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Journal articles on the topic 'Microsystem packaging'

Author: Grafiati

Published: 4 June 2021

Last updated: 11 February 2022

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1

Peterson, K. A., K. D. Patel, C. K. Ho, B. R. Rohrer, C. D. Nordquist, B. D. Wroblewski, and K. B. Pfeifer. "LTCC Microsystems and Microsystem Packaging and Integration Applications." Journal of Microelectronics and Electronic Packaging 3, no. 3 (July 1, 2006): 109–20. http://dx.doi.org/10.4071/1551-4897-3.3.109.

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Low Temperature Cofired Ceramic (LTCC) has proven to be an enabling medium for microsystem technologies, because of its desirable electrical, physical, and chemical properties coupled with its capability for rapid prototyping and scalable manufacturing of components. LTCC is viewed as an extension of hybrid microcircuits, and in that function it enables development, testing, and deployment of silicon microsystems. However, its versatility has allowed it to succeed as a microsystem medium in its own right, with applications in non-microelectronic meso-scale devices and in a range of sensor devices. Applications include silicon microfluidic ‘chip-and-wire’ systems and fluid grid array (FGA)/microfluidic multichip modules using embedded channels in LTCC, and cofired electro-mechanical systems with moving parts. Both the microfluidic and mechanical system applications are enabled by sacrificial volume materials (SVM), which serve to create and maintain cavities and separation gaps during the lamination and cofiring process. SVMs consisting of thermally fugitive or partially inert materials are easily incorporated. Screeding is an incorporation technique we describe that improves uniformity and eliminates processing steps. Recognizing the premium on devices that are cofired rather than assembled, we report on functional-as-released and functional-as-fired moving parts, including an impeller that has been exercised over thirty million cycles, and a cofired pressure sensor that requires only pressure source and electrical connections. Additional applications for cofired transparent windows, some as small as an optical fiber, are also described. The applications described help pave the way for widespread application of LTCC to biomedical, control, analysis, characterization, and radio frequency (RF) functions for macro-meso-microsystems.

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2

Kelly, G., J. Alderman, C. Lyden, and J. Barrett. "Microsystem packaging: lessons from conventional low cost IC packaging." Journal of Micromechanics and Microengineering 7, no. 3 (September 1, 1997): 99–103. http://dx.doi.org/10.1088/0960-1317/7/3/004.

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3

Romig, A. D., P. V. Dressendorfer, and D. W. Palmer. "High performance microsystem packaging: A perspective." Microelectronics Reliability 37, no. 10-11 (October 1997): 1771–81. http://dx.doi.org/10.1016/s0026-2714(97)00158-3.

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4

Wei, J. "Wafer Bonding Techniques for Microsystem Packaging." Journal of Physics: Conference Series 34 (April 1, 2006): 943–48. http://dx.doi.org/10.1088/1742-6596/34/1/156.

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5

Morrissey, A., G. Kelly, and J. Alderman. "Low-stress 3d packaging of a microsystem." Sensors and Actuators A: Physical 68, no. 1-3 (June 1998): 404–9. http://dx.doi.org/10.1016/s0924-4247(98)00025-9.

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6

Qiu, Xiaotun, David Welch, Jennifer Blain Christen, Jie Zhu, Jon Oiler, Cunjiang Yu, Ziyu Wang, and Hongyu Yu. "Reactive nanolayers for physiologically compatible microsystem packaging." Journal of Materials Science: Materials in Electronics 21, no. 6 (August 15, 2009): 562–66. http://dx.doi.org/10.1007/s10854-009-9957-5.

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7

Theppakuttai, S., D. B. Shao, and S. C. Chen. "Localized Laser Transmission Bonding for Microsystem Fabrication and Packaging." Journal of Manufacturing Processes 6, no. 1 (January 2004): 24–31. http://dx.doi.org/10.1016/s1526-6125(04)70057-2.

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8

Morrissey, A., G. Kelly, J. Alderman, J. Barrett, C. Lyden, and L. O'Rourke. "Some issues for microsystem packaging in plastic and 3D." Microelectronics Journal 29, no. 9 (September 1998): 645–50. http://dx.doi.org/10.1016/s0026-2692(98)00029-9.

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9

Lu, Wen, Jie Han, Jiang Bo Luo, Gui Fu Ding, and Ran Chen. "Fabrication of Redistribution Layer (RDL) Based on AlN/Sodium Silicate Composite for TSV Interposers." Applied Mechanics and Materials 543-547 (March 2014): 3914–17. http://dx.doi.org/10.4028/www.scientific.net/amm.543-547.3914.

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3D stacking technology with TSV interconnect is becoming a major trend of microsystem packaging. Redistribution layer (RDL) plays an important role in TSV packaging applications. Inorganic RDL based on AlN/sodium silicate composite through wet process has been put forward in this paper. After mixing AlN powder with sodium silicate uniformly and curing of the mixture, AlN/sodium silicate composite dielectric was formed. Finally a novel wet RDL process was developed for TSV interposer applications.

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10

Morrissey, A., G. Kelly, and J. Alderman. "Selection of materials for reduced stress packaging of a microsystem." Sensors and Actuators A: Physical 74, no. 1-3 (April 1999): 178–81. http://dx.doi.org/10.1016/s0924-4247(98)00335-5.

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11

Chiang, Y. M. J., M. Bachman, and G. P. Li. "A Wafer-Level Microcap Array to Enable High-Yield Microsystem Packaging." IEEE Transactions on Advanced Packaging 27, no. 3 (August 2004): 490–96. http://dx.doi.org/10.1109/tadvp.2004.831825.

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12

Tseng, Ampere A., and Jong-Seung Park. "Using Transmission Laser Bonding Technique for Line Bonding in Microsystem Packaging." IEEE Transactions on Electronics Packaging Manufacturing 29, no. 4 (October 2006): 308–18. http://dx.doi.org/10.1109/tepm.2006.887356.

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13

Hu, Yu-Chen, Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Hsiao-Chun Chang, Yu-Tao Yang, Yan-Huei You, et al. "An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem." IEEE Transactions on Electron Devices 64, no. 4 (April 2017): 1666–73. http://dx.doi.org/10.1109/ted.2017.2660763.

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14

Tseng, Ampere A., Jong-Seung Park, George P. Vakanas, Hongtao Wu, Miroslav Raudensky, and T. P. Chen. "Influences of interface oxidation on transmission laser bonding of wafers for microsystem packaging." Microsystem Technologies 13, no. 1 (September 7, 2006): 49–59. http://dx.doi.org/10.1007/s00542-006-0249-1.

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15

Park, Jong-Seung, Han Zhu, Zhilong Zhao, Ampere A. Tseng, and T. P. Chen. "Direct Writing of Spot and Line Bonds for Microsystem Packaging Using Transmission Laser Bonding Technique." Materials and Manufacturing Processes 22, no. 1 (January 2007): 71–80. http://dx.doi.org/10.1080/10426910601015964.

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16

Liang, Tianpeng, Jihua Zhang, Hongwei Chen, Libin Gao, and Vincent G. Harris. "Dielectric and thermodynamic properties of Ba-doped photoetchable glasses for three dimensional RF microsystem packaging." Ceramics International 47, no. 10 (May 2021): 14226–32. http://dx.doi.org/10.1016/j.ceramint.2021.01.288.

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17

Gotz, A., I. Gracia, C. Cane, A. Morrissey, and J. Alderman. "Manufacturing and packaging of sensors for their integration in a vertical MCM microsystem for biomedical applications." Journal of Microelectromechanical Systems 10, no. 4 (2001): 569–79. http://dx.doi.org/10.1109/84.967380.

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18

Courtois, Bernard, and Bernd Michel. "Microsystem Technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2010." Microsystem Technologies 17, no. 4 (April 2011): 481. http://dx.doi.org/10.1007/s00542-011-1296-9.

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19

Courtois, Bernard, and Bernd Michel. "Microsystem technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2009." Microsystem Technologies 16, no. 7 (May 16, 2010): 1035. http://dx.doi.org/10.1007/s00542-010-1082-0.

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20

Courtois, Bernard, and Bernd Michel. "Microsystem Technologies: Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2003." Microsystem Technologies 10, no. 5 (August 2004): 345. http://dx.doi.org/10.1007/s00542-004-0419-y.

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21

Vurchio, Federica, Pietro Ursi, Francesco Orsini, Andrea Scorza, Rocco Crescenzi, Salvatore A. Sciuto, and Nicola P. Belfiore. "Toward Operations in a Surgical Scenario: Characterization of a Microgripper via Light Microscopy Approach." Applied Sciences 9, no. 9 (May 9, 2019): 1901. http://dx.doi.org/10.3390/app9091901.

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Micro Electro Mechanical Systems (MEMS)-Technology based micro mechanisms usually operate within a protected or encapsulated space and, before that, they are fabricated and analyzed within one Scanning Electron Microscope (SEM) vacuum specimen chamber. However, a surgical scenario is much more aggressive and requires several higher abilities in the microsystem, such as the capability of operating within a liquid or wet environment, accuracy, reliability and sophisticated packaging. Unfortunately, testing and characterizing MEMS experimentally without fundamental support of a SEM is rather challenging. This paper shows that in spite of large difficulties due to well-known physical limits, the optical microscope is still able to play an important role in MEMS characterization at room conditions. This outcome is supported by the statistical analysis of two series of measurements, obtained by a light trinocular microscope and a profilometer, respectively.

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22

Lee, C. F., J. J. Wang, and W. K. Chung. "A Steady Creep Theory of High Lead Pb/Sn Solder with Creep-Parameters Maps." Journal of Mechanics 21, no. 4 (December 2005): 217–25. http://dx.doi.org/10.1017/s1727719100000654.

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AbstractIn this paper, Valanis' steady creep theory with four creep parameters was derived from a liaison of the theory of deformation kinetics with internal isotropy and the theory of irreversible thermodynamics of continuous media with only one internal state variable.According to the theory, steady creep rates under simple shear and simple tensile conditions are related and allow one to construct creep-parameters maps of high lead Pb/Sn solders (from 90% to 100% Pb). When testing temperatures are higher than solder's solvus temperature, microstructural transformation from lamellae α + β phase to solid solution α phase in the bulk specimens are considered in the construction of maps. Applications of maps in the 97.5Pb/2.5Sn solder joints creep tests need minor modifications due to dispersive precipitation of tin particles in lead matrix. As a result, the maps may provide estimated steady creep rates for the usage of finite elements analysis in the microsystem or electronic packaging analysis.

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23

Fries, David P., Chase A. Starr, and Geran W. Barton. "Ocean Sensor “Imaging” Arrays Based on Bio-inspired Architectures and 2-D/3-D Construction." Marine Technology Society Journal 49, no. 3 (May 1, 2015): 43–49. http://dx.doi.org/10.4031/mtsj.49.3.17.

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AbstractMany common ocean sensor systems measure a localized space above a single sensor element. Single-point measurements give magnitude but not necessarily direction information. Expanding single sensor elements, such as used in salinity sensors, into arrays permits spatial distribution measurements and allows flux visualizations. Furthermore, applying microsystem technology to these macro sensor systems can yield imaging arrays with high-resolution spatial/temporal sensing functions. Extending such high spatial resolution imaging over large areas is a desirable feature for new “vision” modes on autonomous robotic systems and for deployable ocean sensor systems. The work described here explores the use of printed circuit board (PCB) technology for new sensing concepts and designs. In order to create rigid-conformal, large area imaging “camera” systems, we have merged flexible PCB substrates with rigid constructions from 3-D printing. This approach merges the 2-D flexible electronics world of printed circuits with the 3-D printed packaging world. Furthermore, employing architectures used by biology as a basis for our imaging systems, we explored naturally and biologically inspired designs, their relationships to visual imagining, and alternate mechanical systems of perception. Through the use of bio-inspiration, a framework is laid out to base further research on design for packaging of ocean sensors and arrays. Using 3-D printed exoskeleton's rigid form with flexible printed circuits, one can create systems that are both rigid and form-fitting with 3-D shape and enable new sensor systems for various ocean sensory applications.

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24

Zhu, Qi, Lunyu Ma, and Suresh K. Sitaraman. "Development of G-Helix Structure as Off-Chip Interconnect." Journal of Electronic Packaging 126, no. 2 (June 1, 2004): 237–46. http://dx.doi.org/10.1115/1.1756148.

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Microsystem packages continue to demand lower cost, higher reliability, better performance and smaller size. Compliant wafer-level interconnects show great potential for next-generation packaging. G-Helix, an electroplated compliant wafer-level chip-to-substrate interconnect can facilitate wafer-level probing as well as wafer-level packaging without the need for an underfill. The fabrication of the G-Helix interconnect is similar to conventional IC fabrication process and is based on electroplating and photolithography. G-Helix interconnect has good mechanical compliance in the three orthogonal directions and can accommodate the differential displacement induced by the coefficient of thermal expansion (CTE) mismatch between the silicon die and the organic substrate. In this paper, we report the wafer-level fabrication of an area-arrayed G-Helix interconnects. The geometry effect on the mechanical compliance and electrical parasitics of G-Helix interconnects have been studied. Thinner and narrower arcuate beams with larger radius and taller post are found to have better mechanical compliance. However, it is also found that structures with excellent mechanical compliance may not have good electrical performance. Therefore, a trade off is needed. Using response surface methodology (RSM), an optimization has been done. Furthermore, reliability of the optimized G-helix interconnects in a silicon-on-organic substrate assembly has been assessed, which includes the package weight and thermo-mechanical analysis. The pitch size effect on the electrical and mechanical performance of G-Helix interconnects has also been studied.

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25

Nakayama, W. "Thermal issues in microsystems packaging." IEEE Transactions on Advanced Packaging 23, no. 4 (2000): 602–7. http://dx.doi.org/10.1109/6040.883748.

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26

Esashi, Masayoshi, and Shuji Tanaka. "Integrated Microsystems." Advances in Science and Technology 81 (September 2012): 55–64. http://dx.doi.org/10.4028/www.scientific.net/ast.81.55.

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Technology called MEMS (Micro Electro Mechanical Systems) or microsystems are heterogeneous integration on silicon chips and play important roles as sensors. MEMS as switches and resonators fabricated on LSI are needed for future multi-band wireless systems. MEMS for safety systems as event driven tactile sensor network for nursing robot are developed. Wafer level packaging for MEMS and open collaboration to reduce the cost for the development are discussed.

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27

de Reus, R., C. Christensen, S. Weichel, S. Bouwstra, J. Janting, G. Friis Eriksen, K. Dyrbye, et al. "Reliability of industrial packaging for microsystems." Microelectronics Reliability 38, no. 6-8 (June 1998): 1251–60. http://dx.doi.org/10.1016/s0026-2714(98)00149-8.

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28

Camon, H., J. Alderman, A. Morrissey, and G. Kelly. "3-D packaging methodologies for microsystems." IEEE Transactions on Advanced Packaging 23, no. 4 (2000): 623–30. http://dx.doi.org/10.1109/6040.883751.

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29

Zheng, W., J. Chung, and H. O. Jacobs. "Fluidic Heterogeneous Microsystems Assembly and Packaging." Journal of Microelectromechanical Systems 15, no. 4 (August 2006): 864–70. http://dx.doi.org/10.1109/jmems.2006.878885.

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30

Sparjs, D. R. "Packaging of microsystems for harsh environments." IEEE Instrumentation & Measurement Magazine 4, no. 3 (2001): 30–33. http://dx.doi.org/10.1109/5289.953456.

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31

Bright, V. M., and J. T. Butler. "An embedded overlay concept for microsystems packaging." IEEE Transactions on Advanced Packaging 23, no. 4 (2000): 617–22. http://dx.doi.org/10.1109/6040.883750.

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32

Hsu, T. R. "Packaging design of microsystems and meso-scale devices." IEEE Transactions on Advanced Packaging 23, no. 4 (2000): 596–601. http://dx.doi.org/10.1109/6040.883747.

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33

Guérin, L., M. A. Schaer, R. Sachot, and M. Dutoit. "New multichip-on-silicon packaging scheme for microsystems." Sensors and Actuators A: Physical 52, no. 1-3 (March 1996): 156–60. http://dx.doi.org/10.1016/0924-4247(96)80142-7.

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34

Neysmith, J., and D. F. Baldwin. "Modular, device-scale, direct-chip-attach packaging for microsystems." IEEE Transactions on Components and Packaging Technologies 24, no. 4 (2001): 631–34. http://dx.doi.org/10.1109/6144.974952.

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35

Sawan, Mohamad, B. Gosselin, J. Coulombe, A. E. Ayoub, A. Chaudhuri, and F. Leporé. "Implantable Electronics for the Recovery of Neuromuscular Functions." Advances in Science and Technology 57 (September 2008): 204–9. http://dx.doi.org/10.4028/www.scientific.net/ast.57.204.

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This paper covers circuits and systems techniques for the construction of high reliability biosensing and stimulation medical devices. Such microsystems are dedicated for interconnections through either the central or the peripheral nervous systems. Low-power high-reliability wireless links are used to power up the implanted devices while data are exchanged bidirectionaly between these implants and external controllers. A global view of main devices is given, case studies related to applications such as bladder control, intracortical monitoring and microstimulation are discussed, altogether with modeling, characterization, as well as microsystems assembly and packaging. Also, dedicated electrode arrays and their interfaces to tissues interfaces are summarized.

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36

Suga, Tadatomo, Jenn-Ming Song, and Yi-Shao Lai. "Guest Editorial – Low Temperature Processing for Microelectronics and Microsystems Packaging." Microelectronics Reliability 52, no. 2 (February 2012): 301. http://dx.doi.org/10.1016/j.microrel.2011.12.015.

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37

Wu, Guoqiang, Dehui Xu, Xiao Sun, Bin Xiong, and Yuelin Wang. "Wafer-Level Vacuum Packaging for Microsystems Using Glass Frit Bonding." IEEE Transactions on Components, Packaging and Manufacturing Technology 3, no. 10 (October 2013): 1640–46. http://dx.doi.org/10.1109/tcpmt.2013.2279135.

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38

Beal, Aubrey N., and Robert N. Dean. "A Survey of Nonlinear Phenomena and Chaos in Microsystems and Packaging." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, DPC (January 1, 2016): 001498–542. http://dx.doi.org/10.4071/2016dpc-wp31.

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39

Bardin, Fabrice, Stephan Kloss, Changhai Wang, Andrew J. Moore, Anne Jourdain, Ingrid De Wolf, and Duncan P. Hand. "Laser Bonding of Glass to Silicon Using Polymer for Microsystems Packaging." Journal of Microelectromechanical Systems 16, no. 3 (June 2007): 571–80. http://dx.doi.org/10.1109/jmems.2007.896704.

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40

Tan, C. S., J. Fan, D. F. Lim, G. Y. Chong, and K. H. Li. "Low temperature wafer-level bonding for hermetic packaging of 3D microsystems." Journal of Micromechanics and Microengineering 21, no. 7 (June 3, 2011): 075006. http://dx.doi.org/10.1088/0960-1317/21/7/075006.

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41

Fries, David, Liesl Hotaling, Geran Barton, Stan Ivanov, Michelle Janowiak, and Matt Smith. "PCBMEMS as a Flexible Path to Devices and Systems across Spatial Scales." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (January 1, 2011): 000597–634. http://dx.doi.org/10.4071/2011dpc-ta24.

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PCB technology based on both rigid and flexible laminates is desirable for miniaturization of mobile devices and systems. The technology provides substantial flexibility in systems design. The ability to use flexible microsystems allows new sensing systems for mobile applications. Using this design, fabrication and construction approach allows lightweight, complex, and space efficient systems. Flex microsystems based on structurable, non-fiber filled laminates permits miniaturization to occur at two levels: at the micro scale with the embedding of microstructures in the substrate, and at the macro scale with the ability to flex the system across millimeter to centimeter lengths of real everyday objects. The macro scale systems further allows ultra large systems with high resolution features permitting novel sensor systems. Examples will be given where the technology has enabled devices, systems and packaging innovation across several spatial scales. Mobile (environmental, medical, portable, embedded) sensor systems all can be realized using this design and fabrication toolbox.

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42

Bakir, Muhannad S., Hollie A. Reed, Anthony V. Mulé, Joseph Paul Jayachandran, Paul A. Kohl, Kevin P. Martin, Thomas K. Gaylord, and James D. Meindl. "Chip-to-Module Interconnections Using “Sea of Leads” Technology." MRS Bulletin 28, no. 1 (January 2003): 61–67. http://dx.doi.org/10.1557/mrs2003.19.

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AbstractThe drive toward higher density and higher performance in integrated circuits creates a need to keep interconnects short and eliminate layers of packaging. In this article, we propose a novel, ultrahigh-density (exceeding 104 leads per cm2), compliant, wafer-level, input/output interconnection technology called “sea of leads” as a key enabling technology for future high-performance microsystems. The mechanical compliance is addressed through slippery leads (leads released from the surface) and embedded air gaps. The ability to fabricate embedded air gaps has enabled the integration of optical interconnects with high index-of-refraction mismatches between the core and cladding.

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43

Ranganathan, N., D. Y. Lee, L. Ebin, N. Balasubramanian, K. Prasad, and K. L. Pey. "The development of a tapered silicon micro-micromachining process for 3D microsystems packaging." Journal of Micromechanics and Microengineering 18, no. 11 (October 15, 2008): 115028. http://dx.doi.org/10.1088/0960-1317/18/11/115028.

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44

Maeng, Jimin, Dohyuk Ha, William J. Chappell, and Pedro P. Irazoqui. "Parylene as Thin Flexible 3-D Packaging Enabler for Biomedical Implants." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000176–85. http://dx.doi.org/10.4071/isom-2012-ta56.

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In this paper, the novel use of Parylene for implantable biomedical microsystems packaging is presented. Parylene is an excellent candidate material to be used for implantable and clinically usable miniature devices due to its biocompatibility, flexibility, near-hermeticity, and high-density integration capability in a small form factor. Here, we propose a novel all-Parylene packaging technique where Parylene is used as a package substrate, an isolation layer, a capacitor insulator, and a sealing layer. Fully-integrated embedded passive devices, transmission lines, and surface mount components on a thin-film multilayer Parylene substrate are described. Metal-insulator-metal capacitors are implemented on Parylene and their DC and RF properties are characterized. Further, high-density 3-D trench capacitors are developed on Parylene for the first time. By integrating embedded capacitors and antenna with surface mount diodes, a rectifier module is implemented. Wireless powering onto the Parylene package is demonstrated as a proof-of-concept for the implant package to be powered by external environment. The authors believe that the all-Parylene packaging method described here can be widely applied to other miniature implant applications.

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45

Schönecker, Andreas, and Sylvia Gebhardt. "Microsystems Technologies for Use in Structures and Integrated Systems." Advances in Science and Technology 56 (September 2008): 76–83. http://dx.doi.org/10.4028/www.scientific.net/ast.56.76.

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Piezoceramics are considered as key functional material in micro systems and smart structure technology. Showing superior mechanical, dielectric, pyroelectric, ferroelectric and piezoelectric properties they introduce improved functionality, e.g. sensing, actuation, energy harvesting, health monitoring or shape control. Various applications such as micro integrated valves, drives, voltage converter, piezoelectric, pyroelectric and ultrasound sensors are expected. Another field of application concerns active structures in space, automotive or machine building industry. Progress was achieved by combining flexible board and piezo technology which opens up a new class of reliable ready to use actuator and sensor modules. Tailored design and packaging are seen as key factors for progress in custom applications. Load carrying structures with embedded actuators, sensors and electronics, which are usually pre-integrated in modules, offer the opportunity for noise reduction, vibration and shape control and health monitoring. The present paper summarizes the potential of advanced, microsystems compatible piezotechnology for active structures and systems. The focus will be given to PZT film and fibre processing and the integration in silicon wafer, ceramic multilayer and polymer matrix architectures. Finally, forward-looking applications are highlighted.

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46

Gebhardt, Sylvia, Dörthe Ernst, Bernhard Bramlage, Markus Flössel, and Andreas Schönecker. "Integrated Piezoelectrics for Smart Microsystems - A Teamwork of Substrate and Piezo." Advances in Science and Technology 77 (September 2012): 1–10. http://dx.doi.org/10.4028/www.scientific.net/ast.77.1.

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Microelectronic substrates like silicon, alumina and LTCC (Low Temperature Cofired Ceramics) allow for high robustness and reliability, 3D packaging (electrical connection, channels, cavities and membranes) as well as integration and application of electronic components whereas piezoceramic materials offer sensor and actuator operations. To combine the advantages of both, integrated solutions are of great interest. This paper deals with two approaches of monolithic integration, (i) screen printing of piezoceramic thick films on microelectronic substrates and subsequent post firing and (ii) integration of pre-fired piezoceramic components into green LTCC multilayer packages and subsequent sintering. Functionality of smart microsystems not only depends on the outer design and construction but to a great part on interaction of substrate and piezoceramic material properties. A thorough choice of materials as well as the understanding and prevention of chemical reactions are necessary to build effective systems.

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47

Ma, Yushu, Tao Li, and Yogesh B. Gianchandani. "A Low-Temperature Batch Mode Packaging Process for Submillimeter Microsystems in Harsh Environment Applications." IEEE Transactions on Components, Packaging and Manufacturing Technology 6, no. 3 (March 2016): 366–72. http://dx.doi.org/10.1109/tcpmt.2016.2521580.

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48

Meng, Cheng, Yang, Sun, and Luo. "A Novel Seedless TSV Process Based on Room Temperature Curing Silver Nanowires ECAs for MEMS Packaging." Micromachines 10, no. 6 (May 28, 2019): 351. http://dx.doi.org/10.3390/mi10060351.

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The through-silicon-vias (TSVs) process is a vital technology in microelectromechanical systems (MEMS) packaging. The current via filling technique based on copper electroplating has many shortcomings, such as involving multi-step processes, requiring sophisticated equipment, low through-put and probably damaging the MEMS devices susceptible to mechanical polishing. Herein, a room temperature treatable, high-efficient and low-cost seedless TSV process was developed with a one-step filling process by using novel electrically conductive adhesives (ECAs) filled with silver nanowires. The as-prepared ECAs could be fully cured at room temperature and exhibited excellent conductivity due to combining the benefits of both polymethyl methacrylate (PMMA) and silver nanowires. Complete filling of TSVs with the as-prepared 30 wt% silver nanowires ECAs was realized, and the resistivity of a fully filled TSV was as low as 10−3 Ω·cm. Furthermore, the application of such novel TSV filling process could also be extended to a wide range of different substrates, showing great potential in MEMS packaging, flexible microsystems and many other applications.

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Lv, Hao, Shengbing Zhang, Wei Han, Yongqiang Liu, Shuo Liu, Yaoqin Chu, and Lei Zhang. "Design and Realization of an Aviation Computer Micro System Based on SiP." Electronics 9, no. 5 (May 7, 2020): 766. http://dx.doi.org/10.3390/electronics9050766.

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In recent years, microelectronics technology has entered the era of nanoelectronics/integrated microsystems. System in Package (SiP) and System on Chip (SoC) are two important technical approaches for microsystems. The development of micro-system technology has made it possible to miniaturize airborne and missile-borne electronic equipment. This paper introduces the design and implementation of an aerospace miniaturized computer system. The SiP chip uses Xilinx Zynq® SoC (2ARM® + FPGA), FLASH memory and DDR3 memory as the main components, and integrates with SiP high-density system packaging technology. The chip has the advantages of small size and ultra-low power consumption compared with the traditional PCB circuit design. A pure software-based DDR3 signal eye diagram test method is used to verify the improvement inf the signal integrity of the chip without the need for probe measurement. The method of increasing the thermal conductive silver glue was used to improve the thermal performance after the test and analysis. The SiP chip was tested and analyzed with other mainstream aviation computers using a heading measurement of extended Kalman filter (EKF) algorithm. The paper has certain reference value and research significance in the miniaturization of the aviation computer system, the heat dissipation technology of SiP chip and the test method of signal integrity.

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Goeke, R. S., R. K. Grubbs, D. Yazzie, A. L. Casias, and K. A. Peterson. "Gas Permeation Measurements on Low Temperature Cofired Ceramics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000323–27. http://dx.doi.org/10.4071/cicmt-2012-wa25.

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Commercial low temperature cofired ceramic (LTCC) technology is established in microelectronics and microsystems packaging, multichip and radio frequency (RF) modules, and sensors. The ability to combine structural considerations with embedded traces and components using laminated glass-ceramic tapes has created solutions to unconventional packaging requirements of micro-electro-mechanical systems (MEMS) devices. Many MEMS devices such as resonators are very sensitive to pressure and require packaging in a vacuum environment. Attaining and maintaining desirable pressure levels in sealed vacuum packages requires knowledge of the permeation characteristics of the vacuum envelope and the sealing materials. An experimental system to measure the time dependent gas permeation through LTCC at temperatures from room temperature to 500°C has been developed. This system utilizes a membrane technique in which a gas is allowed to permeate through a test sample, held at a constant temperature, into a high vacuum chamber where it is detected using mass spectrometry. The gas permeation value is determined from the steady state gas flux through the sample. The gas diffusivity and solubility in the material were calculated using data from the time dependent approach to the steady state condition. The gas-solid permeation data for helium through DuPont 951 LTCC is presented and compared to the permeation through other common vacuum envelope materials such as glasses and high-purity alumina ceramics. Application of the permeation data to the prediction of vacuum levels inside typical LTCC packaging is discussed. This data can further be utilized in designs to create LTCC packages that meet specific pressure/time operating requirements.

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