Relevant bibliographies by topics / Microsystem packaging

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Microsystem packaging'

Author: Grafiati
Published: 4 June 2021
Last updated: 11 February 2022

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Journal articles on the topic "Microsystem packaging"

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Peterson, K. A., K. D. Patel, C. K. Ho, B. R. Rohrer, C. D. Nordquist, B. D. Wroblewski, and K. B. Pfeifer. "LTCC Microsystems and Microsystem Packaging and Integration Applications." Journal of Microelectronics and Electronic Packaging 3, no. 3 (July 1, 2006): 109–20. http://dx.doi.org/10.4071/1551-4897-3.3.109.

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Low Temperature Cofired Ceramic (LTCC) has proven to be an enabling medium for microsystem technologies, because of its desirable electrical, physical, and chemical properties coupled with its capability for rapid prototyping and scalable manufacturing of components. LTCC is viewed as an extension of hybrid microcircuits, and in that function it enables development, testing, and deployment of silicon microsystems. However, its versatility has allowed it to succeed as a microsystem medium in its own right, with applications in non-microelectronic meso-scale devices and in a range of sensor devices. Applications include silicon microfluidic ‘chip-and-wire’ systems and fluid grid array (FGA)/microfluidic multichip modules using embedded channels in LTCC, and cofired electro-mechanical systems with moving parts. Both the microfluidic and mechanical system applications are enabled by sacrificial volume materials (SVM), which serve to create and maintain cavities and separation gaps during the lamination and cofiring process. SVMs consisting of thermally fugitive or partially inert materials are easily incorporated. Screeding is an incorporation technique we describe that improves uniformity and eliminates processing steps. Recognizing the premium on devices that are cofired rather than assembled, we report on functional-as-released and functional-as-fired moving parts, including an impeller that has been exercised over thirty million cycles, and a cofired pressure sensor that requires only pressure source and electrical connections. Additional applications for cofired transparent windows, some as small as an optical fiber, are also described. The applications described help pave the way for widespread application of LTCC to biomedical, control, analysis, characterization, and radio frequency (RF) functions for macro-meso-microsystems.
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Kelly, G., J. Alderman, C. Lyden, and J. Barrett. "Microsystem packaging: lessons from conventional low cost IC packaging." Journal of Micromechanics and Microengineering 7, no. 3 (September 1, 1997): 99–103. http://dx.doi.org/10.1088/0960-1317/7/3/004.

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Romig, A. D., P. V. Dressendorfer, and D. W. Palmer. "High performance microsystem packaging: A perspective." Microelectronics Reliability 37, no. 10-11 (October 1997): 1771–81. http://dx.doi.org/10.1016/s0026-2714(97)00158-3.

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Wei, J. "Wafer Bonding Techniques for Microsystem Packaging." Journal of Physics: Conference Series 34 (April 1, 2006): 943–48. http://dx.doi.org/10.1088/1742-6596/34/1/156.

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Morrissey, A., G. Kelly, and J. Alderman. "Low-stress 3d packaging of a microsystem." Sensors and Actuators A: Physical 68, no. 1-3 (June 1998): 404–9. http://dx.doi.org/10.1016/s0924-4247(98)00025-9.

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Qiu, Xiaotun, David Welch, Jennifer Blain Christen, Jie Zhu, Jon Oiler, Cunjiang Yu, Ziyu Wang, and Hongyu Yu. "Reactive nanolayers for physiologically compatible microsystem packaging." Journal of Materials Science: Materials in Electronics 21, no. 6 (August 15, 2009): 562–66. http://dx.doi.org/10.1007/s10854-009-9957-5.

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Theppakuttai, S., D. B. Shao, and S. C. Chen. "Localized Laser Transmission Bonding for Microsystem Fabrication and Packaging." Journal of Manufacturing Processes 6, no. 1 (January 2004): 24–31. http://dx.doi.org/10.1016/s1526-6125(04)70057-2.

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Morrissey, A., G. Kelly, J. Alderman, J. Barrett, C. Lyden, and L. O'Rourke. "Some issues for microsystem packaging in plastic and 3D." Microelectronics Journal 29, no. 9 (September 1998): 645–50. http://dx.doi.org/10.1016/s0026-2692(98)00029-9.

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Lu, Wen, Jie Han, Jiang Bo Luo, Gui Fu Ding, and Ran Chen. "Fabrication of Redistribution Layer (RDL) Based on AlN/Sodium Silicate Composite for TSV Interposers." Applied Mechanics and Materials 543-547 (March 2014): 3914–17. http://dx.doi.org/10.4028/www.scientific.net/amm.543-547.3914.

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3D stacking technology with TSV interconnect is becoming a major trend of microsystem packaging. Redistribution layer (RDL) plays an important role in TSV packaging applications. Inorganic RDL based on AlN/sodium silicate composite through wet process has been put forward in this paper. After mixing AlN powder with sodium silicate uniformly and curing of the mixture, AlN/sodium silicate composite dielectric was formed. Finally a novel wet RDL process was developed for TSV interposer applications.
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Morrissey, A., G. Kelly, and J. Alderman. "Selection of materials for reduced stress packaging of a microsystem." Sensors and Actuators A: Physical 74, no. 1-3 (April 1999): 178–81. http://dx.doi.org/10.1016/s0924-4247(98)00335-5.

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Dissertations / Theses on the topic "Microsystem packaging"

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Jiang, Xin. "Diode laser processing of PMMA and LCP materials for microsystem packaging." Thesis, Heriot-Watt University, 2015. http://hdl.handle.net/10399/3008.

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The thesis describes the development of laser-assisted bonding methods for assembly of microfluidic devices and MEMS packaging. A laser microwelding technique for assembly of transparent polymer substrates for fabrication of microfluidic devices was studied. The transparent PMMA substrates were bonded together using a high power diode laser system with a broad top-hat beam profile and an intermediate titanium thin film consisting of 0.7 mm diameter spots. A tensile strength of 6 MPa was achieved for this novel method which is comparable to that of the previous work in laser welding of polymers. It has been demonstrated that the method is capable of leak free encapsulation of a microfluidic channel. Furthermore, a novel laser-based method using an LCP film for packaging of MEMS, sensors and other microelectronic devices has been investigated. The results show that it is possible to use a laser based method with an LCP polymer for high quality substrate bonding applications. Glass-glass based cavities allow optical transmission and have potential applications for optical sensors and other photonic devices. For glass-glass bonding, it was shown that thin film titanium material can be used as an effective optical absorber in the laser based LCP bonding technique. Laser bonding of glass and silicon using an LCP film has also been achieved but in this case the silicon substrate acted as the absorber to capture the laser power. Laser bonding of a silicon cap to a molded LCP package has also been demonstrated successfully. The results of temperature monitoring using embedded sensors show that the temperature at the base of the LCP package (~130C) is substantially lower than the bonding temperature (> 280C). The results of shear and leak test show good reliability and hermeticity of the laser bonded microcavities. Both two-dimensional and three-dimensional models of heat transfer are developed and studied using the COMSOL Multiphysics software tool to understand the localised laser heating effects. The results are in good agreement with those of the practical work.
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McCallum, Grant A. "A Microfabricated Platform for Three-Dimensional Microsystems." Case Western Reserve University School of Graduate Studies / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=case1310564363.

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Hegde, Shashikant. "Enhance thermomechanical reliability of microsystems packaging through new base substrate and dielectric materials." Thesis, Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/17141.

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Setia, Ronald. "Modeling and Diagnosis of Excimer Laser Ablation." Diss., Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/7634.

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Recent advances in the miniaturization, functionality, and integration of integrated circuits and packages, such as the system-on-package (SOP) methodology, require increasing use of microvias that generates vertical signal paths in a high-density multilayer substrate. A scanning projection excimer laser system has been utilized to fabricate the microvias. In this thesis, a novel technique implementing statistical experimental design and neural networks (NNs) is used to characterize and model the excimer laser ablation process for microvia formation. Vias with diameters from 10 50 micrometer have been ablated in DuPont Kapton(r) E polyimide using an Anvik HexScan(tm) 2150 SXE pulsed excimer laser operating at 308 nm. Accurate NN models, developed from experimental data, are obtained for microvia responses, including ablated thickness, via diameter, wall angle, and resistance. Subsequent to modeling, NNs and genetic algorithms (GAs) are utilized to generate optimal process recipes for the laser tool. Such recipes can be used to produce desired microvia responses, including open vias, specific diameter, steep wall angle, and low resistance. With continuing advancement in the use of excimer laser systems in microsystems packaging has come an increasing need to offset capital equipment investment and lower equipment downtime. In this thesis, an automated in-line failure diagnosis system using NNs and Dempster-Shafer (D-S) theory is implemented. For the sake of comparison, an adaptive neuro-fuzzy approach is applied to achieve the same objective. Both the D-S theory and neuro-fuzzy logic are used to develop an automated inference system to specifically identify failures. Successful results in failure detection and diagnosis are obtained from the two approaches. The result of this investigation will benefit both engineering and management. Engineers will benefit from high yield, reliable production, and low equipment down-time. Business people, on the other hand, will benefit from cost-savings resulting from more production-worthy (i.e., lower maintenance) laser ablation equipment.
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Kacker, Karan. "Design and fabrication of free-standing structures as off-chip interconnects for microsystems packaging." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26464.

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Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2009.
Committee Chair: Dr. Suresh K. Sitaraman; Committee Member: Dr. F. Levent Degertekin; Committee Member: Dr. Ioannis Papapolymerou; Committee Member: Dr. Madhavan Swaminathan; Committee Member: Dr. Nazanin Bassiri-Gharb. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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Jeong, Seung Hee. "Soft Intelligence : Liquids Matter in Compliant Microsystems." Doctoral thesis, Uppsala universitet, Mikrosystemteknik, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-281281.

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Soft matter, here, liquids and polymers, have adaptability to a surrounding geometry. They intrinsically have advantageous characteristics from a mechanical perspective, such as flowing and wetting on surrounding surfaces, giving compliant, conformal and deformable behavior. From the behavior of soft matter for heterogeneous surfaces, compliant structures can be engineered as embedded liquid microstructures or patterned liquid microsystems for emerging compliant microsystems. Recently, skin electronics and soft robotics have been initiated as potential applications that can provide soft interfaces and interactions for a human-machine interface. To meet the design parameters, developing soft material engineering aimed at tuning material properties and smart processing techniques proper to them are to be highly encouraged. As promising candidates, Ga-based liquid alloys and silicone-based elastomers have been widely applied to proof-of-concept compliant structures. In this thesis, the liquid alloy was employed as a soft and stretchable electrical and thermal conductor (resistor), interconnect and filler in an elastomer structure. Printing-based liquid alloy patterning techniques have been developed with a batch-type, parallel processing scheme. As a simple solution, tape transfer masking was combined with a liquid alloy spraying technique, which provides robust processability. Silicone elastomers could be tunable for multi-functional building blocks by liquid or liquid-like soft solid inclusions. The liquid alloy and a polymer additive were introduced to the silicone elastomer by a simple mixing process. Heterogeneous material microstructures in elastomer networks successfully changed mechanical, thermal and surface properties. To realize a compliant microsystem, these ideas have in practice been useful in designing and fabricating soft and stretchable systems. Many different designs of the microsystems have been fabricated with the developed techniques and materials, and successfully evaluated under dynamic conditions. The compliant microsystems work as basic components to build up a whole system with soft materials and a processing technology for our emerging society.
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Sundaram, Venkatesh. "Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/28141.

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Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2009.
Committee Chair: Tummala, Rao; Committee Member: Iyer, Mahadevan; Committee Member: Saxena, Ashok; Committee Member: Swaminathan, Madhavan; Committee Member: Wong, Chingping.
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Lin, I.-Hsuan, and 林宜璇. "Integrated Resistance Welding for Microsystem Packaging." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/31395202100348652433.

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碩士
國立交通大學
機械工程系所
102
This thesis studies the bounding properties of a novel method proposed our research group previously. This new techniques use resistance welding to achieve TLP bounding between two wafers, thus enabling the wafer level packing and testing. Investigation of the bounding properties is proceeded by changing the following parameters including, applying voltage for the resistance welding, hermetic/ vacuum bounding, bounding time, etc. The bonding property is examined by the tests including resistance variation during bonding process, X-ray diffraction (XRD) for the material composition, SAT for the defect detection, SEM/ EDS for the defect observation and material composition, and bounding strength test. According to the experimental results, we found three key factors for the bounding properties of the resistance welding, which are the oxide compound in the interface, resistance variation due to alloy formation, resistance variation due to the change of bounding area. With these experimental results and analysis, we propose the following guideline for the future research: (1) time-variant voltage input which could melt more Tin and improve the diffusion ability; (2) controlling the bonding temperature and bonding time to increase the quality of Ni3Sn2.
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Lin, Po-Jung, and 林伯融. "A Resistance Welding Method with in-situ Temperature Sensors for Microsystem Packaging." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/k65mst.

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碩士
國立交通大學
機械工程系所
105
This paper proposed several methods to improve the bounding property of a wafer-level packaging technology which was proposed by our research team previously. The bounding method employed in this technology is to use the conventional resistance welding to facilitate the process of transient-liquid-phase (TLP) bonding, which forms inter-metallic compounds to bound two wafers together. The advantages of this packaging technology are as follows. First, the bounding surface need not to be cleaned or flattened in advance. Second, it is a local-heating process so that IC and MEMS devices would not be damaged by the elevated bounding temperature. Third, this method does not need additional micro-heater. The space and fabrication complexity can be reduced. Finally, it can integrate the through-silicon-via (TSV) technology to implement the connection between IC devices and MEMS devices. Besides, the bounding pads can be exposed for the wafer-level testing. In the previously study, our research team used ring type bounding structure. Unfortunately, the results show that the bounding property can be easily affected by the process variation, In this research, we used solid square to replace the ring type structure. Besides, we design in-situ temperature sensors to monitor the temperature of the bounding process. The experiments were conducted both under vacuum and atmosphere to observe the influence of the environment. Lastly, we used SEM and EDAX to exam the bounding surface, and traction machine to test the bounding force. According to the experimental results, we found that the fabricated temperature sensors have higher sensitivity than the conventional born-doped polysilicon film because of its Schottky diode interface. The resistance welding method can successfully implement the TLP bounding with temperature of 230~300C. The bounding property is better in the vacuum than in the atmosphere due to the generation of metal oxide during the bounding process. Lastly, the stretching test indicates that the failure happens at the oxide and Ti interface, but not at the intended bounding surface.
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Lien, Jui-Chien, and 練瑞虔. "An Integrated Resistance Welding and TSV Process for Microsystems Packaging." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/86832757864743046678.

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碩士
國立交通大學
機械工程學系
100
This paper proposes a novel wafer level packaging for integrated circuits (IC) and microelectromechanical system (MEMS) devices. In this method, two wafers were bounded by resistance welding with simultaneously through-silicon-via (TSV) connection and cavity sealing. In general, bonding techniques require two bonding surfaces to be flat to have intimate contact for bonding. If the surface is rough, it needs to be conditioned. Otherwise, the bonding temperature needs to be high to soften the bonding material, which could damage the device materials such as aluminum in circuits. In a word, the surface roughness of the bonding surface is not preferred and extra care/cost should be paid for that. The proposed IC-MEMS packaging method has the following advantages. First, it does not require flat surface for bonding. Instead, it makes use of the surface roughness of TSV for resistance welding, which achieves transient liquid phase (TLP) for wafer bonding. Second, it is a local heating process but does not require pre-patterned micro-heaters. Thus, high-temperature bonding materials can be used for better bonding properties and no extra area is needed for the deployment of micro-heaters. Third, it can achieve wafer-level testing. This fabrication/bonding process is briefly described as follows. The thickness of bottom wafer is 525 ?慆 and formed through wafer trenches. The TSV is formed by the Nickel electroplating which completely refilled those trenches and is used as an electrical interconnect between two sides of the bottom wafer. Both on the top and bottom wafers, 5?慆-Ni /2?慆-Sn standouts are created and patterned as a bonding ring for bonding two wafers together later on. Note that, those Ni/Sn films can be fabricated by cheap fabrication processes because the surface roughness is not critical. After that, two wafers are brought together and a constant voltage is applied to two contact pads, which can be accessed at the bottom side of the bottom wafer. The surface roughness introduces a large contact resistance to the circuit and completes the current loop. Thus, it creates a local heater at contact points. When the temperature of these contact points reach 300℃, the Ni-Sn TLP bonding happens, which seals the gap for bonding two wafers together and complete the electrical interconnects between two wafers simultaneously. The Ni-Sn bonding took place at several contact points but many voids existed. The existence of voids was likely because we did not operate this bonding process under vacuum. More experiments are on the way to calibrate the performance of this fabrication process.
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Books on the topic "Microsystem packaging"

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Jin, Yufeng. Introduction to microsystem packaging technology. Boca Raton: Taylor & Francis, 2010.

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Wang, Zhiping, 1962- Oct. 6 and Chen Jing 1974-, eds. Introduction to microsystem packaging technology. Boca Raton: Taylor & Francis, 2010.

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Jin, Yufeng. Introduction to microsystem packaging technology. Boca Raton, FL: CRC Press/Taylor & Francis, 2011.

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Institute of Electrical and Electronics Engineers. and Components, Packaging & Manufacturing Technology Society., eds. Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06): June 27th-June 30 2006 : Shanghai University, Shanghai, China. Piscataway, NJ: IEEE, 2006.

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IEEE CPMT Conference on High Density Microsystem Design and Packaging Component Failure Analysis (6th 2004 Shanghai, China). Proceeding of the sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04): June 30-July 3, 2004, Bao Long Hotel, Shanghai, China. Piscataway, N.J: IEEE, 2004.

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Hsu, Tai-Ran. Mems and microsystems: Design, manufacture, and packaging. 2nd ed. Hoboken, NJ: John Wiley, 2008.

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MEMS and microsystems: Design and manufacture. Boston: McGraw-Hill, 2002.

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Spangler, Leland. The Art and Science of Microsystem Packaging (Microsystems). Springer, 2007.

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Cpmt Conference on High Density IEEE. Proceedings of the Sixth IEEE Cpmt Conference on High Density Microsystem Design Packaging ... Institute of Electrical & Electronics Enginee, 2004.

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Fundamentals of Microsystems Packaging. McGraw-Hill Education, 2019.

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Book chapters on the topic "Microsystem packaging"

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Kelly, Gerard. "Microsystem Packaging in Plastic and in 3D." In The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages, 87–106. Boston, MA: Springer US, 1999. http://dx.doi.org/10.1007/978-1-4615-5011-2_6.

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Hornung, Mark R., and Oliver Brand. "Packaging of Transducers." In Microsystems, 55–75. Boston, MA: Springer US, 1999. http://dx.doi.org/10.1007/978-1-4615-4997-0_5.

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Wijesundara, Muthu B. J., and Robert G. Azevedo. "Packaging." In Silicon Carbide Microsystems for Harsh Environments, 167–88. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-7121-0_5.

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Chiao, Mu, Yu-Ting Cheng, and Liwei Lin. "Introduction to MEMS Packaging." In Microsystems and Nanotechnology, 415–46. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-18293-8_11.

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Jung, E., M. Wiemer, V. Grosser, R. Aschenbrenner, and H. Reichl. "Microsystems Packaging for Automotive Applications." In Advanced Microsystems for Automotive Applications Yearbook 2002, 66–75. Berlin, Heidelberg: Springer Berlin Heidelberg, 2002. http://dx.doi.org/10.1007/978-3-642-18213-6_9.

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Huff, Michael. "Microsystems Process Integration, Testing, and Packaging." In Process Variations in Microsystems Manufacturing, 275–311. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-40560-1_7.

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Fischer, Wolf-Joachim, and Michael Mertig. "Nanopatterning and Self-Assembly in Microsystems: An Overview." In Bio and Nano Packaging Techniques for Electron Devices, 179–208. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-28522-6_9.

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Sommerfeld, Peter, Daniel J. Jendritza, and Stephan Hell. "Advanced Packaging and Interconnection Technologies for Automotive Microelectronic Modules." In Advanced Microsystems for Automotive Applications 99, 111–19. Berlin, Heidelberg: Springer Berlin Heidelberg, 1999. http://dx.doi.org/10.1007/978-3-662-03838-3_10.

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Wymysłowski, A., G. Q. Zhang, W. D. van Driel, and L. J. Ernst. "Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems." In Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, A205—A266. Boston, MA: Springer US, 2007. http://dx.doi.org/10.1007/0-387-32989-7_6.

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van Dommelen, I. "Plastic Packaging for Various Sensor Applications in the Automotive Industry." In Advanced Microsystems for Automotive Applications Yearbook 2002, 289–96. Berlin, Heidelberg: Springer Berlin Heidelberg, 2002. http://dx.doi.org/10.1007/978-3-642-18213-6_34.

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Conference papers on the topic "Microsystem packaging"

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Kelly, Gerard, John C. Alderman, C. Lyden, James Barrett, and Anthony Morrissey. "Microsystem packaging in 3D." In Micromachining and Microfabrication, edited by Kevin H. Chau and Patrick J. French. SPIE, 1997. http://dx.doi.org/10.1117/12.284509.

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Chen, Mingxiang, Sheng liu, and Zhiyin Gan. "Selective Induction Heating for Microsystem Packaging." In 2006 7th International Conference on Electronic Packaging Technology. IEEE, 2006. http://dx.doi.org/10.1109/icept.2006.359830.

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Lim Ruiqi, Tan Ee Lim, Tan Kwan Ling, M. S. Narducci, Sun Tao, and Cheng Ming-Yuan. "Biocompatible packaging development for an intracranial microsystem." In 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012). IEEE, 2012. http://dx.doi.org/10.1109/eptc.2012.6507048.

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Brenner, Werner, A. Stelmach, and J. Baret. "Standardization for microsystem technology." In Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, edited by Bernard Courtois, Selden B. Crary, Kaigham J. Gabriel, Jean Michel Karam, Karen W. Markus, and Andrew A. O. Tay. SPIE, 2000. http://dx.doi.org/10.1117/12.382292.

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Spangler, Leland. "Assembly process issues and reliability in microsystem packaging." In Micromachining and Microfabrication, edited by Danelle M. Tanner and Rajeshuni Ramesham. SPIE, 2004. http://dx.doi.org/10.1117/12.531901.

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Lv, Yanzhu, Min Miao, Xiaofei Wang, Huifen Liu, Xin Sun, Zhensong Li, Yuexia Zhang, and Xiaoqing Zhang. "Research on microsystem interposer designer software with through silicon via." In 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). IEEE, 2012. http://dx.doi.org/10.1109/icept-hdp.2012.6474586.

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Hua Gan, Yunsong Qiu, Min Miao, and Yufeng Jin. "A micro in-situ Pirani vacuum gauge for microsystem package applications." In High Density Packaging (ICEPT-HDP). IEEE, 2010. http://dx.doi.org/10.1109/icept.2010.5582469.

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Goubault, B., G. Aspar, J. C. Souriau, L. Castagne, G. Simon, L. Di Cioccio, and Y. Brechet. "A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process." In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC). IEEE, 2018. http://dx.doi.org/10.1109/ectc.2018.00026.

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Chiang, Yuh-Min, Mark Bachman, and Guann-pyng Li. "Front-end wafer-level microsystem packaging technique with microcap array." In SPIE's 9th Annual International Symposium on Smart Structures and Materials, edited by Vijay K. Varadan. SPIE, 2002. http://dx.doi.org/10.1117/12.475040.

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Maltsev, Petr P. "Perspectives of microsystem engineering developments in Russia." In Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, edited by Bernard Courtois, Jean Michel Karam, Karen W. Markus, Bernd Michel, Tamal Mukherjee, and James A. Walker. SPIE, 2002. http://dx.doi.org/10.1117/12.462828.

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Reports on the topic "Microsystem packaging"

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Chae, Junseok, Brian H. Stark, Andrew Kuo, Andrew David Oliver, and Khalil Najafi. Robust hermetic packaging techniques for MEMS integrated microsystems. Office of Scientific and Technical Information (OSTI), March 2005. http://dx.doi.org/10.2172/919644.

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