Relevant bibliographies by topics / Microelectronics Application Project

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Microelectronics Application Project'

Author: Grafiati
Published: 4 June 2021
Last updated: 5 February 2022

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Journal articles on the topic "Microelectronics Application Project"

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Denoyelle, Dirk. "Up Close: The Interuniversity Microelectronics Center (IMEC), Leuven, Belgium." MRS Bulletin 14, no. 6 (June 1989): 35–38. http://dx.doi.org/10.1557/s0883769400062692.

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The Interuniversity Microelectronics Center, Leuven, Belgium (IMEC) is one of the world's largest independent research centers for microelectronics. It was established in 1984 by the Flemish government as a part of a comprehensive program to promote high technology in Flanders, Belgium. Benefiting from existing experience available mainly at the University of Leuven, IMEC moved into its present facilities in 1986 (Figure 1).The Center covers a wide range of research topics in the microelectronics domain—VLSI systems design methodologies, advanced semiconductor processing, materials, packaging, and more.About 50 people work on computer-aided design, developing a series of “true” silicon compilers: CATHEDRAL. With this software, ASIC (application specific integrated circuit) design becomes extremely attractive, since CATHEDRAL covers design from the high system level down to layout.INVOMEC, the training division of IMEC, supports universities in ASIC design. It trains people for both educational institutes and industry in chip design, makes available the necessary software, and has a well-established Multi Project Chip—Multi Project Wafer service.The Processing Technologies and Materials Divisions involve about 200 people and have a 3,600 m2 clean room at their disposal. The clean room consists of a 20% class 10 area with a fast-turnaround prototyping line and an 80% class 1000 area.IMEC's objectives are: to perform research in the microelectronics field, supporting both industry and universities, and to stimulate the microelectronics industry in Flanders.IMEC performs research on both silicon and III-V technologies.
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Zapletina, M. A., D. V. Zhukov, and S. V. Gavrilov. "Boolean Satisfiability Methods for Modern Computer-Aided Design Problems in Microelectronics." Proceedings of Universities. ELECTRONICS 25, no. 6 (December 2020): 525–38. http://dx.doi.org/10.24151/1561-5405-2020-25-6-525-538.

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Currently, the methods based on a Boolean satisfiability (SAT) problem are one of the efficient approaches to solving the problem of Boolean matching and the equivalence checking of digital circuits. In combination with classic routing algorithms and optimization techniques, the SAT methods demonstrate the results exceeding the classic routing algorithms by the operation speed and the quality of obtained results. In the paper, the analysis of the modern practice of using the SAT methods in the CAD systems for VLSI has been performed. The examples of modern SAT approaches to the problems of the formal equivalence checking of digital circuits descriptions within the technological mapping framework and to the routing problem as a part of the FPGA design flow have been considered. The algorithm of the detailed routing of the FPGA switching blocks using the satisfiability problem has been developed and presented. The results of its work have been demonstrated on the example of the programmable logic block of the domestic made integrated circuit 5400TP094. The block has the island architecture, where the configurable logic blocks and switching blocks form a regularly repeated layout template. The properties of the chosen classic architecture permit to expand the region of presented algorithm to the entire class of island style FPGA. The algorithm has been tested on the project benchmarks ISCAS-85, ISCAS-89 and LGSynth-89. The comparison of the developed SAT-based algorithm with the well-known routing algorithm Pathfinder by criteria of the elapsed time and the achieved portion of routed nets in the switching blocks is presented. It has been determined that the considered Boolean satisfiability methods for the routing problem are capable to prove the circuit unroutability, unlike the algorithm Pathfinder which results can only implicitly indicate it. The paper demonstrates that the application of more efficient SAT solver significantly accelerates work of the suggested detailed routing algorithm.
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Yuriy Alekseevich, POLENOV, OGORODNIKOV Vitaliy Nikolaevich, and KISIN Aleksandr Yur’evich. "History of prospecting and development of deposits of quartz raw materials in the Urals and the prospect of their further use." NEWS of the Ural State Mining University, no. 2 (June 15, 2021): 48–59. http://dx.doi.org/10.21440/2307-2091-2021-2-48-59.

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Relevance of the work. For 60 years of hard work of quartz workers in the geological industry, Soviet geologists have fully provided the USSR industry for many years to come with piezoquartz and high-grade, highly pure quartz for the production of all types of quartz products. Much has changed over the years; and it became necessary to analyze the existing raw material base of Russia for quartz for smelting. Purpose of the work: analysis of the existing raw material base of Russia for quartz raw materials and the role of the deposits of quartz raw materials in the Ural region in solving this problem. Research methodology. The history of the use of quartz material as an industrial raw material and its application by the most developed countries of Europe is briefly outlined. It is shown that in the presence of various genetic types of quartz in the territory of Russia, the main deposits of highly pure quartz are located within the Ural region. The history of the complex and multiple reorganization of geological units that carried out prospecting, exploration, production and processing of all types of quartz raw materials from the Urals deposits is considered in detail. With the aim of centralization of exploration, mining operations, the production of industrial products from quartz and gemstones, scientific and project construction works in the Urals, the production association Uralkvartssamotsvety has been established since November 1, 1977. In terms of its technological equipment, the level of technology and organization of production, the achieved technical and economic indicators and allocations, the Uralkvartszamotsvety association was the flagship among the related associations of the USSR Ministry of Geology. Conclusions. Nowadays, the severe issue of the raw material base of quartz in Russia is the provision of the domestic industry with raw materials for the fusion of special transparent quartz glasses used primarily in microelectronics, fiber optics, and the production of high-intensity light sources. Ural had been and could continue to be the main supplier of raw materials and especially pure quartz. The reserves of these types of raw materials are significant, and the deposits are located in favorable economic and geographical areas.
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Lora-Tamayo, E., and M. D. Alvarez. "Up Close: Centra Nacional de Microelectrónica." MRS Bulletin 17, no. 3 (March 1992): 60–61. http://dx.doi.org/10.1557/s0883769400040914.

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The Spanish National Microelectronics Center (Centra Nacional de Microelectrónica or CNM), a nonprofit R&D institute, was established in 1985 through the joint efforts of the General Directorate of Science (Ministry of Education) and the General Directorate of Electronics and Computer Science (Ministry of Industry and Energy).As a scientific research center, the CNM belongs to the Spanish Science Research Council (Consejo Superior de Investigaciones Cientifícas, CSIC), but differs from other CSIC centers in two ways. CNM is a direct spinoff of a nationwide scientific and technological research program (Programa Nacional de Microelectrónica), and it has its own board of trustees with representatives from different ministries (Education, Industry and Energy, Defense, and Communications); from the local governments of Catalonia, Andalusia, and Madrid; and from microelectronics-related industries.CNM's activities are channeled toward promoting microelectronics in Spain through scientific and technological research on the design and fabrication of integrated circuits, electronic devices, and related materials, while providing technological support for industry and university research groups. The global objectives are as follows:∎ Establishment of stable quasi-industrial technologies in technological niches that permit good interaction between CNM and industry. Among those niches, fixed by Spain's national industrial policy, are application-specific integrated circuits (ASICs), power devices, semiconductor sensors, and molecular beam epitaxy (MBE) technologies and associated devices.∎ Startup of precise technological processes or new IC design techniques through cooperative research projects with industry and/or university groups that involve carrying out research and technology development tasks, renewing established technologies, and the continuing training of researchers.
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Polla, D. L., and L. F. Francis. "Ferroelectric Thin Films in Micro-electromechanical Systems Applications." MRS Bulletin 21, no. 7 (July 1996): 59–65. http://dx.doi.org/10.1557/s0883769400035934.

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Ferroelectric ceramic thin films fit naturally into the burgeoning field of microelectromechanical systems (MEMS). Microelectromechanical systems combine traditional Si integrated-circuit (IC) electronics with micromechanical sensing and actuating components. The term MEMS has become synonymous with many types of microfabricated devices such as accelerometers, infrared detectors, flow meters, pumps, motors, and mechanical components. These devices have lateral dimensions in the range of 10 μm–10 mm. The ultimate goal of MEMS is a self-contained system of interrelated sensing and actuating devices together with signal processing and control electronics on a common substrate, most often Si. Since fabrication involves methods common to the IC industry, MEMS can be mass-produced. Commercial applications for MEMS already span biomedical (e.g., blood-pressure sensors), manufacturing (e.g., microflow controllers), information processing (e.g., displays), and automotive (e.g., accelerometers) industries. More applications are projected in consumer electronics, manufacturing control, communications, and aerospace. Materials for MEMS include traditional microelectronic materials (e.g., Si, SiO2, Si3N4, polyimide, Pt, Al) as well as nontraditional ones (e.g., ferroelectric ceramics, shapememory alloys, chemical-sensing materials). The superior piezoelectric and pyroelectric properties of ferroelectric ceramics make them ideal materials for microactuators and microsensors.
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Urbina, Marina, Antonio Rinaldi, Santiago Cuesta-Lopez, Arcadii Sobetkii, Anca Elena Slobozeanu, Peter Szakalos, Yi Qin, et al. "The methodologies and strategies for the development of novel material systems and coatings for applications in extreme environments − a critical review." Manufacturing Review 5 (2018): 9. http://dx.doi.org/10.1051/mfreview/2018006.

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The aim of this paper is to present a critical analysis of existing methodologies, approaches and strategies used to develop materials systems and coatings for uses in extreme environments. The extreme or harsh conditions encompass a large variety of in-service forms such as: extreme temperatures, abrasion, corrosion, impact and radiation that can exist in various applications such as those associated with aerospace and aeronautical engineering, land and marine transport, manufacturing machinery, and even microelectronics products. This article describes how working environment and required service performance of a particular part or structure could affect the choice of materials and surfaces to which it is composed. In addition, the paper explains the relevance that abusive working environments have for industry, especially relating to their costs, being followed by an overview of surface deposition approaches that are currently popularly used to improve performance of mechanical devices that need to combat adverse conditions. Finally, a material system and three kinds of protective coatings that could be used in applications in extreme conditions are described. The critical review is an outcome of the strategic review from the EU H2020 SUPERMAT project which deals with materials and manufacture for the products/structural parts used in extreme conditions.
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Vogt, Holger, Frank Altmann, Sebastian Braun, Yusuf Celik, Lothar Dietrich, Dorothee Dietz, Marius van Dijk, et al. "HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, HiTEC (January 1, 2016): 000001–10. http://dx.doi.org/10.4071/2016-hitec-1a.

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Abstract Several applications in the fields of industrial sensors and power electronics are creating a demand for high operating temperature of 300 °C or even higher. Due to the increased temperature range new potential defect risks and material interactions have to be considered. As a consequence, innovation in semiconductor, devices and packaging technologies has to be accompanied by dedicated research of the reliability properties. Therefore various investigations on realizing high temperature capable electronic systems have shown that a multidisciplinary approach is necessary to achieve highly reliable solutions. In the course of the multi-institute Fraunhofer internal research program HOT-300 several aspects of microelectronic systems running up to 300 °C have been investigated like SOI-CMOS technology and circuits, silicon capacitor devices, a capacitive micromachined ultrasonic transducer (CMUT), ceramic substrates and different packaging and assembly techniques. A ceramic molded package has been developed. Die attach on different leadframe alloys were investigated using silver sintering and transient liquid phase bonding (TLPB). Copper and gold wire bonding was studied and used to connect the chips with the package terminals. Investigations in flip chip technology were performed using Au/Sn and Cu/Sn solder bumps for transient liquid phase bonding. High operating temperatures result in new temperature driven mechanisms of degradation and material interactions. It is quite possible that the thermomechanical reliability is a limiting factor for the technology to be developed. Therefore investigations on material diagnostics, reliability testing and modeling have been included in the project, complementing the technology developments.
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Magonski, Zbigniew. "Combustion Heat Meter." Journal of Microelectronics and Electronic Packaging 14, no. 3 (July 1, 2017): 100–107. http://dx.doi.org/10.4071/imaps.0531.

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Abstract In Memoriam—In memory of Dr. Zbigniew Magonski, a talented electronic engineer and inventor, was born in Glubczyce, Poland in 1950 and passed away in Cracow, Poland in 2017. He received M.Sc. degree in Solid State Technology from the Technical University of Wrocław, Poland in 1973, and PhD degree from the AGH University of Science and Technology, Cracow, Poland in 2000. For 15 years, he was with the R&D Center for Hybrid Microelectronics, Cracow Poland. At that time, his interest was focused on hybrid A/D, D/A converters also on DC HV power converters. Later, for 28 years, he was with the Department of Electronics, AGH University of Science and Technology, Cracow, Poland. His research interests covered ceramic microfluidic systems, hydrocarbon combustors, and high-temperature solid oxide fuel cells. In 1994–1995, he was with Summit Technology, Massachusetts, involved in a project relating to HV supplying of excimer lasers. He was a member of IMAPS US Chapter, the author of 13 patents and almost 50 technical papers connected with electronic technology. He was a caring husband and father and a good friend of many of us. We will miss you, Zbyszek. This article presents a proposal of a thermal instrument intended for the evaluation of heat energy of fluid fuels. Two thermal devices the flow meter and the combustor are the basic components of the instrument. The meter maintains a constant temperature in the vicinity of the combustion zone. The amount of heat energy in the fuel is calculated as the ratio of the electric power change expressed in Watts to the change of fuel supply delivered to the combustor within a time period of 1 s. The method enables a direct evaluation of fuel energy expressed in Joules per unit of mass or volume. For some applications, the meter may be a good alternative for a bulky bomb calorimeter.
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Yu, Y. D., R. Guan, K. H. Kuo, and H. Hashimoto. "A new sulphide Ag8S formed in the early stage of sulfurization of silver." Proceedings, annual meeting, Electron Microscopy Society of America 48, no. 4 (August 1990): 1086–87. http://dx.doi.org/10.1017/s0424820100178562.

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Metal sulphuration, like oxidation, is a basic problem in metal corrosion. For silver the sulphuration is more important than oxidation in materials engineering such as in microelectronic applications. In the present note, we report the formation of Ag8S prior to Ag2S, like copper and nickel oxidation, in the initial sulphuration stage.A block of 99.99% silver was rolled into sheets of about 50 μm thick and was then electrolytically thinned by the window method in dilute nitric acide. Then these films were sulphurated at 300°C in a tube with some trace sulphur left on the tube wall in a vacuum of about 10”4 Torr. The thin film was somewhat sulphurized and many microcrystallites grew up at the edge of the film. From the electron diffraction patterns it is clear that these crystallites are not silver, nor the Ag2S sulphide, indicating that they may belong to a new silver sulphide. Figure 1 is the low magnification electron microscopic images of these sulphide crystallites. Figure 2 shows its energy dispersive X-ray (EDS) peaks, indicating that it contains sulphur of about 2-3 wt%, which is much lower than the sulphur content (12.9 wt%) in Ag2S. Fig. 3 shows the HREM image in which region B is much thinner than region A and shows a higher resolution. The distance between the imaging spots in region B is half of that in region A. By analysing the EDPs and the HREM images we came to conclusion that the structure of the crystal is body- centered orthorhombic with a=0.59, b=0.64 and c=0.87 nm. Each unit cell has 16 Ag atoms and 2 S atoms. Fig.4 is the [010] projection of the structure. Fig.5a shows the magnified image of region A of Fig.3 and Fig.6a shows that of region B. Figs.5b and 6b show the simulated images which were obtained from the suggested model for Ag8S with thicknesses of 185A and 20A, respectively. The agreement between the observed and the calculated images is rather good indeed. Comparing Figs.5b and 6b with Fig.4, we can see that the imaging spots in Fig.5a correspond to the projected S atoms, while those in Fig.6a to the projected Ag atoms. In the thicker area (region A), only S atoms can be imaged as shown in Fig.5a, while in the thinner area (region B), Ag atoms can be observed as in Fig. 6a. This phenomenon can easily be made clear by the variation of the diffraction amplitudes of (400) and (004) planes with Ag atoms as the dominating scatters, and of (200), (002) and (101) planes with S atoms as the dominating scatters, as shown in Fig.7.
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Feng, J. L., C. Y. Yue, and K. S. Chian. "Synthesis and Characterization of the Bismaleimides Containing Aliphatic-ether Chain for Microelectronics Application." e-Polymers 6, no. 1 (December 1, 2006). http://dx.doi.org/10.1515/epoly.2006.6.1.580.

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AbstractThis project aims to develop and characterize a series of bismaleimide (BMI) polymers based on maleic anhydride and aliphatic-ether diamines. The effects of varying the chain length of aliphatic-ether diamines on the resultant bismaleimide systems were evaluated so that their suitability for microelectronics applications could be evaluated. The synthetic reaction and properties of the bismaleimide materials were investigated using Fourier Transform Infrared Spectroscopy (FTIR), Differential Scanning Calorimetry (DSC), Thermo- Gravimetric Analysis (TGA), Dielectric Thermal Analysis (DEA) and rheometry. Results showed that thermal, dielectric and rheological properties were all affected by the main chain length of BMI. The magnitude of the dielectric constant at 100 kHz increases with the increasing chain length. The curing peak temperature, curing heat and degradation temperature of BMI, all decrease with the increasing chain length.
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Dissertations / Theses on the topic "Microelectronics Application Project"

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Gupta, Viyas. "Analysis of single event radiation effects and fault mechanisms in SRAM, FRAM and NAND Flash : application to the MTCube nanosatellite project." Thesis, Montpellier, 2017. http://www.theses.fr/2017MONTS087/document.

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L’environnement radiatif spatial est un environnement sévère qui agit sur tout composants électroniques embarqués sur des engins spatiaux, y compris sous le bouclier naturel que nous procure le champ magnétique terrestre en orbite basse. Bien qu’il soit possible, en particulier à ces orbites, de se protéger efficacement contre les particules créant de la dose totale ionisante, cela pose plus de difficultés pour les particules générant des effets singuliers. Cela est d’autant plus un problème que l’utilisation des composants commerciaux (dits « COTS »), non conçus pour de telles applications, sont de plus en plus utilisés. Dans le cadre de cette thèse, les effets singuliers sur trois types de mémoires sont étudiés: SRAM, FRAM et NAND Flash. En se basant sur l’analyse des résultats de tests, les mécanismes d’erreurs induits par des particules générant des effets singuliers sont analysés. Avec pour objectif d’étudier et comparer la sensibilité de ces mémoires directement en orbite, l’expérience RES (Radiation Effect Study) a été développée et est présentée dans ce manuscrit. Cette expérience scientifique constituera la charge utile du nanosatellite de type CubeSat nommé MTCube (Memory Test CubeSat) developpé à l’Université de Montpellier en collaboration entre le Centre Spatial Universitaire Montpellier-Nîmes, et les laboratoires LIRMM et IES. Ce nanosatellite est financé par l’ESA (Agence Spatial Européenne)
Space radiation is a harsh environment affecting all electronic devices used on spacecraft, despite the presence of Earth’s protective magnetic field in Low Earth Orbit (LEO). Although particles inducing total ionizing dose (TID) can be effectively shielded against in LEO, particles responsible for Single Event Effects (SEEs) remain an issue for the reliability of electronics. This is particularly of concern considering the increasing use of Commercial-Off-The-Shelf (COTS) components, not designed for space applications. In the frame of this thesis, the SEE response of three commercial memory types are explored: SRAM, FRAM and NAND Flash. Based on SEE test results, the possible fault mechanisms induced by SEE particles on those devices are analysed. In order to study and compare the devices’ response with actual in-orbit measurements, the RES (Radiation Effect Study) science experiment was developed and is presented. The RES experiment will be the payload of the MTCube (Memory Test CubeSat) nanosatellite, which is being developed at the University of Montpellier as a joint project between the University Space Center (CSU Montpellier-Nîmes), as well as the LIRMM and IES laboratories. MTCube is financed by the European Space Agency (ESA)
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Books on the topic "Microelectronics Application Project"

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Northcott, Jim. Promoting innovation: Microelectronics applications projects. London: Policy Studies Institute, 1985.

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Promoting Innovation 2: Microelectronics Consultancy Support (Research Report). Policy Studies Institute, 1986.

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Promoting Innovation: Microelectronics Application Projects (PSI Reports). Policy Studies Institute, 1985.

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Book chapters on the topic "Microelectronics Application Project"

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Crean, G. M., N. Cordero, S. Lidholm, and M. O’Sullivan. "The EU Telematics Application Programme “MODEM” Research Project; A European Microelectronics Telematics Based Educational Initiative." In Microelectronics Education, 261–64. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-5110-8_60.

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Al-Sarawi, Said. "Application of Project/Problem-Based Learning in Microelectronics." In IFIP — The International Federation for Information Processing, 49–61. Boston, MA: Springer US, 2005. http://dx.doi.org/10.1007/0-387-30761-3_5.

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Nissen, Mark E. "Application Cases in Business." In Harnessing Knowledge Dynamics, 124–51. IGI Global, 2006. http://dx.doi.org/10.4018/978-1-59140-773-7.ch007.

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This chapter concentrates on knowledge-flow visualization and analysis in the for-profit business sector. We look first at an advanced-technology company involved with new-product development. The discussion turns then to examine an independent production company involved with a feature film. The third case involves a technology-transfer project between a university and a microelectronics company. In each case, we draw from secondary data sources for background. This should prove helpful to the reader who is interested in following up to consider more details than presented in this volume. We draw also from our own research and professional experience to fill in missing information, and we apply principles and techniques of this book to contribute new insights through examination of knowledge flows in the cases. Each application case concludes with exercises to stimulate critical thought, learning, and discussion.
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Conference papers on the topic "Microelectronics Application Project"

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Lobur, Mykhaylo, Petro Kosobutskyy, Ruslan Holovatskyy, Nazariy Jaworski, and Ihor Farmaga. "The Atomic-Force Microscope — Project of the CAD department of Lviv Polytechnic National University." In 2017 14th International Conference The Experience of Designing and Application of CAD Systems in Microelectronics (CADSM). IEEE, 2017. http://dx.doi.org/10.1109/cadsm.2017.7916161.

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Rumsby, Phil T., and Malcolm C. Gower. "Excimer laser projector for microelectronics applications." In Proc Int 91, edited by Bodil Braren. SPIE, 1991. http://dx.doi.org/10.1117/12.51024.

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Flachsbart, B. R., S. Prakash, J. Yeom, Y. Wu, G. Z. Mozsgai, Z. C. Leseman, K. Wong, et al. "Theory, Fabrication, and Characterization of MEMS Devices: An Interdisciplinary Course for Mechanical Engineers." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-13741.

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The need to provide students with hands-on instruction in the fabrication of Microelectromechanical Systems (MEMS) led to the development of an upper-undergraduate, introductory-graduate, laboratory course offered each spring in the Department of Mechanical Science and Engineering (MechSE). The laboratory is taught in a class 100 cleanroom located in, and operated by, the MechSE department. Fabrication and testing of two MEMS device projects, a piezoresistive membrane pressure sensor and a microfluidic logic chip, facilitate the teaching of standard fabrication procedures, fabrication tool operation, and cleanroom protocols. The course appeals across disciplines as evident by half the students coming from other departments (chemical engineering, chemistry, material science, physics, electrical engineering, aeronautical engineering, etc.). The course also serves to attract prospective graduate students as many students continue to use the cleanroom in their graduate level research. This course broadly covers MEMS fabrication theory while maintaining a focus on practical understanding and laboratory application of that theory. The lecture is tied closely to the laboratory work by covering the tool and procedure theory that is used in the lab each week. An exciting aspect of the course is the hands-on learning experience the students get by independently operating the fabrication equipment themselves, including metal deposition tools, reactive ion etch (RIE) tools, lithography tools (spinners, mask aligners, etc.), and bath etchers and cleaners. Safety is an important aspect of the course where students are tested on safety protocol, Material Safety Data Sheet (MSDS) and National Fire Protection Agency (NFPA) familiarity, personal protection procedures, etc. The students also learn benchmark fabrication procedures including standard cleaning protocols (with ultrasonics), the Bosch RIE etching of silicon microstructures, and anisotropic etching of silicon. The piezoresistive membrane pressure sensor project facilitates an understanding of the residual stresses involved in thin-film deposition, stress-strain relationships, and signal analysis for transduction mechanisms. The microfluidic logic chip project, a chip of logic gates (NAND, NOR, etc.) and a half-adder, facilitates understanding fundamental principles of microfluidics, the Navier-Stokes equation, and flow in microchannels. This course, originally sponsored by Intel Corporation, prepares Mechanical Engineers in a multi-disciplinary environment to learn both the practical fundamentals and the theoretical basis of basic and advanced microfabrication that goes beyond the usual CMOS fabrication theory and methodology taught in Electrical Engineering for the microelectronics bound students. As evident from its popularity, the course also serves to excite and equip students for the important Mechanical Engineering field of MEMS.
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Khandekar, Sameer, Manfred Groll, Vivak Luckchoura, Walter Findl, and Jun Zhuang. "Micro Heat Pipes for Stacked 3D Microelectronic Modules." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35109.

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In context of a European Commission funded project, development of a standardized multifunctional stacked 3D package was envisioned for potential applications in aviation, space and telecommunication sectors. The standardization and modularity was aimed to integrate packages from different technologies and to allow mutual slice inter-changeability. Thermal management solutions to the proposed new stacked 3D package as per the project specifications (a total of three stacked substrate slices, each slice of size 55 × 55 × 1 mm3 and total package height not exceeding 10.5 mm) are reported here. Three potential options were studied i.e. (a) module liquid cooling, (b) integration of miniature copper-water cylindrical heat pipes (OD 3.0 mm) with the 1.0 mm substrate slice and (c) development of flat plate heat pipes of 0.9 mm thickness. For options (a) and (b), initial tests have been performed taking aluminum as a representative material for AlSiC metal matrix composites which were to be employed in the final design. Further, copper based flat plate micro-structure conventional heat pipes have been developed and performance tested. Thermal interactions have been investigated with thermocouples coupled with infrared thermography. For safe operation up to 30W heating power (10W/slice), while thermal diffusion through the bare metallic substrate is sufficient for heat transfer from chip to the substrate, micro heat pipes should be employed to cool the substrate and transfer heat from it to an external cold plate. Flat plate heat pipes are advantageous for higher power levels per slice. Interlayer thermal interactions also affect the response of stacked 3D packages.
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Schmadecke, Ingo, Christian Leibold, Hans-Peter Bruckner, and Holger Blume. "Project-organized education: From FPGA prototyping to ASIC design: Consecutive microelectronic education in designing application-specific hardware." In 2013 IEEE International Conference on Microelectronic Systems Education (MSE). IEEE, 2013. http://dx.doi.org/10.1109/mse.2013.6566691.

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Globa, L. S., and T. M. Kot. "The Project Development and Support Tools." In 2007 9th International Conference - The Experience of Designing and Applications of CAD Systems in Microelectronics. IEEE, 2007. http://dx.doi.org/10.1109/cadsm.2007.4297594.

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Brenner, W., and N. Adamovic. "Thin-film CIGS solar modules for design driven applications in the frame of the FP7 NMP project SolarDesign." In 2015 38th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO). IEEE, 2015. http://dx.doi.org/10.1109/mipro.2015.7160252.

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Dudar, Zoya, and Alexander Medovoy. "Internet- projects Assessment Criteria Validity, Problems and Perspectives for Proceedings of International Conference CADSM 2007." In 2007 9th International Conference - The Experience of Designing and Applications of CAD Systems in Microelectronics. IEEE, 2007. http://dx.doi.org/10.1109/cadsm.2007.4297623.

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