hot embossing and dmoulding temperature of 110°C～120°C and 60°C～70°C were obtained to produce high quality duplication of multiple nano bar structures. Micro-grating replicas were also fabricated and demonstrated in this paper.

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15

YOUN, SUNG-WON, CHIEKO OKUYAMA, MASHARU TAKAHASHI, and RYUTARO MAEDA. "REPLICATION OF NANO/MICRO QUARTZ MOLD BY HOT EMBOSSING AND ITS APPLICATION TO BOROSILICATE GLASS EMBOSSING." International Journal of Modern Physics B 22, no. 31n32 (December 30, 2008): 6118–23. http://dx.doi.org/10.1142/s0217979208051674.

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Glass hot-embossing is one of essential techniques for the development of high-performance optical, bio, and chemical micro electromechanical system (MEMS) devices. This method is convenient, does not require routine access to clean rooms and photolithographic equipment, and can be used to produce multiple copies of a quartz mold as well as a MEMS component. In this study, quartz molds were prepared by hot-embossing with the glassy carbon (GC) masters, and they were applied to the hot-emboss of borosilicate glasses. The GC masters were prepared by dicing and focused ion beam (FIB) milling techniques. Additionally, the surfaces of the embossed quartz molds were coated with molybdenum barrier layers before embossing borosilicate glasses. As a result, micro-hot-embossed structures could be developed in borosilicate glasses with high fidelity by hot embossing with quartz molds.

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16

Lee, Seung-Hyun, Jeongdai Jo, Kwang-Young Kim, and Young-Man Choi. "Recent Research Trend of Micro Hot-Embossing." Journal of the Korean Society for Precision Engineering 35, no. 11 (November 1, 2018): 1027–34. http://dx.doi.org/10.7736/kspe.2018.35.11.1027.

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17

Mekaru, Harutaka, Hiroshi Goto, and Masaharu Takahashi. "Development of ultrasonic micro hot embossing technology." Microelectronic Engineering 84, no. 5-8 (May 2007): 1282–87. http://dx.doi.org/10.1016/j.mee.2007.01.235.

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18

Shan, Xue Chuan, Ryutaro Maeda, and Yoichi Murakoshi. "Micro Hot Embossing for Replication of Microstructures." Japanese Journal of Applied Physics 42, Part 1, No. 6B (June 30, 2003): 3859–62. http://dx.doi.org/10.1143/jjap.42.3859.

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19

Idei, Kazuyoshi, Harutaka Mekaru, Yoshihiro Fukuda, Hiroaki Takeda, and Tadashi Hattori. "Precise Micro Pattern Replication Using Hot Embossing." Proceedings of the Machine Design and Tribology Division meeting in JSME 2004.4 (2004): 69–70. http://dx.doi.org/10.1299/jsmemdt.2004.4.69.

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20

IDEI, Kazuyoshi, Harutaka MEKARU, Hiroaki TAKEDA, and Tadashi HATTORI. "Precise Micro Pattern Replication by Hot Embossing." JSME International Journal Series A 49, no. 1 (2006): 69–73. http://dx.doi.org/10.1299/jsmea.49.69.

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21

Emadinia, Omid, Maria Teresa Vieira, and Manuel Fernando Vieira. "Micro Powder Hot Embossing of Aluminum Feedstock." Journal of Materials Engineering and Performance 29, no. 5 (May 2020): 3395–403. http://dx.doi.org/10.1007/s11665-020-04869-9.

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22

Chen, X., Z. Zhang, and Q. Gao. "PMMA Micro-Pillar Forming in Micro Channel by Hot Embossing." International Polymer Processing 31, no. 3 (July 30, 2016): 364–68. http://dx.doi.org/10.3139/217.3207.

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23

Hong, Hyeonjun, and Dong Sung Kim. "Robust Topographical Micro-Patterning of Nanofibrillar Collagen Gel by In Situ Photochemical Crosslinking-Assisted Collagen Embossing." Nanomaterials 10, no. 12 (December 21, 2020): 2574. http://dx.doi.org/10.3390/nano10122574.

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The topographical micro-patterning of nanofibrillar collagen gels is promising for the fabrication of biofunctional constructs mimicking topographical cell microenvironments of in vivo extracellular matrices. Nevertheless, obtaining structurally robust collagen micro-patterns through this technique is still a challenging issue. Here, we report a novel in situ photochemical crosslinking-assisted collagen embossing (IPC-CE) process as an integrative fabrication technique based on collagen compression-based embossing and UV–riboflavin crosslinking. The IPC-CE process using a micro-patterned polydimethylsiloxane (PDMS) master mold enables the compaction of collagen nanofibrils into micro-cavities of the mold and the simultaneous occurrence of riboflavin-mediated photochemical reactions among the nanofibrils, resulting in a robust micro-patterned collagen construct. The micro-patterned collagen construct fabricated through the IPC-CE showed a remarkable mechanical resistivity against rehydration and manual handling, which could not be achieved through the conventional collagen compression-based embossing alone. Micro-patterns of various sizes (minimum feature size <10 μm) and shapes could be obtained by controlling the compressive pressure (115 kPa) and the UV dose (3.00 J/cm2) applied during the process. NIH 3T3 cell culture on the micro-patterned collagen construct finally demonstrated its practical applicability in biological applications, showing a notable effect of anisotropic topography on cells in comparison with the conventional construct.

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24

Zhao, Jie, and Yi Qin. "Hot embossing of polypropylene micro-tubes into functional tubular components with controlled inner-pore sizes." MATEC Web of Conferences 190 (2018): 10005. http://dx.doi.org/10.1051/matecconf/201819010005.

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To meet ever-increasing demands on the micro-components for medical and non-medical applications, a new micro-shaping technology - “hot embossing of micro-tubes”, had been developed for the forming of polymeric tubular micro-components. The paper presents the results from the forming of Polypropylene(PP) micro-tubes with outer diameters of 1.3mm and inner diameters 0.6mm, to achieve various reduced inner-features. The study was effected by combining experiment, numerical simulation and SEM analysis. FE simulation was implemented by using the material data obtained from the material characterisation tests. The forming experiment was conducted with a high-precision hot-embossing machine, developed in-house, with automated handling and good reliability and repeatability. The Polypropylene (PP) micro-tubes were successfully formed into the desired features at the temperatures of 60°C and 100°C respectively. The influences of the parameters/factors, such as tool design, temperature, forming pressure and holding time, on the quality of the shaped parts, are discussed in details. Based on this study, it is concluded that PP is an ideal candidate material among the polymeric materials for hot embossing of tubular micro-components, due to its good ductility, low transition temperature and low viscosity. Keywords: Micro forming, Manufacturing process, Tool geometry

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Shiratori, Tomomi, Tatsuhiko Aizawa, Yasuo Saito, and Kuniaki Dohda. "Fabrication of Micro-Punch Array by Plasma Printing for Micro-Embossing into Copper Substrates." Materials 12, no. 16 (August 19, 2019): 2640. http://dx.doi.org/10.3390/ma12162640.

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Copper substrates were wrought to have micro-grooves for packaging by micro-stamping with use of a AISI316 stainless steel micro-punch array. The micro-texture of this arrayed punch was first tailored and compiled into CAD data. A screen film was prepared to have the tailored micro-pattern in correspondence to the CAD data. A negative pattern to this screen was printed directly onto the AISI316 die substrate. This substrate was plasma nitrided at 673 K for 14.4 ks. The unprinted die surfaces were selectively nitrogen super-saturated to have sufficiently high corrosion toughness and hardness; other surfaces were masked by the prints. The two-dimensional micro-pattern on the screen was transformed into a three-dimensional nitrogen supersaturated micro-texture embedded in the AISI316 die. The printed surfaces were selectively sand-blasted to fabricate the micro-textured punch array for micro-embossing. A uniaxial compression testing machine was utilized to describe the micro-embossing behavior in copper substrates and to investigate how the micro-texture on the die was transcribed to the copper. The micro-punch array in this study consisted of three closed loop heads with a width of 75 µm and a height of 120 µm after plasma nitriding and sand-blasting. Since the nitrogen supersaturated heads had sufficient hardness against the blasting media, the printed parts of AISI316 die were removed. The micro-embossing process was described by comparison of the geometric configurations between the multi-punch array and the embossed copper plate.

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26

Cheng, Hsin Chung, Chiung Fang Huang, Yi Lin, and Yung Kang Shen. "Fabrication of Micropattern of Plastic Film Using Ultrasonic Micro Embossing." Advanced Materials Research 912-914 (April 2014): 141–44. http://dx.doi.org/10.4028/www.scientific.net/amr.912-914.141.

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This study indicates the micropattern of molded plastic film from a mold insert using ultrasonic micro embossing. A mold insert and plastic film are heated above the glass transition temperature of plastic, and the softened plastic is flowed into the micropattern of a mold insert by applying pressure via a conventional technique. A longitudinal ultrasonic wave is added to the ultrasonic micro embossing process. The longitudinal ultrasonic wave generated by an ultrasonic system at a frequency of 35 KHz, has amplitude of 20 μm and output power of 900 W. The micropatterns of the Ni mold insert are groove-shaped and they are 2-μm wide and 200-nm deep. The Polypropylene (PP) is chosen as the replication materials. This study identifies the replication properties of the plastic film using different process parameters (working pressure, ultrasonic pressure, packing pressure, working time, ultrasonic time and packing time). Results of this study demonstrate that ultrasonic time is the most important process parameter for ultrasonic micro embossing.

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27

He, Yong, WenBin Wu, Ting Zhang, and JianZhong Fu. "Micro structure fabrication with a simplified hot embossing method." RSC Advances 5, no. 49 (2015): 39138–44. http://dx.doi.org/10.1039/c5ra01410g.

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Chang, Chih-Yuan. "Nonuniform Heating Method for Hot Embossing of Polymers with Multiscale Microstructures." Polymers 13, no. 3 (January 21, 2021): 337. http://dx.doi.org/10.3390/polym13030337.

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The hot embossing of polymers is one of the most popular methods for replicating high-precision structures on thermoplastic polymer substrates at the micro-/nanoscale. However, the fabrication of hybrid multiscale microstructures by using the traditional isothermal hot embossing process is challenging. Therefore, in this study, we propose a novel nonuniform heating method for the hot embossing of polymers with multiscale microstructures. In this method, a thin graphene-based heater with a nonuniform heating function, a facility that integrates the graphene-based heater and gas-assisted hot embossing, and a roll of thermoplastic film are employed. Under appropriate process conditions, multiscale polymer microstructure patterns are fabricated through a single-step hot embossing process. The quality of the multiscale microstructure patterns replicated is uniform and high. The technique has great potential for the rapid and flexible fabrication of multiscale microstructure patterns on polymer substrates.

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29

Shiratori, Tomomi, Tatsuhiko Aizawa, Yasuo Saito, and Kenji Wasa. "Plasma Printing of an AISI316 Micro-Meshing Punch Array for Micro-Embossing onto Copper Plates." Metals 9, no. 4 (March 30, 2019): 396. http://dx.doi.org/10.3390/met9040396.

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Packaging using thermoplastic molding for hollowed GaN chips were requested for a leak-proof micro-joining between plastic molds and copper-based substrates. The design and engineering of micro-textures is a key technology for putting leak-proof packaging into practice. In the present paper, a micro-meshing punch array was prepared using plasma-nitriding-assisted printing. Two-dimensional original patterns were screen-printed onto an AISI316 die substrate and plasma nitrided at 673 K for 14.4 ks (or 4 h). The unprinted surfaces were selectively nitrogen super-saturated to have more nitrogen content than 5 mass% and a higher hardness than 1200 HV. The printed surfaces were selectively sand blasted to fabricate the micro-meshing punch array for micro-embossing. A computer numerically controlled stamping system was utilized to describe the micro-embossing behavior onto copper substrates and to investigate how the micro-textures on the array was transcribed onto the copper. Reduction of takt time as well as flexibility in the micro-grooving were discussed with reference to the picosecond laser machining and mechanical milling processes.

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30

Kuo, Chil-Chyuan, and Hsiu-Ju Hsu. "Micro-Hot Embossing of Fresnel Lens Using Precision Micro-Featured Mold." Materials and Manufacturing Processes 28, no. 11 (November 2, 2013): 1228–33. http://dx.doi.org/10.1080/10426914.2013.811748.

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31

Hira, Shin-Ichiro, Masato Yoshioka, Zhu Qing Wang, Yu Zhang, and Yutaka Nobukawa. "Study on Replication of Micro Channel Structures onto Polytetrafluoroethylene (PTFE) Substrate Employing Two-Stage Hot Embossing." Advanced Materials Research 76-78 (June 2009): 526–31. http://dx.doi.org/10.4028/www.scientific.net/amr.76-78.526.

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Replication of micro structures on a polymer substrate employing two-stage hot embossing is described in this paper. Linear channels with rectangular cross section were fabricated on a master mold of a brass plate by means of a computer numerical control (CNC) machining center using a micro end mill. In the first embossing process, the master mold with concavity features was embossed on a polycarbonate (PC) plate in order to make a “polymer replication mold”. Polytetrafluoroethylene (PTFE) was chosen as a material of polymer substrate used in the second embossing process. The replicated structure on PTFE substrate was observed and each dimension of its cross-sectional shape was also measured in order to assess the replication accuracy. According to the results, it was found that the depth of a replicated channel was near 90 % of that on the master mold. But roundness at each corner could be also found due to the insufficiency of plastic flow. Furthermore the deformation of the structures on a replication mold of PC before and after 2nd hot embossing process was also examined. As a result, it was found that the deformation ratio at temperatures below 145 oC was roughly smaller than 10 %.

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32

Huang, Chiung Fang, Jeou Long Lee, Yung Kang Shen, Yi Lin, and Chih Wei Wu. "Precision Transfer and Replication of Ultrasonic Nanoimprint." Advanced Materials Research 47-50 (June 2008): 411–14. http://dx.doi.org/10.4028/www.scientific.net/amr.47-50.411.

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This study succeeds to replicate a micro-feature by ultrasonic nanoimprint. The conjunction effect of the pressure and the ultrasonic vibration enables flowing of plastic into a more precise micro-feature of the metal mold. The longitudinal wave generated by an ultrasonic system of the frequency 35KMz and output power 900W. The micro-feature of the Ni mold insert used in the experiment is a groove shape. The groove’s width is 49 µm and its depth is 25 µm. The PMMA, PC and PP are chosen with the replication materials. This study also discusses the replication properties of plastic film by different processing parameters (delay pressure, fusion pressure, embossing pressure, delay time, fusion time and embossing time).

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Sun, Huan Li, Chong Liu, M. M. Li, Jun Sheng Liang, and H. H. Chen. "Study on Replication of Densely Patterned, High-Depth Channels on a Polymer Substrate Using Hot Embossing Techniques." Materials Science Forum 628-629 (August 2009): 411–16. http://dx.doi.org/10.4028/www.scientific.net/msf.628-629.411.

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Micro hot embossing process is a cost-effective method for parallel replication of polymer microstructures. To study the effect of hot embossing and demoulding parameters on the replication accuracy of the polymer microstructure, densely patterned and high-depth channels on 50mm×50mm polymer substrates were fabricated by hot embossing in this paper. Experimental results showed that the replication accuracy of the microstructure increased with the increasing of hot embossing temperature and the thickness of polymer substrates. It can be found that demoulding became more difficult when replication accuracy increased. The reason was that higher replication accuracy resulted in larger contact area between the replica and the embossing mold. The demoulding problem could be solved by rising demoulding temperature. However, overhigh demouding temperature (110°C) would lead to round corners at the edges of the ribs. Experimental results also showed that very small channel widths and depths errors (less than 1.2%) of the microstructures with 2mm thickness substrates could be achieved, when embossing and demoulding temperatures were set to 120°C and 100°C, respectively.

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He, Xiao Xiang, Xiu Ting Zheng, Da Ming Wu, Ya Jun Zhang, Jian Zhuang, and Yang Zhou. "Effect of Aspect Ratio of Micro Sphere Lens Arrays on the Optical Property of Diffuser." Advanced Materials Research 335-336 (September 2011): 147–52. http://dx.doi.org/10.4028/www.scientific.net/amr.335-336.147.

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The effect of the aspect ratio of micro sphere lens arrays on the optical properties of diffuser including transmittance and haze have been simulated by the LightTools software, and the results show that with the increasing of the aspect ratio, the haze rises first and drops later while the transmittance decreases all the time. Later, the mold with uniform micro sphere lens arrays arranged in regular triangle has been fabricated successfully by the ball embossing method. Then, the micro sphere lens arrays diffuser with aspect ratio of 0.19, 0.23, 0.26 and 0.29 have been made using the hot embossing method in polypropylene (PP) substrate. Last, haze and transmittance of the micro sphere lens arrays PP diffuser made are verified both by experiment and simulation and the results of experiment and simulation are consistent well.

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Schubert, A., S. Gross, J. Edelmann, and B. Schulz. "Laser micro structuring of high-stressed embossing dies." Physics Procedia 5 (2010): 261–68. http://dx.doi.org/10.1016/j.phpro.2010.08.145.

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Choi, C. H., M. W. Lee, B. H. O, S. G. Lee, S. G. Park, and E. H. Lee. "Fabrication of micro-photonic devices using embossing technique." Microelectronic Engineering 83, no. 4-9 (April 2006): 1336–38. http://dx.doi.org/10.1016/j.mee.2006.01.057.

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Peng, Linfa, Yujun Deng, Peiyun Yi, and Xinmin Lai. "Micro hot embossing of thermoplastic polymers: a review." Journal of Micromechanics and Microengineering 24, no. 1 (December 12, 2013): 013001. http://dx.doi.org/10.1088/0960-1317/24/1/013001.

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MURAKOSHI, Y., X. C. SHAN, and R. MAEDA. "APPLICATION OF MICRO HOT EMBOSSING FOR MEMS STRUCTURES." International Journal of Computational Engineering Science 04, no. 03 (September 2003): 617–20. http://dx.doi.org/10.1142/s1465876303001897.

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He, Yong, Jian-Zhong Fu, and Zi-Chen Chen. "Optimization of control parameters in micro hot embossing." Microsystem Technologies 14, no. 3 (December 20, 2007): 325–29. http://dx.doi.org/10.1007/s00542-007-0497-8.

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Jiang, Guiyang, Chunwei Wang, Zijin Liu, Yinghao Zhai, Yong Zhang, Jie Jiang, Nobuhiro Moriguchi, Jun Zhu, and Yoshihiro Yamana. "Characterization of polypropylene/hydrogenated styrene-isoprene-styrene block copolymer blends and fabrication of micro-pyramids via micro hot embossing of blend thin-films." RSC Advances 5, no. 112 (2015): 92212–21. http://dx.doi.org/10.1039/c5ra17934c.

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Polypropylene (PP)/hydrogenated styrene-isoprene-styrene block copolymer (HYBRAR) blends were proposed as a new material for the fabrication of optical thin-films with regular micro-pyramids via the micro hot embossing of blend thin-films.

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He, Yong, Ting Zhang, Jian Zhong Fu, and Zi Chen Chen. "Experimental Study on the Fabrication of the Light Guide Plate with Hot Embossing Method." Applied Mechanics and Materials 37-38 (November 2010): 448–52. http://dx.doi.org/10.4028/www.scientific.net/amm.37-38.448.

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To improve the quality of the light guide plate (LGP) made by injection molding, a fabrication method based on hot embossing was proposed. The silicon mold of the LGP with micro pyramid array was fabricated by wet chemical etching. The experiments of embossing the LGP were performed with a self-designed hot embossing machine. Orthogonal method was used to analyze the imprint pressure, the holding time, the imprint temperature and the width of pyramid with respect to the accuracy of replication (AOR). The experimental results show that the imprint temperature has the greatest effect on the AOR, followed by the imprint pressure and the holding time, while the width of micro pyramid has the minimal effect on the AOR. The increase of imprint temperature can obviously improve the pattern filling quality in the lower imprint pressure (0.7MPa). At last the optimal process parameters were obtained with the imprint pressure of 0.9MPa, the holding time of 5min and the imprint temperature of 130°C.

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Kolew, Alexander, Daniel Münch, Karsten Sikora, and Matthias Worgull. "Hot embossing of micro and sub-micro structured inserts for polymer replication." Microsystem Technologies 17, no. 4 (December 24, 2010): 609–18. http://dx.doi.org/10.1007/s00542-010-1182-x.

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IDEI, K., H. MEKARU, H. TAKEDA, and T. HATTORI. "P6: Precise Micro Pattern Replication by Hot Embossing(SHORT ORAL PRESENTATION FOR POSTERS I)." Proceedings of the JSME Materials and Processing Conference (M&P) 2005 (2005): 16–17. http://dx.doi.org/10.1299/jsmeintmp.2005.16_6.

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Nguyen, Lan Phuong, Ming Hui Wu, and Ching Hua Hung. "Effect of Ultrasonic Vibration on Increasing Embossing Speed during Hot Glass Embossing Process." Applied Mechanics and Materials 889 (March 2019): 71–79. http://dx.doi.org/10.4028/www.scientific.net/amm.889.71.

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Nowadays, microstructures have an important role in optical products as well as in optical systems. Beside machining methods, hot glass embossing is recently a novel technology to manufacture microstructures in optical components with high quality and low cost. Especially, this technology has been assisted efficiently by ultrasonic vibration. Previous studies showed that high energy of ultrasonic vibration would lead to the temperature rise inside the glass so that the material was easily embossed into the microcavities on the mold. Thus, micro-formability of glass material has been especially improved efficiently. However, there were no studies focusing on effect of ultrasonic vibration on embossing speed in this process. Therefore, this work is aimed to utilize ultrasonic vibration to improve the embossing speed of hot glass embossing process. K-PSK100 optical glass was used as the material for all experiments. Pyramid array with size of 30 × 30 × 20 μm and period of 150 μm was created on the mold. Microstructure hot embossing experiments were conducted for both conventional process (without ultrasonic vibration) and ultrasonic vibration-assisted process (frequency of 35 kHz and amplitude of 3 μm). By fixing the embossing temperature of 430 °C, the embossing speeds of 0.05 mm/min, 0.10 mm/min and 0.15 mm/min were applied, respectively. Experimental results showed that in case of conventional process, the faster embossing speed, the smaller final height of pyramid structures. Nevertheless, this obstacle was resolved by ultrasonic vibration. Under heating effect of ultrasonic vibration, the glass still filled well into the pyramid cavities on the mold even when the high embossing speed was applied. Measurements indicated that in the same experimental conditions (temperature and speed), ultrasonic vibration could improve the filling ability of the glass to 18 %. This finding could be used to optimize the experimental conditions to increase the productivity of the microstructure hot glass embossing process.

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Shin, Hong Gue, Heon Young Kim, and Byeong Hee Kim. "Nano Molding Technology for Optical Storage Media with Large-Area Nano-Pattern." Key Engineering Materials 364-366 (December 2007): 925–30. http://dx.doi.org/10.4028/www.scientific.net/kem.364-366.925.

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Nano hot or thermal embossing has many advantages of comparatively few process steps, simple operation, relatively low tooling cost and high replication accuracy for small features. However, because of its long processing time, it has been known as being less competitive than nano injection molding. In order to overcome the weakness of long processing time, the high speed nano hot embossing system has been developed and its characteristics were investigated. Nanopatterned stampers made of Ni and Si were fabricated by the laser mastering and electroforming process and the DRIE and LPCVD or thermal oxidation process respectively. In order to make the processing time shorter and get relatively higher aspect ratio nano/micro features, especially, the temperatures of the molds were controlled actively and precisely during the embossing process. Through various experiments, nano embossing parameters, such as temperature, pressure and processing time, are optimized and the high aspect ratio nano features could be obtained.

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Herrmann, Marius, Björn Beckschwarte, Henning Hasselbruch, Julian Heidhoff, Christian Schenck, Oltmann Riemer, Andreas Mehner, and Bernd Kuhfuss. "Diamond-Like-Carbon Coated Dies for Electromagnetic Embossing." Materials 13, no. 21 (November 3, 2020): 4939. http://dx.doi.org/10.3390/ma13214939.

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Electromagnetic forming is a high-speed process, which features contactless force transmission. Hence, punching operations can be realized with a one-sided die and without a mechanical punch. As the forces act as body forces in the part near the surface, the process is especially convenient for embossing microstructures on thin sheet metals. Nevertheless, the die design is critical concerning wear like adhesion. Several die materials were tested, like aluminum, copper as well as different steel types. For all die materials adhesion phenomena were observed. To prevent such adhesion an a-C:H-PVD (Physical Vapor Deposition)-coating was applied to steel dies (X153CrMoV12) and tested by embossing aluminum sheets (Al99.5). By this enhancement of the die adhesion was prevented. Furthermore, the die surface was structured with tribology-effective patterns that were generated by micro hard milling. The embossing quality was topographically analyzed with respect to different initial surface states of the sheets. It was identified that thicker sheets facilitate better embossing results. Moreover, the initial sheet surface has a decisive influence on the embossing quality, whereby the characteristic of the topography showed different susceptibility on the initial sheet surface state.

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Shan, X. C., T. Ikehara, Y. Murakoshi, and R. Maeda. "Applications of micro hot embossing for optical switch formation." Sensors and Actuators A: Physical 119, no. 2 (April 2005): 433–40. http://dx.doi.org/10.1016/j.sna.2004.09.026.

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Yeo, Lip Pin, Sum Huan Ng, Zhenfeng Wang, Zhiping Wang, and Nicolaas Frans de Rooij. "Micro-fabrication of polymeric devices using hot roller embossing." Microelectronic Engineering 86, no. 4-6 (April 2009): 933–36. http://dx.doi.org/10.1016/j.mee.2008.12.021.

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Li, Kangsen, Gang Xu, Hexi Luo, Xiaohua Liu, and Feng Gong. "Glass flow behaviors in micro-channels during hot embossing." Ceramics International 46, no. 13 (September 2020): 21517–26. http://dx.doi.org/10.1016/j.ceramint.2020.05.253.

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Kolew, A., M. Heilig, M. Schneider, D. Münch, R. Ezzat, N. Schneider, and M. Worgull. "Hot embossing of transparent high aspect ratio micro parts." Microsystem Technologies 20, no. 10-11 (December 5, 2013): 1967–73. http://dx.doi.org/10.1007/s00542-013-2021-7.

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