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Relevant bibliographies by topics / Microelectronic devices / Dissertations / Theses

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Dissertations / Theses on the topic 'Microelectronic devices'

Author: Grafiati

Published: 4 June 2021

Last updated: 25 July 2025

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1

Al-Amin, Chowdhury G. "Advanced Graphene Microelectronic Devices." FIU Digital Commons, 2016. http://digitalcommons.fiu.edu/etd/2512.

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The outstanding electrical and material properties of Graphene have made it a promising material for several fields of analog applications, though its zero bandgap precludes its application in digital and logic devices. With its remarkably high electron mobility at room temperature, Graphene also has strong potential for terahertz (THz) plasmonic devices. However there still are challenges to be solved to realize Graphene’s full potential for practical applications. In this dissertation, we investigate solutions for some of these challenges. First, to reduce the access resistances which signif

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2

Burrows, Susan Elizabeth. "Silicone encapsulants for microelectronic devices." Thesis, University of Warwick, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.319702.

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3

Solis, Adrian (Adrian Orbita). "MIT Device Simulation WebLab : an online simulator for microelectronic devices." Thesis, Massachusetts Institute of Technology, 2004. http://hdl.handle.net/1721.1/33364.

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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, June 2005.<br>Includes bibliographical references (p. 149-157).<br>In the field of microelectronics, a device simulator is an important engineering tool with tremendous educational value. With a device simulator, a student can examine the characteristics of a microelectronic device described by a particular model. This makes it easier to develop an intuition for the general behavior of that device and examine the impact of particular device parameters on device characteristics. In thi

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4

Ramon, i. Garcia Eloi. "Inkjet printed microelectronic devices and circuits." Doctoral thesis, Universitat Autònoma de Barcelona, 2014. http://hdl.handle.net/10803/285078.

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En els darrers anys ha anat creixent l’interès per la fabricació de sistemes de baix cost, flexibles i sobre gran àrea com, per exemple, les etiquetes RFID per a identificació de productes, les pantalles flexibles o les etiquetes intel•ligents entre d’altres. La tecnologia d’impressió electrònica (Printed Electronics) s’ha posicionat com una de les tecnologies alternatives de fabricació més prometedores pel fet de no utilitzar tècniques fotolitogràfiques i de buit. Alhora, la millora en materials orgànics i inorgànics ha provocat un increment en les prestacions dels dispositius impresos. Tot i

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5

Reska, Anna. "Interfacing insect neuronal neutworks with microelectronic devices." Jülich Forschungszentrum, Zentralbibliothek, 2009. http://d-nb.info/1000321983/34.

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6

Sanderson, Lisa. "Nanoscale strain characterisation of modern microelectronic devices." Thesis, University of Newcastle upon Tyne, 2012. http://hdl.handle.net/10443/1541.

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Sources of stress and strain in modern microelectronics can be either beneficial to the electrical performance or detrimental to the mechanical integrity and ultimately lifetime of the device. Strain engineering is commonplace in state-of-the-art device fabrication as a means to boost performance in the face of device scaling limitation. The strain present in the device is directly related to the improvement factor and as such precise measurements and good understanding are of utmost importance due to the many thermal processing steps that can induce or cause relaxation of the strain. Front-en

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7

Limpaphayom, Koranan. "Microelectronic circuits for noninvasive ear type assistive devices." College Park, Md.: University of Maryland, 2009. http://hdl.handle.net/1903/9887.

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Thesis (Ph. D.) -- University of Maryland, College Park, 2009.<br>Thesis research directed by: Reliability Engineering Program. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.

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8

Clarke, Warrick Robin Physics Faculty of Science UNSW. "Quantum interaction phenomena in p-GaAs microelectronic devices." Awarded by:University of New South Wales. School of Physics, 2006. http://handle.unsw.edu.au/1959.4/32259.

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In this dissertation, we study properties of quantum interaction phenomena in two-dimensional (2D) and one-dimensional (1D) electronic systems in p-GaAs micro- and nano-scale devices. We present low-temperature magneto-transport data from three forms of low-dimensional systems 1) 2D hole systems: in order to study interaction contributions to the metallic behavior of 2D systems 2) Bilayer hole systems: in order to study the many body, bilayer quantum Hall state at nu = 1 3) 1D hole systems: for the study of the anomalous conductance plateau G = 0.7 ???? 2e2/h The work is divided into five ex

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9

Heng, Stephen Fook-Geow. "Experimental and theoretical thermal analysis of microelectronic devices." Diss., Georgia Institute of Technology, 1988. http://hdl.handle.net/1853/16694.

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10

Thongpang, Sanitta. "Vacuum field emission microelectronic devices based on silicon nanowhiskers." Thesis, University of Canterbury. Electrical and Computer Engineering, 2007. http://hdl.handle.net/10092/1141.

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Vacuum field emission devices have become a promising candidate for emerging display technology due to their interesting properties compared to conventional thermionic emission devices that require high temperature and power to operate. Unlike thermionic emission, field emission devices can induce the electrons to emit at low temperature; sharp and thin emitters on the cathode are desired in order to increase the field emission. Many candidates from other research groups, such as Carbon Nanotubes (CNTs), SiC and ZnO, appear to have high field emission, but their complicated fabrication proces

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11

León, Cerro Javier. "Advanced analysis of microelectronic devices and systems by lock-in IR thermography." Doctoral thesis, Universitat Autònoma de Barcelona, 2016. http://hdl.handle.net/10803/392687.

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Desde los inicios de la revolución microelectrónica, su evolución tecnológica siempre se ha visto marcada por la búsqueda constante de dispositivos y sistemas electrónicos monolíticos más compactos, fiables y robustos, ofreciendo mejores prestaciones y funcionalidades a un coste razonable. Ello no sólo ha permitido su uso para complementar o sustituir en muchas aplicaciones a otros sistemas basados en elementos mecánicos, electromecánicos, hidráulicos, y neumáticos (sistemas de comunicación, more electric aircrafts o tracción ferroviaria), sino que también ha dado lugar a nuevos conceptos o ca

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12

Reska, Anna [Verfasser]. "Interfacing insect neuronal neutworks with microelectronic devices / vorgelegt von Anna Magdalena Reska." Jülich : Forschungszentrum, Zentralbibliothek, 2009. http://d-nb.info/1000321983/34.

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13

Liu, Liyu. "Design and fabrication of microfluidic/microelectronic devices from nano particle based composites /." View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?NSNT%202008%20LIU.

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14

Blanco, Agnes M. Padovani. "Low dielectric constant porous spin-on glass for microelectronic applications." Diss., Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/11840.

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15

Köck, Helmut [Verfasser]. "Experimental and numerical study on heat transfer problems in microelectronic devices / Helmut Köck." Aachen : Shaker, 2013. http://d-nb.info/1049382048/34.

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16

Monadgemi, Pezhman. "Polymer-Based Wafer-Level Packaging of Micromachined HARPSS Devices." Diss., Georgia Institute of Technology, 2006. http://hdl.handle.net/1853/11473.

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This thesis reports on a new low-cost wafer-level packaging technology for microelectromechanical systems (MEMS). The MEMS process is based on a revised version of High Aspect Ratio Polysilicon and Single Crystal Silicon (HARPSS) technology. The packaging technique is based on thermal decomposition of a sacrificial polymer through a polymer overcoat followed by metal coating to create resizable MEMS packages. The sacrificial polymer is created on top of the active component including beams, seismic mass, and electrodes by photodefining, dispensing, etching, or molding. The low loss polymer ove

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17

Kohl, Michael. "An experimental investigation of microchannel flow with internal pressure measurements." Diss., Available online, Georgia Institute of Technology, 2004:, 2004. http://etd.gatech.edu/theses/available/etd-06072004-131239/unrestricted/kohl%5Fmichael%5F200405%5Fphd.pdf.

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18

Weigel, Stefan. "Primary neuronal culture of Locusta migratoria for construction of networks on microelectronic recording devices." [S.l.] : [s.n.], 2006. http://deposit.ddb.de/cgi-bin/dokserv?idn=98245774X.

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19

Varghese, J. (Jobin). "MoO₃, PZ29 and TiO₂ based ultra-low fabrication temperature glass-ceramics for future microelectronic devices." Doctoral thesis, Oulun yliopisto, 2019. http://urn.fi/urn:isbn:9789526222172.

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Abstract This thesis describes a detailed investigation of new glass 10Li₂O−10Na₂O−20K₂O−60MoO₃ (LNKM), ceramic (α-MoO₃) and ceramic-commercial glass (PZ29-GO17, rutile TiO₂-GO17) composites to satisfy the future requirements for ultra-low fabrication temperature materials and their associated processes. The initial part of the thesis is devoted to the development of the LNKM glass by a glass-melting and quenching process, followed by an investigation into its structural, microstructural and microwave dielectric properties. The prepared glass had ultra-low glass transition and melting temperat

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20

Loik, V. B., V. Havrysh, and L. Kolyasa. "Non-linear mathematical 3D model of determination of temperature field in elements of microelectronic devices (Scopus)." Thesis, XIІI International Scientific and Technical Conference “Computer Sciences and Information Technologies” CSIT 2018, 2018. http://hdl.handle.net/123456789/5324.

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21

Krundel, Ludovic. "On microelectronic self-learning cognitive chip systems." Thesis, Loughborough University, 2016. https://dspace.lboro.ac.uk/2134/21804.

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After a brief review of machine learning techniques and applications, this Ph.D. thesis examines several approaches for implementing machine learning architectures and algorithms into hardware within our laboratory. From this interdisciplinary background support, we have motivations for novel approaches that we intend to follow as an objective of innovative hardware implementations of dynamically self-reconfigurable logic for enhanced self-adaptive, self-(re)organizing and eventually self-assembling machine learning systems, while developing this new particular area of research. And after revi

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22

Valdes, Abel. "Development of laser ultrasonic and interferometric inspection system for high-volume on-line inspection of microelectronic devices." Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/29685.

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Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2009.<br>Committee Chair: Ume, I. Charles; Committee Member: Kalaitzidou, Kyriaki; Committee Member: Mayor, J. Rhett. Part of the SMARTech Electronic Thesis and Dissertation Collection.

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23

Liang, Hongwei. "Development of microwave and millimeter-wave pin grid array and ball grid array packages." Diss., Georgia Institute of Technology, 2001. http://hdl.handle.net/1853/14867.

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24

Liu, Yi Johnson R. Wayne. "Packaging of silicon carbide high temperature, high power devices processes and materials /." Auburn, Ala., 2006. http://repo.lib.auburn.edu/2006%20Spring/doctoral/LIU_YI_31.pdf.

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25

Reading, Michael Alexander. "The application of MEIS for the physical characterisation of high-k ultra thin dielectric layers in microelectronic devices." Thesis, University of Salford, 2010. http://usir.salford.ac.uk/26876/.

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During the last decade the use of 8162 as gate dielectric layers in complementary metal oxide semiconductor (CMOS) microelectronic devices has become increasingly problematic due to leakage resulting from the electron tunnelling with gate oxide thickness approaching 1 nm. Approaches to deal with these problems have focused on increasing the dielectric constant (k) of the material, initially though nitridation of the oxide layer and more recently the application of high-A: materials such as Hf based dielectrics. The work described in this thesis concerns the physical characterisation of thin hi

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26

Dalmia, Sidharth. "Design and implementation of high-Q passive devices for wireless applications using System-On-Package (SOP) based organic technologies." Diss., Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/15689.

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27

Ma, Wei. "Low temperature metal-based micro fabrication and packaging technology /." View abstract or full-text, 2005. http://library.ust.hk/cgi/db/thesis.pl?MECH%202005%20MA.

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28

Howard, Turner A. "Design of an advanced system for inspection of microelectronic devices and their solder connections using laser-induced virbration techniques." Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/16645.

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29

Othman, Maslina. "Spectroscopic ellipsometry analysis of nanoporous low dielectric constant films processed via supercritical carbon dioxide for next-generation microelectronic devices." Diss., Columbia, Mo. : University of Missouri-Columbia, 2007. http://hdl.handle.net/10355/4879.

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Thesis (Ph.D.)--University of Missouri-Columbia, 2007.<br>The entire dissertation/thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file (which also appears in the research.pdf); a non-technical general description, or public abstract, appears in the public.pdf file. Title from title screen of research.pdf file (viewed on March 24, 2009) Vita. Includes bibliographical references.

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30

Wächtler, Thomas. "Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices." Doctoral thesis, Universitätsbibliothek Chemnitz, 2010. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-201000725.

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Copper-based multi-level metallization systems in today’s ultralarge-scale integrated electronic circuits require the fabrication of diffusion barriers and conductive seed layers for the electrochemical metal deposition. Such films of only several nanometers in thickness have to be deposited void-free and conformal in patterned dielectrics. The envisaged further reduction of the geometric dimensions of the interconnect system calls for coating techniques that circumvent the drawbacks of the well-established physical vapor deposition. The atomic layer deposition method (ALD) allows depositing f

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31

Wächtler, Thomas. "Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices." Doctoral thesis, Universitätsverlag der Technischen Universität Chemnitz, 2009. https://monarch.qucosa.de/id/qucosa%3A19323.

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Copper-based multi-level metallization systems in today’s ultralarge-scale integrated electronic circuits require the fabrication of diffusion barriers and conductive seed layers for the electrochemical metal deposition. Such films of only several nanometers in thickness have to be deposited void-free and conformal in patterned dielectrics. The envisaged further reduction of the geometric dimensions of the interconnect system calls for coating techniques that circumvent the drawbacks of the well-established physical vapor deposition. The atomic layer deposition method (ALD) allows depositing

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32

Alsaleem, Fadi M. "An investigation into the effect of the PCB motion on the dynamic response of MEMS devices under mechanical shock loads." Diss., Online access via UMI:, 2007.

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33

Ohta, Ricardo Luís. "Construção e caracterização de fotodetetores metal-semicondutor-metal (MSM)." Universidade de São Paulo, 2006. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-22072007-172649/.

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Este trabalho teve como objetivo principal a fabricação de fotodetetores do tipo Metal-Semicondutor-Metal (MSM) com corrente de escuro da ordem de 1 nA, responsividade da ordem de 0,1 A/W e razão fotocorrente/corrente de escuro de pelo menos 10. Estes valores asseguram que os fotodetetores obtidos tenham sensibilidade suficiente para serem utilizados em sensores ópticos integrados. Todos os materiais utilizados na construção dos fotodetetores MSM são compatíveis com processos convencionais de fabricação em microeletrônica, facilitando a integração com outros dispositivos em estado sólido. O se

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34

Terranova, Brandon. "Design and optimization of VCSEL-based optical interconnects on package." Diss., Online access via UMI:, 2009.

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35

Yang, Jin. "Quality inspection and reliability study of solder bumps in packaged electronic devices [electronic resource] : using laser ultrasound and finite element methods." Diss., Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26593.

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Consumer demands are driving the current trend in the microelectronics industry to make electronic products that are miniature, fast, compact, high-density, reliable and low-cost. The use of surface mount devices (SMDs) has helped to decrease the size of electronic packages through the use of solder bump interconnections between the devices and the substrates/printed wiring boards (PWBs). Solder bumps act as not only mechanical, but also electrical interconnections between the device and the substrate/PWB. Common manufacturing defects ¨C such as open, cracked, missing, and misaligned solder bu

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36

Osborn, Tyler Nathaniel. "All-copper chip-to-substrate interconnects for high performance integrated circuit devices." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/28211.

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Thesis (M. S.)--Chemical Engineering, Georgia Institute of Technology, 2009.<br>Committee Chair: Kohl, Paul; Committee Member: Bidstrup Allen, Sue Ann; Committee Member: Fuller, Thomas; Committee Member: Hesketh, Peter; Committee Member: Hess, Dennis; Committee Member: Meindl, James.

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37

Ткач, Олена Петрівна, Елена Петровна Ткач, Olena Petrivna Tkach та ін. "Акустоелектронний сенсор фізичних величин на поверхневих акустичних хвилях". Thesis, Сумський державний університет, 2018. http://essuir.sumdu.edu.ua/handle/123456789/67906.

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Розроблення сенсорних пристроїв на вітчизняному та світовому ринках є прогресивним напрямом в подальшому розвитку наноелектроніки. На основі поверхневих хвиль розроблена велика кількість сенсорів з високими показниками точності, що дозволяють вимірювати вагу, тиск, прискорення та ін. До переваг даних пристроїв можна віднести те, що вони створюються на основі елементів інтегральної електроніки, оптики та різноманітних мікроелектронних технологій і при цьому забезпечують контроль декількох фізичних величин. Проте актуальними залишаються питання пошуку нових матеріалів для підкладки та топології

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38

Thomas, Stuart R. "Solution processed metal oxide microelectronics : from materials to devices." Thesis, Imperial College London, 2013. http://hdl.handle.net/10044/1/22162.

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Owing to their many interesting characteristics, the application of metal oxide based electronics has been growing at a considerable rate for the past ten years. High performance, optical transparency, chemical stability and suitability toward low cost deposition methods make them well suited to a number of new and interesting application areas which conventional materials such as silicon, or more recently organic materials, are unable to satisfy. The work presented in this thesis is focussed on the optimisation of high performance metal oxide based electronics combined with use of spray pyrol

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39

Hou, Chih-Sheng Johnson. "An integrated microelectronic device for biomolecular amplification and detection." Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/38676.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2007.<br>Includes bibliographical references (p. 133-154).<br>The extraordinarily high sensitivity, large dynamic range and reproducibility of polymerase chain reaction (PCR) have made it one of the most widely used techniques for analyzing nucleic acids. As a result, considerable effort has been directed towards developing miniaturized systems for PCR, but most rely on off-chip optical detection modules that are difficult to miniaturize into a compact analytical system and fluorescent

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40

Cukalovic, Boris. "MIT integrated microelectronics device experimentation and simulation iLab." Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/36776.

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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2006.<br>Includes bibliographical references (p. 57-58).<br>We developed the MIT Integrated Microelectronics Device Experimentation and Simulation iLab, a new online laboratory that combines and significantly upgrades the capabilities of two existing online microelectronics labs: WebLab, a device characterization lab, and WebLabSim, a device simulation lab. The new integrated tool allows users to simultaneously run experiments on actual devices and simulations on the virtual ones, as

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41

Wei, Xiaojin. "Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices." Diss., Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/4873.

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A stacked microchannel heat sink was developed to provide efficient cooling for microelectronics devices at a relatively low pressure drop while maintaining chip temperature uniformity. Microfabrication techniques were employed to fabricate the stacked microchannel structure, and experiments were conducted to study its thermal performance. A total thermal resistance of less than 0.1 K/W was demonstrated for both counter flow and parallel flow configurations. The effects of flow direction and interlayer flow rate ratio were investigated. It was found that for the low flow rate range the par

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42

Foong, Andrew Jun Li. "Heat transfer and fluid flow characteristics of microchannels with internal longitudinal fins." Thesis, Curtin University, 2009. http://hdl.handle.net/20.500.11937/360.

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Electronic components generate large amount of heat during their operation, which requires to be dissipated. Over the past decade, internal heat generation levels have exponentially increased due to the compact packaging of high-powered microelectronic circuitry in modern devices. The efficient removal of this internally generated heat from microelectronic components is a critical design consideration for enabling optimum performance, and improving the operational reliability of modern high-performance electronic devices. Traditional cooling techniques such as fan-cooled heat sinks are grossly

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43

Wan, Kris Pui Yu. "Fabrication of protein and DNA-mediated devices : a potential application in microelectronics /." View Abstract or Full-Text, 2003. http://library.ust.hk/cgi/db/thesis.pl?CENG%202003%20WAN.

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44

Garst, Sebastian. "Design and production of polymer based miniaturised bio-analytical devices." Australasian Digital Thesis Program, 2007. http://adt.lib.swin.edu.au/public/adt-VSWT20071003.082618/index.html.

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Thesis (MEng) - Swinburne University of Technology, Industrial Research Institute Swinburne - 2007.<br>A thesis submitted for fulfillment of the requirement for the degree of Master of Engineering, Industrial Research Institute, Swinburne University of Technology - 2007. Typescript. Includes bibliographical references (p. 148-155).

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45

Sidek, Roslina. "Applications of Si/SiGe heterostructures to CMOS devices." Thesis, University of Southampton, 1999. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.286957.

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46

Madathil, Sankara Narayanan Ekkanath. "CMOS compatible lateral MOS controlled power devices for High Voltage Integrated Circuits." Thesis, University of Cambridge, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.240223.

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Wong, Terence Kin Shun. "Fabrication and characterization of ultrasmall tunnelling devices." Thesis, University of Cambridge, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.241122.

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48

Hoole, Andrew Charles Frederick. "Nanolithography and its application to the fabrication of electron devices." Thesis, University of Cambridge, 1993. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.308358.

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Qin, Zuxin. "Novel lateral MOS controlled power devices and technologies for power integrated circuits." Thesis, De Montfort University, 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.391477.

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Chang, Won Jae. "Design and fabrication of a novel electrostatic micromirror with high speed and large rotation angle." [Gainesville, Fla.] : University of Florida, 2005. http://purl.fcla.edu/fcla/etd/UFE0009060.

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