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Relevant bibliographies by topics / Microheaters

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Academic literature on the topic 'Microheaters'

Author: Grafiati

Published: 4 June 2021

Last updated: 6 September 2023

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Journal articles on the topic "Microheaters"

1

Kharbanda, D. K., N. Suri, and P. K. Khanna. "Design, Fabrication and Characterization of Inter-Layer Microheaters Using LTCC Technology." ECS Journal of Solid State Science and Technology 11, no. 3 (March 1, 2022): 037002. http://dx.doi.org/10.1149/2162-8777/ac5a70.

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This paper presents design, fabrication and characterization of novel inter-layer microheaters based on low temperature co-fired ceramics (LTCC) technology. LTCC microheater structures (S1 to S3) with three different heater configurations has been presented. Microheater structure S1 has a heater pattern generated only on the top LTCC layer while S2 and S3 structures have inter-layer heater patterns. These structures have been simulated using COMSOL software to depict the temperature distribution over the active area. LTCC being a multilayer technology, heater patterns are generated in two different layers of LTCC tapes and connected through vias (3D interconnections) to fabricate inter-layer microheaters. By distributing the heater pattern of S1 equally in two LTCC tape layers (as in S3), this method allows possibility to develop miniature LTCC microheaters using conventional screen-printing process. The developed microheaters are characterized and the results are compared. At an input power of ∼1 W, structure S3 reaches a peak temperature of 316 °C as compared to 272 °C achieved with S1 configuration. Thermal imaging results shows better temperature uniformity in the active area for inter-layer microheaters as compared to microheater having heater pattern only on the top LTCC layer.

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Li, Dezhao, Yangtao Ruan, Chuangang Chen, Wenfeng He, Cheng Chi, and Qiang Lin. "Design and Thermal Analysis of Flexible Microheaters." Micromachines 13, no. 7 (June 29, 2022): 1037. http://dx.doi.org/10.3390/mi13071037.

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With the development of flexible electronics, flexible microheaters have been applied in many areas. Low power consumption and fast response microheaters have attracted much attention. In this work, systematic thermal and mechanical analyses were conducted for a kind of flexible microheater with two different wire structures. The microheater consisted of polyethylene terephthalate (PET) substrate and copper electric wire with graphene thin film as the middle layer. The steady-state average temperature and heating efficiency for the two structures were compared and it was shown that the S-shaped wire structure was better for voltage-controlled microheater other than circular-shaped structure. In addition, the maximum thermal stress for both structures was from the boundary of microheaters, which indicated that not only the wire structure but also the shape of micro heaters should be considered to reduce the damage caused by thermal stress. The influence resulting from the thickness of graphene thin film also has been discussed. In all, the heating efficiency for flexible microheaters can be up to 135 °C/W. With the proposed PID voltage control system, the response time for the designed microheater was less than 10 s. Moreover, a feasible fabrication process flow for these proposed structures combing thermal analysis results in this work can provide some clues for flexible microheaters design and fabrication in other application areas.

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Zhang, Lunjia, Pan Zhang, Ronghang Wang, Renchang Zhang, Zhenming Li, Wei Liu, Qifu Wang, Meng Gao, and Lin Gui. "A Performance-Enhanced Liquid Metal-Based Microheater with Parallel Ventilating Side-Channels." Micromachines 11, no. 2 (January 24, 2020): 133. http://dx.doi.org/10.3390/mi11020133.

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Gallium-based liquid metal can be used as a material for microheaters because it can be easily filled into microchannels and electrified to generate Joule heat, but the liquid metal-based microheater will suffer breakage induced by voids forming within the liquid metal when the temperature normally gets higher than 100 °C. To resolve this problem, a novel liquid metal-based microheater with parallel ventilating side-channels is presented. It consists of a liquid-metal heating channel and two parallel ventilating side-channels. The heating channel is connected with the side-channels by small gaps between polydimethylsiloxane (PDMS) posts. Experimental results show that this novel microheater can be heated up to 200 °C without damage. To explain its excellent performance, an experiment is performed to discover the development of the voids within the liquid-metal heating channel, and two reasons are put forward in this work on the basis of the experiment. Afterward pressing and bending tests are conducted to explore the mechanical stability of the novel microheaters. Finally, the microheaters are applied to warm water to show their good flexibility on non-flat surfaces. In consequence, the novel liquid metal-based microheater is believed to be widely applicable to soft micro-electro-mechanical system(MEMS) heating devices.

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Yang, Tzu-Sen, and Jin-Chern Chiou. "A High-Efficiency Driver Circuit for a Gas-Sensor Microheater Based on a Switch-Mode DC-to-DC Converter." Sensors 20, no. 18 (September 19, 2020): 5367. http://dx.doi.org/10.3390/s20185367.

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Low power consumption is one of the critical factors for successful Internet of Things (IoT) applications. In such applications, gas sensors have become a main source of power consumption because energy conversion efficiency of the microheater is relative over a wide range of operating temperatures. To improve the energy-conversion efficiency of gas-sensor microheaters, this paper proposes integrated switch-mode DC-to-DC power converter technology which we compare with traditional driving methods such as pulse-width modulation and the linear mode. The results indicate that energy conversion efficiency with this proposed method remains over 90% from 150 °C to 400 °C when using a 3.0, 4.2 and 5.0 V power supply. Energy-conversion efficiency increases by 1–74% compared with results obtained using the traditional driving methods, and the sensing film still detects alcohol and toluene at 200 °C and 280 °C, respectively, with high energy conversion efficiency. These results show that the proposed method is useful and should be further developed to drive gas-sensor microheaters, and then integrated into the circuits of the complementary metal-oxide-semiconductor micro electro mechanical systems (CMOS-MEMS).

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Partridge, P. G., G. Meaden, E. D. Nicholson, J. A. Nicholson, and M. N. R. Ashfold. "Diamond fibre microheaters." Materials Science and Technology 13, no. 7 (July 1997): 551–54. http://dx.doi.org/10.1179/mst.1997.13.7.551.

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Singh, Surinder, Alok Jejusaria, Jaspreet Singh, Munish Vashishath, and Dinesh Kumar. "Comparative study of titanium, platinum, and titanium nitride thin films for micro-elecrto mechanical systems (MEMS) based micro-heaters." AIP Advances 12, no. 9 (September 1, 2022): 095202. http://dx.doi.org/10.1063/6.0001892.

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This paper presents a comparative study of titanium (Ti), platinum (Pt), and titanium nitride (TiN) micro-electro mechanical systems based micro-heaters. In the present study, a common geometry and thin film thicknesses were selected to achieve comparable base resistances for all three microheater materials. Titanium, platinum, and titanium nitride thin films are deposited using DC magnetron sputtering, E-beam evaporation, and reactive DC magnetron sputtering techniques, respectively, and deposited thicknesses were verified using scanning electron microscopy. Mechanical properties such as Young’s modulus and hardness were also evaluated using nano-indentation. Later, the micro-heaters were fabricated, packaged, and characterized. The thermal coefficient of resistance (TCR) was found to be 4146, 2641, and 487 ppm/°C for Ti, Pt, and TiN micro-heaters, respectively. Power–temperature (P–T) characterization showed that the power required to reach the set temperature is comparable for all the above micro-heater materials. The TiN micro-heater exhibits a linear voltage–current (V–I) characteristic compared to platinum and titanium micro-heaters. The temperatures measured using infra-red imaging were comparable to those calculated by TCR measurements. Furthermore, thermal stability studies have been performed on all micro-heaters for 110 h. TiN microheaters were found to be more stable and resilient to external environmental conditions than Ti and Pt microheaters because of their lower TCR values.

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Gaiardo, Andrea, David Novel, Elia Scattolo, Michele Crivellari, Antonino Picciotto, Francesco Ficorella, Erica Iacob, et al. "Optimization of a Low-Power Chemoresistive Gas Sensor: Predictive Thermal Modelling and Mechanical Failure Analysis." Sensors 21, no. 3 (January 25, 2021): 783. http://dx.doi.org/10.3390/s21030783.

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The substrate plays a key role in chemoresistive gas sensors. It acts as mechanical support for the sensing material, hosts the heating element and, also, aids the sensing material in signal transduction. In recent years, a significant improvement in the substrate production process has been achieved, thanks to the advances in micro- and nanofabrication for micro-electro-mechanical system (MEMS) technologies. In addition, the use of innovative materials and smaller low-power consumption silicon microheaters led to the development of high-performance gas sensors. Various heater layouts were investigated to optimize the temperature distribution on the membrane, and a suspended membrane configuration was exploited to avoid heat loss by conduction through the silicon bulk. However, there is a lack of comprehensive studies focused on predictive models for the optimization of the thermal and mechanical properties of a microheater. In this work, three microheater layouts in three membrane sizes were developed using the microfabrication process. The performance of these devices was evaluated to predict their thermal and mechanical behaviors by using both experimental and theoretical approaches. Finally, a statistical method was employed to cross-correlate the thermal predictive model and the mechanical failure analysis, aiming at microheater design optimization for gas-sensing applications.

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Xu, Ruijia, and Yu-Sheng Lin. "Tunable Infrared Metamaterial Emitter for Gas Sensing Application." Nanomaterials 10, no. 8 (July 24, 2020): 1442. http://dx.doi.org/10.3390/nano10081442.

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We present an on-chip tunable infrared (IR) metamaterial emitter for gas sensing applications. The proposed emitter exhibits high electrical-thermal-optical efficiency, which can be realized by the integration of microelectromechanical system (MEMS) microheaters and IR metamaterials. According to the blackbody radiation law, high-efficiency IR radiation can be generated by driving a Direct Current (DC) bias voltage on a microheater. The MEMS microheater has a Peano-shaped microstructure, which exhibits great heating uniformity and high energy conversion efficiency. The implantation of a top metamaterial layer can narrow the bandwidth of the radiation spectrum from the microheater to perform wavelength-selective and narrow-band IR emission. A linear relationship between emission wavelengths and deformation ratios provides an effective approach to meet the requirement at different IR wavelengths by tailoring the suitable metamaterial pattern. The maximum radiated power of the proposed IR emitter is 85.0 µW. Furthermore, a tunable emission is achieved at a wavelength around 2.44 µm with a full-width at half-maximum of 0.38 µm, which is suitable for high-sensitivity gas sensing applications. This work provides a strategy for electro-thermal-optical devices to be used as sensors, emitters, and switches in the IR wavelength range.

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Zhao, Yiyuan, Henk-Willem Veltkamp, Thomas V. P. Schut, Remco G. P. Sanders, Bogdan Breazu, Jarno Groenesteijn, Meint J. de Boer, Remco J. Wiegerink, and Joost C. Lötters. "Heavily-Doped Bulk Silicon Sidewall Electrodes Embedded between Free-Hanging Microfluidic Channels by Modified Surface Channel Technology." Micromachines 11, no. 6 (May 31, 2020): 561. http://dx.doi.org/10.3390/mi11060561.

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Surface Channel Technology is known as the fabrication platform to make free-hanging microchannels for various microfluidic sensors and actuators. In this technology, thin film metal electrodes, such as platinum or gold, are often used for electrical sensing and actuation purposes. As a result that they are located at the top surface of the microfluidic channels, only topside sensing and actuation is possible. Moreover, in microreactor applications, high temperature degradation of thin film metal layers limits their performance as robust microheaters. In this paper, we report on an innovative idea to make microfluidic devices with integrated silicon sidewall electrodes, and we demonstrate their use as microheaters. This is achieved by modifying the original Surface Channel Technology with optimized mask designs. The modified technology allows to embed heavily-doped bulk silicon electrodes in between the sidewalls of two adjacent free-hanging microfluidic channels. The bulk silicon electrodes have the same electrical properties as the extrinsic silicon substrate. Their cross-sectional geometry and overall dimensions can be designed by optimizing the mask design, hence the resulting resistance of each silicon electrode can be customized. Furthermore, each silicon electrode can be electrically insulated from the silicon substrate. They can be designed with large cross-sectional areas and allow for high power dissipation when used as microheater. A demonstrator device is presented which reached 119.4 ∘ C at a power of 206.9 m W , limited by thermal conduction through the surrounding air. Other potential applications are sensors using the silicon sidewall electrodes as resistive or capacitive readout.

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Kalinin, Ivan A., Ilya V. Roslyakov, Dmitry N. Khmelenin, and Kirill S. Napolskii. "Long-Term Operational Stability of Ta/Pt Thin-Film Microheaters: Impact of the Ta Adhesion Layer." Nanomaterials 13, no. 1 (December 25, 2022): 94. http://dx.doi.org/10.3390/nano13010094.

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Microheaters with long-term stability are crucial for the development of a variety of microelectronic devices operated at high temperatures. Structured Ta/Pt bilayers, in which the Ta sublayer ensures high adhesion of the Pt resistive layer, are widely used to create microheaters. Herein, a comprehensive study of the microstructure of Ta/Pt films using high-resolution transmission electron microscopy with local elemental analysis reveals the twofold nature of Ta after annealing. The main fraction of Ta persists in the form of tantalum oxide between the Pt resistive layer and the alumina substrate. Such a sublayer hampers Pt recrystallization and grain growth in bilayered Ta/Pt films in comparison with pure Pt films. Tantalum is also observed inside the Pt grains as individual Ta nanoparticles, but their volume fraction is only about 2%. Microheaters based on the 10 nm Ta/90 nm Pt bilayers after pre-annealing exhibit long-term stability with low resistance drift at 500 °C (less than 3%/month).

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Dissertations / Theses on the topic "Microheaters"

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Lin, Wei-Chih. "Fabrication of zinc oxide nanostructures using microheaters." Thesis, University of Cambridge, 2013. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.648415.

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Henry, Christopher Douglas. "Nucleate pool boiling characteristics from a horizontal microheater array." College Park, Md. : University of Maryland, 2005. http://hdl.handle.net/1903/3185.

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Thesis (Ph. D.) -- University of Maryland, College Park, 2005.
Thesis research directed by: Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.

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Banerjee, Shomir. "A prototype on-chip microheater for disposable micro-PCR module." Cincinnati, Ohio : University of Cincinnati, 2002. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=ucin1038001719.

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Aslam, Muhammad. "Fabrication of a microheated thin film gas sensor array on polyimide membrane." Thesis, University of Manchester, 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.488419.

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Lin, Chong-Jheng, and 林崇正. "Design and Fabrication of Metal Silicide Microheaters." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/80271132610332126979.

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碩士
國立高雄應用科技大學
光電與通訊工程研究所
101
This study presents the design and fabrication of CMOS process compatible metal silicide microheaters. Metal silicide is an excellent candidate for the heating material of a microheater due to its high temperature stability, high CMOS process compatibility, and low electrical resistivity. In this work, the sheet resistance and the temperature coefficient of resistance of various metal silicide films at different annealed conditions were characterized. In addition, v-shaped three-dimensional heating structures were introduced into the design of the metal silicide microheaters in order to increase the surface area and enhance the mechanical strength of the devices. The material samples of metal silicides include titanium silicide, nickel silicide and titanium-nickel silicide. The material properties of metal silicides were characterized by SIMS and XRD, the thickness of material. The sheet resistance of titanium polycide is 0.975(Ω/□) and its has TCR 0.383(%/℃) at second RTA 900℃. The nickel silicide has sheet resistance 2.8(Ω/□) and TCR 0.29(%/℃) at first RTA 600℃. The results show that the TCR of metal silicides are higher than titanium (0.25%/℃) and platinum (0.25%/℃). Finally, the three-dimensional v-shaped structural metal silicide microheaters were fabricated successfully.

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Bhowmick, Shomnath. "INVESTIGATION OF PYROELECTRIC EFFECT GENERATED BY LITHIUM NIOBATE CRYSTALS INDUCED BY INTEGRATED MICROHEATERS." Tesi di dottorato, 2017. http://www.fedoa.unina.it/11809/1/Thesis_sbhowmick_29thcycle_ITEE.pdf.

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This thesis work focuses on the investigation of the pyroelectric effect from the –Z surface of Lithium (LiNbO3) crystal using different microheater (µH) designs fabricated on the +Z surface of the crystal. Thermal analyses of the microheater designs were performed both theoretically and experimentally using COMSOL™ Multiphysics and FLIR SC7000 thermocamera respectively. The pyroelectric effect was investigated analysing the current impulses detected using a metallic probe detector connected to an oscilloscope. The temperature variation induced by the microheater causes a spontaneous polarization in the crystal resulting in the formation surface bound charges. The electric field generated between the probe and the crystal surface causes the charge emission that appears as a voltage impulse on the oscilloscope. In an ambient condition, the air layer act as a dielectric thin film layer at few hundreds of microns between the detector probe and crystal surface gap spacing. It was demonstrated and validated that the threshold field strength require to generate the PE was near the dielectric breakdown of air. The pyroelectric emission shows a higher dependency on the rate of thermalization of the microheater and also the electric field generated between the probes to surface gap spacing’s of crystal. The deep characterization of µHs is investigated, in order to demonstrate the reliability and the effectiveness of these microdevices for all those applications where compact and low-power consuming electrical field sources are highly desirable.

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Kim, Samuel. "Novel Methods in Ball Bond Reliability Using In-Situ Sensing and On-Chip Microheaters." Thesis, 2012. http://hdl.handle.net/10012/7217.

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Wire bonding is the process of creating interconnects between the circuitry on a microchip and PCB boards or substrates so that the microchip can interact with the outside world. The materials and techniques used in this bonding process can cause a wide variation in bond quality, so wire bond reliability testing is very important in determining the quality and longevity of wire bonds. Due to the fact that microchips are encased in protective resins after bonding and their substrates attached to the larger device as a whole, once any single wire bond fails then it could jeapordize the entire device as the wire bonds cannot be individually replaced or fixed. Current methods of reliability testing are lengthy and often destroy the entire sample in the process of evaluation, so the availability of novel non-destructive, real-time monitoring methods as well as accelerated aging could reduce costs and provide realistically timed tests of novel wire bond materials which do not form Intermetallic compounds (IMCs) as rapidly as Au wire on Al substrates. In this thesis, five new chip designs for use in wire bond reliability testing are reported, focusing on the first joint made in a wire bond, called the ball bond. These chips are scaled either to test up to 55 test bonds simultaneously or just one at a time, introducing different requirements for microchip infrastructure capabilities, such as on-chip sensing/data bus, multiplexer, and switches able to operate under High Temperature Storage (HTS) which ranges from temperatures of 150-220 ??C. There are different heating requirements for each of these microchips, needing to be heated externally or containing on-chip microheaters to heat only the ball bond under test, and not the rest of the microchip or surrounding I/O pads. Of the five chip designs, sample chips were produced by an external company. Experimental studies were then carried out with two of these chip designs. They were specifically made to test novel methods of determining ball bond reliability using in-situ, non-destructive sensing, in real-time, while the ball bond undergoes thermal aging. Pad resistance as an analysis tool for ball bond reliability is proposed in this thesis as a new way of evaluating ball bond quality and allows for the testing of electrical connection without the need for specialized measurement probes or difficult bonding processes that contact resistance measurements require. Results are reported for pad resistance measurements of a ball bond under very high temperature storage (VHTS) at 250 ??C, a temperature exceeding typical HTS ranges to accelerate aging. Pad resistance measurements are taken using the four-wire measurement method from each corner of the bond pad, while reversing current direction every measurement to remove thermo-electric effects, and then calculating the average square resistance of the pad from this value. The test ball bond is aged using a novel on-chip microheater which is a N+ doped Si resistive heater located directly underneath the bond pad, and can achieve temperatures up to 300 ??C while not aging any of the I/O pads surrounding it, which are located ~180 ??m away. A 50 ??? resistor is placed 60 ??m away from the heater to monitor the temperature. The use of a microheater allows the aging of novel wire types at temperatures much higher than those permitted for microchip operation while thermally isolating the test bond from the sensing and power bonds, which do not need to be aged. Higher temperatures allow the aging process to be sped up considerably. The microheater is programmatically cycled between 250 ??C (for 45 min) and 25 ??C (for 15 min) for up to 200 h or until the pad resistance measurements fail due breakdown of the bonding pad. Intermetallic compounds forming between the ball bond and the pad first become visible after a few hours, and then the pad becomes almost completely consumed after a day. The pad resistance is measured every few seconds while the sample is at room temperature, and the increase in pad resistance agrees with the fact that Au/Al IMC products are known to have much higher resistance than both pure Au or Al. Also discussed are some aging results of Au wires and Pd coated Cu (PCC) wires bonded to Al bonding pads and aged at a temperature of 200 ??C in an oven for 670 h. The oven aged Au ball bonds also saw IMC formation on the surface of the bonding pad, much like the microheater tests. The PCC ball bonds became heavily oxidized due to lack of Pd on the surface of the ball, the wire portions did not oxidize much. In conclusion, the new structures have been demonstrated to age ball bonds faster than with conventional methods while obtaining non-destructive data. Specifically, the new microheater ages a test bond at an accelerated rate without having an observable effect on the I/O connections used to monitor the test bond. Pad resistance measurements correlate to the aging of the test bond and ensure the electrical integrity of the joint is checked.

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Jayaraman, Balaji. "Modular Design Of Microheaters, Signal Conditioning ASIC And ZnO Transducer For Gas Sensor System Platform." Thesis, 2011. https://etd.iisc.ac.in/handle/2005/2115.

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With the proliferation of industries world-wide, there is a growing need and interest in sensing and monitoring environmental pollutants and monitoring the concentration of chemicals/gases in industrial process control. There is also an increasing demand for chemical sensors in other applications such as home security, breath analysis and food processing. Design and development of metal-oxide based gas sensor system is reported in this thesis. The system consists of three components viz. micro heater(which aids inheating the sensor film to required temperatures), CMOS ASIC (the sensor interface circuit) and the thin film transducer(a semiconducting metal oxide thin film whose resistance changes with the concentration of the target gas). Microheaters were realized through PolyMUMPs process. Thermal characterization of surface-micromachined microheaters is carried out from their dynamic response to electrothermal excitations. An electrical equivalent circuit model is developed for the thermo-mechanical system. The mechanical parameters are extracted from the frequency response obtained using a Laser Doppler Vibrometer. The resonant frequencies of the microheaters are measured and compared with FEM simulations. The thermal time constants are obtained from the electrical equivalent model by fitting the model response to the measured frequency response. Microheaters with an active area of140m × 140m have been realized on two different layers(poly-1 andpoly-2) with two different air-gaps (2m and 2.75m). The effective time constants, combining thermal and mechanical responses, are intherangeof0.13msto0.22msforheatersonpoly-1,and1.9s to0.15ms for microheaters on poly-2 layer. The thermal time constants of the best microheaters are in the range of a few s, thus making them suitable for sensor applications that need faster thermal response. The mechanical deformation of the microheaters subjected to an electrothermal excitation, due to thermal stress, is also analyzed using lensless in-line digital holographic microscopy (DHM). The numerically reconstructed holographic images of the micro-heaters clearly indicate the regions under high stress. Double exposure method has been used to obtain the quantitative measurements of the deformations, from the phase analysis of the hologram fringes. The measured deformations correlate well with the theoretical values predicted by a thermo-mechanical analytical model. The results show that lensless in-line DHM with Fourier analysis is an effective method for evaluating the thermo-mechanical characteristics of MEMS components. A sensor interface circuit comprising a resistance-to-time period converter as the front-end circuit and a proportional temperature controller to control the microheater temperature is designed and realized in 130nm UMC CMOS technology. The impact of biasing the transistors in subthreshold versus saturation conditions on analog circuit performance is systematically analyzed. A cascode current mirror, designed in 130nm CMOS technology, is biased in subthreshold and saturation regions and its performance has been analyzed through rigorous analytical modeling. The analytical results have been validated with SPICE simulations. It is demonstrated that the subthreshold operation provides better performance in terms of linearity, power, area, output impedance and tolerance to temperature variation, making it a preferable option for applications such as signal conditioning circuitry for environmental sensors. On the other hand, biasing the circuit in saturation is preferable for applications like transceivers and data converters where high bandwidth, SNR and low sensitivity to process variations are the key requirements. Based on this analysis, a sensor interface circuit has been prototyped for resistance measurement on 130nm CMOS technology, using subthreshold cascode current mirrors as the key building blocks. This current mirror results in 14X lower power compared to above-threshold operation. The interface circuit spans 5 orders of magnitude of resistance, and consumes an ultra low power of 326W. A proportional temperature controller with an integrated on-chip power MOSFET is also realized on the same chip for heating and temperature control of microheaters. The microheater is reused as temperature sensor. The entire circuit works with 1.2V supply, except the power MOSFET and the heater driver circuit, which operate with 3.3V supply. ZnO, a semiconducting metal-oxide, is used as the sensing material. Thin films of ZnO are spin-coated over insulating substrates using sol-gel processing technique. Gold pads deposited over the sensing film act as electrodes. The sensor film is characterized at different temperatures for its sensitivity to ethanol. A peak response of 14% change in resistance is observed for 5ppm ethanol, at a working temperature of 275◦C.

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Jayaraman, Balaji. "Modular Design Of Microheaters, Signal Conditioning ASIC And ZnO Transducer For Gas Sensor System Platform." Thesis, 2011. http://etd.iisc.ernet.in/handle/2005/2115.

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With the proliferation of industries world-wide, there is a growing need and interest in sensing and monitoring environmental pollutants and monitoring the concentration of chemicals/gases in industrial process control. There is also an increasing demand for chemical sensors in other applications such as home security, breath analysis and food processing. Design and development of metal-oxide based gas sensor system is reported in this thesis. The system consists of three components viz. micro heater(which aids inheating the sensor film to required temperatures), CMOS ASIC (the sensor interface circuit) and the thin film transducer(a semiconducting metal oxide thin film whose resistance changes with the concentration of the target gas). Microheaters were realized through PolyMUMPs process. Thermal characterization of surface-micromachined microheaters is carried out from their dynamic response to electrothermal excitations. An electrical equivalent circuit model is developed for the thermo-mechanical system. The mechanical parameters are extracted from the frequency response obtained using a Laser Doppler Vibrometer. The resonant frequencies of the microheaters are measured and compared with FEM simulations. The thermal time constants are obtained from the electrical equivalent model by fitting the model response to the measured frequency response. Microheaters with an active area of140m × 140m have been realized on two different layers(poly-1 andpoly-2) with two different air-gaps (2m and 2.75m). The effective time constants, combining thermal and mechanical responses, are intherangeof0.13msto0.22msforheatersonpoly-1,and1.9s to0.15ms for microheaters on poly-2 layer. The thermal time constants of the best microheaters are in the range of a few s, thus making them suitable for sensor applications that need faster thermal response. The mechanical deformation of the microheaters subjected to an electrothermal excitation, due to thermal stress, is also analyzed using lensless in-line digital holographic microscopy (DHM). The numerically reconstructed holographic images of the micro-heaters clearly indicate the regions under high stress. Double exposure method has been used to obtain the quantitative measurements of the deformations, from the phase analysis of the hologram fringes. The measured deformations correlate well with the theoretical values predicted by a thermo-mechanical analytical model. The results show that lensless in-line DHM with Fourier analysis is an effective method for evaluating the thermo-mechanical characteristics of MEMS components. A sensor interface circuit comprising a resistance-to-time period converter as the front-end circuit and a proportional temperature controller to control the microheater temperature is designed and realized in 130nm UMC CMOS technology. The impact of biasing the transistors in subthreshold versus saturation conditions on analog circuit performance is systematically analyzed. A cascode current mirror, designed in 130nm CMOS technology, is biased in subthreshold and saturation regions and its performance has been analyzed through rigorous analytical modeling. The analytical results have been validated with SPICE simulations. It is demonstrated that the subthreshold operation provides better performance in terms of linearity, power, area, output impedance and tolerance to temperature variation, making it a preferable option for applications such as signal conditioning circuitry for environmental sensors. On the other hand, biasing the circuit in saturation is preferable for applications like transceivers and data converters where high bandwidth, SNR and low sensitivity to process variations are the key requirements. Based on this analysis, a sensor interface circuit has been prototyped for resistance measurement on 130nm CMOS technology, using subthreshold cascode current mirrors as the key building blocks. This current mirror results in 14X lower power compared to above-threshold operation. The interface circuit spans 5 orders of magnitude of resistance, and consumes an ultra low power of 326W. A proportional temperature controller with an integrated on-chip power MOSFET is also realized on the same chip for heating and temperature control of microheaters. The microheater is reused as temperature sensor. The entire circuit works with 1.2V supply, except the power MOSFET and the heater driver circuit, which operate with 3.3V supply. ZnO, a semiconducting metal-oxide, is used as the sensing material. Thin films of ZnO are spin-coated over insulating substrates using sol-gel processing technique. Gold pads deposited over the sensing film act as electrodes. The sensor film is characterized at different temperatures for its sensitivity to ethanol. A peak response of 14% change in resistance is observed for 5ppm ethanol, at a working temperature of 275◦C.

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Velmathi, G. "Integrated Gas Sensor - Studies On Sensing Film Deposition, Microheater Design And Fabrication, Interface Electronics Design And Testing." Thesis, 2012. https://etd.iisc.ac.in/handle/2005/2457.

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Recently, there has been an increasing interest in the electronics world for those aspects related to semiconducting gas sensor (SGS) materials. In view of the increasingly strict legal limits for pollutant gas emissions, there is a great interest in developing high performance gas sensors for applications such as controlling air pollution and exhaust gases in automotive industry. In this way, semiconductor gas sensors offer good advantages with respect to other gas sensor devices, due to their simple implementation, low cost and good stability and sensitivity. The first part of the thesis is dedicated to the synthesis, film structural and sensitivity study of the Tin Oxide film deposited by RF sputtering, doped with noble metal Palladium (Pd). Effects on the Gas Sensitivity due to the deposition parameters like thickness of the film, Substrate temperature, Ar /O2 ratio of the sputtering environment, annealing temperature and duration and doping metal weight % into the Tin Oxide films are studied and the results are shown in detail. The sensitivity and selectivity of the gas sensing film is decided by the operating temperature i.e. the temperature of the gas sensing film while it is in the target gas ambience, Microheaters happen to be the very important component in the gas sensor especially with wide band gap semiconducting metal oxides films such as tin oxide, gallium oxide or indium oxides. Other than gas sensing microheater also finds applications in many areas like thermal dip pen nanolithography, polymerase chain reaction (PCR), fluid pumping with bubbles, in vitro fertilization etc. So in this report due importance was given for the design and fabrication of the microheater. Microheaters are the most power consuming element of the integrated Gas sensors. This is also an important reason for the extensive microheater work in this research. Six different heater patterns were simulated by considering low power and temperature uniformity as an important goals. Among them the best three patterns named Double spiral, “Fan” Shape and “S” shape were chosen for fabrication and both thermal and electrical characterization results of them were presented in detail in the Microheater section of the thesis. It is believed that the intelligent design and integration of the electronic circuitry (for drive, signal conditioning/compensation, and read-out) with the gas sensing element can mitigate some of the significant issues inherent in solid-state gas sensors, such as strong temperature and humidity dependence, signal drift, aging, poisoning, and weak selectivity. The sensitivity of the gas sensors which has been indicated as the dynamic change of resistance in wide range should be read out properly. Towards this aim a low cast high efficient readout circuit is designed and implemented. Temperature monitoring and controlling is a key phenomenon in the metal Oxide based gas sensors since the selectivity mainly depends on the operating temperature of the sensing film. So focus was also shown on the design and implementation of the temperature monitoring and control unit, which been presented in the last part of this thesis.

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Books on the topic "Microheaters"

1

Fu, Rachel. Experimental validation of a microfluidic real time PCR device and the development of microheater applications. 2005.

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Book chapters on the topic "Microheaters"

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Scorzoni, Andrea, Pisana Placidi, Paolo Valigi, and Nicola Lovecchio. "Electro-Thermal Characterization and Modeling of a 4-Wire Microheater for Lab-on-Chip Systems." In Lecture Notes in Electrical Engineering, 117–25. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-11973-7_15.

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Das, Kaushik, and Priyanka Kakoty. "Design, Simulation, and Performance Evaluation of a High Temperature and Low Power Consumption Microheater Structure for MOS Gas Sensors." In Lecture Notes in Electrical Engineering, 221–29. New Delhi: Springer India, 2015. http://dx.doi.org/10.1007/978-81-322-2464-8_19.

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Das, Surajit, and Jamil Akhtar. "Comparative Study on Temperature Coefficient of Resistance (TCR) of the E-beam and Sputter Deposited Nichrome Thin Film for Precise Temperature Control of Microheater for MEMS Gas Sensor." In Physics of Semiconductor Devices, 495–97. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-03002-9_124.

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Roy, Sunipa, and Chandan Kumar Sarkar. "Microheaters for Gas Sensor." In MEMS and Nanotechnology for Gas Sensors, 87–115. CRC Press, 2017. http://dx.doi.org/10.1201/b18928-6.

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Conference papers on the topic "Microheaters"

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Hashim, Solehah Md, Umadevi Chandaran, and Zaini Abdul Halim. "Temperature sensor readout circuit for microheaters." In 2014 2nd International Conference on Electronic Design (ICED). IEEE, 2014. http://dx.doi.org/10.1109/iced.2014.7015821.

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Kang, Seok-Won, and Debjyoti Banerjee. "Investigation of Microcantilever Sensor for Explosive Detection." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-63930.

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In this study we investigate the use of microcantilever sensors for explosives detection. An array of microcantilevers consisting of gold (Au) and silicon nitride (Si3N4) thin-films of sub-micron thickness acts as a thermal bimorph. A microheater is fabricated in-situ at the base of each microcantilever in the array. When the microheaters are addressed individually using different actuation currents, each microcantilever undergoes thermo-mechanical deformation by different amounts which are then tracked individually by monitoring each reflected ray from a laser illuminating the array of microcantilevers. The threshold current values for the differential actuation of the microcantilevers are correlated with the auto-ignition temperature of a particular explosive (or combustible vapor) and its corresponding vapor pressure. In this study numerical simulations are also performed to study the variation of temperature, species concentration and deflection of individual microcantilevers as a function of actuation current.

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Londe, Ghanashyam, Anindarupa Chunder, Lei Zhai, and Hyoung J. Cho. "A Nanostructured Thermosensitive Smart Surface With Integrated Microheater for Wettability Control." In ASME 2008 International Mechanical Engineering Congress and Exposition. ASMEDC, 2008. http://dx.doi.org/10.1115/imece2008-68732.

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This paper describes the design and fabrication of a switchable thermosensitive polymer with an integrated microheater as a smart surface platform for wettabilty control. The thermoresponsive surface is synthesized on a glass substrate using the polymer poly(N-isopropylacrylamide) (PNIPAAm) which can change its wettability when subjected to change in temperature. PNIPAAm is hydrophilic when the surface temperature is less than the lower critical solution temperature (LCST) range of about 28–33 °C and is hydrophobic above the LCST range. The PNIPAAm surface is heated by spiral gold microheaters which are fabricated on the lower side of the glass substrate. The contact angle change with change in temperature is tested using a standard goniometer. Time response analysis of the surface is presented. This smart surface can be used as an active or adaptive component for microflow regulation and can be potentially integrated into large scale lab-on-chip (LOC) systems.

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Milanović, Veljko, Edwin Bowen, Nim Tea, John Suehle, Beverly Payne, Mona Zaghloul, and Michael Gaitan. "Convection-Based Accelerometer and Tilt Sensor Implemented in Standard CMOS." In ASME 1998 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1998. http://dx.doi.org/10.1115/imece1998-1289.

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Abstract This paper describes a CMOS implementation of novel accelerometers that operate based on heat convection, requiring no solid proof mass. The devices consist of microheaters and thermocouple or thermistor temperature sensors separated by a gap and placed in differential or bridge configurations. Temperature sensors measure the temperature difference between the two sides of the microheater caused by the effect of acceleration on free convection in the surrounding gas. The devices show a small linearity error of < 0.5% under tilt conditions from −90 to 90 degrees, and < 2% under acceleration from 0 g to 7 g. Sensitivity of the devices is also a nearly linear function of heater power (temperature). Sensitivity of up to 115 μV/g was measured for thermopile configuration, and up to 185 μV/g for thermistor configuration. Both types of devices are operable up to frequencies of several hundred hertz.

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Gaitas, Angelo, and Paddy French. "Magnetic microheaters for cell separation, manipulation, and lysing." In TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. IEEE, 2011. http://dx.doi.org/10.1109/transducers.2011.5969331.

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Brida, Sebastiano, Lorenza Ferrario, Flavio Giacomozzi, Domenico Giusti, Vittorio Guarnieri, Benno Margesin, Giorgio U. Pignatel, et al. "Development of silicon microheaters for chemoresistive gas sensors." In Design, Test, and Microfabrication of MEMS/MOEMS, edited by Bernard Courtois, Selden B. Crary, Wolfgang Ehrfeld, Hiroyuki Fujita, Jean Michel Karam, and Karen W. Markus. SPIE, 1999. http://dx.doi.org/10.1117/12.341164.

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Bhowmick, S., G. Coppola, G. Romano, A. Irace, M. Riccio, G. Breglio, M. Gioffrè, and M. Iodice. "Pyro-Electro-Thermal Analysis of LiNbO3 using Microheaters." In 2015 Fotonica AEIT Italian Conference on Photonics Technologies. Institution of Engineering and Technology, 2015. http://dx.doi.org/10.1049/cp.2015.0129.

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George, Naveen, and Ashok Srivastava. "Design, fabrication, and testing of polysilicon microheaters in silicon." In Micromachining and Microfabrication '96, edited by Michael T. Postek, Jr. and Craig R. Friedrich. SPIE, 1996. http://dx.doi.org/10.1117/12.250954.

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Al Zandi, Muaiyd, Changhai Wang, Rodica-Cristina Voicu, and Raluca Muller. "Testing and characterisation of electrothermal microgrippers with embedded microheaters." In 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP). IEEE, 2016. http://dx.doi.org/10.1109/dtip.2016.7514880.

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Jingyu Lu, Ting Xu, and Jianmin Miao. "Temperature control of microheaters for localized carbon nanotube synthesis." In 2010 IEEE 3rd International Nanoelectronics Conference (INEC). IEEE, 2010. http://dx.doi.org/10.1109/inec.2010.5424544.

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Reports on the topic "Microheaters"

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Kim, Jungho. Time and Space Resolved Heat Transfer - Boiling and Droplet Cooling Studies Using Microheaters. Droplet and Spray Cooling Heat Transfer. Fort Belvoir, VA: Defense Technical Information Center, April 2003. http://dx.doi.org/10.21236/ada416644.

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