Journal articles: 'Microstrip circuits'

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Ye, Ming, Shaoguang Hu, Rui Wang, Yong Zhang, and Yongning He. "Microwave Corona Breakdown Suppression of Microstrip Coupled-Line Filter Using Lacquer Coating." Electronics 13, no. 15 (July 24, 2024): 2910. http://dx.doi.org/10.3390/electronics13152910.

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Due to its potential harm to space payload, microwave corona breakdown of microstrip circuits has attracted much attention. This work describes an efficient way to suppress corona breakdown. Since the corona breakdown threshold is determined by the highest electric field intensity at the surface of microstrip circuits, lacquer coating with a thickness of tens of microns is sprayed on top of microstrip circuits. The applied dielectric coating is used to move the discharge location away from the circuit’s surface, which is equivalent to reducing the highest electric field intensity on the interface of solid/air of the circuit and thus results in a higher breakdown threshold. Two designs of a classic coupled-line bandpass filter were used for verification. Corona experimental results at 2.5 GHz show that in the low-pressure range of interest (100 to 4500 Pa), a 5.3 dB improvement of the microwave corona breakdown threshold can be achieved for a filter with a narrowest gap of 0.2 mm, while its electrical performances like insertion loss and Q-factor are still acceptable. A threshold improvement prediction method is also presented and validated.

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Mandhare, M. M., S. A. Gangal, M. S. Setty, and R. N. Karekar. "Performance Comparison of Thin and Thick Film Microstrip Rejection Filters." Active and Passive Electronic Components 13, no. 1 (1988): 45–54. http://dx.doi.org/10.1155/1988/62434.

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A performance comparison of microstripline circuits using thin and thick film techniques has been studied, in which a Microstrip rejection filter, in the X-band of microwaves, is used as test circuit. A thick film technique is capable of giving good adhesive films with comparable d.c. sheet resistivity, but other parameters such as open area (porosity), particle size, and edge definition are inferior to thin-film microstrip filters. Despite this drawback, the average value of transmission, transmission loss, reflection coefficient, resonant rejection frequency, and quality factor for thick-film filters indicate that screen printed Ag films are intermediate between thin-film1,2,9and etched-thick-film9microstrip filters in performance, making it a feasible method for microstrip circuits.

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Mahor, Devesh Kumar, Atal Verma, Veerendra Singh Jadaun, and Pavan Kumar Sharma. "Enhancing the Performance of Microstrip Circuit Using Defected Ground Structure." International Journal of Engineering & Technology 1, no. 4 (August 19, 2012): 347. http://dx.doi.org/10.14419/ijet.v1i4.228.

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This paper focuses how to enhance the performance of microstrip circuits using DGS. A DGS is a defected ground structure where the ground plane metal of a microstrip circuit is intentially modified to enhance performance. Finally, the main application of DGS in microwave technology fields are summarized and the evolution trend of DGS is given.

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Siakavara, K., K. Koukouliantas, and P. Kouraklis. "Power loss and radiated field from microwave microstrip floating lines in resonance." Canadian Journal of Physics 82, no. 12 (December 1, 2004): 1053–66. http://dx.doi.org/10.1139/p04-050.

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Undesirable radiation from microstrip floating lines and discontinuities in printed circuit boards' circuits when they are under resonance is one of the serious problems that may affect the operation of the circuit and interfere with the operation of adjacent circuits as well. In the present work, an effort is made to calculate the power loss and the radiated field of a signal transmitted into various microstrip structures when it meets discontinuities and floating lines in resonance. The full-wave technique is used for the analysis and the results obtained give useful information about the values of the structure parameters for which the level of power loss becomes less. PACS Nos.: 84.40.Az, 84.40.Dc

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Oakley, Christopher, Premjeet Chahal, John Papapolymerou, and John D. Albrecht. "Fabrication of X-band Oscillator on LCP Substrate Using Aerosol Printing." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000052–55. http://dx.doi.org/10.4071/isom-2017-tp24_106.

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Abstract This paper presents a low-cost additive manufacturing method for rapid prototyping of millimeter and microwave circuits using aerosol jet printing of silver nanoparticle ink deposited on commercially available liquid crystal polymer (LCP) substrate material. Two passive circuit elements, a 50 Ω microstrip transmission line and a band-stop microstrip resonator, were designed, fabricated and measured. These passive elements form the basis of a printed X-band transistor-based oscillator circuit in which all metal layers have been printed, including metalized vias. Impacts of via metallization quality on oscillator performance are obtained by comparing measured data and designs. We conclude that printed metal quality (conductivity, roughness and uniformity) is an important fabrication issue for obtaining high-performance 3D printed circuits.

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Liew, Hui Fang, Syed Idris Syed Hassan, Mohd Fareq bin Abd Malek, Yufridin Wahab, Melaty Amirruddin, Ahmad Zaidi Abdullah, Muhammad Irwanto Misrun, Gomesh Nair Shasidharan, Mohd Irwan Yusoff, and Nurhakimah Mohd Mukhtar. "Design of Compact Composite Microstrip Low Pass Filter Using MEMS Technology." Applied Mechanics and Materials 754-755 (April 2015): 581–90. http://dx.doi.org/10.4028/www.scientific.net/amm.754-755.581.

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This paper presents the design technique of a compact composite microstrip filter operating at ultra high frequency (UHF) band and its fabrication using micro-electro mechanical system MEMS technology. The fringing compensation method is applied into the design of the microstrip line transformation from lumped element. The filter lumped circuits and microstrip line circuit were designed and simulated using Advanced Design Software (ADS) and fabricated on silicon substrates to obtain the best filter characteristic based on S-parameter. The measured and simulated results have achieved a good agreement within the frequency of interest. This shows that the fringing compensation method of transforming lumped element into microstrip line is able to solve the conventional design of complexity size of circuit of composite low pass filter (LPF) into microstrip line. The proposed filter design can replace the conventional filters in wireless communication as they offer better performance at lower cost in the RF microwave communication applications.

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Safwat, Amr M. E. "Letter-shaped microstrip ground slots." International Journal of Microwave and Wireless Technologies 4, no. 5 (May 16, 2012): 523–28. http://dx.doi.org/10.1017/s1759078712000426.

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This paper proposes a systematic approach for designing and modeling letter-shaped microstrip ground slots. Twenty-three structures are investigated. For each one, a geometrical circuit model is developed. Interestingly, 21 letters have unique s-parameters (electromagnetic [EM] print). Results are confirmed by EM simulations and measurements. These results may pave the way to new applications, e.g. microwave character recognition, letter-based microwave circuits, or new radio frequency identification (RFID) structures

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Smith, A., B. Dalrymple, A. Silver, R. Simon, and J. Burch. "Microstrip resonances in superconducting circuits." IEEE Transactions on Magnetics 23, no. 2 (March 1987): 796–99. http://dx.doi.org/10.1109/tmag.1987.1064982.

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Hannachi, Chaouki, Matthieu Egels, Phillipe Pannier, and Serioja Ovidiu Tatu. "Tolerance Considerations for MHMIC Manufacturing Process at Millimeter-Wave Band." Sensors 24, no. 8 (April 12, 2024): 2486. http://dx.doi.org/10.3390/s24082486.

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This paper investigates the manufacturing uncertainties at a 60 GHz millimeter-wave band for the monolithic hybrid microwave integrated circuits (MHMIC) fabrication process. It specifically deals with the implementation tolerances of thin-film gold microstrip transmission lines, titanium oxide thin-layer resistors, microstrip quarter-wavelength radial stubs, and active device implementation using the gold-bonding ribbons. The impacts of these manufacturing tolerances are assessed and experimentally quantified through prototyped MHMIC circuits. This allows us, on one hand, to identify the acceptable amount of dimensional variation enabling reasonable performances. On the other hand, it aims to establish a relationship between the manufacturing tolerances and the circuit parameters to provide more flexibility for the tolerance compensation and accuracy enhancement of the MHMIC fabrication processes.

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Sun, Hong Wei. "The Multiport Analysis of Microstrip Circuits Using Gaussian Green’s Function Method." Applied Mechanics and Materials 462-463 (November 2013): 636–42. http://dx.doi.org/10.4028/www.scientific.net/amm.462-463.636.

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The microstrip circuits are analyzed using the Gaussian Green’s function method (GGF) together with network analysis method. The main advantage of the GGF lies in its precision as well as rapid convergence. The multiport network analysis of microstrip circuits can effectively reduce the complexity of the modeling. A novel method is derived by combining of the multiport network analysis and GGF. To demonstrate the versatility of this method, the current distribution of two microstrip filter circuits is achieved by this method. The results are compared with the results of the commercial full-wave software of Ansoft Designer. It is shown that this method is much more accurate and valid.

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Nair, Deepukumar, Glenn Oliver, and Jim Parisi. "Qualification of Polyimide Based Coverlays for 900 MHz and 2.40 GHz Microstrip Antenna Applications." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 001078–80. http://dx.doi.org/10.4071/isom-2012-thp24.

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Organic coverlays are required to protect microstrip circuits in most applications. The presence of coverlay can potentially influence the performance of microstrip antennas. This paper describes the qualification of polyimide based coverlays for microstrip antennas both in 900 MHz and 2.50 GHz frequency bands. An Inverted F-shaped antenna fabricated on FR-4 dielectric is used as the test vehicle and two different coverlay materials are tested with respect to key parameters like resonant frequency, S11 bandwidth, antenna gain, frequency detuning, and radiation pattern. The data presented in this paper clearly indicates polyimide materials are well suited to cover microstrip antenna circuits with minimal impact on performance.

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Demirel, Salih, Filiz Gunes, and A. Kenan Keskin. "An UWB LNA Design with PSO Using Support Vector Microstrip Line Model." Journal of Applied Mathematics 2015 (2015): 1–10. http://dx.doi.org/10.1155/2015/374325.

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A rigorous and novel design procedure is constituted for an ultra-wideband (UWB) low noise amplifier (LNA) by exploiting the 3D electromagnetic simulator based support vector regression machine (SVRM) microstrip line model. First of all, in order to design input and output matching circuits (IMC-OMC), sourceZSand loadZLtermination impedance of matching circuit, which are necessary to obtain required input VSWR (Vireq), noise (Freq), and gain (GTreq), are determined using performance characterisation of employed transistor, NE3512S02, between 3 and 8 GHz frequencies. After the determination of the termination impedance, to provide this impedance with IMC and OMC, dimensions of microstrip lines are obtained with simple, derivative-free, easily implemented algorithm Particle Swarm Optimization (PSO). In the optimization of matching circuits, highly accurate and fast SVRM model of microstrip line is used instead of analytical formulations. ADCH-80a is used to provide ultra-wideband RF choking in DC bias. During the design process, it is aimed thatVireq= 1.85,Freq=Fmin, andGTreq=GTmaxall over operating frequency band. Measurements taken from the realized LNA demonstrate the success of this approximation over the band.

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13

JimÃ©nez, Alejandro DueÃ±as, and Francisco JimÃ©nez HernÃ¡ndez. "Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams." JOURNAL OF ADVANCES IN PHYSICS 5, no. 1 (August 2, 2014): 737–41. http://dx.doi.org/10.24297/jap.v5i1.1972.

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Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the â€œspeedsâ€ on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book â€œ2-D Electromagnetic Simulation of Passive Microstrip Circuitsâ€ from the corresponding author of this paper.

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Rossignol, J., D. Stuerga, G. Bailly, A. Harrabi, S. Girard, and S. Lalléchère. "Microwave microscopy applied to EMC problem: Visualisation of electromagnetic field in the vicinity of electronic circuit and effect of nanomaterial coating." Advanced Electromagnetics 6, no. 2 (May 20, 2017): 33. http://dx.doi.org/10.7716/aem.v6i2.429.

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This proposal is devoted to a collaborative approach dealing with microwave microscopy experiments. The application is dedicated to an electromagnetic field cartography above circuits and the influence of nanometric material layer deposition on the circuits. The first application is associated to a microstrip ring resonator. The results match with the simulated fields. The second application is focused on the effects of a dielectric layer deposited on the circuit and its impact in terms of electromagnetic propagation.

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Lakhlef, Ahcene, Arezki Benfdila, and Lounas Belhimer. "Capacitance study of integrated circuits matrix interconnects." Indonesian Journal of Electrical Engineering and Computer Science 22, no. 2 (May 1, 2021): 1156. http://dx.doi.org/10.11591/ijeecs.v22.i2.pp1156-1164.

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<span>Propagation delays and couplings between nearby lines affect the circuit performances (speed, power consumption) and operations. Propagation delays in longer lines can become critical compared to the clock frequency and can induce unwanted signals in neighboring lines ("crosstalk" phenomenon). Induced line capacitances can induce parasitic signals. Hence characterizing of these capacitances is of paramount importance. The present work deals with the analysis of capacitance of a multilayer conductor interconnect aiming for their possible exact extraction. We used three topologies of a microstrip conductor interconnects and identified the potential distributor and then computed the capacitance and inductance matrix using a finite element method. The first analysis dealt with parallel microstrip conductors and the second with two levels (plan) of a microstrip conductors the results are compared to those obtained by other methods and found quite encouraging.</span>

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Singh, Vimlesh, Priyanka Bansal, and P. K.Singhal. "Microstrip line Antenna Fabrication Material." International Journal of Engineering & Technology 7, no. 2.8 (March 19, 2018): 340. http://dx.doi.org/10.14419/ijet.v7i2.8.10437.

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This paper presents an extensive survey of electromagnetic materials used for antenna fabrication, which find application in Civilian life as well as defense life. When a densely packed microwave integrated circuit is designed, it requires protection from higher power transient because of specific polarization and frequency response. To meet specification of such kind of microwave circuits it is desired to exploit properties of fabricating materials, which are not found in nature but can be prepared with specific proportion of chemical element combination. This study provides in-depth responses of materials toward electromagnetic wave's characteristics such as dielectric, flexible electronics, electrical and thermal properties, which have vast potential in communication engineering.

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Sanchez-Soriano, Miguel A., Yves Quere, Vincent Le Saux, and Cedric Quendo. "Energy Recovery From Microstrip Passive Circuits." IEEE Access 4 (2016): 9716–23. http://dx.doi.org/10.1109/access.2016.2639294.

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18

Martel, J., R. R. Boix, and M. Horno. "Equivalent circuits for MIS microstrip discontinuities." IEEE Microwave and Guided Wave Letters 3, no. 11 (November 1993): 408–10. http://dx.doi.org/10.1109/75.248515.

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19

Sayre, C. L. "Microstrip Circuits for the Classroom Laboratory." IEEE Transactions on Education 28, no. 1 (February 1985): 28–31. http://dx.doi.org/10.1109/te.1985.4321727.

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Gardiol, Fred E. "Radiation from microstrip circuits: An introduction." International Journal of Microwave and Millimeter-Wave Computer-Aided Engineering 1, no. 2 (1991): 225–35. http://dx.doi.org/10.1002/mmce.4570010208.

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21

Wang, Shouxu, Xiaolan Xu, Guoyun Zhou, Yuanming Chen, Wei He, Wenjun Yang, Xinhong Su, and Yongshuan Hu. "Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process." Circuit World 44, no. 2 (May 8, 2018): 53–59. http://dx.doi.org/10.1108/cw-11-2017-0064.

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Purpose As a common transmission line, the microstrip line plays an important role in high-speed circuits. The purpose of this paper was to investigate the effects of the circuit design of microstrip lines on the signal integrity (SI). In addition, the influence of the type and thickness of the solder resist ink on SI was analyzed to provide guidance for the related producing process design of printed circuit boards (PCBs). Design/methodology/approach Microstrip line properties consisting of shape, line-width/line-space ratio, reference layer design and as-covered solder resist ink were designed to measure the insertion loss (S21) in high-speed PCB. Findings The study showed that the insertion loss (S21) of straight, meander, snake-shaped and wavy microstrip lines was approximately consistent. A microstrip line with width/space ratio less than 0.96 is necessary, as the differential line closing produces a mutual interference. Reference layer including the discontinuous area should be repaired by adjusting the microstrip line parameters. With regard to the solder resist ink, the insertion loss of novel solder resist ink decreased by 0.163 dB/in at 12.9 GHz and 0.164 dB/in at 14 GHz, compared with traditional solder resist ink. Accordingly, the insertion loss effectively improved at a lower thickness of solder resist. Originality/value This paper demonstrated that the common designing factors of line shape, line/space ratio, reference layer and solder resist influence microstrip line SI in the significant reference of designer-making PCB layout.

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Rabjohn, G., J. Wolczanski, and R. Surridge. "High-frequency wafer-probing techniques." Canadian Journal of Physics 65, no. 8 (August 1, 1987): 850–55. http://dx.doi.org/10.1139/p87-130.

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High-speed digital and microwave circuits have traditionally been tested by dicing wafers and mounting chips into high-frequency test carriers. This process is expensive, time consuming, and destructive. Methods of high-frequency measurement at the wafer stage are very desirable; for example, for wafer mapping, but conventional needle probes cannot be used because of their parasitics. New probe structures based on fine coaxial lines, vertically mounted microstrip lines, and tapered coplanar lines have been reported.For measurement at microwave frequencies (2–20 GHz), we have developed a geometry of a coplanar wave-guide probe that gives better than 10 dB return loss. Individual monolithic components can easily be measured and modelled for inclusion in a circuit simulation.For the measurement of digital circuits, especially those requiring several high-speed signal lines, we have used proprietary microstrip probes. Satisfactory operation up to about 2 Gbit∙s−1 has been observed, the upper bit rate being restricted by the inductance of the probe tip.Microwave-frequency and time-domain measurements of both types of probes have been made and will be discussed. Additionally, examples of the use of these probes for on-wafer measurements of digital and analog circuits will be given.

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Uyguroğlu, Rasime, Allaeldien Mohamed Hnesh, Muhammad Sohail, and Abdullah Y. Oztoprak. "Spurious radiation suppression in microstrip monopulse antenna." COMPEL - The international journal for computation and mathematics in electrical and electronic engineering 39, no. 4 (May 11, 2020): 791–99. http://dx.doi.org/10.1108/compel-10-2019-0384.

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Purpose This paper aims to introduce a new novel microstrip monopulse comparator system to reduce the spurious radiation from the comparator and the feed network for achieving better radiation performance. Design/methodology/approach Two substrate layers have been used for the microstrip monopulse comparator system. The feed network and the comparator circuits are on the first substrate layer and the microstrip array antenna is on the second layer. The elements of the array antenna are novel square four-sided narrow rectangular slot antennas built on a conducting plane. A commercially available computational software, CST microwave studio, has been used for the analysis of the system. Findings Two substrate layers have been used for the microstrip monopulse comparator system. The feed network and the comparator circuits are on the first substrate layer and the microstrip array antenna is on the second layer. The elements of the array antenna are novel square four-sided narrow rectangular slot antennas built on a conducting plane. A commercially available computational software, CST microwave studio, has been used for the analysis of the system. Practical implications The system is proposed for tracking moving targets. Originality/value Novel slot radiators are introduced as radiating elements in this paper. The antenna arrangement shields the comparator and the feed network circuits, reducing the spurious radiation significantly.

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Sun, Shangbin, Yuanxiang Chen, Jia Fu, Shangjing Lin, Hu Zhu, Xiaobo Zhao, and Jianguo Yu. "A Design of Wideband Microstrip-to-Microstrip Vertical Transition for RF Circuits." Journal of Physics: Conference Series 2209, no. 1 (February 1, 2022): 012018. http://dx.doi.org/10.1088/1742-6596/2209/1/012018.

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Abstract With the miniaturization of RF circuits, the transmission of signals in different layers becomes important. How to realize the vertical transition structure with wide transmission band and low loss has become the focus of research. In this paper, we proposed a broadband vertical transition structure design based on cavity coupling. This model achieves broadband coupling between the upper and lower microstrips by adding parabolic patches, which improves the model transmission bandwidth. The simulation results show that the optimized model has ultra-wideband transmission characteristic, the 1dB bandwidth is 3.32 GHz-10.42 GHz and the fractional bandwidth is more than 103%. What’ more, the thick ground layer of the model improves the heat dissipation performance. Therefore, this structure is very suitable for high-speed and high-density RF circuits.

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Han, Min, Chengzhi Wang, Chao Liu, Shuwen Xiao, Jianguang Ma, and Hui Sun. "A Wideband Microstrip-to-Waveguide Transition Using E-Plane Probe with Parasitic Patch for W-Band Application." Applied Sciences 12, no. 23 (November 28, 2022): 12162. http://dx.doi.org/10.3390/app122312162.

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The hollow metal waveguides are attractive components for millimeter-wave circuits owing to low loss. To integrate with the front-end circuit, a transition from microstrip line to waveguide is required. In this article, a microstrip-to-waveguide transition is presented in the W-band by using an E-plane probe with a parasitic patch. The probe is embedded into the waveguide along the center of the broad wall to excite the TE10 mode. A backshort-circuited waveguide with a quarter wavelength is used to obtain sufficient energy coupling and achieve good impedance matching. The additional parasitic patch can introduce a new resonance at a low frequency to enhance the working bandwidth. Hence, the proposed transition achieves wide working bandwidth and low insertion loss. For verification, a back-to-back transition is constructed and measured. The measured results indicate that the proposed transition has a wide working bandwidth covering the entire W-band. The measured reflection coefficient is below −13 dB from 70 to 110 GHz and the average insert loss is 1.1 dB. Attributed to wide working bandwidth and simple structure, the proposed transition is attractive for W-band circuit systems.

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Fan, Xiangsuo, Xiaokang Chen, Wenhao Xu, Lingping Feng, Ling Yu, and Haohao Yuan. "A Filtering Switch Made by an Improved Coupled Microstrip Line." Applied Sciences 13, no. 13 (July 5, 2023): 7886. http://dx.doi.org/10.3390/app13137886.

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In this paper, we propose a new filtering switch with excellent working performance made using an optimized coupled microstrip line. Upon analyzing the RF (radio frequency) front-end’s system structure, the switching device was simplified to a diode, which was connected to the microstrip circuit we designed to become a filter switch with both filtering and shutdown functions. First, we obtained an equivalent schematic of this filtering switch based on the relevant microstrip line theory. This switch consists of two coupled microstrip circuits, parallel-coupled feed lines and coupled-line stub-load resonators (CLSs), and a PIN diode. Second, the operating principle is described by the switching of the operating states, with ideal shutdown performance in the off state and considerable selectivity and excellent out-of-band rejection performance in the filtered state. Finally, a prototype filtering switch with a center frequency of 0.8 GHz was designed and tested. After subsequent optimization and improvement, the simulation and test performance results were noticeably consistent, consequently verifying the performance requirements of this filtering switch in two operating states in the center frequency band.

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Al-Mumen, Haider, and Ahmed Abdulkadhim Hamad. "Design and characterization of an RF reused energy system for nano-devices." Bulletin of Electrical Engineering and Informatics 11, no. 5 (October 1, 2022): 2595–602. http://dx.doi.org/10.11591/eei.v11i5.4321.

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In this work a simple, high conversion efficiency, and high output voltage energy harvesting device was designed and simulated. The harvesting device consists of microstrip antennas, matching and rectifier circuits. Both mono patch and array antennas are designed to be operated at 5.8 GHz. The simulation work was implemented using central standard time (CST) studio. Results showed an accepted return loss and high gain. To more elevate the device gain and then to obtain greater output energy, an array of microstrip antennas was designed. To convert the radio frequency (RF) energy to dc output voltage, a rectifier, which consists of a voltage doubter and schottky diodes was designed using advanced design system (ADS) simulator. Furthermore, to achieve 50 Ω impedance, a matching circuit was designed by adjusting the microstrip line patterns. The output voltage of the device was 6.2 V at input power 20 dBm and 560 Ω load resistance.

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Harms, P. H., and R. Mittra. "Equivalent circuits for multiconductor microstrip bend discontinuities." IEEE Transactions on Microwave Theory and Techniques 41, no. 1 (1993): 62–69. http://dx.doi.org/10.1109/22.210230.

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Chang, W. S., and C. Y. Chang. "Uniplanar microstrip periodic structure for microwave circuits." Electronics Letters 47, no. 8 (2011): 499. http://dx.doi.org/10.1049/el.2011.0301.

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Pribetich, P., Y. Combet, G. Giraud, and P. Lepage. "Quasifractal planar microstrip resonators for microwave circuits." Microwave and Optical Technology Letters 21, no. 6 (June 20, 1999): 433–36. http://dx.doi.org/10.1002/(sici)1098-2760(19990620)21:6<433::aid-mop11>3.0.co;2-1.

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Kumar, Akshay, Amarveer Singh, and Ekambir Sidhu. "Equivalent Circuit Modelling of Microstrip Patch Antenna (MPA) Using Parallel LCR Circuits." International Journal of Engineering Trends and Technology 25, no. 4 (July 25, 2015): 183–85. http://dx.doi.org/10.14445/22315381/ijett-v25p234.

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Mansoor Mahmood, Suhair, and Asaad M. Jassim Al-Hindawi. "Theoretical and Experimental Results of Substrate Effects on Microstrip Power Divider Designs." International Journal of Microwave Science and Technology 2011 (September 12, 2011): 1–9. http://dx.doi.org/10.1155/2011/980982.

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The effects of substrate materials on the design of microstrip power divider are investigated theoretically and experimentally. Three dielectric substrate materials, Duroid 3003, G10/FR4 epoxy Glass, and Duroid 3010, are chosen to be studied. A three-way two-stage power divider is designed at S-band frequency of 2.25 GHz and etched on each studied substrate separately. The substrate effects on the characteristics and performance of the microsrip circuits are studied taking into consideration the large difference in dielectric constant and the dissipation factor. The circuit designs presented here are analyzed using the Genesys CAD program and implemented and tested experimentally. The simulated and measured results are compared and discussed, and they indicate that significant changes in the characteristics of the microstrip power divider are observed.

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Srishti, Sneha, Siddhi Jain, and Rahul Gowda. "Design and Analysis of MSPA using FR-4 Epoxy Dielectric for Wireless Broadband Application." Middle East Research Journal of Engineering and Technology 3, no. 1 (January 21, 2023): 12–20. http://dx.doi.org/10.36348/merjet.2023.v03i01.003.

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In modern communication devices, microstrip patch antennas are preferred to conventional antennas due to their size. In this review, a survey of commonly used techniques and designs for microstrip antennas is conducted. These techniques and designs were used by the authors to design an effective, low-profile, small, compatible, and affordable microstrip antenna. They were mostly used to design reconfigurable, multiband, and wideband antennas. After that, a initiator patch design with dimensions is provided on which technique will be used to analyze various antenna parameters. In recent years, research into microstrip patch antennas has made significant progress. Microstrip patch horns outperform conventional microstrip patches in a number of ways, including their low cost, ease of integration with integrated microwave circuits (MICs), low volume, small size, high performance, and low weight.

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Benson, T. M. "Design, Fabrication and Test Techniques for Microstrip Transmission Lines." International Journal of Electrical Engineering & Education 23, no. 3 (July 1986): 231–37. http://dx.doi.org/10.1177/002072098602300307.

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The background to and methods for an experiment on the design, fabrication and test of microstrip circuits are presented. The experiment is intended to complement final year of undergraduate or M.Sc. level electromagnetics sections of Electrical and Electronic Engineering courses. The circuits are fabricated using p.c.b. techniques thus keeping costs to a minimum.

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El Gibari, Mohammed, and HongWu Li. "A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer Substrate." International Journal of Antennas and Propagation 2015 (2015): 1–7. http://dx.doi.org/10.1155/2015/481768.

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A comparative study between via-holed and via-free back-to-back GCPW-MS-GCPW (Grounded Coplanar Waveguide-Microstrip lines) transitions is reported in this paper. According to simulation results, both via-holed and via-free transitions on commercial benzocyclobutene polymer 20 µm film show a bandwidth over 57 GHz. Bandwidth of optimized via-holed transitions increases with the via-hole diameter, up to 75 GHz with 300 μm via-hole diameter. The via-hole free transition achieves experimentally an ultrabroadband from 2 GHz to 78 GHz with an insertion loss of only 0.5 dB thanks to the copper metallization thickness of 2 μm. In addition, these measurement results are in perfect agreement with the simulation results. These via-free and via-holes transitions are very useful and requested in component packaging, on-wafer measurements of microstrip based microwave integrated circuits, and also the interconnections in hybrid circuits including both microstrip and coplanar structures.

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Fu, Chao, Wenrao Fang, Ruyu Fan, Lulu Wang, Wenhua Huang, Yuchuan Zhang, and Changkun Liu. "Design and Implementation of Low Parasitic Inductance Bias Circuit for High-Power Pulsed Power Amplifiers." Electronics 12, no. 6 (March 17, 2023): 1430. http://dx.doi.org/10.3390/electronics12061430.

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This article presents a wideband bias circuit with low parasitic inductance for high-power pulsed amplifiers. The proposed bias circuit works similarly to the traditional bias circuit in that it can ensure the transmission of microwaves from the power amplifier to the load while preventing the transmission of microwaves from the power amplifier to the power supply. By making the bias line shorter and the transmission line wider than the traditional bias circuit, the proposed bias circuit reduces its parasitic inductance. The reduction of parasitic parameters is critical for reducing the drain voltage overshoot of the high-power pulse power amplifier and ensuring its safety. The simulation results demonstrate that the proposed bias circuit has a lower parasitic inductance and a wider bandwidth. To validate the theory and simulation results, the traditional and the proposed bias circuits are fabricated using microstrip circuits. Both the simulation and experimental results indicate that the proposed bias circuit has a one-third lower parasitic inductance than the traditional bias circuit. Furthermore, the proposed bias circuit has a wider bandwidth.

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Woonghwan Ryu, Seung-Ho Baik, Hyungsoo Kim, Jonghoon Kim, Myunghee Sung, and Joungho Kim. "Embedded microstrip interconnection lines for gigahertz digital circuits." IEEE Transactions on Advanced Packaging 23, no. 3 (2000): 495–503. http://dx.doi.org/10.1109/6040.861566.

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Chinglung Chen, Ming-Ju Tsai, and N. G. Alexopoulos. "Optimization of aperture transitions for multiport microstrip circuits." IEEE Transactions on Microwave Theory and Techniques 44, no. 12 (1996): 2457–65. http://dx.doi.org/10.1109/22.554578.

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39

Oberschmidt, G., C. Metz, and A. F. Jacob. "Efficient simulation of microstrip circuits using adapted wavelets." IEE Proceedings - Microwaves, Antennas and Propagation 145, no. 4 (1998): 354. http://dx.doi.org/10.1049/ip-map:19982060.

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Kozlov, Dmitry, Alexey P. Shitvov, Senad Bulja, Ross Lundy, Pawel Rulikowski, Kevin Nolan, and Ryan Enright. "Practical Mitigation of Passive Intermodulation in Microstrip Circuits." IEEE Transactions on Electromagnetic Compatibility 62, no. 1 (February 2020): 163–72. http://dx.doi.org/10.1109/temc.2018.2885961.

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Voltmer, David R. "Comments on ``Microstrip Circuits for the Classroom Laboratory''." IEEE Transactions on Education E-29, no. 1 (February 1986): 42. http://dx.doi.org/10.1109/te.1986.5570686.

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42

Hill, A., J. Burke, and K. Kottapalli. "Three-dimensional electromagnetic analysis of shielded microstrip circuits." International Journal of Microwave and Millimeter-Wave Computer-Aided Engineering 2, no. 4 (1992): 286–96. http://dx.doi.org/10.1002/mmce.4570020410.

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Shang, Yuqiu, Qingsheng Zeng, Qian Wang, Xinwei Wang, Gengqi Zheng, and Feng Shang. "The Design of Miniature Frequency Reconfigurable Antenna Based on Inductive Loading Technology." International Journal of RF and Microwave Computer-Aided Engineering 2023 (November 23, 2023): 1–9. http://dx.doi.org/10.1155/2023/2913342.

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A circularly polarized (CP) and frequency reconfigurable microstrip antenna with loading inductive is presented in this paper. The designed antenna is comprised of a radiating patch, four short-circuited grounded metal posts, and four coupling branches. Each coupling branch has an end that is coupled to the shorted ground post and is also connected to the parasitic branches by means of a group of PIN diodes. By controlling the state of the PIN diodes connected to each parasitic branch, the working resonant frequency of the antenna can be changed. In order to further understand the mechanisms of operation of the antenna, the equivalent circuit model was built, and the circuit model of the antenna was analyzed, and this analysis was used for the development of the frequency reconfigurable microstrip patch antenna. Furthermore, the parameters of specific equivalent circuits can be solved by the three lengths of branch. Meanwhile, the calculated results derived from the given resonant frequency formula for the antenna are in good agreement with the simulation results of the antenna. Simulated results for the input impedance of the antenna are also in good agreement with the calculated values for the equivalent circuit. Finally, the antenna is fabricated and measured, and the measured results show that the antenna can not only achieve frequency reconfiguration at 1.14 GHz, 1.21 GHz, and 1.39 GHz but also accord well with the simulation value, while maintaining a compact size.

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Jyothi, K. D., P. Bala Srinivas, and S. Kumar. "A Soft Computing Techniques Analysis for Planar Microstrip Antenna for Wireless Communications." International Journal of Electrical and Electronics Research 10, no. 3 (September 30, 2022): 466–69. http://dx.doi.org/10.37391/ijeer.100310.

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The use of neural-network computational modules for radio frequency and microwave modelling and design has lately gained popularity as an uncommon but useful technique for this type of modelling and design. It is possible to train neural networks to study the behaviour of active and passive mechanisms and circuits. In this study, technologists will learn about what neural networks are and how they can be used to model microstrip patch antennas. An artificial neural network is used in this work to investigate in depth several designs and analysis methodologies for microstrip patch antennas. Various network structures are also discussed in this study for wireless communications. Microstrip antenna design has been presented and the use of ANN in microstrip antenna design are also shown in this article.

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Ilnitskyi, L. Ya, O. A. Shcherbyna, M. Yu Zaliskyi, I. I. Mykhalchuk, and O. V. Kozhokhina. "POWER SUPPLY OF RING ANTENNA USING DIRECTIONAL COUPLERS." Radio Electronics, Computer Science, Control, no. 3 (September 28, 2023): 6. http://dx.doi.org/10.15588/1607-3274-2023-3-1.

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Context. The circular polarization of radio waves is used in various electronic systems. This includes, for example, space communications stations, some radio relay communication systems, radar stations, data transmission systems and others. The characteristics of radio wave propagation are studied by using electromagnetic waves separated by circular orthogonal polarization in radiomonitoring and radiocontrol systems. Compared to other antenna types, circularly polarized antennas, such as rings, have superior design simplicity and excellent electrodynamics properties. Objective. The objective of this study is to analyse the characteristics and application of directional microstrip couplers for supplying power to ring antennas. Method. To better the performance of microstrip ring antennas, the reasons for their limited operating frequency range are analysed. These causes include the frequency-dependent parameters of the coupler, errors in calculating the directional coupler circuit, and radiation from asymmetric strip lines. To understand how supply lines, affect antenna characteristics, correlations between radiation fields determined in both its coordinate system and that of the primary axis are taken into account. Results. An analysis of the dependence graphs of the main characteristics of ring microstrip antennas with intricate power supply circuits for directional couplers and comparison with similar characteristics for simple circuits revealed that the shape of the radiation pattern in the higher radiation hemisphere became symmetrical about the axis, especially when symmetrically supplying the ring with branch-line couplers. The frequency band has also widened, at which there was an acceptable degree of deviation in the ellipticity coefficient from unity. Conclusions. The simulation results of microstrip ring antennas with power lines connected to directional couplers of different types showed that supplying the ring antenna with electricity via the directional coupler ensures circular polarization for the emitted electromagnetic waves. Additionally, the range of operating frequencies where there is only a small discrepancy in ellipticity coefficient remains at an acceptable level of –3 dB is quite broad. By utilizing directional branch-line couplers to power a ring antenna, it is possible to simultaneously emit both right and left circularly polarized waves with the same antenna.

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McGrath, Finbarr J., and Patrick J. Murphy. "A Cad Package for Microwave Integrated Circuit Design." International Journal of Electrical Engineering & Education 24, no. 4 (October 1987): 319–24. http://dx.doi.org/10.1177/002072098702400405.

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A comprehensive CAD package for analysis and design of microwave microstrip circuits is described. The package which is written in FORTRAN has a comprehensive element library and a range of graphical output options.

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ATALAN, Cenk, and Eyup TONGEL. "BENEFITS OF TRANSMISSION LINE METAL-INSULATOR-METAL CAPACITORS IN MASS PRODUCTION OF RF CIRCUITS." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000838–43. http://dx.doi.org/10.4071/isom-thp26.

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Coupling capacitors or DC blocks are essential tuning elements in RF/microwave applications. Their role becomes imperative in cascade amplifiers to isolate drain voltages of preceding MMIC from the gate voltage of the following chip where both RF and DC signals are carried through the same line. The purpose of this study is to explain the benefits of a newly designed thin film coupling capacitor called as transmission line metal-insulator-metal capacitor (TL MIM Cap), which serves as a DC block capacitor in microwave circuits. This novel structure provides a unique solution, which cannot be achieved with traditional single layer ceramic capacitor (SLC) structure. It combines two discrete circuit elements into one: “Microstrip transmission line of required length and width” with a “serially attached coupling capacitor”. Thin film capacitive layers ranged from 0.5pF to 50pF, which are typically needed for microwave frequencies within 1–40 GHz, constructed and embedded into 50 Ohm impedance transmission lines in series. Substrates like quartz, glass, or alumina can be used to minimize losses and to achieve higher RF/microwave performance. We used copper traces as conductive layers for optimal conductivity. After manufacturing TL MIM Caps, we tested several capacitance values for 1pF, 5pF, 15pF and 30pF corresponding to a wide frequency range. The RF tests we performed showed that TL MIM Caps exhibited a minimum of 20dB return loss and a maximum of 0.3 dB insertion loss at 1–40GHz range. We also found our technique comes with some workmanship advantages in high frequency circuit assembly as follows: Traditional coupling capacitor attachment with silver epoxy on top of a microstrip transmission line is a manual operation, which requires well trained and experienced technicians. In contrast, using the TL MIM Caps in our high frequency hybrid modules, we found that the process caused errors were eliminated such as the micro short circuit effect caused by conductive epoxy. Therefore we improved yield in assembly stage of the circuits. In addition, improvements are observed in production processes such as less consumption of adhesives (epoxy), no technician failure caused wastes, elimination of extra curing process to attach capacitors, no short circuit inspection, rework, or re-cure operations to fix assembly errors. Last but not least, blocking capacitors are embedded into the microstrip transmission lines in TL MIM Caps. This ensures that having the lowest possible impedance since very short wire bond exists from the bond pad of the TL MIM Cap to the adjacent circuit element.

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Lin, Haidan, and Yiran Shen. "A VO2 Neuristor Based on Microstrip Line Coupling." Micromachines 14, no. 2 (January 28, 2023): 337. http://dx.doi.org/10.3390/mi14020337.

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The neuromorphic network based on artificial neurons and synapses can solve computational difficulties, and its energy efficiency is incomparable to the traditional von Neumann architecture. As a new type of circuit component, nonvolatile memristors are very similar to biological synapses in structure and function. Only one memristor can simulate the function of a synapse. Therefore, memristors provide a new way to build hardware-based artificial neural networks. To build such an artificial neural network, in addition to the artificial synapses, artificial neurons are also needed to realize the distribution of information and the adjustment of synaptic weights. As the VO2 volatile local active memristor is complementary to nonvolatile memristors, it can be used to simulate the function of neurons. However, determining how to better realize the function of neurons with simple circuits is one of the current key problems to be solved in this field. This paper considers the influence of distribution parameters on circuit performance under the action of high-frequency and high-speed signals. Two Mott VO2 memristor units are connected and coupled with microstrip lines to simulate the Hodgkin–Huxley neuron model. It is found that the proposed memristor neuron based on microstrip lines shows the characteristics of neuron action potential: amplification and threshold.

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Khac Le, Hung, and SoYoung Kim. "Machine Learning Based Energy-Efficient Design Approach for Interconnects in Circuits and Systems." Applied Sciences 11, no. 3 (January 20, 2021): 915. http://dx.doi.org/10.3390/app11030915.

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In this paper, we propose an efficient design methodology for energy-efficient off-chip interconnect. This approach leverages an artificial neural network (ANN) as a surrogate model that significantly improves design efficiency in the frequency-domain. This model utilizes design specifications as the constraint functions to guarantee the satisfaction of design requirements. Additionally, a specified objective function to select low-loss and low-noise structure is employed to determine the optimal case from a large design space. The proposed design flow can find the optimum design that gives maximum eye height (EH) with the largest allowable transmitter supply voltage (VTX) reduction for minimum power consumption. The proposed approach is applied to the microstrip line and stripline structures with single-ended and differential signals for general applicability. For the microstrip line, the proposed methodology performs at a performance speed with 42.7 and 0.5 s per structure for the data generation and optimization process, respectively. In addition, the optimal microstrip line design achieves a 25%VTX reduction. In stripline structures, it takes 31.9 s for the data generation and 0.6 s for the optimization process per structure when the power efficiency reaches a maximum 30.7% peak to peak VTX decrease.

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Ezenkova, D., D. Moskalev, N. Smirnov, A. Ivanov, A. Matanin, V. Polozov, V. Echeistov, et al. "Broadband SNAIL parametric amplifier with microstrip impedance transformer." Applied Physics Letters 121, no. 23 (December 5, 2022): 232601. http://dx.doi.org/10.1063/5.0129862.

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Josephson parametric amplifiers are an important part of a modern superconducting quantum computing platform and squeezed quantum states generation devices. Traveling wave and impedance-matched parametric amplifiers provide broad bandwidth for high-fidelity single-shot readout of multiple qubit superconducting circuits. Here, we present a quantum-limited 3-wave-mixing parametric amplifier based on superconducting nonlinear asymmetric inductive elements (SNAILs), whose useful bandwidth is enhanced with an on-chip two-section impedance-matching circuit based on microstrip transmission lines. The amplifier dynamic range is increased using an array of 67 SNAILs with 268 Josephson junctions, forming a nonlinear quarter-wave resonator. Operating in a current-pumped mode, we experimentally demonstrate an average gain of 17 dB across 300 MHz bandwidth, along with an average saturation power of –100 dBm, which can go as high as −97 dBm with quantum-limited noise performance. Moreover, the amplifier can be fabricated using a simple technology with just one e-beam lithography step.

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Journal articles on the topic 'Microstrip circuits'

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