Relevant bibliographies by topics / Nano-packaging

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Nano-packaging'

Author: Grafiati
Published: 4 June 2021
Last updated: 17 February 2022

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Journal articles on the topic "Nano-packaging"

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Adeyeye, Samuel Ayofemi Olalekan. "Food packaging and nanotechnology: safeguarding consumer health and safety." Nutrition & Food Science 49, no. 6 (2019): 1164–79. http://dx.doi.org/10.1108/nfs-01-2019-0020.

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Purpose Nanotechnology as an emerging area if adequately harnessed could revolutionise food packaging and food processing industry worldwide. Although several benefits of nano-materials or particles in food packaging have been suggested, potential risks and health hazards of nano-materials or particles are possible as a result of migration of their particles into food materials. The purpose of this review therefore assessed nanotechnology and its applications in food packaging, consumer acceptability of nano-packaged foods and potential hazards and safety issues in nano-packaged foods. Design/methodology/approach This review takes a critical assessment of previous literature on nanotechnology and its impact on food packaging, consumer health and safety. Findings Applications of nanotechnology in food packaging could be divided into three main divisions: improved packaging, which involves mixing nano-materials into polymers matrix to improve temperature, humidity and gas barrier resistance of the packaging materials. Active packaging deals with direct interaction between nano-materials used for packaging and the food to protect it as anti-microbial or oxygen or ultra violet scavengers. Smart packaging could be used to sense biochemical or microbial changes in foods, as well as a tracker for food safety, to prevent food counterfeit and adulteration. The review also discussed bio-based food packaging which is biodegradable. Bio-based packaging could serve as veritable alternative to conventional packaging which is non-degradable plastic polymers which are not environmental friendly and could pose a threat to the environment. However, bio-based packaging could reduce material waste, elongate shelf life and enhance food quality. However, several challenges are envisaged in the use of nano-materials in food packaging due to knowledge gaps, possible interaction with food products and possible health risks that could result from the nano-materials used for food packaging. Originality/value The increase in growth and utilisation of nanotechnology signifies wide use of nano-materials especially in the food sector with arrays of potential benefits in the areas of food safety and quality, micronutrients and bioactive ingredients delivery, food processing and in packaging Active studies are being carried out to develop innovative packages such as smart, intelligent and active food packaging to enhance effective and efficient packaging, as well as balanced environmental issues. This review looks at the future of nano-packaged foods vis-à-vis the roles played by stakeholders such as governments, regulatory agencies and manufacturers in looking into consumer health and safety issues related to the application of nano-materials in food packaging.
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Kuswandi, B. "Environmental friendly food nano-packaging." Environmental Chemistry Letters 15, no. 2 (2017): 205–21. http://dx.doi.org/10.1007/s10311-017-0613-7.

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Guo, Yun Tian, and Li Jiang Huo. "Study on PE/Inorganic Nano-Antibacterial Packaging Material." Applied Mechanics and Materials 731 (January 2015): 365–68. http://dx.doi.org/10.4028/www.scientific.net/amm.731.365.

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The paper describes the type and action mechanism of inorganic nano-antibacterial agent, introduces the preparation and test method of PE/ inorganic nano-packaging material. The study gives a classification overview of the development and safety evaluation study on PE/inorganic nano-packaging material. The paper also analyzes problems that currently exist in theory, technology and applications, and points out the way to solve the problems in aspects of security, standardization, multi-functional and industrialization. Finally, foresighted technology development of the study and application of the PE/ inorganic nano-packaging material is made.
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Wolter, Klaus-Juergen, and Gerald Gerlach. "Nano- and Biotechniques in Electronic Packaging." IEEE Nanotechnology Magazine 4, no. 1 (2010): 23–27. http://dx.doi.org/10.1109/mnano.2010.935970.

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Zhang, Rongfei, Xiangyou Wang, and Meng Cheng. "Preparation and Characterization of Potato Starch Film with Various Size of Nano-SiO2." Polymers 10, no. 10 (2018): 1172. http://dx.doi.org/10.3390/polym10101172.

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The various sizes (15, 30, 80, and 100 nm) of nano-SiO2/potato starch films were synthesized and characterized. The gas permeability, antibacterial properties, and mechanical properties of the films were evaluated to their potential for application as food packaging materials. Results indicated that the 100 nm nano-SiO2 was well dispersed in the starch matrix, which induced an active group on the surface of 100 nm nano-SiO2 adequately combined with starch macromolecule. The water resistance and mechanical properties of the films were improved with the addition of nano-SiO2. Notably, resistance to ultraviolet and thermal aging was also enhanced. The nano-SiO2/potato starch films were more efficient against Escherichia coli (E. coli) than Staphylococcus aureus (S. aureus). Remarkable preservation properties of the films packaging the white mushrooms were obtained, with those of the 100 nm films considered superior. This study can significantly guide the rational choice of the nano-SiO2 size to meet the packaging requirements of various agricultural products.
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Li, Xin, Shu Cai Li, and Li Qiang Huang. "Synthesis and Property of Water Borne Polyurethane/Modified Nano-ZnO Composites Packaging Membranes." Applied Mechanics and Materials 469 (November 2013): 167–70. http://dx.doi.org/10.4028/www.scientific.net/amm.469.167.

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Water borne polyurethane /modified nano-ZnO composites packaging membranes were synthesized from modified nano-ZnO, polybutyleneadipate glycol (PBA), polycaprolactone (PCL) isophorne diisocyanate (IPDI), dimethylol propionic acid (DMPA), ethylenediamine(EDA) by self-emulsified method. The phase property, mechanical, antibacterial and anti-ultraviolet properties of the composites packaging membranes influenced by the modified nano-ZnO content were studied by scanning electron microscopy (SEM), mechanical testing, and antibacterial testing. And the relative results were analysed.
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Sánchez, C., M. Hortal, C. Aliaga, A. Devis, and V. A. Cloquell-Ballester. "Recyclability assessment of nano-reinforced plastic packaging." Waste Management 34, no. 12 (2014): 2647–55. http://dx.doi.org/10.1016/j.wasman.2014.08.006.

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Yap, Ray Chin Chong, Amegadze Paul Seyram Kwablah, Jiating He, and Xu Li. "Functions of Nano-Materials in Food Packaging." Journal of Molecular and Engineering Materials 04, no. 04 (2016): 1640015. http://dx.doi.org/10.1142/s2251237316400153.

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Food packaging has been changing from bulky and rigid form in the past to different variation of lights and plastic packagings. Regardless of the changes, the packaging must be able to uphold its original function which is to serve as food containment as well as to protect the food from the external environment. Coupled with the increasing consumer’s awareness on food waste, higher standard of living, technological developments are underway to enhance the shelf-life of packed food as well as methods to provide indications of food packaging environment. There are many different indicators for food spoilage, but two commonly found gases in food packaging are oxygen and carbon dioxide. Oxygen is the main mechanism for food spoilage, while carbon dioxide is often used in modified-atmosphere-packaging. There are also different methods of gas scavenging and/or sensing techniques based on different concepts in the literature. In this review, the focus will be on nano-materials, namely titanium dioxide, silica, zeolites and metal organic frameworks. This review is structured in a manner to highlight how each material can be used in both gas scavenging and/or indicators applications. The last part of the review focuses on the approach and some key considerations when integrating nano-materials into the plastic film.
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Morris, James E. "Reliability testing of nano-particle system packaging." Microsystem Technologies 15, no. 1 (2008): 139–43. http://dx.doi.org/10.1007/s00542-008-0654-8.

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Wong, Ching-Ping, Wei Lin, Ling-Bo Zhu, et al. "Nano materials for microelectronic and photonic packaging." Frontiers of Optoelectronics in China 3, no. 2 (2010): 139–42. http://dx.doi.org/10.1007/s12200-010-0009-9.

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Dissertations / Theses on the topic "Nano-packaging"

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Joo, Sung Chul. "Adhesion mechanisms of nano-particle silver to electronics packaging materials." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31730.

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Bleiker, Simon J. "Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems." Doctoral thesis, KTH, Mikro- och nanosystemteknik, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-207185.

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Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. 3D integration of NEMS and ICs also contributes to more compact device footprints, improves device performance, and lowers the power consumption. Therefore, 3D integration of NEMS and ICs has been proposed as a promising solution to the end of Moore’s law, i.e. the slowing advancement of complementary metal-oxide-semiconductor (CMOS) technology.In this Ph.D. thesis, I propose a comprehensive fabrication methodology for heterogeneous 3D integration of NEM devices directly on top of CMOS circuits. In heterogeneous integration, the NEMS and CMOS components are fully or partially fabricated on separate substrates and subsequently merged into one. This enables process flexibility for the NEMS components while maintaining full compatibility with standard CMOS fabrication. The first part of this thesis presents an adhesive wafer bonding method using ultra-thin intermediate bonding layers which is utilized for merging the NEMS components with the CMOS substrate. In the second part, a novel NEM switch concept is introduced and the performance of CMOS-integrated NEM switch circuits for logic and computation applications is discussed. The third part examines two different packaging approaches for integrated MEMS and NEMS devices with either hermetic vacuum cavities or low-cost glass lids for optical applications. Finally, a novel fabrication approach for through silicon vias (TSVs) by magnetic assembly is presented, which is used to establish an electrical connection from the packaged devices to the outside world.
Tredimensionell (3D) integration av mikro- och nano-elektromekaniska system (MEMS/NEMS) med integrerade kretsar (ICs) är en ny teknik som erbjuder stora fördelar jämfört med konventionell mikroelektronik. MEMS och NEMS används oftast som sensorer och aktuatorer då de möjliggör många funktioner som inte kan uppnås med vanliga ICs.3D-integration av NEMS och ICs bidrar även till mindre dimensioner, ökade prestanda och mindre energiförbrukning av elektriska komponenter. Den nuvarande tekniken för complementary metal-oxide-semicondictor (CMOS) närmar sig de fundamentala gränserna vilket drastiskt begränsar utvecklingsmöjligheten för mikroelektronik och medför slutet på Moores lag. Därför har 3D-integration identifierats som en lovande teknik för att kunna driva vidare utvecklingen för framtidens elektriska komponenter.I denna avhandling framläggs en omfattande fabrikationsmetodik för heterogen 3D-integration av NEMS ovanpå CMOS-kretsar. Heterogen integration betyder att både NEMS- och CMOS-komponenter byggs på separata substrat för att sedan förenas på ett enda substrat. Denna teknik tillåter full processfrihet för tillverkning av NEMS-komponenter och garanterar kompatibilitet med standardiserade CMOS-fabrikationsprocesser.I den första delen av avhandlingen beskrivs en metod för att sammanfoga två halvledarskivor med en extremt tunn adhesiv polymer. Denna metod demonstreras för 3D-integration av NEMS- och CMOS-komponenter. Den andra delen introducerar ett nytt koncept för NEM-switchar och dess användning i NEM-switch-baserade mikrodatorchip. Den tredje delen presenterar två olika inkapslingsmetoder för MEMS och NEMS. Den ena metoden fokuserar på hermetisk vakuuminkapsling medan den andra metoden beskriver en lågkostnadsstrategi för inkapsling av optiska komponenter. Slutligen i den fjärde delen presenteras en ny fabrikationsteknik för så kallade ”through silicon vias” (TSVs) baserad på magnetisk självmontering av nickeltråd på mikrometerskala.

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Nasiri, Aida. "Development of Safe-by-Design Nano-composites for Food Packaging Application." Thesis, Montpellier, 2017. http://www.theses.fr/2017MONTT076.

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Ce projet contribue à développer la prochaine génération de nano-emballages en utilisant une approche plus sûre et éco-conçue avec des avantages directs à la fois pour l'environnement et la sécurité des consommateurs. Les emballages alimentaires constituent l’un des principaux secteurs d’applications des nanotechnologies avec des enjeux environnementaux prometteurs de substitution des pétro-plastiques par des bio-plastiques et de réduction des pertes et gaspillages alimentaires grâce à des emballages plus performants, de type actifs et intelligents. Dans le cas de matériaux nano-composites (matrice polymérique contenant des nano-particules) destinés au contact alimentaire, le risque majeur en terme de santé humaine est lié à leur impact sur la migration de composés indésirables de l’emballage vers l’aliment (stabilisants UV, antioxydants, plastifiants, etc) qui peuvent avoir des effets néfastes en fonction des doses et durées d’exposition. Ces interactions contenant/contenu sont soumises à une réglementation européenne dont l’objectif est la protection de la santé du consommateur en fixant des limites de migration spécifique pour tous les composés supposés entrer dans la composition des matériaux plastiques dédiés au contact alimentaire. Dans le cas des nanomatériaux, la présence de nanoparticules est susceptible de modifier les interactions entre le polymère et les additifs et par voie de conséquence leurs propriétés de transfert. Ainsi, la formalisation des phénomènes de migration de l’emballage vers l’aliment établie sur des matériaux plastiques ne contenant pas de nanoparticules ne peut pas être directement transposée au nano-matériaux. De plus la présence de ces nanoparticules peut profondément modifier l’éco-toxicité environnementale du système matrice- nanoparticule -additif.La présente étude vise à comprendre et contrôler l’impact des structures nanocomposites (matrice polymérique contenant des nano-particules) sur les propriétés de transport (diffusivité et solubilité) des nanoparticules et des additifs chimiques en condition d’usage. À cet égard, il est nécessaire de combler le déficit de connaissances dans a caractérisation de la structure 3D, des propriétés physico-chimique et des interactions aux interfaces entre nanoparticules et matrice dans les nanomatériaux. Devant la complexité du système étudié, la modélisation est indispensable pour représenter (simplifier sans pour autant perdre trop de connaissances) la structure 3D des nanomatériaux et simuler, reproduire puis prédire, l’évolution de leurs propriétés de transfert en fonction des paramètres structurels et en condition d’usage. La modélisation des transferts est également indispensable pour, dans une approche d’ingénierie inverse, éco-concevoir et dimensionner à façon des nano-emballages sûrs pour l’Homme et l’Environnement. Dans cette optique une démarche de modélisation multi-échelle des relations structure/propriétés de transfert de masse a été mise en place sur des matériaux nanocomposites ciblés choisis pour leur pertinence dans le domaine de l’emballage alimentaire
The market of nanotechnologies is dominated by the food packaging area which amounts more than 20% of the total nanotechnologies market in 2015. However, the wide-scale use of nanomaterials raises important questions about environmental and safety issues that could hinder their development. In the case of plastics intended to be in contact with food, the risk of contamination concerns not only the nanoparticles but also all the chemical additives added during the material processing. The presence of nanoparticles is susceptible to modify the interactions between polymer and the additives with a possible change in their transport properties and therefore the food contamination.The present work aims at identifying the relationship between the structural characteristic and the transport properties (diffusivity and solubility) of nanoparticles and chemical additives incorporated in nanocomposites. In this regard, it is necessary to fill the gap of knowledge in 3D nanostructure characterization and a multi-scale modeling of mass transfer properties of nanocomposites in real usage conditions.In this way, polyethylene and nanoclay were selected based on the best compromise between real potential applications and the scientific knowledge previously published and eventually the nanocomposites were synthesized with LLDPE, Cloisite20 and a compatibilizer by melt intercalation method.The nanocomposite structure was characterized using TEM, X-ray nanotomography, TGA and XRD then submitted to migration tests undertaken in contact with different food simulants which represent various types of food (aqueous, acid, alcoholic) following the recommendation of the European regulation on the food contact material. To evaluate the positive or adverse effects of the nanomaterials on the contamination of the food by chemical additives which are usually incorporated with the plastic packaging, the virgin polymer and nanocomposite material were spiked with a mixture of the additives exhibiting various volatility, polarity and molecular weight. Then, the transport properties (i.e inertia) of nanocomposite structure was distinctively investigated on kinetic (apparent diffusion coefficient) and thermodynamic (partition coefficient) considerations.The results indicated that nanoclay addition in plastic materials favorably reduced the migration of additives by modifying both their diffusivity in the polymer and their partition between the polymer and the food simulant. However, while the partition coefficient of additives increases in nanocomposite in comparison to pure LLDPE for the samples in contact with all types of food simulants, the reduction of diffusion coefficient is significantly dependent on the nature of the food simulant in contact. Hence, it can be concluded that the major role in the migration of additives is not played by the imposed tortuosity path, but by the factors such as the affinity between the base polymer and simulants as well as the effects of simulants on swelling and crystallinity of the samples. Moreover, the effect of additive-related parameters and the structural parameters were assessed and put in perspective with their impact on the transport properties of nanostructures. Integrating the results of characterization and transfer properties led to an improved understanding of the influence of structure of nanocomposites on their mass transfer properties and therefore on the suitability of using them as food contact materials
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Barwood, Michael. "An exploration of shape memory polymers and (nano) composites for packaging applications." Thesis, Sheffield Hallam University, 2012. http://shura.shu.ac.uk/19326/.

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Shape memory polymers, SMP, are gaining considerable interest in research and industry due to their novel properties and vast potential. SMP belong to an emerging class of materials known as 'smart polymers', and have the intriguing ability to be moulded into a temporary shape, store that temporary shape and, when activated by an external stimulus, recover its original shape. SMP have currently been used for a wide range of applications including SMP stents, catheters, smart clothing, composite tooling and biodegradable sutures. This project aims to develop an understanding of how SMP can be of use in the packaging industry, exploring several types of thermoset and thermoplastic based SMP for packaging applications. The fundamental aspects of SMP, the methods to tailor the mechanical and thermal properties and the quantification of the shape memory effect are also considered. Initially photopolymerised thermoset shape-memory networks, class I SMP, with tailorable thermomechanics were investigated. Tertiary butylacrylate (tBA) and polyethylene glycol dimethacrylate (PEGDMA) were copolymerized to create networks with adjustable glass transition temperatures (Tg) and rubbery modulus values ranging from -18 to 39 °C and 0.7 to 25.0 MPa, respectively. The networks were characterised for homogeneity, thermal, mechanical and shape memory properties. The adjustable Tg had a great impact on the shape memory effect however the varying rubbery modulus had no significant effect. Previously incorporation of clay into polymers has shown to dramatically increase the mechanical, barrier and fire resistant properties of a wide range of polymers. At addition levels of 1 to 5 wt% no significant changes occurred to the mechanical abilities of the tBA-co-PEGDMA networks, although there was a minor improvement of the rubbery modulus at 1 wt% clay loading. There was a significant increase in initial shape memory recovery, at 1 wt% clay loading, but no improvement in total shape memory recovery. Alternatives to tBA-co-PEGDMA were also studied; these include i-bornylacrylate, IBoA, i-bornylmethacrylate, IBoMA, and tertiary butylmethacrylate, tBMA, in co-PEGDMA networks, which were also explored for their SMP packaging potential. The IBoA, IBoMA and tBMA-co-PEGDMA networks also had adjustable Tg and rubbery modulus values ranging from -20 to 53 °C and 2.0 to 22.0 MPa, -11 to 93 °C and 4.0 to 30.0 MPa and -11 to 74 °C and 1.0 to 30.0 MPa, respectively. Thermoplastic polyurethane, PU, PU-co-PVC blends, class IV SMP, and their nanocomposites were also evaluated as SMP packaging materials. As clay content was increased, 1 to 5 wt%, in the SMP PU, there was a significant shift of the soft segment (SS) Tg from -29 to -10 °C, respectively, but only a minor improvement in the rubbery modulus. There was no significant effect on the shape memory ability. As PVC was blended with PU the SS Tg shifted from -29 to 1 °C, and the PU initial modulus dropped dramatically from 2414 to 493 MPa. On any addition of PVC the shape memory recovery time was extended. As clay was increased, 1 to 5 wt%, in the PU-co-PVC blend the overall modulus was reduced with no other significant effects apart from a minor increase in intensity and shift to lower temperatures of the PU/PVC/Lap 1 tan 6 peak. As clay increased the time for the initial shape recovery of the polymer blends decreased, from 12.5 to 8.0 seconds, however there was no effect on the overall return time, ca. 15 seconds.
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Ji, Zhouxiang. "Nano-channel of Viral DNA Packaging Motor as Single Pore to Differentiate Peptides." The Ohio State University, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=osu1555016293008571.

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Castro, Mayorga Jinneth Lorena. "Biotechnological routes for the development of antimicrobial nano-metal based polyhydroxyalkanoates for active food packaging applications." Doctoral thesis, Universitat Politècnica de València, 2017. http://hdl.handle.net/10251/85678.

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The development of novel bio-based materials with antimicrobial properties for active packaging applications is a topic of significant interest. The current PhD thesis deals with the development of biotechnologically derived polyhydroxyalkanoates (PHAs) based on nanometals for antimicrobial active food packaging applications. Initially, silver nanoparticles (AgNPs) were produced by chemical reduction and stabilized in situ within unpurified poly(hydroxybutyrate-co-hydroxyvalerate), PHBV18 (18 mol% valerate) suspensions previously obtained from mixed microbial cultures. The stabilized AgNPs were subsequently used to develop PHAs-AgNPs nanocomposites following two different strategies: 1) a direct melt-blending process where the AgNPs were added to the PHBV3 (3% mol valerate) from a highly dispersed and distributed enriched masterbatch form and, 2) as an annealed electrospun coating of PHBV3/PHBV18/AgNPs over compression molded PHBV3. The implementation of both strategies resulted in active nanocomposites with strong antimicrobial activity against food-borne pathogens, being the electrospinning coating technique the most efficient one in reducing the bacterial and virus population, even at very low AgNPs loading (from 0.002 to 0.04% wt.). As an alternative route, an integrated bioprocess for the biological synthesis of AgNPs and polyhydroxybutyrate (PHB) from the fermentation process with Cupriavidus necator was also carried out. Interestingly, this work demonstrated for the first time, the inherent capacity of C. necator to reduce silver nitrate and produce AgNPs without the need for adding a reducing agent. The process was successfully optimized and scaled-up to a fully automated 10 liters bioreactor. Finally, because of the limitations of the use of AgNPs in food applications, antimicrobial PHAs films based on zinc oxide (ZnO) and copper oxide (CuO) nanoparticles were prepared according to the previously developed strategies but in this case, a melt-mixing process of preincorporated ZnO into unpurified PHBV18 fiber mats made by electrospinning was also carried out to stabilize the metal nanoparticles. The effect of ZnO nanoparticles morphology and the method of ZnO/CuO incorporation on the morphological, optical, thermal, mechanical and barrier properties of the resulting active films as well as their influence on the antimicrobial (bactericide and virucidal) performance were studied. Thus, this PhD thesis represents a significant step forward in the understanding of the antimicrobial efficacy of highly dispersed and distributed nanometals and highlights the suitability of the developed PHAs/nanometals materials for antimicrobial applications and in particular for antimicrobial active food packaging applications.
El desarrollo de nuevos biomateriales con propiedades antimicrobianas para aplicaciones de envasado activo resulta un tema de gran interés en la actualidad. La presente tesis doctoral estudia el desarrollo por vía biotecnológica de polihidroxialcanoatos (PHAs) conteniendo nanometales para aplicaciones de envasado activo antimicrobiano de alimentos. En primer lugar, se produjeron nanopartículas de plata (AgNPs) por reducción química y se estabilizaron in situ en una suspensión de poli (hidroxibutirato-co-hidroxivalerato) no purificado, PHBV18 (18% en moles de valerato), obtenido previamente a partir de cultivos mixtos microbianos. Posteriormente, las AgNPs estabilizadas se utilizaron para desarrollar nanocompuestos de PHAs-AgNPs siguiendo dos estrategias diferentes: 1) un proceso de mezclado-fundido en donde las AgNPs se añadieron al PHBV3 (3% mol de valerato) a partir de un masterbatch de nanopartículas altamente dispersas y distribuidas y, 2) como una estructura bicapa formada por un recubrimiento a base de PHBV/PHBV18/AgNPs depositado sobre un film de PHBV3 obtenido por moldeo por compresión. La aplicación de ambas estrategias dio lugar a nanocompuestos activos con una fuerte actividad antimicrobiana frente a patógenos transmitidos por los alimentos, siendo la estructura bicapa la más eficaz en la reducción de la población bacteriana y viral, incluso a una carga muy baja de AgNPs (de 0.002 a 0.04% en peso). Como ruta alternativa, también se llevó a cabo un proceso integrado de fermentación con Cupriavidus necator para la síntesis biológica de AgNPs y polihidroxibutirato (PHB). En este trabajo se demostró, por primera vez, la capacidad inherente de C. necator para reducir nitrato de plata y producir AgNPs sin la necesidad de añadir un agente reductor. El proceso fue optimizado y escalado satisfactoriamente a un biorreactor automatizado de 10 litros. Finalmente, debido a las limitaciones del uso de AgNPs en aplicaciones alimentarias, se prepararon films antimicrobianos de PHAs basados en nanopartículas de óxido de zinc (ZnO) y óxido de cobre (CuO) de acuerdo con las estrategias previamente desarrolladas. Adicionalmente, ambas estrategias se compararon con una tercera basada en la preincorporación de ZnO en fibras de PHBV18 no purificado y su posterior mezclado-fundido con polímero virgen. Se estudió el efecto de la morfología de las nanopartículas de ZnO y del método de incorporación de ZnO/CuO sobre las propiedades morfológicas, ópticas, térmicas, mecánicas y de barrera de los films activos resultantes, así como su influencia en el comportamiento antimicrobiano (bactericida y virucida). Por lo tanto, esta tesis doctoral representa un avance significativo en la comprensión de la eficacia antimicrobiana de nanometales altamente dispersos y distribuidos y destaca la idoneidad de los materiales desarrollados a base de PHAs y nanometales para aplicaciones antimicrobianas y, en particular, para aplicaciones de envasado de alimentos activos antimicrobianos.
El desenvolupament de nous materials d'origen biològic amb propietats antimicrobianes per a aplicacions d'envasament actiu és un tema d'interès significatiu. La tesi doctoral actual s'ocupa del desenvolupament de polihidroxialcanoats (PHA) reforçats amb nanometals per via biotecnològicament per a aplicacions d'envasat actiu antimicrobià d'aliments. Inicialment, les nanopartícules de plata (AgNPs) van ser produïdes per reducció química i estabilitzades in situ dins en suspensions de poli (hidroxibutirato-co-hidroxivalerato) sense purificar, PHBV18 (18 mol% de valerat), prèviament obtinguts a partir de cultius mixtes microbians. Las AgNPs estabilitzades es van usar posteriorment per a desenvolupar nanocompostos de PHA's- AgNPs seguint dues estratègies diferents: 1) Procés directe de barreja en fusió que no utilitza dissolvents orgànics o estabilitzants addicionals i on es van afegir les AgNPs al PHBV3 (3% mol valerato) a partir d¿un masterbath on estaven perfectament disperses i distribuïdes 2) com una estructura bicapa formada per un recobriment de PHBV3 / PHBV18/AgNPS que es deposita sobre un film de PHBV3 obtingut per modelat per compressió. L'aplicació d'ambdues estratègies va donar lloc a nanocompostos actius amb una forta activitat antibacteriana enfront de patògens transmesos pels aliments, sent l'estructura de doble capa la més eficaç en la reducció de la població bacteriana i viral, fins i tot a una càrrega molt baixa de AgNPs (de 0.002-0.04% en pes). Com ruta alternativa, també es va dur a terme un procés integrat de fermentació amb Cupriavidus necator per a la síntesi biològica de AgNPs i polihidroxibutirato (PHB). En aquest treball es demostra, per primera vegada, la capacitat inherent de C. necator per reduir la sal de plata i produir AgNPs sense la necessitat d'afegir un agent reductor. El procés va ser optimitzat i escalat satisfactòriament a un bioreactor de 10 litres. Finalment, a causa de les limitacions de l'ús de nanopartícules de plata en aplicacions alimentàries, es van preparar films antimicrobians de PHA que incorporessin nanopartícules d'òxid de zinc (ZnO) i òxid de coure (CuO) d'acord amb les estratègies prèviament desenvolupades. Les dues estratègies es van comparar amb una tercera basada en la preincorporació de ZnO en fibres de PHBV18 no purificat i aquestes fibres es van barrejar posteriorment amb polímer verge. Es va estudiar l'efecte de la morfologia de les nanopartícules de ZnO i el mètode de la incorporació de ZnO/CuO sobre les propietats morfològiques, òptiques, tèrmiques, mecàniques i de barrera dels films actius resultants, així com la seva influència en el comportament antimicrobià (bactericida i virucida). Per tant, aquesta tesi doctoral representa un pas endavant significatiu en la comprensió de l'eficàcia antimicrobiana de nanometales altament dispersos i distribuïts i posa en relleu la idoneïtat dels materials desenvolupats basats en PHAs i nanometals per a aplicacions antimicrobianes i, en particular, per a aplicacions d'envasat d'aliments actius antimicrobians.
Castro Mayorga, JL. (2017). Biotechnological routes for the development of antimicrobial nano-metal based polyhydroxyalkanoates for active food packaging applications [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/85678
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Wolf, Caroline. "Multi-scale modelling of structure and mass transfer relationships in nano- and micro-composites for food packaging." Thesis, Montpellier 2, 2014. http://www.theses.fr/2014MON20217/document.

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Malgré l'intérêt croissant que représente dans le domaine de l'emballage alimentaire la conception raisonnée de structures composites aux propriétés de transfert contrôlées, la compréhension des transferts de gaz et de vapeurs avec l'ajout de particules dans des polymères reste complexe. En vue d'apporter un nouvel éclairage à ce verrou scientifique, les travaux de thèse se sont focalisés sur les trois parties suivantes : - contribuer à une meilleure compréhension des transferts de matière dans les composites. Pour ce faire, une analyse exhaustive des données expérimentales de transfert de gaz et de vapeurs disponibles dans la littérature a été menée pour les nano- et micro-composites et une comparaison de ces données a été réalisée avec des modèles de tortuosité, basés sur des paramètres géométriques ; - comprendre et modéliser la perméabilité dans des composites avec deux phases perméables. Pour cela, les transferts de vapeur d'eau dans un composite (fibre de paille/bio-polyester) chargé avec des particules perméables ont été mesurés et décrits en détail, et une comparaison de ces données avec des modèles analytiques issus d'autres champs disciplinaires, prenant en compte la perméabilité dans la particule et dans la matrice, a été menée. Cette étude a mis en avant le manque de modèles adaptés pour la prédiction de la perméabilité dans les composites contenant des particules perméables ; - développer une nouvelle approche multi-échelle pour la prédiction de la perméabilité dans des composites prenant en compte les propriétés de transfert dans les particules et dans la matrice polymérique avec une représentation 2D de la structure du composite. Afin d'atteindre un niveau satisfaisant de validation du modèle, la détermination des paramètres expérimentaux tels que la diffusion dans les particules doit être améliorée. Cette nouvelle approche de modélisation ouvre la voie à la création d'outils d'ingénierie inverse pour le design de structures composites, ajustés aux besoins des aliments en termes de propriétés barrières
Despite the global growing interest in the food packaging field for the design of tailored composite structures with controlled mass transfer properties, the understanding of the modulation of the mass transfer properties with the incorporation of particles in polymer still remains very complex. In order to throw light on this scientific problem, the thesis work was focused on the following parts: - providing a better understanding of mass transfer in composites. In this purpose an analysis of all experimental gas and vapour permeability data available in the literature has been carried out in nano- and micro- composites and a comparison of these data with predictions from tortuosity models based on few geometrical inputs has been achieved; - performing a detailed study of water vapour mass transfer in composites (wheat straw fibres/bio-polyester). These data were compared with the prediction of bi-phasic analytical models coming from other disciplinary fields. This part of the work has highlighted the lack of comprehensive and complete models for the prediction of permeability in composite with permeable particles; - developing of an innovative multi-scale approach for the prediction of mass transfer in bi-phasic composites considering both the particle and the polymer matrix properties with realistic 2D geometry of the composite structures has been proposed. For the sake of reaching a satisfactory validation level of the model, some experimental improvements are still needed to increase the accuracy of input parameters such as diffusivity of the particles.This new modelling approach open the way for the creation of a reverse-engineering toolbox for the design of tailor made composites structures, tightly adjusted to barrier properties requirements of the packed food
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Imran, Muhammad. "Enrobages actifs contenants des peptides antimicrobiens nano-vectorisés." Thesis, Vandoeuvre-les-Nancy, INPL, 2011. http://www.theses.fr/2011INPL026N/document.

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La nanotechnologie possède la potentialité d’améliorer la sécurité, les procédés, l’emballage alimentaire et le concept d’ingrédient fonctionnel. La nano-encapsulation d’agents actifs, est un concept innovant permettant de protéger les agents actifs d’une dégradation éventuelle pendant le procédé de fabrication de l’aliment et son stockage. Le principal objectif de ce travail est de développer et d’optimiser une méthode de marquage fluorescent afin d’effectuer des études de transfert dans différents films de bio-polymères et dans l’aliment et de nano-encapsuler la nisine. La nano-encapsulation de la nisine dans différents nano-liposomes par micro-fluidisation (CCDS) est une technique innovante pour la fabrication de nano-systèmes de re-largage. L’incorporation de nisine sous forme de nano-émulsion est une méthode efficace de contrôle des flores pathogènes sans altérer les caractéristiques des films d’HPMC. La nisine Z a été marquée par un composé fluorescent, et a une masse moléculaire de 3713,3. Des études en microscopie confocale ont permis de démontrer que l’interaction de la nisine avec les membranes bactériennes se situait au niveau de site de division de la cellule. L’HPMC, le chitosane, le caséinate et l’acide poly-lactique agissent comme des réservoirs et libèrent progressivement la nisine afin d’obtenir un effet inhibiteur durable. Le choix du biopolymère affecte la biodispinibilité du composé à la surface et à l’intérieur de l’aliment. La prochaine révolution concernant la sécurité alimentaire par l’emballage mettra en avant le dernier concept technologique « 3-BIOs » qui se réfère aux notions Bioactif - Biodégradable - Bionanocomposite
Food nanotechnology has the potential to improve food safety and bio-security, food processing, food packaging and functional ingredients. Nano-encapsulation of active agents is an innovative concept to protect them against possible denaturation during processing and storage. The overall objective of the present work was to optimize and develop fluorescent labeling and encapsulation of nisin for molecular transfer study in different packaging based on biopolymers and in the food. Nanoencapsulation of nisin in different nanoliposomes by using continuous cell disruption system (CCDS) has provided an innovative method for nano-delivery systems fabrication. Incorporation of nisin in nano-emulsion form (encapsulated and free) can possibly be an effective approach to control pathogen without compromising the basic physico-chemical attributes of composite HPMC coatings. The fluorescently labeled nisin Z prepared had a molecular weight of 3717.3 Da. Confocal microscopic studies demonstrated the interaction of nisin with the bacterial membranes at the cell-division sites as possible mechanism of action against food borne pathogen. HPMC, CTS, SC and PLA packaging bio-membranes act as a reservoir and progressively release nisin to sustain a constant inhibitory effect. Choice of biopolymer is significant in providing requisite bioavailability of antimicrobial compounds at exterior surface and inside the food system. Based on the present study results, the emerging revolution concerning food safety through packaging possibly will rely on « 3-BIOs » blend with nanotechnology, which refers to Bioactive, Biodegradable and Bio-nanocomposite
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Roux-Levy, Philippe. "Nanostructures de carbone dédiées aux interconnexions hautes fréquences." Thesis, Limoges, 2018. http://www.theses.fr/2018LIMO0102/document.

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A extrêmement hautes fréquences, les applications électroniques vont être confrontées à des challenges liés à la réduction des dimensions et la compacité des systèmes. Les limites physiques des matériaux conventionnels étant atteintes, de nouvelles alternatives sont nécessaires dans le domaine du nano-packaging. De nouveaux matériaux ont été étudiés pour remplacer les matériaux conventionnels. Parmi eux, le nanotube de carbone démontre une excellente conductivité électrique et thermique ainsi qu’une résistance physique extraordinaire. Il est donc un candidat de choix pour des applications comme les interconnexions, l’évacuation de chaleur, le blindage électromagnétique ou encore le renforcement structurel. Autant de points capitaux pour le nano-packaging moderne. Dans ce manuscrit, les nanotubes de carbone vont être étudiés en profondeur pour réaffirmer leurs propriétés électroniques et thermiques hors du commun. Nous nous concentrerons ensuite sur l’étude de deux types d’interconnexions à base de nanotubes de carbone : des interconnexions à base de plot en nanotubes de carbone utilisant la technologie Flip-Chip et des interconnexions sans-fil à base de monopole composé de nanotubes de carbone. Enfin, nous étudierons la possibilité de créer des composants passifs Radio-Fréquence à l’aide de structures en nanotubes de carbone. De nouvelles méthodes de fabrication des structures en CNT ont été utilisées au cours de ces travaux de thèse afin d’obtenir une compatibilité avec les technologies CMOS
At extremely high frequency, electronic applications will have to challenge problems born from the size reduction and compactification of the systems. Physical limits of conventional materials will be reached and so new alternatives are necessary in the nano-packaging field. New materials have been studied to replace conventional materials. Among them, carbon nanotubes have shown extremely high electrical and thermal conductivity as well as extraordinary physical resistance. And so carbon nanotubes are a good candidate for applications such as interconnects, thermal management, electromagnetic shielding or structural reinforcement. All of those applications are capital for modern nano-packaging. In this manuscript, carbon nanotubes will be studied in depths to demonstrate again their incredible electronic and thermal properties. We will then focus on the study of two types of carbon nanotubes based interconnects: carbon nanotubes bumps based interconnects for Flip-Chip applications and wireless interconnects based on carbon nanotubes monopole antenna. Finally, we will study the possibility of creating passive RF components using carbon nanotubes structures. New ways of fabricating the carbon nanotubes structure were used in order to get a fabrication process of the prototype completely compatible with CMOS technologies
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Rajarathinam, Venmathy. "Imprint lithography and characterization of photosensitive polymers for advanced microelectronics packaging." Diss., Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/34722.

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To enable fast and reliable processors, advances must be made in the interconnections on the printed circuit board and in the interconnections from the chip to the printed circuit board. Processing techniques have been demonstrated to fabricate a copper-clad encapsulated air dielectric layer to enable low loss off-chip electrical signal lines using sacrificial polymers and the three dimensional patterning capabilities of imprint lithography. The inclusion of an air gap can eliminate the dielectric loss allowing the signal to propagate over longer lengths. Additionally, the low dielectric constant of air lowers the loss contributions from the conductor and increases the signal propagation velocity reducing delay. The metal shielding could minimize the crosstalk noise and radiation losses that are significant at high frequencies. The three dimensional patterning capabilities of imprint lithography fabricated curved structures and rounded terminations which can reduce reflections at discontinuities. Furthermore, imprint lithography also created planarized surfaces which simplified the buildup process. Since imprint lithography, only uses temperature and pressure to make a pattern it is an inexpensive and simple process advancement. The metal-clad encapsulated air dielectric structures were fabricated in a comparable number of registration steps to traditional transmission lines. Implementation of all copper chip to substrate interconnects would provide high conductivity electrical connections, resistance to electromigration while avoiding formation of brittle intermetallics. High aspect ratio polymer molds for copper electroplating interconnects could enable improved integrated circuit electrical performance. The properties of a new aqueous base develop, negative-tone photosensitive polynorbornene polymer have been characterized to develop mechanically compliant all copper connections between the chip and printed circuit board. High aspect ratio features of 7:1 (height:width) were produced in 70 ìm thick films in a single coat with straight side-wall profiles and high fidelity. The polymer films studied had a contrast of 11.6 and a low absorption coefficient. To evaluate the polymer's suitability to microelectronics applications, epoxy cross-linking reactions were studied as a function of processing condition through Fourier transform infrared spectroscopy, nano-indentation, and dielectric measurements. The fully cross-linked films had an elastic modulus of 2.9 GPa and hardness of 0.18 GPa which can improve the mechanical compliance of the copper interconnections. A photo-imprint lithography process was developed to improve the photo-patterning of the polynorbornene polymer for high aspect ratio hollow structures. A shallow photo-imprint stamp was developed to physically displace material in the polymer core. Since the imprint stamp displaces material in the area of the feature, the effective film thickness is reduced compared to the bulk film. The reduction in film height reduced the effects of scattering in the core and also facilitated transport of developer within the core. The photo-imprint lithography process resulted in high aspect ratio hollow core pillars that exceeded optical resolution capabilities for comparable feature sizes.
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Books on the topic "Nano-packaging"

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Wong, C. P., Kyoung-Sik Moon, and Yi (Grace) Li, eds. Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer US, 2010. http://dx.doi.org/10.1007/978-1-4419-0040-1.

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Li, Yi, C. P. Wong, and Kyoung-Sik Moon. Nano-bio-electronic, photonic and MEMS packaging. Springer, 2010.

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Wong, C. P. (Ching-Ping), Kyoung-sik Moon, and Yi Li, eds. Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-49991-4.

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Gerlach, Gerald, and Klaus-Jürgen Wolter, eds. Bio and Nano Packaging Techniques for Electron Devices. Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-28522-6.

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Klaus-Jürgen, Wolter, and SpringerLink (Online service), eds. Bio and Nano Packaging Techniques for Electron Devices: Advances in Electronic Device Packaging. Springer Berlin Heidelberg, 2012.

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name, No. Nano- and microtechnology: Materials, processes, packaging and systems : 16-18 December 2002, Melbourne, Australia. SPIE, 2003.

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Shi pin nai mi ke ji: Ji chu yu ying yong = Food nano : technology fundamental and application. Xin wen jing kai fa chu ban gu fen you xian gong si, 2011.

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Wong, C. P., Yi Li, and Kyoung-Sik Moon. Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer, 2020.

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Bio And Nano Packaging Techniques For Electron Devices Advances In Electronic Device Packaging. Springer, 2012.

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K, Sood Dinesh, Malshe Ajay P, Maeda Ryutaro, et al., eds. Nano- and microtechnology: Materials, processes, packaging and systems : 16-18 December 2002, Melbourne, Australia. SPIE, 2002.

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Book chapters on the topic "Nano-packaging"

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Jiménez, Alfonso, and Roxana A. Ruseckaite. "Nano-Biocomposites for Food Packaging." In Environmental Silicate Nano-Biocomposites. Springer London, 2012. http://dx.doi.org/10.1007/978-1-4471-4108-2_15.

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Zambrano-Zaragoza, M. L., R. M. González-Reza, D. Quintanar-Guerrero, and N. Mendoza-Muñoz. "Nano-Films for Food Packaging." In Food Engineering Series. Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-44552-2_10.

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Li, Yi, Kyoung-sik (Jack) Moon, and C. P. Wong. "Nano-conductive Adhesives for Nano-electronics Interconnection." In Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0040-1_2.

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Li, Yi, Kyoung-sik Moon, and C. P. (Ching-Ping) Wong. "Nano-conductive Adhesives for Nano-electronics Interconnection." In Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-49991-4_2.

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Tajeddin, Behjat. "Natural Nano-based Polymers for Packaging Applications." In Advanced Structured Materials. Springer India, 2015. http://dx.doi.org/10.1007/978-81-322-2473-0_8.

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Gerlach, Gerald. "Nano- and Biotechniques for Electronic Device Packaging." In Bio and Nano Packaging Techniques for Electron Devices. Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-28522-6_3.

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Balan, Angitha, and Ravi-Kumar Kadeppagari. "Biopolymers for Nano-Enabled Packaging of Foods." In Handbook of Polymer and Ceramic Nanotechnology. Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-10614-0_57-1.

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Balan, Angitha, and Ravi-Kumar Kadeppagari. "Biopolymers for Nano-enabled Packaging of Foods." In Handbook of Polymer and Ceramic Nanotechnology. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-40513-7_57.

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Li, Yao, Jeffrey A. Hinkley, and Karl I. Jacob. "Molecular Dynamics Applications in Packaging." In Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0040-1_18.

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Li, Yao, Jeffery A. Hinkley, and Karl I. Jacob. "Molecular Dynamics Applications in Packaging." In Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-49991-4_24.

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Conference papers on the topic "Nano-packaging"

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Oppermann, M., H. Heuer, N. Meyendorf, and K. J. Wolter. "Nano Evaluation in Electronics Packaging." In 2008 2nd Electronics Systemintegration Technology Conference. IEEE, 2008. http://dx.doi.org/10.1109/estc.2008.4684493.

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Wong, C. P., W. Lin, and R. Zhang. "Nano materials for microelectronic packaging." In 2010 3rd Electronic System-Integration Technology Conference (ESTC). IEEE, 2010. http://dx.doi.org/10.1109/estc.2010.5642891.

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Zhu, X., H. Kotadia, S. Xu, et al. "Electromigration aware design for nano-packaging." In 2013 IEEE 13th International Conference on Nanotechnology (IEEE-NANO). IEEE, 2013. http://dx.doi.org/10.1109/nano.2013.6720970.

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Felba, J., T. Falat, and A. Moscicki. "Nano sized silver for electronic packaging." In 2013 IEEE 13th International Conference on Nanotechnology (IEEE-NANO). IEEE, 2013. http://dx.doi.org/10.1109/nano.2013.6721027.

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Zhang, Wei, Zewen Liu, and Zheng Wang. "Nano resonator simulation fabrication and packaging consideration." In High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270700.

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Lin, W., H. Jiang, R. Zhang, et al. "Nano materials for microelectronic and photonic packaging." In 2008 IEEE Interdisciplinary Conf on Portable Info Devices (PORTABLE) - Polytronic 2008 IEEE Conf on Polymers and Adhesives in Microelectronics and Photonics. IEEE, 2008. http://dx.doi.org/10.1109/portable-polytronic.2008.4681291.

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Siah, Chun Fei, Jianxiong Wang, Philippe Roux-Levy, Philippe Coquet, Beng Kang Tay, and Dominique Baillargeat. "Carbon Nanotube for Interconnects and Nano-Packaging Application." In 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC). IEEE, 2019. http://dx.doi.org/10.1109/eptc47984.2019.9026662.

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Wolter, Klaus-Jurgen, Martin Oppermann, and Thomas Zema. "Nano Packaging - A challenge for Non-destructive Testing." In 2008 10th Electronics Packaging Technology Conference (EPTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/eptc.2008.4763540.

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Wang, Wen Xuan, Xiuzhen Lu, Johan Liu, Michael Olugbenga Olorunyomi, Tomas Aronsson, and Dongkai Shangguan. "New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications." In 2006 International Conference on Electronic Materials and Packaging. IEEE, 2006. http://dx.doi.org/10.1109/emap.2006.4430688.

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Li, Zhuo, Yi Gao, Kyoung-Sik Moon, Allen Tannenbaum, and C. P. Wong. "Nano filler dispersion in polymer composites for electronic packaging." In 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC). IEEE, 2012. http://dx.doi.org/10.1109/ectc.2012.6249074.

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