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Journal articles on the topic 'Microchannel Heat Sinks'

Author: Grafiati

Published: 4 June 2021

Last updated: 25 July 2025

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1

Hurtado-Venegas, Ignacio, Víctor A. Martínez, Vasco Diego A., et al. "Numerical Study About Nanofluids of Spherical and Tube-Shaped TiO₂ Nanomaterials on the Thermal Performance and Entropy Generation of Different Cross-Section Microchannel Heat Sinks." Journal of Nanofluids 12, no. 1 (2023): 65–77. http://dx.doi.org/10.1166/jon.2023.1911.

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We numerically evaluated the thermal performance of microchannel heat sinks, considering rectangular, hexagonal, and circular cross-sections. Moreover, as a passive heat transfer augmentation technique, dimples were added to improve the rectangular microchannel heat sinks. These simulations use nanofluids based on TiO2 nanoparticles or nanotubes dispersed in bidistilled water as working fluids. The mathematical model considered variable thermophysical properties of the nanofluids; for this purpose, polynomial fittings correlate the dependence of the thermophysical properties on the temperature

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2

Jiang, Zhengyong, Mengjie Song, Jun Shen, Long Zhang, Xuan Zhang, and Shenglun Lin. "Experimental Investigation on the Flow Boiling of Two Microchannel Heat Sinks Connected in Parallel and Series for Cooling of Multiple Heat Sources." Micromachines 14, no. 8 (2023): 1580. http://dx.doi.org/10.3390/mi14081580.

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Cooling methods for multiple heat sources with high heat flux have rarely been reported, but such situations threaten the stable operation of electronic devices. Therefore, in this paper, the use of two microchannel heat sinks is proposed, with and without grooves, labeled Type A and Type B, respectively. Experimental investigations on the flow boiling of two microchannel heat sinks connected in parallel and in series are carried out under different mass fluxes. In addition, a high-speed camera is used to observe flow patterns in the microchannels. The cold plate wall temperature (Tw), heat tr

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3

Mai, Yuanqi. "The Effect of Cross-Sectional Shape on the Thermo-Hydraulic Performance of Microchannel Heat Sinks." Applied and Computational Engineering 159, no. 1 (2025): 132–40. https://doi.org/10.54254/2755-2721/2025.23607.

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Microchannel heat sinks are widely used in thermal management systems due to their compact design and efficient heat transfer. To further enhance performance, this study uses numerical simulations to explore the heat transfer characteristics of rectangular, triangular, trapezoidal, and circular microchannels while maintaining equal cross-sectional areas. At Re = 900, the triangular microchannel demonstrates optimal heat transfer performance (HTP) but the weakest hydraulic performance, with a 5.56% reduction in thermal resistance and a 54.45% increase in pumping power compared to the rectangula

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4

Ariyo, David Olugbenga, and Tunde Bello-Ochende. "Optimal design of subcooled triangular microchannel heat sink exchangers with variable heat loads for high performance cooling." Journal of Physics: Conference Series 2116, no. 1 (2021): 012052. http://dx.doi.org/10.1088/1742-6596/2116/1/012052.

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Abstract Deionized water at a temperature of 25 °C was used as the cooling fluid and aluminium as the heat sink material in the geometric optimization and parameter modelling of subcooled flow boiling in horizontal equilateral triangular microchannel heat sinks. The thermal resistances of the microchannels were minimized subject to fixed volume constraints of the heat sinks and microchannels. A computational fluid dynamics (CFD) ANSYS code used for both the simulations and the optimizations was validated by the available experimental data in the literature and the agreement was good. Fixed hea

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5

Deng, Daxiang, Guang Pi, Weixun Zhang, Peng Wang, and Ting Fu. "Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes." Entropy 21, no. 1 (2018): 16. http://dx.doi.org/10.3390/e21010016.

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This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and ther

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6

Nonino, Carlo, and Stefano Savino. "Temperature Uniformity in Cross-Flow Double-Layered Microchannel Heat Sinks." Fluids 5, no. 3 (2020): 143. http://dx.doi.org/10.3390/fluids5030143.

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An in-house finite element method (FEM) procedure is used to carry out a numerical study on the thermal behavior of cross-flow double-layered microchannel heat sinks with an unequal number of microchannels in the two layers. The thermal performance is compared with those yielded by other more conventional flow configurations. It is shown that if properly designed, i.e., with several microchannels in the top layer smaller than that in the bottom layer, cross-flow double-layered microchannel heat sinks can provide an acceptable thermal resistance and a reasonably good temperature uniformity of t

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7

Hegde, Pradeep, K. N. Seetharamu, P. A. Aswatha Narayana, and Zulkifly Abdullah. "Two-Phase Stacked Microchannel Heat Sinks for Microelectronics Cooling." Journal of Microelectronics and Electronic Packaging 2, no. 2 (2005): 122–31. http://dx.doi.org/10.4071/1551-4897-2.2.122.

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Stacked microchannel heat sinks with two-phase flow have been analyzed using the Finite Element Method (FEM). The present method is a simple and practical approach for analyzing the thermal performance of single or multi layered microchannel heat sinks with either single or two-phase flow. A unique 10 noded finite element is used for the channel discretization. Two-phase thermal resistance, pressure drop and pumping power of single, double and triple stack microchannel heat sinks are determined at different base heat fluxes ranging from 150 W/cm2 to 300 W/cm2. The temperature distribution alon

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8

Wei, Xiaojin, Yogendra Joshi, and Michael K. Patterson. "Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices." Journal of Heat Transfer 129, no. 10 (2007): 1432–44. http://dx.doi.org/10.1115/1.2754781.

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One of the promising liquid cooling techniques for microelectronics is attaching a microchannel heat sink to, or directly fabricating microchannels on, the inactive side of the chip. A stacked microchannel heat sink integrates many layers of microchannels and manifold layers into one stack. Compared with single-layered microchannels, stacked microchannels provide larger flow passages, so that for a fixed heat load the required pressure drop is significantly reduced. Better temperature uniformity can be achieved by arranging counterflow in adjacent microchannel layers. The dedicated manifolds h

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9

Yu, Hao, Tongling Li, Xiaoxin Zeng, Tianbiao He, and Ning Mao. "A Critical Review on Geometric Improvements for Heat Transfer Augmentation of Microchannels." Energies 15, no. 24 (2022): 9474. http://dx.doi.org/10.3390/en15249474.

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With the application of microdevices in the building engineering, aerospace industry, electronic devices, nuclear energy, and so on, the dissipation of high heat flux has become an urgent problem to be solved. Microchannel heat sinks have become an effective means of thermal management for microdevices and enhancements for equipment due to their higher heat transfer and small scale. However, because of the increasing requirements of microdevices for thermal load and temperature control and energy savings, high efficiency heat exchangers, especially microchannels are receiving more and more att

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10

Wu, Huajie, and Shanwen Zhang. "Numerical Study on the Fluid Flow and Heat Transfer Characteristics of Al2O3-Water Nanofluids in Microchannels of Different Aspect Ratio." Micromachines 12, no. 8 (2021): 868. http://dx.doi.org/10.3390/mi12080868.

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The study of the influence of the nanoparticle volume fraction and aspect ratio of microchannels on the fluid flow and heat transfer characteristics of nanofluids in microchannels is important in the optimal design of heat dissipation systems with high heat flux. In this work, the computational fluid dynamics method was adopted to simulate the flow and heat transfer characteristics of two types of water-Al2O3 nanofluids with two different volume fractions and five types of microchannel heat sinks with different aspect ratios. Results showed that increasing the nanoparticle volume fraction redu

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11

Duan, Zhipeng, Hao Ma, Boshu He, Liangbin Su, and Xin Zhang. "Pressure Drop of Microchannel Plate Fin Heat Sinks." Micromachines 10, no. 2 (2019): 80. http://dx.doi.org/10.3390/mi10020080.

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The entrance region constitutes a considerable fraction of the channel length in miniaturized devices. Laminar slip flow in microchannel plate fin heat sinks under hydrodynamically developing conditions is investigated semi-analytically and numerically in this paper. The semi-analytical model for the pressure drop of microchannel plate fin heat sinks is obtained by solving the momentum equation with the first-order velocity slip boundary conditions at the channel walls. The simple pressure drop model utilizes fundamental solutions from fluid dynamics to predict its constitutive components. The

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12

Saidi, M. H., and Reza H Khiabani. "Forced Convective Heat Transfer in Parallel Flow Multilayer Microchannels." Journal of Heat Transfer 129, no. 9 (2006): 1230–36. http://dx.doi.org/10.1115/1.2739600.

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Abstract In this paper, the effect of increasing the number of layers on improving the thermal performance of microchannel heat sinks is studied. In this way, both numerical and analytical methods are utilized. The analytical method is based on the porous medium assumption. Here, the modified Darcy equation and the energy balance equations are used. The method has led to an analytical expression presenting the average dimensionless temperature field in the multilayer microchannel heat sink. The effects of different parameters such as aspect ratio, porosity, channel width, and the solid propert

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13

Godi, N. Y., L. B. Zhengwuvi, and M. O. Petinrin. "Forced convection heat transfer in micro heat sinks with square and circular configuration." Nigerian Journal of Technological Development 20, no. 2 (2023): 35–42. http://dx.doi.org/10.4314/njtd.v20i2.1272.

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This paper reports the results of three-dimensional numerical optimisation of microchannel heat exchanger with square and circular cooling channels. The objective of the optimisation is to maximise the global thermal conductance or minimise global thermal resistance. Response surface optimisation methodology (RSM) is used in the numerical optimisation. A high-density heat flux (2.5×106W/m2) is imposed at the bottom surface of the unit cell microchannel and numerical simulation carried out using ANSYS Fluent commercial software package.The elemental volume and axial length N=10mm of the microch

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14

Gonçalves, Inês M., César Rocha, Reinaldo R. Souza, et al. "Numerical Optimization of a Microchannel Geometry for Nanofluid Flow and Heat Dissipation Assessment." Applied Sciences 11, no. 5 (2021): 2440. http://dx.doi.org/10.3390/app11052440.

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In this study, a numerical approach was carried out to analyze the effects of different geometries of microchannel heat sinks on the forced convective heat transfer in single-phase flow. The simulations were performed using the commercially available software COMSOLMultiphysics 5.6® (Burlington, MA, USA) and its results were compared with those obtained from experimental tests performed in microchannel heat sinks of polydimethylsiloxane (PDMS). Distilled water was used as the working fluid under the laminar fluid flow regime, with a maximum Reynolds number of 293. Three sets of geometries were

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15

Savino, Stefano, and Carlo Nonino. "Header Shape Effect on the Inlet Velocity Distribution in Cross-Flow Double-Layered Microchannel Heat Sinks." Fluids 7, no. 1 (2021): 7. http://dx.doi.org/10.3390/fluids7010007.

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Counter-flow double-layered microchannel heat sinks are very effective for thermal control of electronic components; however, they require rather complicated headers and flow maldistribution can also play a negative role. The cross-flow configuration allows a much simpler header design and the thermal performance becomes similar to that provided by the counter-flow arrangement if the velocity distribution in the microchannels is not uniform. The aim of this work is to show the possibility of achieving a favorable flow distribution in the microchannels of a cross-flow double-layered heat sink w

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16

Xu, Jinjin, Qiang Zhou, Huafeng Pan, Li Lei, and Jingzhi Zhang. "Optimization of flow distribution in Z-type manifold microchannels." Highlights in Science, Engineering and Technology 132 (March 20, 2025): 28–33. https://doi.org/10.54097/yf2p1r70.

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Electronic components are increasingly being centralized and miniaturized, leading to a rise in heat flux. As a result, there is a growing interest in high heat flux heat dissipation technology. Manifold microchannel (MMC) heat sinks have proven to be effective in dissipating heat from the chip. The Z-type manifold heat sink is more favored in practical applications, because its inlet and outlet are located on both sides, saving space. However, the flow distribution in each microchannel of the Z-type manifold heat sink is more uneven than that in other types of manifold heat sinks. In this pap

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17

Ma, Hao, Zhipeng Duan, Liangbin Su, Xiaoru Ning, Jiao Bai, and Xianghui Lv. "Fluid Flow and Entropy Generation Analysis of Al2O3–Water Nanofluid in Microchannel Plate Fin Heat Sinks." Entropy 21, no. 8 (2019): 739. http://dx.doi.org/10.3390/e21080739.

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The flow in channels of microdevices is usually in the developing regime. Three-dimensional laminar flow characteristics of a nanofluid in microchannel plate fin heat sinks are investigated numerically in this paper. Deionized water and Al2O3–water nanofluid are employed as the cooling fluid in our work. The effects of the Reynolds number (100 < Re < 1000), channel aspect ratio (0 < ε < 1), and nanoparticle volume fraction (0.5% < Φ < 5%) on pressure drop and entropy generation in microchannel plate fin heat sinks are examined in detail. Herein, the general expression of the

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18

Liu, Fangqi, Lei Jia, Jiaxin Zhang, et al. "Numerical Study on Heat Transfer Efficiency and Inter-Layer Stress of Microchannel Heat Sinks with Different Geometries." Energies 17, no. 20 (2024): 5076. http://dx.doi.org/10.3390/en17205076.

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As electronics become more powerful and compact, laminated microchannel heat sinks (MCHSs) are essential for handling high heat flux. This study aims to optimize the MCHS design for improved heat dissipation and structural strength. An orthogonal experiment was established with the average surface temperature of the heat source as the evaluation metric, and the optimal structure was determined through simulation. Finally, cooling uniformity, fluidity, and performance evaluation criterion (PEC) analyses were carried out on the optimal structure. It was determined that the optimal combination wa

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19

Wei, Xiaojin, and Yogendra Joshi. "Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components." Journal of Electronic Packaging 126, no. 1 (2004): 60–66. http://dx.doi.org/10.1115/1.1647124.

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A novel heat sink based on a multilayer stack of liquid cooled microchannels is investigated. For a given pumping power and heat removal capability for the heat sink, the flow rate across a stack of microchannels is lower compared to a single layer of microchannels. Numerical simulations using a computationally efficient multigrid method [1] were carried out to investigate the detailed conjugate transport within the heat sink. The effects of the microchannel aspect ratio and total number of layers on thermal performance were studied for water as coolant. A heat sink of base area 10 mm by 10 mm

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20

Memon, Safi Ahmed, Taqi Ahmad Cheema, Gyu Man Kim, and Cheol Woo Park. "Hydrothermal Investigation of a Microchannel Heat Sink Using Secondary Flows in Trapezoidal and Parallel Orientations." Energies 13, no. 21 (2020): 5616. http://dx.doi.org/10.3390/en13215616.

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Thermal performance enhancement in microchannel heat sinks has recently become a challenge due to advancements in modern microelectronics, which demand compatibility with heat sinks able to dissipate ever-increasing amounts of heat. Recent advancements in manufacturing techniques, such as additive manufacturing, have made the modification of the microchannel heat sink geometry possible well beyond the conventional rectangular model to improve the cooling capacity of these devices. One such modification in microchannel geometry includes the introduction of secondary flow channels in the walls b

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21

Husain, Afzal, and Kwang-Yong Kim. "Electroosmotically enhanced microchannel heat sinks." Journal of Mechanical Science and Technology 23, no. 3 (2009): 814–22. http://dx.doi.org/10.1007/s12206-009-0206-x.

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22

Abbas Tuaima, Ahmed J. Shkaraha, and Mohammed D. Salman. "An Experimental and Numerical Study of the Effect of Microchannels Geometry on Heat Transfer of Nanofluids." CFD Letters 16, no. 7 (2024): 89–104. http://dx.doi.org/10.37934/cfdl.16.7.89104.

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The use of micro-channel heat exchangers is widespread across a variety of different industrial sectors. This study presents both an experimental and a numerical analysis to compare the performance of four different designs of microchannel heat sinks. The study dealt with using pure water and nanofluid (Al2O3, CuO, and TiO2–H2O) with volumetric concentrations of (0.01- 0.03) as coolants. The software Comsol Multiphysics was employed for conducting numerical analysis in order to simulate and resolve the issue pertaining to fluid and heat flow in a three-dimensional domain. A constant heat flux

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23

Yew Wai Loon, Nor azwadi Che Sidik, and Yutaka Asako. "Numerical Analysis of Fluid Flow and Heat Transfer Characteristics of Novel Microchannel Heat Sink." Journal of Advanced Research in Numerical Heat Transfer 15, no. 1 (2024): 1–23. http://dx.doi.org/10.37934/arnht.15.1.123.

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Microchannel heat sinks have gained prominence in the field of thermal management, offering compact and efficient solutions for dissipating heat flux from high performance electronic devices. Escalating heat flux in modern electronic devices, such as those found in telecommunication equipment, industrial automation equipment, solar devices, and data centre servers has driven the continuous development of microchannel heat sink to achieve efficient thermal management. The critical challenge in thermal management for these devices is to develop a microchannel that enhances heat transfer performa

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24

Hung, Tu-Chieh, Yu-Xian Huang, and Wei-Mon Yan. "Design of Porous-Microchannel Heat Sinks with Different Porous Configurations." International Journal of Materials, Mechanics and Manufacturing 4, no. 2 (2015): 89–94. http://dx.doi.org/10.7763/ijmmm.2016.v4.231.

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25

Zhu, Qifeng, Feiyue Zhu, Dianwei Fu, Anchao Zhang, and Sen Zhang. "Effects of geometric parameters on fluid flow and heat transfer in microchannel heat sink with trapezoidal grooves in sidewalls." Thermal Science, no. 00 (2022): 49. http://dx.doi.org/10.2298/tsci220129049z.

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Trapezoidal grooves were arranged in channel sidewalls of the proposed microchannel heat sinks to enhance heat transfer for cooling microelectronic systems. Three-dimensional numerical simulations were carried out to investigate the characteristics of fluid flow and heat transfer in the proposed microchannels. Field structures of thermal fluid flow, Nusselt number (Nu) and friction factor (f) were employed to study the effects of the relative groove depth (?) and relative grooves spacing length (?) of trapezoidal grooves on the thermal and hydraulic performance of the proposed microchannels. T

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26

Ghani, Usman, Muhammad Anas Wazir, Kareem Akhtar, Mohsin Wajib, and Shahmir Shaukat. "Microchannel Heat Sinks—A Comprehensive Review." Electronic Materials 5, no. 4 (2024): 249–92. http://dx.doi.org/10.3390/electronicmat5040017.

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An efficient cooling system is necessary for the reliability and safety of modern microchips for a longer life. As microchips become smaller and more powerful, the heat flux generated by these chips per unit area also rises sharply. Traditional cooling techniques are inadequate to meet the recent cooling requirements of microchips. To meet the current cooling demand of microelectromechanical systems (MEMS) devices and microchips, microchannel heat sink (MCHS) technology is the latest invention, one that can dissipate a significant amount of heat because of its high surface area to volume ratio

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27

Copeland, D., M. Behnia, and W. Nakayama. "Manifold microchannel heat sinks: isothermal analysis." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 20, no. 2 (1997): 96–102. http://dx.doi.org/10.1109/95.588554.

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28

Savino, Stefano, and Carlo Nonino. "Thermal Performance Improvement of Cross-Flow Double-Layered Microchannel Heat Sinks through Proper Header Design." Energies 17, no. 15 (2024): 3790. http://dx.doi.org/10.3390/en17153790.

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Over the past two decades, double-layered microchannel heat sinks (DL-MCHs) have become increasingly popular as they provide effective performance for electronic cooling, particularly in the counterflow configuration. The cross-flow configuration, which requires much simpler headers, has seldom been considered in the scientific literature, probably due to the possible formation of a hotspot near the outlet port. The aim of this study is to show that cross-flow DL-MCHs can provide performance levels that are comparable to those attained by counterflow DL-MCHs by exploiting the nonuniform flow d

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29

Jin, Lufan, Junchao Wang, Yixun Cai, et al. "Experimental and Numerical Study of a Trapezoidal Rib and Fan Groove Microchannel Heat Sink." Micromachines 15, no. 6 (2024): 713. http://dx.doi.org/10.3390/mi15060713.

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A novel microchannel heat sink (TFMCHS) with trapezoidal ribs and fan grooves was proposed, and the microchannel was manufactured using selective laser melting technology. Firstly, the temperature and pressure drop at different power levels were measured through experiments and then combined with numerical simulation to explore the complex flow characteristics within TFMCHSs and evaluate the comprehensive performance of microchannel heat sinks based on the thermal enhancement coefficient. The results show that, compared with rectangular microchannel heat sinks (RMCHSs), the average and maximum

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30

Rahman, Muhammad Mustafizur. "Measurements of heat transfer in microchannel heat sinks." International Communications in Heat and Mass Transfer 27, no. 4 (2000): 495–506. http://dx.doi.org/10.1016/s0735-1933(00)00132-9.

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31

Chen, Chien-Hsin. "Forced convection heat transfer in microchannel heat sinks." International Journal of Heat and Mass Transfer 50, no. 11-12 (2007): 2182–89. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2006.11.001.

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32

Cheng, Ping, Hui-Ying Wu, and Fang-Jun Hong. "Phase-Change Heat Transfer in Microsystems." Journal of Heat Transfer 129, no. 2 (2006): 101–8. http://dx.doi.org/10.1115/1.2410008.

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Recent work on miscroscale phase-change heat transfer, including flow boiling and flow condensation in microchannnels (with applications to microchannel heat sinks and microheat exchangers) as well as bubble growth and collapse on microheaters under pulse heating (with applications to micropumps and thermal inkjet printerheads), is reviewed. It has been found that isolated bubbles, confined elongated bubbles, annular flow, and mist flow can exist in microchannels during flow boiling. Stable and unstable flow boiling modes may occur in microchannels, depending on the heat to mass flux ratio and

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33

Wang, Yuwei, Jie Yu, Cong Qi, and Wenjie Zhang. "Review on Coupled Thermo-Hydraulic Performance of Nanofluids and Microchannels." Nanomaterials 12, no. 22 (2022): 3979. http://dx.doi.org/10.3390/nano12223979.

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As electronic components continue to be miniaturized, the heat flux density continues to increase. Scholars have proposed the use of microchannel heat sinks (MCHS) to dissipate heat from devices with high heat flux density, and have pointed out that the heat dissipation capability of MCHS can be improved in two ways: using nanofluids with high thermal conductivity and optimizing the structure of MCHS. In this paper, the thermophysical parameters and thermo-hydraulic performance of nanofluids in microchannels are reviewed. Improving the heat dissipation of MCHS is analyzed and discussed in term

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34

Zhang, Xiaoming, Tao Yang, Zhenyuan Chang, et al. "Multi-Objective Optimization of the Microchannel Heat Sink Used for Combustor of the Gas Turbine." Energies 17, no. 4 (2024): 818. http://dx.doi.org/10.3390/en17040818.

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This research presents a surrogate model and computational fluid dynamic analysis-based multi-objective optimization approach for microchannel heat sinks. The Non-dominated Sorting Genetic Algorithm is suggested to obtain the optimal solution set, and the Kriging model is employed to lower the simulation’s computational cost. The physical model consists of a coolant chamber, a mainstream chamber, and a solid board equipped with staggered Zigzag cooling channels. Five design variables are examined in relation to the geometric characteristics of the microchannel heat sinks: the length of inlet o

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Staszak, Maciej, and Grzegorz Musielak. "Numerical Simulations of Flow and Heat Exchange in Zigzag-Shaped Microchannels." Applied Sciences 14, no. 21 (2024): 9826. http://dx.doi.org/10.3390/app14219826.

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Cooling of electronic components is of great importance currently. One of the most important methods of integrated circuit cooling is the use of microchannel heat sinks. The aim of this work is to analyze the cooling capacity of zigzag shaped microchannels. The heat exchange for four different microchannels was tested depending on the flow rate of the cooling liquid (water) and the temperature of the cooled element. The system of differential equations that describe fluid flow and heat transport is presented in the paper. The equations were solved using the finite volume method. The work showe

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36

Xu, Shanglong, Yihao Wu, Qiyu Cai, Lili Yang, and Yue Li. "Optimization of the thermal performance of multi-layer silicon microchannel heat sinks." Thermal Science 20, no. 6 (2016): 2001–13. http://dx.doi.org/10.2298/tsci141213122x.

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The objective is to optimize the configuration sizes and thermal performance of a multilayer silicon microchannel heat sink by the thermal resistance network model. The effect of structural parameter on the thermal resistance is analyzed by numercal simulation. Taking the thermal resistance as an objective function, a nonlinear and multi-constrained optimization model are proposed for the silicon microchannel heat sink in electronic chips cooling. The sequential quadratic programming (SQP) method is used to do the optimization design of the configuration sizes of the microchannel. For the heat

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Kumar, Shailesh Ranjan, and Satyendra Singh. "Numerical Analysis for Augmentation of Thermal Performance of Single-Phase Flow in Microchannel Heat Sink of Different Sizes with or without Micro-Inserts." Fluids 7, no. 5 (2022): 149. http://dx.doi.org/10.3390/fluids7050149.

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With the development of miniaturized and enormous heat density generating novel technologies, the microchannel heat sink is rapidly establishing itself in modern cooling fields. Enhancement of heat transfer performance of microchannels is done by incorporating improved design structure, changing working fluids and flow conditions, using different materials for fabrication, etc. Coupling of two parameters influencing heat transfer performance of microchannels is in a nascent age, and complex coupling of heat transfer influencing parameters of microchannel sinks has not been clearly understood y

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38

Hegde, Pradeep, and K. N. Seetharamu. "Effects of Nonuniform Base Heating on Single Stack and Multi-Stack Microchannel Heat Sinks Used for Electronics Cooling." Journal of Microelectronics and Electronic Packaging 7, no. 2 (2010): 90–98. http://dx.doi.org/10.4071/1551-4897-7.2.90.

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Numerical investigations with regard to the thermal characteristics of water cooled single stack and multistack microchannel heat sinks subjected to nonuniform base heating are conducted. Nonuniformities in base heating are accomplished by applying gradually increasing and gradually decreasing base heat fluxes with respect to coolant flow direction in the heat sink. The effects of heat concentration upstream, downstream, and in the center half of the microchannel heat sinks (similar to a hotspot) are also studied. Both parallel flow and counter coolant flow conditions in the heat sink are cons

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39

Wu, Tao, Lizhi Wang, Yicun Tang, Chao Yin, and Xiankai Li. "Flow and Heat Transfer Performances of Liquid Metal Based Microchannel Heat Sinks under High Temperature Conditions." Micromachines 13, no. 1 (2022): 95. http://dx.doi.org/10.3390/mi13010095.

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Developments in applications such as rocket nozzles, miniature nuclear reactors and solar thermal generation pose high-density heat dissipation challenges. In these applications, a large amount heat must be removed in a limited space under high temperature. In order to handle this kind of cooling problem, this paper proposes liquid metal-based microchannel heat sinks. Using a numerical method, the flow and heat transfer performances of liquid metal-based heat sinks with different working fluid types, diverse microchannel cross-section shapes and various inlet velocities were studied. By solvin

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Yan, Anru, Xu Liu, Xiaobo Wang, and Zhiyong Wang. "Design and Analysis of Microchannels for Heat Dissipation of High-Energy VCSELs Based on Laser 3D Printing." Applied Sciences 12, no. 20 (2022): 10205. http://dx.doi.org/10.3390/app122010205.

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For the problem of high waste heat in the active area of high-power VCSEL arrays and the difficulty of heat dissipation, we took advantage of laser 3D printing technology and combined it with the relevant principles of fluid-structure coupling, three kinds of microchannel heat sink with different structures of pin-fin, honeycomb, and double-layer reflow were designed. The heat dissipation capacity of three kinds of heat sinks to the heat flux density 200 W/cm2 VCSEL array and the influence of the key characteristics of the microchannel on the heat dissipation capacity was studied. The results

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Collins, Ivel L., Justin A. Weibel, Liang Pan, and Suresh V. Garimella. "Evaluation of Additively Manufactured Microchannel Heat Sinks." IEEE Transactions on Components, Packaging and Manufacturing Technology 9, no. 3 (2019): 446–57. http://dx.doi.org/10.1109/tcpmt.2018.2866972.

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Hung, Tu-Chieh, Wei-Mon Yan, Xiao-Dong Wang, and Chun-Yen Chang. "Heat transfer enhancement in microchannel heat sinks using nanofluids." International Journal of Heat and Mass Transfer 55, no. 9-10 (2012): 2559–70. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2012.01.004.

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Kiran K. Ambatipudi, Muhammad M. Ra. "ANALYSIS OF CONJUGATE HEAT TRANSFER IN MICROCHANNEL HEAT SINKS." Numerical Heat Transfer, Part A: Applications 37, no. 7 (2000): 711–31. http://dx.doi.org/10.1080/104077800274046.

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HIRA, GOURAV, and MONOJ BORDOLOI. "REVIEW OF HEAT TRANSFER ANALYSIS IN MICROCHANNEL HEAT SINKS." International Journal of Engineering Science and Technology 8, no. 2S (2018): 201–3. http://dx.doi.org/10.21817/ijest/2018/v10i2s/181002s036.

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Chen, Zijian. "Numerical study of different micro-channel structures on fluid flow and heat transfer performance." Journal of Physics: Conference Series 2441, no. 1 (2023): 012015. http://dx.doi.org/10.1088/1742-6596/2441/1/012015.

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Abstract This research mainly proposed three new types of micro-channel heat sink structures. Numerical simulations and simulation calculations were carried out on the heat sink structure. The three groups of inlet flow rates were used as the main variables to analyse the three new types of heat sinks, model flow characteristics and heat transfer performance. In addition, it was compared with the traditional rectangular micro-channel heat sink (RT-MCHS). Based on and compared with RT-MCHS, three new microchannel heat sinks, reverse concave microchannel heat sink (RC-MCHS), co-directional conca

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Muhammad Hazeer Khiralsaleh Mohamad Rohaizan, Nor Azwadi Che Sidik, and Kamyar Shameli. "Numerical Analysis of Heat Transfer in Microchannel Heat Transfer in Microchannel Heat Sink using Flow Disruption." Journal of Advanced Research Design 106, no. 1 (2024): 1–14. http://dx.doi.org/10.37934/ard.106.1.114.

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Microchannel heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimum levels. It is widely used in computers that are used to cool central processing units or graphic processors. In order to achieve great heat transfer performance of microchannel heat sink, passive method are used in this research particularly the flow disruption and secondary channel. A three-dimensional computational f

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Shen, Jienan, Xiuxiu Li, Yongsheng Zhu, et al. "A Three-Dimensional Simulation Analysis of Fluid Flow and Heat Transfer in Microchannel Heat Sinks with Different Structures." Journal of Non-Equilibrium Thermodynamics 46, no. 3 (2021): 235–53. http://dx.doi.org/10.1515/jnet-2020-0099.

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Abstract Numerical studies have been performed to analyze the fluid flow and heat transfer characteristics of nine microchannel heat sinks (MCHS) with different shapes and different arrangements of the ribs and cavities on the sidewalls, using three common shapes (square, triangle, and circular) of ribs or cavities as the basic structure in this work. The boundary conditions, governing equations, friction factor (f), Nusselt number (Nu), and performance evaluation criteria (ξ) were considered to determine which design was the best in terms of the heat transfer, the pressure drop, and the overa

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Cruz Duarte, Jorge Mario, Iván Mauricio Amaya Contreras, and Carlos Rodrigo Correa Cely. "COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS." Revista EIA 12, no. 24 (2015): 151–66. http://dx.doi.org/10.24050/reia.v12i24.880.

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This article deals with the design of optimum microchannel heat sinks through Unified Particle Swarm Optimisation (UPSO) and Harmony Search (HS). These heat sinks are used for the thermal management of electronic devices, and we analyse the performance of UPSO and HS in their design, both, systematically and thoroughly. The objective function was created using the entropy generation minimisation criterion. In this study, we fixed the geometry of the microchannel, the amount of heat to be removed, and the properties of the cooling fluid. Moreover, we calculated the entropy generation rate, the

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Türkakar, Göker, and Tuba Okutucu-Özyurt. "Dimensional optimization of microchannel heat sinks with multiple heat sources." International Journal of Thermal Sciences 62 (December 2012): 85–92. http://dx.doi.org/10.1016/j.ijthermalsci.2011.12.015.

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Hussein, Hasan Qahtan, Ekhlas M. Fayyadh, and Moayed R. Hasan. "A review of single flow, flow boiling, and coating microchannel studies." Open Engineering 14, no. 1 (2024). http://dx.doi.org/10.1515/eng-2022-0522.

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Abstract The objective of this review article is to provide a comprehensive analysis of the latest research on microchannel heat sinks, with a particular focus on single-phase flow, flow boiling, and coating microchannels. The review aims to highlight the progress made in this field and identify the challenges that need to be addressed to promote the widespread adoption of microchannel heat sinks. The review article examines the research on microchannel heat sinks and analyzes the findings related to single-phase flow, flow boiling, and coating microchannels. The analysis of single-phase flow

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