Relevant bibliographies by topics / Microchannel Heat Sinks

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Microchannel Heat Sinks'

Author: Grafiati
Published: 4 June 2021
Last updated: 18 February 2022

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Journal articles on the topic "Microchannel Heat Sinks"

1

Hegde, Pradeep, K. N. Seetharamu, P. A. Aswatha Narayana, and Zulkifly Abdullah. "Two-Phase Stacked Microchannel Heat Sinks for Microelectronics Cooling." Journal of Microelectronics and Electronic Packaging 2, no. 2 (April 1, 2005): 122–31. http://dx.doi.org/10.4071/1551-4897-2.2.122.

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Stacked microchannel heat sinks with two-phase flow have been analyzed using the Finite Element Method (FEM). The present method is a simple and practical approach for analyzing the thermal performance of single or multi layered microchannel heat sinks with either single or two-phase flow. A unique 10 noded finite element is used for the channel discretization. Two-phase thermal resistance, pressure drop and pumping power of single, double and triple stack microchannel heat sinks are determined at different base heat fluxes ranging from 150 W/cm2 to 300 W/cm2. The temperature distribution along the length of the microchannel is also plotted. It is found that stacked microchannel heat sinks with two-phase flow are thermally more efficient than two-phase single layer microchannel heat sinks, both in terms of thermal resistance and pumping power requirements. It is observed that the thermal resistance of a double stack microchannel heat sink with two-phase flow is about 40% less than that for a single stack heat sink. A triple stack heat sink yields a further 20% reduction in the thermal resistance and at the same time operates with about 30% less pumping power compared to a single stack heat sink. The effect of channel aspect ratio on the thermal resistance and pressure drop of stacked microchannel heat sinks with two-phase flow are also studied.
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2

Wei, Xiaojin, Yogendra Joshi, and Michael K. Patterson. "Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices." Journal of Heat Transfer 129, no. 10 (February 23, 2007): 1432–44. http://dx.doi.org/10.1115/1.2754781.

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One of the promising liquid cooling techniques for microelectronics is attaching a microchannel heat sink to, or directly fabricating microchannels on, the inactive side of the chip. A stacked microchannel heat sink integrates many layers of microchannels and manifold layers into one stack. Compared with single-layered microchannels, stacked microchannels provide larger flow passages, so that for a fixed heat load the required pressure drop is significantly reduced. Better temperature uniformity can be achieved by arranging counterflow in adjacent microchannel layers. The dedicated manifolds help to distribute coolant uniformly to microchannels. In the present work, a stacked microchannel heat sink is fabricated using silicon micromachining techniques. Thermal performance of the stacked microchannel heat sink is characterized through experimental measurements and numerical simulations. Effects of coolant flow direction, flow rate allocation among layers, and nonuniform heating are studied. Wall temperature profiles are measured using an array of nine platinum thin-film resistive temperature detectors deposited simultaneously with thin-film platinum heaters on the backside of the stacked structure. Excellent overall cooling performance (0.09°C∕Wcm2) for the stacked microchannel heat sink has been shown in the experiments. It has also been identified that over the tested flow rate range, counterflow arrangement provides better temperature uniformity, while parallel flow has the best performance in reducing the peak temperature. Conjugate heat transfer effects for stacked microchannels for different flow conditions are investigated through numerical simulations. Based on the results, some general design guidelines for stacked microchannel heat sinks are provided.
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3

Deng, Daxiang, Guang Pi, Weixun Zhang, Peng Wang, and Ting Fu. "Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes." Entropy 21, no. 1 (December 25, 2018): 16. http://dx.doi.org/10.3390/e21010016.

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This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and thermal resistance considerably, induced much more uniform wall temperature distribution, and reduced the pressure drop and pumping power in comparison with SL-MCHS. The DL-MCHS with trapezoidal microchannels performed the worst with regard to thermal resistance, pressure drop, and pumping power. The DL-MCHS with rectangular microchannels produced the best overall thermal performance and seemed to be the optimum when thermal performance was the prime concern. Nevertheless, the DL-MCHS with reentrant Ω-shaped microchannels should be selected when pumping power consumption was the most important consideration.
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4

Wu, Huajie, and Shanwen Zhang. "Numerical Study on the Fluid Flow and Heat Transfer Characteristics of Al2O3-Water Nanofluids in Microchannels of Different Aspect Ratio." Micromachines 12, no. 8 (July 24, 2021): 868. http://dx.doi.org/10.3390/mi12080868.

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The study of the influence of the nanoparticle volume fraction and aspect ratio of microchannels on the fluid flow and heat transfer characteristics of nanofluids in microchannels is important in the optimal design of heat dissipation systems with high heat flux. In this work, the computational fluid dynamics method was adopted to simulate the flow and heat transfer characteristics of two types of water-Al2O3 nanofluids with two different volume fractions and five types of microchannel heat sinks with different aspect ratios. Results showed that increasing the nanoparticle volume fraction reduced the average temperature of the heat transfer interface and thereby improved the heat transfer capacity of the nanofluids. Meanwhile, the increase of the nanoparticle volume fraction led to a considerable increase in the pumping power of the system. Increasing the aspect ratio of the microchannel effectively improved the heat transfer capacity of the heat sink. Moreover, increasing the aspect ratio effectively reduced the average temperature of the heating surface of the heat sink without significantly increasing the flow resistance loss. When the aspect ratio exceeded 30, the heat transfer coefficient did not increase with the increase of the aspect ratio. The results of this work may offer guiding significance for the optimal design of high heat flux microchannel heat sinks.
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5

Saidi, M. H., and Reza H Khiabani. "Forced Convective Heat Transfer in Parallel Flow Multilayer Microchannels." Journal of Heat Transfer 129, no. 9 (August 30, 2006): 1230–36. http://dx.doi.org/10.1115/1.2739600.

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Abstract In this paper, the effect of increasing the number of layers on improving the thermal performance of microchannel heat sinks is studied. In this way, both numerical and analytical methods are utilized. The analytical method is based on the porous medium assumption. Here, the modified Darcy equation and the energy balance equations are used. The method has led to an analytical expression presenting the average dimensionless temperature field in the multilayer microchannel heat sink. The effects of different parameters such as aspect ratio, porosity, channel width, and the solid properties on the thermal resistance are described. The results for single layer and multilayer heat sinks are compared to show the effectiveness of using multilayer microchannels.
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6

Memon, Safi Ahmed, Taqi Ahmad Cheema, Gyu Man Kim, and Cheol Woo Park. "Hydrothermal Investigation of a Microchannel Heat Sink Using Secondary Flows in Trapezoidal and Parallel Orientations." Energies 13, no. 21 (October 27, 2020): 5616. http://dx.doi.org/10.3390/en13215616.

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Thermal performance enhancement in microchannel heat sinks has recently become a challenge due to advancements in modern microelectronics, which demand compatibility with heat sinks able to dissipate ever-increasing amounts of heat. Recent advancements in manufacturing techniques, such as additive manufacturing, have made the modification of the microchannel heat sink geometry possible well beyond the conventional rectangular model to improve the cooling capacity of these devices. One such modification in microchannel geometry includes the introduction of secondary flow channels in the walls between adjacent mainstream microchannels. The present study computationally models secondary flow channels in regular trapezoidal and parallel orientations for fluid circulation through the microchannel walls in a heat sink design. The heat sink is made of silicon wafer, and water is used as the circulating fluid in this study. Continuity, momentum, and energy equations are solved for the fluid flow through the regular trapezoidal secondary flow and parallel secondary flow designs in the heat sink with I-type, C-type, and Z-type inlet–outlet configurations. Plots of velocity contours show that I-type geometry creates optimal flow disruption in the heat sink. Therefore, for this design, the pressure drop and base plate temperatures are plotted for a volumetric flow rate range, and corresponding contour plots are obtained. The results are compared with corresponding trends for the conventional rectangular microchannel design, and associated trends are explained. The study suggests that the flow phenomena such as flow impingement onto the microchannel walls and formation of vortices inside the secondary flow passages coupled with an increase in heat transfer area due to secondary flow passages may significantly improve the heat sink performance.
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7

Gonçalves, Inês M., César Rocha, Reinaldo R. Souza, Gonçalo Coutinho, Jose E. Pereira, Ana S. Moita, António L. N. Moreira, Rui Lima, and João M. Miranda. "Numerical Optimization of a Microchannel Geometry for Nanofluid Flow and Heat Dissipation Assessment." Applied Sciences 11, no. 5 (March 9, 2021): 2440. http://dx.doi.org/10.3390/app11052440.

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In this study, a numerical approach was carried out to analyze the effects of different geometries of microchannel heat sinks on the forced convective heat transfer in single-phase flow. The simulations were performed using the commercially available software COMSOLMultiphysics 5.6® (Burlington, MA, USA) and its results were compared with those obtained from experimental tests performed in microchannel heat sinks of polydimethylsiloxane (PDMS). Distilled water was used as the working fluid under the laminar fluid flow regime, with a maximum Reynolds number of 293. Three sets of geometries were investigated: rectangular, triangular and circular. The different configurations were characterized based on the flow orientation, type of collector and number of parallel channels. The main results show that the rectangular shaped collector was the one that led to a greater uniformity in the distribution of the heat transfer in the microchannels. Similar results were also obtained for the circular shape. For the triangular geometry, however, a disturbance in the jet impingement was observed, leading to the least uniformity. The increase in the number of channels also enhanced the uniformity of the flow distribution and, consequently, improved the heat transfer performance, which must be considered to optimize new microchannel heat sink designs. The achieved optimized design for a heat sink, with microchannels for nanofluid flow and a higher heat dissipation rate, comprised a rectangular collector with eight microchannels and vertical placement of the inlet and outlet.
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8

Nonino, Carlo, and Stefano Savino. "Temperature Uniformity in Cross-Flow Double-Layered Microchannel Heat Sinks." Fluids 5, no. 3 (August 28, 2020): 143. http://dx.doi.org/10.3390/fluids5030143.

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An in-house finite element method (FEM) procedure is used to carry out a numerical study on the thermal behavior of cross-flow double-layered microchannel heat sinks with an unequal number of microchannels in the two layers. The thermal performance is compared with those yielded by other more conventional flow configurations. It is shown that if properly designed, i.e., with several microchannels in the top layer smaller than that in the bottom layer, cross-flow double-layered microchannel heat sinks can provide an acceptable thermal resistance and a reasonably good temperature uniformity of the heated base with a header design that is much simpler than that required by the counter-flow arrangement.
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9

Duan, Zhipeng, Hao Ma, Boshu He, Liangbin Su, and Xin Zhang. "Pressure Drop of Microchannel Plate Fin Heat Sinks." Micromachines 10, no. 2 (January 24, 2019): 80. http://dx.doi.org/10.3390/mi10020080.

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The entrance region constitutes a considerable fraction of the channel length in miniaturized devices. Laminar slip flow in microchannel plate fin heat sinks under hydrodynamically developing conditions is investigated semi-analytically and numerically in this paper. The semi-analytical model for the pressure drop of microchannel plate fin heat sinks is obtained by solving the momentum equation with the first-order velocity slip boundary conditions at the channel walls. The simple pressure drop model utilizes fundamental solutions from fluid dynamics to predict its constitutive components. The accuracy of the model is examined using computational fluid dynamics (CFD) simulations and the experimental and numerical data available in the literature. The model can be applied to either apparent liquid slip over hydrophobic and superhydrophobic surfaces or gas slip flow in microchannel heat sinks. The developed model has an accuracy of 92 percent for slip flow in microchannel plate fin heat sinks. The developed model may be used to predict the pressure drop of slip flow in microchannel plate fin heat sinks for minimizing the effort and expense of experiments, especially in the design and optimization of microchannel plate fin heat sinks.
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Hegde, Pradeep, and K. N. Seetharamu. "Effects of Nonuniform Base Heating on Single Stack and Multi-Stack Microchannel Heat Sinks Used for Electronics Cooling." Journal of Microelectronics and Electronic Packaging 7, no. 2 (April 1, 2010): 90–98. http://dx.doi.org/10.4071/1551-4897-7.2.90.

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Numerical investigations with regard to the thermal characteristics of water cooled single stack and multistack microchannel heat sinks subjected to nonuniform base heating are conducted. Nonuniformities in base heating are accomplished by applying gradually increasing and gradually decreasing base heat fluxes with respect to coolant flow direction in the heat sink. The effects of heat concentration upstream, downstream, and in the center half of the microchannel heat sinks (similar to a hotspot) are also studied. Both parallel flow and counter coolant flow conditions in the heat sink are considered and the results are compared. The results are presented in the form of base temperature distribution and heat sink thermal resistance. The finite element method is used for the analysis.
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Dissertations / Theses on the topic "Microchannel Heat Sinks"

1

Phillips, Richard J. "Forced-convection, liquid-cooled, microchannel heat sinks." Thesis, Massachusetts Institute of Technology, 1987. http://hdl.handle.net/1721.1/14921.

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Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1987.
MICROFICHE COPY AVAILABLE IN ARCHIVES AND ENGINEERING
Bibliography: v.2, leaves 286-291.
by Richard J. Phillips.
M.S.
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2

Lee, Man. "Forced convection heat transfer in integrated microchannel heat sinks /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20LEE.

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Turkakar, Goker. "Numerical Simulation And Analytical Optimization Of Microchannel Heat Sinks." Master's thesis, METU, 2010. http://etd.lib.metu.edu.tr/upload/12612377/index.pdf.

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This study has two main objectives: The performance evaluation of existing microchannel heat sinks using a CFD model, and the dimensional optimization of various heat sinks by minimizing the total thermal resistance. For the analyses, the geometric modeling is performed using the software GAMBIT while the thermal analysis is performed with FLUENT. The developed model compares very well with those available in the literature. Eight different metal-polymer microchannel heat sinks are analyzed using the model to find out how much heat could be provided to the systems while keeping the substrate temperatures below 85°
C under a constant pumping power requirement. Taking the objective function as the total thermal resistance, the optimum geometries have been obtained for the mentioned metal-polymer heat sinks as well as more conventional silicon ones. The results of the optimization code agreed very well with available ones in the literature. In the optimization study, the Intel Core i7-900 Desktop Processor Extreme Edition Series is considered as a reference processor which is reported to dissipate 130 W of heat and to have chip core dimensions of 1.891 cm ×
1.44 cm. A dimensional optimization study has been performed for various copper and silicon microchannel heat sinks to cool down this processor. To the best of the author&rsquo
s knowledge, this study contributes to the literature in that, as opposed to the available analytical microchannel optimization studies considering constant thermophysical properties at the fluid inlet temperature, the properties are evaluated at the area weighted average of the fluid inlet and iteratively calculated outlet temperatures. Moreover, the effects of the thermal and hydrodynamic entrance regions on heat transfer and flow are also investigated.
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Ulu, Ayse Gozde. "Experimental Investigation Of Uninterrupted And Interrupted Microchannel Heat Sinks." Master's thesis, METU, 2012. http://etd.lib.metu.edu.tr/upload/12614227/index.pdf.

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Experimental measurements are conducted on uninterrupted and interrupted aluminum microchannel heat sinks of 300, 500, 600 and 900 &mu
m channel widths. Two different versions of interrupted channels are tested
with single interruption and with 7 interruptions. Distilled water is used as the working fluid and tests are conducted at volumetric flow rates in a range of 0.5-1.1 lpm. Thermoelectric foils are used to supply uniformly distributed heat load to the heat sinks such that for all the tests the heat removed by water is kept constant at 40 W. Pressure drop and temperature increase are measured along the channels of different configurations for a number of different flow rates. For the interrupted channels thermal boundary layers re-initialize at the leading edge of each interrupted fin, which decreases the overall boundary layer thickness. Also the flow has been kept as developing, which results in better heat transfer performance. Due to the separation of the flow into branches, secondary flows appear which improves the mixing of the stream. Advanced mixing of the flow also enhances the thermal performance. In the experiments, it is observed that interruption of channels improved the thermal performance over the uninterrupted counterparts up to 20% in average Nusselt number, for 600 micron-wide channels. The improvement of average Nusselt number between the single interrupted and multi interrupted channels reached a maximum value of 56% for 500 micron-wide channels. This improvement did not cause a high pressure drop deviation between the uninterrupted and interrupted microchannels even for the maximum volumetric flow rate of 1.1 lpm. Highest pressure drop through the channels was measured as 0.07 bar, which did not require to change the pump. In the tests, maximum temperature difference between the inlet of the fluid and the base of the channel is observed as 32.8°
C, which is an acceptable value for electronic cooling applications.
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5

Wei, Xiaojin. "Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices." Diss., Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/4873.

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A stacked microchannel heat sink was developed to provide efficient cooling for microelectronics devices at a relatively low pressure drop while maintaining chip temperature uniformity. Microfabrication techniques were employed to fabricate the stacked microchannel structure, and experiments were conducted to study its thermal performance. A total thermal resistance of less than 0.1 K/W was demonstrated for both counter flow and parallel flow configurations. The effects of flow direction and interlayer flow rate ratio were investigated. It was found that for the low flow rate range the parallel flow arrangement results in a better overall thermal performance than the counter flow arrangement; whereas, for the large flow rate range, the total thermal resistances for both the counter flow and parallel flow configurations are indistinguishable. On the other hand, the counter flow arrangement provides better temperature uniformity for the entire flow rate range tested. The effects of localized heating on the overall thermal performance were examined by selectively applying electrical power to the heaters. Numerical simulations were conducted to study the conjugate heat transfer inside the stacked microchannels. Negative heat flux conditions were found near the outlets of the microchannels for the counter flow arrangement. This is particularly evident for small flow rates. The numerical results clearly explain why the total thermal resistance for counter flow arrangement is larger than that for the parallel flow at low flow rates. In addition, laminar flow inside the microchannels were characterized using Micro-PIV techniques. Microchannels of different width were fabricated in silicon, the smallest channel measuring 34 mm in width. Measurements were conducted at various channel depths. Measured velocity profiles at these depths were found to be in reasonable agreement with laminar flow theory. Micro-PIV measurement found that the maximum velocity is shifted significantly towards the top of the microchannels due to the sidewall slope, a common issue faced with DRIE etching. Numerical simulations were conducted to investigate the effects of the sidewall slope on the flow and heat transfer. The results show that the effects of large sidewall slope on heat transfer are significant; whereas, the effects on pressure drop are not as pronounced.
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Farnam, Dylan Sean. "Comparative analysis of microchannel heat sink configurations subject to a pressure constraint." Diss., Online access via UMI:, 2007.

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7

Koyuncuoglu, Aziz. "Design, Fabrication, And Experimental Evaluation Of Microchannel Heat Sinks In Cpu Cooling." Master's thesis, METU, 2010. http://etd.lib.metu.edu.tr/upload/12612430/index.pdf.

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A novel complementary metal oxide semiconductor (CMOS) compatible microchannel heat sink is designed, fabricated, and tested for electronic cooling applications. The proposed microchannel heat sink requires no design change of the electronic circuitry underneath. Therefore, microchannels can be fabricated on top of the finished CMOS wafers by just adding a few more steps to the fabrication flow. Combining polymer (parylene C) and metal (copper) structures, a high performance microchannel heat sink can be easily manufactured on top of the electronic circuits, forming a monolithic cooling system. In the design stage, computer simulations of the microchannels with several different dimensions have been performed. Microchannels made of only parylene showed poor heat transfer performance as expected since the thermal conductivity of parylene C is very low. Therefore an alternative design comprising structural parylene layer and embedded metal layers has been modeled. Copper is selected as the metal due to its simple fabrication and very good thermal properties. The results showed that the higher the copper surface area the better the thermal performance of the heat sinks. Based on the modeling results, the final test structures are designed with full copper sidewalls with a parylene top wall. Several different microchannel test chips have been fabricated in METU-MEMS Research &
Application Center cleanroom facilities. The devices are tested with different flow rates and heat loads. During the tests, it was shown that the test devices can remove about 126 W/cm2 heat flux from the chip surface while keeping the chip temperature at around 90°
C with a coolant flow rate of 500 &mu
l/min per channel.
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8

Al-Waaly, Ahmed. "The effect of heat transfer on temperature measurement and its applications to study microchannel heat sinks." Thesis, University of Glasgow, 2015. http://theses.gla.ac.uk/6781/.

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Analytical, numerical and experimental analyses have been performed to investigate the effects of thermocouple wire electrical insulation on the temperature measurement of a reference surface. Two diameters of K-type thermocouple, 80μm and 200μm, with different exposed stripped wire lengths (0 mm, 5mm, 10mm, 15mm and 20mm) were used to measure various surface temperatures (4oC, 8oC, 15oC, 25oC and 35oC). Measurements were made when the thermocouple probe is in direct contact with the surface and the wires are extended vertically and exposed to natural convection from outside environment. Experimental results confirmed that the thermal effect from the electrical insulation on temperature measurement was within -0.5oC and therefore it can be neglected. Moreover, the experimental results agree well with those obtained by both the analytical and numerical methods and further confirm that the diameter of the thermocouple has an impact on the temperature measurement. Analytical results of the thermocouple wire with insulation confirm that there is no specific value for the critical radius and the rate of heat flux around the thermocouple wire continuously increases with the wire radius even when this is larger than the critical radius. Experimental and numerical analyses have been performed to investigate the heating impact of using thermocouples for the temperature measurement of small volumes of cold water. Two sizes of K-type thermocouple have been used: 80μm and 315μm to measure the temperature of the cold water inside a small chamber while the thermocouple wires were extended vertically in the outside environment. For this study, the chamber temperature was adjusted to 4oC. The results show that the heating effect of the thermocouple decreases for the greater depth measurements and this effect is eliminated when the thermocouple junction is close to the chamber bottom surface. The increase in the thermal resistance between the bottom surface and the thermocouple junction raises the heating effect of the thermocouple impact. Moreover, the exposed length of thermocouple wires to the environment has no effect over a specific length where the wire end temperature is equal to that of the environment. Experimental and numerical analyses have been carried out to study the effect of using subchannels in heat sink to minimise the effect of hotspots generated on a chip circuit. Two devices of heat sink – with and without subchannels – were fabricated in order to investigate this effect. The first device was manufactured with a normal parallel channel while the second one was designed to extract more heat by dividing the main channels above the hotspot into two subchannels. A hotspot heat flux (16.7×104 [W/m2]) was applied at the centre of the channels while a uniform heat flux (4.45×104 [W/m2]) was applied at upstream and downstream of the channels. Five mass flow rates have generated under gravity force to investigate the performance of devices under different operating conditions. The results showed the maximum surface temperature was reduced by 4oC the temperature uniformity was improved. Moreover, thermal resistance was reduced by 25% but the pumping power was increased as a result of the presence of the subchannels.
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9

Ates, Ahmet Muaz. "Experimental Comparison Of Fluid And Thermal Characteristics Of Microchannel And Metal Foam Heat Sinks." Master's thesis, METU, 2011. http://etd.lib.metu.edu.tr/upload/12613577/index.pdf.

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Doubling transistor count for every two years in a computer chip, transmitter and receiver (T/R) module of a phased-array antenna that demands higher power with smaller dimensions are all results of miniaturization in electronics packaging. These technologies nowadays depend on improvement of reliable high performance heat sink to perform in narrower volumes. Employing microchannels or open cell metal foam heat sinks are two recently developing promising methods of cooling high heat fluxes. Although recent studies especially on microchannels can give a rough estimate on performances of these two methods, since using metal foams as heat sinks is still needed further studies, a direct experimental comparison of heat exchanger performances of these two techniques is still needed especially for thermal design engineers to decide the method of cooling. For this study, microchannels with channel widths of 300 µ
m, 420 µ
m, 500 µ
m and 900 µ
m were produced. Also, 92% porous 10, 20 and 40 ppi 6101-T6 open cell aluminum metal foams with compression factors 1,2, and 3 that have the same finned volume of microchannels with exactly same dimensions were used to manufacture heat sinks with method of vacuum brazing. They all have tested under same conditions with volumetric flow rate ranging from 0,167 l/min to 1,33 l/min and 60 W of heat power. Channel height was 4 mm for all heat sinks and distilled water used as cooling fluid. After experiments, pressure drops and thermal resistances were compared with tabulated and graphical forms. Also, the use of metal foam and microchannel heat sinks were highlighted with their advantages and disadvantages for future projects.
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10

Perry, Jeffrey L. "Fouling in silicon microchannel designs used for IC chip cooling and its mitigation /." Online version of thesis, 2008. http://hdl.handle.net/1850/6211.

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Books on the topic "Microchannel Heat Sinks"

1

Zhang, Lian, Kenneth E. Goodson, and Thomas W. Kenny. Silicon Microchannel Heat Sinks. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-09899-8.

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Zhang, Lian. Silicon Microchannel Heat Sinks: Theories and Phenomena. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004.

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G, Kandlikar S., Celata G. P, American Society of Mechanical Engineers., and Rochester Institute of Technology, eds. First International Conference on Microchannels and Minichannels: Presented at the First International Conference on Microchannels and Minichannels, April 24-25, 2003, Rochester, New York. New York, N.Y: American Society of Mechanical Engineers, 2003.

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International Conference on Microchannels and Minichannels (3rd 2005 Toronto, Ont.). Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005: Presented at 3rd International Conference on Microchannels and Minichannels, June 13-15, 2005, Toronto, Ontario, Canada. New York: American Society of Mechanical Engineers, 2005.

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International Conference on Microchannels and Minichannels (2nd 2004 Rochester, N.Y.). Microchannels and minichannels (ICMM2004): Proceedings of the Second International Conference on Microchannels and Minichannels : presented at the Second International Conference on Microchannels and Minichannels : June 17-19, 2004, Rochester, New York. Edited by Kandlikar S. G, Celata G. P, Rochester Institute of Technology, and American Society of Mechanical Engineers. New York, N.Y: American Society of Mechanical Engineers, 2004.

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International Conference on Microchannels and Minichannels (2nd 2004 Rochester, N.Y.). Microchannels and minichannels (ICMM2004): Proceedings of the Second International Conference on Microchannels and Minichannels : presented at the Second International Conference on Microchannels and Minichannels : June 17-19, 2004, Rochester, New York, USA. Edited by Celata G. P, Kandlikar S. G, American Society of Mechanical Engineers., and Rochester Institute of Technology. New York, N.Y: American Society of Mechanical Engineers, 2004.

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American Society of Mechanical Engineers., ed. Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels-- 2006: Presented at 4th International Conference on Nanochannels, Microchannels and Minichannels, June 19-21, 2006, Limerick, Ireland. New York: American Society of Mechanical Engineers, 2006.

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American Society of Mechanical Engineers., ed. Proceedings of the 5th International Conference on Nanochannels, Microchannels and Minichannels-- 2007: Presented at 5th International Conference on Nanochannels, Microchannels and Minichannels, June 18-20, 2007, Puebla, Mexico. New York: American Society of Mechanical Engineers, 2007.

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International Conference on Nanochannels, Microchannels and Minichannels (8th 2010 Montréal, Québec). Proceedings of the 8th International Conference on Nanochannels, Microchannels and Minichannels--2010: Presented at 8th International Conference on Nanochannels, Microchannels and Minichannels, August 1-5, 2010, Montreal, Canada. New York: American Society of Mechanical Engineers, 2011.

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International, Conference on Nanochannels Microchannels and Minichannels (9th 2011 Edmonton Canada). Proceedings of the 9th International Conference on Nanochannels, Microchannels and Minichannels--2011: Presented at 9th International Conference on Nanochannels, Microchannels and Minichannels, June 19-22, 2011, Edmonton, Canada. New York: American Society of Mechanical Engineers, 2012.

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Book chapters on the topic "Microchannel Heat Sinks"

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Jaluria, Yogesh. "Microchannel Flows as Heat Sinks." In Encyclopedia of Nanotechnology, 1–13. Dordrecht: Springer Netherlands, 2015. http://dx.doi.org/10.1007/978-94-007-6178-0_100965-1.

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Jaluria, Yogesh. "Microchannel Flows as Heat Sinks." In Encyclopedia of Nanotechnology, 2145–56. Dordrecht: Springer Netherlands, 2016. http://dx.doi.org/10.1007/978-94-017-9780-1_100965.

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Zhang, Lian, Kenneth E. Goodson, and Thomas W. Kenny. "Two-phase Microchannel Heat Sinks: Problems and Challenges." In Microtechnology and MEMS, 13–32. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-09899-8_2.

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Cruz-Duarte, Jorge M., Arturo García-Pérez, Iván M. Amaya-Contreras, and Rodrigo Correa. "Assessing Film Coefficients of Microchannel Heat Sinks via Cuckoo Search Algorithm." In Heuristics for Optimization and Learning, 377–91. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-58930-1_25.

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Kode, T. E., A. A. Ogwu, A. Walker, M. Mirzaeian, and H. Wu. "Manufacturing, Numerical and Analytical Model Limitations in Developing Fractal Microchannel Heat Sinks for Cooling MEMS, Microelectronics and Aerospace Components." In Micro and Nanomanufacturing Volume II, 499–543. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-67132-1_17.

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Adham, Ahmed Mohammed, Normah Mohd-Ghazali, and Robiah Ahmad. "Multi-objective Optimization Algorithms for Microchannel Heat Sink Design." In Contemporary Challenges and Solutions in Applied Artificial Intelligence, 169–74. Heidelberg: Springer International Publishing, 2013. http://dx.doi.org/10.1007/978-3-319-00651-2_23.

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Husain, Afzal, and Kwang-Yong Kim. "Optimization of Ribbed Microchannel Heat Sink Using Surrogate Analysis." In Computational Fluid Dynamics 2008, 529–34. Berlin, Heidelberg: Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-642-01273-0_69.

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Jadhav, Subhash V., Sachin M. Kale, Dattatray T. Kashid, Sunil S. Kakade, Sachin R. Gavali, and Subhash D. Shinde. "Performance Analysis of Heat Sink with Different Microchannel Orientations." In Techno-Societal 2018, 367–76. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-16962-6_38.

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Yin, Liming, Mei Wang, Jinzhu Zhou, and Tang Li. "Design and Numerical Simulation of a New Microchannel Heat Sink." In Lecture Notes in Electrical Engineering, 334–44. Singapore: Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-32-9441-7_34.

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Gaikwad, V. P., S. D. Ghogare, and S. S. Mohite. "Numerical Study on Microchannel Heat Sink with Asymmetric Leaf Pattern." In Techno-Societal 2016, 495–507. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-53556-2_49.

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Conference papers on the topic "Microchannel Heat Sinks"

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Garimella, Suresh V., and Vishal Singhal. "Single-Phase Flow and Heat Transport in Microchannel Heat Sinks." In ASME 2003 1st International Conference on Microchannels and Minichannels. ASMEDC, 2003. http://dx.doi.org/10.1115/icmm2003-1018.

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Microchannel heat sinks are widely regarded as being amongst the most effective heat removal techniques from space-constrained electronic devices. However, the fluid flow and heat transfer in microchannels is not fully understood. The pumping requirements for flow through microchannels are also very high and none of the micropumps in the literature are truly suitable for this application. A wide-ranging research program on microchannel heat sinks and micropumps is underway in the Electronics Cooling Laboratory at Purdue University. This article provides an overview of the research being conducted to understand fluid flow and heat transfer in microchannels and to identify pumping requirements and suitable mechanisms for pumping in microchannels.
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Jung, Jaehoon, and Sung Jin Kim. "Entropy Generation Analysis of Microchannel Heat." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-10841.

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Analytical solutions for entropy generation rate distribution associated with heat transfer and fluid friction in microchannel heat sinks are examined. Microchannel heat sinks are modeled as a porous medium through which fluid flows. Analytical solutions are obtained by using velocity and temperature distributions of microchannel heat sinks, which are based on the modified Darcy model for fluid flow and the two-equation model for heat transfer. Using the analytical solution, the entropy generation of heat sinks was obtained. The effects of height, channel width, and fin thickness on the entropy generation rate were studied and thermal optimization of heat sink was performed.
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Rasouli, Erfan, and Vinod Narayanan. "Single-Phase Cryogenic Flows Through Microchannel Heat Sinks." In ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/icnmm2014-21275.

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Cryogenic fluids are used widely in several thermal management applications such as in regenerative cooling of rocket engine combustor liners, missile warning receivers, satellite tracking systems and cryo-adsorbent hydrogen storage systems. Single phase laminar flow and heat transfer rate of liquid nitrogen in microchannels is studied experimentally in this paper. The performance of two distinct geometries of microchannel heat sinks are evaluated and compared for simultaneous developing laminar flow in the Reynolds number range from 180 to 610. The first geometry pertains to parallel microchannels while the second corresponds to a staggered microscale pin fin array. Two parallel microchannel geometries having identical widths of 140μm and identical laminar thermal resistances but with different aspect ratios of 4.7 and 7.6 are compared. The pin fin heat sink consisted of square pins of 395μm side and oriented at 45 degrees to the flow. All three heat sinks have identical heat source surface area. Results are presented in a non-dimensional form in terms of the friction factor, Nusselt, Reynolds numbers and compared with the predictions of existing correlations in the literature for parallel microchannels and micro pin fin heat sinks.
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Rubio-Jimenez, Carlos A., Abel Hernandez-Guerrero, Cuauhtemoc Rubio-Arana, and Daniela Popescu. "Comparison Between Traditional Microchannels Heat Sinks and Microchannels Heat Sinks Based on Biomimical Tendencies." In ASME 2008 9th Biennial Conference on Engineering Systems Design and Analysis. ASMEDC, 2008. http://dx.doi.org/10.1115/esda2008-59436.

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In the last few years high-tendency electronic devices have improved to a larger processing capability with smaller physical dimensions. This fact coupled to traditional cooling mechanisms, are not able to dissipate the high heat fluxes generated by these devices (around 200 W/cm2.) Microchannel heat sinks are the new tendency in heat dissipation. Many of the studies done before had used single-phase water as cooling fluid in laminar flow. Operating within this regimen, and using water as the cooling fluid, the dissipated heat flux is not enough to keep optimal operational conditions in the electronic devices. Therefore, this work presents a thermal and hydraulic numerical analysis for a microchannel heat sink with circular cross section, fabricated in a silicon substrate. The channel cross section is variable, being a function of the heat sink longitudinal position, decreasing as the cooling fluid passes through the channel. The ratio between the inlet and outlet diameters is given as a function of the Biomimic tendency. These theories are based on the behavior that nature has for the mass transport in circular ducts. The cooling fluid used in this study is water in single-phase. These microchannels heat sink arrangements are based in the operational and geometrical parameters of previous works developed by several authors on microchannels heat sinks with constant and conventional cross sections.
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Betz, Amy Rachel, and Daniel Attinger. "Bubble Injection to Enhance Heat Transfer in Microchannel Heat Sinks." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-11972.

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Liquid cooling is an efficient way to remove heat fluxes with magnitude of 1 to 10,000 W/cm2. One limitation of current single-phase microchannel heat sinks is the relatively low Nusselt number, because of laminar flow. In this work, we experimentally investigate how to enhance the Nusselt number in the laminar regime with the periodic injection of non-condensable bubbles in a water-filled array of microchannels in a segmented flow pattern. We designed a polycarbonate heat sink consisting of an array of parallel microchannels with a low ratio of heat to convective resistance, to facilitate the measurement of the Nusselt Number. Our heat transfer and pressure drop measurements are in good agreement with existing correlations, and show that the Nusselt number of a segmented flow is increased by more than a hundred percent over single-phase flow provided the mass velocity is within a given range.
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Hu, Haibao, Sarada Kuravi, Feng Ren, and Pei-feng Hsu. "Liquid Metal Flows in Manifold Microchannel Heat Sinks." In ASME 2014 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/imece2014-39283.

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Heat transfer and flow performance of water and galinstan in manifold microchannel heat sinks is analyzed. The three dimensional flow and conjugate heat transfer is numerically simulated for microchannels of two different hydraulic diameters. The heat transfer coefficient, wall temperature variation at the base, and performance factor were analyzed for the same inlet velocity, Reynolds number and pressure drop conditions for water and liquid metal for different heat flux boundary conditions. Due to the short length of microchannels, it was found that performance factor of liquid metal is larger compared to water for all the cases.
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Alkhazaleh, Anas, Mohamed Younes El-Saghir Selim, Fadi Alnaimat, and Bobby Mathew. "Thermo-Hydraulic Performance of Heat Sinks With Microchannel Embedded With Pin-fins." In ASME 2021 Heat Transfer Summer Conference collocated with the ASME 2021 15th International Conference on Energy Sustainability. American Society of Mechanical Engineers, 2021. http://dx.doi.org/10.1115/ht2021-62804.

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Abstract In this work, an investigation of the heat sink performance employing sinusoidal microchannels embedded with pin fins was conducted. The effect of the sine wave frequency, the pin fins’ diameter, and the hydraulic diameter of the microchannel are studied. The results are quantified in terms of thermal resistance and pressure drop. The study was done using Reynolds numbers varying from 250 to 2000. As Reynolds number increases, the heat sink’s thermal resistance decreased while the pressure drop increased accordingly for all scenarios. The sinusoidal microchannels showed better performance — lower thermal resistance — but with the cost of higher pressure drop compared to the straight microchannel heat sink. The heat sink’s performance was improved by increasing the frequency, diameter of pin fins, and hydraulic diameter; however, this reduction in thermal resistance was associated with an increase in pressure drop. The reduction in thermal resistance of the different configurations of the sinusoidal microchannels was between 17% and 69% compared to the straight microchannel heat sink.
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Wei, Xiaojin, Yogendra Joshi, and Michael K. Patterson. "Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics." In ASME 2004 International Mechanical Engineering Congress and Exposition. ASMEDC, 2004. http://dx.doi.org/10.1115/imece2004-62509.

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Stacked microchannels provide larger flow passages, so that for a fixed heat load the required pressure drop is significantly reduced. One unique feature of the stacked microchannel heat sink is that individual layers populated with parallel microchannels or distributing manifolds can be bonded into one stack with independent flow path. As a beneficial result, flexible control over the flow direction and flow rate can be harnessed to achieve better temperature uniformity and the low junction temperature. In the present work, stacked microchannels with different flow arrangement have been fabricated on silicon wafers using micromachining techniques. Platinum thin film heaters are deposited on the backside of the stacked structure to provide heating. In a close-loop setup, water is pumped through the microchannels to carry the heat from the heaters to a remote liquid-liquid heat exchanger rejecting the heat to a recirculating chiller. Wall temperature along the flow direction is measured at nine locations using platinum resistive temperature detectors deposited at the same time as the heaters. Good overall cooling performance (0.09°C/(W/cm2)) for the stacked microchannel heat sink has been shown in the experiments. It has also been identified that over the tested flow rate range counter-flow arrangement provides better temperature uniformity, while parallel flow has the best performance in reducing the peak temperature.
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Muwanga, Roland, and Ibrahim Hassan. "Flow Boiling Oscillations in Microchannel Heat Sinks." In 9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference. Reston, Virigina: American Institute of Aeronautics and Astronautics, 2006. http://dx.doi.org/10.2514/6.2006-3412.

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Zhou, Yuqing, Tsuyoshi Nomura, and Ercan M. Dede. "Topology Optimization of Manifold Microchannel Heat Sinks." In 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2020. http://dx.doi.org/10.1109/itherm45881.2020.9190257.

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