Relevant bibliographies by topics / Microchip cooling

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'Microchip cooling'

Author: Grafiati
Published: 3 June 2025
Last updated: 13 July 2025

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Journal articles on the topic "Microchip cooling"

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Putra, Nandy, Wayan Nata Septiadi, Ranggi Sahmura, and Cahya Tri Anggara. "Application of Al2O3 Nanofluid on Sintered Copper-Powder Vapor Chamber for Electronic Cooling." Advanced Materials Research 789 (September 2013): 423–28. http://dx.doi.org/10.4028/www.scientific.net/amr.789.423.

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The development of electronic devices pushes manufacturers to create smaller microchips with higher performance than ever before. Microchip with higher working load produces more heat. This leads to the need of cooling system that able to dissipate high heat flux. Vapor chamber is one of highly effective heat spreading device. Its ability to dissipate high heat flux density in limited space made it potential for electronic cooling application, like Central Processing Unit (CPU) cooling system. The purpose of this paper is to study the application of Al2O3Nanofluid as working fluid for vapor chamber. Vapor chamber performance was measured in real CPU working condition. Al2O3Nanofluid with concentration of 0.1%, 0.3%, 0.5%, 1%, 2% and 3% as working fluid of the vapor chamber were tested and compared with its base fluid, water. Al2O3nanofluid shows better thermal performance than its base fluid due to the interaction of particle enhancing the thermal conductivity. The result showed that the effect of working fluid is significant to the performance of vapor chamber at high heat load, and the application of Al2O3nanofluid as working fluid would enhance thermal performance of vapor chamber, compared to other conventional working fluid being used before.
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Chen, Zhi-Gang, and Wei-Di Liu. "Thermoelectric coolers: Infinite potentials for finite localized microchip cooling." Journal of Materials Science & Technology 121 (September 2022): 256–62. http://dx.doi.org/10.1016/j.jmst.2021.12.069.

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Gandi, Venkata Ramana Murthy. "Design Optimization of Heat Transfer in Microchip Cooling System." International Journal for Research in Applied Science and Engineering Technology 7, no. 11 (2019): 614–20. http://dx.doi.org/10.22214/ijraset.2019.11098.

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Wiji Nurastuti and Kumara Ari Yuana. "MODELING MATEMATIS DAN SIMULASI DROPLET UNTUK PENDINGINAN ALAT-ALAT TEKNOLOGI INFORMASI DAN KOMPUTER DENGAN METODE LATTICE-BOLTZMANN." Jurnal Informatika Teknologi dan Sains 3, no. 3 (2021): 389–93. http://dx.doi.org/10.51401/jinteks.v3i3.1039.

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Abstrak : Kebutuhan inovasi skema pendinginan untuk pemeliharaan perangkat elektronik dengan suhu aman dibawah batas yang telah ditentukan oleh batasan material dan kendala realibilitas yang terkait pada miniaturisasi microchip yang agresif pada komponen elektronik. Pergeseran dari ketergantungan pada sistem berpendingin kipas menjadi ke skema pendinginan yang memanfaatkan pendingin cairan dielektrik menggunakan berbagai skema pendinginan fase tunggal. Perekayasa (engineer) sistem pendingin memusatkan perhatian pada skema pendinginan dua fase, untuk memanfaatkan kedua system pendingin. Sifat yang harus dimiliki perekayasa sistem pendingin ini yaitu konveksi fluida dan panas laten untuk memindahkan jumlah kalor yang jauh lebih besar dari pada skema fase tunggal, sambil mempertahankan suhu perangkat yang lebih rendah. Beberapa skema pendingin cairan dua fase telah direkomendasikan untuk menghilangkan fluks kalor tinggi dari perangkat yang digunakan diaplikasi. Momentum droplet memungkinkan cairan menembus penghalang uap yang dibuat oleh gelembung nukleasi dan secara lebih efektif mengisi kembali permukaan, keduanya sangat bermanfaat untuk pendinginan fluks tinggi. Pada model dan simulasi pengembangan droplet menggunakan metode LBM multi fase, parameter penting yang selalu didapatkan adalah arus semu maksimum (maximum spurious currents) yang menetukan stabilitas komputasi.
 Kata kunci : Modeling Matematis, Simulasi Droplet, Metode Latice-Boltzman
 
 Abstract: The need for innovative cooling schemes for maintaining electronic devices with safe temperatures below predetermined limits by material limitations and reliability constraints associated with aggressive microchip miniaturization of electronic components. Shifting from reliance on fan-cooled systems to cooling schemes that utilize dielectric liquid cooling using a variety of single-phase cooling schemes. The cooling system engineer focuses on two-phase cooling schemes, to take advantage of both cooling systems. Properties that these cooling system engineers must possess are fluid convection and latent heat to transfer a much greater amount of heat than a single-phase scheme, while maintaining a lower device temperature. Several two-phase liquid cooling schemes have been recommended to remove the high heat flux from the apparatus used in the application. The droplet momentum allows the liquid to penetrate the vapor barrier created by the nucleation bubbles and more effectively replenish the surface, both of which are very beneficial for high flux cooling. In droplet development models and simulations using the multi-phase LBM method, an important parameter that is always obtained is the maximum spurious currents which determine the computational stability.
 Keywords: Mathematical Modeling, Droplet Simulation, Latice-Boltzman Method
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SOZONOV, Maxim V., Alexander N. BUSYGIN, Andrey N. BOBYLEV, and Anatolii A. KISLITSYN. "THERMOPHYSICAL MODEL OF A MEMRISTOR-DIODE MICROCHIP." Tyumen State University Herald. Physical and Mathematical Modeling. Oil, Gas, Energy 7, no. 4 (2021): 62–78. http://dx.doi.org/10.21684/2411-7978-2021-7-4-62-78.

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The most popular models of memristor, based on the principle of formation and breakage of conductive filaments in memristive layer, are applied to consideration of a single memristor. However, consideration of a full-fledged microchip with many memristors may be also interesting. In this case, it is very important to determine the thermal mode of work of the device, in particular, to determine if it needs cooling and how the microchip architecture affects on the nature of heat transfer. At the same time, the proposed model should be quite simple, since modeling of conductive filaments in each memristor greatly complicates work with the model and requires large computational resources. In this paper a thermophysical model of the microchip based on a memristor-diode crossbar created at the REC “Nanotechnology” at Tyumen State University is presented. The model takes into account Joule heating and convective heat transfer. A feature of the model is a simplified determination of memristor state by the resistivity value of memristive layer from the data of the current-voltage characteristic of a real memristor sample. Simulation is carried out in the ANSYS software package. Within the framework of the model, self-consistent electrical and thermophysical problems are solved in a non-stationary setting. The temperature fields and graphs of the temperature versus time were obtained for various operating modes. The results obtained are in good agreement with similar data from other studies published in the literature. The model shows itself well in various operating modes, both in modes with memristor state switching process and without it. The presented model can be used at the design stage to take into account the features of the microchip architecture, which can significantly affect the thermal state of microchip operating modes.
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Wong Mian Sheng, Abdulhafid M Elfaghi, and Lukmon Owolabi Afolabi. "Numerical Study on Heat Propagation in Laptop Cooling System." Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 99, no. 1 (2022): 58–65. http://dx.doi.org/10.37934/arfmts.99.1.5865.

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Thermal management of microelectronic devices has become increasingly important to maintain their performance and prolonging the lifespan of the devices. In this study, numerical simulation has been conducted to investigate the heat propagation for high performance microelectronic device of laptop. Two models are constructed and Ansys Fluent is used for the Computational Fluid Dynamics (CFD) simulation, source term is applied at the heat source, heat sink and two different material heat pipes are the main cooling components in the system. The results show that the improved design model is a better design for laptop cooling systems, and the increasing number of air vents, thermal conductivity, and length of heat pipes can effectively cool the high-powered microchip effectively. Transient simulation, considering the wick structure and working fluid in the simulation, is suggested for future work.
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Shi Peng, 史彭, 李金平 Li Jinping, 陈文 Chen Wen, 李隆 Li Long, and 甘安生 Gan Ansheng. "Thermal Effect of Nd∶GdYO4 Cube Microchip Laser With Back Surface Cooling." Chinese Journal of Lasers 36, no. 7 (2009): 1772–76. http://dx.doi.org/10.3788/cjl20093607.1772.

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Schulz, Stephan A., Ulrich Poschinger, Frank Ziesel, and Ferdinand Schmidt-Kaler. "Sideband cooling and coherent dynamics in a microchip multi-segmented ion trap." New Journal of Physics 10, no. 4 (2008): 045007. http://dx.doi.org/10.1088/1367-2630/10/4/045007.

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Zhuang, W. Z., Yi-Fan Chen, K. W. Su, K. F. Huang, and Y. F. Chen. "Performance enhancement of sub-nanosecond diode-pumped passively Q-switched Yb:YAG microchip laser with diamond surface cooling." Optics Express 20, no. 20 (2012): 22602. http://dx.doi.org/10.1364/oe.20.022602.

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Su, Yan. "Mesoscale multi-component energy density transport for natural convective microchip cooling with solid–liquid–gas phase changes." Applied Thermal Engineering 236 (January 2024): 121808. http://dx.doi.org/10.1016/j.applthermaleng.2023.121808.

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Dissertations / Theses on the topic "Microchip cooling"

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Li, Dan Mechanical &amp Manufacturing Engineering Faculty of Engineering UNSW. "The effect of synthetic jet driving parameters on heat transfer in microchips cooling channels." Awarded by:University of New South Wales. Mechanical & Manufacturing Engineering, 2009. http://handle.unsw.edu.au/1959.4/43737.

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With the growing power dissipation and more densely packed circuits, the issue of efficient thermal management has become crucial. The safe and reliable operations of microchips have a requirement on a junction temperature below 85??C. In order to meet the heat dissipation requirement at the level of 1 MW m???? of the next generation microchips, a new cooling approach has been proposed by combining the merits from forced convection in the microchannel and the synthetic jet impingements. A parametric study has been carried out on the operating conditions on the synthetic jet actuator, these parameters including: the frequency of the diaphragm in the actuator, the jet outlet velocity both in magnitude and the wave shape as well as the pressure difference between the channel two ends. It was found that these parameters have combined effect on the flow structure as well as the heat transfer rate in the microchannel. When the average jet velocity was at 2.36 ms??¹(Rej= 130), with a fixed pressure difference at 750 Pa, the maximum temperature in the silicon wafer has been reduced to about 343 K at both 560 and 1120 Hz, which was 2 K lower than when 280 Hz was used. However when the average jet velocity was increased by 50 %, the optimal heat transfer then occurred at 1120 Hz, the maximum temperature was reduced to 337 K, with 4 K and 5K difference of 280 and 560 Hz, respectively. Furthermore when the average jet velocity was doubled from Rej= 130, the frequency at 280 Hz achieved the lowest maximum temperature in the wafer at 336 K that was 5 K and 3 K lower than 560 Hz and 1120 Hz. The flow temperature in the actuator is an important factor which affects the heat transfer in the microchannel. In order to lower the cavity temperature and avoid the ingestion of the already mixed flow, the time portion of the ingestion and ejection phases has been altered, by reducing the ejection time and increasing the ingestion time. However this approach did not show any significant effect in the heat transfer process or decreasing the flow temperature in the cavity. However in a later study by increasing the pressure difference across the channel, the flow temperature in the cavity has been substantially reduced and the heat transfer in the channel changed significantly according to the flow structure. It was found that the high pressure in the channel could deliver the vortical structure to the hotter part of the wafer thus decreasing the maximum temperature in the silicon effectively, especially when high jet velocity was used. When high jet velocity has been used, irregular variation of the flow was found The unrepeatable feature of the flow is related to the frequency, jet velocity as well as the channel pressure difference.
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Verde, Maurizio. "Simulation of optical dipole trapping of cold CO molecules." Doctoral thesis, 2020. http://hdl.handle.net/2158/1191549.

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Ultracold matter offers a unique capability to reach the best high-precision spectroscopy measurements and leads to exciting perspectives in many different areas of science and technology. Molecules, thanks to their complex spectra, couple with a broader range of photons compared to atoms, so they are extremely attractive for fundamental science or to design new quantum technologies. However, to date, only a few molecular species have been brought to temperatures of the order of the microkelvin. This was done by laser cooling, a process that has been demonstrated only for species featuring an unpaired electron that does not participate to the chemical bond. A different approach, which is indifferent to the molecule electronic structure and thus potentially universal, is sympathetic cooling, where neutral molecules are cooled in a bath of ultracold atoms. However, inelastic collisions between molecules and the coolant is a major obstacle that has hindered the advances of this method thus far. Trapping the molecules in their absolute ground state would circumvent this problem or at least greatly simplify it. In this thesis we simulate the feasibility of an experiment in which metastable CO molecules are first slowed down to a few m/s with a microstructured Stark decelerator, then they are stopped by a strong DC electrical barrier and finally they are transferred irreversibly to their absolute ground state and captured in an optical trap. Unfortunately, the results of the simulations indicate that the total number of molecules that can be accumulated in the optical trap is rather low, far behind the observation threshold. Therefore, we concluded that other approaches to produce ultracold molecules must to be searched.
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Godley, Richard Franklin. "Investigation of Cryo-Cooled Microcoils for MRI." Thesis, 2011. http://hdl.handle.net/1969.1/ETD-TAMU-2011-08-9873.

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When increasing magnetic resonance imaging (MRI) resolution into the micron scale, image signal-to-noise ratio (SNR) can be maintained by using small radiofrequency (RF) coils in close proximity to the sample being imaged. Micro-scale RF coils (microcoils) can be easily fabricated on chip and placed adjacent to a sample under test. However, the high series resistance of microcoils limits the SNR due to the thermal noise generated in the copper. Cryo-cooling is a potential technique to reduce thermal noise in microcoils, thereby recovering SNR. In this research, copper microcoils of two different geometries have been cryo-cooled using liquid nitrogen. Quality-factor (Q) measurements have been taken to quantify the reduction in resistance due to cryo-cooling. Image SNR has been compared between identical coils at room temperature and liquid nitrogen temperature. The relationship between the drop in series resistance and the increase in image SNR has been analyzed, and these measurements compared to theory. While cryo-cooling can bring about dramatic increases in SNR, the extremely low temperature of liquid nitrogen is incompatible with living tissue. In general, the useful imaging region of a coil is approximately as deep as the coil diameter, thus cryo-cooling of coils has been limited in the past to larger coils, such that the thickness of a conventional cryostat does not put the sample outside of the optimal imaging region. This research utilizes a scheme of microfluidic cooling (developed in the Texas A&M NanoBio Systems Lab), which greatly reduces the volume of liquid nitrogen required to cryo-cool the coil. Along with a small gas phase nitrogen gap, this eliminates the need for a bulky cryostat. This thesis includes a review of the existing literature on cryo-cooled coils for MRI, as well as a review of planar pair coils and spiral microcoils in MR applications. Our methods of fabricating and testing these coils are described, and the results explained and analyzed. An image SNR improvement factor of 1.47 was achieved after cryo-cooling of a single planar pair coil, and an improvement factor of 4 was achieved with spiral microcoils.
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Book chapters on the topic "Microchip cooling"

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Delendik, Kirill, Tatiana Baranova, Andrei Chorny, Natalia Kolyago, Olga Voitik, and Yulia Zhukova. "Improving the Cooling Efficiency of Microchips by Vapor Chamber." In Infosys Science Foundation Series. Springer Nature Singapore, 2025. https://doi.org/10.1007/978-981-97-8152-2_4.

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Conference papers on the topic "Microchip cooling"

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Ongkodjojo, A., R. C. Roberts, A. Abramson, and N. C. Tien. "HIGHLY EFFICIENT IONIC WIND-BASED COOLING MICROFABRICATED DEVICE FOR MICROCHIP COOLING APPLICATIONS." In 2010 Solid-State, Actuators, and Microsystems Workshop. Transducer Research Foundation, 2010. http://dx.doi.org/10.31438/trf.hh2010.122.

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Li, Bodong, Guodong Zhan, Michael Okot, and Vahid Dokhani. "Analysis of Circulating Pressure and Temperature using Drilling Microchips." In International Petroleum Technology Conference. IPTC, 2023. http://dx.doi.org/10.2523/iptc-22805-ms.

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Abstract Accurate knowledge of circulating pressure and temperature is essential for making critical decisions while drilling operation. Through implementation of miniaturized semiconductor technology, we obtained near real-time dynamic pressure and temperature profile of the wellbore, making previously simulated critical operational data such as equivalent circulation density (ECD) and wellbore thermal distribution now measurable using drilling microchip. The application of drilling microchips to collect distributed pressure and temperature data while drilling is investigated, where each microchip measures both pressure and temperature simultaneously. This study also presents a revised method to calibrate measurements of drilling microchip with depth. Four field trials were attempted in a slightly inclined well using water-based or oil-based muds, where 10 drilling microchips were deployed in each trial. The recovered data from the drilling microchips are first downloaded and compiled. An in-house software is developed to process and convert time-scale of each drilling microchip to depth considering slippage of drilling microchips in drill string and annulus. An iterative algorithm is designed to calibrate the predicted arrival time with the actual arrival time of each tracer, which ultimately yields the true velocity of tracers in flow conduits. The maximum measured pressure is used as an indicator to locate each tracer at the bottom hole. It is realized that a plateau of pressure versus time can signify a trapped tracer in the flow path if the pump rate was maintained constant. The results of field trials show that some of the tracers were trapped for few minutes in the lower section of annular space or before the bit nozzle. The results of temperature profiles conclude a unique pattern for almost all of the deployed drilling microchips. However, the results of pressure profiles can be classified in two different groups as drilling microchips could have moved in different batches while pumping. The calculated temperature gradients show a heating zone near the bottom hole and continuous cooling of drilling fluid as tracers move toward the surface. The average pressure gradient is in the range of 0.52 – 0.61 psi/ft among different trials. It is shown that the velocity of tracers in each interval strongly depends on the flow regime. To our best knowledge, a combined measurement of circulating temperature and pressure using drilling microchips for the first-time is successfully conducted in these field trials. The results can be used for calculation of ECD and temperature profiles, which provide near real-time downhole data for monitoring and diagnostic applications. The measured pressure data also provide new insights about tracking of drilling microchips in the wellbore.
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Shi, Peng, Jinping Li, Wen Chen, Long Li, and Ansheng Gan. "Semianalytical Thermal Analysis on Circular Microchip Laser with Back Cooling." In 2009 Symposium on Photonics and Optoelectronics. IEEE eXpress Conference Publishing, 2009. http://dx.doi.org/10.1109/sopo.2009.5230309.

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Li, Yuhui, Fen Wang, Yanyan Lu, and Hao Wang. "The Directional Freezing Effects on Biological Cells in a Microfluidic Cell Culture System." In ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASMEDC, 2009. http://dx.doi.org/10.1115/mnhmt2009-18301.

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Cryotherapy is a prospective also green method for malignant tumor treatment. At low temperature, the cell viability relates with the cooling rate, temperature threshold, freezing interface as well as ice formation. In this paper a series of directional freezing processes and cell responses in a culture microchip were experimentally investigated. The temperature in the microchip was manipulated by a thermoelectric cooler. The surviving cells, necrotic and apoptotic cells under different cryotreatment (duration of the freezing process, freeze-thaw cycle, post-culture et al) were stained and distinguished by PI and FITC-Annexin V. The locations of the ice front and cell death boundary were observed and recorded through an inverted microscopy. By controlling the cooling process in a microfluidic channel, it is possible to recreate a sketch of biological effect during the process of simulated cryosurgery.
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Erbas, Nurhak, and Oktay Baysal. "Micron-Level Actuators for Thermal Management of Microelectronic Devices." In ASME 2007 5th International Conference on Nanochannels, Microchannels, and Minichannels. ASMEDC, 2007. http://dx.doi.org/10.1115/icnmm2007-30098.

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Failure rates of electronic equipment depend on the operating temperature. Although demand for more effective cooling of electronic devices has increased in the last decades because of the microminiaturization in device sizes accompanied by higher power dissipation levels, there is still a challenge for engineers to attain improved reliability of thermal management for intermediate and low-heat-flux systems. In the present study, an innovative alternative method is proposed and a computational parametric study has been conducted. A single microchip is placed in a two-dimensional channel. Different synthetic jet configurations are designed as actuators in order to investigate their effectiveness for thermal management. The effect is that the actuator enhances mixing by imparting momentum to the channel flow thus manipulating the temperature field in a positive manner. The best control is achieved when the actuator is placed midway of the chip length and increasing the throat height. Also, using nozzle-like throat geometry increases the heat transfer rate from the microchip surface. Doubling the number of the actuators, optimally placing them, and phasing their membrane oscillations all improve the cooling.
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Schwarzkopf, J., T. Cader, K. Okamoto, B. Q. Li, and B. Ramaprian. "Effect of Spray Angle in Spray Cooling Thermal Management of Electronics." In ASME 2004 Heat Transfer/Fluids Engineering Summer Conference. ASMEDC, 2004. http://dx.doi.org/10.1115/ht-fed2004-56414.

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The paper presents an experimental and numerical study of the effect of spray angle on spray cooling when applied in the thermal management of electronics. A thermal test chip provided the heated target, and was cooled by a single pressure swirl atomizer. A perfluorocarbon (PF5060) was employed as the coolant. The coolant was subcooled to a fixed level of 26° C, and was sprayed directly onto the heated target at a fixed flow rate of 22 ml/min. The spray angle was varied between 0 and 60 degrees, and the outlet of the atomizer was located at a fixed radius of 1.4 cm from the heated target. The model of Mudawar and Estes (1996) was also modified to account for the effect of spray angle, then used to assist in interpretation of the experimental data. In an effort to estimate the heat transfer characteristics, an inverse heat transfer algorithm is developed. A direct finite element model is applied with estimated heat flux distributions to simulate the thermal field in the test microchip for various cooling conditions. Experimental results are presented for a number of cases and compared with the model’s predictions. The experimental data and model both showed that cooling capability dropped off when spray angle exceeded 50 degrees.
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Wyss, Chr, W. Lüthy, H. P. Weber та ін. "Performance of a diode-pumped 1.4 W Tm:GdVO4 microchip laser at 1.9μm." У The European Conference on Lasers and Electro-Optics. Optica Publishing Group, 1998. http://dx.doi.org/10.1364/cleo_europe.1998.cmc3.

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GdVO4 as a host for Thulium has several advantages for diode pumping in comparison with YAG. The absorption cross section of Thulium in GdVO4 is considerably stronger and broader than in YAG and the spectrum is shifted closer to the emission wavelength of commercially available AlGaAs laser diodes. The broad emission spectrum (1.9 μm - 2.1 μm) allows for tuning the laser wavelength. Furthermore, the large thermal conductivity of GdVO4 (10 W/mK) is very favourable for efficient cooling of the crystal.
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Al-Rjoub, Marwan F., Ajit K. Roy, Sabyasachi Ganguli, and Rupak K. Banerjee. "Enhanced Electro-Osmotic Flow Pump for Micro-Scale Heat Exchangers." In ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/mnhmt2012-75026.

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Non-uniform heat flux generated by microchips can create “hot spots” in localized areas on the microchip surface. This research presents an improved design of an active cooling electro-osmotic flow (EOF) based micro-pump for hot spots thermal management. The design of the micro-pump was simpler and more practical for the application compared to designs presented in literature. Most micro-channel heat sink devices presented in literature were silicon based. Though silicon has better thermal conductivity when compared to polymers used in micro-devices fabrication, processes of silicon fabrication are complicated and time consuming. Also, most micro-channel fabrication processes use silicon etching which leads to rough walls within the micro-channel. An improved design, which uses a combination of silicon and Polydimethylsiloxane (PDMS), is being developed and tested. The main idea of this design is to utilize the favorable thermal properties of silicon while achieving both smoother charged surfaces and ease of fabrication of PDMS material. The EOF micro-pump was tested for four cooling fluid namely, DI water, distilled water, borax buffer, and Al2O3 nano-particles suspended in water solution. A maximum flow rate of 31.2 μL/min was achieved using distilled water at 500 V of EOF voltage. Such micro-pump with this flow rate range can be implemented in a closed loop heat rejection system for hot spot thermal management. Moreover, it can be used in Lap-on-chip and uTAS application for sample transport.
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Lee, Ann, Victoria Timchenko, Guan H. Yeoh, and John A. Reizes. "Forced Convection in Micro-Channel With Synthetic Jet: Effect of Operating Frequency." In ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2012 Heat Transfer Summer Conference and the ASME 2012 Fluids Engineering Division Summer Meeting. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/icnmm2012-73020.

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A three-dimensional computational model has been developed to investigate the cooling effect on the microchip of synthetic jet interacting with a cross-flow in a micro-channel. The conjugate problem is solved by determining the temperature distributions in a heated solid and the fluid flowing in the micro-channel which cools it, thereby simulating the application to a microchip. A parametric study was performed on a fixed geometry by using 1 MWm−2 heat flux at the surface of the silicon wafer to investigate the effect of frequency of the jet at a constant Reynolds number, that is the amplitude is reduced in proportion to the increase in frequency. The hot region in the silicon wafer resulting from the use fluid flowing undisturbed in a micro-channel, are removed when the synthetic jet is switched on thereby significantly lowering the maximum temperature in the wafer. Contrary to the two-dimensional case, there is little difference in the cooling performance when the jet was driven at different frequencies in three-dimensional configuration. This is illustrated by the fact in the end of the simulations at a jet Reynolds number of 40, the maximum temperature in the substrate was 0.5 K lower at 1120 Hz than at 560 Hz and 1 K lower than at 280 Hz.
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Ongkodjojo, Andojo, Alexis R. Abramson, and Norman C. Tien. "Design, Modeling, and Optimization for Highly Efficient Ionic Wind-Based Cooling Microfabricated Devices." In ASME 2010 International Mechanical Engineering Congress and Exposition. ASMEDC, 2010. http://dx.doi.org/10.1115/imece2010-40427.

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The purpose of this work is to re-design, model and optimize a single microfabricated ionic wind pump device [1]. The device could then be employed in a three-dimensional array for use in larger-scale microchip cooling and enhanced thermal spreading applications. The innovative microfabricated air-cooling technology employs an electrohydrodynamic corona discharge (i.e. ionic wind pump) for efficient heat removal from electronic components. Our single ionic wind pump element consists of two parallel collecting electrodes between which a single emitting tip is positioned. The collector electrodes are patterned with a grid structure, which enhances the overall heat transfer coefficient and facilitates a batch and IC compatible process. Various design configurations are explored and modeled computationally to investigate their influence on the cooling phenomenon. In particular, COMSOL Multiphysics™ is employed to computationally explore the effects of collector-emitter configuration on the electrohydrodynamic phenomenon, the flow field and resulting cooling effects. Using both computational and experimental results, we estimate that a two-dimensional array of microfabricated ionic wind pumps covering approximately 2″ square should be able to dissipate greater than 2 W of heat, using about 1/5 the power input as a conventional fan.
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