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Relevant bibliographies by topics / Multi-layered Stack Assemblies

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Journal articles
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Academic literature on the topic 'Multi-layered Stack Assemblies'

Author: Grafiati

Published: 6 September 2023

Last updated: 31 July 2025

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Journal articles on the topic "Multi-layered Stack Assemblies"

1

Pan, Tsung-Yu, and Yi-Hsin Pao. "Deformation in Multilayer Stacked Assemblies." Journal of Electronic Packaging 112, no. 1 (1990): 30–34. http://dx.doi.org/10.1115/1.2904337.

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A linear-elastic analytical model has been developed to describe the deformed geometry of a multi-layered stack assembly subject to thermal loading. The model is based on Timoshenko’s bimetal thermostat analysis [1] and consists of a series of first-order polynomial equations. The radius of curvature, bending moment, force, horizontal and vertical displacements can be determined numerically. These quantities match well with finite element analysis. Calculations for silicon power transistor stacks are presented in order to demonstrate the model capability. The results from this analyitcal model

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2

Bertocci, Francesco, Andrea Grandoni, and Tatjana Djuric-Rissner. "Scanning Acoustic Microscopy (SAM): A Robust Method for Defect Detection during the Manufacturing Process of Ultrasound Probes for Medical Imaging." Sensors 19, no. 22 (2019): 4868. http://dx.doi.org/10.3390/s19224868.

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The main aim of this paper is to provide the feasibility of non-destructive testing (NDT) method, such as scanning acoustic microscopy (SAM), for damage detection in ultrasound (US) probes for medical imaging during the manufacturing process. In a highly competitive and demanding electronics and biomedical market, reliable non-destructive methods for quality control and failure analysis of electronic components within multi-layered structures are strongly required. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies, such as the acousti

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3

Dailly, Julian, Daniel Schmider, Philipp Blanck, Mathieu Marrony, and Olaf Deutschmann. "Protonic Ceramic Membranes: Up-Scaling and Application to E-Fuels Synthesis." ECS Meeting Abstracts MA2024-02, no. 48 (2024): 3474. https://doi.org/10.1149/ma2024-02483474mtgabs.

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Abstract The production of synthetic fuels / chemicals relies on the availability of the reactants: low-carbon H2, CO2 valorization from various CO2 sources, N2. In addition, the value chains are not enough mature to be considered as commercial and still need improvement. The main levers are high production costs of conversion processes, access to biologic or fatal CO2 sources and issues related to the H2 supply chain (H2 cost, heat recovery, etc.). The main streams for improving current e-fuels conversion technologies being explored by industry are focused on new catalyst materials and new re

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4

Haley, Kristine L., Jeffrey A. Cloninger, Kayla Cerminara, et al. "Heated Assembly and Transfer of Van der Waals Heterostructures with Common Nail Polish." Nanomanufacturing 1, no. 1 (2021): 49–56. http://dx.doi.org/10.3390/nanomanufacturing1010005.

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Recent advances in the manipulation and control of layered, two-dimensional materials has given way to the construction of heterostructures with new functionality and unprecedented electronic properties. In this study, we present a simple technique to assemble and transfer van der Waals heterostructures using common nail polish. Commercially available nail polish acts as a resilient sticky polymer, allowing for the fabrication of complex multi-material stacks without noticeable fatigue. Directly comparing four commercially available brands of nail polish, we find that one stands out in terms o

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5

Ganguly, Udayan, Tuo-Hung Hou, and Edwin Kan. "Effects of Metal Nanocrystals and Traps in Tunneling Rate Measurements in Metal Nanocrystal Based Carbon Nanotube Memory." MRS Proceedings 963 (2006). http://dx.doi.org/10.1557/proc-0963-q14-03.

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ABSTRACTThe metal nanocrystal (NC) based carbon nanotube (CNT) memory device has been probed with tunneling rate measurements. Firstly, tunneling behavior at two temperatures (300K and 10K) is reported here to demonstrate the distinct charge tunneling behavior for traps versus NCs and understand their relative contributions to program operations. Low temperature measurements show clear differentiation for two regimes of quantum transport. The FN tunneling regime exhibits strong bias dependence and dominates at high electric fields producing larger tunneling rates than the direct tunneling regi

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Dissertations / Theses on the topic "Multi-layered Stack Assemblies"

1

Rammohan, B. "Design and Analysis of Multifunctional Composites for Unmanned Aerial Vehicles." Thesis, 2017. https://etd.iisc.ac.in/handle/2005/4312.

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The principal aim of this thesis is to analyse the effectiveness of multifunctional composites as intelligent structures to improve mechanical properties and activate additional non-structural features. In order to investigate these multiple aspects, a comprehensive literature review has been presented focusing on the state-of-the-art in multifunctional composites. The importance of simultaneous consideration of the nonlinearly-coupled functions in a multifunctional device is demonstrated. The development of an analytical model for a multilayer stack subjected to temperature change is demonst

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Conference papers on the topic "Multi-layered Stack Assemblies"

1

Raghavan, Sathyanarayanan, Ilko Schmadlak, George Leal, and Suresh Sitaraman. "Chip Package Co-Design: Effect of Substrate Warpage on BEOL Reliability." In ASME 2013 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/imece2013-65877.

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Large-scale integration at lower cost has led to the usage of multi-layered organic substrates in flip-chip assemblies. However, the warpage of substrate plays an important role in the reliability of back-end-of-line (BEOL) stack on a chip. In this work, we study the effect of substrate layer configuration, and thus the warpage of the substrate at reflow temperature on BEOL reliability. A plane-strain flip-chip on substrate assembly model is utilized to study the die and solder stresses for different substrate layer configurations. Apart from studying the die stresses, fracture mechanics based

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2

Lavoie, Andrew. "Lichten Award Paper: Variational Tolerance Analysis (VTA) - Design and Manufacturing Optimization Using Statistical Simulation." In Vertical Flight Society 77th Annual Forum & Technology Display. The Vertical Flight Society, 2021. http://dx.doi.org/10.4050/f-0077-2021-16817.

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Appropriate consideration of tolerances is critical to the design and manufacture of products that meet customer requirements and defined cost targets. Tolerance analysis is most commonly conducted at the individual part or sub-assembly level utilizing basic stack-up methods (worst-case analysis) to ensure the producibility of the assembled product. A worst-case analysis assumes that each dimension in the stack-up will be manufactured on the extreme end or limit of its assigned tolerance (max or min) in such a way that all tolerances become additive. This usually results in tighter than requir

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