Relevant bibliographies by topics / Microchannel Heat Sinks

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Microchannel Heat Sinks'

Author: Grafiati
Published: 4 June 2021
Last updated: 25 July 2025

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Journal articles on the topic "Microchannel Heat Sinks"

1

Hurtado-Venegas, Ignacio, Víctor A. Martínez, Vasco Diego A., et al. "Numerical Study About Nanofluids of Spherical and Tube-Shaped TiO2 Nanomaterials on the Thermal Performance and Entropy Generation of Different Cross-Section Microchannel Heat Sinks." Journal of Nanofluids 12, no. 1 (2023): 65–77. http://dx.doi.org/10.1166/jon.2023.1911.

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We numerically evaluated the thermal performance of microchannel heat sinks, considering rectangular, hexagonal, and circular cross-sections. Moreover, as a passive heat transfer augmentation technique, dimples were added to improve the rectangular microchannel heat sinks. These simulations use nanofluids based on TiO2 nanoparticles or nanotubes dispersed in bidistilled water as working fluids. The mathematical model considered variable thermophysical properties of the nanofluids; for this purpose, polynomial fittings correlate the dependence of the thermophysical properties on the temperature
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Jiang, Zhengyong, Mengjie Song, Jun Shen, Long Zhang, Xuan Zhang, and Shenglun Lin. "Experimental Investigation on the Flow Boiling of Two Microchannel Heat Sinks Connected in Parallel and Series for Cooling of Multiple Heat Sources." Micromachines 14, no. 8 (2023): 1580. http://dx.doi.org/10.3390/mi14081580.

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Cooling methods for multiple heat sources with high heat flux have rarely been reported, but such situations threaten the stable operation of electronic devices. Therefore, in this paper, the use of two microchannel heat sinks is proposed, with and without grooves, labeled Type A and Type B, respectively. Experimental investigations on the flow boiling of two microchannel heat sinks connected in parallel and in series are carried out under different mass fluxes. In addition, a high-speed camera is used to observe flow patterns in the microchannels. The cold plate wall temperature (Tw), heat tr
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Mai, Yuanqi. "The Effect of Cross-Sectional Shape on the Thermo-Hydraulic Performance of Microchannel Heat Sinks." Applied and Computational Engineering 159, no. 1 (2025): 132–40. https://doi.org/10.54254/2755-2721/2025.23607.

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Microchannel heat sinks are widely used in thermal management systems due to their compact design and efficient heat transfer. To further enhance performance, this study uses numerical simulations to explore the heat transfer characteristics of rectangular, triangular, trapezoidal, and circular microchannels while maintaining equal cross-sectional areas. At Re = 900, the triangular microchannel demonstrates optimal heat transfer performance (HTP) but the weakest hydraulic performance, with a 5.56% reduction in thermal resistance and a 54.45% increase in pumping power compared to the rectangula
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Ariyo, David Olugbenga, and Tunde Bello-Ochende. "Optimal design of subcooled triangular microchannel heat sink exchangers with variable heat loads for high performance cooling." Journal of Physics: Conference Series 2116, no. 1 (2021): 012052. http://dx.doi.org/10.1088/1742-6596/2116/1/012052.

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Abstract Deionized water at a temperature of 25 °C was used as the cooling fluid and aluminium as the heat sink material in the geometric optimization and parameter modelling of subcooled flow boiling in horizontal equilateral triangular microchannel heat sinks. The thermal resistances of the microchannels were minimized subject to fixed volume constraints of the heat sinks and microchannels. A computational fluid dynamics (CFD) ANSYS code used for both the simulations and the optimizations was validated by the available experimental data in the literature and the agreement was good. Fixed hea
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Deng, Daxiang, Guang Pi, Weixun Zhang, Peng Wang, and Ting Fu. "Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes." Entropy 21, no. 1 (2018): 16. http://dx.doi.org/10.3390/e21010016.

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This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and ther
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Nonino, Carlo, and Stefano Savino. "Temperature Uniformity in Cross-Flow Double-Layered Microchannel Heat Sinks." Fluids 5, no. 3 (2020): 143. http://dx.doi.org/10.3390/fluids5030143.

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An in-house finite element method (FEM) procedure is used to carry out a numerical study on the thermal behavior of cross-flow double-layered microchannel heat sinks with an unequal number of microchannels in the two layers. The thermal performance is compared with those yielded by other more conventional flow configurations. It is shown that if properly designed, i.e., with several microchannels in the top layer smaller than that in the bottom layer, cross-flow double-layered microchannel heat sinks can provide an acceptable thermal resistance and a reasonably good temperature uniformity of t
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Hegde, Pradeep, K. N. Seetharamu, P. A. Aswatha Narayana, and Zulkifly Abdullah. "Two-Phase Stacked Microchannel Heat Sinks for Microelectronics Cooling." Journal of Microelectronics and Electronic Packaging 2, no. 2 (2005): 122–31. http://dx.doi.org/10.4071/1551-4897-2.2.122.

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Stacked microchannel heat sinks with two-phase flow have been analyzed using the Finite Element Method (FEM). The present method is a simple and practical approach for analyzing the thermal performance of single or multi layered microchannel heat sinks with either single or two-phase flow. A unique 10 noded finite element is used for the channel discretization. Two-phase thermal resistance, pressure drop and pumping power of single, double and triple stack microchannel heat sinks are determined at different base heat fluxes ranging from 150 W/cm2 to 300 W/cm2. The temperature distribution alon
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Wei, Xiaojin, Yogendra Joshi, and Michael K. Patterson. "Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices." Journal of Heat Transfer 129, no. 10 (2007): 1432–44. http://dx.doi.org/10.1115/1.2754781.

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One of the promising liquid cooling techniques for microelectronics is attaching a microchannel heat sink to, or directly fabricating microchannels on, the inactive side of the chip. A stacked microchannel heat sink integrates many layers of microchannels and manifold layers into one stack. Compared with single-layered microchannels, stacked microchannels provide larger flow passages, so that for a fixed heat load the required pressure drop is significantly reduced. Better temperature uniformity can be achieved by arranging counterflow in adjacent microchannel layers. The dedicated manifolds h
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Yu, Hao, Tongling Li, Xiaoxin Zeng, Tianbiao He, and Ning Mao. "A Critical Review on Geometric Improvements for Heat Transfer Augmentation of Microchannels." Energies 15, no. 24 (2022): 9474. http://dx.doi.org/10.3390/en15249474.

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With the application of microdevices in the building engineering, aerospace industry, electronic devices, nuclear energy, and so on, the dissipation of high heat flux has become an urgent problem to be solved. Microchannel heat sinks have become an effective means of thermal management for microdevices and enhancements for equipment due to their higher heat transfer and small scale. However, because of the increasing requirements of microdevices for thermal load and temperature control and energy savings, high efficiency heat exchangers, especially microchannels are receiving more and more att
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Wu, Huajie, and Shanwen Zhang. "Numerical Study on the Fluid Flow and Heat Transfer Characteristics of Al2O3-Water Nanofluids in Microchannels of Different Aspect Ratio." Micromachines 12, no. 8 (2021): 868. http://dx.doi.org/10.3390/mi12080868.

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The study of the influence of the nanoparticle volume fraction and aspect ratio of microchannels on the fluid flow and heat transfer characteristics of nanofluids in microchannels is important in the optimal design of heat dissipation systems with high heat flux. In this work, the computational fluid dynamics method was adopted to simulate the flow and heat transfer characteristics of two types of water-Al2O3 nanofluids with two different volume fractions and five types of microchannel heat sinks with different aspect ratios. Results showed that increasing the nanoparticle volume fraction redu
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Dissertations / Theses on the topic "Microchannel Heat Sinks"

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Phillips, Richard J. "Forced-convection, liquid-cooled, microchannel heat sinks." Thesis, Massachusetts Institute of Technology, 1987. http://hdl.handle.net/1721.1/14921.

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Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1987.<br>MICROFICHE COPY AVAILABLE IN ARCHIVES AND ENGINEERING<br>Bibliography: v.2, leaves 286-291.<br>by Richard J. Phillips.<br>M.S.
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Lee, Man. "Forced convection heat transfer in integrated microchannel heat sinks /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20LEE.

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Turkakar, Goker. "Numerical Simulation And Analytical Optimization Of Microchannel Heat Sinks." Master's thesis, METU, 2010. http://etd.lib.metu.edu.tr/upload/12612377/index.pdf.

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This study has two main objectives: The performance evaluation of existing microchannel heat sinks using a CFD model, and the dimensional optimization of various heat sinks by minimizing the total thermal resistance. For the analyses, the geometric modeling is performed using the software GAMBIT while the thermal analysis is performed with FLUENT. The developed model compares very well with those available in the literature. Eight different metal-polymer microchannel heat sinks are analyzed using the model to find out how much heat could be provided to the systems while keeping the substrate t
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Ulu, Ayse Gozde. "Experimental Investigation Of Uninterrupted And Interrupted Microchannel Heat Sinks." Master's thesis, METU, 2012. http://etd.lib.metu.edu.tr/upload/12614227/index.pdf.

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Experimental measurements are conducted on uninterrupted and interrupted aluminum microchannel heat sinks of 300, 500, 600 and 900 &mu<br>m channel widths. Two different versions of interrupted channels are tested<br>with single interruption and with 7 interruptions. Distilled water is used as the working fluid and tests are conducted at volumetric flow rates in a range of 0.5-1.1 lpm. Thermoelectric foils are used to supply uniformly distributed heat load to the heat sinks such that for all the tests the heat removed by water is kept constant at 40 W. Pressure drop and temperature increase ar
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Wei, Xiaojin. "Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices." Diss., Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/4873.

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A stacked microchannel heat sink was developed to provide efficient cooling for microelectronics devices at a relatively low pressure drop while maintaining chip temperature uniformity. Microfabrication techniques were employed to fabricate the stacked microchannel structure, and experiments were conducted to study its thermal performance. A total thermal resistance of less than 0.1 K/W was demonstrated for both counter flow and parallel flow configurations. The effects of flow direction and interlayer flow rate ratio were investigated. It was found that for the low flow rate range the par
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Farnam, Dylan Sean. "Comparative analysis of microchannel heat sink configurations subject to a pressure constraint." Diss., Online access via UMI:, 2007.

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Koyuncuoglu, Aziz. "Design, Fabrication, And Experimental Evaluation Of Microchannel Heat Sinks In Cpu Cooling." Master's thesis, METU, 2010. http://etd.lib.metu.edu.tr/upload/12612430/index.pdf.

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A novel complementary metal oxide semiconductor (CMOS) compatible microchannel heat sink is designed, fabricated, and tested for electronic cooling applications. The proposed microchannel heat sink requires no design change of the electronic circuitry underneath. Therefore, microchannels can be fabricated on top of the finished CMOS wafers by just adding a few more steps to the fabrication flow. Combining polymer (parylene C) and metal (copper) structures, a high performance microchannel heat sink can be easily manufactured on top of the electronic circuits, forming a monolithic cooling system
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Al-Waaly, Ahmed. "The effect of heat transfer on temperature measurement and its applications to study microchannel heat sinks." Thesis, University of Glasgow, 2015. http://theses.gla.ac.uk/6781/.

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Analytical, numerical and experimental analyses have been performed to investigate the effects of thermocouple wire electrical insulation on the temperature measurement of a reference surface. Two diameters of K-type thermocouple, 80μm and 200μm, with different exposed stripped wire lengths (0 mm, 5mm, 10mm, 15mm and 20mm) were used to measure various surface temperatures (4oC, 8oC, 15oC, 25oC and 35oC). Measurements were made when the thermocouple probe is in direct contact with the surface and the wires are extended vertically and exposed to natural convection from outside environment. Exper
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Ates, Ahmet Muaz. "Experimental Comparison Of Fluid And Thermal Characteristics Of Microchannel And Metal Foam Heat Sinks." Master's thesis, METU, 2011. http://etd.lib.metu.edu.tr/upload/12613577/index.pdf.

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Doubling transistor count for every two years in a computer chip, transmitter and receiver (T/R) module of a phased-array antenna that demands higher power with smaller dimensions are all results of miniaturization in electronics packaging. These technologies nowadays depend on improvement of reliable high performance heat sink to perform in narrower volumes. Employing microchannels or open cell metal foam heat sinks are two recently developing promising methods of cooling high heat fluxes. Although recent studies especially on microchannels can give a rough estimate on performances of these t
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Perry, Jeffrey L. "Fouling in silicon microchannel designs used for IC chip cooling and its mitigation /." Online version of thesis, 2008. http://hdl.handle.net/1850/6211.

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Books on the topic "Microchannel Heat Sinks"

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Zhang, Lian, Kenneth E. Goodson, and Thomas W. Kenny. Silicon Microchannel Heat Sinks. Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-09899-8.

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Zhang, Lian. Silicon Microchannel Heat Sinks: Theories and Phenomena. Springer Berlin Heidelberg, 2004.

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International Conference on Microchannels and Minichannels (3rd 2005 Toronto, Ont.). Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005: Presented at 3rd International Conference on Microchannels and Minichannels, June 13-15, 2005, Toronto, Ontario, Canada. American Society of Mechanical Engineers, 2005.

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International Conference on Microchannels and Minichannels (2nd 2004 Rochester, N.Y.). Microchannels and minichannels (ICMM2004): Proceedings of the Second International Conference on Microchannels and Minichannels : presented at the Second International Conference on Microchannels and Minichannels : June 17-19, 2004, Rochester, New York. Edited by Kandlikar S. G, Celata G. P, Rochester Institute of Technology, and American Society of Mechanical Engineers. American Society of Mechanical Engineers, 2004.

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International Conference on Microchannels and Minichannels (2nd 2004 Rochester, N.Y.). Microchannels and minichannels (ICMM2004): Proceedings of the Second International Conference on Microchannels and Minichannels : presented at the Second International Conference on Microchannels and Minichannels : June 17-19, 2004, Rochester, New York, USA. Edited by Celata G. P, Kandlikar S. G, American Society of Mechanical Engineers., and Rochester Institute of Technology. American Society of Mechanical Engineers, 2004.

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International, Conference on Nanochannels Microchannels and Minichannels (9th 2011 Edmonton Canada). Proceedings of the 9th International Conference on Nanochannels, Microchannels and Minichannels--2011: Presented at 9th International Conference on Nanochannels, Microchannels and Minichannels, June 19-22, 2011, Edmonton, Canada. American Society of Mechanical Engineers, 2012.

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International Conference on Nanochannels, Microchannels and Minichannels (8th 2010 Montréal, Québec). Proceedings of the 8th International Conference on Nanochannels, Microchannels and Minichannels--2010: Presented at 8th International Conference on Nanochannels, Microchannels and Minichannels, August 1-5, 2010, Montreal, Canada. American Society of Mechanical Engineers, 2011.

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International Conference on Nanochannels, Microchannels and Minichannels (7th 2009 Pohang, South Korea). Proceedings of the 7th International Conference on Nanochannels, Microchannels and Minichannels, 2009: Presented at 7th International Conference on Nanochannels, Microchannels and Minichannels, June 22-24, 2009, Pohang, South Korea. American Society of Mechanical Engineers, 2009.

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International, Conference on Nanochannels Microchannels and Minichannels (6th 2008 Darmstadt Germany). Proceedings of the 6th International Conference on Nanochannels, Microchannels and Minichannels, 2008: Presented at 6th International Conference on Nanochannels, Microchannels and Minichannels, June 23-25, 2008, Darmstadt, Germany ; sponsored by ASME. American Society of Mechanical Engineers, 2008.

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International Conference on Nanochannels, Microchannels and Minichannels (6th 2008 Darmstadt, Germany). Proceedings of the 6th International Conference on Nanochannels, Microchannels and Minichannels, 2008: Presented at 6th International Conference on Nanochannels, Microchannels and Minichannels, June 23-25, 2008, Darmstadt, Germany ; sponsored by ASME. American Society of Mechanical Engineers, 2008.

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Book chapters on the topic "Microchannel Heat Sinks"

1

Jaluria, Yogesh. "Microchannel Flows as Heat Sinks." In Encyclopedia of Nanotechnology. Springer Netherlands, 2015. http://dx.doi.org/10.1007/978-94-007-6178-0_100965-1.

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Jaluria, Yogesh. "Microchannel Flows as Heat Sinks." In Encyclopedia of Nanotechnology. Springer Netherlands, 2016. http://dx.doi.org/10.1007/978-94-017-9780-1_100965.

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Zhang, Lian, Kenneth E. Goodson, and Thomas W. Kenny. "Two-phase Microchannel Heat Sinks: Problems and Challenges." In Microtechnology and MEMS. Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-09899-8_2.

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Meena, Vikram, and Amit Arora. "Integration of Nanofluids in Microchannel Heat Sinks for Heat Transfer Enhancement." In Lecture Notes in Mechanical Engineering. Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-3410-0_21.

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Agrawal, Brahma Nand, Charan Singh, Mayur Pratap Singh, and Manoj Kumar Agrawal. "Comparative CFD Analysis of Different Shape Microchannel Heat Sinks." In Lecture Notes in Mechanical Engineering. Springer Nature Singapore, 2024. http://dx.doi.org/10.1007/978-981-97-2481-9_5.

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Cruz-Duarte, Jorge M., Arturo García-Pérez, Iván M. Amaya-Contreras, and Rodrigo Correa. "Assessing Film Coefficients of Microchannel Heat Sinks via Cuckoo Search Algorithm." In Heuristics for Optimization and Learning. Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-58930-1_25.

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Tiruveedula, Mohan Sukumar, Rajesh Kumar Gadekula, and Raja Sekhar Dondapati. "Thermohydraulic Characteristics of Microchannel Heat Sinks Used in Electronic Cooling Applications." In Lecture Notes in Mechanical Engineering. Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-2188-9_66.

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Hiremath, Shivayya C., Rohit Kumar, Arman Mohaddin Nadaf, and Manmohan Pandey. "Numerical Analysis of Heat Transfer and Fluid Flow in Microchannel Heat Sinks Designed for Uniform Cooling." In Fluid Mechanics and Fluid Power, Volume 4. Springer Nature Singapore, 2024. http://dx.doi.org/10.1007/978-981-99-7177-0_29.

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Bajpai, Kshitij, and Abhishek Kundu. "Effect of Intermixing on Thermal Performance of Converged-Diverged Microchannel Heat Sinks for High Heat Flux Applications." In Lecture Notes in Mechanical Engineering. Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-19-7709-1_6.

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Tilak, Abhilash K., and Ranjit S. Patil. "Effect of Aspect Ratio on Flow and Heat Transfer in Rectangular and Novel ITSCEB Microchannel Heat Sinks." In Lecture Notes in Mechanical Engineering. Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-19-7055-9_43.

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Conference papers on the topic "Microchannel Heat Sinks"

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Amyx, Isabella, Caleb Anderson, Nicole Cassada, et al. "High Heat Flux Thermal Management using CuW Microchannel Heat Sinks and FC3283." In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709546.

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Garimella, Suresh V., and Vishal Singhal. "Single-Phase Flow and Heat Transport in Microchannel Heat Sinks." In ASME 2003 1st International Conference on Microchannels and Minichannels. ASMEDC, 2003. http://dx.doi.org/10.1115/icmm2003-1018.

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Microchannel heat sinks are widely regarded as being amongst the most effective heat removal techniques from space-constrained electronic devices. However, the fluid flow and heat transfer in microchannels is not fully understood. The pumping requirements for flow through microchannels are also very high and none of the micropumps in the literature are truly suitable for this application. A wide-ranging research program on microchannel heat sinks and micropumps is underway in the Electronics Cooling Laboratory at Purdue University. This article provides an overview of the research being conduc
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Choquette, S. F., M. Faghri, M. Charmchi, and Y. Asako. "Optimum Design of Microchannel Heat Sinks." In ASME 1996 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1996. http://dx.doi.org/10.1115/imece1996-1344.

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Abstract Analyses have been performed to obtain momentum and thermal characteristics in microchannel heat sinks. The applicability of existing correlations for friction factor and Nusselt number is investigated. The study revealed that existing correlations based on the analytical results can predict the heat sink performance to within the accuracy limits acceptable for use in design. A user friendly computer code has been developed as an aid in the optimum design of microchannel heat sinks. The program, using thermal resistance models, operates in two modes. In mode one, the performance capab
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Rasouli, Erfan, and Vinod Narayanan. "Single-Phase Cryogenic Flows Through Microchannel Heat Sinks." In ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/icnmm2014-21275.

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Cryogenic fluids are used widely in several thermal management applications such as in regenerative cooling of rocket engine combustor liners, missile warning receivers, satellite tracking systems and cryo-adsorbent hydrogen storage systems. Single phase laminar flow and heat transfer rate of liquid nitrogen in microchannels is studied experimentally in this paper. The performance of two distinct geometries of microchannel heat sinks are evaluated and compared for simultaneous developing laminar flow in the Reynolds number range from 180 to 610. The first geometry pertains to parallel microcha
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Jung, Jaehoon, and Sung Jin Kim. "Entropy Generation Analysis of Microchannel Heat." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-10841.

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Analytical solutions for entropy generation rate distribution associated with heat transfer and fluid friction in microchannel heat sinks are examined. Microchannel heat sinks are modeled as a porous medium through which fluid flows. Analytical solutions are obtained by using velocity and temperature distributions of microchannel heat sinks, which are based on the modified Darcy model for fluid flow and the two-equation model for heat transfer. Using the analytical solution, the entropy generation of heat sinks was obtained. The effects of height, channel width, and fin thickness on the entrop
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Rubio-Jimenez, Carlos A., Abel Hernandez-Guerrero, Cuauhtemoc Rubio-Arana, and Daniela Popescu. "Comparison Between Traditional Microchannels Heat Sinks and Microchannels Heat Sinks Based on Biomimical Tendencies." In ASME 2008 9th Biennial Conference on Engineering Systems Design and Analysis. ASMEDC, 2008. http://dx.doi.org/10.1115/esda2008-59436.

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In the last few years high-tendency electronic devices have improved to a larger processing capability with smaller physical dimensions. This fact coupled to traditional cooling mechanisms, are not able to dissipate the high heat fluxes generated by these devices (around 200 W/cm2.) Microchannel heat sinks are the new tendency in heat dissipation. Many of the studies done before had used single-phase water as cooling fluid in laminar flow. Operating within this regimen, and using water as the cooling fluid, the dissipated heat flux is not enough to keep optimal operational conditions in the el
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Betz, Amy Rachel, and Daniel Attinger. "Bubble Injection to Enhance Heat Transfer in Microchannel Heat Sinks." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-11972.

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Liquid cooling is an efficient way to remove heat fluxes with magnitude of 1 to 10,000 W/cm2. One limitation of current single-phase microchannel heat sinks is the relatively low Nusselt number, because of laminar flow. In this work, we experimentally investigate how to enhance the Nusselt number in the laminar regime with the periodic injection of non-condensable bubbles in a water-filled array of microchannels in a segmented flow pattern. We designed a polycarbonate heat sink consisting of an array of parallel microchannels with a low ratio of heat to convective resistance, to facilitate the
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Alkhazaleh, Anas, Mohamed Younes El-Saghir Selim, Fadi Alnaimat, and Bobby Mathew. "Thermo-Hydraulic Performance of Heat Sinks With Microchannel Embedded With Pin-fins." In ASME 2021 Heat Transfer Summer Conference collocated with the ASME 2021 15th International Conference on Energy Sustainability. American Society of Mechanical Engineers, 2021. http://dx.doi.org/10.1115/ht2021-62804.

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Abstract In this work, an investigation of the heat sink performance employing sinusoidal microchannels embedded with pin fins was conducted. The effect of the sine wave frequency, the pin fins’ diameter, and the hydraulic diameter of the microchannel are studied. The results are quantified in terms of thermal resistance and pressure drop. The study was done using Reynolds numbers varying from 250 to 2000. As Reynolds number increases, the heat sink’s thermal resistance decreased while the pressure drop increased accordingly for all scenarios. The sinusoidal microchannels showed better perform
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Hu, Haibao, Sarada Kuravi, Feng Ren, and Pei-feng Hsu. "Liquid Metal Flows in Manifold Microchannel Heat Sinks." In ASME 2014 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/imece2014-39283.

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Heat transfer and flow performance of water and galinstan in manifold microchannel heat sinks is analyzed. The three dimensional flow and conjugate heat transfer is numerically simulated for microchannels of two different hydraulic diameters. The heat transfer coefficient, wall temperature variation at the base, and performance factor were analyzed for the same inlet velocity, Reynolds number and pressure drop conditions for water and liquid metal for different heat flux boundary conditions. Due to the short length of microchannels, it was found that performance factor of liquid metal is large
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Kim, Duckjong, and Sung Jin Kim. "Thermal Optimization of Microchannel Heat Sink With Pin Fin Structures." In ASME 2003 International Mechanical Engineering Congress and Exposition. ASMEDC, 2003. http://dx.doi.org/10.1115/imece2003-42180.

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Abstract:
In the present work, a novel compact modeling method based on the volume-averaging technique and its application to the analysis of fluid flow and heat transfer in pin fin heat sinks are presented. The pin fin heat sink is modeled as a porous medium. The volume-averaged momentum and energy equations for fluid flow and heat transfer in pin fin heat sinks are obtained using the local volume-averaging method. The permeability, the Ergun constant and the interstitial heat transfer coefficient required to solve these equations are determined experimentally. To validate the compact model proposed in
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