Relevant bibliographies by topics / Micro-hole drilling with femtosecond laser

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'Micro-hole drilling with femtosecond laser'

Author: Grafiati
Published: 4 June 2021
Last updated: 11 February 2022

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Journal articles on the topic "Micro-hole drilling with femtosecond laser"

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Huang, Huan, Lih-Mei Yang, and Jian Liu. "Micro-hole drilling and cutting using femtosecond fiber laser." Optical Engineering 53, no. 5 (2014): 051513. http://dx.doi.org/10.1117/1.oe.53.5.051513.

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Jiao, L., Eyk Ng, L. M. Wee, and Hong Yu Zheng. "Parametric Study of Femtosecond Pulses Laser Hole Drilling of Silicon Wafer." Advanced Materials Research 74 (June 2009): 273–77. http://dx.doi.org/10.4028/www.scientific.net/amr.74.273.

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Clark MXR femtosecond (fs) laser micro structuring with pulse duration of 200fs up to a wavelength of 1030nm with a nominal frequency of 1 KHz on silicon wafer was studied in air using the direct focusing technique. The three steps of laser drilling process, namely hole entrance, spatter formation and hole exit, were conducted to investigate the laser parameters such as laser power, focus position, focus lens and number of pulses and their effects on the drilling hole geometry and spatter characteristic. The results show that the minimum entrance diameter is achieved while Zf =-0.2mm. It was e
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JIAO, L., E. Y. K. NG, H. ZHENG, and L. M. WEE. "STATISTICAL ANALYSIS OF FEMTOSECOND PULSES LASER ON HOLE DRILLING OF SILICON WAFER." Surface Review and Letters 18, no. 01n02 (2011): 39–45. http://dx.doi.org/10.1142/s0218625x11014461.

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This study investigated the relationship and parameters interactions between five independent variables in laser percussion drilling of micro-hole. Experiments were conducted on single crystal silicon wafer with material thickness of 725 μm using femtosecond (fs) laser with wavelength of 775 nm and pulse duration of 200 fs. Laser power, focus position, number of pulses, workpiece temperature and assist liquid were selected as independent process variables. Taguchi L18 orthogonal array was applied to design the experiments. The drilling process was evaluated in terms of entrance hole diameter a
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Wang Yuqian, 王禹茜, 张军战 Zhang Junzhan, 刘永胜 Liu Yongsheng, 杨小君 Yang Xiaojun, 李玮楠 Li Weinan, and 王春辉 Wang Chunhui. "Effect of Femtosecond Laser Parameters on TiC Ceramic Micro-Hole Drilling." Chinese Journal of Lasers 41, no. 10 (2014): 1003010. http://dx.doi.org/10.3788/cjl201441.1003010.

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Ran, An, Li Yan, Dou Yan-Ping, Fang Ying, Yang Hong, and Gong Qi-Huang. "Laser Micro-Hole Drilling of Soda-Lime Glass with Femtosecond Pulses." Chinese Physics Letters 21, no. 12 (2004): 2465–68. http://dx.doi.org/10.1088/0256-307x/21/12/040.

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Xia Bo, 夏博, 姜澜 Jiang Lan, 王素梅 Wang Sumei, 闫雪亮 Yan Xueliang, and 刘鹏军 Liu Pengjun. "Femtosecond Laser Drilling of Micro-Holes." Chinese Journal of Lasers 40, no. 2 (2013): 0201001. http://dx.doi.org/10.3788/cjl201340.0201001.

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Jia, Hai-Ni, Xiao-Jun Yang, Wei Zhao, Hua-Long Zhao, Xu Du, and Yong Yang. "Femtosecond Laser Pulses for Drilling the Shaped Micro-Hole of Turbine Blades." Chinese Physics Letters 30, no. 4 (2013): 044202. http://dx.doi.org/10.1088/0256-307x/30/4/044202.

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Jiang, Hao, Caiwen Ma, Ming Li, and Zhiliang Cao. "Femtosecond Laser Drilling of Cylindrical Holes for Carbon Fiber-Reinforced Polymer (CFRP) Composites." Molecules 26, no. 10 (2021): 2953. http://dx.doi.org/10.3390/molecules26102953.

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Ultrafast laser drilling has been proven to effectively reduce the heat-affected zone (HAZ) of carbon fiber-reinforced polymer (CFRP) composites. However, previous research mainly focused on the effects of picosecond laser parameters on CFRP drilling. Compared with a picosecond laser, a femtosecond laser can achieve higher quality CFRP drilling due to its smaller pulse width, but there are few studies on the effects of femtosecond laser parameters on CFRP drilling. Moreover, the cross-sectional taper of CFRP produced by laser drilling is very large. This paper introduces the use of the femtose
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LI Zhi-ming, 李志明, 王玺 WANG Xi, and 聂劲松 NIE Jin-song. "Hole Morphology in Femtosecond Laser Drilling of Silicon." ACTA PHOTONICA SINICA 46, no. 10 (2017): 1014004. http://dx.doi.org/10.3788/gzxb20174610.1014004.

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ZHANG Jun-zhan, 张军战, 王禹茜 WANG Yu-qian, 张颖 ZHANG Ying, and 刘永胜 LIU Yong-sheng. "Effect of feeding speed on micro-hole drilling in TiC ceramic by femtosecond laser." Optics and Precision Engineering 23, no. 6 (2015): 1565–71. http://dx.doi.org/10.3788/ope.20152306.1565.

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Dissertations / Theses on the topic "Micro-hole drilling with femtosecond laser"

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Machinet, Guillaume. "Développement de sources lasers femtosecondes ytterbium à très haute cadence et applications." Thesis, Bordeaux 1, 2013. http://www.theses.fr/2013BOR14999/document.

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Ce travail de thèse est consacré au développement de sources lasers femtosecondes à haute cadence, de forte puissancemoyenne (>10 W) avec des énergies supérieures à 100 μJ. Ce type de sources est primordial pour le développementd’applications industrielles variées (micro-usinage athermique, chirurgie oculaire, …) ainsi qu’en recherchefondamentale pour l’étude de l’interaction laser matière.Après un chapitre d’introduction sur l’état de l’art des chaînes lasers de forte puissance moyenne à base de matériauxdopés ytterbium, la réalisation d’une chaîne laser de forte puissance moyenne compacte
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Wang, Nai-yu, and 王乃右. "Study of micro-hole formation based on laser pre-drilling and magnetic assisted laser drilling." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/15677954167801357810.

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碩士<br>雲林科技大學<br>機械工程系碩士班<br>98<br>In recent years, laser drilling has been an important role in industrial such as PCB, Solar Cell production and Ceramics applications. However, it is a still challenging task to drill on some materials such as aluminum and copper. More over, the high-reflectivity rate materials may cause decreasing on laser drilling rate. On the other hand, longer laser drilling time not only lead to wide and shallow hole, but also defect large hot area zone and intense recast layer on the side wall of the hole. In this study we create a novel laser drilling process using a Q-
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Hung, Yung-Chou, and 洪永洲. "The Study in Hybrid Stamping and Laser Micromachining Process for Micro-Scale Hole Drilling." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/fcsg72.

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博士<br>國立雲林科技大學<br>機械工程系<br>105<br>The shells of notebooks, cell phones and tablets need to be equipped with microperforations of tens of μms. Though a microperforation is small, light can still penetrate it. With the microperforation illumination, we can create a tapered microhole featuring a high rate of optical energy and a high level of illumination evenness. A tapered microhole cannot be made with a traditional mechanical drill. In current industry. a tapered microhole is mainly processed with laser, which makes controlling size difficult . Worse still, slag piles up after the laser punchi
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Book chapters on the topic "Micro-hole drilling with femtosecond laser"

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Feng, Guoying, Guang Li, Zhuping Wang, and Yao Xiao. "Micro-hole Arrays and Net-like Structure Fabrication via Femtosecond Laser Pulses." In Laser Micro-Nano-Manufacturing and 3D Microprinting. Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-59313-1_7.

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Jyoti Biswal, Hrudaya, V. Pandu Ranga, and Ankur Gupta. "Multi-objective Optimization of Laser-Assisted Micro-hole Drilling with Evolutionary Algorithms." In Nature-Inspired Optimization in Advanced Manufacturing Processes and Systems. CRC Press, 2020. http://dx.doi.org/10.1201/9781003081166-11.

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Pramanik, D., N. Roy, A. S. Kuar, S. Sarkar, S. Mitra, and Dipankar Bose. "Laser Trepan Drilling of Monel k-500 Superalloy in Low Power Laser Beam Machining." In Machine Learning Applications in Non-Conventional Machining Processes. IGI Global, 2021. http://dx.doi.org/10.4018/978-1-7998-3624-7.ch009.

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In the field of micro processing of materials, laser has great importance as a source of heat and for its ability to deliver a coherent beam. The use of 50-watt average power for through-hole is impossible to achieve good quality drilling of the metal sheet upto 2 mm thickness. But the use of unique parameter sawing angle and constant focal point distance plays a significant role on hole diameter and circularity in laser trepan drilling. In the present research study, laser trepan drilling is investigated through multi diode pulsed fiber laser beam machining. Experimental analysis based on central composite design (CCD) of response surface methodology (RSM) has been fulfilled to find out the mathematical model. A study of the effect of sawing angle with other process parameters such as cutting speed, power, duty cycle, and pulse frequency on overcut bottom diameter and circularity at bottom for a monel k-500 has been conducted. Experimental validation of the proposed model shows that desired hole quality can be obtained by optimization of controllable of suitable process parameters.
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Aizawa, Tatsuhiko, Tadahiko Inonara, Tomoaki Yoshino, Tomomi Shiratori, and Yohei Suzuki. "Laser Treatment CVD Diamond Coated Punch for Ultra-Fine Piercing of Metallic Sheets." In Engineering Applications of Diamond. IntechOpen, 2021. http://dx.doi.org/10.5772/intechopen.96446.

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CVD-diamond coated special tools have been widely utilized to prolong their tool life in practical production lines. WC (Co) punch for fine piercing of metallic sheets required for high wear-toughness to be free from chipping and damages and for high product quality to punch out the holes with sufficient dimensional accuracy. The laser trimming process was developed to reduce the surface roughness of diamond coating down to submicron level and to adjust its diamond layer dimensions with a sharp punch edge for accurate piercing. The pulsed laser irradiation was employed to demonstrate that micro-groove was accurately formed into the diamond coating. Less deterioration in the worked diamond film by this laser treatment was proved by the Raman spectroscopy. The femtosecond laser trimming was proposed to sharpen the punch edge down to 2 μm and to form the nano-textured punch side surfaces with the LIPSS (Laser Induced Periodic Surface Structuring)-period of 300 nm. Fine piercing experiments were performed to demonstrate that punch life was significantly extended to continuous punching in more than 10,000 shots and that mirror-shining hole surfaces were attained in every shot by regularly coining the nanotextures. The sharp punch edge with homogeneous edge profile was responsible for reduction of the induced damages into work sheet by piercing. The punch life was extended by the ejection mechanism of debris particles through the nanotextures on the punch side surface. The present laser treatment was useful in trimming and nanostructuring the complex-shaped punch edge for industrial application.
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Conference papers on the topic "Micro-hole drilling with femtosecond laser"

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Huang, Huan, Lih-Mei Yang, and Jian Liu. "Micro-hole drilling with femtosecond fiber laser." In SPIE LASE, edited by Xianfan Xu, Guido Hennig, Yoshiki Nakata, and Stephan W. Roth. SPIE, 2013. http://dx.doi.org/10.1117/12.2004888.

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Kuriyama, Noriyuki, and Yoshiro Ito. "Micro-hole drilling on glass plates by femtosecond laser pulses." In LAMP 2002: International Congress on Laser Advanced Materials Processing, edited by Isamu Miyamoto, Kojiro F. Kobayashi, Koji Sugioka, Reinhart Poprawe, and Henry Helvajian. SPIE, 2003. http://dx.doi.org/10.1117/12.486534.

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Antonov, D., E. Weynant, G. Petite, and S. Guizard. "Deep hole drilling in metals by femtosecond laser pulses." In 2007 European Conference on Lasers and Electro-Optics and the International Quantum Electronics Conference. IEEE, 2007. http://dx.doi.org/10.1109/cleoe-iqec.2007.4386669.

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Tönshoff, H. K., F. von Alvensleben, A. Ostendorf, S. Nolte, and G. Kamlage. "Femtosecond laser – A powerful tool for micro drilling." In ICALEO® ‘99: Proceedings of the Laser Microfabrication Conference. Laser Institute of America, 1999. http://dx.doi.org/10.2351/1.5059307.

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Hamasaki, Masayuki, Kenji Gouya, and Kazuhiro Watanabe. "Hole drilling on glass optical fibers by a femtosecond laser." In XIX International Symposium on High-Power Laser Systems and Applications, edited by Kerim R. Allakhverdiev. SPIE, 2013. http://dx.doi.org/10.1117/12.2010521.

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Suzuki, Teruhiko, Daisaku Tokita, and Kazuhiro Watanabe. "Investigation of micro laser drilling on thin glass fibers by femtosecond laser." In 18th International Symposium on Gas Flow & Chemical Lasers & High Power Lasers, edited by Tanja Dreischuh, Petar A. Atanasov, and Nikola V. Sabotinov. SPIE, 2010. http://dx.doi.org/10.1117/12.880925.

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Choi, Wonsuk, and Sung Hak Cho. "Vibration assisted femtosecond laser hole drilling on fine metal mask for AMOLED." In 2015 11th Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR). IEEE, 2015. http://dx.doi.org/10.1109/cleopr.2015.7375847.

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Kling, R., M. Dijoux, L. Romoli, F. Tantussi, J. Sanabria, and E. Mottay. "Metal micro drilling combining high power femtosecond laser and trepanning head." In SPIE LASE, edited by Udo Klotzbach, Yongfeng Lu, and Kunihiko Washio. SPIE, 2013. http://dx.doi.org/10.1117/12.2002083.

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Wu, Benxin, Sha Tao, and Shuting Lei. "The Plasma-Side Wall Interactions During Femtosecond Laser Drilling of High-Aspect-Ratio Microholes." In ASME 2010 International Manufacturing Science and Engineering Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/msec2010-34108.

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The drilling of high-aspect-ratio microholes has very important applications in automotive, aerospace, electronics and other areas. However, this is difficult to realize with conventional mechanical machining or electrical discharge machining approaches. Femtosecond laser ablation can potentially provide a good solution to this, but it also involves many technical difficulties. One of these is that the laser-induced plasma, as it expands out of the microhole, may transfer its energy to the side wall of the hole, which may affect the hole size and geometry. In this paper, the plasma – side wall
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Del Hoyo, Jesús, Pauline Boucher, Cyril Billet, Olivier Pinel, Guillaume Labroille, and François Courvoisier. "High aspect ratio nanochannel drilling in glass by femtosecond laser pulse of high cone angle, high quality Bessel-Gauss beam (Conference Presentation)." In Laser-based Micro- and Nanoprocessing XIII, edited by Udo Klotzbach, Rainer Kling, and Akira Watanabe. SPIE, 2019. http://dx.doi.org/10.1117/12.2511295.

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