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Dissertations / Theses on the topic 'Microchannel Heat Sinks'

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Published: 4 June 2021
Last updated: 25 July 2025

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1

Phillips, Richard J. "Forced-convection, liquid-cooled, microchannel heat sinks." Thesis, Massachusetts Institute of Technology, 1987. http://hdl.handle.net/1721.1/14921.

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Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1987.<br>MICROFICHE COPY AVAILABLE IN ARCHIVES AND ENGINEERING<br>Bibliography: v.2, leaves 286-291.<br>by Richard J. Phillips.<br>M.S.
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2

Lee, Man. "Forced convection heat transfer in integrated microchannel heat sinks /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20LEE.

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3

Turkakar, Goker. "Numerical Simulation And Analytical Optimization Of Microchannel Heat Sinks." Master's thesis, METU, 2010. http://etd.lib.metu.edu.tr/upload/12612377/index.pdf.

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This study has two main objectives: The performance evaluation of existing microchannel heat sinks using a CFD model, and the dimensional optimization of various heat sinks by minimizing the total thermal resistance. For the analyses, the geometric modeling is performed using the software GAMBIT while the thermal analysis is performed with FLUENT. The developed model compares very well with those available in the literature. Eight different metal-polymer microchannel heat sinks are analyzed using the model to find out how much heat could be provided to the systems while keeping the substrate t
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4

Ulu, Ayse Gozde. "Experimental Investigation Of Uninterrupted And Interrupted Microchannel Heat Sinks." Master's thesis, METU, 2012. http://etd.lib.metu.edu.tr/upload/12614227/index.pdf.

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Experimental measurements are conducted on uninterrupted and interrupted aluminum microchannel heat sinks of 300, 500, 600 and 900 &mu<br>m channel widths. Two different versions of interrupted channels are tested<br>with single interruption and with 7 interruptions. Distilled water is used as the working fluid and tests are conducted at volumetric flow rates in a range of 0.5-1.1 lpm. Thermoelectric foils are used to supply uniformly distributed heat load to the heat sinks such that for all the tests the heat removed by water is kept constant at 40 W. Pressure drop and temperature increase ar
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5

Wei, Xiaojin. "Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices." Diss., Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/4873.

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A stacked microchannel heat sink was developed to provide efficient cooling for microelectronics devices at a relatively low pressure drop while maintaining chip temperature uniformity. Microfabrication techniques were employed to fabricate the stacked microchannel structure, and experiments were conducted to study its thermal performance. A total thermal resistance of less than 0.1 K/W was demonstrated for both counter flow and parallel flow configurations. The effects of flow direction and interlayer flow rate ratio were investigated. It was found that for the low flow rate range the par
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6

Farnam, Dylan Sean. "Comparative analysis of microchannel heat sink configurations subject to a pressure constraint." Diss., Online access via UMI:, 2007.

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7

Koyuncuoglu, Aziz. "Design, Fabrication, And Experimental Evaluation Of Microchannel Heat Sinks In Cpu Cooling." Master's thesis, METU, 2010. http://etd.lib.metu.edu.tr/upload/12612430/index.pdf.

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A novel complementary metal oxide semiconductor (CMOS) compatible microchannel heat sink is designed, fabricated, and tested for electronic cooling applications. The proposed microchannel heat sink requires no design change of the electronic circuitry underneath. Therefore, microchannels can be fabricated on top of the finished CMOS wafers by just adding a few more steps to the fabrication flow. Combining polymer (parylene C) and metal (copper) structures, a high performance microchannel heat sink can be easily manufactured on top of the electronic circuits, forming a monolithic cooling system
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8

Al-Waaly, Ahmed. "The effect of heat transfer on temperature measurement and its applications to study microchannel heat sinks." Thesis, University of Glasgow, 2015. http://theses.gla.ac.uk/6781/.

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Analytical, numerical and experimental analyses have been performed to investigate the effects of thermocouple wire electrical insulation on the temperature measurement of a reference surface. Two diameters of K-type thermocouple, 80μm and 200μm, with different exposed stripped wire lengths (0 mm, 5mm, 10mm, 15mm and 20mm) were used to measure various surface temperatures (4oC, 8oC, 15oC, 25oC and 35oC). Measurements were made when the thermocouple probe is in direct contact with the surface and the wires are extended vertically and exposed to natural convection from outside environment. Exper
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9

Ates, Ahmet Muaz. "Experimental Comparison Of Fluid And Thermal Characteristics Of Microchannel And Metal Foam Heat Sinks." Master's thesis, METU, 2011. http://etd.lib.metu.edu.tr/upload/12613577/index.pdf.

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Doubling transistor count for every two years in a computer chip, transmitter and receiver (T/R) module of a phased-array antenna that demands higher power with smaller dimensions are all results of miniaturization in electronics packaging. These technologies nowadays depend on improvement of reliable high performance heat sink to perform in narrower volumes. Employing microchannels or open cell metal foam heat sinks are two recently developing promising methods of cooling high heat fluxes. Although recent studies especially on microchannels can give a rough estimate on performances of these t
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10

Perry, Jeffrey L. "Fouling in silicon microchannel designs used for IC chip cooling and its mitigation /." Online version of thesis, 2008. http://hdl.handle.net/1850/6211.

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11

Thiagarajan, Naveenan Bhavnani S. H. "Experimental investigation of thermo-hydraulic characteristics of two-phase flow of FC72 in microchannel heat sinks." Auburn, Ala., 2009. http://hdl.handle.net/10415/1954.

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12

Kuravi, Sarada. "Numerical Study of Encapsulated Phase Change Material (EPCM) Slurry Flow in Microchannels." Doctoral diss., University of Central Florida, 2009. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/4093.

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Heat transfer and flow characteristics of phase change material slurry flow in microchannels with constant heat flux at the base were investigated. The phase change process was included in the energy equation using the effective specific heat method. A parametric study was conducted numerically by varying the base fluid type, particle concentration, particle size, channel dimensions, inlet temperature, base heat flux and melting range of PCM. The particle distribution inside the microchannels was simulated using the diffusive flux model and its effect on the overall thermal performance of micr
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13

Bogojević, Dario. "Flow boiling and two-phase flow instabilities in silicon microchannel heat sinks for microsystems cooling." Thesis, University of Edinburgh, 2010. http://hdl.handle.net/1842/3791.

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Flow boiling in microchannels, while very promising as a cooling technology in electronics thermal management, is still a subject being explored that requires further investigation. Before applying this technology for high heat flux computer chip cooling, challenging issues such as fully understanding boiling mechanisms in confined spaces, extending and stabilising the nucleate boiling regime, suppressing flow boiling instabilities, maintaining uniform flow distribution among microchannels, have to be addressed. If flow boiling is to be used as a thermal management method for high heat flux el
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14

Dietz, Carter Reynolds. "Single-phase forced convection in a microchannel with carbon nanotubes for electronic cooling applications." Thesis, Available online, Georgia Institute of Technology, 2007, 2007. http://etd.gatech.edu/theses/available/etd-07052007-155623/.

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Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2008.<br>Dr. David Gerlach, Committee Member ; Dr. Samuel Graham, Committee Member ; Dr. Minami Yoda, Committee Member ; Dr. Yogendra Joshi, Committee Chair.
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15

Chauhan, Anjali. "Hot spot mitigation in microprocessors by application of single phase microchannel heat sink and microprocessor floor planning." Diss., Online access via UMI:, 2009.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineeering, 2009.<br>Includes bibliographical references.
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16

Pate, Daniel Thomas Bhavnani S. H. "Experimental investigation of cavity induced two phase flow in silicon microchannels." Auburn, Ala., 2006. http://repo.lib.auburn.edu/2006%20Summer/Theses/PATE_DANIEL_19.pdf.

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17

Kuan, Wai Keat. "Experimental study of flow boiling heat transfer and critical heat flux in microchannels /." Link to online version, 2006. https://ritdml.rit.edu/dspace/handle/1850/1887.

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18

Tunuguntla, Sri Priyanka. "Numerical Study of Thermal Performance of Two-Layered Microchannel Heat Sink with Nanofluids For Cooling of Microelectronics." University of Cincinnati / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1307442807.

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19

Steinke, Mark E. "Single-phase liquid flow and heat transfer in plain and enhanced silicon microchannels /." Link to online version, 2005. http://hdl.handle.net/1850/999.

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20

Eidi, Ali Fadhil. "Experimental Evaluation of an Additively Manufactured Straight Mini-Channel Heat Sink for Electronics Cooling." Thesis, Virginia Tech, 2021. http://hdl.handle.net/10919/102777.

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The continuous miniaturization of electronic devices and the corresponding increase in computing powers have led to a significant growth in the density of heat dissipation within these devices. This increase in heat generation has challenged conventional air fan cooling and alternative solutions for heat removal are required to avoid overheating and part damage. Micro/Mini channel heat sinks (M/MCHS) that use liquids for heat removal appear as an attractive solution to this problem as they provide large heat transfer area per volume. Mini/microchannels traditionally have suffered from geometri
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21

Al, Siyabi I. "Enhancing the performance of concentrating photovoltaics through multi-layered microchannel heat sink and phase change materials." Thesis, University of Exeter, 2019. http://hdl.handle.net/10871/35932.

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Concentrating Photovoltaic technology is considered now as a promising option for solar electricity generation along with the conventional flat plate PV technology especially in high direct normal irradiance areas. However, the concentrating photovoltaic industry sector still struggles to gain market share and to achieve adequate economic returns due to challenges such as the high temperature of the solar cell which causes a reduction its efficiency. The work presented in this thesis is targeted to influence the overall performance of a high concentrated photovoltaic system by integrating both
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22

Sahu, Vivek. "Hybrid solid-state/fluidic cooling for thermal management of electronic components." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/45817.

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A novel hybrid cooling scheme is proposed to remove non-uniform heat flux in real time from the microprocessor. It consists of a liquid cooled microchannel heat sink to remove the lower background heat flux and superlattice coolers to dissipate the high heat flux present at the hotspots. Superlattice coolers (SLC) are solid-state devices, which work on thermoelectric effect, and provide localized cooling for hotspots. SLCs offer some unique advantage over conventional cooling solutions. They are CMOS compatible and can be easily fabricated in any shape or size. They are more reliable as they d
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23

Ojada, Ejiro Stephen. "Analysis of mass transfer by jet impingement and study of heat transfer in a trapezoidal microchannel." [Tampa, Fla] : University of South Florida, 2009. http://purl.fcla.edu/usf/dc/et/SFE0003297.

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24

Nascimento, Francisco Júlio do. "Estudo teórico-experimental da transferência de calor e da perda de pressão em um dissipador de calor baseado em microcanais." Universidade de São Paulo, 2012. http://www.teses.usp.br/teses/disponiveis/18/18147/tde-14082012-113947/.

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A presente dissertação trata de um estudo teórico-experimental sobre escoamento monofásico e bifásico em um dissipador de calor baseado em microcanais. Este tipo de dissipador de calor tem sido usado para a intensificação da troca de calor em sistemas compactos e de alto desempenho. A intensificação da troca de calor promovida pelo escoamento em microcanais é acompanhada de um incremento na perda de pressão, portanto o estudo destes dois parâmetros é essencial para o entendimento dos fenômenos relacionados e fundamental para o desenvolvimento de ferramen
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25

Toro, Cristian Alfredo Chávez. "Transferência de calor e perda de pressão durante a ebulição convectiva de hidrocarbonetos em um dissipador de calor baseado em multi-microcanais." Universidade de São Paulo, 2016. http://www.teses.usp.br/teses/disponiveis/18/18147/tde-03052017-160433/.

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A presente tese envolve um estudo experimental da ebulição convectiva no interior de um dissipador de calor baseado em multi-microcanais. Resultados experimentais para perda de pressão e coeficiente de transferência de calor foram levantados para os hidrocarbonetos R600a (isobutano), R290 (propano) e R1270 (propileno), fluidos com reduzido GWP (Global Warming Potential) e ODP (Ozone Depletion Potential) nulo. O desempenho termo-hidráulico destes fluidos foi avaliado em um dissipador de calor de cobre, contendo cinquenta canais paralelos com seção transversal retangular de 123x494 µm2 , 15 mm d
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26

Arroyave, Ortegón Jorge Andrés. "Desenvolvimento de um dissipador de calor compacto para o resfriamento de células fotovoltaicas de alta concentração (HCPV)." Ilha Solteira, 2018. http://hdl.handle.net/11449/154894.

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Orientador: Elaine Maria Cardoso<br>Resumo: A energia solar pode ser aproveitada como fonte de energia térmica para aquecimento de água, por exemplo, em coletores solares ou como fonte de energia elétrica usando sistemas de células fotovoltaicas. Entretanto, as células fotovoltaicas, geralmente, de custos relativamente altos, têm algumas restrições relacionadas a altas temperaturas de operação e distribuições de temperatura não homogêneas levando a redução da vida útil e eficiência elétrica de tais sistemas. Essas limitações têm sido o foco de pesquisas, a fim de melhorar as eficiências elétri
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27

Leão, Hugo Leonardo Souza Lara. "Análise experimental dos efeitos do fluido e da orientação do escoamento no desempenho de dissipadores de calor baseados na ebulição convectiva em microcanais." Universidade de São Paulo, 2014. http://www.teses.usp.br/teses/disponiveis/18/18147/tde-19082014-102054/.

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A pesquisa realizada envolveu a avaliação experimental dos efeitos do fluido e da orientação do escoamento no desempenho de um dissipador de calor baseado na ebulição convectiva em microcanais. Estes dissipadores de calor são usados como uma nova aplicação para a refrigeração dos novos dispositivos eletrônicos que geram altas taxas de calor. Efetuou-se inicialmente uma extensa pesquisa bibliográfica sobre o escoamento monofásico e a ebulição convectiva em microcanais e em multi-microcanais através da qual levantou-se os principais métodos de previsão do coeficiente de transferência de calor e
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28

Riera, Curt Sara. "Estudi experimental i numèric d’un sistema de refredament híbrid de jet impactant i microcanals a escala micromètrica." Doctoral thesis, Universitat de Lleida, 2015. http://hdl.handle.net/10803/365303.

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En aquesta tesi s’avalua un sistema híbrid de jet impactant/ microcanals, a escala micromètrica. S’inclou el procediment de dimensionament i la construcció del dissipador mitjançant el procés de microfabricació. Amb proves experimentals que permeten el càlcul de paràmetres com el coeficient de resistència tèrmica i la desviació estàndard de la temperatura, s’avalua el comportament del sistema en comparació amb d’altres de similars a escala mil•limètrica. Paral•lelament es desenvolupa i valida un model numèric per simular el comportament del dispositiu. El model permet analitzar l’efecte
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29

Perret, Corinne. "Réalisation et optimisation de refroidisseurs à microcanaux en technologie silicium." Phd thesis, Grenoble INPG, 2001. http://www.theses.fr/2001INPG0034.

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Les convertisseurs d'électronique de puissance sont de plus en plus compacts. Les pertes générées dans les différents composants restent sensiblement constantes, voire croissantes, pour une puissance donnée, car l'augmentation des fréquences de travail est pénalisante à ce niveau. Les puissances volumiques à évacuer sont donc en augmentation et nécessitent la conception de refroidisseurs plus efficaces. Nous présentons dans cette thèse une démarche visant à réaliser des refroidisseurs à microcanaux en technologie silicium. Après avoir rappelé une méthode de calcul des pertes et les lois de la
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30

Perret, Corinne. "Réalisation et optimisation de refroidisseurs à microcanaux en technologie silicium." Phd thesis, Grenoble INPG, 2001. http://tel.archives-ouvertes.fr/tel-00549755.

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Les convertisseurs d'électronique de puissance sont de plus en plus compacts. Les pertes générées dans les différents composants restent sensiblement constantes, voire croissantes, pourune puissance donnée, car l'augmentation des fréquences de travail 'est pénalisante à ce niveau. Les puissances volumiques à évacuer sont donc en augmentation et nécessitent la conception de· refroidisseurs plus efficaces. Les meilleures performances sont actuellement obtenues par des refroidisseurs en cuivre à microcanaux parcourus par un fluide caloporteur. Afin.de limiter les problèmes de fatigue thermique, d
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31

Shu-ChingLiao and 廖淑菁. "Numerical Optimization of Trapezoidal Microchannel Heat Sinks." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/31243249337984834124.

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32

Li, Wei-ping, and 李偉平. "Heat Transfer Analysis and Channel Designs of Microchannel Heat Sinks." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/96896024583791424982.

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碩士<br>國立臺南大學<br>綠色能源科技研究所碩士班<br>100<br>In this thesis, the numerical analysis is performed to examine the possible methods to enhance the heat transfer performance of microchannel heat sink (MCHS) by computational fluid dynamics software. The effects of geometric parameters and nanofluids are discussed in details for the enhancement of heat transfer performance in MCHs. For the design of two-layer MCHS, the effects of geometric parameters such as channel number, channel width ratio, channel aspect ratio, and pumping power on the temperature distribution and thermal resistance are discussed in
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33

Chen, YehFeng, and 陳業豐. "Performance of Thermoelectric Cooler Integrated with Microchannel Heat Sinks." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/67271114189859742589.

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碩士<br>國立中興大學<br>機械工程學系<br>92<br>The major goal of the present study is using the thermoelectric cooler(TEC) for cooling a fixed volume of water, the microchannel were fabricated by using IC-based micromachining techniques is employed at the TEC hot side to dissipate heat and discuss effect of six specific geometries of silicon microchannel heat sink performance for TEC cooling. Finally, a theoretical model on lumped system is established and used to predict the transient behavior of water temperature variation with time. The measurements show that temperature of water decreases with
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34

Lin, Jing-Wei, and 林敬唯. "Optimization of Design Parameters for Fibonacci Spiral Microchannel Heat Sinks." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/p6jndf.

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碩士<br>中原大學<br>機械工程研究所<br>105<br>In this study, the Fibonacci series was adopted in design-optimal of spiral micro channel heat sink. By using Taguchi Method, the performance variation in different channel parameters (such as width, height, flow rate, and fluid media) combinations were thoroughly studied, aimed for producing higher performance spiral micro channel heat sink. There are two phases in this study: Firstly, the ANSYS fluent numerical simulation software and Taguchi Method were used to shorten the design and experiment time. Secondly, the pressure drop and thermal resistance were c
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35

Huang, Jun-min, and 黃俊閔. "HEAT TRANSFER AND PRESSURE DROP CHARACTERISTICS FOR HFE-7100 WITHIN MICROCHANNEL HEAT SINKS." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/01437923921722950668.

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碩士<br>國立中正大學<br>機械工程所<br>97<br>This study examines the heat transfer and pressure drop characteristics of the dielectric fluid HFE-7100 within multiport microchannel heat sink having a square configuration rectangular with a hydraulic diameter of 460μm and790μm. For a lower mass flux of 100 or 200kg/m2s, it is found that the heat transfer coefficients are roughly independent of heat flux and vapor quality provided that no flow reversal occurs. However, with the presence of flow reversal at an elevated heat flux, appreciable drop of heat transfer coefficient is encountered. The flow reversal al
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36

Ding, Chang-Yi, and 丁章議. "Thermal Flow Field and Cooling Performance of Nanofluids in Microchannel Heat Sinks." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/9dr8f2.

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碩士<br>國立虎尾科技大學<br>機械與機電工程研究所<br>97<br>The objective of this work is to investigate thoroughly the forced convection heat transfer of nanofluid flow through microchannel heat sinks. In view of the small dimensions of the microstructures, the microchannel heat sink is modeled as a fluid-saturated porous medium by using a general non-Darcy model to describe the flow and the two-equation model is used for heat transfer. A numerical study is carried out to solve the flow field and thermal transport problems. Results for the velocity profiles of the coolant flow and the temperature distributions
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37

Dang, Minh Nhat. "A study on two-phase flow characteristics in cross-linked microchannel heat sinks." Thesis, 2007. http://spectrum.library.concordia.ca/975499/1/MR34741.pdf.

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Thermal management for high performance of miniaturized electronic devices using microchannel heat sinks has recently become of interest to researchers and industry. Obtaining heat sink designs with uniform flow distribution is strongly desired. Mal-distribution in a standard straight microchannel heat sink has become a problematic issue in this research area. A cross-linking scheme, introduced in the channel core promises an appropriate solution to this problem due to flow sharing through the cross-links. In the present thesis, a number of experimental and numerical studies have been conducte
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38

Levac, Marc. "Three-dimensional analysis of two-layered microchannel heat sinks in parallel and counter-flow arrangements." 2008. http://hdl.handle.net/1993/21093.

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39

Ling, Ling. "Numerical Investigation of the Cooling Performance of Microchannel Heat Sinks under Uniform and Non-Uniform Heating Conditions." Thesis, 2012. http://spectrum.library.concordia.ca/975059/1/Ling_MASc_S2013.pdf.

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High-power electronic devices are now widely applied in computer, mechanical and sustainable energy industries. As electronic devices become further more integrated and powerful, more effective cooling is required to remove increasing heat fluxes generated by smaller devices. Microchannel heat sink has been recognized as a very promising cooling technology since it was brought up by Tuckerman and Pease. The purpose of the present work is to numerically study the cooling performance of microchannel heat sinks under non-uniform heating conditions and to compare to that under uniform heating con
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40

Ighalo, Fervent U. "Optimisation of microchannels and micropin-fin heat sinks with computational fluid dynamics in combination with a mathematical optimisation algorithm." Diss., 2011. http://hdl.handle.net/2263/26207.

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In recent times, high power density trends and temperature constraints in integrated circuits have led to conventional cooling techniques not being sufficient to meet the thermal requirements. The ever-increasing desire to overcome this problem has led to worldwide interest in micro heat sink design of electronic components. It has been found that geometric configurations of micro heat sinks play a vital role in heat transfer performance. Therefore, an effective means of optimally designing these heat sinks is required. Experimentation has extensively been used in the past to understand the be
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41

Bedi, Nishit. "Conjugate Heat Transfer Analysis in Multi Microchannel Heat Sink." Thesis, 2018. http://localhost:8080/iit/handle/2074/7575.

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42

Shiao, Shin-Duan, and 蕭心端. "Experimental Study of Microchannel Geometry on the Microchannel Heat Sink Performance Enhancement." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/77817152086764854254.

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碩士<br>國立中興大學<br>機械工程學系所<br>94<br>In this study，performances of two types of microscale heat sinks based on the modifications from the conventional parallel channel heat sink (PCHS) are studied experimentally。By referring the walls that separating the channels in PCHS as the plate fins，the first type of modified heat sinks involves placing obstacles alternatively on the plate fins. As a result，the original parallel channels in PCHS become winded。This type of heat sink is referred to as the obstructive channel heat sink (OCHS)。It is intended to enhance the heat transfer coefficient by the flow d
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43

Yu-PinHsu and 許毓彬. "Thermal Analysis and Optimization of Microchannel Heat Sink." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/37701846224452019201.

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碩士<br>國立成功大學<br>機械工程學系碩博士班<br>98<br>Three-dimensional incompressible laminar fluid flow and heat transfer of a rectangular micro-channel heat sink is studied numerically using water as a cooling fluid in a silicon substrate. The control volume approach is developed for solving Navier-Stokes equations with conjugate energy equation for both fluid and solid regions. The QUICK and SIMPLE techniques are used for discretization of momentum and energy equations. In this studied, computations were performed for a range of 50≦Re≦600, 0.05W≦P≦0.25W, 100W/cm2≦q"≦300W/cm2. Solutions are first carefully v
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44

Lu, Chun-Ting, and 盧俊庭. "Development of a Highly Stable Microchannel Heat Sink." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/97394825354763002963.

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博士<br>國立清華大學<br>工程與系統科學系<br>99<br>With microprocessor performance increasing, the power generation from a microprocessor chip is expected to exceed 180 W/cm2 and the limits of current air-cooling technology will be reached, i.e., forced air heat sinks have become significantly larger with more expensive and noisier. Therefore, there is a need to address the thermal challenge of high-heat-flux for next generation of power electronics. Flow boiling in microchannels, considered as one of the most promising technologies, has the advantages of highest heat fluxes, lowest pumping powers, and the hig
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Kroeker, Christopher J. "Three-dimensional thermal analysis of heat sinks with circular microchannels." 2003. http://hdl.handle.net/1993/19928.

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Chuang, Jason, and 莊志升. "Experimental Study of Heat Transfer in Nanofluid-cooled Microchannel Heat Sink." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/25517146589492126235.

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碩士<br>國立中興大學<br>機械工程學系<br>93<br>The major goal of this study is to investigate the microchannel heat sink performance using nanofluids for the coolant. Pure water, nanofluids with volume fraction of 0.204%, 0.25%, 0.294% and 0.4%.and Ethylene glycol- nanofluids with volume fraction of 0.208% are employed in this study. Under the fixed heating power, microchannel heat sink performance in terms of thermal resistance and overall Nusselt number are evaluated bead on the measured with temp variations along the heat sink base plate . The coolant flow rate employed in the rage of 10 to 20 ml/min. A
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Lin, Shih-han, and 林詩涵. "Numerical Study of Microchannel Heat Sink Performance using Nanofluids." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/04893553231914996201.

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碩士<br>國立成功大學<br>機械工程學系碩博士班<br>96<br>In this study, microchannel heat sink (MCHS) performance using nanofluids as coolant is analyzed numerically and nanofluids are modeled using the single phase approach and the two phase approach. The numerical predictions are validated with available experimental data in the literature in the laminar flow, then extend to turbulent flow. The turbulent governing equations are solved with the standard turbulence model. An orthogonal non-uniform staggered grid is used for the establishment of mesh grids. The parameters studied include the particle volume fract
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CHANDRA, SUBODH. "COMPUTATIONAL FLUID DYNAMICS ANALYSIS OF RECTANGULAR MICROCHANNEL HEAT SINK." Thesis, 2017. http://dspace.dtu.ac.in:8080/jspui/handle/repository/15806.

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In the study, the analysis of fluid flow and heat transfer in a rectangular microchannel heat sink has been carried out with the help of computational fluid dynamics (CFD) .The experimental work done performed by Lee and Mudawar (2002) was simulated for this study. The CFD model equations are solved to analyze the hydrodynamic and thermal behaviour of the rectangular microchannel heat sink. The geometry of the problem is created in Solidworks while meshing has been done in ANSYS Workbench. The model has been solved by ANSYS Fluent 15 solver. The three-dimensional heat transfer character
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Dong, Xin-Xian, and 董信賢. "Heat Transfer Enhancement of Microchannel Heat Sink with Rib Shape Vortex Generators." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/5764k8.

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碩士<br>國立虎尾科技大學<br>航空與電子科技研究所<br>103<br>The microchannel heat sink is considered to be the one of effective methods for the electric chip cooling. This study aims to investigate the cooling performance enhancement for the microchannel heat sink by utilizing longitudinal vortex generators. The physical system is a 10 mm x 10 mm x 1 mm silicon substrate. The microchannel has a width of 142 μm and a height of 500 μm. Liquid water is used as the coolant. The ribs are designed onto the channel walls to induce the longitudinal vortices for the liquid water flow. The governing equations for the conjug
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Chen, Chih-wei, and 陳誌偉. "OPTIMUM THERMAL ANALYSIS OF A HEAT SINK WITH VARIOUS FIN CROSS-SECTIONS AND A MICROCHANNEL HEAT SINK." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/18320670183646478503.

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博士<br>大同大學<br>機械工程學系(所)<br>96<br>In the first topic of this study, a theoretical analysis of a heat sink is presented to pursue the purpose of maximum thermal dissipation and the least material cost. Due to the general derivation, the longitudinal fin arrays on a heat sink can have either square, rectangular, equilaterally triangular, or cylindrical cross section. By input the Biot number, Bi*, heat transfer coefficient ratio Hb* and He*, the heat transfer equation is derived in transcendental form which can be solved by iterative method to calculate the optimum fin length. Meanwhile, the ther
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