Books on the topic 'Microelectromechanical systems. Microelectromechanical systems Microelectronic packaging'

Hsu, Tai-Ran. Mems and microsystems: Design, manufacture, and packaging. 2nd ed. Hoboken, NJ: John Wiley, 2008.

MEMS and microsystems: Design and manufacture. Boston: McGraw-Hill, 2002.

International, TechSearch. MEMS markets: Challenges for packaging and assembly. Austin, Tex: TechSearch International, Inc., 2005.

MEMS/MOEMS packaging: Concepts, designs, metarials, and processes. New York: McGraw-Hill, 2005.

Kullberg, Richard C., and Rajeshuni Ramesham. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX: 25-26 January 2010, San Francisco, California, United States. Edited by SPIE (Society). Bellingham, Wash: SPIE, 2010.

Garcia-Blanco, Sonia. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices X: 24-25 January 2011, San Francisco, California, United States. Edited by SPIE (Society), Institut national d'optique (Canada), DALSA Corporation (Canada), and Smart Equipment Technology (France). Bellingham, Wash: SPIE, 2011.

Garcia-Blanco, Sonia, and Rajeshuni Ramesham. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices XI: 23-24 January 2012, San Francisco, California, United States. Edited by SPIE (Society), Dyoptyka (Firm), Vuzix Corporation, and Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Bellingham, Wash: SPIE, 2012.

Hartzell, Allyson L. Reliability, packaging, testing, and characterization of MEMS/MOEMS VII: 21-22 January 2008, San Jose, California, USA. Bellingham, Wash: SPIE, 2008.

Wei mi na mi qi jian feng zhuang ji shu: Micro-Nanometer Devices Packaging Technology. Beijing: Guo fang gong ye chu ban she, 2012.

International Microelectronics and Packaging Society., CMP Media, and Society of Photo-optical Instrumentation Engineers., eds. Proceedings: 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California. Washington, DC: IMAPS, 2001.

HD, International Conference on High-Density Interconnect and Systems Packaging (2000 Denver Colo ). 2000 HD International Conference on High-Density Interconnect and Systems Packaging: 25-28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA. Reston, VA: IMAPS, 2000.

W, Roman John, International Microelectronics and Packaging Society, and Society of Photo-optical Instrumentation Engineers., eds. Proceedings 2000: International Symposium on Microelectronics : September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts. Reston, Va: IMAPS, 2000.

Richard, Charbonneau, International Microelectronics and Packaging Society, and Society of Photo-optical Instrumentation Engineers., eds. 2002 International Symposium on Microelectronics: IMAPS : proceedings : September 4-6, 2002, Colorado Convention Center, Denver, CO. Washington, D.C: IMAPS, 2002.

International Symposium on Microelectronics (2003 Boston, Mass.). Proceedings 2003: International Symposium on Microelectronics : IMAPS : November 18-20, 2003, Hynes Convention Center, Boston, MA. Washington, D.C: IMAPS, 2003.

Fundamentals of microfabrication: The science of miniaturization. 2nd ed. Boca Raton, FL: CRC Press, 2002.

Fundamentals of microfabrication. Boca Raton, Fla: CRC Press, 1997.

Bruce, Romenesko, International Microelectronics and Packaging Society, and Society of Photo-optical Instrumentation Engineers., eds. Proceedings 2001: International Symposium on Microelectronics, October 9-11, 2001, Baltimore Convention Center, Baltimore, Maryland. Washington, D.C: IMAPS, 2001.

name, No. MEMS/MOEMS: Advances in photonic communications, sensing, metrology, packaging and assembly ; 28-29 October 2002, Brugge, Belgium. Bellingham, WA: SPIE, 2003.

Symposium, on Design Test Integration and Packaging of MEMS/MOEMS (2010 Seville Spain). 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP 2010): Seville, Spain, 5-7 May 2010. Piscataway, NJ]: IEEE, 2010.

ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2005 San Francisco, Calif.). Advances in electronic packaging 2005: Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, presented at 2005 ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, July 17-22, 2005 San Fransico, California USA. New York, NY: American Society of Mechanical Engineers, 2005.

Chiao, Jung-Chih. Micro- and nanotechnology: Materials, processes, packaging, and systems IV : 10-12 December 2008, Melbourne, Australia. Bellingham, Wash: SPIE, 2008.

Chiao, Jung-Chih. Micro- and nanotechnology: Materials, processes, packaging, and systems IV : 10-12 December 2008, Melbourne, Australia. Bellingham, Wash: SPIE, 2008.

(Society), SPIE, and RMIT University, eds. Micro- and nanotechnology: Materials, processes, packaging, and systems IV : 10-12 December 2008, Melbourne, Australia. Bellingham, Wash: SPIE, 2008.

IEEE CPMT Conference on High Density Microsystem Design and Packaging Component Failure Analysis (6th 2004 Shanghai, China). Proceeding of the sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04): June 30-July 3, 2004, Bao Long Hotel, Shanghai, China. Piscataway, N.J: IEEE, 2004.

Institute of Electrical and Electronics Engineers. and Components, Packaging & Manufacturing Technology Society., eds. Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06): June 27th-June 30 2006 : Shanghai University, Shanghai, China. Piscataway, NJ: IEEE, 2006.

Tai-Ran, Hsu, and INSPEC, eds. MEMS packaging. London: INSPEC, 2004.

MEMS & Microsystems: Design, Manufacture, and Nanoscale Engineering. 2nd ed. Wiley, 2008.

Hsu, Tai-Ran. MEMS and Microsystems. Mayfield, 2001.

Hsu, Tai-Ran. MEMS and Microsystems: Design and Manufacture. McGraw-Hill Science/Engineering/Math, 2001.

Hsu, Tai-Ran. MEMS and Microsystems. Mayfield, 2001.

International, TechSearch, ed. MEMS markets: Challenges for packaging and assembly. Austin, Tex: TechSearch International, Inc., 2005.

H, Lau John, ed. Advanced MEMS packaging. New York: McGraw-Hill, 2010.

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... Springer, 2019.

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... Springer, 2018.

1959-, Tan Cher Ming, Society of Photo-optical Instrumentation Engineers., Nanyang Technological University, and Institute of Physics Singapore, eds. Microelectronic yield, reliability, and advanced packaging: 28-30 November 2000, Singapore. Bellingham, Wash., USA: SPIE, 2000.

SPIE. Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII: 28-29 January 2009, San Jose, California, United States. SPIE, 2009.

R, Descour Michael, Rantala Juha T, and Society of Photo-optical Instrumentation Engineers., eds. Functional integration of opto-electro-mechanical devices and systems: 24-25 January 2001, San Jose, USA. Bellingham, Wash: SPIE, 2001.

2000 International Conference on High-Density Inetconnect and Systems Packaging. SPIE-International Society for Optical Engine, 2000.

(Editor), B. Courtois, and Serge Demidenko (Editor), eds. Design, Characterization, and Packaging for Mems and Microelectronics: 27-29 October 1999, Royal Pines Resort, Queensland, Australia (Proceedings of Spie--the ... Society for Optical Engineering, V. 3893.). South-Western Educational Publishing, 1999.

(Editor), Danelle M. Tanner, and Rajeshuni Ramesham (Editor), eds. Reliability, Packaging, Testing and Characterization of Mems / Moems 5 (Proceedings of Spie). SPIE-International Society for Optical Engine, 2006.

D, Franzon Paul, Society of Photo-optical Instrumentation Engineers., United States. Air Force. Asian Office of Aerospace Research and Development, and Institute of Electrical and Electronics Engineers. South Australia Section., eds. Design, characterization, and packaging for MEMS and microelectronics II: 17-19 December, 2001, Adelaide, Australia. Bellingham, Wash: SPIE, 2001.

B, Courtois, and Centre national de la recherche scientifique (France), eds. Design, test, integration, and packaging of MEMS/MOEMS 2002: 6-8 May, 2002, Cannes, France. Bellingham, Wash: SPIE, 2002.

B, Courtois, and Centre national de la recherche scientifique (France), eds. Design, test, integration and packaging of MEMS/MOEMS 2001: 25-27 April 2001, Cannes, France. Bellingham, Washington: SPIE, 2001.

Keren, Bergman, Centre national de la recherche scientifique (France), and Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (5th : 2003 : Cannes, France), eds. Design, test, integration and packaging of MEMS/MOEMS 2003: DTIP 2003 : 5-7 May, 2003, Cannes, France. Piscataway, N.J: IEEE, 2003.

R, Descour Michael, Rantala Juha T, and Society of Photo-optical Instrumentation Engineers., eds. Functional integration of opto-electro-mechanical devices and systems II: 23-24 January 2002, San Jose, USA. Bellingham, Wash., USA: SPIE, 2002.

Design, Test, Integration, and Packaging of Mems/Moems: 9-11 May 2000, Paris, France (Proceedings of Spie--the International Society for Optical Engineering, V. 4019.). SPIE-International Society for Optical Engine, 2000.

K, Sood Dinesh, Malshe Ajay P, Maeda Ryutaro, Society of Photo-optical Instrumentation Engineers., RMIT University, Swinburne University of Technology, and International Symposium on Smart Materials, Nano-, and Micro-Smart Systems (2002 : RMIT University), eds. Nano- and microtechnology: Materials, processes, packaging and systems : 16-18 December 2002, Melbourne, Australia. Bellingham, Wash., USA: SPIE, 2002.

Micro-electro-mechanical systems (MEMS)--1999: Microelectromechanical systems, microfluidics, MEMS packaging, thermal devices and measurements, medical applications of microsystems : presented at the 1999 ASME International Mechanical Engineering Congress and Exposition, November 14-19, 1999, Nashville, Tennessee. New York, N.Y: American Society of Mechanical Engineers, 1999.

Reliability, packaging, testing, and characterization of MEMS/MOEMS VI: 23-24 January, 2007, San Jose, California, USA. Bellingham, Wash: SPIE, 2007.

Proceedings: 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California (SPIE proceedings series). Published in cooperation with SPIE, 2001.