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Journal articles on the topic 'Motherboard'

Author: Grafiati

Published: 4 June 2021

Last updated: 11 February 2022

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1

Li, Mao De, Cong Qiu, and Zhi Song Zheng. "Numerical Analysis of Temperature Field on the Desktop Computer Motherboard." Applied Mechanics and Materials 644-650 (September 2014): 1531–34. http://dx.doi.org/10.4028/www.scientific.net/amm.644-650.1531.

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The motherboard is one of the most important parts of a computer. According to the ATX motherboard, this article introduces the numerical simulation of temperature field on the motherboard by using thermal analysis software. Firstly introducing the heat production of a motherboard briefly, then the article takes advantage of ANSYS software modeling based on the prototype of ATX motherboard, meshing, solving, and compares the results with the actual value which are well agreed. From the simulation results, it is shown that the display card and Northbridge CPU with higher power consumption. Their heat dissipation configuration should be enhanced.

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2

Li, Mao De, Zhi Song Zheng, and Cong Qiu. "Experimental Research of Thermal Effect of Desktop Computer Motherboard." Applied Mechanics and Materials 668-669 (October 2014): 826–29. http://dx.doi.org/10.4028/www.scientific.net/amm.668-669.826.

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With the rapid development of desktop computer, its motherboard power consumption has become an important factor. In this paper, experimental research under different conditions of the motherboard components is carried out. We select four kinds of load conditions of empty load, 100% load, one high-definition movie online display and two high-definition movies online display simultaneously. Through the temperature changing, its thermal effect is shown and so as to understand its heat transfer mechanism of desktop computer motherboard. From the experimental results, it is seen that, when working time more than forty minutes, the computer motherboard temperature will reach the maximum value in each operating state.

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3

Yang, Hui, Ru Bin Wu, Jun Liu, and Qiong Cai. "Study on Repairing Motherboard with Fuzzy Reasoning." Advanced Materials Research 562-564 (August 2012): 1619–24. http://dx.doi.org/10.4028/www.scientific.net/amr.562-564.1619.

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On the basis of comments sets of fuzzy reasoning, fault model and the characteristics of complex motherboard repair, fault model is introduced to diagnosis the motherboard and comments sets is used to reflect the priori knowledge. Data sources are obtained by analyzing the classification of circuit. Fuzzy relation between the chip is analyzed and illustrated by the example. Reasoning model of repairing complex motherboard can be established.

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4

Barabas, T. "An Autonomous Mobile Robot Controlled by a Motherboard of an Android Smartphone." Scientific Bulletin of Electrical Engineering Faculty 19, no. 2 (October 1, 2019): 44–47. http://dx.doi.org/10.1515/sbeef-2019-0020.

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AbstractIn this paper it is proposed, for the local control of an autonomous mobile robot, the use of only a motherboard of an Android smartphone, instead of a full smartphone. Thus, in addition to presenting the mobile robot, it is shown how the control system was conceived and achieved. The control system does not contain the display or the touchscreen of the smartphone. The motherboard is connected to the motor driver via a standard interface called “Android ADK Interface”. Motion control is performed using an Android app that is run on the motherboard and that is automatically launched at the power up of the mobile robot. The app offers the possibility of automatic detection and bypass of obstacles and was created in the Android Studio programming environment.

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Shida, Haruki, Takeshi Okamoto, and Yoshiteru Ishida. "Immunity-Based Diagnosis for a Motherboard." Sensors 11, no. 4 (April 18, 2011): 4462–73. http://dx.doi.org/10.3390/s110404462.

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6

Perminov, N. S., D. Y. Tarankova, and S. A. Moiseev. "Programmable quantum motherboard for logical qubits." Laser Physics 29, no. 12 (November 19, 2019): 124016. http://dx.doi.org/10.1088/1555-6611/ab4bd5.

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7

Jalil, Jalal M., Ekbal H. Ali, and Hiba H. Kurdi. "Numerical and Experimental Study of CPU Cooling with Finned Heat Sink and Different P.C. Air Passages Configurations." Al-Nahrain Journal for Engineering Sciences 21, no. 1 (January 25, 2018): 99. http://dx.doi.org/10.29194/njes21010099.

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This study investigated numerically and experimentally fluid flow and heat transfer in the desktop PC. Three patterns of the positions of air inlet and outlet were tested to find the best one for cooling. The computer components in the present study are CPU, finned heat sink, power supply, motherboard, CD, HDD and fans. Three components which were generate heat are CPU, motherboard and power supply and there were two openings for air inlet and two for air outlet. The air inlet velocities were 1.2, 1.8, 2.4 m/s with constant CPU fan velocity. The studied parameters were the changed of inlet air velocity, powers of CPU, motherboard and PSU and the positions of inlet air. The numerical results obtained are found in a good agreement with the experimental results. The experimental results show that the maximum temperature was 81 at 16.5 W and 1.2 m/s. Numerical results showed that the CPU temperature reaches 89.6 at 18.5 W and 1.2 m/s. From the results, it was found that; the temperatures of the main components (PSU and motherboard) affected little by CPU power and vice versa, the finned heat sink has higher cooling efficiency and the pattern 1 was the best pattern for CPU cooling.

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8

Buyuksahin, Utku. "A New Control Method for Using Inkjet Printer Motherboard as 3 Axes CNC Router's Motion Control Card." Advanced Materials Research 445 (January 2012): 225–30. http://dx.doi.org/10.4028/www.scientific.net/amr.445.225.

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As the inkjet printers have two axes of movement, (one for scrolling of the paper and one for travelling of the cartridges) inkjets have closed loop stepper motor control cards for two axes which can be used in CNC routers. There are few studies in literature and internet about this method. The main difficulty while using these cards as motion control card is to send the motion data of the cutting process to the CNCs motor drivers. As programming ability is needed, this is the point where the projects are mostly left unfinished. In this study, a new method to help use of printer motherboards as CNC router motion control cards, with no need of programming skills and buying expensive software, is given. In this method, the third dimension of the picture is represented by colors. After drawing the two dimensional top view of the workpiece with any simple graphics painting software which can be found in every computer like Paint, is painted with the colors black to white, from the lowest level to highest respectively, like in the geographical maps which the oceans are painted darker to lighter according to the depth. As it is known that there are 16.7 millions of colors between black and white, the system is impressively precise in Z axis. The analogue signals of the colors which are sent from printers motherboard to the cartridges are captured with a PIC based circuit, which is designed for this project. Then the color codes are converted to Z axiss position data and PWM signals that are needed in Z axis motion. The X and Y axes stepper motor control PWM signals are generated by printer motherboard and used in the system just as is. While doing the cutting process on a printer motherboard attached CNC, the computer assumes as if a picture is being printed with the printer that is connected to USB or parallel port. This method is candidate to be one of the most common used home based or laboratory based CNC control methods in the near future.

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9

Sirakaya, Mustafa, and Ebru Kilic Cakmak. "Effects of Augmented Reality on Student Achievement and Self-Efficacy in Vocational Education and Training." International Journal for Research in Vocational Education and Training 5, no. 1 (April 26, 2018): 1–18. http://dx.doi.org/10.13152/ijrvet.5.1.1.

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This study aimed to test the impact of augmented reality (AR) use on student achievement and self-efficacy in vocational education and training. For this purpose, a marker-based AR application, called HardwareAR, was developed. HardwareAR provides information about characteristics of hardware components, ports and assembly. The research design was quasi experimental with pre-test post-test that included a control group. The study was conducted with 46 undergraduate students in the Computer Hardware Course. Computer hardware course achievement test, motherboard assembly self-efficacy questionnaire and unstructured observation form were used in the study for data collection purposes. The control group learned the theoretical and applied information about motherboard assembly by using their textbooks (print material) while students in the experimental group used HardwareAR application for the same purpose. It was found that the use of AR had a positive impact on student achievement in motherboard assembly whereas it had no impact on students’ self-efficacy related to theoretical knowledge and assembly skills. On the other hand use of AR helped learners to complete the assembly process in a shorter time with less support. It is concluded that compared to control group students, experimental group students were more successful in computer hardware courses. This result shows that AR application can be effective in increasing achievement. It was concluded that AR application had no effect on students’ motherboard assembly theoretical knowledge self-efficacy and motherboard assembly skills self-efficacy. This result may have been affected from the fact that students had high levels of theoretical knowledge and assembly skills before the implementation. Observations showed that AR application enabled students to assemble motherboard in a shorter time with less support. It is thought that simultaneous interaction between virtual objects and real world provided by the AR application is effective in reducing assembly time. The students who were able to see the process steps and instructions directly with the help of HardwareAR application could complete the assembly by getting less help. Considering these results, it can be argued that, thanks to simultaneous interaction it provides, AR offers an important alternative for topics that need learner application and practice.

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10

Andrade, Lidiane Maria, Mariana Alves de Carvalho, Marcos Paulo Kohler Caldas, Denise Espinosa, and Jorge Tenòrio. "RECOVERY OF COPPER AND SILVER OF PRINTED CIRCUIT BOARDS FROM OBSOLETE COMPUTERS BY ONE-STEP ACID LEACHING." Detritus, no. 14 (February 26, 2021): 86–91. http://dx.doi.org/10.31025/2611-4135/2021.14056.

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Over the years, the generation of Waste Electric and Electronic Equipment has been significantly increased, which leads to environmental and economic concerns. Thus, it is fundamental to develop treatment methods for these residues. Printed Circuit Boards are essential components of electronic equipments. In this sense, printed circuit boards are composed of remarkable metals, in particular, copper and silver at high and low concentrations, respectively. These metals can be recovered by the hydrometallurgical process followed by a chemical purification step. Therefore, the aim of this study was to leach silver and copper from two different printed circuit boards (memory board and motherboard) from obsolete computers by hydrometallurgical route based on only one-stage leaching in oxidant media. When compared to the motherboard, a higher recovery rate of Ag was obtained from memory boards 83% and 33%, respectively. Whereas, similar recovery rates of copper were observed for memory board and motherboard, 48% and 46%, respectively.

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11

Xu, Ken An. "Fault Analysis and Repair Computer Motherboard Interface." Applied Mechanics and Materials 687-691 (November 2014): 3415–18. http://dx.doi.org/10.4028/www.scientific.net/amm.687-691.3415.

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This paper mainly presents the common malfunction analysis and maintenance of computer motherboard interface. First introduced the mainboard interface simple maintenance of the basic knowledge, and then analyzed the frequent failures of maintenance. In the end, enumerates the maintenance examples to further understand maintenance knowledge.

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12

Minutoli, S., M. Lo Vetere, and E. Robutti. "The TOTEM T1 read out card motherboard." Journal of Instrumentation 5, no. 12 (December 29, 2010): C12052. http://dx.doi.org/10.1088/1748-0221/5/12/c12052.

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13

Westerfield, Giles, Antonija Mitrovic, and Mark Billinghurst. "Intelligent Augmented Reality Training for Motherboard Assembly." International Journal of Artificial Intelligence in Education 25, no. 1 (November 4, 2014): 157–72. http://dx.doi.org/10.1007/s40593-014-0032-x.

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14

Hapsari, Gita Indah, Giva Andriana Mutiara, and Rini Handayani. "Perancangan dan Implementasi Modul Praktikum." JURNAL INFOTEL - Informatika Telekomunikasi Elektronika 7, no. 1 (May 10, 2015): 23. http://dx.doi.org/10.20895/infotel.v7i1.26.

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Kemajuan teknologi berbasis komputer berkembang dengan sangat pesat. Seiring dengan perkembangan jaman, kemajuan tersebut memberikan pengaruh terhadap perubahan cara penyampaian pengajaran yang mengarah pada penggunaan jenis media penyampaian. Praktikum merupakan salah satu bentuk pengajaran yang memberikan pengalaman belajar secara nyata terhadap kondisi sebenarnya di lapangan mengenai penggunaan dan implementasi alat praktek yang berhubungan dengan berbagai materi yang dipelajari oleh mahasiswa dan memiliki tujuan untuk memberikan keterampilan dan pengenalan terhadap mahasiswa/peserta didik. Penelitian ini melakukan implementasi teknologi augmented reality terhadap salah satu modul praktikum yaitu pengenalan tata letak hardware dan Port I/O pada motherboard dan bertujuan sebagai alat bantu penyampaian pengajaran praktikum. Pengimplementasian teknologi augmented reality melibatkan aksi oleh user terhadap media penangkapan gambar motherboard menggunakan web camera dan tampilan pemetaan tata letak hardware dan port i/o pada motherboard. Penelitian telah diimplementasikan dan diujicoba terhadap 3 kelas dengan 97 responder. Adapun hasil dari penelitiannya adalah 83% responder menyukai aplikasi, 77% memahami materi, 84,5% menginginkan aplikasi ini menjadi alat bantu ajar, 65,98% meminta materi untuk dilengkapi dan diperbanyak, 77,3% dapat belajar mandiri menggunakan aplikasi ini, tanpa bantuan dari dosen ataupun asisten.

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15

Barman, Soumitra, Bibudha Parasar, Pradip Kundu, and Soumyajit Roy. "A copper based catalyst for poly-urethane synthesis from discarded motherboard." RSC Advances 6, no. 79 (2016): 75749–56. http://dx.doi.org/10.1039/c6ra14506j.

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16

Sen, Rabindra Nath, and Paul H. P. Yeow. "Cost effectiveness of ergonomic redesign of electronic motherboard." Applied Ergonomics 34, no. 5 (September 2003): 453–63. http://dx.doi.org/10.1016/s0003-6870(03)00065-6.

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17

Li, Meng, Shi, Gao, Zhang, Li, and Wang. "A Cost-Effective Solution to Improving the Electrical Performance of Metal Contacting Interfaces in IC System under Temperature-Humidity Environment." Applied Sciences 9, no. 19 (September 20, 2019): 3950. http://dx.doi.org/10.3390/app9193950.

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Temperature-humidity (TH) induced failure mechanism (FM) of metal contacting interfaces in integrated circuit (IC) systems has played a significant role in system reliability issues. This paper focuses on central processing unit (CPU)/motherboard interfaces and studies several factors that are believed to have a great impact on TH performance. They include: Enabling load, surface finish quality, and contacting area. Test vehicles (TVs) of Clarkdale package and of Ibex peak motherboard were designed to measure low level contact resistance (LLCR) for catching any failure. Several sets of design of experiments (DOE) were conducted on 85°C/85% relative humidity and test results were analyzed. A proposal that correlates asperity spots and contact tip design with contact resistance was proposed and thus a cost-effective solution for improving electrical performance under TH was deduced. The proposal has proven to be reasonably effective in practice.

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18

PARK, JONG-HOON, HONG-JUNE PARK, BO-KYOUNG CHOI, OH-HYUN KIM, and SI-DON CHOI. "SIMULTANEOUS SWITCHING NOISE ANALYSIS OF A 16 MB × 9 DRAM SIMM MEMORY MODULE." International Journal of High Speed Electronics and Systems 06, no. 04 (December 1995): 647–68. http://dx.doi.org/10.1142/s0129156495000249.

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HSPICE simulations have been performed for a 16 Mb×9 SIMM memory module and the simultaneous switching noise has been investigated. The SPICE model of the SIMM memory module is made up of a PCB circuit model and a simplified DRAM chip model. To keep the SPICE simulation time within reasonable bounds, a simplified circuit model of a 16 Mb DRAM chip was generated by keeping the basic physical DRAM structure in the model including the bit-line sense amplifiers. The parameter values of the circuit elements in the simplified DRAM chip model were tuned to fit the measured transient supply current waveform of a commercial 16 Mb DRAM chip. The SIMM module was placed on a fabricated motherboard PCB and the simultaneous switching noise voltage on the motherboard VSS plane was measured. Good agreement between measurements and HSPICE simulations were observed.

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19

Sun, Zhuowen, Kevin Chen, and Richard Crisp. "DIMM-in-a-PACKAGE (DIAP) signal integrity for high-performance on-board memory applications." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000223–27. http://dx.doi.org/10.4071/isom-2013-tp12.

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The recent explosion of thin notebooks and tablets has challenged the IC packaging industry to come up with new solutions of DRAM integration onto motherboard. Beyond traditional SO-DIMMs, innovative memory solutions should perform well at high speed (1600 MT/s) with much reduced footprint and z-height, while leveraging current manufacturing infrastructure for lower cost and also enabling simpler and cheaper motherboard design. To accomplish all the goals stated above for high-performance on-board memory applications, we showed a new DIMM-in-a-Package (DIAP) technology. This 22.5×17.5×1.2mm quad-die face-down (QFD) part has four standard center bond DDR3L dies (each ×16) face-down, which are wire-bonded to the bottom layer of the 407-ball BGA package. This judiciously designed package places data nets at the peripheral and command/control/address nets in the middle of the BGA. As such, motherboard design and layout were substantially simplified to allow the use of low-cost non-HDI Type 3 board for signal integrity performance comparable to expensive HDI boards. The QFD™ ball assignment could accommodate future memory density expansion and different memory type (e.g. LPDDR3, DDR4). It also enables dual-rank operations in each channel when double-sided assembly is used. We successfully demonstrated in production build that 1GB ×64 DDR3L QFD with data rate of 1600 MT/s can be achieved on a Type 3 motherboard for the Intel Haswell mobile platform in dual-channel dual-rank operation. A balanced-T Command/Address topology between the processor and the memory was implemented in a DELL XPS 12 Ultrabook. Channel simulations including chip, package and board were performed. We also conducted cross-talk analysis up to 9 aggressors to take into account the timing impact from the dense routing inside QFD. Layout optimization techniques for best signal integrity, such as trace length matching and stub length minimization, were discussed in detail and applied to both package and motherboard design. Lastly, we also presented and discussed DIAPs currently under study with different memory bus topologies for even higher data rate up to 2400 MT/s using the same QFD technology. Our results and analysis demonstrated DIAP using wirebond-based QFD technology as a viable candidate for the compact, low-cost, high-performance on-board memory solution. We have identified several key aspects of DIAP architecture design and physical layout that are strongly impacting the SI of QFD parts at rate >1600 MT/s and that could be optimized for DDR4 operations. QFD DIAP can become an attractive low-cost, high-performance option for many OEMs and ODMs in various mobile, personal and network computing platforms.

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20

Sun, Rong Chun, and Yan Xin Yu. "Test and Simulation System of Multi-Axis Controller." Advanced Materials Research 860-863 (December 2013): 1069–72. http://dx.doi.org/10.4028/www.scientific.net/amr.860-863.1069.

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To realize the online error analysis and verification of control strategy, it is necessary to simulate the states of the motion mechanism, and accurately to obtain the motion relationship between multi-axis and between motors. So a test and simulation system of multi-axis controller was designed. The system consists of a unit of real-time acquisition and analysis, a simulation unit of motor loads, a motherboard and a computer. Motor driving signals for multi channels are synchronously sampled and analyzed by the unit of acquisition and analysis. Motherboard is used to link the various parts. The working states of motor divers under loads are simulated by simulating the motor loads. In the industrial computer, the control effects of multi-axis control system are displayed by 3D simulation. Test results show that the system is stable and reliable, and has a certain application value.

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21

Swettlen, Tim, Juan Landeros, Scott Mokler, and Antonio Caputo. "Recess in the motherboard architectures for small form factor systems." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000013–18. http://dx.doi.org/10.4071/2380-4505-2018.1.000013.

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Abstract This paper details an architecture that includes a recess in motherboard (RiMB) to enable increased packaging density of functional components for next generation mobile personal computing products. The recess depth, manufacturing methods, and SMT assembly data are included to provide the reader with a full overview of the manufacturing and assembly challenges.

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22

Zhou, Liang, Feng Hou, Chuan Rui Zhu, and Liang Li. "The Development of an Automatic Leather Nesting System." Materials Science Forum 800-801 (July 2014): 398–401. http://dx.doi.org/10.4028/www.scientific.net/msf.800-801.398.

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To solve the problem of irregular leather nesting, a “Revolution-Rotation” algorithm is put forward on the base of heurism search in this paper. The system can be applied in nesting problem in both regular and irregular motherboard, and can achieve the balance of material utilization and nesting efficiency.

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23

Kim, Seunghwan, and Alenka Zajic. "Characterization of 300-GHz Wireless Channel on a Computer Motherboard." IEEE Transactions on Antennas and Propagation 64, no. 12 (December 2016): 5411–23. http://dx.doi.org/10.1109/tap.2016.2620598.

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Chang, Pao-Long, and Chao-Chan Wu. "The study of efficiency and productivity in Taiwan motherboard industry." Journal of Information and Optimization Sciences 28, no. 6 (November 2007): 945–64. http://dx.doi.org/10.1080/02522667.2007.10699782.

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Dong, Zhi Bo, Yan Hong Wei, Wen Jian Zheng, Guang Xu Hu, and Rui Ma. "Welding Sequence Optimization of TA15 Airplane Wall Panels." Materials Science Forum 704-705 (December 2011): 1045–50. http://dx.doi.org/10.4028/www.scientific.net/msf.704-705.1045.

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TA15 airplane wall panels are used widely in aircraft manufacture, which consist of some reinforced ribs and a motherboard. Therefore, welding sequences of different reinforced ribs directly determine distortion and residual stress distributions of welding wall panels, and then affect the structure service performance. Therefore, it is important to get the optimistic sequence during manufacture processing of welding wall panels. This paper analyses and predicts regularities of distributions of residual distortion and stress under four kinds of different welding sequence namely, order welding sequence, head-tail welding, head-tail symmetry welding and center symmetry welding. Compared the distortion and residual stress of four kinds of sequences, it is obvious that the welding distortion is smaller and welding quality is better under head-tail symmetry welding sequence, and the order welding sequence is the worst. The simulated distortions are in good agreement with the experiments. So this study puts forward the best welding sequence when welding airplane wall panels, which adapt to any amounts of reinforced ribs welded with the motherboard.

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26

Yan, Jin, Hong Yan Chen, and Min Cheng. "The Design of Portable Motorcycle Exhaust Analyzer Software System Based on the Operating Mode Method." Advanced Materials Research 482-484 (February 2012): 426–30. http://dx.doi.org/10.4028/www.scientific.net/amr.482-484.426.

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The motorcycle exhaust analyzer based on the operating mode method in existence occupies a large area and is very expensive. In this article, the small industrial computer motherboard is used, and the software system of the portable motorcycle exhaust gas analyzer based on the operating mode method is designed, it realizes convenient detection about the motorcycle exhaust.

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Vegda, Hiral, and Nimesh Modi. "Intrusion Detection in Wireless Network using BIOS and Motherboard Serial Number." International Journal of Computer Applications 164, no. 6 (April 17, 2017): 16–19. http://dx.doi.org/10.5120/ijca2017913655.

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28

Wang, Fu-Kwun, and Timon Du. "Implementing support vector regression with differential evolution to forecast motherboard shipments." Expert Systems with Applications 41, no. 8 (June 2014): 3850–55. http://dx.doi.org/10.1016/j.eswa.2013.12.022.

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Bandura, K., A. N. Bender, J. F. Cliche, T. de Haan, M. A. Dobbs, A. J. Gilbert, S. Griffin, et al. "ICE: A Scalable, Low-Cost FPGA-Based Telescope Signal Processing and Networking System." Journal of Astronomical Instrumentation 05, no. 04 (December 2016): 1641005. http://dx.doi.org/10.1142/s2251171716410051.

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We present an overview of the ‘ICE’ hardware and software framework that implements large arrays of interconnected field-programmable gate array (FPGA)-based data acquisition, signal processing and networking nodes economically. The system was conceived for application to radio, millimeter and sub-millimeter telescope readout systems that have requirements beyond typical off-the-shelf processing systems, such as careful control of interference signals produced by the digital electronics, and clocking of all elements in the system from a single precise observatory-derived oscillator. A new generation of telescopes operating at these frequency bands and designed with a vastly increased emphasis on digital signal processing to support their detector multiplexing technology or high-bandwidth correlators — data rates exceeding a terabyte per second — are becoming common. The ICE system is built around a custom FPGA motherboard that makes use of an Xilinx Kintex-7 FPGA and ARM-based co-processor. The system is specialized for specific applications through software, firmware and custom mezzanine daughter boards that interface to the FPGA through the industry-standard FPGA mezzanine card (FMC) specifications. For high density applications, the motherboards are packaged in 16-slot crates with ICE backplanes that implement a low-cost passive full-mesh network between the motherboards in a crate, allow high bandwidth interconnection between crates and enable data offload to a computer cluster. A Python-based control software library automatically detects and operates the hardware in the array. Examples of specific telescope applications of the ICE framework are presented, namely the frequency-multiplexed bolometer readout systems used for the South Pole Telescope (SPT) and Simons Array and the digitizer, F-engine, and networking engine for the Canadian Hydrogen Intensity Mapping Experiment (CHIME) and Hydrogen Intensity and Real-time Analysis eXperiment (HIRAX) radio interferometers.

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Xu, Kai Hua, Di Zhang, Yu Hua Liu, Ke Xu, and Yuan Hao Xi. "Design of Deformation Monitoring Terminal System Based on STM32." Applied Mechanics and Materials 347-350 (August 2013): 628–33. http://dx.doi.org/10.4028/www.scientific.net/amm.347-350.628.

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One monitoring Terminal system based on STM32 is introduced in this paper. The system used STM32 as core controller, GPIO and USART as control and communication channel. GPS, GPRS, wired transmission and power section together makes up the system motherboard. The design has been tested and been applied in geology disaster monitoring. Results show that it is adapted to the harsh environment outdoors and long term working conditions.

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Mlakić, Dragan, Hamid Baghaee, Srete Nikolovski, Marko Vukobratović, and Zoran Balkić. "Conceptual Design of IoT-Based AMR Systems Based on IEC 61850 Microgrid Communication Configuration Using Open-Source Hardware/Software IED." Energies 12, no. 22 (November 10, 2019): 4281. http://dx.doi.org/10.3390/en12224281.

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This paper presents an intelligent electronic device (IED) utilized for automatic meter readings (AMR) scheme using “Open-Source” software. This IED is utilized to measure a low-voltage intelligent electronic device) system with a boundless number of sensors, and it is accessible on the Internet of Things (IoT). The utilized equipment for this task is Arduino UNO R3 motherboard and fringe sensors, which are used for measurement of the referenced information. The Arduino motherboard is used not only for sole tranquility of equipment but also for serving as wireless fidelity (Wi-Fi) switch for the sensors. The personal computer is utilized to gather information and perform client-side calculations. The server works based on an open-source program written in Java programming language. The underlying objective of the proposed scheme is to make the meter based on the “Do It Yourself” methodology which requires considerably fewer funds. Also, it is conceivable by keeping easy to understand interface, information legitimacy, precision of measured information and convenience for the conclusive client. The information is measured in just about 1 ms which is superb for custom-designed IED. Furthermore, the measured qualities are calculated based on their RMS values to be used for analyzing and further presentation of data.

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Bieliński, Henryk, and Jarosław Mikielewicz. "Computer cooling using a two phase minichannel thermosyphon loop heated from horizontal and vertical sides and cooled from vertical side." Archives of Thermodynamics 31, no. 4 (October 1, 2010): 51–59. http://dx.doi.org/10.2478/v10173-010-0027-4.

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Computer cooling using a two phase minichannel thermosyphon loop heated from horizontal and vertical sides and cooled from vertical sideIn the present paper it is proposed to consider the computer cooling capacity using the thermosyphon loop. A closed thermosyphon loop consists of combined two heaters and a cooler connected to each other by tubes. The first heater may be a CPU processor located on the motherboard of the personal computer. The second heater may be a chip of a graphic card placed perpendicular to the motherboard of personal computer. The cooler can be placed above the heaters on the computer chassis. The thermosyphon cooling system on the use of computer can be modeled using the rectangular thermosyphon loop with minichannels heated at the bottom horizontal side and the bottom vertical side and cooled at the upper vertical side. The riser and a downcomer connect these parts. A one-dimensional model of two-phase flow and heat transfer in a closed thermosyphon loop is based on mass, momentum, and energy balances in the evaporators, rising tube, condenser and the falling tube. The separate two-phase flow model is used in calculations. A numerical investigation for the analysis of the mass flux rate and heat transfer coefficient in the steady state has been accomplished.

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Huang, Zhiqi, Houjun Wang, and Dongyi Chen. "The study on the vibration optimization model of the wearable computer motherboard." JOURNAL OF ELECTRONIC MEASUREMENT AND INSTRUMENT 2009, no. 10 (December 17, 2009): 31–36. http://dx.doi.org/10.3724/sp.j.1187.2009.10031.

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Yang, Chen-Lung, C. H. Lin, and Chwen Sheu. "Developing Manufacturing Flexibility through Supply Chain Activities: Evidence from the Motherboard Industry." Total Quality Management & Business Excellence 18, no. 9 (November 2007): 957–72. http://dx.doi.org/10.1080/14783360601150024.

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Jones, C. A., K. Cooper, P. J. Ayliffe, J. D. Rush, R. G. Waller, M. W. Nield, P. M. Harrison, and A. R. Thurlow. "2.4 Gbit/s transceiver using silica waveguides on a silicon optical motherboard." Electronics Letters 31, no. 25 (December 7, 1995): 2208–10. http://dx.doi.org/10.1049/el:19951489.

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Greenhalgh-Spencer, Heather. "Reproducing the Motherboard: The Invisible Labor of Discourses that Gender Digital Fields." Studies in Philosophy and Education 36, no. 1 (October 13, 2016): 33–48. http://dx.doi.org/10.1007/s11217-016-9540-5.

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Jorgensen, Erik J., Frank T. Werner, Milos Prvulovic, and Alenka Zajić. "Deep Learning Classification of Motherboard Components by Leveraging EM Side-Channel Signals." Journal of Hardware and Systems Security 5, no. 2 (June 2021): 114–26. http://dx.doi.org/10.1007/s41635-021-00116-2.

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Ali, Abbas M., S. D. Gore, and Musaab AL-Sariera. "The Use of Neural Network to Recognize the Parts of the Computer Motherboard." Journal of Computer Science 1, no. 4 (April 1, 2005): 477–81. http://dx.doi.org/10.3844/jcssp.2005.477.481.

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39

Hunziker, W., W. Vogt, H. Melchior, P. Buchmann, and P. Vettiger. "Passive self-aligned low-cost packaging of semiconductor laser arrays on Si motherboard." IEEE Photonics Technology Letters 7, no. 11 (November 1995): 1324–26. http://dx.doi.org/10.1109/68.473486.

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Yung, Ing-Shane, and Ming-Hong Lai. "Dynamic capabilities in new product development: the case of Asus in motherboard production." Total Quality Management & Business Excellence 23, no. 9-10 (October 2012): 1125–34. http://dx.doi.org/10.1080/14783363.2012.669542.

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Faraji, Hamza, Mustapha Faraji, and Mustapha El Alami. "Computational parametric study of latent melting heat storage." MATEC Web of Conferences 286 (2019): 08008. http://dx.doi.org/10.1051/matecconf/201928608008.

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This paper presents a numerical study of the melting process of a phase change material for the cooling of a heat source “electronic component”. The latter is protruding and mounted on a substrate "motherboard" in the center of the bottom wall of a rectangular enclosure. The enclosure is filled completely with PCM. A 2D non-dimensional mathematical model is developed based on the conservation equations of mass, momentum and energy. The enclosure aspect ratio ‘A’ effect on the thermal and hydrodynamic behavior of the PCM-based heat sink is investigated.

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Clayton, James E. "Flex-DIMM – A New High Density Module Form Factor." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000806–9. http://dx.doi.org/10.4071/isom-2015-thp31.

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The Dual In-Line Memory Module (DIMM) has remained relatively unchanged for the past two decades, with exception of an increase in PCB size, I/O pads and layer count. A new generation called Flex-DIMM is introduced by replacing the rigid-PCB substrate with a thin, bifurcated, flexible circuit that enables several improvements; including a thinner cross-section, better signal integrity with lower layer count, better thermal dissipation and ability to be directly mated to the surface of a motherboard. Originally intended for RDIMM applications, the new module may be an ideal solution for clustered microservers.

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Cao, Qing Song, Jian Li, and Ji Hui Zhou. "The Design of Display System for Elevator Enclosure Based on STC11L60XE." Applied Mechanics and Materials 241-244 (December 2012): 2179–83. http://dx.doi.org/10.4028/www.scientific.net/amm.241-244.2179.

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In order to meet the requirement of magnificent appearance and humanization of the elevator car's decoration, this paper designs a elevator car's display system based on the STC11L60XE. This system is consisted of control module, display module, DS1302 clock module and SJA1000 transceiver module. The control module collects data from the DS1302, uses SJA1000 to receive and analyse data from the elevator motherboard, then drives LCD controller to display information of time and elevator running state. The actual tests in elevator shows that the system has a normal and stable display and can achieve reservation functions.

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Wang, Fu-Kwun, Yu-Yao Hsiao, and Ku-Kuang Chang. "Combining Diffusion and Grey Models Based on Evolutionary Optimization Algorithms to Forecast Motherboard Shipments." Mathematical Problems in Engineering 2012 (2012): 1–10. http://dx.doi.org/10.1155/2012/849634.

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It is important for executives to predict the future trends. Otherwise, their companies cannot make profitable decisions and investments. The Bass diffusion model can describe the empirical adoption curve for new products and technological innovations. The Grey model provides short-term forecasts using four data points. This study develops a combined model based on the rolling Grey model (RGM) and the Bass diffusion model to forecast motherboard shipments. In addition, we investigate evolutionary optimization algorithms to determine the optimal parameters. Our results indicate that the combined model using a hybrid algorithm outperforms other methods for the fitting and forecasting processes in terms of mean absolute percentage error.

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Iqbal, A. M., M. S. A. Aziz, M. Z. Abdullah, and M. H. H. Ishak. "Temperature Prediction on Flexible Printed Circuit Board in Reflow Oven Soldering for Motherboard Application." IOP Conference Series: Materials Science and Engineering 530 (July 15, 2019): 012019. http://dx.doi.org/10.1088/1757-899x/530/1/012019.

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Hunziker, W., R. Ngo, G. Laube, F. Pommereau, H. Melchior, T. Fillion, P. Doussiere, et al. "Self-aligned flip-chip packaging of tilted semiconductor optical amplifier arrays on Si motherboard." Electronics Letters 31, no. 6 (March 16, 1995): 488–90. http://dx.doi.org/10.1049/el:19950293.

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Dašić, P., C. Hutanu, V. Jevremović, R. Dobra, M. Risteiu, and I. Ileana. "High Accuracy Investigation of Microwave Absorption in Polymer Electrical Components on Motherboard of Computers." IOP Conference Series: Materials Science and Engineering 209 (June 2017): 012068. http://dx.doi.org/10.1088/1757-899x/209/1/012068.

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Wang, Chih-Hsuan, and Yin Yun. "Demand planning and sales forecasting for motherboard manufacturers considering dynamic interactions of computer products." Computers & Industrial Engineering 149 (November 2020): 106788. http://dx.doi.org/10.1016/j.cie.2020.106788.

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Parker, J. W., P. M. Harrison, P. J. Ayliffe, T. V. Clapp, M. C. Geear, and R. G. Peall. "6 × 700 Mbit/s array transmitter/receiver pair realised in optohybrid silicon motherboard technology." Microelectronic Engineering 19, no. 1-4 (September 1992): 215–18. http://dx.doi.org/10.1016/0167-9317(92)90426-r.

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Rymarczyk, Tomasz, Michał Gołąbek, Piotr Lesiak, Andrzej Marciniak, and Mirosław Guzik. "CONSTRUCTION OF AN ULTRASONIC TOMOGRAPH FOR ANALYSIS OF TECHNOLOGICAL PROCESSES IN THE FIELD OF REFLECTION AND TRANSMISSION WAVES." Informatyka, Automatyka, Pomiary w Gospodarce i Ochronie Środowiska 9, no. 4 (December 15, 2019): 43–47. http://dx.doi.org/10.35784/iapgos.569.

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This article presents the ultrasonic structure for the analysis of technological processes in the field of reflective and transmission waves. Ultrasound tomography enables the analysis of processes occurring in the examined object without interfering with its interior through appropriate acquisition and analysis of data. The design goal is to verify the repeatability of measurement results by eliminating laboratory equipment. The ultrasonic tomograph has been designed in a modular way and consists of a motherboard connected to an analog signal conditioning board, a liquid crystal display with an integrated graphics processor and a high voltage pulser with a 64 channel multiplexer. The solution was designed for tomographic measurements of technological process properties.

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