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Relevant bibliographies by topics / Micromachined waveguide

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Academic literature on the topic 'Micromachined waveguide'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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Journal articles on the topic "Micromachined waveguide"

1

Gomez-Torrent, Adrian, and Joachim Oberhammer. "Micromachined Waveguide Interposer for the Characterization of Multi-port Sub-THz Devices." Journal of Infrared, Millimeter, and Terahertz Waves 41, no. 3 (2020): 245–57. http://dx.doi.org/10.1007/s10762-019-00663-4.

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AbstractThis paper reports for the first time on a micromachined interposer platform for characterizing highly miniaturized multi-port sub-THz waveguide components. The reduced size of such devices does often not allow to connect them to conventional waveguide flanges. We demonstrate the micromachined interposer concept by characterizing a miniaturized, three-port, 220–330-GHz turnstile orthomode transducer. The interposer contains low-loss micromachined waveguides for routing the ports of the device under test to standard waveguide flanges and integrated micromachined matched loads for terminating the unused ports. In addition to the interposer, the measurement setup consists of a micromachined square-to-rectangular waveguide transition. These two devices enable the characterization of such a complex microwave component in four different configurations with a standard two-port measurement setup. In addition, the design of the interposer allows for independent characterization of its sub-components and, thus, for accurate de-embedding from the measured data, as demonstrated in this paper. The measurement setup can be custom-designed for each silicon micromachined device under test and co-fabricated in the same wafer due to the batch nature of this process. The solution presented here avoids the need of CNC-milled test-fixtures or waveguide pieces that deteriorate the performance of the device under test and reduce the measurement accuracy.

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Ermolov, Vladimir, Antti Lamminen, Jaakko Saarilahti, Ben Wälchli, Mikko Kantanen, and Pekka Pursula. "Micromachining integration platform for sub-terahertz and terahertz systems." International Journal of Microwave and Wireless Technologies 10, no. 5-6 (2018): 651–59. http://dx.doi.org/10.1017/s175907871800048x.

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AbstractWe demonstrate a sub-terahertz (THz) and THz integration platform based on micromachined waveguides on silicon. The demonstrated components in the frequency range 225–325 GHz include waveguides, filters, waveguide vias, and low-loss transitions between the waveguide and the monolithic integrated circuits. The developed process relies on microelectromechanical systems manufacturing methods and silicon wafer substrates, promising a scalable and cost-efficient system integration method for future sub-THz and THz communication and sensing applications. Low-temperature Au/In thermo-compression and Au–Au laser bonding processes are parts of the integration platform enabling integration of millimeter-wave monolithic integrated circuits.

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Sun, Xiaofeng, Guifu Ding, Donghua Gu, Binhong Li, and Minyi Shen. "New micromachined interdigital coplanar waveguide." Microwave and Optical Technology Letters 49, no. 5 (2007): 1007–10. http://dx.doi.org/10.1002/mop.22336.

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Bowen, J. W., S. Hadjiloucas, B. M. Towlson, et al. "Micromachined waveguide antennas for 1.6 THz." Electronics Letters 42, no. 15 (2006): 842. http://dx.doi.org/10.1049/el:20061766.

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Weikle, Robert M., H. Li, A. Arsenovic, et al. "Micromachined Interfaces for Metrology and Packaging Applications in the Submillimeter-Wave Band." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (2017): 1–36. http://dx.doi.org/10.4071/2017dpc-tha3_presentation2.

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The continued emergence of new terahertz devices has created a need for improved approaches to packaging, integration, and measurement tools for diagnostics and characterization in this portion of the spectrum. Rectangular waveguide has for many years been the primary transmission medium for terahertz and submillimeter-wave systems operating from 300 GHz to 1 THz, with the UG-387 flange the most common interface for mating waveguide components over this frequency range. Alignment of UG-387 flanges is accomplished with pins and alignment holes that are placed around the flange perimeter and, under the standard MIL SPECS tolerances, misalignments of up to 6 mils (150 microns) are possible as a result of practical milling tolerances. With the emergence of vector network analyzers operating beyond 1 THz, such misalignment of waveguide mating flanges is not negligible and is recognized as a fundamental issue limiting calibration and measurement precision at frequencies greater than 300 GHz. In response to this issue, a number of new waveguide flange concepts have been investigated to reduce flange misalignment and the P1785 IEEE Standard was recently issued to recommend designs for waveguide interfaces at frequencies above 110 GHz. Among the new flange concepts being proposed is a modified UG-387 that utilizes tighter machining tolerances and the ring-centered flange where alignment is accomplished using a precision coupling ring that fits over raised bosses that are centered on each waveguide. This paper discusses the new interface concepts that are being developed to address waveguide flange misalignment as well as emerging micromachined interconnects, calibration standards and heterogeneous integration methods that are being applied to implement low-loss and high-performance circuit architectures for the terahertz frequency range. Among the technologies that will be described are (1) design and characterization methods for the new ring-centered waveguide standard, (2) micromachined waveguide components and calibration standards for the terahertz band, (3) silicon-based micromachined probe structures for direct-contact interfacing and metrology, and (4) epitaxial transfer of III-V semiconductor material onto high-resistivity silicon to realize a low-loss platform for integration of terahertz components. Details of the processing methods used to realize these components as well as measurement techniques for assessing their performance will be described.

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Lin, Chih-Peng, and Christina F. Jou. "New CMOS-Compatible Micromachined Embedded Coplanar Waveguide." IEEE Transactions on Microwave Theory and Techniques 58, no. 9 (2010): 2511–16. http://dx.doi.org/10.1109/tmtt.2010.2058552.

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Zhao, X. H., J. F. Bao, G. C. Shan, et al. "D-Band Micromachined Silicon Rectangular Waveguide Filter." IEEE Microwave and Wireless Components Letters 22, no. 5 (2012): 230–32. http://dx.doi.org/10.1109/lmwc.2012.2193121.

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Lihan Chen, A. Arsenovic, J. R. Stanec, et al. "A Micromachined Terahertz Waveguide 90$^{\circ}$ Twist." IEEE Microwave and Wireless Components Letters 21, no. 5 (2011): 234–36. http://dx.doi.org/10.1109/lmwc.2011.2127467.

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Chen, Zhang, Yingbin Zheng, Xiaoke Kang, Bin Lu, and Bohua Cui. "WR-2.8 Band Micromachined Rectangular Waveguide Filter." Journal of Infrared, Millimeter, and Terahertz Waves 34, no. 12 (2013): 847–55. http://dx.doi.org/10.1007/s10762-013-0028-x.

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Liu, Shuang, Jiang Hu, Yong Zhang, et al. "1 THz Micromachined Waveguide Band-Pass Filter." Journal of Infrared, Millimeter, and Terahertz Waves 37, no. 5 (2015): 435–47. http://dx.doi.org/10.1007/s10762-015-0229-6.

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Dissertations / Theses on the topic "Micromachined waveguide"

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Bugyik, Paul L. "Coplanar waveguide structures on micromachined glass substrates." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 2001. http://www.collectionscanada.ca/obj/s4/f2/dsk3/ftp05/MQ62700.pdf.

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Treen, Andrew S. "The fabrication and theoretical investigation of micromachined submillimetre-wave metal-pipe waveguide components." Thesis, University of Bath, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.296619.

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Shang, Xiaobang. "SU-8 micromachined terahertz waveguide circuits and coupling matrix design of multiple passband filters." Thesis, University of Birmingham, 2011. http://etheses.bham.ac.uk//id/eprint/3087/.

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This thesis presents the designs and measurement performance of nine SU-8 micromachined waveguide circuits operating at WR-10 band (75-110 GHz), WR-3 band (220-325 GHz) and WR-1.5 band (500-750 GHz). Two thick SU-8 photoresist micromachining processes, namely, the separate single-layer process and the joint two-layer process, are developed to fabricate these terahertz waveguide circuits. In order to achieve accurate and secure interconnections with measurement network analyzers, two calibrated measurement methods for micromachined waveguide circuits are proposed. The measurement performance of these micromachined circuits is excellent in terms of very low insertion loss. The design of multiple-passband filters using coupling matrix optimisation is also discussed in this thesis. The optimisation is performed on the coupling matrix and a genetic algorithm (GA) is employed to generate initial values for the control variables for a subsequent local optimisation (sequential quadratic programming - SQP search). The novel cost function presented in this thesis measures the difference of the frequency locations of reflection and transmission zeros between the response produced by the coupling matrix and the ideal response. An eighth-order X-band dual-band waveguide filter with all capacitive coupling irises is fabricated and measured to verify the design technique.

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Stickel, Micah T. "Silicon bulk micromachined waveguide resonators and filters /." 2006. http://link.library.utoronto.ca/eir/EIRdetail.cfm?Resources__ID=442447&T=F.

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Thesis (Ph. D.)--University of Toronto, 2006.<br>Source: Dissertation Abstracts International, Volume: 67-06, Section: B, page: 3357. Advisor: George Eleftheriades. Includes bibliographical references.

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Lin, Chih-Peng, and 林智鵬. "Characterization and Application of New Micromachined Embedded Coplanar-Waveguide." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/9263mm.

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博士<br>國立交通大學<br>電信工程研究所<br>101<br>A new robust micromachined embedded coplanar waveguide is proposed in the thesis. The central and ground plates are partially bended and overlapped within the trench. Due to tight coupling of the E-field between the overlapped plates, the micromachined embedded CPW line is capable of wide range characteristic impedance (17.9-92.3 Ω) with compact size. Furthermore, the area in which E-field radiates into the substrate of the micromachined embedded CPW is quite small compared to the conventional CPW, and therefore the dielectric loss of the micromachined embedded CPW can be effectively suppressed. Compared with the conventional CPW lines, the embedded CPW lines have shown a great reduction on loss, especially in low-impedance range. The micromachined embedded CPW lines on the high-resistivity silicon substrate (ρs = 15000 Ω-cm) achieve a measured loss as low as 0.81 dB/cm at 50 GHz. The Schwarz–Christoffel mapping technique is utilized to analysis the ECPW. The quasi-TEM transmission line parameters, resistance, inductance, conductance, and capacitance (RLGC), were also extracted and analyzed. Moreover, the micromachined embedded CPW line can fit well in the RF system-on-package applications. These features make micromachined embedded CPW a promising transmission line for RFICs application.

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Datesman, Aaron Michael. "Fabrication of a superconducting hot-electron bolometer receiver with micromachined waveguide components /." 2005. http://wwwlib.umi.com/dissertations/fullcit/3189316.

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7

Frid, Henrik. "On millimeter and submillimeter wave focal plane arrays implemented with MEMS waveguide switches." Licentiate thesis, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-197339.

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This thesis presents research towards enabling micromachined millimeter and submillimeter wave focal plane arrays (FPAs). The FPAs operate under the following principle: a switch network consisting of microelectromechanical (MEMS) switches, integrated with micromachined waveguides, is used to feed an array of antenna elements, located in the focal plane of a high-gain quasi-optical system. Hence, it is possible to switch between a set of narrow beams in different directions. Such beam steering systems are needed for future millimeter and submillimeter wave imaging and communication systems. The contributions to future MEMS-switchable FPAs presented here are organized in three papers, as described below. Paper I presents a criterion on the spacing between adjacent FPA elements which results in -3 dB overlap between the switched beams, for the special case when an extended hemispherical dielectric lens is used as the optical system. A key step towards this criterion is a closed-form relation between the scan angle and the FPA element's position, which results in an expression for the effective focal length of extended hemispherical lenses. A comparison with full-wave simulations demonstrates an excellent agreement with the presented theoretical results. Finally, it is shown that the maximum feasible FPA spacing when using an extended hemispherical lens is about 0.7 wavelengths. Paper II presents a numerical study of silicon-micromachined planar extended hemispherical lenses, with up to three matching regions used to reduce internal reflections. The effective permittivity of the matching regions is tailor-made by etching periodic holes in the silicon wafer. The optimal thickness and permittivity of the matching regions were determined using TRF optimization, in order to yield the maximum wide-band aperture efficiency and small side-lobes. We introduce a new matching region geometry, referred to as shifted-type matching regions, and it is demonstrated that using three shifted-type matching regions results in twice as large aperture efficiency as compared to using three conventional concentric-type matching regions. Paper III presents a submillimeter-wave single-pole single-throw (SPST) 500-750 GHz MEMS waveguide switch, based on a MEMS-reconfigurable surface inserted between two waveguide flanges. A detailed design parameter study is carried out to select the best combination of the number of horizontal bars and vertical columns of the MEMS-reconfigurable surface, for achieving a low insertion loss in the transmissive state and a high isolation in the blocking state. A method is presented to model the non-ideal electrical contacts between the vertical cantilevers of the MEMS surface, with an excellent agreement between the simulated and measured isolation. It is shown that the isolation can be improved by replacing an ohmic contact by a new, capacitive contact. The measured isolation of the switch prototype is better than 19 dB and the measured insertion loss is between 2.5 and 3 dB.<br>Denna avhandling presenterar forskning som syftar till att möjliggöra fokalplans-gruppantenner (FPAs) för våglängder i millimeter och submillimeterområdet. Principen för en sådan FPAs funktion är följande: ett nätverk bestående av mikroelektromekaniska (MEMS) switchar, används för att välja mellan de olika antenn-elementen i en gruppantenn, som placerats i fokalplanet av ett optiskt system. Därmed blir det möjligt att välja från en uppsättning av smala lober i olika riktningar. Sådana lob-styrningssystem behövs för framtida radar- och kommunikationssystem i millimeter och submillimeterområdet. Resultaten är uppdelade i tre vetenskapliga artiklar, som beskrivs nedan. I den första artikeln (Paper I) presenteras ett villkor för avståndet mellan närliggande FPA-element som resulterar i -3 dB överlappning mellan de switchade loberna, för specialfallet då en förlängd hemisfärisk lins används som optiskt system. Det viktigaste steget mot att hitta detta villkor är att bestämma en analytisk relation mellan avsökningsvinkeln och FPA-elementens position. Detta resulterar i ett uttryck för den effektiva fokallängden för denna typ av lins. En utmärkt överensstämelse har funnits mellan dessa relationer och simuleringar. Slutligen visas det att de största möjliga FPA-avstånden för en förlängd hemisfärisk lins är ungefär 0.7 våglängder, vilket uppnås för linser med låg permittivitet. I den andra artikeln (Paper II) presenteras en numerisk studie av plana förlängda hemisfäriska linser, som kan produceras från en kiselskiva. Linserna har upp till tre matchningsregioner, som används för att reducera interna reflektioner. Den effektiva permittiviteten av de matchande regionerna skräddarsys genom etsning av periodiska hål i kiselskivan. Den optimala tjockleken och permittiviteten av de matchande regionerna har bestämts med hjälp av TRF-optimering, för att ge maximal bredbandig direktivitet och minimala sidlober. En ny geometri introduceras för matchningsregionerna, som vi kallar matchningsregioner av skiftad typ. Vi visar att användning av tre matchningsregioner av skiftad typ resulterar i en dubbelt så hög apertur-effektivitet, jämfört med att använda tre konventionella matchningsregioner av koncentrisk typ. I den tredje artikeln (Paper III) presenteras en MEMS-switch för rektangulära vågledare, för frekvensområdet 500-750 GHz. Baserat på en designparameterstudie har den bästa kombinationen av antalet horisontella rader och vertikala kolumner hos den MEMS-konfigurerbara ytan valts ut, för att uppnå låga förluster i det öppna tillståndet och hög isolation i det blockerande tillståndet. I artikeln presenteras en metod för att modellera icke-perfekta elektriska kontakter mellan de fixerade och de rörliga delarna i MEMS-ytan. Denna metod uppvisar en utmärkt överensstämmelse mellan den simulerade och den uppmätta isolationen. Vi visara att isolationen kan förbättras med hjälp av en ny typ av kapacitiv kontakt. Den uppmätta isolationen hos den presenterade switch-prototypen är högre än 19 dB, och den uppmätta förlusten är mellan 2.5 och 3 dB.<br><p>QC 20161206</p>

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Shekhar, Sudhanshu. "Design, Fabrication and Characterization of Low Voltage Capacitive RF MEMS Switches." Thesis, 2015. http://etd.iisc.ernet.in/2005/3941.

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This dissertation presents the design, fabrication, and characterization of low-voltage capacitive RF MEMS switches. Although, RF MEMS switches have shown superior performance as compared to the existing solid-state semiconductor switches and are viable alternate to the present and the future communication systems, not been able to match the commercial standards due to their poor reliability. Dielectric charging due high actuation is one of the major concerns that limit the reliability of these switches. Hence, the focus of this thesis is on the development of low actuation voltage RF MEMS switches without compromising much on their RF and dynamic performances i.e., low insertion loss and high isolation. Four different switch topologies are studied and discussed. Electromechanical and electromagnetic modelling is presented to study the effect of various components that comprise a MEMS switch on the transient and the RF behaviour. The analytical expressions for switching and release times are established in order to estimate the switching and release times. An in-house developed surface micromachining process is adapted for the micro fabrication. This process eliminates the need for an extra mask used for the anchors and restricts the overall process to four-masks only. These switches are fabricated on 500 µm thick glass substrate. A 0.5 µm thick gold film is used as the structural material. For the final release of the switch, chemical wet etching technique is employed. The fabricated MEMS switches are characterized mechanically and electrically by measuring mechanical resonant frequency, quality factor, pull-in, and pull-up voltages. Since, low actuation voltage switches have slow response time. One of the key objectives of this thesis is to realize switches with fast response time at low actuation voltage. Measurements are performed to estimate the switching and release times. The measured Q-factors of switches are found to be in between 1.1 -1.4 which is the recommended value for Q in MEMS switches for a suppressed oscillation after the release. Furthermore, the effect of hole size on the switching dynamics is addressed. RF measurements are carried out to measure the S-parameters in order to quantify the RF performance. The measured results demonstrate that these switches need low actuation voltage in range of 4.5 V to 8.5 V for the actuation. The measured insertion loss less than -0.8 dB and isolation better than 30 dB up to 40 GHz is reported. In addition, the robustness of realized switches is tested using in-house developed Lab View-based automated measurement test set-up. The reliability test analysis shows no degradation in the RF performance even after 10 millions of switching cycles. Overall yield of 70 -80% is estimated in the present work. Finally, the experimentally measured results presented in this work prove the successful development of low actuation voltage capacitive RF MEMS switches and also offers that even with 0.5 µm thick gold film better reliability for MEMS switches can be achieved.

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Huang, Tsung-Hsing, and 黃崇信. "Analysis and Design of Micromachined Copalnar Waveguides (MCPWs)." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/91298639550007365798.

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碩士<br>華梵大學<br>機電工程研究所<br>90<br>The finite element method coupled with method of lines (FEM-MoL) is employed to rigorously investigate the propagation characteristics of a micromachined coplanar waveguide (MCPW). In the FEM-MoL analysis, the complex regions of the structure are appropriately modeled using finite element method, while the homogeneous regions are analyzed by method of lines. Since only some parts of the problem domain are needed to be discretized in two dimension by finite element method, while other parts are handled by one-dimensional discretization following the analysis of method of lines, the complex MCPW structure can be thus analyzed very efficiently by this method. Using this method, the propagation characteristics of a MCPW are fully studied. The results show that the MCPW has much lower line loss and higher phase velocity compared with the conventional CPW. It is also found that the finite-metallization thickness could be an important factor that affects the propagation characteristics of the MCPW.

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Books on the topic "Micromachined waveguide"

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Stickel, Micah T. Silicon bulk micromachined waveguide resonators and filters. 2006.

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2

United States. National Aeronautics and Space Administration., ed. Integrated optical interferometers with micromachined diaphragms for pressure sensing. University of Cincinnati, College of Engineering, Dept. of Electrical & Computer Engineering and Computer Science, 1996.

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Integrated optical micromachined pressure sensors with spectrally encoded output and temperature compensation: Final report : NASA grant NAG 3-1774. National Aeronautics and Space Administration, 1997.

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Conference papers on the topic "Micromachined waveguide"

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Weller, Thomas M., and Linda P. B. Katehi. "Compact stubs for micromachined coplanar waveguide." In 25th European Microwave Conference, 1995. IEEE, 1995. http://dx.doi.org/10.1109/euma.1995.337029.

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Vahidpour, M., and K. Sarabandi. "Micromachined J-band rectangular waveguide filter." In 2011 XXXth URSI General Assembly and Scientific Symposium. IEEE, 2011. http://dx.doi.org/10.1109/ursigass.2011.6050631.

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Shang, Xiaobang, Michael J. Lancaster, Maolong Ke, and Yi Wang. "Measurements of micromachined submillimeter waveguide circuits." In 2010 76th ARFTG Microwave Measurement Conference. IEEE, 2010. http://dx.doi.org/10.1109/arftg76.2010.5700055.

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Hu, Jiang, Shuang Liu, Yong Zhang, and Ruimin Xu. "Micromachined terahertz waveguide band-pass filters." In 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017. IEEE, 2017. http://dx.doi.org/10.1109/mwsym.2017.8058653.

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Shuang Liu, Jiang Hu, Zuhao Xuan, Yong Zhang, and Ruimin Xu. "Micromachined WR-1.0 waveguide band-pass filter." In 2016 IEEE International Conference on Microwave and Millimeter Wave Technology (ICMMT). IEEE, 2016. http://dx.doi.org/10.1109/icmmt.2016.7762496.

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Shi, Yanling, Zongsheng Lai, and Peisheng Xin. "Stress relaxation of the micromachined coplanar waveguide." In International Conference on Sensing units and Sensor Technology, edited by Yikai Zhou and Shunqing Xu. SPIE, 2001. http://dx.doi.org/10.1117/12.440196.

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Li, Yuan, Bo Pan, Manos M. Tentzeris, and John Papapolymerou. "A Fully Micromachined W-Band Coplanar Waveguide to Rectangular Waveguide Transition." In 2007 IEEE/MTT-S International Microwave Symposium. IEEE, 2007. http://dx.doi.org/10.1109/mwsym.2007.380233.

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Murad, N. A., M. J. Lancaster, Yi Wang, and M. L. Ke. "Micromachined rectangular coaxial line to ridge waveguide transition." In 2009 IEEE 10th Annual Wireless and Microwave Technology Conference: An IEEE Industry/Government (WAMICON). IEEE, 2009. http://dx.doi.org/10.1109/wamicon.2009.5207269.

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Campion, James, Umer Shah, and Joachim Oberhammer. "Silicon-Micromachined Waveguide Calibration Shims for Terahertz Frequencies." In 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019. IEEE, 2019. http://dx.doi.org/10.1109/mwsym.2019.8700929.

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Yun, Tae-Soon, Ki-Byoung Kim, Jong-Chul Lee, et al. "A LIGA Micromachined Balun with Coplanar Waveguide Structure." In 32nd European Microwave Conference, 2002. IEEE, 2002. http://dx.doi.org/10.1109/euma.2002.339267.

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Reports on the topic "Micromachined waveguide"

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Forman, Michael A. Low-loss LIGA-micromachined conductor-backed coplanar waveguide. Office of Scientific and Technical Information (OSTI), 2004. http://dx.doi.org/10.2172/920817.

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Backus, Sterling. Micromachined Hardened Waveguides for High-Harmonic Generation. Office of Scientific and Technical Information (OSTI), 2016. http://dx.doi.org/10.2172/1263620.

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