Relevant bibliographies by topics / Microchannel Heat Transfer

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Microchannel Heat Transfer'

Author: Grafiati
Published: 4 June 2021
Last updated: 1 February 2022

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Journal articles on the topic "Microchannel Heat Transfer"

1

Zhang, Donghui, Haiyang Xu, Yi Chen, Leiqing Wang, Jian Qu, Mingfa Wu, and Zhiping Zhou. "Boiling Heat Transfer Performance of Parallel Porous Microchannels." Energies 13, no. 11 (June 10, 2020): 2970. http://dx.doi.org/10.3390/en13112970.

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Flow boiling in microporous layers has attracted a great deal of attention in the enhanced heat transfer field due to its high heat dissipation potential. In this study, flow boiling experiments were performed on both porous microchannels and a copper-based microchannel, using water as the coolant. As the heat flux was less than 80 W/cm2, the porous microchannels presented significantly higher boiling heat transfer coefficients than the copper-based microchannel. This was closely associated with the promotion of the nucleation site density of the porous coating. With the further increase in heat flux, the heat transfer coefficients of the porous microchannels were close to those of the copper-based sample. The boiling process in the porous microchannel was found to be dominated by the nucleate boiling mechanism from low to moderate heat flux (<80 W/cm2).This switched to the convection boiling mode at high heat flux. The porous samples were able to mitigate flow instability greatly. A visual observation revealed that porous microchannels could suppress the flow fluctuation due to the establishment of a stable nucleate boiling process. Porous microchannels showed no advantage over the copper-based sample in the critical heat flux. The optimal thickness-to-particle-size ratio (δ/d) for the porous microchannel was confirmed to be between 2–5. In this range, the maximum enhanced effect on boiling heat transfer could be achieved.
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Gong, Liang, and Bo Wei. "The Characteristics of Fluid Flow and Heat Transfer in Wavy, Dimple and Wavy-Dimple Microchannels." Applied Mechanics and Materials 394 (September 2013): 173–78. http://dx.doi.org/10.4028/www.scientific.net/amm.394.173.

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The flow and heat transfer characteristics were numerically studied in wave, dimple and wave-dimple microchannels for thermal managements on the chip of Intel i7-996X with heat flux of 0.56 W/mm2.The results show that, in microchannles heat sink, the dimple structure could reduce the flow resistances and the wavy wall could enhance heat transfer. According to the both advantages, two types of microchannel heat sink both with dimples and wavy walls were designed, and the flow and heat transfer characteristics were numerically studied. It is proved that the wave-dimple microchannels heat sink holds the characteristics of enhancing heat transfer with low pressure drop, which implies it has great potential of development and application prospect.
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Pan, Minqiang, Hongqing Wang, Yujian Zhong, Tianyu Fang, and Xineng Zhong. "Numerical simulation of the fluid flow and heat transfer characteristics of microchannel heat exchangers with different reentrant cavities." International Journal of Numerical Methods for Heat & Fluid Flow 29, no. 11 (November 4, 2019): 4334–48. http://dx.doi.org/10.1108/hff-03-2019-0252.

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Purpose With the increasing heat dissipation of electronic devices, the cooling demand of electronic products is increasing gradually. A water-cooled microchannel heat exchanger is an effective cooling technology for electronic equipment. The structure of a microchannel has great impact on the heat transfer performance of a microchannel heat exchanger. The purpose of this paper is to analyze and compare the fluid flow and heat transfer characteristic of a microchannel heat exchanger with different reentrant cavities. Design/methodology/approach The three-dimensional steady, laminar developing flow and conjugate heat transfer governing equations of a plate microchannel heat exchanger are solved using the finite volume method. Findings At the flow rate range studied in this paper, the microchannel heat exchangers with reentrant cavities present better heat transfer performance and smaller pressure drop. A microchannel heat exchanger with trapezoidal-shaped cavities has best heat transfer performance, and a microchannel heat exchanger with fan-shaped cavities has the smallest pressure drop. Research limitations/implications The fluid is incompressible and the inlet temperature is constant. Practical implications It is an effective way to enhance heat transfer and reduce pressure drop by adding cavities in microchannels and the data will be helpful as guidelines in the selection of reentrant cavities. Originality/value This paper provides the pressure drop and heat transfer performance analysis of microchannel heat exchangers with various reentrant cavities, which can provide reference for heat transfer augmentation of an existing microchannel heat exchanger in a thermal design.
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Huang, Binghuan, Haiwang Li, and Tiantong Xu. "Experimental Investigation of the Flow and Heat Transfer Characteristics in Microchannel Heat Exchangers with Reentrant Cavities." Micromachines 11, no. 4 (April 12, 2020): 403. http://dx.doi.org/10.3390/mi11040403.

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The application of microchannel heat exchangers is of great significance in industrial fields due to their advantages of miniaturized scale, large surface-area-to-volume ratio, and high heat transfer rate. In this study, microchannel heat exchangers with and without fan-shaped reentrant cavities were designed and manufactured, and experiments were conducted to investigate the flow and heat-transfer characteristics. The impact rising from the radius of reentrant cavities, as well as the Reynolds number on the heat transfer and the pressure drop, is also analyzed. The results indicate that, compared with straight microchannels, microchannels with reentrant cavities could enhance the heat transfer and, more importantly, reduce the pressure drop at the same time. For the ranges of parameters studied, increasing the radius of reentrant cavities could augment the effect of pressure-drop reduction, while the corresponding variation of heat transfer is complicated. It is considered that adding reentrant cavities in microchannel heat exchangers is an ideal approach to improve performance.
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Liu, Dong, and Suresh V. Garimella. "Flow Boiling Heat Transfer in Microchannels." Journal of Heat Transfer 129, no. 10 (December 14, 2006): 1321–32. http://dx.doi.org/10.1115/1.2754944.

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Flow boiling heat transfer to water in microchannels is experimentally investigated. The dimensions of the microchannels considered are 275×636 and 406×1063μm2. The experiments are conducted at inlet water temperatures in the range of 67–95°C and mass fluxes of 221–1283kg∕m2s. The maximum heat flux investigated in the tests is 129W∕cm2 and the maximum exit quality is 0.2. Convective boiling heat transfer coefficients are measured and compared to predictions from existing correlations for larger channels. While an existing correlation was found to provide satisfactory prediction of the heat transfer coefficient in subcooled boiling in microchannels, saturated boiling was not well predicted by the correlations for macrochannels. A new superposition model is developed to correlate the heat transfer data in the saturated boiling regime in microchannel flows. In this model, specific features of flow boiling in microchannels are incorporated while deriving analytical solutions for the convection enhancement factor and nucleate boiling suppression factor. Good agreement with the experimental measurements indicates that this model is suitable for use in analyzing boiling heat transfer in microchannel flows.
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Jiang, Weiyu, Lili Sun, Jijin Mao, Zhang Donghui, and A. Levtsev. "Effect of Copper Particles Shape on the Heat Transfer Characteristics of Porous Microchannels During Boiling of Working Fluid." Bulletin of Science and Practice 7, no. 4 (April 15, 2021): 286–94. http://dx.doi.org/10.33619/2414-2948/65/32.

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In this paper, the heat transfer performance of porous microchannels sintered with spherical and dendritic copper particle is compared. The working fluid is deionized water. For uniform particle size sample, the dendritic-particle microchannel presents better boiling heat transfer performance than the spherical-particle one. It includes higher critical heat flux (CHF), which was related to the connected pore structure of the dendritic copper powder. For mixed particle size sample, the dendritic-particle microchannel also shows higher heat transfer coefficient and CHF. At high heat flux, the dendritic-particle microchannel can effectively suppress the pressure pulsation and maintain a relatively stable flow boiling state in the microchannel.
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Zhou, Shengnan, Bifen Shu, Zukang Yu, Yan Huang, and Yuqi Zhang. "Experimental Study and Mechanism Analysis of the Flow Boiling and Heat Transfer Characteristics in Microchannels with Different Surface Wettability." Micromachines 12, no. 8 (July 27, 2021): 881. http://dx.doi.org/10.3390/mi12080881.

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In this paper experiments have been conducted to investigate the flow boiling and heat transfer characteristics in microchannels with three different surface wettability. Three types of microchannels with a super-hydrophilic surface (θ ≈ 0°), a hydrophilic surface (θ = 43°) and an untreated surface (θ = 70°) were prepared. The results show that the average heat transfer coefficient of a super-hydrophilic surface microchannel is significantly higher than that of an untreated surface microchannel, especially when the mass flux is high. The visualization of the flow patterns states that the number of bubble nucleation generated in the super-hydrophilic microchannel at the beginning of the flow boiling is significantly more than that in the untreated microchannel. Through detailed analysis of the experimental data, flow patterns and microchannel surface SEM images, it can be inferred that the super-hydrophilic surface microchannel has more active nucleation cavities, a high nucleation rate and a large nucleation number, a small bubble departure diameter and a fast departure frequency, thereby promoting the flow and heat transfer in the microchannel. In addition, through the force analysis of the vapor-liquid interface, the mechanism that the super-hydrophilic microchannel without dryout under high heat flux conditions is clarified.
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Cheng, Ping, Hui-Ying Wu, and Fang-Jun Hong. "Phase-Change Heat Transfer in Microsystems." Journal of Heat Transfer 129, no. 2 (September 20, 2006): 101–8. http://dx.doi.org/10.1115/1.2410008.

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Recent work on miscroscale phase-change heat transfer, including flow boiling and flow condensation in microchannnels (with applications to microchannel heat sinks and microheat exchangers) as well as bubble growth and collapse on microheaters under pulse heating (with applications to micropumps and thermal inkjet printerheads), is reviewed. It has been found that isolated bubbles, confined elongated bubbles, annular flow, and mist flow can exist in microchannels during flow boiling. Stable and unstable flow boiling modes may occur in microchannels, depending on the heat to mass flux ratio and inlet subcooling of the liquid. Heat transfer and pressure drop data in flow boiling in microchannels are shown to deviate greatly from correlations for flow boiling in macrochannels. For flow condensation in microchannels, mist flow, annular flow, injection flow, plug-slug flow, and bubbly flows can exist in the microchannels, depending on mass flux and quality. Effects of the dimensionless condensation heat flux and the Reynolds number of saturated steam on transition from annular two-phase flow to slug/plug flow during condensation in microchannels are discussed. Heat transfer and pressured drop data in condensation flow in microchannels, at low mass flux are shown to be higher and lower than those predicted by correlations for condensation flow in macrochannels, respectively. Effects of pulse heating width and heater size on microbubble growth and collapse and its nucleation temperature on a microheater under pulse heating are summarized.
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Srivastava, Pankaj, and Anupam Dewan. "A study of turbulent heat transfer in convergent-divergent shaped microchannel with ribs and cavities using CFD." Journal of Mechanical Engineering and Sciences 14, no. 1 (March 23, 2020): 6344–61. http://dx.doi.org/10.15282/jmes.14.1.2020.12.0497.

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This paper presents the effects of microchannel shape with ribs and cavities on turbulent heat transfer. Three-dimensional conjugate heat transfer using the SST k-ω turbulence model has been investigated for four different microchannels, namely, rectangular, rectangular with ribs and cavities, convergent-divergent (CD) and convergent-divergent with Ribs and Cavities (CD-RC). The flow field, pressure and temperature distributions and friction factor are analyzed, and thermal resistance and average Nusselt number are compared. The thermal performance of the CD-RC microchannel is found to be better than that of other microchannels considered in terms of an average Nusselt number increased from 16% to 40%. Heat transfer increases due to a strong fluid mixing and periodic interruption of boundary-layer. It is observed that with an increase in Reynolds number (Re), the thermal resitance drops rapidly. The thermal resistance of the CD-RC microchannel is decreased by 30% than that of the rectangular microchannel for Re ranging from 2500 to 7000. However, such design of microchannel loses its heat transfer effectiveness due to a high pumping power at high values of Re.
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Jawade, Shubham. "Thermal Analysis of Microchannels Heat Sink using Super-hydrophobic Surface." International Journal for Research in Applied Science and Engineering Technology 9, no. 9 (September 30, 2021): 654–57. http://dx.doi.org/10.22214/ijraset.2021.38024.

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Abstract: Electronics devices are the major part of modern technology and with the rapid growth of miniaturizations of electronic devices, the heat dissipation from these devices have been the objective for researchers. This heat dissipation has to done effectively otherwise this will affect the life of device and will result decrement in efficiency. Increasing the heat transfer rates from electronic devices has long been a quest. Microchannel heat sink is one of the best option for removing heat from the electronics devices due to its compact size which provides high surface area to volume ratio that enables higher heat transfer rates. Microchannels are the flow passages having hydraulic diameter ranges from 10 micrometer (µm) to 200µm. Microchannel heat sink enhances the feasibility of electronics device. Microchannels with hydrophobic surface are a promising candidate for cooling of electronics devices, as hydrophobic surface can be used to create friction free regions with a channel which effectively reduce pumping power, flow pressure drop and frictional factor compared to Microchannel without Hydrophobic surface. This paper deals with the detailed behavior of Microchannel with hydrophobic surface. In this work, rectangular cross section with 0.8 mm (800 micron) hydraulic diameter super hydrophobic microchannel is used. Keywords: Microchannel, Hydrophobic surface, Heat transfer rate, Frictional factor.
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Dissertations / Theses on the topic "Microchannel Heat Transfer"

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Siu, Billy Chin Pang. "Condensation heat transfer in microchannel /." View abstract or full-text, 2004. http://library.ust.hk/cgi/db/thesis.pl?MECH%202004%20SIU.

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Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2004.
Includes bibliographical references (leaves 43-46). Also available in electronic version. Access restricted to campus users.
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Lee, Man. "Forced convection heat transfer in integrated microchannel heat sinks /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20LEE.

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Turgay, Metin Bilgehan. "Effect Of Surface Roughness In Microchannels On Heat Transfer." Master's thesis, METU, 2008. http://etd.lib.metu.edu.tr/upload/12610253/index.pdf.

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In this study, effect of surface roughness on convective heat transfer and fluid flow in two dimensional parallel plate microchannels is analyzed by numerically. For this purpose, single-phase, developing, laminar fluid flow at steady state and in the slip flow regime is considered. The continuity, momentum, and energy equations for Newtonian fluids are solved numerically for constant wall temperature boundary condition. Slip velocity and temperature jump at wall boundaries are imposed to observe the rarefaction effect. Effect of axial conduction inside the fluid and viscous dissipation also considered separately. Roughness elements on the surfaces are simulated by triangular geometrical obstructions. Then, the effect of these roughness elements on the velocity field and Nusselt number are compared to the results obtained from the analyses of flows in microchannels with smooth surfaces. It is found that increasing surface roughness reduces the heat transfer at continuum conditions. However in slip flow regime, increase in Nusselt number with increasing roughness height is observed. Moreover, this increase is found to be more obvious at low rarefied flows. It is also found that presence of axial conduction and viscous dissipation has increasing effect on heat transfer in smooth and rough channels.
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Al-Waaly, Ahmed. "The effect of heat transfer on temperature measurement and its applications to study microchannel heat sinks." Thesis, University of Glasgow, 2015. http://theses.gla.ac.uk/6781/.

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Analytical, numerical and experimental analyses have been performed to investigate the effects of thermocouple wire electrical insulation on the temperature measurement of a reference surface. Two diameters of K-type thermocouple, 80μm and 200μm, with different exposed stripped wire lengths (0 mm, 5mm, 10mm, 15mm and 20mm) were used to measure various surface temperatures (4oC, 8oC, 15oC, 25oC and 35oC). Measurements were made when the thermocouple probe is in direct contact with the surface and the wires are extended vertically and exposed to natural convection from outside environment. Experimental results confirmed that the thermal effect from the electrical insulation on temperature measurement was within -0.5oC and therefore it can be neglected. Moreover, the experimental results agree well with those obtained by both the analytical and numerical methods and further confirm that the diameter of the thermocouple has an impact on the temperature measurement. Analytical results of the thermocouple wire with insulation confirm that there is no specific value for the critical radius and the rate of heat flux around the thermocouple wire continuously increases with the wire radius even when this is larger than the critical radius. Experimental and numerical analyses have been performed to investigate the heating impact of using thermocouples for the temperature measurement of small volumes of cold water. Two sizes of K-type thermocouple have been used: 80μm and 315μm to measure the temperature of the cold water inside a small chamber while the thermocouple wires were extended vertically in the outside environment. For this study, the chamber temperature was adjusted to 4oC. The results show that the heating effect of the thermocouple decreases for the greater depth measurements and this effect is eliminated when the thermocouple junction is close to the chamber bottom surface. The increase in the thermal resistance between the bottom surface and the thermocouple junction raises the heating effect of the thermocouple impact. Moreover, the exposed length of thermocouple wires to the environment has no effect over a specific length where the wire end temperature is equal to that of the environment. Experimental and numerical analyses have been carried out to study the effect of using subchannels in heat sink to minimise the effect of hotspots generated on a chip circuit. Two devices of heat sink – with and without subchannels – were fabricated in order to investigate this effect. The first device was manufactured with a normal parallel channel while the second one was designed to extract more heat by dividing the main channels above the hotspot into two subchannels. A hotspot heat flux (16.7×104 [W/m2]) was applied at the centre of the channels while a uniform heat flux (4.45×104 [W/m2]) was applied at upstream and downstream of the channels. Five mass flow rates have generated under gravity force to investigate the performance of devices under different operating conditions. The results showed the maximum surface temperature was reduced by 4oC the temperature uniformity was improved. Moreover, thermal resistance was reduced by 25% but the pumping power was increased as a result of the presence of the subchannels.
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Ojada, Ejiro Stephen. "Analysis of mass transfer by jet impingement and study of heat transfer in a trapezoidal microchannel." [Tampa, Fla] : University of South Florida, 2009. http://purl.fcla.edu/usf/dc/et/SFE0003297.

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Determan, Matthew D. "Experimental and Analytical Investigation of Ammonia-Water Desorption in Microchannel Geometries." Thesis, Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/7149.

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An experimental and analytical study of a microchannel ammonia-water desorber was conducted in this study. The desorber consists of 5 passes of 16 tube rows each with 27, 1.575 mm outside diameter x 140 mm long tubes per row for a total of 2160 tubes. The desorber is an extremely compact 178 mm x 178 mm x 0.508 m tall component, and is capable of transferring the required heat load (~17.5 kW) for a representative residential heat pump system. Experimental results indicate that the heat duty ranged from 5.37 kW to 17.46 kW and the overall heat transfer coefficient ranges from 388 to 617 W/m2-K. The analytical model predicts temperature, concentration and mass flow rate profiles through the desorber, as well as the effective wetted area of the heat transfer surface. Heat and mass transfer correlations as well as locally measured variations in the heating fluid temperature are used to predict the effective wetted area. The average wetted area of the heat and mass exchanger ranged from 0.25 to 0.69 over the range of conditions tested in this study. Local mass transfer results indicate that water vapor is absorbed into the solution in the upper stages of the desorber leading to higher concentration ammonia vapor and therefore reducing the rectifier cooling capacity required. These experimentally validated results indicate that the microchannel geometry is well suited for use as a desorber. Previous experimental and analytical research has demonstrated the performance of this microchannel geometry as an absorber. Together, these studies show that this compact geometry is suitable for all components in an absorption heat pump, which would enable the increased use of absorption technology in the small capacity heat pump market.
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Rastan, Hamidreza. "Investigation of the heat transfer of enhanced additively manufactured minichannel heat exchangers." Thesis, KTH, Skolan för industriell teknik och management (ITM), 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-264278.

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Mini-/microchannel components have received attention over the past few decades owing to their compactness and superior thermal performance. Microchannel heat sinks are typically manufactured through traditional manufacturing practices (milling and sawing, electrodischarge machining, and water jet cutting) by changing their components to work in microscale environments or microfabrication techniques (etching and lost wax molding), which have emerged from the semiconductor industry. An extrusion process is used to produce multiport minichannel-based heat exchangers (HXs). However, geometric manufacturing limitations can be considered as drawbacks for all of these techniques. For example, a complex out-of-plane geometry is extremely difficult to fabricate, if not impossible. Such imposed design constraints can be eliminated using additive manufacturing (AM), generally known as three-dimensional (3D) printing. AM is a new and growing technique that has received attention in recent years. The inherent design freedom that it provides to the designer can result in sophisticated geometries that are impossible to produce by traditional technologies and all for the redesign and optimization of existing models. The work presented in this thesis aims to investigate the thermal performance of enhanced minichannel HXs manufactured via metal 3D printing both numerically and experimentally. Rectangular winglet vortex generators (VGs) have been chosen as the thermal enhancement method embedded inside the flat tube. COMSOL Multiphysics, a commercial software package using a finite element method (FEM), has been used as a numerical tool. The influence of the geometric VG parameters on the heat transfer and flow friction characteristics was studied by solving a 3D conjugate heat transfer and laminar flow. The ranges of studied parameters utilized in simulation section were obtained from our previous interaction with various AM technologies including direct metal laser sintering (DMLS) and electron-beam melting (EBM). For the simulation setup, distilled water was chosen as the working fluid with temperaturedependent thermal properties. The minichannel HX was assumed to be made of AlSi10Mg with a hydraulic diameter of 2.86 mm. The minichannel was heated by a constant heat flux of 5 Wcm−2 , and the Reynolds number was varied from 230 to 950. A sensitivity analysis showed that the angle of attack, VG height, VG length, and longitudinal pitch have notable effects on the heat transfer and flow friction characteristics. In contrast, the VG thickness and the distance from the sidewalls do not have a significant influence on the HX performance over the studied range. On the basis of the simulation results, four different prototypes including a smooth channel as a reference were manufactured with AlSi10Mg via DMLS technology owing to the better surface roughness and greater design uniformity. A test rig was developed to test the prototypes. Owing to the experimental facility and working fluid (distilled water), the experiment was categorized as either a simultaneously developing flow or a hydrodynamically developed but thermally developing flow. The Reynolds number ranged from 175 to 1370, and the HX was tested with two different heat fluxes of 1.5 kWm−2 and 3 kWm−2 . The experimental results for the smooth channel were compared to widely accepted correlations in the literature. It was found that 79% of the experimental data were within a range of ±10% of the values from existing correlations developed for the thermal entry length. However, a formula developed for the simultaneously developing flow overpredicted the Nusselt number. Furthermore, the results for the enhanced channels showed that embedding VGs can considerably boost the thermal performance up to three times within the parameters of the printed parts. Finally, the thermal performance of the 3D-printed channel showed that AM is a promising solution for the development of minichannel HXs. The generation of 3D vortices caused by the presence of VGs ii can notably boost the thermal performance, thereby reducing the HX size for a given heat duty.
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Gokaltun, Seckin. "Lattice Boltzmann Method for Flow and Heat Transfer in Microgeometries." FIU Digital Commons, 2008. http://digitalcommons.fiu.edu/etd/64.

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Recent technological developments have made it possible to design various microdevices where fluid flow and heat transfer are involved. For the proper design of such systems, the governing physics needs to be investigated. Due to the difficulty to study complex geometries in micro scales using experimental techniques, computational tools are developed to analyze and simulate flow and heat transfer in microgeometries. However, conventional numerical methods using the Navier-Stokes equations fail to predict some aspects of microflows such as nonlinear pressure distribution, increase mass flow rate, slip flow and temperature jump at the solid boundaries. This necessitates the development of new computational methods which depend on the kinetic theory that are both accurate and computationally efficient. In this study, lattice Boltzmann method (LBM) was used to investigate the flow and heat transfer in micro sized geometries. The LBM depends on the Boltzmann equation which is valid in the whole rarefaction regime that can be observed in micro flows. Results were obtained for isothermal channel flows at Knudsen numbers higher than 0.01 at different pressure ratios. LBM solutions for micro-Couette and micro-Poiseuille flow were found to be in good agreement with the analytical solutions valid in the slip flow regime (0.01 < Kn < 0.1) and direct simulation Monte Carlo solutions that are valid in the transition regime (0.1 < Kn < 10) for pressure distribution and velocity field. The isothermal LBM was further extended to simulate flows including heat transfer. The method was first validated for continuum channel flows with and without constrictions by comparing the thermal LBM results against accurate solutions obtained from analytical equations and finite element method. Finally, the capability of thermal LBM was improved by adding the effect of rarefaction and the method was used to analyze the behavior of gas flow in microchannels. The major finding of this research is that, the newly developed particle-based method described here can be used as an alternative numerical tool in order to study non-continuum effects observed in micro-electro-mechanical-systems (MEMS).
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Bakaraju, Omkareshwar Rao. "Heat Transfer in Electroosmotic Flow of Power-Law Fluids in Micro-Channel." Cleveland State University / OhioLINK, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=csu1263337731.

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Cetin, Barbaros. "Analysis Of Single Phase Convective Heat Transfer In Microtubes And Microchannels." Master's thesis, METU, 2005. http://etd.lib.metu.edu.tr/upload/12605820/index.pdf.

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Heat transfer analysis of two-dimensional, incompressible, constant property, hydrodynamically developed, thermally developing, single phase laminar flow in microtubes and microchannels between parallel plates with negligible axial conduction is performed for constant wall temperature and constant wall heat flux thermal boundary conditions for slip flow regime. Fully developed velocity profile is determined analytically, and energy equation is solved by using finite difference method for both of the geometries. The rarefaction effect which is important for flow in low pressures or flow in microchannels is imposed to the boundary conditions of the momentum and energy equations. The viscous dissipation term which is important for high speed flows or flows in long pipelines is included in the energy equation. The effects of rarefaction and viscous heating on temperature profile and local Nusselt number are discussed. The results of the numerical method are verified with the well-known analytical results of the flow in macrochannels (i.e. Kn =0, Br =0) and with the available analytical results of flow in microchannels for simplified cases. The results show significant deviations from the flow in macrochannels.
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Books on the topic "Microchannel Heat Transfer"

1

Ohadi, Michael. Next Generation Microchannel Heat Exchangers. New York, NY: Springer New York, 2013.

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Chen, Lin. Microchannel Flow Dynamics and Heat Transfer of Near-Critical Fluid. Singapore: Springer Singapore, 2017. http://dx.doi.org/10.1007/978-981-10-2784-0.

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Saha, Sujoy Kumar, and Gian Piero Celata. Heat Transfer and Pressure Drop in Flow Boiling in Microchannels. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-20285-3.

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Chen, Lin. Microchannel Flow Dynamics and Heat Transfer of Near-Critical Fluid. Springer, 2016.

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Chen, Lin. Microchannel Flow Dynamics and Heat Transfer of Near-Critical Fluid. Springer, 2018.

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Kandlikar, Satish, Srinivas Garimella, Dongqing Li, Stephane Colin, and Michael R. King. Heat Transfer and Fluid Flow in Minichannels and Microchannels. Elsevier Science, 2005.

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Kandlikar, Satish, Srinivas Garimella, Dongqing Li, Stephane Colin, and Michael R. King. Heat Transfer and Fluid Flow in Minichannels and Microchannels. Elsevier Science & Technology, 2013.

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Heat Transfer and Fluid Flow in Minichannels and Microchannels. Elsevier Science, 2005.

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Heat Transfer Enhancement Using Nanofluid Flow in Microchannels. Elsevier, 2016. http://dx.doi.org/10.1016/c2015-0-02005-6.

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Ganji, Davood Domairry, and Amir Malvandi. Heat Transfer Enhancement Using Nanofluid Flow in Microchannels: Simulation of Heat and Mass Transfer. Elsevier Science & Technology Books, 2016.

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Book chapters on the topic "Microchannel Heat Transfer"

1

Joshi, Y., X. Wei, B. Dang, and K. Kota. "Some Aspects of Microchannel Heat Transfer." In Nano-Bio- Electronic, Photonic and MEMS Packaging, 431–77. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0040-1_13.

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Joshi, Y., X. Wei, B. Dang, and K. Kota. "Some Aspects of Microchannel Heat Transfer." In Nano-Bio- Electronic, Photonic and MEMS Packaging, 205–33. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-49991-4_10.

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Chen, Lin. "Heat Transfer Characteristics of Near-Critical Microchannel Flows." In Microchannel Flow Dynamics and Heat Transfer of Near-Critical Fluid, 95–118. Singapore: Springer Singapore, 2016. http://dx.doi.org/10.1007/978-981-10-2784-0_5.

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Korniliou, S., F. Coletti, and T. G. Karayiannis. "Flow Boiling of Water in a Square Metallic Microchannel." In Advances in Heat Transfer and Thermal Engineering, 207–10. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-4765-6_38.

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Chen, Lin. "Challenges in Near-Critical Microchannel Flows." In Microchannel Flow Dynamics and Heat Transfer of Near-Critical Fluid, 1–32. Singapore: Springer Singapore, 2016. http://dx.doi.org/10.1007/978-981-10-2784-0_1.

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Chen, Lin. "Discussion on Near-Critical Heat Transfer Flow Experiment." In Microchannel Flow Dynamics and Heat Transfer of Near-Critical Fluid, 51–67. Singapore: Springer Singapore, 2016. http://dx.doi.org/10.1007/978-981-10-2784-0_3.

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Ren, Yong, Yuning Huang, Yuying Yan, and Jing Wang. "Thermal Effect on Breakup Dynamics of Double Emulsion Flowing Through Constricted Microchannel." In Advances in Heat Transfer and Thermal Engineering, 309–13. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-4765-6_54.

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Nagayama, Gyoko, Seishi Sibuya, Masako Kawagoe, and Takaharu Tsuruta. "Heat Transfer Enhancement at Nanostructured Surface in Parallel-plate Microchannel." In Challenges of Power Engineering and Environment, 999–1006. Berlin, Heidelberg: Springer Berlin Heidelberg, 2007. http://dx.doi.org/10.1007/978-3-540-76694-0_185.

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Lee, Vivian Y. S., Gary Henderson, and Tassos G. Karayiannis. "Effect of Inlet Subcooling on Flow Boiling Behaviour of HFE-7200 in a Microchannel Heat Sink." In Advances in Heat Transfer and Thermal Engineering, 83–88. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-4765-6_15.

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Deng, Zeng, Jun Shen, Wei Dai, Ke Li, and Xueqiang Dong. "A Hybrid Microchannel and Slot Jet Array Heat Sink for Cooling High-Power Laser Diode Arrays." In Advances in Heat Transfer and Thermal Engineering, 609–15. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-4765-6_105.

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Conference papers on the topic "Microchannel Heat Transfer"

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Odaymet, A., and H. Louahlia-Gualous. "Experimental Investigation of Steam Condensation in a Silicon Microchannel." In 2010 14th International Heat Transfer Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/ihtc14-22191.

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Experimental investigations of a two-phase flow were conducted to study heat transfer and various flow patterns of steam condensation in two different microchannels. Microchannels have a rectangular cross-section with hydraulic diameter of 305μm (depth of 310μm and width of 300μm) and 410.5μm (depth of 312μm and width of 600μm). The length of each microchannel is of 50 mm. The silicon microchannel is covered with a transparent thin Pyrex plate to view different flow patterns. Microthermocouples (K-type, 20μm) were placed in rectangular silicon grooves. Measurements are carried out for different inlet pressures and flow rates of steam while the outlet pressure of the microchannel is kept at atmospheric pressure. Plug/slug flow patterns are observed in the microchannel for different mass fluxes. Local surface temperatures along the microchannel corresponding of each two-phase flow structure are measured and analyzed.
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Davaa, Ganbat, and O. Jambal. "HEAT TRANSFER PERFORMANCE EVALUATION OF CORRUGATED MICROCHANNEL HEAT SINKS." In International Heat Transfer Conference 16. Connecticut: Begellhouse, 2018. http://dx.doi.org/10.1615/ihtc16.nmt.022030.

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Nithiarasu, Perumal. "The Finite Element Method for Microchannel Flow and Heat Transfer Calculations." In 2010 14th International Heat Transfer Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/ihtc14-23375.

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In this paper, the finite element method for modelling of microchannel flow and heat transfer is discussed. The situations that need unstructured mesh technology are highlighted in addition to the flexible nature of the finite element method for problems with the need for adaptive refinement. Many of these aspects are demonstrated by solving flow and heat transfer through microchannels. Both mechanically driven and electrokinetically driven single phase flows in microchannels are considered. A brief discussion is provided on enhancement methods in which the finite element modelling can help. Only a selection of results are presented in this paper. More results will be presented during the conference.
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Cole, Gregory S., and Robert P. Scaringe. "The Evolution of Microchannel Heat Transfer." In Aerospace Power Systems Conference. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1999. http://dx.doi.org/10.4271/1999-01-1357.

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Koyuncuog˘lu, Aziz, Tuba Okutucu, and Haluk Ku¨lah. "A CMOS Compatible Metal-Polymer Microchannel Heat Sink for Monolithic Chip Cooling Applications." In 2010 14th International Heat Transfer Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/ihtc14-23212.

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A novel complementary metal oxide semiconductor (CMOS) compatible microchannel heat sink is designed and fabricated for monolithic liquid cooling of electronic circuits. The microchannels are fabricated with full metal walls between adjacent channels with a polymer top layer for easy sealing and optical visibility of the channels. The use of polymer also provides flexibility in adjusting the width of the channels allowing better management of the pressure drop. The proposed microchannel heat sink requires no design change of the electronic circuitry underneath, hence, can be produced by adding a few more steps to the standard CMOS fabrication flow. The microchannel heat sinks were tested successfully under various heat flux and coolant flow rate conditions. The preliminary cooling tests indicate that the proposed design is promising as a monolithic liquid cooling solution for CMOS circuits.
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Christopher, David M., and Xipeng Lin. "Bubble Growth During Nucleate Boiling in Microchannels." In 2010 14th International Heat Transfer Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/ihtc14-22725.

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The flow and heat transfer in microchannels has been of great interest for some years now due to the significantly higher heat transfer coefficients useful for enhancing the heat transfer in very small but high heat flux applications such as electronics cooling. Nucleate boiling heat transfer in microchannels is also of great interest for generating even higher heat transfer rates; however, numerous studies have shown that the bubble formation immediately fills the entire microchannel with vapor significantly reducing the heat transfer since the bubble size is normally of the same size as the microchannel. The bubble growth process is very fast and difficult to study experimentally, even with high speed cameras. This study numerically analyzes the flow and bubble growth in a microchannel for various conditions by solving the Navier-Stokes equations with the VOF model with an analytical microlayer model to provide the large amount of vapor produced by the curved region of the microlayer. As each bubble forms, the large pressure drop around the bubble causes the bubble to quickly break away from the nucleation site and move quickly downstream. The bubbles are quite small with the size depending on the bulk flow velocity, subcooling and the heating rate. The numerical results compare quite well with preliminary experimental observations of bubble growth on a microheater embedded in the channel wall for FC-72 flowing in a microchannel.
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Fogg, D. W., J. M. Koo, L. Jiang, and K. E. Goodson. "Numerical Simulation of Transient Boiling Convection in Microchannels." In ASME 2003 Heat Transfer Summer Conference. ASMEDC, 2003. http://dx.doi.org/10.1115/ht2003-47300.

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Two-phase microchannel heat exchangers are receiving increasing attention from the microprocessor industry as power density levels in microchips increase. Previous numerical investigations of convective boiling in microchannels assumed steady flow within the channels. However, experimental data shows that two-phase flows in microchannels are highly transient even under steady heat loads. Little work has been done to model the dynamics associated with vapor generation in microchannels. The present work simulates the periodic distribution of vapor within microchannels filled with water by solving one-dimensional homogeneous equations for the mass, momentum and energy transport in conjunction with a transient wall conduction equation. A wall superheat constraint is incorporated to account for the excess superheat temperature required for bubble nucleation. Boiling events reduce the local wall temperature and change the pressure and enthalpy distributions within the flow. The transient pressure fluctuations predicted here are consistent with those observed in experiments. This study provides insight into the significance of bubble nucleation for forced convective boiling in microchannels and will be useful for the optimization of microchannel heat exchangers.
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Betz, Amy Rachel, and Daniel Attinger. "Bubble Injection to Enhance Heat Transfer in Microchannel Heat Sinks." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-11972.

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Liquid cooling is an efficient way to remove heat fluxes with magnitude of 1 to 10,000 W/cm2. One limitation of current single-phase microchannel heat sinks is the relatively low Nusselt number, because of laminar flow. In this work, we experimentally investigate how to enhance the Nusselt number in the laminar regime with the periodic injection of non-condensable bubbles in a water-filled array of microchannels in a segmented flow pattern. We designed a polycarbonate heat sink consisting of an array of parallel microchannels with a low ratio of heat to convective resistance, to facilitate the measurement of the Nusselt Number. Our heat transfer and pressure drop measurements are in good agreement with existing correlations, and show that the Nusselt number of a segmented flow is increased by more than a hundred percent over single-phase flow provided the mass velocity is within a given range.
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Frijns, A. J. H., E. A. T. van den Akker, P. A. J. Hilbers, P. Stephan, and A. A. van Steenhoven. "Evaporative Microchannel Cooling: An Atomistic Approach." In 2010 14th International Heat Transfer Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/ihtc14-22839.

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Heat generation and temperature rise in electronic devices is a technical problem with increasing importance, since the number of transistors per surface area on integrated circuitries is rapidly increasing. If the heat cannot effectively be carried away damage in the circuitry may occur. Therefore enhanced and integrated cooling is needed. A promising technique is evaporative microchannel cooling. However, a major problem in modeling such micro-device is that the continuum approach starts to fail in the vapor phase and more detailed modeling becomes necessary. Since on these small scales the boundary and interface conditions are very important for the overall performance of the device, we choose the approach in which we start with understanding the essential physical phenomena at a molecular level. In this paper a detailed particle-based model is derived for these interactions: local interactions between the three phases are studied by molecular dynamics (MD) simulations in a detailed way. In this way physically and thermodynamically correct interface and boundary conditions (e.g. slip velocities and temperature jumps) are ensured. Finally, the enhanced heat transfer in the evaporative zone (Argon on a Calcium surface) is simulated by our molecular model and is compared to the results obtained by the continuum microregion model developed by P. Stephan et al. (Int. J. Heat Mass Transfer, 35, pp. 383–391, 1992).
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Xin, Chengyun, Jianhua Wang, Jianheng Xie, and Yuee Song. "Modeling and Numerical Simulations of Vapor-Liquid Flow and Heat Transfer Within Microchannel Heat Sinks." In ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/mnhmt2012-75239.

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Microchannel heat sinks have demonstrated the ability to dissipate large amounts of heat flux. This ability can be strongly enhanced by phase change of a liquid coolant. This paper numerically simulates the processes of liquid coolant flow, heat absorption and phase change within a microchannel, which is heated at one side by given heat fluxes. The two-phase flow model widely used in the investigations on heat and mass transfer within porous media is firstly introduced into microchannnel heat sinks by this paper. Experiential equations of the heat transfer coefficients in single phase and boiling region within microchannels are employed to calculate the convective heat exchange between solid wall and flowing fluid by an iterative process. The numerical results of pressure and temperature distributions obtained at different conditions are exhibited and analyzed. The results indicated that the trends predicted by this approach agree well with the previous references. Therefore the modeling is validated in some sense. At the same time, two phenomena, countercurrent flow in two-phase region and special pressure variations near the transition point, are exhibited.
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Reports on the topic "Microchannel Heat Transfer"

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Lin, C. X. Heat Transfer Enhancement Through Self-Sustained Oscillating Flow in Microchannels. Fort Belvoir, VA: Defense Technical Information Center, May 2006. http://dx.doi.org/10.21236/ada460536.

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