Relevant bibliographies by topics / Microelectromechanical systems. Microelectromechanical systems Microelectronic packaging

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Microelectromechanical systems. Microelectromechanical systems Microelectronic packaging'

Author: Grafiati
Published: 4 June 2021
Last updated: 12 February 2022

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Journal articles on the topic "Microelectromechanical systems. Microelectromechanical systems Microelectronic packaging"

1

Pinto, Raquel, André Cardoso, Sara Ribeiro, Carlos Brandão, João Gaspar, Rizwan Gill, Helder Fonseca, and Margaret Costa. "Application of SU-8 photoresist as a multi-functional structural dielectric layer in FOWLP." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (January 1, 2017): 1–19. http://dx.doi.org/10.4071/2017dpc-tp2_presentation3.

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Microelectromechanical Systems (MEMS) are a fast growing technology for sensor and actuator miniaturization finding more and more commercial opportunities by having an important role in the field of Internet of Things (IoT). On the same note, Fan-out Wafer Level Packaging (FOWLP), namely WLFO technology of NANIUM, which is based on Infineon/ Intel eWLB technology, is also finding further applications, not only due to its high performance, low cost, high flexibility, but also due to its versatility to allow the integration of different types of components in the same small form-factor package. Despite its great potential it is still off limits to the more sensitive components as micro-mechanical devices and some type of sensors, which are vulnerable to temperature and pressure. In the interest of increasing FOWLP versatility and enabling the integration of MEMS, new methods of assembling and processing are continuously searched for. Dielectrics currently used for redistribution layer construction need to be cured at temperatures above 200°C, making it one of the major boundary for low temperature processing. In addition, in order to accomplish a wide range of dielectric thicknesses in the same package it is often necessary to stack very different types of dielectrics with impact on bill of materials complexity and cost. In this work, done in cooperation with the International Iberian Nanotechnology Laboratory (INL), we describe the implementation of commercially available SU-8 photoresist as a structural material in FOWLP, allowing lower processing temperature and reduced internal package stress, thus enabling the integration of components such as MEMS/MOEMS, magneto-resistive devices and micro-batteries. While SU-8 photoresist was first designed for the microelectronics industry, it is currently highly used in the fabrication of microfluidics as well as microelectromechanical systems (MEMS) and BIO-MEMS due to its high biocompatibility and wide range of available thicknesses in the same product family. Its good thermal and chemical resistance and also mechanical and rheological properties, make it suitable to be used as a structural material, and moreover it cures at 150°C, which is key for the applications targeted. Unprecedentedly, SU-8 photoresist is tested in this work as a structural dielectric for the redistribution layers on 300mm fan-out wafers. Main concerns during the evaluation of the new WLFO dielectric focused on processability quality; adhesion to multi-material substrate and metals (copper, aluminium, gold, ¦); between layers of very different thicknesses; and overall reliability. During preliminary runs, processability on 300 mm fan-out wafers was evaluated by testing different coating and soft bake conditions, exposure settings, post-exposure parameters, up to developing setup. The outputs are not only on process conditions and results but also on WLFO design rules. For the first time, a set of conditions has been defined that allows processing SU-8 on WLFO, with thickness values ranging from 1 um to 150 um. The introduction of SU-8 in WLFO is a breakthrough in this fast-growing advanced packaging technology platform as it opens vast opportunities for sensor integration in WLP technology.
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Butler, Jeffrey T., Victor M. Bright, and John H. Comtois. "Multichip module packaging of microelectromechanical systems." Sensors and Actuators A: Physical 70, no. 1-2 (October 1998): 15–22. http://dx.doi.org/10.1016/s0924-4247(98)00107-1.

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Lee, Y. C., B. A. Parviz, J. A. Chiou, and S. Chen. "Packaging for microelectromechanical and nanoelectromechanical systems." IEEE Transactions on Advanced Packaging 26, no. 3 (August 2003): 217–26. http://dx.doi.org/10.1109/tadvp.2003.817973.

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Chen, L. H., and S. Jin. "Packaging of nanostructured microelectromechanical systems microtriode devices." Journal of Electronic Materials 32, no. 12 (December 2003): 1360–65. http://dx.doi.org/10.1007/s11664-003-0101-7.

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Kuntzman, Michael L., Karen D. Kirk, Caesar T. Garcia, Guclu A. Onaran, and Neal A. Hall. "Commercial packaging of an optical microelectromechanical systems microphone." Journal of the Acoustical Society of America 128, no. 4 (October 2010): 2444. http://dx.doi.org/10.1121/1.3508741.

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Su, Bingzhi, Y. C. Lee, and Martin L. Dunn. "Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities." Journal of Electronic Packaging 125, no. 3 (September 1, 2003): 369–77. http://dx.doi.org/10.1115/1.1602702.

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We study cracking from the interface of an In60-Pb40 solder joint on a brittle GaAs die when the joint is subjected to a uniform temperature change. Our primary objective is to apply and validate a fracture initiation criterion based on critical values of the stress intensities that arise from an analysis of the asymptotic elastic stress fields at the interface corner. In some regards the approach is similar to interface fracture mechanics; however, it differs in that it is based on a singular field other than that for a crack. We begin by determining the shape that the solder bump will assume after reflow when constrained by a fixed diameter wetting pad on the GaAs. To simplify the interpretation of the results, we focus on a class of solder bumps of various sizes, but with a self-similar shape. The approach, though, can be applied to different size and shape solder bumps. We then compute the asymptotic interface corner fields when the system is subjected to a uniform temperature change. The asymptotic structure (radial and angular dependence) of the elastic fields is computed analytically, and the corresponding stress intensities that describe the scaling of the elastic fields with geometry and loading are computed by axisymmetric finite element analysis. In order to assess the validity of fracture correlation using critical stress intensities, we designed and fabricated a series of test structures consisting of In60-Pb40 solder bumps on a GaAs chip. The test structures were subjected to uniform temperature drops from room temperature to induce cracking at the interface corner. From the tests we determined the relationship between the solder bump size and the temperature change at which cracking occurred. Not unexpectedly, smaller bumps required larger temperature changes to induce cracking. The observed scaling between solder bump size and temperature change is well described by the critical stress intensity failure criterion based on only a single parameter, the critical value of the mode 1 stress intensity, K1crn. Interestingly, this is because over a significant region, the mode 2 and constant terms in the asymptotic expansion cancel each other. This failure criterion provides the necessary machinery to construct failure maps in terms of geometry and thermomechanical loading. We conclude by describing how to apply the approach in more general and more practical settings that are possibly applicable to a wide range of problems in microelectronics, optoelectronics, and microelectromechanical systems packaging.
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Tadigadapa, Srinivas A., and Nader Najafi. "Developments in Microelectromechanical Systems (MEMS): A Manufacturing Perspective." Journal of Manufacturing Science and Engineering 125, no. 4 (November 1, 2003): 816–23. http://dx.doi.org/10.1115/1.1617286.

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This paper presents a discussion of some of the major issues that need to be considered for the successful commercialization of MEMS products. The diversity of MEMS devices and historical reasons have led to scattered developments in the MEMS manufacturing infrastructure. A good manufacturing strategy must include the complete device plan including package as part of the design and process development of the device. In spite of rapid advances in the field of MEMS there are daunting challenges that lie in the areas of MEMS packaging, and reliability testing. CAD tools for MEMS are starting to get more mature but are still limited in their overall performance. MEMS manufacturing is currently at a fragile state of evolution. In spite of all the wonderful possibilities, very few MEMS devices have been commercialized. In our opinion, the magnitude of the difficulty of fabricating MEMS devices at the manufacturing level is highly underestimated by both the current and emerging MEMS communities. A synopsis of MEMS manufacturing issues is presented here.
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Ortigoza-Diaz, Jessica, Kee Scholten, Christopher Larson, Angelica Cobo, Trevor Hudson, James Yoo, Alex Baldwin, Ahuva Weltman Hirschberg, and Ellis Meng. "Techniques and Considerations in the Microfabrication of Parylene C Microelectromechanical Systems." Micromachines 9, no. 9 (August 22, 2018): 422. http://dx.doi.org/10.3390/mi9090422.

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Parylene C is a promising material for constructing flexible, biocompatible and corrosion-resistant microelectromechanical systems (MEMS) devices. Historically, Parylene C has been employed as an encapsulation material for medical implants, such as stents and pacemakers, due to its strong barrier properties and biocompatibility. In the past few decades, the adaptation of planar microfabrication processes to thin film Parylene C has encouraged its use as an insulator, structural and substrate material for MEMS and other microelectronic devices. However, Parylene C presents unique challenges during microfabrication and during use with liquids, especially for flexible, thin film electronic devices. In particular, the flexibility and low thermal budget of Parylene C require modification of the fabrication techniques inherited from silicon MEMS, and poor adhesion at Parylene-Parylene and Parylene-metal interfaces causes device failure under prolonged use in wet environments. Here, we discuss in detail the promises and challenges inherent to Parylene C and present our experience in developing thin-film Parylene MEMS devices.
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Jin, Sungho. "Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging." Journal of Electronic Materials 32, no. 12 (December 2003): 1366–70. http://dx.doi.org/10.1007/s11664-003-0102-6.

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Polla, D. L., and L. F. Francis. "Ferroelectric Thin Films in Micro-electromechanical Systems Applications." MRS Bulletin 21, no. 7 (July 1996): 59–65. http://dx.doi.org/10.1557/s0883769400035934.

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Ferroelectric ceramic thin films fit naturally into the burgeoning field of microelectromechanical systems (MEMS). Microelectromechanical systems combine traditional Si integrated-circuit (IC) electronics with micromechanical sensing and actuating components. The term MEMS has become synonymous with many types of microfabricated devices such as accelerometers, infrared detectors, flow meters, pumps, motors, and mechanical components. These devices have lateral dimensions in the range of 10 μm–10 mm. The ultimate goal of MEMS is a self-contained system of interrelated sensing and actuating devices together with signal processing and control electronics on a common substrate, most often Si. Since fabrication involves methods common to the IC industry, MEMS can be mass-produced. Commercial applications for MEMS already span biomedical (e.g., blood-pressure sensors), manufacturing (e.g., microflow controllers), information processing (e.g., displays), and automotive (e.g., accelerometers) industries. More applications are projected in consumer electronics, manufacturing control, communications, and aerospace. Materials for MEMS include traditional microelectronic materials (e.g., Si, SiO2, Si3N4, polyimide, Pt, Al) as well as nontraditional ones (e.g., ferroelectric ceramics, shapememory alloys, chemical-sensing materials). The superior piezoelectric and pyroelectric properties of ferroelectric ceramics make them ideal materials for microactuators and microsensors.
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Dissertations / Theses on the topic "Microelectromechanical systems. Microelectromechanical systems Microelectronic packaging"

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Ma, Wei. "Low temperature metal-based micro fabrication and packaging technology /." View abstract or full-text, 2005. http://library.ust.hk/cgi/db/thesis.pl?MECH%202005%20MA.

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Ok, Seong Joon. "High density, high aspect ratio through-wafer electrical interconnect vias for MEMS packaging." Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/18227.

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Willis, Oral R. "Characterizing fluoropolymeric materials for microelectronics and MEMS packaging." Diss., Online access via UMI:, 2007.

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Kohl, Michael. "An experimental investigation of microchannel flow with internal pressure measurements." Diss., Available online, Georgia Institute of Technology, 2004:, 2004. http://etd.gatech.edu/theses/available/etd-06072004-131239/unrestricted/kohl%5Fmichael%5F200405%5Fphd.pdf.

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Deshpande, Anjali W. "Study and characterization of plastic encapsulated packages for MEMS." Link to electronic thesis, 2005. http://www.wpi.edu/Pubs/ETD/Available/etd-01145-144711/.

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Thesis (M.S.)--Worcester Polytechnic Institute.
Keywords: finite difference methods; OEH methodology; packaging; plastic encapsulation; Fick's second law of diffusion; MEMS. Includes bibliographical references (p. 144-161).
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Neysmith, Jordan M. "A modular, direct chip attach, wafer level MEMS package : architecture and processing." Thesis, Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/17559.

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Lo, Chi Chuen. "Numerical prediction and experimental validation of flip chip solder joint geometry for MEMS applications /." View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?MECH%202008%20LO.

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Alsaleem, Fadi M. "An investigation into the effect of the PCB motion on the dynamic response of MEMS devices under mechanical shock loads." Diss., Online access via UMI:, 2007.

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Fritz, Nathan Tyler. "Materials, design and processing of air encapsulated MEMS packaging." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/43751.

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Air-gap structures are of particular interest for packaging of microelectromechanical systems (MEMS). In this work, an overcoat material is used to cover a sacrificial polymer, which protects the MEMS device during packaging. Once the overcoat is in place, the sacrificial polymer is thermally decomposed freeing the MEMS structure while the overcoat dielectric provides mechanical protection from the environment. An epoxy POSS dielectric was used as a high-selectivity etch mask for the PPC and a rigid overcoat for the structure leading to the process improvements. The packaging structures can be designed for a range of MEMS device sizes and operating environments. However, the air-cavity structures need additional rigidity to withstand chip-level packaging conditions. Metalized air cavity packages were molded under traditional lead frame molding pressures and tested for mechanical integrity. The experimental molding tests and mechanical models were used to establish processing conditions and physical designs for the cavities as a function of cavity size. A semi-hermetic package was created using an in-situ sacrificial decomposition/epoxy cure molding step for creating large cavity chip packages. Through the optimization of the air cavity, new materials and processes were tested for general microfabrication. The epoxy POSS dielectric provides a resilient, strong inorganic/organic hybrid dielectric for use in microfabrication and packaging applications. Polycarbonates can be used for low cost temporary adhesives in wafer-wafer bonding. An improved electroless deposition process for silver and copper was developed. The Sn/Pd activation was replaced by a cost efficient Sn/Ag catalyst. The process was shown to be able to deposit adherent copper on smooth POSS and silicon dioxide surfaces. Electroless copper was demonstrated on untreated silicon oxide wafers for TSV sidewall deposition.
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Deshpande, Anjali W. "Study and characetrization of plastic encapsulated packages for MEMS." Digital WPI, 2005. https://digitalcommons.wpi.edu/etd-theses/100.

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Technological advancement has thrust MEMS design and fabrication into the forefront of modern technologies. It has become sufficiently self-sustained to allow mass production. The limiting factor which is stalling commercialization of MEMS is the packaging and device reliability. The challenging issues with MEMS packaging are application specific. The function of the package is to give the MEMS device mechanical support, protection from the environment, and electrical connection to other devices in the system. The current state of the art in MEMS packaging transcends the various packaging techniques available in the integrated circuit (IC) industry. At present the packaging of MEMS includes hermetic ceramic packaging and metal packaging with hermetic seals. For example the ADXL202 accelerometer from the Analog Devices. Study of the packaging methods and costs show that both of these methods of packaging are expensive and not needed for majority of MEMS applications. Due to this the cost of current MEMS packaging is relatively high, as much as 90% of the finished product. Reducing the cost is therefore of the prime concern. This Thesis explores the possibility of an inexpensive plastic package for MEMS sensors like accelerometers, optical MEMS, blood pressure sensors etc. Due to their cost effective techniques, plastic packaging already dominates the IC industry. They cost less, weigh less, and their size is small. However, porous nature of molding materials allows penetration of moisture into the package. The Thesis includes an extensive study of the plastic packaging and characterization of three different plastic package samples. Polymeric materials warp upon absorbing moisture, generating hygroscopic stresses. Hygroscopic stresses in the package add to the thermal stress due to high reflow temperature. Despite this, hygroscopic characteristics of the plastic package have been largely ignored. To facilitate understanding of the moisture absorption, an analytical model is presented in this Thesis. Also, an empirical model presents, in this Thesis, the parameters affecting moisture ingress. This information is important to determine the moisture content at a specific time, which would help in assessing reliability of the package. Moisture absorption is modeled using the single phase absorption theory, which assumes that moisture diffusion occurs freely without any bonding with the resin. This theory is based on the Fick's Law of diffusion, which considers that the driving force of diffusion is the water concentration gradient. A finite difference simulation of one-dimensional moisture diffusion using the Crank-Nicolson implicit formula is presented. Moisture retention causes swelling of compounds which, in turn, leads to warpage. The warpage induces hygroscopic stresses. These stresses can further limit the performance of the MEMS sensors. This Thesis also presents a non invasive methodology to characterize a plastic package. The warpage deformations of the package are measured using Optoelectronic holography (OEH) methodology. The OEH methodology is noninvasive, remote, and provides results in full-field-of-view. Using the quantitative results of OEH measurements of deformations of a plastic package, pressure build up can be calculated and employed to assess the reliability of the package.
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Books on the topic "Microelectromechanical systems. Microelectromechanical systems Microelectronic packaging"

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Hsu, Tai-Ran. Mems and microsystems: Design, manufacture, and packaging. 2nd ed. Hoboken, NJ: John Wiley, 2008.

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MEMS and microsystems: Design and manufacture. Boston: McGraw-Hill, 2002.

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International, TechSearch. MEMS markets: Challenges for packaging and assembly. Austin, Tex: TechSearch International, Inc., 2005.

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MEMS/MOEMS packaging: Concepts, designs, metarials, and processes. New York: McGraw-Hill, 2005.

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Kullberg, Richard C., and Rajeshuni Ramesham. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX: 25-26 January 2010, San Francisco, California, United States. Edited by SPIE (Society). Bellingham, Wash: SPIE, 2010.

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Garcia-Blanco, Sonia. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices X: 24-25 January 2011, San Francisco, California, United States. Edited by SPIE (Society), Institut national d'optique (Canada), DALSA Corporation (Canada), and Smart Equipment Technology (France). Bellingham, Wash: SPIE, 2011.

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Garcia-Blanco, Sonia, and Rajeshuni Ramesham. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices XI: 23-24 January 2012, San Francisco, California, United States. Edited by SPIE (Society), Dyoptyka (Firm), Vuzix Corporation, and Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Bellingham, Wash: SPIE, 2012.

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Hartzell, Allyson L. Reliability, packaging, testing, and characterization of MEMS/MOEMS VII: 21-22 January 2008, San Jose, California, USA. Bellingham, Wash: SPIE, 2008.

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Wei mi na mi qi jian feng zhuang ji shu: Micro-Nanometer Devices Packaging Technology. Beijing: Guo fang gong ye chu ban she, 2012.

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International Microelectronics and Packaging Society., CMP Media, and Society of Photo-optical Instrumentation Engineers., eds. Proceedings: 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California. Washington, DC: IMAPS, 2001.

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Book chapters on the topic "Microelectromechanical systems. Microelectromechanical systems Microelectronic packaging"

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Fuh, Yiin-Kuen, Firas Sammoura, Yingqi Jiang, and Liwei Lin. "Polymeric Microelectromechanical Millimeter Wave Systems." In RF and Microwave Microelectronics Packaging, 43–68. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0984-8_3.

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Lee, Y. C., Ming Kong, and Yadong Zhang. "Microelectromechanical Systems and Packaging." In Materials for Advanced Packaging, 697–731. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-45098-8_16.

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Lee, Y. C. "Microelectromechanical Systems and Packaging." In Materials for Advanced Packaging, 601–27. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-0-387-78219-5_17.

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M. Mansour, Mohamed, and Haruichi Kanaya. "Tunable Zeroth-Order Resonator Based on Ferroelectric Materials." In Multifunctional Ferroelectric Materials. IntechOpen, 2021. http://dx.doi.org/10.5772/intechopen.98475.

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Tunable microwave devices have the benefits of added functionality, smaller form factor, lower cost, and lightweight, and are in great demand for future communications and radar applications as they can extend the operation over a wide dynamic range. Current tunable technologies include several schemes such as ferrites, semiconductors, microelectromechanical systems (MEMS), and ferroelectric thin films. While each technology has its own pros and cons, ferroelectric thin film-based technology has proved itself as the potential candidate for tunable devices due to its simple processes, low power consumption, high power handling, small size, and fast tuning. A tunable Composite Right Left-Handed Zeroth Order Resonator (CRLH ZOR) is introduced in this chapter and it relies mainly on the latest advancement in the ferroelectric materials. It is common that for achieving optimum performance for the resonant structure, this involves the incorporation of an additional tuning by either mechanical means (i.e. with tuning screws) or other coupling mechanisms. The integration between electronic tuning and High-Temperature Superconducting (HTS) components yields a high system performance without degradation of efficiency. This leads not only low-loss microwave components that could be fine-tuned for maximum efficiency but will provide a tunable device over a broadband frequency spectrum as well. The dielectric properties of the ferroelectric thin film, and the thickness of the ferroelectric film, play a fundamental role in the frequency or phase tunability and the overall insertion loss of the circuit. The key advantages of using ferroelectric are the potential for significant size-reduction of the microwave components and systems and the cabibility for integration with microelectronic circuits due to the utilization of thin and thick ferroelectric film technology. In this chapter, ZOR is discussed and the conceptual operation is introduced. The ZOR is designed and simulated by the full-wave analysis software. The response is studied using electromagnetic characteristics with the applied electric field, ferroelectric thickness, and the operating temperature.
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Conference papers on the topic "Microelectromechanical systems. Microelectromechanical systems Microelectronic packaging"

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Stanimirovic, I., and Z. Stanimirovic. "Packaging and reliability issues in microelectromechanical systems." In 2014 IEEE 29th International Conference on Microelectronics (MIEL). IEEE, 2014. http://dx.doi.org/10.1109/miel.2014.6842157.

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Lee, Hyungsuk, and Junghyun Cho. "Development of Conformal PDMS and Parylene Coatings for Microelectronics and MEMS Packaging." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-82955.

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There is a growing demand in the development of small-scale devices in microelectronics and microelectromechanical systems (MEMS). Packaging and reliability of such devices are of great concern as they introduce a number of unique packaging issues that are distinct and different from typical electronic packaging applications. In addition, the packaging or encapsulation materials are often exposed to harsh environments, for which their performance is drastically degraded. Importantly, such devices become lighter and smaller, precluding the use of conventional packaging materials and schemes. Given that, surface protective coatings can provide an innovative solution for some of the aforementioned issues. Polymers have indeed shown such a potential for use either as a standalone coating, or an intermediate layer for the subsequent harder, stiffer coatings. In this study, we explore processes and properties of the three coating systems: i) PDMS, ii) Parylene (para-xylylene), iii) Parylene/PDMS. In particular, parylene coating on PDMS is a focus of this study. The parylene coating having much higher mechanical properties than PDMS provided a way to enhance the surface properties of this PDMS. Proper surface modification of PDMS via oxygen plasma seemed to be essential to generate desirable microstructures of parylene coating. Mechanical properties of such coatings are systematically examined via a nanoindenter. The dynamic nanoindentation is also employed to assess viscoelastic properties, as well as depth-dependent mechanical properties. While characterizing the films using the nanoindentation, the substrate effect influenced the indentation data. In addition, extensive surface characterizations are carried out using atomic force microscope (AFM), scanning electron microscope (SEM), and optical microscopy.
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Furlong, Cosme, Ryszard J. Pryputniewicz, and Jeffrey S. Yokum. "Optimization of Optical Methodology for High-Digital Resolution Quantitative Evaluation of Reliability of Microelectronics and Packaging." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39492.

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Recent technological trends based on miniaturization of mechanical, electromechanical, and photonic devices to the microscopic scale have led to the development of microelectromechanical systems (MEMS). Effective development of MEMS components requires the synergism of advanced design, analysis, and fabrication methodologies, and also of quantitative metrology techniques for characterizing their performance, reliability, and integrity during the electronic packaging cycle. In this paper, we describe optoelectronic techniques for measuring, with sub-micrometer accuracy, shape and changes in states of deformation of MEMS structures. With the described optoelectronic techniques, it is possible to characterize MEMS components using the display and data modes. In the display mode, interferometric information related to shape and deformation is displayed at video frame rates, providing the capability for adjusting and setting experimental conditions. In the data mode, interferometric information related to shape and deformation is recorded as high-spatial and high-digital resolution images, which are further processed to provide quantitative 3D information. Furthermore, the quantitative 3D data are exported to computer-aided design (CAD) environments and utilized for analysis and optimization of MEMS structures. Capabilities of optoelectronic techniques are illustrated with representative applications demonstrating their applicability to provide indispensable quantitative information for the effective development and optimization of MEMS structures.
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Lee, Y. C. "Packaging and Microelectromechanical Systems (MEMS)." In 2007 8th International Conference on Electronic Packaging Technology. IEEE, 2007. http://dx.doi.org/10.1109/icept.2007.4441562.

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Sun, Xiao, Adrian Keating, and Giacinta Parish. "Stress control of porous silicon film for microelectromechanical systems." In 2014 Conference on Optoelectronic and Microelectronic Materials & Devices (COMMAD). IEEE, 2014. http://dx.doi.org/10.1109/commad.2014.7038693.

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Chen, Morgan, Nicole Evers, Chris Kapusta, Joe Iannotti, Anh-Vu Pham, William Kornrumpf, John Maciel, and Nafiz Karabudak. "Development of a Hermetically Sealed Enclosure for MEMS in Chip-on-Flex Modules Using Liquid Crystalline Polymer (LCP)." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73440.

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We present the development of a hermetic shield packaging enclosure for RF microelectromechanical system switches (MEMS) using Liquid Crystal Polymer (LCP). A cavity formed in LCP has been laminated, at low temperature, onto a Si MEMS switch to create a hermetically sealed package. The hermetically sealed enclosure is a stack-up layer of the multi-layer organic chip-on-flex system-on-a-package (SOP). The entire SOP hermetically sealed package has a total insertion loss of ∼0.5 dB at X-band. E595 outgas tests demonstrate that the LCP package is reliable and hermetically protects the MEMS switch.
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7

Wodin-Schwartz, Sarah, Matthew W. Chan, Kirti Ramesh Mansukhani, Albert P. Pisano, and Debbie G. Senesky. "MEMS Sensors for Down-Hole Monitoring of Geothermal Energy Systems." In ASME 2011 5th International Conference on Energy Sustainability. ASMEDC, 2011. http://dx.doi.org/10.1115/es2011-54699.

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This paper reviews the limitations in current down-hole monitoring technologies for geothermal energy systems and introduces microelectromechanical systems (MEMS) sensors as a means of optimizing well performance. The use of continuous, real-time, down-hole monitoring can improve geothermal well efficiencies and increase well life. More specifically, monitoring can aid in obtaining accurate temperature and pressure profiles to allow for optimized well reinjection and energy extraction. A variety of materials used in the fabrication of MEMS sensors have been tested in an experimental geothermal environment (critical-point water) and exposed for up to 100 hours. The results obtained from the exposure testing support the use of harsh environment materials to create a suite of sensors that can be permanently located down-hole. MEMS-based temperature and pressure sensors using a harsh environment materials platform are currently in the design phase for down-hole monitoring. In addition to designing harsh environment sensors that can reliably monitor down-hole conditions, suitable packaging must be considered. One vision is to mount the sensors to the well casings through the use of new bonding technologies.
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Shepherd, Ellen. "Prototyping With SUMMiT™ Technology, Sandia’s Ultra-Planar Multi-Level MEMS Technology." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39258.

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Sandia National Laboratories, a world leader in the development and application of surface micromachining technology, offers its ultra-planar, multi-level SUMMiT™ technology for prototyping devices for microelectromechanical systems (MEMS). By incorporating advanced fabrication processes, such as chemical mechanical polishing and five levels of polysilicon (four mechanical and one ground), in a well-characterized, base-lined technology, the SUMMiT™ (Sandia’s Ultra-planar, Multi-level, MEMS Technology) process offers a virtually limitless range of microelectromechanical systems that can be fabricated for both commercial and military applications [1]. Sandia’s SUMMiT™ process, licensed to industry for volume production, is available from Sandia for agile prototyping through the SAMPLES™ Program. The SAMPLES™ (Sandia’s Agile MEMS Prototyping, Layout tools, Education, and Services) Program, offers participants the opportunity to access state-of-the-art MEMS technology to prototype an idea and produce hardware that can be used to sell a concept. The four components of the SAMPLES™ Program provide: • Education and training on Sandia’s SUMMiT™ designand visualization tools, fabrication process, and reliability issues; • Layout tools for design including visualization and checking of design rules; • Fabrication in the 5-level SUMMiT™ technology; • Post-fabrication services such as release, packaging, reliability characterization, and failure analysis. This paper discusses the SUMMiT™ technology, its capabilities, and the infrastructure for prototyping within the technology through the SAMPLES™ Program.
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Baidya, Bikram, Satyandra K. Gupta, and Tamal Mukherjee. "Feature-Recognition for MEMS Extraction." In ASME 1998 Design Engineering Technical Conferences. American Society of Mechanical Engineers, 1998. http://dx.doi.org/10.1115/detc98/mech-5838.

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Abstract Microelectromechanical systems (MEMS) integrating multi-domain sensors and actuators with conventional microelectronic batch fabrication processes are becoming increasingly complex. In order to design systems with large numbers of multi-domain components, we need to use a hierarchical structured design approach, with design at the schematic level instead of the traditional layout representation used in MEMS design. However, since fabrication can only be done from a layout representation, an automatic or manual layout generation from schematic is necessary. It is essential to be able to translate from the layout representation back to the schematic to reason about layout correctness in meeting the schematic’s function as well as to extract geometric parameters for functional simulation. An extraction module is developed which reads in the geometric description of the layout structure and reconstructs the corresponding schematic. This schematic can then be fed to an ordinary differential equation solver or can be compared with the design schematic to validate the correctness of the designed layout. The extraction module also minimizes the number of nodes required to represent the schematic as a netlist. The results presented show the success of the module for some example MEMS designs.
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10

Rao, Masaru P. "High-Aspect-Ratio Titanium Micromachining: Enabling Technology for In Vivo Therapeutic Microdevice Applications." In ASME 2010 5th Frontiers in Biomedical Devices Conference. American Society of Mechanical Engineers, 2010. http://dx.doi.org/10.1115/biomed2010-32024.

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The continuing need for enhanced efficacy, safety, and/or functionality in in vivo therapeutics provides immense opportunity for microelectromechanical systems (MEMS). However, continuing reliance upon materials adopted from the semiconductor industry may ultimately limit the scope of what can be achieved. Many such materials suffer from poor mechanical reliability due to low fracture toughness, which results in extreme sensitivity to stress concentration and predisposition to catastrophic failure by fracture. Although mitigation via robust design and packaging is sometimes possible, this invariably increases complexity and cost. Moreover, in many emerging applications, these avenues are not available, due to design constraint and/or performance restriction, thus underscoring need for development of viable alternatives. Herein, we present an overview of high-aspect-ratio titanium micromachining techniques we have developed to address this need. We then follow with a brief summary of recent results from several applications currently under development. In each, Ti micromachining provides a means for leveraging a host of advantageous properties that yield potential for enhanced safety, reliability, and/or performance. As such, Ti micromachining shows considerable promise for extending the utility of MEMS for in vivo therapeutics.
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