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Journal articles on the topic 'Microchannel Heat Sinks'

Author: Grafiati

Published: 4 June 2021

Last updated: 18 February 2022

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1

Hegde, Pradeep, K. N. Seetharamu, P. A. Aswatha Narayana, and Zulkifly Abdullah. "Two-Phase Stacked Microchannel Heat Sinks for Microelectronics Cooling." Journal of Microelectronics and Electronic Packaging 2, no. 2 (April 1, 2005): 122–31. http://dx.doi.org/10.4071/1551-4897-2.2.122.

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Stacked microchannel heat sinks with two-phase flow have been analyzed using the Finite Element Method (FEM). The present method is a simple and practical approach for analyzing the thermal performance of single or multi layered microchannel heat sinks with either single or two-phase flow. A unique 10 noded finite element is used for the channel discretization. Two-phase thermal resistance, pressure drop and pumping power of single, double and triple stack microchannel heat sinks are determined at different base heat fluxes ranging from 150 W/cm2 to 300 W/cm2. The temperature distribution along the length of the microchannel is also plotted. It is found that stacked microchannel heat sinks with two-phase flow are thermally more efficient than two-phase single layer microchannel heat sinks, both in terms of thermal resistance and pumping power requirements. It is observed that the thermal resistance of a double stack microchannel heat sink with two-phase flow is about 40% less than that for a single stack heat sink. A triple stack heat sink yields a further 20% reduction in the thermal resistance and at the same time operates with about 30% less pumping power compared to a single stack heat sink. The effect of channel aspect ratio on the thermal resistance and pressure drop of stacked microchannel heat sinks with two-phase flow are also studied.

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2

Wei, Xiaojin, Yogendra Joshi, and Michael K. Patterson. "Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices." Journal of Heat Transfer 129, no. 10 (February 23, 2007): 1432–44. http://dx.doi.org/10.1115/1.2754781.

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One of the promising liquid cooling techniques for microelectronics is attaching a microchannel heat sink to, or directly fabricating microchannels on, the inactive side of the chip. A stacked microchannel heat sink integrates many layers of microchannels and manifold layers into one stack. Compared with single-layered microchannels, stacked microchannels provide larger flow passages, so that for a fixed heat load the required pressure drop is significantly reduced. Better temperature uniformity can be achieved by arranging counterflow in adjacent microchannel layers. The dedicated manifolds help to distribute coolant uniformly to microchannels. In the present work, a stacked microchannel heat sink is fabricated using silicon micromachining techniques. Thermal performance of the stacked microchannel heat sink is characterized through experimental measurements and numerical simulations. Effects of coolant flow direction, flow rate allocation among layers, and nonuniform heating are studied. Wall temperature profiles are measured using an array of nine platinum thin-film resistive temperature detectors deposited simultaneously with thin-film platinum heaters on the backside of the stacked structure. Excellent overall cooling performance (0.09°C∕Wcm2) for the stacked microchannel heat sink has been shown in the experiments. It has also been identified that over the tested flow rate range, counterflow arrangement provides better temperature uniformity, while parallel flow has the best performance in reducing the peak temperature. Conjugate heat transfer effects for stacked microchannels for different flow conditions are investigated through numerical simulations. Based on the results, some general design guidelines for stacked microchannel heat sinks are provided.

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3

Deng, Daxiang, Guang Pi, Weixun Zhang, Peng Wang, and Ting Fu. "Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes." Entropy 21, no. 1 (December 25, 2018): 16. http://dx.doi.org/10.3390/e21010016.

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This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and thermal resistance considerably, induced much more uniform wall temperature distribution, and reduced the pressure drop and pumping power in comparison with SL-MCHS. The DL-MCHS with trapezoidal microchannels performed the worst with regard to thermal resistance, pressure drop, and pumping power. The DL-MCHS with rectangular microchannels produced the best overall thermal performance and seemed to be the optimum when thermal performance was the prime concern. Nevertheless, the DL-MCHS with reentrant Ω-shaped microchannels should be selected when pumping power consumption was the most important consideration.

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4

Wu, Huajie, and Shanwen Zhang. "Numerical Study on the Fluid Flow and Heat Transfer Characteristics of Al2O3-Water Nanofluids in Microchannels of Different Aspect Ratio." Micromachines 12, no. 8 (July 24, 2021): 868. http://dx.doi.org/10.3390/mi12080868.

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The study of the influence of the nanoparticle volume fraction and aspect ratio of microchannels on the fluid flow and heat transfer characteristics of nanofluids in microchannels is important in the optimal design of heat dissipation systems with high heat flux. In this work, the computational fluid dynamics method was adopted to simulate the flow and heat transfer characteristics of two types of water-Al2O3 nanofluids with two different volume fractions and five types of microchannel heat sinks with different aspect ratios. Results showed that increasing the nanoparticle volume fraction reduced the average temperature of the heat transfer interface and thereby improved the heat transfer capacity of the nanofluids. Meanwhile, the increase of the nanoparticle volume fraction led to a considerable increase in the pumping power of the system. Increasing the aspect ratio of the microchannel effectively improved the heat transfer capacity of the heat sink. Moreover, increasing the aspect ratio effectively reduced the average temperature of the heating surface of the heat sink without significantly increasing the flow resistance loss. When the aspect ratio exceeded 30, the heat transfer coefficient did not increase with the increase of the aspect ratio. The results of this work may offer guiding significance for the optimal design of high heat flux microchannel heat sinks.

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5

Saidi, M. H., and Reza H Khiabani. "Forced Convective Heat Transfer in Parallel Flow Multilayer Microchannels." Journal of Heat Transfer 129, no. 9 (August 30, 2006): 1230–36. http://dx.doi.org/10.1115/1.2739600.

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Abstract In this paper, the effect of increasing the number of layers on improving the thermal performance of microchannel heat sinks is studied. In this way, both numerical and analytical methods are utilized. The analytical method is based on the porous medium assumption. Here, the modified Darcy equation and the energy balance equations are used. The method has led to an analytical expression presenting the average dimensionless temperature field in the multilayer microchannel heat sink. The effects of different parameters such as aspect ratio, porosity, channel width, and the solid properties on the thermal resistance are described. The results for single layer and multilayer heat sinks are compared to show the effectiveness of using multilayer microchannels.

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6

Memon, Safi Ahmed, Taqi Ahmad Cheema, Gyu Man Kim, and Cheol Woo Park. "Hydrothermal Investigation of a Microchannel Heat Sink Using Secondary Flows in Trapezoidal and Parallel Orientations." Energies 13, no. 21 (October 27, 2020): 5616. http://dx.doi.org/10.3390/en13215616.

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Thermal performance enhancement in microchannel heat sinks has recently become a challenge due to advancements in modern microelectronics, which demand compatibility with heat sinks able to dissipate ever-increasing amounts of heat. Recent advancements in manufacturing techniques, such as additive manufacturing, have made the modification of the microchannel heat sink geometry possible well beyond the conventional rectangular model to improve the cooling capacity of these devices. One such modification in microchannel geometry includes the introduction of secondary flow channels in the walls between adjacent mainstream microchannels. The present study computationally models secondary flow channels in regular trapezoidal and parallel orientations for fluid circulation through the microchannel walls in a heat sink design. The heat sink is made of silicon wafer, and water is used as the circulating fluid in this study. Continuity, momentum, and energy equations are solved for the fluid flow through the regular trapezoidal secondary flow and parallel secondary flow designs in the heat sink with I-type, C-type, and Z-type inlet–outlet configurations. Plots of velocity contours show that I-type geometry creates optimal flow disruption in the heat sink. Therefore, for this design, the pressure drop and base plate temperatures are plotted for a volumetric flow rate range, and corresponding contour plots are obtained. The results are compared with corresponding trends for the conventional rectangular microchannel design, and associated trends are explained. The study suggests that the flow phenomena such as flow impingement onto the microchannel walls and formation of vortices inside the secondary flow passages coupled with an increase in heat transfer area due to secondary flow passages may significantly improve the heat sink performance.

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7

Gonçalves, Inês M., César Rocha, Reinaldo R. Souza, Gonçalo Coutinho, Jose E. Pereira, Ana S. Moita, António L. N. Moreira, Rui Lima, and João M. Miranda. "Numerical Optimization of a Microchannel Geometry for Nanofluid Flow and Heat Dissipation Assessment." Applied Sciences 11, no. 5 (March 9, 2021): 2440. http://dx.doi.org/10.3390/app11052440.

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In this study, a numerical approach was carried out to analyze the effects of different geometries of microchannel heat sinks on the forced convective heat transfer in single-phase flow. The simulations were performed using the commercially available software COMSOLMultiphysics 5.6® (Burlington, MA, USA) and its results were compared with those obtained from experimental tests performed in microchannel heat sinks of polydimethylsiloxane (PDMS). Distilled water was used as the working fluid under the laminar fluid flow regime, with a maximum Reynolds number of 293. Three sets of geometries were investigated: rectangular, triangular and circular. The different configurations were characterized based on the flow orientation, type of collector and number of parallel channels. The main results show that the rectangular shaped collector was the one that led to a greater uniformity in the distribution of the heat transfer in the microchannels. Similar results were also obtained for the circular shape. For the triangular geometry, however, a disturbance in the jet impingement was observed, leading to the least uniformity. The increase in the number of channels also enhanced the uniformity of the flow distribution and, consequently, improved the heat transfer performance, which must be considered to optimize new microchannel heat sink designs. The achieved optimized design for a heat sink, with microchannels for nanofluid flow and a higher heat dissipation rate, comprised a rectangular collector with eight microchannels and vertical placement of the inlet and outlet.

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8

Nonino, Carlo, and Stefano Savino. "Temperature Uniformity in Cross-Flow Double-Layered Microchannel Heat Sinks." Fluids 5, no. 3 (August 28, 2020): 143. http://dx.doi.org/10.3390/fluids5030143.

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An in-house finite element method (FEM) procedure is used to carry out a numerical study on the thermal behavior of cross-flow double-layered microchannel heat sinks with an unequal number of microchannels in the two layers. The thermal performance is compared with those yielded by other more conventional flow configurations. It is shown that if properly designed, i.e., with several microchannels in the top layer smaller than that in the bottom layer, cross-flow double-layered microchannel heat sinks can provide an acceptable thermal resistance and a reasonably good temperature uniformity of the heated base with a header design that is much simpler than that required by the counter-flow arrangement.

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9

Duan, Zhipeng, Hao Ma, Boshu He, Liangbin Su, and Xin Zhang. "Pressure Drop of Microchannel Plate Fin Heat Sinks." Micromachines 10, no. 2 (January 24, 2019): 80. http://dx.doi.org/10.3390/mi10020080.

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The entrance region constitutes a considerable fraction of the channel length in miniaturized devices. Laminar slip flow in microchannel plate fin heat sinks under hydrodynamically developing conditions is investigated semi-analytically and numerically in this paper. The semi-analytical model for the pressure drop of microchannel plate fin heat sinks is obtained by solving the momentum equation with the first-order velocity slip boundary conditions at the channel walls. The simple pressure drop model utilizes fundamental solutions from fluid dynamics to predict its constitutive components. The accuracy of the model is examined using computational fluid dynamics (CFD) simulations and the experimental and numerical data available in the literature. The model can be applied to either apparent liquid slip over hydrophobic and superhydrophobic surfaces or gas slip flow in microchannel heat sinks. The developed model has an accuracy of 92 percent for slip flow in microchannel plate fin heat sinks. The developed model may be used to predict the pressure drop of slip flow in microchannel plate fin heat sinks for minimizing the effort and expense of experiments, especially in the design and optimization of microchannel plate fin heat sinks.

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10

Hegde, Pradeep, and K. N. Seetharamu. "Effects of Nonuniform Base Heating on Single Stack and Multi-Stack Microchannel Heat Sinks Used for Electronics Cooling." Journal of Microelectronics and Electronic Packaging 7, no. 2 (April 1, 2010): 90–98. http://dx.doi.org/10.4071/1551-4897-7.2.90.

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Numerical investigations with regard to the thermal characteristics of water cooled single stack and multistack microchannel heat sinks subjected to nonuniform base heating are conducted. Nonuniformities in base heating are accomplished by applying gradually increasing and gradually decreasing base heat fluxes with respect to coolant flow direction in the heat sink. The effects of heat concentration upstream, downstream, and in the center half of the microchannel heat sinks (similar to a hotspot) are also studied. Both parallel flow and counter coolant flow conditions in the heat sink are considered and the results are compared. The results are presented in the form of base temperature distribution and heat sink thermal resistance. The finite element method is used for the analysis.

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11

Husain, Afzal, and Kwang-Yong Kim. "Electroosmotically enhanced microchannel heat sinks." Journal of Mechanical Science and Technology 23, no. 3 (March 2009): 814–22. http://dx.doi.org/10.1007/s12206-009-0206-x.

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12

Wei, Xiaojin, and Yogendra Joshi. "Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components." Journal of Electronic Packaging 126, no. 1 (March 1, 2004): 60–66. http://dx.doi.org/10.1115/1.1647124.

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A novel heat sink based on a multilayer stack of liquid cooled microchannels is investigated. For a given pumping power and heat removal capability for the heat sink, the flow rate across a stack of microchannels is lower compared to a single layer of microchannels. Numerical simulations using a computationally efficient multigrid method [1] were carried out to investigate the detailed conjugate transport within the heat sink. The effects of the microchannel aspect ratio and total number of layers on thermal performance were studied for water as coolant. A heat sink of base area 10 mm by 10 mm with a height in the range 1.8 to 4.5 mm (2–5 layers) was considered with water flow rate in the range 0.83×10−6m3/s (50 ml/min) to 6.67×10−6m3/s (400 ml/min). The results of the computational simulations were also compared with a simplified thermal resistance network analysis.

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13

Shen, Jienan, Xiuxiu Li, Yongsheng Zhu, Boya Zhang, Hang Guo, Baolin Liu, and Hong Chen. "A Three-Dimensional Simulation Analysis of Fluid Flow and Heat Transfer in Microchannel Heat Sinks with Different Structures." Journal of Non-Equilibrium Thermodynamics 46, no. 3 (March 25, 2021): 235–53. http://dx.doi.org/10.1515/jnet-2020-0099.

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Abstract Numerical studies have been performed to analyze the fluid flow and heat transfer characteristics of nine microchannel heat sinks (MCHS) with different shapes and different arrangements of the ribs and cavities on the sidewalls, using three common shapes (square, triangle, and circular) of ribs or cavities as the basic structure in this work. The boundary conditions, governing equations, friction factor (f), Nusselt number (Nu), and performance evaluation criteria (ξ) were considered to determine which design was the best in terms of the heat transfer, the pressure drop, and the overall performance. It was observed that no matter how the circular ribs or cavities were arranged, its heat sink performance was better than the other two shapes for Reynolds number of 200–1000. Therefore, circular ribs or cavities can be considered as the best structure to improve the performance of MCHS. In addition, the heat sink performance of the microchannel heat sink with symmetrical circular ribs (MCHS-SCR) was improved by 31.2 % compared with the conventional microchannel heat sink at Re = 667. This was because in addition to the formation of transverse vortices in the channel, four symmetrical and reverse longitudinal vortices are formed to improve the mixing efficiency of the central fluid (low temperature) and the near-wall fluid (high temperature). Then, as the Reynolds number increases, the heat sink performance of MCHS-SCR dropped sharply. The heat sink performance of microchannel heat sinks with staggered ribs and cavities (MCHS-SCRC, MCHS-STRC, and MCHS-SSRC) exceeded that of MCHS-SCR. This indicated that the microchannel heat sink with staggered ribs and cavities was more suitable for high Reynolds number (Re > 800).

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14

Hung, Tu-Chieh, Yu-Xian Huang, and Wei-Mon Yan. "Design of Porous-Microchannel Heat Sinks with Different Porous Configurations." International Journal of Materials, Mechanics and Manufacturing 4, no. 2 (2015): 89–94. http://dx.doi.org/10.7763/ijmmm.2016.v4.231.

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15

Ma, Hao, Zhipeng Duan, Liangbin Su, Xiaoru Ning, Jiao Bai, and Xianghui Lv. "Fluid Flow and Entropy Generation Analysis of Al2O3–Water Nanofluid in Microchannel Plate Fin Heat Sinks." Entropy 21, no. 8 (July 28, 2019): 739. http://dx.doi.org/10.3390/e21080739.

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The flow in channels of microdevices is usually in the developing regime. Three-dimensional laminar flow characteristics of a nanofluid in microchannel plate fin heat sinks are investigated numerically in this paper. Deionized water and Al2O3–water nanofluid are employed as the cooling fluid in our work. The effects of the Reynolds number (100 < Re < 1000), channel aspect ratio (0 < ε < 1), and nanoparticle volume fraction (0.5% < Φ < 5%) on pressure drop and entropy generation in microchannel plate fin heat sinks are examined in detail. Herein, the general expression of the entropy generation rate considering entrance effects is developed. The results revealed that the frictional entropy generation and pressure drop increase as nanoparticle volume fraction and Reynolds number increase, while decrease as the channel aspect ratio increases. When the nanoparticle volume fraction increases from 0 to 3% at Re = 500, the pressure drop of microchannel plate fin heat sinks with ε = 0.5 increases by 9%. It is demonstrated that the effect of the entrance region is crucial for evaluating the performance of microchannel plate fin heat sinks. The study may shed some light on the design and optimization of microchannel heat sinks.

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16

Copeland, D., M. Behnia, and W. Nakayama. "Manifold microchannel heat sinks: isothermal analysis." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 20, no. 2 (June 1997): 96–102. http://dx.doi.org/10.1109/95.588554.

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17

Sarowar, Md Tanbir. "Performance Comparison of Microchannel Heat Sink Using Boron-Based Ceramic Materials." Advanced Materials Research 1163 (April 2021): 73–88. http://dx.doi.org/10.4028/www.scientific.net/amr.1163.73.

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Microchannel heat sink plays a vital role in removing a considerable amount of heat flux from a small surface area from different electronic devices. In recent times, the rapid development of electronic devices requires the improvement of these heat sinks to a greater extent. In this aspect, the selection of appropriate substrate materials of the heat sinks is of vital importance. In this paper, three boron-based ultra-high temperature ceramic materials (ZrB2, TiB2, and HfB2) are compared as a substrate material for the microchannel heat sink using a numerical approach. The fluid flow and heat transfer are analyzed using the finite volume method. The results showed that the maximum temperature of the heat source didn’t exceed 355K at 3.6MWm-2 for any material. The results also indicated HfB2 and TiB2 to be more useful as a substrate material than ZrB2. By applying 3.6 MWm-2 heat flux at the source, the maximum obtained surface heat transfer coefficient was 175.2 KWm-2K-1 in a heat sink having substrate material HfB2.

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18

Rahman, Muhammad Mustafizur. "Measurements of heat transfer in microchannel heat sinks." International Communications in Heat and Mass Transfer 27, no. 4 (May 2000): 495–506. http://dx.doi.org/10.1016/s0735-1933(00)00132-9.

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19

Chen, Chien-Hsin. "Forced convection heat transfer in microchannel heat sinks." International Journal of Heat and Mass Transfer 50, no. 11-12 (June 2007): 2182–89. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2006.11.001.

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20

Cruz Duarte, Jorge Mario, Iván Mauricio Amaya Contreras, and Carlos Rodrigo Correa Cely. "COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS." Revista EIA 12, no. 24 (November 30, 2015): 151–66. http://dx.doi.org/10.24050/reia.v12i24.880.

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This article deals with the design of optimum microchannel heat sinks through Unified Particle Swarm Optimisation (UPSO) and Harmony Search (HS). These heat sinks are used for the thermal management of electronic devices, and we analyse the performance of UPSO and HS in their design, both, systematically and thoroughly. The objective function was created using the entropy generation minimisation criterion. In this study, we fixed the geometry of the microchannel, the amount of heat to be removed, and the properties of the cooling fluid. Moreover, we calculated the entropy generation rate, the volume flow rate of air, the channel width, the channel height, and the Knudsen number. The results of several simulation optimizations indicate that both global optimisation strategies yielded similar results, about 0.032 W/K, and that HS required five times more iterations than UPSO, but only about a nineteenth of its computation time. In addition, HS revealed a greater chance (about three times) of finding a better solution than UPSO, but with a higher dispersion rate (about five times). Nonetheless, both algorithms successfully optimised the design for different scenarios, even when varying the material of the heat sink, and for different heat transfer rates.

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21

Dang, Thanhtrung, Ngoctan Tran, and Jyh Tong Teng. "Numerical and Experimental Investigations on Heat Transfer Phenomena of an Aluminium Microchannel Heat Sink." Applied Mechanics and Materials 145 (December 2011): 129–33. http://dx.doi.org/10.4028/www.scientific.net/amm.145.129.

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The study was done both numerically and experimentally on the heat transfer behaviors of a microchannel heat sink. The solver of numerical simulations (CFD - ACE+software package) was developed by using the finite volume method. This numerical method was performed to simulate for an overall microchannel heat sink, including the channels, substrate, manifolds of channels as well as the covered top wall. Numerical results associated with such kinds of overall microchannel heat sinks are rarely seen in the literatures. For cases done in this study, a heat flux of 9.6 W/cm2was achieved for the microchannel heat sink having the inlet temperature of 25 °C and mass flow rate of 0.4 g/s with the uniform surface temperature of bottom wall of the substrate of 50 °C; besides, the maximum heat transfer effectiveness of this device reached 94.4%. Moreover, in this study, when the mass flow rate increases, the outlet temperature decreases; however, as the mass flow rate increases, the heat flux of this heat sink increases also. In addition, the results obtained from the numerical analyses were in good agreement with those obtained from the experiments as well as those from the literatures, with the maximum discrepancies of the heat fluxes estimated to be less than 6 %.

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22

Muwanga, R., I. Hassan, and R. MacDonald. "Characteristics of Flow Boiling Oscillations in Silicon Microchannel Heat Sinks." Journal of Heat Transfer 129, no. 10 (April 13, 2007): 1341–51. http://dx.doi.org/10.1115/1.2754946.

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Flow boiling oscillation characteristics in two silicon microchannel heat sink configurations are presented. One is a standard heat sink with 45 straight parallel channels, whereas the second is similar except with cross-linked paths at three locations. Data are presented over a flow range of 20–50ml∕min(91–228kg∕(m2s)) using distilled water as the working fluid. The heat sinks have a footprint area of 3.5cm2 and contain 269μm wide by 283μm deep reactive ion etching channels. Flow oscillations are found to be similar in characteristic trends between the two configurations, showing a decreasing frequency with increasing heat flux. The oscillation amplitudes are relatively large and identical in frequency for the inlet temperature, outlet temperature, inlet pressure, and pressure drop. Oscillation properties for the standard heat sink at two different inlet temperatures and various flow rates are correlated for different heat fluxes. This work additionally presents a first glimpse of the cross-linked heat sink performance under flow boiling instability conditions.

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23

Cheng, Ping, Hui-Ying Wu, and Fang-Jun Hong. "Phase-Change Heat Transfer in Microsystems." Journal of Heat Transfer 129, no. 2 (September 20, 2006): 101–8. http://dx.doi.org/10.1115/1.2410008.

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Recent work on miscroscale phase-change heat transfer, including flow boiling and flow condensation in microchannnels (with applications to microchannel heat sinks and microheat exchangers) as well as bubble growth and collapse on microheaters under pulse heating (with applications to micropumps and thermal inkjet printerheads), is reviewed. It has been found that isolated bubbles, confined elongated bubbles, annular flow, and mist flow can exist in microchannels during flow boiling. Stable and unstable flow boiling modes may occur in microchannels, depending on the heat to mass flux ratio and inlet subcooling of the liquid. Heat transfer and pressure drop data in flow boiling in microchannels are shown to deviate greatly from correlations for flow boiling in macrochannels. For flow condensation in microchannels, mist flow, annular flow, injection flow, plug-slug flow, and bubbly flows can exist in the microchannels, depending on mass flux and quality. Effects of the dimensionless condensation heat flux and the Reynolds number of saturated steam on transition from annular two-phase flow to slug/plug flow during condensation in microchannels are discussed. Heat transfer and pressured drop data in condensation flow in microchannels, at low mass flux are shown to be higher and lower than those predicted by correlations for condensation flow in macrochannels, respectively. Effects of pulse heating width and heater size on microbubble growth and collapse and its nucleation temperature on a microheater under pulse heating are summarized.

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24

Collins, Ivel L., Justin A. Weibel, Liang Pan, and Suresh V. Garimella. "Evaluation of Additively Manufactured Microchannel Heat Sinks." IEEE Transactions on Components, Packaging and Manufacturing Technology 9, no. 3 (March 2019): 446–57. http://dx.doi.org/10.1109/tcpmt.2018.2866972.

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25

Zheng, Wei, Jianjun Sun, Chenbo Ma, Qiuping Yu, Yuyan Zhang, and Tao Niu. "Numerical Study of Fluid Flow and Heat Transfer Characteristics in a Cone-Column Combined Heat Sink." Energies 14, no. 6 (March 14, 2021): 1605. http://dx.doi.org/10.3390/en14061605.

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Temperature has a great influence on the normal operation and service life of high-power electronic components. To cope with the increasingly severe heat problems in integrated circuits, an enhanced heat transfer factor E is introduced to evaluate the comprehensive heat transfer performance of microchannel heat sinks (MCHS). The computational fluid dynamics (CFD) software was used to numerically study the fluid flow and heat transfer characteristics in the cone-column combined heat sink. The research results obtained the velocity field and pressure field distribution of the heat sink structure in the range of 100 ≤ Re ≤ 700. When Re changes, the change law of pressure drop ΔP, friction factor f, average Nussel number Nuave, average substrate temperature T, and enhanced heat transfer factor E, are compared with the circular MCHS. The results show that the uniform arrangement of the cones inside the cone-column combined heat sink can change the flow state of the cooling medium in the microchannel and enhance the heat transfer. In the range of 100 ≤ Re ≤ 700, the base temperature of the cone-column combined heat sink is always lower than the base temperature of the circular MCHS, and the average Nusselt number Nuave is as high as 2.13 times that of the circular microchannel. The enhanced heat factor E is 1.75 times that of the circular MCHS, indicating that the comprehensive heat transfer performance of the cone-column combined heat sink is significantly better than that of the circular microchannel.

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26

Kiran K. Ambatipudi, Muhammad M. Ra. "ANALYSIS OF CONJUGATE HEAT TRANSFER IN MICROCHANNEL HEAT SINKS." Numerical Heat Transfer, Part A: Applications 37, no. 7 (June 12, 2000): 711–31. http://dx.doi.org/10.1080/104077800274046.

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27

HIRA, GOURAV, and MONOJ BORDOLOI. "REVIEW OF HEAT TRANSFER ANALYSIS IN MICROCHANNEL HEAT SINKS." International Journal of Engineering Science and Technology 8, no. 2S (February 28, 2018): 201–3. http://dx.doi.org/10.21817/ijest/2018/v10i2s/181002s036.

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28

Hung, Tu-Chieh, Wei-Mon Yan, Xiao-Dong Wang, and Chun-Yen Chang. "Heat transfer enhancement in microchannel heat sinks using nanofluids." International Journal of Heat and Mass Transfer 55, no. 9-10 (April 2012): 2559–70. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2012.01.004.

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29

Xu, Shanglong, Yihao Wu, Qiyu Cai, Lili Yang, and Yue Li. "Optimization of the thermal performance of multi-layer silicon microchannel heat sinks." Thermal Science 20, no. 6 (2016): 2001–13. http://dx.doi.org/10.2298/tsci141213122x.

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The objective is to optimize the configuration sizes and thermal performance of a multilayer silicon microchannel heat sink by the thermal resistance network model. The effect of structural parameter on the thermal resistance is analyzed by numercal simulation. Taking the thermal resistance as an objective function, a nonlinear and multi-constrained optimization model are proposed for the silicon microchannel heat sink in electronic chips cooling. The sequential quadratic programming (SQP) method is used to do the optimization design of the configuration sizes of the microchannel. For the heat sink with the size of 20mm?20mm and the power of 400 W, the optimized microchannel number, layer, height and width are 40 and 2, 2.2mm and 0.2mm, respectively, and its corresponding total thermal resistance for whole microchannel heat sink is 0.0424 K/W.

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Türkakar, Göker, and Tuba Okutucu-Özyurt. "Dimensional optimization of microchannel heat sinks with multiple heat sources." International Journal of Thermal Sciences 62 (December 2012): 85–92. http://dx.doi.org/10.1016/j.ijthermalsci.2011.12.015.

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31

Betz, Amy Rachel, and Daniel Attinger. "Can segmented flow enhance heat transfer in microchannel heat sinks?" International Journal of Heat and Mass Transfer 53, no. 19-20 (September 2010): 3683–91. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2010.04.016.

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32

Zhao, C. Y., and T. J. Lu. "Analysis of microchannel heat sinks for electronics cooling." International Journal of Heat and Mass Transfer 45, no. 24 (November 2002): 4857–69. http://dx.doi.org/10.1016/s0017-9310(02)00180-1.

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Adham, Ahmed Mohammed, Normah Mohd-Ghazali, and Robiah Ahmad. "Cooling of Microchannel Heat Sinks with Gaseous Coolants." Procedia Engineering 56 (2013): 337–43. http://dx.doi.org/10.1016/j.proeng.2013.03.128.

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34

KIM, SUNG JIN. "Methods for Thermal Optimization of Microchannel Heat Sinks." Heat Transfer Engineering 25, no. 1 (January 2004): 37–49. http://dx.doi.org/10.1080/01457630490248359.

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Khan, Waqar Ahmed, Muhammad Bilal Kadri, and Qasim Ali. "Optimization of Microchannel Heat Sinks Using Genetic Algorithm." Heat Transfer Engineering 34, no. 4 (October 15, 2012): 279–87. http://dx.doi.org/10.1080/01457632.2013.694758.

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Ansari, Danish, and Kwang-Yong Kim. "Hotspot Analysis of Double-Layer Microchannel Heat Sinks." Heat Transfer Engineering 40, no. 15 (April 23, 2018): 1221–38. http://dx.doi.org/10.1080/01457632.2018.1460918.

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Tsai, Tsung-Hsun, and Reiyu Chein. "Performance analysis of nanofluid-cooled microchannel heat sinks." International Journal of Heat and Fluid Flow 28, no. 5 (October 2007): 1013–26. http://dx.doi.org/10.1016/j.ijheatfluidflow.2007.01.007.

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38

Kadam, Sambhaji T., and Ritunesh Kumar. "Twenty first century cooling solution: Microchannel heat sinks." International Journal of Thermal Sciences 85 (November 2014): 73–92. http://dx.doi.org/10.1016/j.ijthermalsci.2014.06.013.

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Memon, Safi A., M. B. Sajid, M. S. Malik, Awad B. S. Alquaity, M. Mohib ur Rehman, Taqi A. Cheema, Moon Kyu Kwak, and Cheol Woo Park. "Investigation of the Thermal Performance of Salt Hydrate Phase Change of Nanoparticle Slurry Flow in a Microchannel." Journal of Chemistry 2019 (January 3, 2019): 1–10. http://dx.doi.org/10.1155/2019/5271923.

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Computational study was conducted to investigate the thermal performance of water-based salt hydrate S44 nanoparticles as the phase change material (PCM) in a microchannel heat sink. Constant heat dissipation was applied on the top wall of the heat sink. Forced internal convection of the PCM slurry flow was performed through a homogeneous approach. Three thermal performance parameters, including effectiveness ratio, performance index, and Merit number, were used to quantify the cooling performance of S44 for various concentrations of the PCM nanoparticles. The thermal performance of the salt hydrate S44 slurry was also compared with a similar study conducted for lauric acid nanoparticle slurry found in the literature. Specific operating conditions were identified. The salt hydrate S44 would provide better thermal performance than lauric acid, and vice versa. Finally, Nusselt number correlations have been developed for the microchannel PCM heat sink for Reynolds numbers in the range 12.23 to 47.14 and Prandtl numbers in the range 3.74 to 5.30. A design guideline for manufacturing PCM particles and microchannel heat sinks is provided. With this guideline, the heat absorption ability of the heat sink is maximized, and the pumping power and the losses related to the addition of the particles are minimized.

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Salem, Thomas E., Stephen B. Bayne, and Don Porschet. "An Experimental Approach for Thermal Characterization of Water-Cooled Heat Sinks Using Fourier Analysis Techniques." Journal of Electronic Packaging 129, no. 4 (February 13, 2007): 512–17. http://dx.doi.org/10.1115/1.2814056.

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As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a metal-oxide-semiconductor field-effect transistor on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique using Fourier analysis techniques for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.

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Savino, S., and C. Nonino. "Numerical analysis of double-layered microchannel heat sinks with different microchannel heights." Journal of Physics: Conference Series 1599 (August 2020): 012020. http://dx.doi.org/10.1088/1742-6596/1599/1/012020.

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Kim, S. J., and D. Kim. "Forced Convection in Microstructures for Electronic Equipment Cooling." Journal of Heat Transfer 121, no. 3 (August 1, 1999): 639–45. http://dx.doi.org/10.1115/1.2826027.

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This paper reports analytical solutions for both velocity and temperature profiles in Microchannel heat sinks by modeling the Microchannel heat sink as a fluid-saturated porous medium. The analytical solutions are obtained based on the modified Darcy model for fluid flow and the two-equation model for heat transfer. To validate the porous medium model and the analytical solutions based on that model, the closed-form solution for the velocity distribution in the fully-developed channel flow and the numerical solutions for the conjugate heat transfer problem, comprising the solid fin and the fluid, are also obtained. The analytical solutions based on the porous medium model are shown to predict the volume-averaged velocity and temperature distributions quite well. Using the analytical solutions, the aspect ratio and the effective thermal conductivity ratio are identified as variables of engineering importance and their effects on fluid flow and heat transfer are studied. As either one of these variables increases, the fluid temperature is shown to approach the solid temperature. Finally, the expression for the total thermal resistance, derived from the analytical solutions and the geometry of the microchannel heat sink for which the thermal resistance of the heat sink is minimal, is obtained.

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Al Siyabi, Idris, Sourav Khanna, Senthilarasu Sundaram, and Tapas Mallick. "Experimental and Numerical Thermal Analysis of Multi-Layered Microchannel Heat Sink for Concentrating Photovoltaic Application." Energies 12, no. 1 (December 30, 2018): 122. http://dx.doi.org/10.3390/en12010122.

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Concentrating photovoltaic has a major challenge due to the high temperature raised during the process which reduces the efficiency of the solar cell. A multi-layered microchannel heat sink technique is considered more efficient in terms of heat removal and pumping power among many other cooling techniques. Thus, in the current work, multi-layered microchannel heat sink is used for concentrating photovoltaic cooling. The thermal behavior of the system is experimentally and numerically investigated. The results show that in extreme heating load of 30 W/cm2 with heat transfer fluid flow rate of 30 mL/min, increasing the number of layers from one to four reduces the heat source temperature from 88.55 to 73.57 °C. In addition, the single layered MLM heat sink suffers from the highest non-uniformity in the heat source temperature compared to the heat sinks with the higher number of layers. Additionally, the results show that increasing the number of layers from one to four reduces the pressure drop from 162.79 to 32.75 Pa.

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Zargartalebi, Mohammad, and Jalel Azaiez. "Flow dynamics and heat transfer in partially porous microchannel heat sinks." Journal of Fluid Mechanics 875 (July 26, 2019): 1035–57. http://dx.doi.org/10.1017/jfm.2019.491.

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In this study, the flow dynamics and heat transfer in partially filled pin-based microchannel heat sinks (MCHS) are examined. The lattice Boltzmann method is used to analyse the physics of these systems and examine the effects of the flow, pin configuration, size and porous medium height. The results of the study reveal that, unlike the fully filled pin-based MCHS, there is no unique behaviour for the pin configuration effects and the performance of partially filled pin-based MCHS depends on the porous medium size and structure as well as the inertial forces in the flow. In particular, it is found that there are hydrodynamic and thermal-based critical porous medium heights at which the best performance in terms of heat removal switches from the inline to the staggered configuration. The dependence of these critical heights on the Reynolds number and the porous medium properties are analysed and the effects of the flow dynamics are further unravelled through a particle tracing technique. Furthermore, a simple flow model is developed, and is shown to capture well the main trends obtained from the simulations and to bring to light more of the system physics that help explain the interplay between the different parameters.

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Zhang, Zong-wei, Wen-di Xu, Zhao Wang, Cong Liu, and Ke-lu Cui. "FLOW BOILING HEAT TRANSFER OF R30 IN PARALLEL MICROCHANNEL HEAT SINKS." Heat Transfer Research 50, no. 10 (2019): 977–92. http://dx.doi.org/10.1615/heattransres.2018026477.

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Roy, Rahul, and Balaram Kundu. "Effects of fin shapes on heat transfer in microchannel heat sinks." Heat Transfer-Asian Research 47, no. 4 (April 20, 2018): 646–59. http://dx.doi.org/10.1002/htj.21332.

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Şimşek, Eylül, Sahin Coskun, Tuba Okutucu-Özyurt, and Husnu Emrah Unalan. "Heat transfer enhancement by silver nanowire suspensions in microchannel heat sinks." International Journal of Thermal Sciences 123 (January 2018): 1–13. http://dx.doi.org/10.1016/j.ijthermalsci.2017.08.021.

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Dehghan, Maziar, Mahdi Daneshipour, Mohammad Sadegh Valipour, Roohollah Rafee, and Seyfolah Saedodin. "Enhancing heat transfer in microchannel heat sinks using converging flow passages." Energy Conversion and Management 92 (March 2015): 244–50. http://dx.doi.org/10.1016/j.enconman.2014.12.063.

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Chein, Reiyu, and Yehong Chen. "Performances of thermoelectric cooler integrated with microchannel heat sinks." International Journal of Refrigeration 28, no. 6 (September 2005): 828–39. http://dx.doi.org/10.1016/j.ijrefrig.2005.02.001.

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50

Kim, S. J., D. Kim, and D. Y. Lee. "On the local thermal equilibrium in microchannel heat sinks." International Journal of Heat and Mass Transfer 43, no. 10 (May 2000): 1735–48. http://dx.doi.org/10.1016/s0017-9310(99)00259-8.

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