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Books on the topic 'Microelectronic devices'

Author: Grafiati

Published: 4 June 2021

Last updated: 25 July 2025

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1

Leaver, K. D. Microelectronic devices. Longman Scientific & Technical, 1989.

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2

Yang, Edward S. Microelectronic devices. McGraw-Hill, 1988.

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3

Yang, Edward S. Microelectronic devices. McGraw-Hill, 1988.

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4

Fonstad, Clifton G. Microelectronic devices and circuits. McGraw-Hill, 1994.

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5

Horenstein, Mark N. Microelectronic circuits and devices. Prentice Hall, 1990.

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6

Fonstad, Clifton. Microelectronic devices and circuits. McGraw-Hill, 1994.

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7

Pulfrey, David L. Introduction to microelectronic devices. Prentice-Hall International, 1989.

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8

1956-, Tarr N. Garry, ed. Introduction to microelectronic devices. Prentice Hall, 1989.

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9

Arunachalam, V., and K. Sivasankaran, eds. Microelectronic Devices, Circuits and Systems. Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-5048-2.

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10

Manzione, Louis T. Plastic packaging of microelectronic devices. Van Nostrand Reinhold, 1990.

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11

Arunachalam, V., and K. Sivasankaran, eds. Microelectronic Devices, Circuits and Systems. Springer Nature Switzerland, 2022. http://dx.doi.org/10.1007/978-3-031-23973-1.

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12

Burrows, Susan Elizabeth. Silicone encapsulants for microelectronic devices. typescript, 1995.

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13

Fleetwood, Daniel. Defects in microelectronic materials and devices. CRC Press, 2008.

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14

M, Grasserbauer, and Werner H. W, eds. Analysis of Microelectronic Materials and Devices. Wiley, 1994.

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15

1945-, Grasserbauer M., and Werner H. W, eds. Analysis of microelectronic materials and devices. Wiley, 1991.

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16

C, Ling Hung, Niwa Koichi, Shukla Vishwa N, International Symposium on Materials for Optoelectronic and Microelectronic Packaging (1992 : San Francisco, Calif.), and International Ceramic Science and Technology Congress (3rd : 1992 : San Francisco, Calif.), eds. Materials in microelectronic and optoelectronic packaging. American Ceramic Society, 1993.

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17

universitet, Uppsala, ed. Investigations of microelectronic devices based on metal-semiconductor contacts. Uppsala University, 1989.

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18

B, Courtois, and Centre national de la recherche scientifique (France), eds. Design, test, integration, and packaging of MEMS/MOEMS 2002: 6-8 May, 2002, Cannes, France. SPIE, 2002.

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19

R, Feldman Michael, Lee Yung-Cheng, Society of Photo-optical Instrumentation Engineers., and United States. Advanced Research Projects Agency., eds. Optoelectronic packaging: 1-2 February 1996, San Jose, California. SPIE, 1996.

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20

1939-, Lee S. H., ed. Selected papers on optical interconnects and packaging. SPIE Optical Engineering Press, 1997.

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21

Qin-Yi, Tong, Goesele Ulrich M, Society of Photo-optical Instrumentation Engineers., et al., eds. Advances in microelectronic device technology: 7-9 November 2001, Nanjing, China. SPIE, 2001.

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22

Wolfram, Scharff, and Technische Universität Karl-Marx-Stadt, eds. Schichtsysteme für zukünftige Bauelemente der Mikro-, Opto- und Molekularelektronik: 1. Fachtagung, November 1986. Technische Universität Karl-Marx-Stadt, 1987.

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23

Fachtagung Schichtsysteme für Zukünftige Bauelemente der Mikro-, Opto-, Bioelektronik und Optik (2nd 1989? Technische Universität Karl-Marx-Stadt). 2. Fachtagung Schichtsysteme für Zukünftige Bauelemente der Mikro-, Opto-, Bioelektronik und Optik. Technische Universität Karl-Marx-Stadt, 1989.

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24

G, Sabnis Anant, and Society of Photo-optical Instrumentation Engineers., eds. Manufacturing process control for microelectronic devices and circuits: 20-21 October 1994, Austin, Texas. SPIE, 1994.

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25

Barry, Harrison H., Wee Andrew T. S, Gupta Subhash 1955-, Society of Photo-optical Instrumentation Engineers., Nanyang Technological University, and Institute of Physics Singapore, eds. Advanced microelectronic processing techniques: 28-30 November 2000, Singapore. SPIE, 2000.

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26

Conference on Optoelectronic and Microelectronic Materials and Devices (2000 Melbourne, Australia). COMMAD 2000: Conference on Optoelectronic and Microelectronic Materials and Devices : proceedings : Melbourne, Australia, 6-8 December, 2000. Edited by Broekman Leonard D, Usher Brian F, Riley John D, and Institute of Electrical and Electronics Engineers. IEEE, 2000.

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27

R, Descour Michael, Rantala Juha T, and Society of Photo-optical Instrumentation Engineers., eds. Functional integration of opto-electro-mechanical devices and systems: 24-25 January 2001, San Jose, USA. SPIE, 2001.

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28

R, Descour Michael, Rantala Juha T, and Society of Photo-optical Instrumentation Engineers., eds. Functional integration of opto-electro-mechanical devices and systems II: 23-24 January 2002, San Jose, USA. SPIE, 2002.

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29

B, Courtois, and Centre national de la recherche scientifique (France), eds. Design, test, integration and packaging of MEMS/MOEMS 2001: 25-27 April 2001, Cannes, France. SPIE, 2001.

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30

Conference on Optoelectronic and Microelectronic Materials and Devices (1998 Perth, Australia). 1998 Conference on Optoelectronic and Microelectronic Materials and Devices: Proceedings, 14-16 December 1998, Microelectronics Research Group, Department of Electrical and Electronic Engineering, The University of Western Australia, Perth, Western Australia. Edited by Faraone Lorenzo and Institute of Electrical and Electronics Engineers. Institute of Electrical and Electronic Engineers, 1999.

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31

Conference on Optoelectronic and Microelectronic Materials and Devices (1996 Canberra, Australia). 1996 Conference on Optoelectronic and Microelectronic Materials and Devices: Proceedings, 8-11 December 1996, Australian National University, Canberra, Australia. Edited by Jagadish C and Institute of Electrical and Electronics Engineers. Institute of Electrical and Electronic Engineers, 1996.

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32

E, Bailey Wayne, Motamedi M. Edward, Luo Fang-Chen, Semiconductor Equipment and Materials International., National Institute of Standards and Technology (U.S.), and Society of Photo-optical Instrumentation Engineers., eds. Microelectronic structures and microelectromechanical devices for optical processing and multimedia applications: 24 October, 1995, Austin, Texas. SPIE, 1995.

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33

I, Baturone, ed. Microelectronic design of fuzzy logic-based systems. CRC, 2000.

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34

S, Mathad G., Nguyen Du B, Electrochemical Society. Dielectric Science and Technology Division., and Electrochemical Society Electronics Division, eds. Proceedings of the symposia on reliability of semiconductor devices/interconnections and dielectric breakdown, and laser process for microelectronic applications. Electrochemical Society, 1992.

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35

Pham, Anh-Vu H., Morgan J. Chen, and Kunia Aihara. LCP for microwave packages and modules. Cambridge University Press, 2012.

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36

J, Dubowski J., and Society of Photo-optical Instrumentation Engineers., eds. Laser applications in microelectronic and optoelectronic manufacturing II: 10-12 February, 1997, San Jose, California. SPIE, 1997.

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37

Suning, Tang, Li Y, and Society of Photo-optical Instrumentation Engineers., eds. Optoelectronic interconnects VIII: 25-26 January, 2001, San Jose, [Calif.] USA. SPIE, 2001.

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38

M, Earman Allen, Chen Ray T, and Society of Photo-optical Instrumentation Engineers., eds. Photonics packaging, integration, and interconnects VII: 23-25 January, 2007, San Jose, California, USA. SPIE, 2007.

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39

Glebov, A. L. Photonics packaging, integration, and interconnects IX: 26-28 January 2009, San Jose, California, United States. Edited by SPIE (Society). SPIE, 2009.

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40

Glebov, Alexei L. Photonics packaging, integration, and interconnects VIII: 22-24 January 2008, San Jose, California, USA. Edited by Society of Photo-optical Instrumentation Engineers. SPIE, 2008.

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41

Henry, Helvajian, United States. Air Force. Office of Scientific Research., and Society of Photo-optical Instrumentation Engineers., eds. Laser applications in microelectronic and optoelectronic manufacturing V: 24-26 January, 2000, San Jose, USA. SPIE, 2000.

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42

J, Dubowski J., United States. Air Force. Office of Scientific Research., and Society of Photo-optical Instrumentation Engineers., eds. Laser applications in microelectronic and optoelectronic manufacturing IV: 25-27 January 1999, San Jose, California. SPIE, 1999.

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43

Xuping, Zhang, Zhongguo yi qi yi biao xue hui, and SPIE (Society), eds. Microelectronic and optoelectronic devices and integration: 2008 International Conference on Optical Instruments and Technology : 16-19 November 2008, Beijing, China. SPIE, 2009.

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44

P, Bristow Julian, Tang Suning, and Society of Photo-optical Instrumentation Engineers., eds. Optoelectronic interconnects VI: 27-29 January 1999, San Jose, California. SPIE, 1999.

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45

Earman, Allen M. Photonics packaging and integration VI: 25-26 January, 2006, San Jose, California, USA. Edited by Society of Photo-optical Instrumentation Engineers. SPIE, 2006.

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46

Leaver, Keith. Microelectronic Devices. PUBLISHED BY IMPERIAL COLLEGE PRESS AND DISTRIBUTED BY WORLD SCIENTIFIC PUBLISHING CO., 1997. http://dx.doi.org/10.1142/p011.

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47

Microelectronic devices. 2nd ed. Imperial College Press, 1997.

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48

Microelectronic Devices. Longman Higher Education, 1989.

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49

Leaver, Keith. Microelectronic Devices. Allied Publishers Pvt. Ltd., 2003.

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50

Nagchoudhuri, D. Microelectronic Devices. Prentice-Hall, 2002.

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