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Relevant bibliographies by topics / Microelectronic circuit

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Academic literature on the topic 'Microelectronic circuit'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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Journal articles on the topic "Microelectronic circuit"

1

Jóźwiak, Lech. "General Decomposition and Its Use in Digital Circuit Synthesis." VLSI Design 3, no. 3-4 (January 1, 1995): 225–48. http://dx.doi.org/10.1155/1995/16259.

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Modem microelectronic technology.gives opportunities to build digital circuits of huge complexity and provides a wide diversity of logic building blocks. Although logic designers have been building circuits for many years, they have realized that advances in microelectronic technology are outstripping their abilities to make use of the created opportunities. In this paper, we present the fundamentals of a logic design methodology which meets the requirements of today's complex circuits and modem building blocks. The methodology is based on the theory of general full-decompositions which constitutes the theory of digital circuit structures at the highest abstraction level. The paper explains the theory and shows how it can be used for digital circuit synthesis. The decomposition methodology that is presented ensures “correctness by construction” and enables very effective and efficient post-factum validation. It makes possible extensive examination of the structural features of the required information processing in relation to a given set of objectives and constraints.

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Din, M. Omar, Aida Martin, Ivan Razinkov, Nicholas Csicsery, and Jeff Hasty. "Interfacing gene circuits with microelectronics through engineered population dynamics." Science Advances 6, no. 21 (May 2020): eaaz8344. http://dx.doi.org/10.1126/sciadv.aaz8344.

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While there has been impressive progress connecting bacterial behavior with electrodes, an attractive observation to facilitate advances in synthetic biology is that the growth of a bacterial colony can be determined from impedance changes over time. Here, we interface synthetic biology with microelectronics through engineered population dynamics that regulate the accumulation of charged metabolites. We demonstrate electrical detection of the bacterial response to heavy metals via a population control circuit. We then implement this approach to a synchronized genetic oscillator where we obtain an oscillatory impedance profile from engineered bacteria. We lastly miniaturize an array of electrodes to form “bacterial integrated circuits” and demonstrate its applicability as an interface with genetic circuits. This approach paves the way for new advances in synthetic biology, analytical chemistry, and microelectronic technologies.

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Grout, Ian, and Joseph Walsh. "Microelectronic Circuit Test Engineering Laboratories with Programmable Logic." International Journal of Electrical Engineering & Education 41, no. 4 (October 2004): 313–27. http://dx.doi.org/10.7227/ijeee.41.4.5.

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Shen, Xiaoyan, and Zhigong Wang. "Fully integrated circuit chip of microelectronic neural bridge." Journal of Semiconductors 35, no. 9 (September 2014): 095011. http://dx.doi.org/10.1088/1674-4926/35/9/095011.

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Jones, Andrew, and Vinod Sikka. "Superhydrophobic Coatings on Electronic Components." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000113–16. http://dx.doi.org/10.4071/isom-2011-ta3-paper6.

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Superhydrophobic coatings provide exceptional protection to electrical circuits, switches, and other electrical devices which operate in wet environments, such as food processing plants or outdoor applications. Among various electrical device applications, electric motors and electrical switches have been successfully tested in the field at two food processors for nearly 20 months with exceptionally good results. Coated microelectronic circuit board has been in operation without any incidence for over 1 year.

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Rajakumar, C., and D. Johnson. "Finite Element Predictions of Free Convection Heat Transfer Coefficients of Simulated Electronic Circuit Boards." Journal of Electronic Packaging 111, no. 2 (June 1, 1989): 129–34. http://dx.doi.org/10.1115/1.3226517.

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A numerical simulation of the buoyancy-induced flow around microelectronic components mounted on a circuit board has been performed using the finite element method. The circuit board is modeled by a vertical plate on which rectangular strip heating surfaces are mounted. Computations have been performed in two-dimensional plane applying a simplifying assumption that the circuit board and the strip heating surfaces are infinitely long. The Navier-Stokes, the flow continuity and the energy equations for laminar flow have been considered in the finite element discretizations. Results of the computations are presented in the form of temperature contour plots and velocity vector plots in the flow field. The convection heat transfer coefficients at the surface of the microelectronic components are presented as a function of their height. The convection coefficients computed have been compared with experimental correlations of free convection heat transfer found in the literature.

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ALARCÓN, EDUARD, GERARD VILLAR, and ALBERTO POVEDA. "CMOS INTEGRATED CIRCUIT CONTROLLERS FOR SWITCHING POWER CONVERTERS." Journal of Circuits, Systems and Computers 13, no. 04 (August 2004): 789–811. http://dx.doi.org/10.1142/s0218126604001714.

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Two case examples of high-speed CMOS microelectronic implementations of high-performance controllers for switching power converters are presented. The design and implementation of a current-programmed controller and a general-purpose feedforward one-cycle controller are described. The integrated circuit controllers attain high-performance by means of using current-mode analog signal processing, hence allowing high switching frequencies that extend the operation margin compared to previous designs. Global layout-extracted transistor-level simulation results for 0.8 μm and 0.35 μm standard CMOS technologies confirm both the correct operation of the circuits in terms of bandwidth as well as their functionality for the control of switching power converters. The circuits may be used either as standalone IC controllers or as controller circuits that are technology-compatible with on-chip switching power converters and on-chip loads for future powered systems-on-chip.

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Xie, Yiwei, Leimeng Zhuang, and Arthur J. Lowery. "Picosecond optical pulse processing using a terahertz-bandwidth reconfigurable photonic integrated circuit." Nanophotonics 7, no. 5 (May 24, 2018): 837–52. http://dx.doi.org/10.1515/nanoph-2017-0113.

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AbstractChip-scale integrated optical signal processors promise to support a multitude of signal processing functions with bandwidths beyond the limit of microelectronics. Previous research has made great contributions in terms of demonstrating processing functions and device building blocks. Currently, there is a significant interest in providing functional reconfigurability, to match a key advantage of programmable microelectronic processors. To advance this concept, in this work, we experimentally demonstrate a photonic integrated circuit as an optical signal processor with an unprecedented combination of two key features: reconfigurability and terahertz bandwidth. These features enable a variety of processing functions on picosecond optical pulses using a single device. In the experiment, we successfully verified clock rate multiplication, arbitrary waveform generation, discretely and continuously tunable delays, multi-path combining and bit-pattern recognition for 1.2-ps-duration optical pulses at 1550 nm. These results and selected head-to-head comparisons with commercially available devices show our device to be a flexible integrated platform for ultrahigh-bandwidth optical signal processing and point toward a wide range of applications for telecommunications and beyond.

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Rodriguez, M. E., A. Mandelis, G. Pan, J. A. Garcia, and Y. Riopel. "Microelectronic circuit characterization via photothermal radiometry of scribeline recombination lifetime." Solid-State Electronics 44, no. 4 (April 2000): 703–11. http://dx.doi.org/10.1016/s0038-1101(99)00289-0.

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Ilumoka, A. A. "A modular neural network approach to microelectronic circuit yield optimization." Microelectronics Reliability 38, no. 4 (April 1998): 571–80. http://dx.doi.org/10.1016/s0026-2714(97)00203-5.

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Dissertations / Theses on the topic "Microelectronic circuit"

1

Lau, P. H. "Computer aided design of microelectronic systems in the time domain." Thesis, University of Sunderland, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.234044.

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Zhu, Qi. "Helix-type compliant off-chip interconnect for microelectronic packaging." Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/17541.

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Li, Yiming. "Plasma processing of advanced interconnects for microelectronic applications." Diss., Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/11034.

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Ma, Lunyu. "Design and development of stress-engineered compliant interconnect in microelectronic packaging." Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/16066.

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Haemer, Joseph Michael. "Thermo-mechanical modeling and design of micro-springs for microelectronic probing and packaging." Thesis, Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/16830.

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Srinivasan, Gopikrishna. "Multiscale EM and circuit simulation using the Laguerre-FDTD scheme for package-aware integrated-circuit design." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/24705.

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Thesis (Ph.D.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2008.
Committee Chair: Prof. Madhavan Swaminathan; Committee Member: Prof. Andrew Peterson; Committee Member: Prof. Sungkyu Lim

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Martin, Lara J. "Study on metal adhesion mechanisms in high density interconnect printed circuit boards." Thesis, Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/19628.

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Xue, Hao. "Hardware Security and VLSI Design Optimization." Wright State University / OhioLINK, 2018. http://rave.ohiolink.edu/etdc/view?acc_num=wright1546466777397815.

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Sundaram, Venkatesh. "Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/28141.

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Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2009.
Committee Chair: Tummala, Rao; Committee Member: Iyer, Mahadevan; Committee Member: Saxena, Ashok; Committee Member: Swaminathan, Madhavan; Committee Member: Wong, Chingping.

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Terizhandur, Varadharajan Narayanan. "Fast methods for full-wave electromagnetic simulations of integrated circuit package modules." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/41059.

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Fast methods for the electromagnetic simulation of integrated circuit (IC) package modules through model order reduction are demonstrated. The 3D integration of multiple functional IC chip/package modules on a single platform gives rise to geometrically complex structures with strong electromagnetic phenomena. This motivates our work on a fast full-wave solution for the analysis of such modules, thus contributing to the reduction in design cycle time without loss of accuracy. Traditionally, fast design approaches consider only approximate electromagnetic effects, giving rise to lumped-circuit models, and therefore may fail to accurately capture the signal integrity, power integrity, and electromagnetic interference effects. As part of this research, a second order frequency domain full-wave susceptance element equivalent circuit (SEEC) model will be extracted from a given structural layout. The model so obtained is suitably reduced using model order reduction techniques. As part of this effort, algorithms are developed to produce stable and passive reduced models of the original system, enabling fast frequency sweep analysis. Two distinct projection-based second order model reduction approaches will be considered: 1) matching moments, and 2) matching Laguerre coefficients, of the original system's transfer function. Further, the selection of multiple frequency shifts in these schemes to produce a globally representative model is also studied. Use of a second level preconditioned Krylov subspace process allows for a memory-efficient way to address large size problems.

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Books on the topic "Microelectronic circuit"

1

Jaeger, Richard C. Microelectronic circuit design. 4th ed. New York: McGraw-Hill, 2011.

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Jaeger, Richard C. Microelectronic circuit design. 4th ed. New York, NY: McGraw-Hill, 2010.

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N, Blalock Travis, ed. Microelectronic circuit design. 4th ed. New York, NY: McGraw-Hill, 2010.

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Jaeger, Richard C. Microelectronic circuit design. New York: McGraw-Hill, 1997.

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N, Blalock Travis, ed. Microelectronic circuit design. 2nd ed. New York, NY: McGraw-Hill, 2004.

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N, Blalock Travis, ed. Microelectronic circuit design. 3rd ed. Boston: McGraw-Hill Higher Education, 2008.

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Jaeger, Richard C. Microelectronic circuit design. 2nd ed. Dubuque, Iowa: McGraw-Hill, 2003.

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8

Fonstad, Clifton G. Microelectronic devices and circuits. New York: McGraw-Hill, 1994.

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9

Di Paolo Emilio, Maurizio. Microelectronic Circuit Design for Energy Harvesting Systems. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-47587-5.

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10

Rashid, M. H. Microelectronic circuits: Analysis and design. 2nd ed. Stamford, CT: Cengage Learning, 2011.

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Book chapters on the topic "Microelectronic circuit"

1

Weik, Martin H. "microelectronic circuit." In Computer Science and Communications Dictionary, 1013. Boston, MA: Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_11482.

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Di Paolo Emilio, Maurizio. "Low-Power Circuits." In Microelectronic Circuit Design for Energy Harvesting Systems, 105–41. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-47587-5_9.

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Di Paolo Emilio, Maurizio. "The Fundamentals of Energy Harvesting." In Microelectronic Circuit Design for Energy Harvesting Systems, 11–20. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-47587-5_2.

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Di Paolo Emilio, Maurizio. "Introduction." In Microelectronic Circuit Design for Energy Harvesting Systems, 1–10. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-47587-5_1.

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Di Paolo Emilio, Maurizio. "Low-Power Solutions for Biomedical/Mobile Devices." In Microelectronic Circuit Design for Energy Harvesting Systems, 143–54. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-47587-5_10.

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Di Paolo Emilio, Maurizio. "Applications of Energy Harvesting." In Microelectronic Circuit Design for Energy Harvesting Systems, 155–65. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-47587-5_11.

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Di Paolo Emilio, Maurizio. "Input Energy." In Microelectronic Circuit Design for Energy Harvesting Systems, 21–35. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-47587-5_3.

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Di Paolo Emilio, Maurizio. "Electromagnetic Transducers." In Microelectronic Circuit Design for Energy Harvesting Systems, 37–45. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-47587-5_4.

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Di Paolo Emilio, Maurizio. "Piezoelectric Transducers." In Microelectronic Circuit Design for Energy Harvesting Systems, 47–53. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-47587-5_5.

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Di Paolo Emilio, Maurizio. "Thermoelectric Transducers." In Microelectronic Circuit Design for Energy Harvesting Systems, 55–63. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-47587-5_6.

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Conference papers on the topic "Microelectronic circuit"

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Kolasa, Ted, and Alfredo Mendoza. "Concepts for In Situ Diagnostics in Analog Microelectronic Circuits." In ISTFA 2007. ASM International, 2007. http://dx.doi.org/10.31399/asm.cp.istfa2007p0301.

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Abstract Comprehensive in situ (designed-in) diagnostic capabilities have been incorporated into digital microelectronic systems for years, yet similar capabilities are not commonly incorporated into the design of analog microelectronics. And as feature sizes shrink and back end interconnect metallization becomes more complex, the need for effective diagnostics for analog circuits becomes ever more critical. This paper presents concepts for incorporating in situ diagnostic capability into analog circuit designs. Aspects of analog diagnostic system architecture are discussed as well as nodal measurement scenarios for common signal types. As microelectronic feature sizes continue to shrink, diagnostic capabilities such as those presented here will become essential to the process of fault localization in analog circuits.

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Gubkina, Valeria R., and Anastasia Yu Rogulina. "Microelectronic integrated circuit design automation." In 2016 17th International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices (EDM). IEEE, 2016. http://dx.doi.org/10.1109/edm.2016.7538703.

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Chandramouli, Rajarathnam, N. Vijaykrishnan, and N. Ranganathan. "SPRT for Weibull distributed integrated circuit failures." In Microelectronic Manufacturing, edited by Sharad Prasad, Hans-Dieter Hartmann, and Tohru Tsujide. SPIE, 1998. http://dx.doi.org/10.1117/12.324373.

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Vanderlinde, William E., Christopher J. Von Benken, and Addison R. Crockett. "Rapid integrated circuit delayering without grass." In Microelectronic Manufacturing 1996, edited by Ali Keshavarzi, Sharad Prasad, and Hans-Dieter Hartmann. SPIE, 1996. http://dx.doi.org/10.1117/12.250834.

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Emzivat, Delphine, Claude Gagnadre, and Eric Martin. "Optical integrated circuit for quality control." In Microelectronic Manufacturing Technologies, edited by Kevin Yallup and Murali K. Narasimhan. SPIE, 1999. http://dx.doi.org/10.1117/12.346239.

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Baskys, Algirdas, and Vitold Gobis. "Technique of analog integrated circuit yield analysis." In Microelectronic Manufacturing Technologies, edited by Kostas Amberiadis, Gudrun Kissinger, Katsuya Okumura, Seshu Pabbisetty, and Larg H. Weiland. SPIE, 1999. http://dx.doi.org/10.1117/12.346931.

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Wang, Jun, and Alfred K. K. Wong. "Effects of grid-placed contacts on circuit performance." In Advanced Microelectronic Manufacturing, edited by Alfred K. K. Wong and Kevin M. Monahan. SPIE, 2003. http://dx.doi.org/10.1117/12.485279.

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Roberts, David A., Hans J. Graf, and Michael J. Halberstadt. "Control of CVD precursor purity for integrated circuit manufacture." In Microelectronic Manufacturing '95, edited by Anant G. Sabnis and Ivo J. Raaijmakers. SPIE, 1995. http://dx.doi.org/10.1117/12.221307.

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Chakraborty, S., and V. Jandhyala. "Surface-based broadband electromagnetic-circuit simulation of lossy conducting structures in microelectronic circuits." In IEEE Antennas and Propagation Society Symposium, 2004. IEEE, 2004. http://dx.doi.org/10.1109/aps.2004.1331949.

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"Session 5: Circuit." In 2010 International Conference on Microelectronic Test Structures (ICMTS). IEEE, 2010. http://dx.doi.org/10.1109/icmts.2010.5466846.

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Reports on the topic "Microelectronic circuit"

1

Ringo, John A. Nanoscale Microelectronic Circuit Development. Fort Belvoir, VA: Defense Technical Information Center, June 2011. http://dx.doi.org/10.21236/ada545257.

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Schoelkopf, R. J., K. W. Lehnert, K. Bladh, L. F. Spietz, and D. I. Schuster. Measurement of the Excited-State Lifetime and Coherence Time of a Microelectronic Circuit. Fort Belvoir, VA: Defense Technical Information Center, August 2002. http://dx.doi.org/10.21236/ada414293.

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McCarthy, A. Demonstration model circuit panel for silicon-on-insulator microelectronics and flat-panel 1994 LDRD final report 94-FS-041. Office of Scientific and Technical Information (OSTI), September 1995. http://dx.doi.org/10.2172/120880.

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