Relevant bibliographies by topics / Motherboard

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Motherboard'

Author: Grafiati
Published: 4 June 2021
Last updated: 11 February 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Motherboard.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Motherboard"

1

Li, Mao De, Cong Qiu, and Zhi Song Zheng. "Numerical Analysis of Temperature Field on the Desktop Computer Motherboard." Applied Mechanics and Materials 644-650 (September 2014): 1531–34. http://dx.doi.org/10.4028/www.scientific.net/amm.644-650.1531.

Full text
Abstract:
The motherboard is one of the most important parts of a computer. According to the ATX motherboard, this article introduces the numerical simulation of temperature field on the motherboard by using thermal analysis software. Firstly introducing the heat production of a motherboard briefly, then the article takes advantage of ANSYS software modeling based on the prototype of ATX motherboard, meshing, solving, and compares the results with the actual value which are well agreed. From the simulation results, it is shown that the display card and Northbridge CPU with higher power consumption. Their heat dissipation configuration should be enhanced.
APA, Harvard, Vancouver, ISO, and other styles
2

Li, Mao De, Zhi Song Zheng, and Cong Qiu. "Experimental Research of Thermal Effect of Desktop Computer Motherboard." Applied Mechanics and Materials 668-669 (October 2014): 826–29. http://dx.doi.org/10.4028/www.scientific.net/amm.668-669.826.

Full text
Abstract:
With the rapid development of desktop computer, its motherboard power consumption has become an important factor. In this paper, experimental research under different conditions of the motherboard components is carried out. We select four kinds of load conditions of empty load, 100% load, one high-definition movie online display and two high-definition movies online display simultaneously. Through the temperature changing, its thermal effect is shown and so as to understand its heat transfer mechanism of desktop computer motherboard. From the experimental results, it is seen that, when working time more than forty minutes, the computer motherboard temperature will reach the maximum value in each operating state.
APA, Harvard, Vancouver, ISO, and other styles
3

Yang, Hui, Ru Bin Wu, Jun Liu, and Qiong Cai. "Study on Repairing Motherboard with Fuzzy Reasoning." Advanced Materials Research 562-564 (August 2012): 1619–24. http://dx.doi.org/10.4028/www.scientific.net/amr.562-564.1619.

Full text
Abstract:
On the basis of comments sets of fuzzy reasoning, fault model and the characteristics of complex motherboard repair, fault model is introduced to diagnosis the motherboard and comments sets is used to reflect the priori knowledge. Data sources are obtained by analyzing the classification of circuit. Fuzzy relation between the chip is analyzed and illustrated by the example. Reasoning model of repairing complex motherboard can be established.
APA, Harvard, Vancouver, ISO, and other styles
4

Barabas, T. "An Autonomous Mobile Robot Controlled by a Motherboard of an Android Smartphone." Scientific Bulletin of Electrical Engineering Faculty 19, no. 2 (October 1, 2019): 44–47. http://dx.doi.org/10.1515/sbeef-2019-0020.

Full text
Abstract:
AbstractIn this paper it is proposed, for the local control of an autonomous mobile robot, the use of only a motherboard of an Android smartphone, instead of a full smartphone. Thus, in addition to presenting the mobile robot, it is shown how the control system was conceived and achieved. The control system does not contain the display or the touchscreen of the smartphone. The motherboard is connected to the motor driver via a standard interface called “Android ADK Interface”. Motion control is performed using an Android app that is run on the motherboard and that is automatically launched at the power up of the mobile robot. The app offers the possibility of automatic detection and bypass of obstacles and was created in the Android Studio programming environment.
APA, Harvard, Vancouver, ISO, and other styles
5

Shida, Haruki, Takeshi Okamoto, and Yoshiteru Ishida. "Immunity-Based Diagnosis for a Motherboard." Sensors 11, no. 4 (April 18, 2011): 4462–73. http://dx.doi.org/10.3390/s110404462.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Perminov, N. S., D. Y. Tarankova, and S. A. Moiseev. "Programmable quantum motherboard for logical qubits." Laser Physics 29, no. 12 (November 19, 2019): 124016. http://dx.doi.org/10.1088/1555-6611/ab4bd5.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Jalil, Jalal M., Ekbal H. Ali, and Hiba H. Kurdi. "Numerical and Experimental Study of CPU Cooling with Finned Heat Sink and Different P.C. Air Passages Configurations." Al-Nahrain Journal for Engineering Sciences 21, no. 1 (January 25, 2018): 99. http://dx.doi.org/10.29194/njes21010099.

Full text
Abstract:
This study investigated numerically and experimentally fluid flow and heat transfer in the desktop PC. Three patterns of the positions of air inlet and outlet were tested to find the best one for cooling. The computer components in the present study are CPU, finned heat sink, power supply, motherboard, CD, HDD and fans. Three components which were generate heat are CPU, motherboard and power supply and there were two openings for air inlet and two for air outlet. The air inlet velocities were 1.2, 1.8, 2.4 m/s with constant CPU fan velocity. The studied parameters were the changed of inlet air velocity, powers of CPU, motherboard and PSU and the positions of inlet air. The numerical results obtained are found in a good agreement with the experimental results. The experimental results show that the maximum temperature was 81 at 16.5 W and 1.2 m/s. Numerical results showed that the CPU temperature reaches 89.6 at 18.5 W and 1.2 m/s. From the results, it was found that; the temperatures of the main components (PSU and motherboard) affected little by CPU power and vice versa, the finned heat sink has higher cooling efficiency and the pattern 1 was the best pattern for CPU cooling.
APA, Harvard, Vancouver, ISO, and other styles
8

Buyuksahin, Utku. "A New Control Method for Using Inkjet Printer Motherboard as 3 Axes CNC Router's Motion Control Card." Advanced Materials Research 445 (January 2012): 225–30. http://dx.doi.org/10.4028/www.scientific.net/amr.445.225.

Full text
Abstract:
As the inkjet printers have two axes of movement, (one for scrolling of the paper and one for travelling of the cartridges) inkjets have closed loop stepper motor control cards for two axes which can be used in CNC routers. There are few studies in literature and internet about this method. The main difficulty while using these cards as motion control card is to send the motion data of the cutting process to the CNCs motor drivers. As programming ability is needed, this is the point where the projects are mostly left unfinished. In this study, a new method to help use of printer motherboards as CNC router motion control cards, with no need of programming skills and buying expensive software, is given. In this method, the third dimension of the picture is represented by colors. After drawing the two dimensional top view of the workpiece with any simple graphics painting software which can be found in every computer like Paint, is painted with the colors black to white, from the lowest level to highest respectively, like in the geographical maps which the oceans are painted darker to lighter according to the depth. As it is known that there are 16.7 millions of colors between black and white, the system is impressively precise in Z axis. The analogue signals of the colors which are sent from printers motherboard to the cartridges are captured with a PIC based circuit, which is designed for this project. Then the color codes are converted to Z axiss position data and PWM signals that are needed in Z axis motion. The X and Y axes stepper motor control PWM signals are generated by printer motherboard and used in the system just as is. While doing the cutting process on a printer motherboard attached CNC, the computer assumes as if a picture is being printed with the printer that is connected to USB or parallel port. This method is candidate to be one of the most common used home based or laboratory based CNC control methods in the near future.
APA, Harvard, Vancouver, ISO, and other styles
9

Sirakaya, Mustafa, and Ebru Kilic Cakmak. "Effects of Augmented Reality on Student Achievement and Self-Efficacy in Vocational Education and Training." International Journal for Research in Vocational Education and Training 5, no. 1 (April 26, 2018): 1–18. http://dx.doi.org/10.13152/ijrvet.5.1.1.

Full text
Abstract:
This study aimed to test the impact of augmented reality (AR) use on student achievement and self-efficacy in vocational education and training. For this purpose, a marker-based AR application, called HardwareAR, was developed. HardwareAR provides information about characteristics of hardware components, ports and assembly. The research design was quasi experimental with pre-test post-test that included a control group. The study was conducted with 46 undergraduate students in the Computer Hardware Course. Computer hardware course achievement test, motherboard assembly self-efficacy questionnaire and unstructured observation form were used in the study for data collection purposes. The control group learned the theoretical and applied information about motherboard assembly by using their textbooks (print material) while students in the experimental group used HardwareAR application for the same purpose. It was found that the use of AR had a positive impact on student achievement in motherboard assembly whereas it had no impact on students’ self-efficacy related to theoretical knowledge and assembly skills. On the other hand use of AR helped learners to complete the assembly process in a shorter time with less support. It is concluded that compared to control group students, experimental group students were more successful in computer hardware courses. This result shows that AR application can be effective in increasing achievement. It was concluded that AR application had no effect on students’ motherboard assembly theoretical knowledge self-efficacy and motherboard assembly skills self-efficacy. This result may have been affected from the fact that students had high levels of theoretical knowledge and assembly skills before the implementation. Observations showed that AR application enabled students to assemble motherboard in a shorter time with less support. It is thought that simultaneous interaction between virtual objects and real world provided by the AR application is effective in reducing assembly time. The students who were able to see the process steps and instructions directly with the help of HardwareAR application could complete the assembly by getting less help. Considering these results, it can be argued that, thanks to simultaneous interaction it provides, AR offers an important alternative for topics that need learner application and practice.
APA, Harvard, Vancouver, ISO, and other styles
10

Andrade, Lidiane Maria, Mariana Alves de Carvalho, Marcos Paulo Kohler Caldas, Denise Espinosa, and Jorge Tenòrio. "RECOVERY OF COPPER AND SILVER OF PRINTED CIRCUIT BOARDS FROM OBSOLETE COMPUTERS BY ONE-STEP ACID LEACHING." Detritus, no. 14 (February 26, 2021): 86–91. http://dx.doi.org/10.31025/2611-4135/2021.14056.

Full text
Abstract:
Over the years, the generation of Waste Electric and Electronic Equipment has been significantly increased, which leads to environmental and economic concerns. Thus, it is fundamental to develop treatment methods for these residues. Printed Circuit Boards are essential components of electronic equipments. In this sense, printed circuit boards are composed of remarkable metals, in particular, copper and silver at high and low concentrations, respectively. These metals can be recovered by the hydrometallurgical process followed by a chemical purification step. Therefore, the aim of this study was to leach silver and copper from two different printed circuit boards (memory board and motherboard) from obsolete computers by hydrometallurgical route based on only one-stage leaching in oxidant media. When compared to the motherboard, a higher recovery rate of Ag was obtained from memory boards 83% and 33%, respectively. Whereas, similar recovery rates of copper were observed for memory board and motherboard, 48% and 46%, respectively.
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Motherboard"

1

Mitchell, Lorianne D., Jennifer D. Parlamis, G. E. Boone, and C. Allen Gorman. "From the Chalkboard to the Motherboard: A Quasi-Experimental Comparison of Online and On-Ground Organizational Behavior Classes." Digital Commons @ East Tennessee State University, 2020. https://dc.etsu.edu/etsu-works/8301.

Full text
Abstract:
Book Summary: Ever-evolving technological innovation creates both opportunities and challenges for educators aiming to achieve meaningful and effective learning in the classroom and equip students with a well-honed set of technology skills as they enter the professional world. The Handbook of Teaching with Technology in Management, Leadership and Business is written by experienced instructors using technology in novel and impactful ways in their undergraduate and graduate courses, as well as researchers reporting and reflecting on studies and literature that can guide them on the how and why of teaching with technology. Combining insights from research and practice, this comprehensive Handbook provides a state-of-the-art reflection on the role and effectiveness of technology in management, leadership, and business education. It offers a variety of resources and guidelines for the application of technology across different educational contexts and courses, and explores how specific digital tools, software, and applications have been used in the classroom to promote student engagement, assessment, collaboration, learning, and leadership. The broad range of chapters will support educators, administrators, instructional designers, researchers, chief information officers, and teaching technology developers seeking to expand their knowledge on the use of teaching and learning technologies in higher-education level management, leadership, and business programs.
APA, Harvard, Vancouver, ISO, and other styles
2

Jain, Priyank P. "Explicit dynamic analysis of computer motherboards subjected to mechanical shock." Diss., Online access via UMI:, 2005.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
3

許加融. "Forecasting the Global Shipment of Motherboard." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/37821690799923925111.

Full text
Abstract:
碩士
國立交通大學
管理學院管理科學學程
99
The establishment of a suitable and effective model to explain the sales of motherboard is quite important in the fields of technology marketing and forecasting. This study seeks to utilize the Bass (1969) model to illustrate the dynamics of global motherboard market. We focus on quarterly data of the global motherboard shipment units from 2003 to 2010. The empirical results show the significant influence of consumers’ communications on the sale of motherboards. Previous motherboard adopters exercise on potential adopters by persuading the latter to imitate the former in the motherboard decision. In addition, the price is sensitive to the dramatic changes in the supply and demand of the motherboard due to the shot life cycle of the motherboard industry. Furthermore, this work finds that our model performs well in prediction accuracy. The findings in this study can provide motherboard manufacturers a valuable insight about the diffusion characteristics to help them review the fitness of their marketing strategies.
APA, Harvard, Vancouver, ISO, and other styles
4

Wu, Kuo-Hsiung, and 吳國雄. "A Study on Customer Needs of Motherboard." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/73867305748475949123.

Full text
Abstract:
碩士
國立臺北科技大學
管理學院工業工程與管理EMBA專班
99
This study investigates the customer needs in motherboard market. First, the questionnaires, Kano Two-Dimensional Quality Model, include the three dimensions from customer needs which are divided into Attractive quality, Indifferent quality and One-dimensional quality. Attractive quality contains assemble, driver installment and audio. Indifferent quality contains basic input output system (BIOS) setup, overclocking, energy conservation performance, player, video software, video format and operating system. One-dimensional quality contains power supply, central processing unit (CPU), display card, memory, peripheral device, stable system operating, smooth software operating, network bandwidth, video output and system performance. The result from Kano Two-Dimensional Quality Model shows there are five important features for customer needs including a stable system operating item of functional level, memory, display card and CPU items of compatibility level and assemble item of simplicity level. Moreover, this study applies Quality Function Deployment to find important features for technology containing BIOS, CPU, chipset, printed circuit board (PCB) and driver. These features will be considered as key factors for design.
APA, Harvard, Vancouver, ISO, and other styles
5

Ting-Cheng, Chen, and 陳鼎誠. "Operation Efficiency Analysis in Motherboard Industry -- DEA." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/77567104253937802812.

Full text
Abstract:
碩士
東吳大學
經濟學系
90
Abstract The motherboard industry has developed soon within 20 years and now become the top in the world. In 2000 the market share reached to 84.7%. However, due to the saturation of the whole market and the standardization of the products, it is obvious that the industry has stepped to centralization. The trend of “The stronger will be stronger; the weaker will be weaker” can be seen in the industry. Therefore, the improvement of efficiency, the competition within the industry, and the ways to cope with the market changes in the future are critical topics to research.. This research uses Data Envelopment Analysis and Malmquist to evaluate the 13 domestic M/B firms’ efficiency. We choose fixed assets, R&D expenses, and employees as input factors; net income as output factor. The conclusions are as follows: 1.The firm which has more input / output does not mean it has higher efficiency. 2. All of 13 firms are lack of management efficiency, and they turn to pursue higher SEC. 3.Because of abundant resources and fund, large firms have competitive advantages to broaden the products and their SEC are better than other small ones.
APA, Harvard, Vancouver, ISO, and other styles
6

Yun, Ying, and 雲穎. "Capacity planning and interactive dynamics for motherboard." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/359tut.

Full text
Abstract:
碩士
國立交通大學
工業工程與管理系所
107
Motherboard is known as the core of computer systems. Under the fierce competition in the industry, more and more features are replaceable, which causes crowding and competition effect. Along with the shrink of desktop and laptop market in the world, motherboard industry will certainly be affected to impact on Taiwan’s overall manufacturing industries. This research will discuss three major parts which matters: capacity planning, revenue forecasting, and dynamic interaction. Three metrics, such as RMSE, MAD, and MAPE, are used in this research to measure the quality of the model. Time Series and machine learning are adapted to forecast the demand of motherboard (global shipments) as well as perform capacity planning for motherboard. Taiwanese computer companies used in this research include ASUS, MSI, ASROCK, and GIGABYTE. In the past, the variables which affect the sales revenues were more complicated than those affect the global shipments, which can be trade variables, consumer products, economic factors, etc. This research applies the concept of product mix to forecast the sales revenue of computer companies. As we know, the motherboard requires a large number of chips, which enables domestic manufacturers to actively develop related components and then indirectly drives the growth of Taiwan semiconductor industry, especially driven by the motherboard industry and related computer products including desktops, laptops, and servers. According to this fact, we try to explore the dynamics between the motherboard market and the market of the consumer products. In particular, Lotka- Volterra competition model has been developed to address the relationship between them and reveal managerial insights.
APA, Harvard, Vancouver, ISO, and other styles
7

Lin, Michael, and 林志青. "Design of motherboard global reverse logistics system." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/76375518966994351155.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

林國鼎. "Fatigue life analysis of motherboard under random vibration." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/99136112398162766429.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Hung, Yung-Cheng, and 洪永程. "A Study of Motherboard Diagnosis Using Machine Learning Techniques." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/ny2829.

Full text
Abstract:
碩士
國立臺北科技大學
自動化科技研究所
105
The devices used for cloud services have become more and more extensive. There are many important data stored in the cloud, so the demands for high speed and storage capacity requirements are increasing. Therefore, the design for hardware quality is more and more essential. The signal measurement is one of the important factors on the quality of motherboard hardware design. The test engineers need to identify design issues according to the test results. The junior engineers need experienced engineers to help them to analyze failure items as their experience or learning ability is insufficient. It is difficult to finish all of test items when the time and labors are limited. Computer-aided decision systems can assist test engineers in motherboard diagnosis. I this study, we developed a decision support system based on decision tree algorithms to provide inexperienced engineers with suggestions for motherboard diagnosis problems. With our system, the time for training a test engineer who just started doing the test position can be reduced. The proposed also can cope and perform under an increased or expanding workload.
APA, Harvard, Vancouver, ISO, and other styles
10

劉文忠. "The competitive strategy analysis of motherboard industry in China." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/05867268223975967545.

Full text
Abstract:
碩士
國立政治大學
經營管理碩士學程(EMBA)
98
The motherboard industry has developed soon within 20 years and now become the top in the world. In 2000 the market share reached to 84.7%. However, due to the saturation of the whole market and the standardization of the products, it is obvious that the industry has stepped to centralization. The trend of “The stronger will be stronger; the weaker will be weaker” can be seen in the industry. Therefore, the improvement of efficiency, the competition within the industry, and the ways to cope with the market changes in the future are critical topics to research. This research adopted the method of questionnaire survey and took sophomore from universities in China as research objects. We could found in this research that the time students bought their computers concentrated on 2008 and 2009；That is, the frequency which students bought their computers peaked when they were freshmen and sophomore. Also, according to this research, we could found, in the type of computers students bought, that students who bought DIY computers account for 29% and who bought note books account for 62%, the highest percentage. Furthermore, we could found, in the gender who bought computers, that the percentage of boys who bought DIY computers is obviously greater than the percentage of girls and that the percentage of girls who bought note books is obviously greater than the percentage of boys. The primary factors influenced the decision that students bought motherboards are the quality, famous brand, and friends’ recommendation.
APA, Harvard, Vancouver, ISO, and other styles
More sources

Books on the topic "Motherboard"

1

Institute Of Electrical and Electronics Engineers. IEEE standard for a versatile backplane bus: VMEbus. New York, NY: Institute of Electrical and Electronic Engineers, 1988.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
2

United States International Trade Commission. In the matter of certain electrical connectors and products containing same. Washington, DC: U.S. International Trade Commission, 1996.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
3

Timna, Seligman, and Muzeʼon Yiśraʼel (Jerusalem), eds. ʻArim semuyot. Yerushalayim: Muzeʼon Yiśraʼel, 2007.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
4

Institute Of Electrical and Electronics Engineers. IEEE standard for a metric equipment practice for microcomputers: Convection-cooled with 2 mm connectors. New York, NY, USA: Institute of Electrical and Electronics Engineers, 1991.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
5

Institute Of Electrical and Electronics Engineers. IEEE standard for a metric equipment practice for microcomputers: Convection-cooled with 2 mm connectors. New York: Institute of Electrical and Electronics Engineers, 1993.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
6

Croucher, Phil. Motherboard Companion. Advice Press, 2001.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
7

Lotia, Manahar, and Pradeep Nair. All About Motherboard. BPB Publications, 2002.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
8

Lotia, Manahar, and Pradeep Nair. Modern All About Motherboard. BPB Publications, 2003.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
9

Are You My Motherboard? Mascot Books, 2018.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
10

Learning, Thomson Delmar. E41.2 Motherboard-Troubleshooting PC Video. Delmar Learning, 1998.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Book chapters on the topic "Motherboard"

1

Weik, Martin H. "motherboard." In Computer Science and Communications Dictionary, 1046. Boston, MA: Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_11823.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Cook, David. "The Motherboard." In Robot Building for Beginners, 339–58. Berkeley, CA: Apress, 2009. http://dx.doi.org/10.1007/978-1-4302-2749-6_23.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Fischer-Hirchert, Ulrich H. P., and Ulrich Krzysztof Nieweglowski. "Optical Motherboard." In Photonic Packaging Sourcebook, 217–39. Berlin, Heidelberg: Springer Berlin Heidelberg, 2015. http://dx.doi.org/10.1007/978-3-642-25376-8_10.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Cook, David. "The Motherboard." In Robot Building for Beginners, 421–42. Berkeley, CA: Apress, 2002. http://dx.doi.org/10.1007/978-1-4302-0826-6_23.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Cook, David. "The Motherboard." In Robot Building for Beginners, 329–46. Berkeley, CA: Apress, 2015. http://dx.doi.org/10.1007/978-1-4842-1359-9_23.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Buchanan, Bill. "Local Bus and PC Motherboard." In Handbook of Data Communications and Networks, 684–709. Boston, MA: Springer US, 1999. http://dx.doi.org/10.1007/978-1-4757-0905-6_54.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Shida, Haruki, Takeshi Okamoto, and Yoshiteru Ishida. "Evaluations of Immunity-Based Diagnosis for a Motherboard." In Knowledge-Based and Intelligent Information and Engineering Systems, 628–36. Berlin, Heidelberg: Springer Berlin Heidelberg, 2010. http://dx.doi.org/10.1007/978-3-642-15393-8_70.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Gadre, Dhananjay V., and Sarthak Gupta. "PadmaBoard—Peripheral Motherboard of Tiva C Series LaunchPad." In Getting Started with Tiva ARM Cortex M4 Microcontrollers, 33–52. New Delhi: Springer India, 2017. http://dx.doi.org/10.1007/978-81-322-3766-2_4.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Perminov, Nikolay, and Diana Tarankova. "Frequency Characteristics of a Quantum Motherboard in Preprocessor and Distributed Sensor Mode." In Cyber-Physical Systems, 373–83. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-67892-0_30.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Buchanan, W. J. "PC Motherboards." In The Handbook of Data Communications and Networks, 487–508. Boston, MA: Springer US, 2004. http://dx.doi.org/10.1007/978-1-4020-7870-5_26.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Motherboard"

1

Park, Sungmee, Kenneth Mackenzie, and Sundaresan Jayaraman. "The wearable motherboard." In the 39th conference. New York, New York, USA: ACM Press, 2002. http://dx.doi.org/10.1145/513918.513961.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Konkol, Nicholas. "System Failure Analysis Process and Case Study." In ISTFA 2006. ASM International, 2006. http://dx.doi.org/10.31399/asm.cp.istfa2006p0026.

Full text
Abstract:
Abstract Failure analysis at the system level requires a well-defined process and methodology in order to drive quality improvements onto motherboards or other subsystems of a personal computer. This process needs to be structured around the type of failure mechanisms that an FA group desires to understand. This paper discusses a specific case study involving electrical overstress in a personal computer that impacted the motherboard of the system. The case study resulted in a solution to increase quality on motherboards in the context of electrical overstress prevention.
APA, Harvard, Vancouver, ISO, and other styles
3

Keil, N., H. Yao, C. Zawadzki, N. Grote, and M. Schell. "Polymer optical motherboard technology." In Integrated Optoelectronic Devices 2008, edited by Alexei L. Glebov and Ray T. Chen. SPIE, 2008. http://dx.doi.org/10.1117/12.762593.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Serafin, Stacey N., and Terrance Dishongh. "Manufacturability of Large SMT Connectors." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-33073.

Full text
Abstract:
With the advent of higher signaling frequencies on today’s motherboard, evolution suggests that the electronic industry is near a phase transition of going from through hole mount to surface mount connectors. Current computer infrastructure supports assembly of motherboards using through hole mount connectors from a historical standpoint. This legacy has led placement equipment manufacturers to develop fabrication machines that do not consider long, thin devices such as a PCI or DIMM connector. The reassessment of the world’s method of motherboard manufacturing presents a challenge. Hence the question arises, what is the realistic lifetime of a through hole mount connector and what are the assembly and reliability issues associated with a proposed replacement such as a surface mount connector. This paper addresses the basic reliability concerns of a long, thin, surface mount PCI connector both with, and without retention features.
APA, Harvard, Vancouver, ISO, and other styles
5

Geng, Phil, Robert R. Martinson, Richard L. Williams, Michael Mello, and Steve Cho. "Shadow Moire´ Evaluation of Motherboard Warpage Under Preload CPU Thermal Solutions." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73046.

Full text
Abstract:
This work investigated the motherboard coplanarity and preload correlation using the shadow moire´ interferometry. Motherboards under three different preloads in the CPU area were examined at room temperature and elevated temperature. Both the global board warpage and the local board warpage around the CPU area were measured for preload and temperature correlations. The measured board coplanarity was correlated to the board preload successfully. The results clearly identified a failure mode from the outlier, which has totally different warpage shape and corresponds to the uneven preload case. Also, the creep effect under preload during heating stage was observed and quantified.
APA, Harvard, Vancouver, ISO, and other styles
6

Kar Mun Ng and K. R. Shah. "Motherboard heat transfer modeling methodology." In Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. IEEE, 2006. http://dx.doi.org/10.1109/hdp.2006.1707563.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Opdahl, Patrick G. "Improved Electrical Failure Analysis/Fault Isolation Tool Development on Server Motherboard Platforms Based on Historic Failure Modes." In ISTFA 2004. ASM International, 2004. http://dx.doi.org/10.31399/asm.cp.istfa2004p0134.

Full text
Abstract:
Abstract Electrical fault isolation constitutes the first steps in characterizing and isolating the failure modes and root causes of a failing motherboard. Ideally the Failure Analysis Test tools provide complete coverage of all motherboard buses and silicon devices. Time and resource constraints for tool development prevent complete coverage, however, so the challenge is to provide the highest level of debug test coverage in the shortest development schedule. A simplified Fault Isolation process has been created based on historical failure analysis data to reduce the development time and resources to create tools which allow diagnosing failure root causes on high-end server motherboards. This strategy prioritizes the most common types of electrical failure modes and the types of Electrical Failure Analysis / Fault Isolation (EFA-FI) tools best suited to diagnose these modes. The benefits of this strategy include shorter EFA-FI development times, equivalent success rates in failure root cause, lower costs, and more effective EFA-FI tools that can be used within the Design Team and at either OEM or Contract Manufacturing sites.
APA, Harvard, Vancouver, ISO, and other styles
8

Stange, Kent. "Honeywell FLASH fiber optic motherboard evaluations." In SPIE's 1996 International Symposium on Optical Science, Engineering, and Instrumentation, edited by Daniel B. Thompson and Robert J. Baumbick. SPIE, 1996. http://dx.doi.org/10.1117/12.254225.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Yating, Yu, Du Pingan, and Gan Ezhong. "Structural Robustness Study of a Computer Motherboard." In 2006 IEEE International Conference on Industrial Technology. IEEE, 2006. http://dx.doi.org/10.1109/icit.2006.372636.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Park, D. S., M. Witek, X. Zhao, Y. Kang, K. Dathathreya, B. H. You, S. A. Soper, and M. C. Murphy. "Design and Fabrication of a Multi-Scale Fluidic Motherboard for a Universal Molecular Processing System (uMPS)." In ASME 2019 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/imece2019-11921.

Full text
Abstract:
Abstract A multi-scale fluidic motherboard, which can be used in a universal molecular processing system (uMPS) integrated with task-specific processing modules, was designed and fabricated in thermoplastics. The motherboard consists of a coverplate and a substrate. The coverplate included fluidic interconnects and thermal grooves on the top side, and the corresponding interconnects on the bottom side. The substrate was comprised of cell lysis microchannels, micromixers, and flow-connecting microchannels on the top side, and reservoirs for sample inputs and waste output, thermal grooves, and valve seats for flow control on the bottom side. The coverplates and substrates were fabricated with double-sided hot embossing of polycarbonate (PC) using four micromilled brass molds, two for the coverplate and another two for the substrate. Evaluation of the relative front-to-backside alignment for the double-sided hot embossing yielded an accuracy of 25 μm ± 14 μm (average ± standard deviation) for the coverplates and 30 μm ± 20 μm for the substrates. Thermal fusion bonding (TFB) of the coverplate and substrate was done using a spring plunger bonding setup with a range of temperatures and pressures. The motherboard bonded at 154 °C and 12.0 psi for 2 hours in a convection oven produced complete bonding with a little deformation of the valve seats. The complete motherboard will be integrated with the task-specific processing modules in the uMPS for investigating circulating markers from whole blood for precision molecular diagnosis of disease at low cost and with high fidelity.
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Motherboard' for particular source types:
Journal articles Dissertations / Theses Books
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography