Books on the topic 'Multichip modules (Microelectronics) Testing'
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Lau, John H. Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies. McGraw-Hill, 1997.
Find full textQiong, Yu, and Babida Sandeep 1965-, eds. Introduction to multichip modules. Wiley, 1995.
Find full text1945-, Kang Sung-Mo, ed. Physical design for multichip modules. Kluwer Academic Publishers, 1994.
Find full textIEEE Multi-Chip Module Conference (1993 Santa Cruz, Calif.). 1993 IEEE Multi-Chip Module Conference, MCMC-93, March 15-18, 1993, Santa Cruz, California: Proceedings. IEEE Computer Society Press, 1993.
Find full textIEEE, Multi-Chip Module Conference (1992 Santa Cruz Calif ). Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92: March 18-20, 1992, Santa Cruz, California. IEEE Computer Society Press, 1992.
Find full textIEEE Multi-Chip Module Conference (1992 Santa Cruz, Calif.). Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92: March 18-20, 1992, Santa Cruz, California. IEEE Computer Society Press, 1992.
Find full textIEEE Multi-Chip Module Conference (1994 Santa Cruz, Calif.). 1994 IEEE Multi-Chip Module Conference: MCMC-94, March 15-17, 1994, Santa Cruz, California : proceedings. IEEE Computer Society Press, 1994.
Find full textIEEE Multi-Chip Module Conference (1996 Santa Cruz, Calif.). Proceedings: 1996 IEEE Multi-Chip Module Conference, February 6-7, 1996, Santa Cruz, California. IEEE Computer Society Press, 1996.
Find full textIEEE Multi-Chip Module Conference (1995 Santa Cruz, Calif.). Proceedings, 1995 IEEE Multi-Chip Module Conference, January 31-February 2, 1995, Santa Cruz, California. IEEE Computer Society Press, 1994.
Find full textSandborn, Peter A. Conceptual design of multichip modules and systems. Kluwer Academic, 1994.
Find full textP, Schnorr Donald, ed. Multichip modules and related technologies: MCM, TAB, and COB design. McGraw-Hill, 1994.
Find full textKnipfer, Brent J. Multichip packaging and bare chip systems. Business Communications Co., 1994.
Find full textInternational Conference and Exhibition on Multichip Modules (6th 1997 Denver, Colo.). Proceedings: 1997 International Conference on Multichip Modules, April 2-4, 1997, The Adam's Mark Hotel, Denver, Colorado. Institute of Electrical and Electronics Engineers, 1997.
Find full textInternational, Conference on Multichip Modules and High Density Packaging (1998 Denver Colo ). Proceedings. Institute of Electrical and Electronics Engineers, 1998.
Find full textInternational, Symposium on Microelectronics (1995 Los Angeles California). 1995 International Symposium on Microelectronics: Proceedings : 24-26 October, 1995, Los Angeles Convention Center, Los Angeles, California. ISHM-The Microelectronics Society, 1995.
Find full textInternational Symposium on Microelectronics (1996 Minneapolis, Minnesota). 1996 International Symposium on Microelectronics: 8-10 October, 1996, Minneapolis Convention Center, Minneapolis, Minnesota. ISHM-The Microelectronics Society, 1996.
Find full textInternational Symposium on Microelectronics (1997 Philadelphia, Pennsylvania). 1997 International Symposium on Microelectronics: Proceedings : October 14-16, 1997, Pennsylvania Convention Center, Philadelphia, Pennsylvania. IMAPS--International Microelectronics and Packaging Society, 1997.
Find full textInternational Conference and Exhibition on Multichip Modules (5th 1996 Denver, Colo.). 1996 International Conference on Multichip Modules: Proceedings, April 17-19, 1996, Denver, Colorado. ISHM, 1996.
Find full textInternational Symposium on Microelectronics. (1993 Dallas, Tex.). 1993 International Symposium on Microelectronics: Proceedings : 9-11 November, 1993, Dallas Convention Center, Dallas, Texas. The Society, 1993.
Find full textInternational Symposium on Microelectronics (1995 Los Angeles, California). 1995 International Symposium on Microelectronics: 24-26 October, 1995, Los Angeles Convention Center, Los Angeles, California. ISHM-The Microelectronics Society, 1995.
Find full textInternational Conference and Exhibition on Multichip Modules. (2nd 1993 Denver, Colo.). Multichip modules: International conference and exhibition : 14-16 April 1993, Denver, Colorado. Published by ISHM and IEPS in cooperation with SPIE--the International Society for Optical Engineering, 1993.
Find full textMadhavan, Swaminathan, ed. Introduction to system-on-package (SOP): Miniaturization of the entire system. McGraw-Hill, 2008.
Find full textInternational Conference and Exhibition on Multichip Modules (4th 1995 Denver, Colo.). 1995 International Conference on Multichip Modules: Proceedings : 19-21 April 1995, Denver, Colorado. ISHM, 1995.
Find full textInternational Symposium on Microelectronics (27th 1994 Boston, Mass.). 27th International Symposium on Microelectronics: 15-17 November 1994, Boston, Massachusetts. The Society, 1994.
Find full textInternational Symposium on Microelectronics (27th 1994 Boston, Mass.). 27th International Symposium on Microelectronics: Proceedings : 15-17 November, 1994, Boston, Massachusetts. ISHM--The Microelectronics Society, 1994.
Find full textHirt, Etienne. System design using high density packaging and multi chip modules. Hartung-Gorre, 2000.
Find full textInternational Symposium on Microelectronics (1998 San Diego, Calif.). Proceedings 1998 International Symposium on Microelectronics: November 1-4, 1998, San Diego Convention Center, San Diego, California. IMAPS ... in cooperation with SPIE--the International Society for Optical Engineering, 1998.
Find full textEuropean Conference on Electronic Packaging Technology (1st 1994 Essen, Germany). EuPac '94: Vortäge und Posterbeiträge der 1. Europäischen Konferenz für elektronische Packaging-Technologie und des 7. Internationalen Kolloquium "Verbindungstechnik in der Elektronik" in Essen vom 1. bis 3. Februar 1994 = Lectures and poster show contributions of the 1st European Conference on Electronic Packaging Technology and the 7th International Conference "Interconnection Technology in Electronics" taking place in Essen from February 1st to 3rd 1994. DVS-Verlag, 1994.
Find full textDick, Potter, Peters Laura, and Integrated Circuit Engineering Corporation, eds. Roadmaps of packaging technology. Integrated Circuit Engineering, 1997.
Find full textInternational Symposium on Microelectronics (1993 Dallas, Tex.). Proceedings: Of the 1993 International Symposium on Microelectronics, November 9-11, 1993, Dallas Convention Center, Dallas, Texas. ISHM - The Microelectronics Society, 1993.
Find full textHabiger, Claus. An investigation into the cost-effectiveness of multi-chip modules for massively parallel computing applications. Hartung-Gorre, 1995.
Find full textNATO, Advanced Research Institute on Ceramic/Mixed Mode Multi-Chip Modules (MCM) (1994 Islamorada Fla ). MCM C/mixed technologies and thick film sensors. Kluwer Academic Publishers, 1995.
Find full textGoodman, Thomas W. FCIP and expanding markets for flip chip. Edited by Vardaman Jan and Tschirhart-Spangler Pat. TechSearch International, Technology Licensing and Consulting, 1997.
Find full textInternational, Symposium on Microelectronics (1999 Chicago Ill ). Proceedings 1999 International Symposium on Microelectronics: October 26-28, 1999, Chicago Hilton & Towers, Chicago, Illinois. IMAPS, 1999.
Find full textHwang, Jennie S. Ball grid array & fine pitch peripheral interconnections: A handbook of the technology & applications for microelectronics/electronics manufacturing. Electrochemical Publications Ltd, 1995.
Find full textVardaman, Jan. Worldwide developments in MCP integration: Markets & trends. TechSearch International, 1998.
Find full textKellerman, David. Prevalent single chip packages for integrated circuit packages. Business Communications Co., 1997.
Find full textSherwani, N. A. Routing in the third dimension: From VLSI chips to MCMs. IEEE Press, 1995.
Find full textInternational Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (4th 2000 Espoo, Finland). 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing ; proceedings: Presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000. Edited by Kivilahti Jorma, Hyytiäinen Marika, Nokia (Firm), and Adhesives 2000 (2000 : Espoo, Finland). IEEE, 2000.
Find full textH, Lau John, Electronic Industries Association, and IEEE Components, Hybrids, and Manufacturing Technology Society., eds. Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium: Integrated manufacturing, the future is now : September 28-30, 1992, Baltimore, MD, USA. Institute of Electrical and Electronics Engineers, 1993.
Find full textSergent, Jerry E. Thermal management handbook: For electronic assemblies. McGraw-Hill, 1998.
Find full textIEEE, Multi-Chip Module Conference (1997 Santa Cruz Calif ). Proceedings, 1997 IEEE Multi-Chip Module Conference: February 4-5, 1997, Santa Cruz, California. IEEE Computer Society Press, 1997.
Find full textIEEE Multi-Chip Module Conference (1997 Santa Cruz, Calif.). Proceedings, 1997 IEEE Multi-Chip Module Conference: February 4-5, 1997, Santa Cruz, California. IEEE Computer Society Press, 1997.
Find full textKinzy, Jones W., and Harsányi Gábor, eds. Multichip modules with integrated sensors. Kluwer Academic Publishers, 1996.
Find full textReliability Analysis Center (U.S.), ed. Critical review and technology assessments '91-'92. Reliability Analysis Center, 1992.
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